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JP4992811B2 - Electronic component mounting equipment - Google Patents

Electronic component mounting equipment Download PDF

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Publication number
JP4992811B2
JP4992811B2 JP2008108586A JP2008108586A JP4992811B2 JP 4992811 B2 JP4992811 B2 JP 4992811B2 JP 2008108586 A JP2008108586 A JP 2008108586A JP 2008108586 A JP2008108586 A JP 2008108586A JP 4992811 B2 JP4992811 B2 JP 4992811B2
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substrate
electronic component
solder
data
board
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JP2009260101A (en
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大介 永井
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は電子部品実装装置に関するものである。   The present invention relates to an electronic component mounting apparatus.

実装分野において、電子部品と基板の接合信頼性を確保するため、基板は反りのない平面の状態であることが重要である。基板の反りを検査する方法として、基板の全面に均一に分布させた複数のサンプリング測点の高さを計測し、これらの高さデータを含む三次元座標データに基づいて生成した近似曲面によって基板の形状を表す方法が存在する(特許文献1参照)。基板の反りの検査は、スクリーン印刷によって基板に半田を印刷する前段階だけでなく、リフロー工程を経て最終的に電子部品が実装された状態でも行われている。
特開2006−196819号公報
In the mounting field, in order to ensure the bonding reliability between the electronic component and the board, it is important that the board is flat without warping. As a method for inspecting the warpage of a substrate, the height of a plurality of sampling stations distributed uniformly over the entire surface of the substrate is measured, and the substrate is formed by an approximate curved surface generated based on three-dimensional coordinate data including these height data. There exists a method for representing the shape of the above (see Patent Document 1). The inspection of the warpage of the substrate is performed not only before the solder is printed on the substrate by screen printing but also in a state where the electronic component is finally mounted through the reflow process.
JP 2006-196819 A

基板は反りのない平板であることが理想的ではあるが、品質に影響を与えない程度の反りは許容されており、そのまま半田を印刷し、電子部品を実装し、最終的に製品に搭載されているという現状がある。搭載時には反りを矯正した状態で製品に固定されるため、基板の変形により生じた内部応力が特に半田付け部分に集中して作用し、これが主として半田クラックの要因となっている。この場合、半田クラックが発生した個所の過去の反りの状態が分かれば、不具合発生原因の追及が容易になるとともに検査基準の見直しにフィードバックすることもでき、以後の不具合の発生率を減少させることが可能になる。   Ideally, the substrate should be a flat plate that does not warp, but warping that does not affect quality is acceptable, and solder is printed as it is, electronic components are mounted, and finally mounted on the product. There is a current situation. Since it is fixed to the product in a state where the warp is corrected at the time of mounting, the internal stress generated by the deformation of the substrate is concentrated particularly on the soldered portion, and this mainly causes a solder crack. In this case, if the state of past warpage of the location where the solder crack occurred is known, the cause of the failure can be easily pursued and can be fed back to the review of the inspection standards to reduce the subsequent failure rate. Is possible.

以上の課題を解決するため、本発明は、半田印刷装置と電子部品搭載装置とリフロー装置を備えた電子部品実装装置において、基板の表面の三次元データを取得する手段と、取得した三次元データに基づいて基板の外観を表す近似曲面データを生成する手段と、基板のID情報と前記近似曲面データとを関連付けて記憶する手段を備え、前記近似曲面データを、前記半田印刷装置で半田を印刷する前段階及び半田を印刷した後段階及び前記リフロー装置で電子部品を半田付けした後段階において生成し、記憶することで、基板の反りと半田クラックとの因果関係を基板の生産過程に沿って段階的に解析する構成とした。 In order to solve the above problems, the present invention provides a means for acquiring three-dimensional data on the surface of a substrate in an electronic component mounting apparatus including a solder printing device, an electronic component mounting device, and a reflow device, and the acquired three-dimensional data. And generating means for generating approximate curved surface data representing the appearance of the board, and means for storing the ID information of the board and the approximate curved surface data in association with each other , and printing the approximate curved surface data with the solder printing apparatus. The causal relationship between the warp of the board and the solder crack is generated along the board production process by generating and storing the stage before the soldering, the stage after printing the solder, and the stage after soldering the electronic component by the reflow apparatus. It was set as the structure analyzed in steps .

