JP5065826B2 - Substrate liquid processing apparatus and liquid processing method - Google Patents

Description

The present invention is to provide a substrate such as a glass plate, it relates to a liquid processing apparatus and liquid processing how the substrate for performing a liquid processing such as development of the circuit pattern.

  In a panel such as a liquid crystal panel, a plasma display panel, and an organic EL panel constituting a flat display device, for example, the liquid crystal panel is composed of two substrates, a TFT substrate made of a glass substrate and a color filter. Liquid crystal is sealed between them. In the process of manufacturing a panel substrate for a flat display device, a circuit pattern is formed on the surface of a glass plate for a TFT substrate, and a black matrix and a color material film are formed for a color filter. It is formed through a process consisting of film coating, exposure, development, and etching.

  Among these processes, the development process is such that the substrate after exposure of the resist film applied on the surface is carried in, and the substrate is immersed in the developer. In general, it is carried out by showering the developer during horizontal transport. The substrate stops development after being brought into contact with the developer for a predetermined time. However, in order to accurately control the development time, the development is usually stopped by performing water replacement. In other words, while the substrate is transported at a predetermined speed by the conveyor, development is performed for a predetermined time on the development stage provided with the developer shower, and then the water replacement stage is provided with a shower for washing, The development is stopped by removing the developer by replacing it with water by washing with water.

  Here, at the developing stage, the developing solution showered on the substrate is collected and circulated for reuse, thereby suppressing consumption of the developing solution. However, since the substrate is conveyed by the conveyor, a large amount of developer stays on the entire surface of the developing stage. In particular, in the case of a large substrate, the retention amount of the developer may be enormous. If this is transferred to the water replacement stage as it is, a large amount of developer is taken out. In this water replacement stage, the substrate is washed with water. Therefore, when the developer staying on the substrate is transferred to the water replacement stage, the developer is mixed with water and cannot be reused.

  If the developer is returned to the developing stage before the substrate moves from the developing stage to the water replacement stage, the consumption of the developing solution can be reduced. For this purpose, a liquid draining means is provided in a position immediately adjacent to the outlet portion of the developing stage, and the developer on the substrate is drained when the substrate passes through the outlet portion. When the liquid is drained, clean air is blown onto the substrate surface in order to prevent impurities from being mixed into the developer. As a result, the developer can be removed from the substrate by the wind pressure of the air, and the developer removed from the substrate is collected on the development stage in a reusable state. Therefore, a well-known air knife nozzle can be used as the liquid draining means.

  As an air knife nozzle that can be used to perform the above liquid drainage, for example, the one shown in Patent Document 1 is known. The air knife nozzle according to Patent Document 1 is configured by providing an air blowing port in a nozzle body, and the air blowing port is opened obliquely rearward in the transport direction of the substrate to be dried, so that the air is obliquely upward. It will rush into the substrate surface. In this air outlet, the rear wall surface in the substrate transport direction has a curved surface shape, and the further rear side of the curved surface portion is a flat surface portion facing in a direction parallel to the substrate. In addition, the front side of the substrate transfer direction from the air outlet is also provided with a surface parallel to the substrate, and this surface is located closer to the substrate than the flat surface portion on the rear side. The plane parallel to the direction has a step difference before and after the air outlet.

With this configuration, when air is ejected from the air blowing port, a difference in the distance from the substrate occurs before and after the air blowing port due to the level difference of the nozzle body, and the front side in the substrate transport direction is The interval is narrowed. For this reason, the air blown out from the air blowout port will surely flow in the direction opposite to the moving direction of the substrate, and the air flow is prevented from moving forward, so that a small amount of air is used efficiently. The substrate can be dried.
JP 2007-144314 A

  By the way, when the air knife nozzle shown in Patent Document 1 is used as the developer draining means, it is sufficient that the developer can be completely removed by the air knife nozzle. However, the air knife nozzle alone leaves no developer. It is extremely difficult to eliminate. When the developer is attached to the substrate, the development proceeds even if the amount of the developer is small. Therefore, development is performed on a part of the substrate until just before the start of water replacement, but development does not proceed any further at the site where the developer is removed, and therefore a difference occurs in development time depending on the part of the substrate. As a result, uneven development occurs.

