JP5074940B2 - Substrate processing method - Google Patents

Description

  The present invention relates to a laminate including a substrate and a support plate that supports the substrate, and a substrate processing method for peeling a support plate from a substrate constituting the laminate.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, there is an increasing demand for higher integration of chips in packages by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of chips in the package, it is necessary to reduce the thickness of the chip to a range of 25 to 150 μm.

  However, since a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been reduced by making it thin, it has to be transported manually, and the handling thereof is complicated.

  Therefore, a wafer support system has been developed that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass, hard plastic, or the like, to the wafer to be ground. . Since the strength of the wafer can be maintained by the wafer support system, the conveyance of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, a thermoplastic resin, an adhesive, or the like. Thereafter, the support plate is peeled from the substrate before dicing the wafer. When using adhesive tape to bond the wafer and the support plate, the wafer is peeled off from the support plate. When using a thermoplastic resin, the resin is heated to dissolve the resin. When using an adhesive, a solution is used. The wafer is peeled off from the support plate, for example, by dissolving the adhesive by using it. For example, Patent Document 1 discloses a technique in which a wafer and a support plate are bonded together using an adhesive, and the adhesive is dissolved using a solution to peel the wafer from the support plate.

As described above, when the support plate is peeled from the wafer, the peeling is performed after the other surface of the wafer is bonded to another support such as a dicing tape in accordance with the film thickness of the wafer. This is because the thickness of the wafer is small, so that the strength of the wafer itself is low and cracks are likely to occur. That is, after the laminated body which consists of a dicing tape, a board | substrate, and a support plate is once formed, a support plate will peel from a board | substrate.
JP 2006-135272 A (published May 25, 2006)

  As described above, before the support plate is peeled from the substrate, there is a laminate composed of the dicing tape, the substrate, and the support plate. And when peeling off the support plate, a solvent that dissolves the adhesive that holds the laminate so that the support plate is positioned at the uppermost position and bonds the substrate and the support plate through the through holes of the support plate Is supplied.

  However, when the solvent is supplied as described above, the solvent may be scattered on the exposed dicing tape. At this time, depending on the type of the solvent, the dicing tape may be deteriorated. The deterioration of the dicing tape causes cracks and warpage of the substrate, and causes problems in subsequent dicing.

  Therefore, development of a method for peeling the support plate from the substrate without deteriorating the dicing tape is required.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing method capable of peeling a support plate supporting a substrate from the substrate without deteriorating the dicing tape, and this processing. The object is to provide a laminate that is satisfactorily provided.

A laminate according to the present invention is a laminate including a thinned substrate and a support plate,
A first support plate attached to one surface of the substrate via a first adhesive; and a second support plate attached to the other surface of the substrate via a second adhesive;
The second adhesive has a solubility different from that of the first adhesive.

The substrate processing method according to the present invention is a substrate processing method in which the first support plate is peeled off from the thinned substrate to which the first support plate is attached via the first adhesive,
The second support plate is attached to the surface of the substrate opposite to the attachment surface of the first support plate using a second adhesive having a solubility different from that of the first adhesive. A sticking process;
And a first peeling step of dissolving the first adhesive and peeling the first support plate from the substrate after the sticking step.

  According to the laminated body concerning this invention, when removing a 1st support plate or a 2nd support plate from a laminated body, the laminated body which can immerse a laminated body in a solvent is provided. In other words, since the solubility of the adhesives adhering to the first support plate and the substrate and the second support plate and the substrate are different from each other, when only one of the support plates is to be removed, the support plate to be removed is simply pasted. The adhesive can be removed only by immersing it in a soluble solvent. That is, according to the laminated body concerning this invention, the removal of a support plate from a laminated body is realizable by a simple method.

  And the 2nd support plate is affixed on the board | substrate using the 2nd adhesive agent melt | dissolved with the solvent inactive with respect to a dicing tape. For this reason, when the laminated structure including the dicing tape, the substrate, and the second support plate is once formed, when the second support plate is peeled off from the substrate, the dicing tape is not deteriorated and the wafer is not cracked. That is, according to the present invention, it is possible to provide a laminate capable of realizing the process of peeling the support plate from the substrate so that the strength of the thinned substrate is reinforced and the dicing tape is not deteriorated. it can.