本発明によれば、経年的に基板に不具合が発生した場合に、当該基板のID情報に基づいてデータベースから取得した当該基板の近似曲面データから実装過程における基板の反り状態を把握することができ、これにより不具合と基板の反りとの因果関係を解析し、生産条件の見直し等の有効な対策を講じることができる。   According to the present invention, when a problem occurs in a board over time, the warpage state of the board in the mounting process can be grasped from the approximate curved surface data of the board acquired from the database based on the ID information of the board. Thus, it is possible to analyze the causal relationship between the defect and the warp of the substrate and take effective measures such as reviewing the production conditions.

添付した図面を参照して本発明の実施の形態について説明する。図1は本発明の実施の形態の電子部品実装装置の構成を示したブロック図である。図2は管理コンピュータに構築されたデータベースのデータ構成図である。   Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a block diagram showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a data configuration diagram of a database constructed in the management computer.

図1において、電子部品実装装置1は、基板の搬送方向に対して上流から下流に向けて配置された基板検査装置2と半田印刷装置3と印刷状態検査装置4と電子部品搭載装置5と搭載状態検査装置6とリフロー装置7と実装状態検査装置8とで構成されている。電子
部品実装装置1は、これら各装置においてそれぞれ所定の処理を施すことで基板に電子部品を実装する。
In FIG. 1, an electronic component mounting apparatus 1 is mounted with a board inspection device 2, a solder printing device 3, a printing state inspection device 4, and an electronic component mounting device 5 that are arranged from upstream to downstream with respect to the board conveyance direction. The state inspection device 6, the reflow device 7, and the mounting state inspection device 8 are configured. The electronic component mounting apparatus 1 mounts an electronic component on a substrate by performing predetermined processing in each of these apparatuses.

基板検査装置2は実装対象となる基板の外観検査を行う。この外観検査には非接触型の三次元計測器を用いる。三次元計測器は基板表面に光を走査させ、基板表面で反射した光を受光した位置に応じてサンプリング測点の高さ(Z座標値)を計測する。サンプリング測点は基板の全面に適宜分布するように水平位置(XY座標値)が予め設定されている。基板検査装置2はこれらの三次元データに基づいて基板の外観を示す近似曲面データを生成する。近似曲面データとは基板表面の曲面形状を複数の三次元曲線データの重ね合わせによって構成したものであり、実際に計測していない箇所については周囲のサンプリング測点の複数の三次元データから解析して算出する。サンプリング測点の高さ(Z座標値)に予め定めた許容値を超えるものがなかった場合には、基板には品質上問題となる反りは生じていないと判断され、次の半田印刷装置3に移送される。   The board inspection apparatus 2 performs an appearance inspection of a board to be mounted. A non-contact type three-dimensional measuring instrument is used for this visual inspection. The three-dimensional measuring instrument scans the surface of the substrate with light and measures the height (Z coordinate value) of the sampling point according to the position where the light reflected on the surface of the substrate is received. The horizontal positions (XY coordinate values) are set in advance so that the sampling measurement points are appropriately distributed over the entire surface of the substrate. The board inspection apparatus 2 generates approximate curved surface data indicating the appearance of the board based on these three-dimensional data. Approximate curved surface data consists of the curved surface shape of the substrate surface by superimposing multiple 3D curve data, and for areas that are not actually measured, analysis is performed from multiple 3D data at surrounding sampling stations. To calculate. If the sampling station height (Z coordinate value) does not exceed a predetermined allowable value, it is determined that the substrate does not have a warp that causes a quality problem, and the next solder printing apparatus 3 It is transferred to.