  If the interval between the development stage and the water replacement stage is shortened or the substrate is rapidly replaced with water after passing through the development stage, the occurrence of a time lag in the development time can be suppressed to some extent. However, if water replacement is performed at a position close to the development stage, water at the time of water replacement flows into the development stage, and the change in the substrate transport speed by the conveyor is from the viewpoint of process control. It is not desirable. Moreover, even if there is a slight difference, if a difference occurs in the development time, uneven development will still occur.

  By the way, water substitution is usually for stopping development, and even if the developer is attached to the substrate surface until just before this development stop, if it is over the entire surface of the substrate, There is no occurrence of uneven development. However, from the viewpoint of saving developer, the developer remaining on the substrate should be reduced as much as possible. Ideally, the substrate surface is wet when it is unloaded from the development stage, that is, a slight liquid film is formed over the entire surface of the substrate. Accordingly, an object of the present invention is to minimize the removal of the processing liquid from the liquid processing stage and to surely prevent the processing from being unevenly performed on the substrate.

In order to achieve the above-described object, the configuration of the liquid processing apparatus according to the present invention includes a liquid processing stage for supplying a processing liquid to the surface of the substrate and carrying out a predetermined liquid processing while the substrate is being transported. A substrate liquid processing apparatus comprising a processing stop stage for ending processing with a processing liquid , wherein the entire surface of the substrate is wet among the processing liquid remaining on the surface of the substrate at the liquid processing stage. Processing liquid that forms an air flow for liquid recovery parallel to the substrate surface toward the rear side in the substrate transport direction in order to return the surplus processing liquid to the liquid processing stage while leaving a liquid film to maintain A recovery means is provided in the liquid processing stage, and the processing liquid recovery means is constituted by a drain nozzle arranged so as to cover the entire length in a direction perpendicular to the substrate transport direction, and the drain nozzle is located on the rear side in the substrate transport direction. Add diagonally from above An injection passage for injecting air is provided, and a rectifying surface parallel to the surface of the substrate is formed at a position on the rear side in the substrate conveyance direction from the position where the injection passage is formed, and the injection passage in the substrate conveyance direction is formed. On the front side, in order to guide the flow of air injected from the injection passage in a direction along the rectifying surface, an air inlet wall having an angle smaller than an inclination angle of the injection passage to the surface of the substrate This is characterized in that a configuration is provided .

  The substrate is preferably transported horizontally with the surface to be processed facing upward. Further, the film may be transported in an inclined state. However, for example, when developing, the processing liquid needs to be in contact with the surface of the substrate for as long as possible. Therefore, depending on the type and mode of processing, when it is desirable to discharge immediately after the processing liquid has acted on the substrate surface, it is necessary to maintain the contact state with the processing liquid as much as possible. For this, horizontal conveyance may be used. When the substrate is transferred from the liquid processing stage to the processing stop stage, the processing liquid that stays on the surface of the substrate needs to be collected mainly when the substrate is in a horizontal transfer state, but in the case of inclined transfer. Even so, it is also advantageous to collect the processing liquid by the processing liquid recovery means from the viewpoint of reducing the consumption of the processing liquid.

  The processing liquid recovery means is preferably provided in the vicinity of the transition portion to the processing stop stage in the liquid processing stage, and can be constituted by a drain nozzle arranged to cover the entire length in the direction orthogonal to the substrate transport direction. The drain nozzle is provided with an injection passage for injecting pressurized air obliquely from above toward the rear side in the substrate transport direction. The injection angle of the pressurized air is preferably set to an angle of 45 degrees or less with respect to the substrate surface, and is preferably as shallow as possible in order to form an air flow parallel to the substrate surface. However, if the injection angle of the pressurized air is made extremely shallow, there is a problem that the drain nozzle is enlarged. Therefore, it is desirable that the injection angle of the pressurized air be about 45 to 30 degrees. Then, by forming a rectifying surface parallel to the surface of the substrate on the rear side in the substrate transport direction from the position where the injection passage is formed, air injected from the injection passage is connected to the substrate along the rectifying surface. It becomes possible to flow in the parallel direction. Further, in order to guide the flow of air injected from the injection passage to the front side of the injection passage in the substrate transport direction in the direction along the rectifying surface, the air inclined at an angle smaller than the inclination angle to the substrate surface of the injection passage. By adopting the structure in which the intake wall is provided, an air flow parallel to the substrate can be formed more reliably, quickly and smoothly.