  According to the substrate processing method of the present invention, the step of attaching the second support plate to the substrate using the second adhesive before peeling the first support plate supporting the thinned substrate. including. Therefore, peeling of the first support plate can be realized by a simpler method. Furthermore, the board | substrate and the 2nd support plate are affixed using the 2nd adhesive agent which can melt | dissolve in an inert solvent with respect to a dicing tape. Therefore, when peeling a 2nd support plate from a board | substrate, melt | dissolution of a 2nd adhesive agent is simply realizable using a processing method with a high degree of freedom. As a result, according to the present invention, there is provided a substrate processing method capable of peeling the support plate from the substrate while maintaining the strength of the thinned substrate satisfactorily without deteriorating the dicing tape. be able to.

  Hereinafter, this embodiment will be described with reference to the drawings.

[Laminate]
(First embodiment)
A laminated body including a substrate according to the present embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view illustrating a laminate according to this embodiment. As shown in FIG. 1, the stacked body 20 includes a first support plate 12 provided on one surface 10a of the substrate 10 and a second support plate 14 provided on the other surface 10b. That is, support plates are provided on both surfaces of the substrate 10 respectively. The first support plate 12 and the substrate 10 are connected via a first adhesive (not shown), and the second support plate 14 and the substrate 10 are connected via a second adhesive (not shown). Each is pasted.

  The substrate 10 is, for example, a thinned substrate. Specifically, the substrate 10 is preferably a semiconductor wafer. At this time, the film thickness of the substrate 10 may be 10 to 150 μm.

  The first support plate 12 will be described in detail in a process of thinning a semiconductor wafer, which will be described later, and serves to support the substrate 10. The first support plate 12 preferably has the same size as or larger than the surface 10a of the substrate 10, and more preferably has the same size as the surface 10a. Moreover, it is preferable that the 1st support plate 12 is provided with the through-hole (not shown) which penetrates the 1st support plate 12 in the thickness direction. A large number of through holes are provided, and the through holes are preferably provided uniformly distributed on the entire surface of the first support plate 12, and the diameter of the through holes is 0.3 mm to 0.5 mm. The pitch between the through holes is preferably 0.5 mm to 1.0 mm. Thus, the advantage in case the 1st support plate 12 has a through-hole is mentioned later. Examples of the material forming the first support plate 12 include glass and hard plastic.

  Similar to the first support plate (support plate) 12, the second support plate 14 is a member that plays a role of supporting the substrate 10. In other words, the second support plate 14 has a surface that can come into contact with the surface 10b of the substrate 10 and can be said to be a support portion that can be attached to the surface 10b. Therefore, the second support plate 14 is not limited to a plate (simple plate) that is handled alone, and has a surface that can contact the other surface 10b of the substrate, and the second adhesive is used. As long as the board | substrate 10 can be stuck through, the aspect is not limited.

  1st Embodiment demonstrates the case where the 2nd support plate 14 is a board which can be handled independently. Here, “a board handled alone” means a simple board. In the case where such a separately handled plate is used as the second support plate 14, there is an advantage that there are few restrictions on the processing of the stacked body 20 even after the stacked body 20 is formed. The second support plate 14 may be a plate having a through hole in the thickness direction, like the first support plate 12. When the 2nd support plate 14 has a through-hole, it has the advantage that the penetration | infiltration of the solvent to a 2nd adhesive agent can be performed more rapidly.

  Moreover, it is preferable that the 2nd support plate 14 is a material which has tolerance with respect to the solvent which melt | dissolves a 1st adhesive agent. That is, when the first adhesive is dissolved, the second support plate 14 itself is not damaged even if the solvent is scattered on the second support plate 14. According to this aspect, the restriction | limiting with respect to the processing method when peeling the 1st support plate 12 from the board | substrate 10 decreases, and the freedom degree of a processing method becomes high.