半田印刷装置3は基板表面に形成されている電極に半田のスクリーン印刷を行う。スクリーン印刷に用いるマスクは基板表面に密着させる必要があり、顕著な反りがある基板とは密着しないので、そのような反りを生じている基板は基板検査装置2によって電子部品実装装置1から排除される。半田印刷装置3は基板の電極に対応する位置に開口が設けられているマスクを備えており、移送されてきた基板の表面にマスクを重ね、マスク上でスキージングしたクリーム状の半田を電極上に印刷する。マスクは基板の種類(電極の位置)によって専用のものが準備されている。同種の基板に対しては同一のマスクを使用して印刷を行う。半田印刷装置3で半田が印刷された基板は印刷状態検査装置4に順次移送される。   The solder printing apparatus 3 performs solder screen printing on the electrodes formed on the substrate surface. A mask used for screen printing needs to be in close contact with the substrate surface and does not adhere to a substrate with significant warpage. Therefore, the substrate incurring such warpage is excluded from the electronic component mounting apparatus 1 by the substrate inspection apparatus 2. The The solder printing apparatus 3 is provided with a mask having an opening at a position corresponding to the electrode of the substrate. The mask is superimposed on the surface of the transferred substrate, and the cream-like solder squeezed on the mask is placed on the electrode. Print on. A special mask is prepared depending on the type of substrate (position of electrode). Printing is performed on the same type of substrate using the same mask. The board on which the solder is printed by the solder printing apparatus 3 is sequentially transferred to the printing state inspection apparatus 4.

印刷状検査装置4は半田印刷装置3から順次移送されてきた基板に印刷されている半田の外観検査を行う。基板検査装置2と同様に三次元計測器を用いて半田表面を含む基板表面の全面に適宜分布させたサンプリング測点の三次元データ(XYZ座標値)を取得し、これらの三次元データに基づいて基板の外観を示す近似曲面データを生成する。半田の印刷状態は半田表面の三次元データに基づいて半田の印刷面積、体積、厚さ、位置等の評価項目を数値化し、これらを閾値処理することでその良否を判断する。半田が所定の位置に所定の形状で印刷されていなければ印刷状態が不良であるとして排除する。   The printed inspection apparatus 4 inspects the appearance of the solder printed on the board sequentially transferred from the solder printing apparatus 3. Similar to the substrate inspection apparatus 2, the three-dimensional measuring instrument is used to obtain three-dimensional data (XYZ coordinate values) of sampling points distributed appropriately over the entire surface of the substrate including the solder surface, and based on these three-dimensional data. To generate approximate curved surface data indicating the appearance of the substrate. The solder printing state is evaluated based on the three-dimensional data on the solder surface by digitizing evaluation items such as the solder printing area, volume, thickness, and position, and thresholding them. If the solder is not printed in a predetermined shape at a predetermined position, the printed state is rejected as defective.

半田の印刷状態が正常であると判断された基板は電子部品搭載装置5に移送される。電子部品搭載装置5は電子部品の電極が半田に接触するように電子部品の搭載を行う。搭載状態検査装置6は基板表面の三次元計測によって電子部品の搭載状態の検査を行う。電子部品が正常な搭載状態にある基板はリフロー装置7に移送され、ここで電子部品を基板に半田付けする。これで電子部品と基板が電気的および機械的に完全に接続された状態となり、電子部品の実装工程が完了する。   The board determined that the solder printing state is normal is transferred to the electronic component mounting apparatus 5. The electronic component mounting apparatus 5 mounts the electronic component such that the electrode of the electronic component is in contact with the solder. The mounting state inspection device 6 inspects the mounting state of the electronic component by three-dimensional measurement of the substrate surface. The substrate on which the electronic component is normally mounted is transferred to the reflow device 7 where the electronic component is soldered to the substrate. Thus, the electronic component and the board are completely electrically and mechanically connected, and the mounting process of the electronic component is completed.

実装状態検査装置8は、実装が完了した基板の外観検査を行う。この外観検査によって基板が製品として出荷できる品質であるかどうかの最終確認を行う。半田のリフロー時に電子部品が移動することがあるが、この移動が許容範囲内であるかどうかを三次元データに基づいて電子部品の位置を確認することで判断する。また、リフロー時に基板に加わる熱や溶融した半田の凝固時に基板に加わる応力等による基板の変形が起り得るので、電子部品が搭載されている箇所以外の箇所をサンプリング測点として基板表面の三次元計測を行い、これらの三次元データに基づいて基板表面の曲面形状を近似した近似曲面データを生成する。   The mounting state inspection device 8 performs an appearance inspection of the board that has been mounted. A final confirmation is made as to whether or not the substrate is of a quality that can be shipped as a product by this appearance inspection. The electronic component may move during solder reflow. Whether the movement is within an allowable range is determined by checking the position of the electronic component based on the three-dimensional data. In addition, since the substrate may be deformed by heat applied to the substrate during reflow or stress applied to the substrate during solidification of the molten solder, the three-dimensional surface of the substrate is set at a sampling point other than where the electronic component is mounted. Measurement is performed to generate approximate curved surface data that approximates the curved surface shape of the substrate surface based on these three-dimensional data.