  The drain nozzle constituting the processing liquid recovery means is provided for recovering excess processing liquid to the developing stage, leaving a liquid film that keeps the entire surface of the substrate wet. Therefore, with respect to the substrate to be transported, excess processing liquid staying on the surface is removed from the substrate by the air flow parallel to the substrate and is collected on the developing stage. Therefore, a narrow passage having a substantially slit shape is formed between the rectifying surface of the drain nozzle and the surface of the substrate, and the air flow is caused to flow from the rear wall of the injection passage by the Coanda effect. It becomes the flow which adheres to. Then, the pressing force against the processing liquid staying on the substrate surface is determined by the gap forming the slit-shaped passage, that is, the distance between the rectifying surface and the substrate surface and the pressure of the pressurized air injected from the injection passage. Is determined. The closer the rectifying surface is to the substrate and the higher the air pressure, the greater the pressing force acting on the processing liquid. On the other hand, the resistance to the pressing force to the processing liquid changes depending on the surface state of the substrate and the viscosity of the processing liquid.

  Here, the pressurized air ejected from the ejection passage does not dry the substrate surface, but reduces the layer of the processing liquid staying on the substrate surface to make it thinner. Therefore, depending on the surface condition of the substrate and the type and nature of the processing liquid staying on this surface, how much the rectifying surface is close to the substrate, and how much pressure is used to discharge the pressurized air Decide whether to flow through the injection passage. As a result, the liquid film of the processing liquid is not cut on the surface of the substrate, and the maximum processing liquid can be recovered.

  Although the processing liquid does not stay on the back side of the substrate, a considerable amount of the processing liquid may adhere depending on the viscosity of the processing liquid. Therefore, it may be necessary to remove the processing liquid adhering to the back side of the substrate. Therefore, a back surface injection nozzle is provided so as to face the liquid discharge nozzle across the substrate, and pressurized air is injected by the back surface injection nozzle so as to exclude the processing liquid toward the rear side in the substrate transport direction. This back surface injection nozzle is for removing as much as possible the processing liquid adhering to the back surface side, and it is not necessary to leave a liquid film as on the front surface side. That is, the back spray nozzle can substantially have a function as a drying means.

Next, the invention of the substrate processing method includes a liquid processing step of supplying a processing liquid to the surface of the substrate while the substrate is transported to perform a predetermined liquid processing, and a rear side of the substrate transport direction in the liquid processing step. Toward the surface of the substrate by forming an air flow in a direction parallel to the surface of the substrate, leaving the treatment liquid staying on the surface of the substrate leaving a liquid film that keeps the entire surface of the substrate wet. A processing liquid recovery step for returning the processing liquid to the liquid processing step side, and a processing stop that terminates the processing with the processing liquid by removing the processing liquid remaining on the surface of the substrate and replacing it with water. And in the processing liquid recovery step, air is flowed in a rectified state parallel to the substrate and toward the rear side in the substrate transport direction, and the substrate transport direction with respect to the substrate Substrate over the entire length in the direction perpendicular to The air is jetted from the oblique direction toward the rear side of the direction to form an air flow parallel to the surface of the transport substrate, and the substrate of the jet air flow toward the negative pressure region by the jet air flow This is characterized in that air is drawn into the negative pressure region at an angle smaller than the inclination angle of the air .