  In the second support plate 14, the contact surface with the substrate 10 preferably has at least the same size as the surface of the substrate 10 or the same size or larger (large diameter). When the contact surface of the second support plate has the same size as the surface of the substrate 10, the stacked body 20 becomes the same size as the substrate 10, and the degree of freedom of conveyance by a conveyer or the like increases. The second support plate 14 may be an unprocessed plate-like member, such as glass, hard plastic, SUS, ceramic, aluminum, or the like.

  The first adhesive bonds the substrate 10 and the first support plate 12 together. The first adhesive may be a material that is soluble in at least one solvent among the solvents that do not dissolve the second adhesive described below. As an example of such an adhesive, for example, an adhesive that is soluble in an organic solvent is preferable, and a novolac type phenol resin or acrylic resin material as described in JP-A-2005-191550 is used. An adhesive composition comprising styrene, a cyclic skeleton-containing (meth) acrylic acid ester monomer, and a (meth) acrylic acid alkyl ester monomer as described in JP-A-2007-119646. An adhesive composition mainly composed of an acrylic polymer can be exemplified.

  The second adhesive affixes the substrate 10 and the second support plate 14 and is different in solubility from the first adhesive. In the present invention, “different in solubility from the first adhesive” means insoluble or hardly soluble in at least one solvent among the solvents that dissolve the first adhesive. Moreover, it is preferable that a 2nd adhesive agent is an adhesive agent which can be melt | dissolved with an inert solvent with respect to a dicing tape.

  Specifically, it is preferable to use a water-soluble adhesive as the second adhesive. Here, “water-soluble” means that it can be dissolved in water and an aqueous solvent. Examples of the water-soluble adhesive include, for example, a composition obtained by dissolving a water-soluble polymer such as polyvinyl alcohol, polyvinyl pyrrolidone, polyacrylamide, and acrylamide-diacetone acrylamide copolymer in water or a solvent. . Thus, there are the following advantages by adhering the second support plate 14 and the substrate 10 through the water-soluble adhesive. After the first support plate 12 is peeled from the substrate 10, the second support plate is further peeled from the substrate 10. The substrate 10 may be attached to the dicing tape before the peeling. Here, even if the solvent which melt | dissolves a 2nd adhesive splashes on a dicing tape by using the said specific adhesive agent, degradation of a dicing tape can be suppressed. Moreover, since there is no restriction | limiting of the process conditions which must melt | dissolve, preventing scattering to a dicing tape, the 2nd support plate 14 can be peeled from the board | substrate 10 by a simpler method.

  According to the laminate 20 according to the present embodiment, a laminate is provided in which the laminate 20 can be immersed in a solvent when the first support plate 12 or the second support plate 14 is peeled from the laminate 20. . That is, since the solubility of the adhesive provided between the first support plate 12 and the substrate 10 and the second support plate 14 and the substrate 10 is different from each other, when only one of the support plates is to be removed, the removal is desired. A desired support plate can be removed by immersing the adhesive on which the support plate is attached in a solvent that is soluble. The advantages of the laminate according to the present embodiment will be described in more detail in the substrate processing method described later.

(Second Embodiment)
The laminated body 30 concerning 2nd Embodiment is demonstrated referring FIG. The second embodiment is an example in which the second support plate is different from the first embodiment. In the second embodiment, differences from the first embodiment will be described.

  In the stacked body 30, a stage 26 on which a predetermined substrate can be mounted is used as the second support plate. In other words, in the second embodiment, the stage 26 serving as the second support plate is a member that is not handled alone, but has a surface that can contact the other surface 10b of the substrate 10 and has the second adhesion. Since the substrate 10 can be supported via the agent, it can be used as the second support plate. The material and structure of the stage are not limited as long as it can be attached to the substrate 10 via the second adhesive. For example, the stage 26 can be a stage made of a porous material.

  According to the laminated body 30 concerning 2nd Embodiment, it has the advantage that the stage which the existing apparatus has can be used effectively as a 2nd support plate, and the raise of manufacturing cost can be suppressed.