  In the treatment liquid recovery step, air is allowed to flow in a rectified state parallel to the substrate and toward the rear side in the substrate transport direction. Then, air is ejected at an angle of 45 degrees or less from the oblique direction toward the rear side of the substrate transport direction over the entire length in the direction orthogonal to the substrate transport direction with respect to the substrate, thereby roughly the surface of the substrate being transported. A parallel air flow is formed, and air is drawn into the negative pressure region by the jet air flow toward the negative pressure region at an angle smaller than an inclination angle of the jet air flow toward the substrate. It is desirable to make it. In the treatment liquid recovery step, an air flow that excludes the treatment liquid can be formed toward the rear side in the substrate transport direction also on the back surface side of the substrate.

  Regardless of the substrate liquid processing apparatus or the liquid processing method described above, in the liquid processing stage or the liquid processing step, a developing solution is supplied to the substrate to perform the development processing, and the processing stop stage or the processing stop step is performed. Then, it can be set as the water displacement stage which replaces a developing solution with water. And the board | substrate manufactured by these liquid processing apparatuses and liquid processing methods is a panel for flat displays, Comprising: A flat display apparatus can be manufactured using this panel.

  Deterioration of the processing liquid by supplying water to the substrate, etc., leaving the minimum liquid film on the entire surface of the substrate to keep the surface wet, returning the excess processing liquid to the liquid processing stage By minimizing the amount brought into the process stop stage, etc., the consumption of the processing liquid can be suppressed, and by keeping the liquid film on the entire surface of the substrate until immediately before the process stop is performed, It is possible to reliably prevent the processing unevenness of the substrate from occurring.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, in FIG. 1, 1 is a substrate. The substrate 1 is a TFT substrate or a color filter constituting a liquid crystal panel made of a transparent glass substrate. A circuit pattern is formed on the surface of the substrate 1 in the case of a TFT substrate, and a black matrix and a color filter in the case of a color filter. A pattern of the color material film is formed. In order to form these patterns, a resist film is applied to the surface of the substrate 1 and then exposed to light, followed by development processing using a developer. In the apparatus configuration shown in FIG. 1, a resist film is applied, the exposed substrate 1 is carried into a developing apparatus, and development processing is performed. As is apparent from FIG. St1, water replacement stage St2, first cleaning stage St3 by shower of cleaning water, second cleaning stage St4 performed by jetting high-pressure cleaning water, third cleaning stage St5 in which ultrasonic cleaning is performed, and pure It comprises a fourth cleaning stage St6 comprising finish cleaning with water and a drying stage St7 equipped with a drying means having an air knife nozzle.

  The substrate 1 is sequentially transported to the above-described stages by the roller conveyor 2 in a state where the substrate 1 is tilted horizontally or from left to right or front to back. A plurality of developer showers 3 are provided at short pitch intervals at the upper position of the development stage St1. Here, as shown in FIG. 2, the developer shower 3 has a plurality of injection nozzles formed downward in a supply pipe that is longer than the width of the substrate 1, that is, the entire length in the direction orthogonal to the transport direction. Consists of As a result, at the development stage St1, the developer is supplied without interruption to the entire surface of the substrate 1 conveyed to the roller conveyor 2.

  As described above, the developing process is performed by supplying the developing solution to the surface of the substrate 1 on which the resist film is formed in the developing stage St1. The developing process is performed by applying a developing solution to the resist film exposed for a predetermined time, but the contact time with the developing solution is appropriately controlled. The reason why the water replacement stage St2 is provided immediately after the development stage St1 is for controlling the contact time between the resist film of the substrate 1 and the developer, and water is injected into the water replacement stage St2. A water replacement shower 4 is provided. As described above, in the water replacement stage St2, the developing process itself is completed by discharging the developer present on the surface of the substrate 1 and replacing it with water. Therefore, the development stage St1 is a liquid processing stage, and the water replacement stage St2 is a processing stop stage.

  Here, a developer shower is supplied to the substrate 1 by the developer shower 3 provided on the development stage St1, and the supplied developer is circulated. In the development stage St1, as a result of dissolution of a part of the resist film formed on the substrate 1, the developer is mixed with the resist agent. Therefore, the developer collected at the development stage St1 has a slight amount of the resist agent dissolved therein, but it can be used as it is or mixed with a new developer for further development processing. . Of course, liquids other than the resist agent, dirt and foreign matters are prevented from entering, and the collected liquid is passed through a filter when it is used in a circulating manner.

  As described above, when the substrate 1 is moved from the development stage St1 to the water replacement stage St2 in order to efficiently recover the developer supplied to the substrate 1 at the development stage St1, an amount more than necessary for the substrate 1 is required. Do not take out the developer. For this purpose, the processing liquid recovery means 10 is installed in the vicinity of the outlet in the developing station St1. As is apparent from FIG. 2, the processing liquid recovery means 10 is located in the development stage St1 and in front of the developer shower 3 positioned at the forefront in the transport direction of the substrate 1, and in the interior thereof A drainage nozzle 11 is provided. The drainage nozzle 11 is installed so as to face in a direction orthogonal to the transport direction of the substrate 1, and its length dimension is longer than the total length in the width direction of the substrate 1, that is, the direction orthogonal to the transport direction. Have.

  As shown in FIGS. 3 and 4, the drainage nozzle 11 has an air chamber 12 into which pressurized air is introduced, and a narrow injection passage 13 communicates with the air chamber 12. The jet passage 13 is inclined with respect to the surface 1a of the substrate 1 conveyed on the roller conveyor 2, and this angle is usually 45 degrees or less. Further, the length of the injection passage 13 is substantially the same as or longer than the entire length of the substrate 1 in the width direction. Further, a back spray nozzle 14 is mounted at a position facing the drain nozzle 11 across the substrate 1, and the developer that adheres to the back surface 1 b of the substrate 1 from the back spray nozzle 14. Is to be refluxed to the development stage St1. Therefore, the back spray nozzle 14 also constitutes a part of the processing liquid recovery means 10.

  The back surface injection nozzle 14 only removes the developer from the substrate 1, so that pressurized air is injected from the back surface injection nozzle 14 to collide with the back surface 1 b of the substrate 1, and this air flow causes Remove the developer adhering to the surface. For this purpose, as shown in FIG. 3, pressurized air is injected from the oblique direction toward the rear side of the back surface 1 b of the substrate 1 in the conveying direction by the roller conveyor 2 to the back surface injection nozzle 14. It is supposed to let you. By the action of this pressurized air, the developing solution is scraped off from the substrate 1 and removed.

  In contrast, the drain nozzle 11 is not intended to remove all the developer from the surface 1 a of the substrate 1, but leaves a thin film of developer on the surface 1 a of the substrate 1, so that excess processing solution is left. Is to eliminate. Since the exposed resist film is formed on the surface 1a of the substrate 1, it is sufficient that the developer can be completely removed. However, if the developer remains partially, uneven development occurs. In order to prevent this development unevenness, in the water replacement stage St2, the state in which the thin film of the developer is formed is maintained until the water replacement is performed and the liquid processing is stopped. The solution is refluxed to the development stage St1. For this purpose, the liquid discharge nozzle 11 allows pressurized air having a predetermined pressure to flow in a direction parallel to the substrate 1, and discharges the developer remaining on the substrate 1.

  As described above, the developer is not completely removed from the surface 1a of the substrate 1, but a thin liquid film is left. For this purpose, as shown in FIG. 5 in an enlarged manner, the ejection passage 13 of the drain nozzle 11 has an angle of 45 degrees or less, preferably about 45 to 35 degrees with respect to the substrate 1 to be transported. Yes. An injection port 13 a in the injection passage 13 is opened to the rectifying surface 15. The rectifying surface 15 is a surface parallel to the substrate 1 and has a predetermined length from the opening position of the injection port 15 toward the rear in the transport direction of the substrate 1. Therefore, a slit-like passage having a uniform gap G is formed between the rectifying surface 15 of the drain nozzle 11 and the surface 1 a of the substrate 1, and this slit-like passage is formed in the width direction of the substrate 1. It has a length equal to or greater than the total length.