(Third embodiment)
The laminated body 40 concerning 3rd Embodiment is demonstrated referring FIG. The third embodiment is an example in which the second support plate is different from the first embodiment. In the stacked body 40, the second support plate is a plate of a processing apparatus including a plate having a flat surface that can be used for various processes. Specifically, a pressing member of a planarization processing apparatus can be exemplified. That is, the stage 26 described in the second embodiment is a support plate that is attached with the surface 10b of the substrate 10 facing down, whereas the third embodiment has the surface 10b of the substrate 10 facing up. A member that can be attached from above the substrate 10. For example, the plate 28 for pressing for flattening can be illustrated.

  As long as this plate 28 has a surface that can be attached to the surface 10 b of the substrate 10, there is no limitation on the shape and material. For example, a plate having a through hole for adsorbing the substrate from above and a through hole for supplying or sucking a predetermined processing liquid or gas to the substrate or a substrate connected to the suction means It may be a plate connected to the means or suction means.

  Further, the plate 28 is preferably made of a material that does not deteriorate even when the solvent for dissolving the first adhesive is scattered. This is because according to this aspect, the degree of freedom of the processing method is increased, and simple processing can be realized.

  According to the laminated body concerning 3rd Embodiment, when peeling the 1st support plate 12 from the board | substrate 10 similarly to the laminated body concerning 1st Embodiment, it can implement favorably. In addition, there is an advantage that a plate provided in an existing apparatus can be effectively used as the second support plate, and an increase in manufacturing cost can be suppressed.

[Substrate processing method]
Next, a substrate processing method according to this embodiment will be described with reference to FIGS. 4 to 8 are cross-sectional views showing the substrate processing method according to the present embodiment. Specifically, this substrate processing method is a processing method for peeling the support plate from the thinned substrate 10, and further, a processing method for obtaining the substrate 10 attached to the dicing tape. is there.

1. Substrate thinning step In this step, first, a thinned wafer (for example, a semiconductor wafer or a compound semiconductor wafer) is formed. Specifically, the substrate 11 having a film thickness of 500 to 1000 μm is prepared, and the first support plate 12 is attached to the surface 10a of the substrate 11 with a first adhesive as shown in FIG. As the 1st support plate 12, the structure demonstrated by the term of the above-mentioned laminated body can be taken. At this time, the first support plate 12 serves to support the substrate to be thinned. The first adhesive is preferably an adhesive that is different in solubility from the second adhesive described later, and is soluble in at least one solvent among solvents that do not dissolve the second adhesive. . Also, in the thinning process of the substrate, it may be performed while spraying cooling water to prevent the substrate from being overheated by polishing heat, but it is necessary to prevent the support plate from being peeled off during this process. The first adhesive is preferably a water resistant material. Specifically, the adhesive described in the above section of the laminate can be used.

  By using the adhesive composition containing the above-described novolac type phenolic resin or acrylic resin material as the first adhesive, a film forming process is performed on the thinned substrate 10 and the like. Even if the 1 support plate 12 is exposed to high heat, it is heat resistant and can maintain good adhesive force. In particular, an acrylic resin material is preferable because it has good heat resistance and adhesiveness and can be easily peeled at the time of peeling.