  The pressurized air jetted from the jet passage 13 of the drain nozzle 11 is transported in the direction of the substrate 1 along the slit-like passage between the rectifying surface 15 and the substrate 1 as shown by arrows in FIG. However, this air flow does not enter the substrate 1 in an oblique direction but forms a flow substantially parallel to the surface of the substrate 1. Here, a negative pressure region A is formed immediately before the opening position of the injection port 13a, and air flows from the front side of the drainage nozzle 11 toward the negative pressure region A. In order to guide this air flow in a direction parallel to the substrate 1, an air inlet wall 16 is formed at a portion of the drainage nozzle 11 that is on the front side in the transport direction of the substrate 1 from the injection port 13 a. The air inlet wall 16 is a wall surface having an angle smaller than the inclination angle of the injection passage 13, for example, an angle of 30 degrees or less, and extends at least the entire length of the portion where the injection passage 13 is formed.

  The air intake wall 16 can be positioned immediately before the opening position of the injection port 13a on the rectifying surface 15, but preferably, as shown in FIG. In the slit-like passage between the surface of the substrate 1 and the lower surface of the drainage nozzle 11, it is positioned in the negative pressure region A generated by the jet air flow from the jet passage 13. As a result, the air drawn in from the air inlet wall 16 wraps around from the pressurized air jetted from the jet passage 13 toward the surface 1a side of the board 1 as shown by the dotted arrows in FIG. 1 toward the rear in the conveying direction. As a result, the pressurized air injected from the injection passage 13 can further improve the adhesion to the rectifying surface 15. That is, when the pressurized air is injected from the injection port 13a, a flow is surely formed in the injection passage 13 along the surface exhibiting the Coanda function indicated by C, and does not enter the substrate 1 obliquely from above. In the slit-shaped passage, the direction is quickly changed to a flow parallel to the surface of the substrate 1 almost certainly.

  As a result, in the region indicated by P in FIG. 3, the developer staying on the surface 1 a of the substrate 1 is caused by the flow of pressurized air from the drain nozzle 11 in the direction parallel to the substrate 1. Is pushed out rearward in the transport direction and discharged from the rear end part or the left and right side parts. On the other hand, a thin film of the developer is left on the entire surface 1a of the substrate 1 at a portion on the front side of the surface 1a of the substrate 1 facing the injection port 13a. Moreover, the developer adhering to the back surface 1b side of the substrate 1 is almost removed by the action of the back surface injection nozzle 14 provided on the opposite side across the drain nozzle 11 and the substrate 1. As a result, most of the developer adhering to the substrate 1 is refluxed into the developing stage St1 before the substrate 1 is led out from the developing stage St1, and the amount taken out to the water replacement stage St2 is minimized. Can be suppressed.

  In this way, the substrate 1 moves from the development stage St1 to the water replacement stage St2 with the developer thin film remaining on the entire surface 1a, and water is supplied by the water replacement shower 4 to replace the developer. At this stage, development stops. That is, development proceeds until the water replacement shower 4 acts. Therefore, as a result of the uniform development time over the entire surface of the substrate 1, uneven development does not occur.

  As described above, a liquid film of the developer is formed on the surface 1a of the substrate 1. By setting the liquid film to a minimum thickness, the developer is not wasted, and the substrate 1 In this case, no film breakage is generated on the surface 1a.

  Here, depending on the surface state of the substrate 1, the viscosity of the developer, and the like, the pressing force of the pressurized air necessary to push the developer away to a required level varies. The pressing force of the pressurized air varies depending on the pressure of the pressurized air ejected from the ejection passage 13 and the size of the gap G formed between the drain nozzle 11 and the substrate 1. Accordingly, the pressure of the pressurized air and the gap G are appropriately set according to the surface state of the substrate 1 and the viscosity of the developer. Further, a resist film is formed on the surface 1a of the substrate 1, and the resist film is partially peeled off by development processing. Accordingly, the wettability of the surface of the substrate 1 varies depending on the site, but a thin film of the developer remains so as to remain at the site with poor wettability. On the other hand, the air pressure applied to the back surface 1b side of the substrate 1 may be set to a pressure state necessary for almost completely removing the developer adhering to the back surface of the substrate 1.