  Examples of such an adhesive include (a) styrene, (b) a cyclic skeleton-containing (meth) acrylic acid ester monomer, (c) (meth) acrylic described in Japanese Patent Application No. 2005-315282. Adhesive composition mainly composed of acrylic polymer containing acid alkyl ester monomer as repeating unit, group described in Japanese Patent Application No. 2006-2115070 application, dissociating from ester bond by action of heat The main component is a polymer obtained by copolymerization of a monomer composition containing a (meth) acrylic acid ester having a cyclic structure containing benzene and a (meth) acrylic acid alkyl ester having a chain structure. Styrene, a (meth) acrylic acid ester having a cyclic structure, and a chain structure described in Japanese Patent Application No. 2006-243449. An adhesive composition comprising as a main component a copolymer obtained by copolymerizing a monomer composition containing (meth) acrylic acid alkyl ester, wherein the monomer composition comprises an ethylenic double bond An adhesive composition, further comprising a carboxylic acid having A monomer composition containing styrene, (meth) acrylic acid ester having a cyclic structure, and (meth) acrylic acid alkyl ester having a chain structure, as described in Japanese Patent Application No. 2006-243450. An adhesive composition comprising a copolymer as a main component, wherein the monomer composition further comprises a bifunctional monomer. A monomer composition containing styrene, a (meth) acrylic acid ester having a cyclic structure, and a (meth) acrylic acid alkyl ester having a chain structure described in Japanese Patent Application No. 2006-243451. An adhesive composition comprising a copolymer as a main component, wherein the monomer composition further comprises a styrene macromonomer. A monomer composition containing styrene, (meth) acrylic acid ester having a cyclic structure, and (meth) acrylic acid alkyl ester having a chain structure, as described in Japanese Patent Application No. 2006-243452. An adhesive composition comprising a copolymer as a main component, wherein the polymer has a styrene block segment. A monomer composition containing styrene, a (meth) acrylic acid ester having a cyclic structure, and a (meth) acrylic acid alkyl ester having a chain structure described in Japanese Patent Application No. 2006-316094 An adhesive composition comprising a copolymer as a main component, wherein the monomer composition further comprises a carboxylic acid having an ethylenic double bond, a bifunctional monomer, and a styrene macromonomer. An adhesive composition, wherein the polymer has a styrene block segment, styrene, and a (meth) acrylic acid alkyl ester having a chain structure described in Japanese Patent Application No. 2006-322346 A monomer composition containing a (meth) acrylic acid ester having an aliphatic ring and a (meth) acrylic acid ester having an aromatic ring An adhesive composition mainly comprising a polymer, wherein the styrene, a (meth) acrylic acid alkyl ester having a chain structure, the (meth) acrylic acid ester having an aliphatic ring, and the above When the total amount with the (meth) acrylic acid ester having an aromatic ring is 100 parts by mass, the mass of the styrene is 40 to 69 parts by mass, and the mass of the (meth) acrylic acid alkyl ester having the chain structure. Is 20-30 parts by mass, the mass of the (meth) acrylic acid ester having an aliphatic ring is 10-25 parts by mass, and the mass of the (meth) acrylic acid ester having an aromatic ring is 1-5. Adhesive composition characterized by being part by mass, an adhesive mainly comprising a polymer obtained by polymerizing a monomer composition described in Japanese Patent Application No. 2006-335081 A core material which is vaporized by heat applied when the adhesive composition is peeled off from the adherend, contains the core substance, and is insoluble in the adhesive composition An adhesive composition characterized by containing a microcapsule composed of a film that is destroyed by the addition of acrylate, and the like, and an acrylic resin material containing a styrene unit is particularly preferable.

Next, the substrate 11 is ground to obtain a thinned substrate 10. The thickness of the substrate 10 is preferably 10 to 150 μm . Thereby, as shown in FIG. 5, a laminated structure including the thinned substrate 10 and the first support plate 12 is obtained.

2. Adhesion process Next, the 2nd support plate 14 is adhere | attached on the surface 10b on the opposite side to the adhesion surface 10a of the 1st support plate 12 in the board | substrate 10 using a 2nd adhesive agent. In the present embodiment, a case where a plate handled alone is used as the second support plate 14 will be described as an example. The second adhesive has a different solubility from the first adhesive. Therefore, the first support plate 12 and the second support plate 14 are not peeled off at the same time. It is preferable to use a water-soluble adhesive as the second adhesive. Here, the water-soluble adhesive refers to an adhesive that is soluble in water or an aqueous solvent. The laminated body 20 is formed by the process so far.

3. First peeling step Next, the first support plate 12 is peeled from the substrate 10. Specifically, the first adhesive is dissolved. The processing method in this step is not limited as long as the first adhesive can be dissolved. For example, as shown in FIG. 6, the first adhesive can be dissolved by immersing the entire laminate 20 in the solvent 24 using the processing container 22 in which the solvent 24 is stored. According to this aspect, the first support plate can be peeled off by a very simple method. Moreover, it is not necessary to prepare a special apparatus as a processing apparatus, and the manufacturing cost is not increased.