It is a stage block diagram of the development processing apparatus as an example of the liquid processing apparatus of the board | substrate by this invention. In the stage block diagram of FIG. 1, it is a structure explanatory drawing which shows a development stage, a water substitution stage, and its transfer part. It is sectional drawing which shows the structure of a process liquid collection | recovery means. FIG. 4 is a right side view of FIG. 3. It is explanatory drawing which shows the air flow of a drainage nozzle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Roller conveyor 3 Developer liquid shower 4 Water displacement shower 10 Process liquid collection | recovery means 11 Drain nozzle 13 Injection channel 13a Injection port 14 Back surface injection nozzle 15 Rectification surface 16 Air inlet wall St1 Development stage St2 Water replacement stage

Claims (8)

A substrate liquid processing apparatus comprising a liquid processing stage for supplying a processing liquid to the surface of the substrate and carrying out a predetermined liquid processing while the substrate is transported, and a processing stop stage for terminating the processing with the processing liquid. There,
Of the processing liquid staying on the surface of the substrate at the liquid processing stage, the substrate is transported to return the excess processing liquid to the liquid processing stage while leaving a liquid film that keeps the entire surface of the substrate wet. A processing liquid recovery means for forming a liquid recovery air flow parallel to the substrate surface toward the rear side in the direction is provided in the liquid processing stage ,
The processing liquid recovery means is composed of a drain nozzle arranged so as to extend over the entire length in the direction orthogonal to the substrate transport direction, and the drain nozzle discharges pressurized air obliquely from above toward the rear side in the substrate transport direction. An injection passage for injecting,
Forming a rectifying surface parallel to the surface of the substrate at a position on the rear side in the substrate transport direction from the position where the injection passage is formed,
In order to guide the flow of air jetted from the jet passage in a direction along the rectifying surface, an inclination angle of the jet passage to the surface of the substrate is provided on the front side of the jet passage in the substrate transport direction. A substrate liquid processing apparatus characterized in that an air inlet wall having a small angle is provided . The injection passage of pressurized air injection angle is the substrate 45 degrees from the pear to the surface of the front Symbol air was injected from the injection passage into the direction parallel to the substrate along the rectifying surface The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus is configured to flow toward the substrate. A position where a back surface injection nozzle for injecting pressurized air so as to exclude processing liquid toward the rear side in the substrate transport direction with respect to the back surface side of the substrate faces the drain nozzle with the substrate interposed therebetween The substrate liquid processing apparatus according to claim 1 , wherein the substrate liquid processing apparatus is provided. The liquid processing stage is developing stage performs development processing by supplying a developing solution to the substrate and the processing stop stage claims 1 to 3, a developing solution, characterized in that a water displacement stage for water replacement The substrate liquid processing apparatus according to any one of the above. A liquid processing step of performing a predetermined liquid processing by supplying a processing liquid to the surface of the substrate while transporting the substrate;
In the liquid processing step, by forming an air flow in a direction parallel to the surface of the substrate from the substrate transport direction toward the rear side, the processing liquid staying on the surface of the substrate is removed from the entire surface of the substrate. A treatment liquid recovery step that leaves a liquid film that maintains a wet state and returns excess treatment liquid to the liquid treatment step side;
Removing the processing liquid remaining on the surface of the substrate and replacing it with water, thereby terminating the processing with this processing liquid , and
In the treatment liquid recovery step, the air is parallel to the substrate and flows in a rectified state toward the rear side in the substrate transport direction,
Air is jetted from the oblique direction toward the rear side of the substrate transport direction over the entire length in the direction orthogonal to the substrate transport direction to form an air flow parallel to the surface of the transport substrate, and A substrate liquid processing method characterized in that air is drawn toward the negative pressure region at an angle smaller than an inclination angle of the jet air flow toward the substrate toward the negative pressure region due to the jet air flow. .   6. The substrate liquid processing method according to claim 5, wherein air is jetted at an angle of 45 degrees or less from the oblique direction with respect to the substrate. 7. The substrate according to claim 5, wherein, in the treatment liquid recovery step, an air flow that excludes the treatment liquid is formed on the back side of the substrate toward the rear side in the substrate transport direction. liquid processing method of. 8. The substrate liquid processing method according to claim 5, wherein in the liquid processing step, a developing solution is supplied from above toward the substrate to perform a developing process.

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