  Conventionally, since the first support plate 12 is peeled off from the substrate 10 after the dicing tape is applied to the surface 10b side, depending on the material of the dicing tape, resistance to a solvent that dissolves the first adhesive is obtained. In some cases, the object to be treated could not be immersed in the solvent when the first support plate 12 was peeled off. Therefore, a special processing device may be used or complicated processing may be required so that the solvent does not scatter on the dicing tape. However, according to the present embodiment, the first support plate 12 can be peeled favorably by a simple method without using a special processing apparatus.

  In the present embodiment, the first support plate 12 and the substrate 10 may be immersed in a solvent until the first support plate 12 and the substrate 10 are completely separated in the solvent, or after being immersed in the solvent and the adhesive force is reduced to some extent, 1 The support plate 12 and the substrate 10 may be completely separated by pulling them in directions opposite to each other. In the case of a support plate having a through hole, the solvent is supplied from the direction perpendicular to the surface of the first support plate 12 without being immersed in the solvent, and the solvent is supplied to the first adhesive. It can also be infiltrated. Further, when there is no through hole, the solvent can be supplied from the end face direction of the first support plate 12.

4). Dicing Tape Adhesion Step Next, as shown in FIG. 7, the dicing tape 16 is attached to the surface 10 a of the substrate 10. The periphery of the dicing tape 16 is fixed by a dicing frame 18. That is, the dicing frame 18 maintains its tension so that the dicing tape 16 does not loosen.

5. Second Peeling Step Next, as shown in FIG. 8, the second support plate 14 is peeled from the substrate 10. In peeling off the second support plate 14, first, the second adhesive is dissolved. The second adhesive is dissolved by using an inert solvent for the dicing tape 16. That is, it is a solvent that does not deteriorate the dicing tape. As such a solvent, water or an aqueous solvent can be used. In the case of water, it is preferably water having a pH value of 6-8. As a processing method, as illustrated in FIG. 6, the whole may be immersed in a solvent, or the solvent may be supplied from the end face side. As the aqueous solvent, for example, water or an aqueous solution in which various additives (for example, a surfactant, an acidic compound, a basic compound, etc.) are mixed with water can be used.

  In addition, when the second support plate 14 has a through hole penetrating in the thickness direction, the solvent is supplied from the upper side of the second support plate 14 through the through hole to dissolve the second adhesive. You can also. Moreover, a solvent can be supplied from the end surface side of the board | substrate 10, and a 2nd adhesive agent can also be melt | dissolved.

  Through the above steps, the substrate 10 attached to the dicing tape 16 can be obtained.

  According to the substrate processing method of this embodiment, the support plate can be peeled from the thinned substrate 10 without damaging the substrate 10. Since the first support plate is removed before the dicing tape 16 and the substrate 10 are attached, the first support plate is not contacted with a solvent that is active with respect to the dicing tape 16, that is, can deteriorate the dicing tape 16. Therefore, the support plate can be peeled from the substrate 10 without deteriorating the dicing tape 16.

(Second Embodiment)
A substrate processing method according to the second embodiment will be described with reference to FIGS. 9 and 10 are cross-sectional views illustrating the substrate processing steps according to the second embodiment. The substrate processing method according to the second embodiment is a method of peeling the support plate from the substrate 10 in the above-described laminate 30. In the following description, differences from the first embodiment will be described.

  First, the thinned substrate 10 is obtained in the same manner as the substrate thinning step of the first embodiment. Next, a stage 26 as a second support plate is affixed to the surface 10b of the substrate 10 with a second adhesive. Thereby, the laminated body 30 as referred to FIG. 2 is obtained.

  Next, the first support plate 12 is peeled off. Here, the solvent is supplied from the end face side of the substrate 10 and the first support plate 12, or when there is a through hole (not shown) in the first support plate 12, the solvent is introduced from above through the through hole. The first adhesive may be dissolved by supplying After the adhesive force of the first adhesive is reduced, the first support plate 12 can be peeled from the substrate 10 by pulling the first support plate 12 upward as shown in FIG.

  Next, as shown in FIG. 10, a dicing tape 16 is attached to the surface 10 b of the substrate 10. Next, the substrate 10 is peeled from the stage 26 (second peeling step). In this step, the second adhesive is dissolved by supplying a solvent from the end face side of the substrate 10. Through the above steps, the substrate 10 adhered to the dicing tape 16 can be obtained.

(Third embodiment)
Next, a substrate processing method according to the third embodiment will be described with reference to FIGS. 11 and 12 are cross-sectional views illustrating the substrate processing steps according to the third embodiment. The substrate processing method according to the third embodiment is a method of peeling the support plate from the substrate 10 in the above-described laminate 40. In the following description, differences from the first embodiment will be described.

  First, the plate 28 that is the second support plate is attached to the surface 10b of the thinned substrate 10. Thereby, the laminated body 40 is obtained as referred to in FIG. Next, the first support plate 12 is peeled off. Here, a method of dissolving the first adhesive by, for example, immersing the adhesive surface between the substrate 10 and the first support plate 12 in a solvent can be employed.

  Next, as shown in FIG. 11, a dicing tape 16 is attached to the surface 10 b of the substrate 10. Next, the substrate 10 is peeled from the plate 28 (second peeling step). In this step, as shown in FIG. 12, when the laminated body 40 is immersed in the processing container 42 in which the solvent 44 is stored, or when the plate 28 has a through-hole (not shown) penetrating in the thickness direction. The second adhesive can be dissolved by supplying the solvent between the substrate 10 and the plate 28 through the through hole of the plate 28. Thereafter, the plate 28 is peeled off from the substrate 10 to obtain the substrate 10 affixed to the dicing tape 16 as shown in FIG. In addition, when supplying a solvent through the through-hole of the plate 28, it is preferable to carry out it, attracting | sucking a solvent through the other through-hole of the plate 28 as needed.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The substrate processing method according to the present invention provides a laminate and a substrate processing method capable of easily handling a thinned substrate. The present invention can be used, for example, for manufacturing a miniaturized semiconductor device.

It is sectional drawing which shows the laminated body containing the board | substrate concerning 1st Embodiment. It is sectional drawing which shows the laminated body containing the board | substrate concerning 2nd Embodiment. It is sectional drawing which shows the laminated body containing the board | substrate concerning 3rd Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 1st Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 1st Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 1st Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 1st Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 1st Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 2nd Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 2nd Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 3rd Embodiment. It is sectional drawing which shows 1 process of the processing method of the board | substrate concerning 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 10a, 10b surface 11 Board | substrate 12 1st support plate 14 2nd support plate 16 Dicing tape 18 Dicing frame 20, 30, 40 Laminated body 22, 42 Processing container 24, 44 Solvent 26 Stage 28 Plate

Claims (5)

A substrate processing method for peeling a first support plate from a substrate that has been thinned and has a first support plate attached thereto via a first adhesive,
The second support plate is attached to the surface of the substrate opposite to the attachment surface of the first support plate using a second adhesive having a solubility different from that of the first adhesive. A sticking process;
A first peeling step of dissolving the first adhesive and peeling the first support plate from the substrate after the sticking step;
A second peeling step of dissolving the second adhesive and peeling the second support plate from the substrate after the first peeling step;
After the first peeling step and before the second peeling step,
The surface of the substrate from which the first support plate has been removed includes a step of attaching the substrate and the dicing tape so as to face a dicing tape attached to the substrate,
The second adhesive, Ri adhesive der dissolvable by a solvent which is inert with respect to the dicing tape,
In the second separation step, the method of processing a substrate characterized by Rukoto using an inert solvent with respect to the dicing tape.   2. The substrate processing method according to claim 1, wherein the first peeling step includes immersing a laminated body including the first support plate, the substrate, and the second support plate in a solvent. The substrate processing method according to claim 1 or 2, wherein a solvent corresponding to water or an aqueous solution having a pH of 6 to 8 is selected as a solvent inert to the dicing tape . In the first separation step, the processing method of a substrate according to any one of claims 1 to 3, characterized in that an organic solvent which does not dissolve the second adhesive as a solvent. The organic solvent, PGMEA (propylene glycol monomethyl ether acetate) and at least Tanedea The substrate processing method as claimed in claim 4, characterized in Rukoto selected from among 2-heptanone.

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