管理コンピュータ9は、前記各装置2〜8の動作制御を行うとともに、個々の基板に対して各装置2〜8で実行した作業に関するデータやそこで得られた三次元データ等を基板
のID情報と関連付けたデータベースとして記憶する。図2において、基板のID情報は個々の基板に固有の情報であり、管理コンピュータ9は新たな基板を扱う毎にID情報を付した履歴データや近似曲面データを蓄積してデータベースを構築する。
The management computer 9 controls the operation of each of the devices 2 to 8, and uses the substrate ID information and the data regarding the work executed by the devices 2 to 8 for each substrate, the three-dimensional data obtained there, etc. Store as an associated database. In FIG. 2, the board ID information is information unique to each board, and the management computer 9 builds a database by accumulating history data and approximate curved surface data with ID information every time a new board is handled.

近似曲面データ(印刷前)11は基板検査装置2での外観検査によって生成されたものである。印刷作業データ12には、半田印刷装置3で用いられたマスクに関するデータや半田の品種に関するデータのほか、印刷作業中に発生したエラーの種類や発生時間等のログが記録されている。印刷状態検査データ13には印刷状態検査装置4での外観検査によって得られた半田の印刷位置や印刷量等が記録されている。近似曲面データ(印刷後)14は印刷状態検査装置4での外観検査によって生成されたものである。   The approximate curved surface data (before printing) 11 is generated by an appearance inspection by the substrate inspection apparatus 2. In the print work data 12, in addition to data related to the mask used in the solder printing apparatus 3 and data related to the type of solder, a log of the type and time of errors that occurred during the print work is recorded. The print state inspection data 13 records the print position, print amount, etc. of the solder obtained by the appearance inspection in the print state inspection device 4. The approximate curved surface data (after printing) 14 is generated by an appearance inspection by the printing state inspection device 4.

搭載作業データ15には、基板に搭載した電子部品の品種やロットに関するデータやフィーダやノズルのID情報が記録されているほか、ピックアップした電子部品の位置認識の結果を記録した認識データや、位置補正のために行った動作を記録した動作データが含まれており、さらには搭載作業中に発生したエラーの種類や発生時間等のログも記録されている。搭載状態検査データ16には搭載状態検査装置6での外観検査によって得られた電子部品の位置情報等が記録されている。   The mounting work data 15 includes data on the type and lot of electronic components mounted on the board, ID information on feeders and nozzles, as well as recognition data that records the results of position recognition of the picked-up electronic components, Operation data recording the operation performed for correction is included, and a log of the type and time of error that occurred during the mounting operation is also recorded. In the mounting state inspection data 16, position information and the like of electronic parts obtained by appearance inspection by the mounting state inspection device 6 are recorded.

リフロー作業データ17にはリフロー装置7の機能仕様や作業履歴等を記録したプロファイルデータが含まれており、そのほかリフロー作業中に発生したエラーの種類や発生時間等のログも記録されている。リフロー後検査データ18には実装状態検査装置8での外観検査によって得られた電子部品の位置情報等が記録されている。近似曲面データ(リフロー後)19は実装状態検査装8での外観検査によって生成されたものである。   The reflow work data 17 includes profile data in which the functional specifications and work history of the reflow apparatus 7 are recorded. In addition, a log of the type and time of errors that occurred during the reflow work is also recorded. In the post-reflow inspection data 18, position information of electronic parts obtained by appearance inspection by the mounting state inspection device 8 is recorded. The approximate curved surface data (after reflow) 19 is generated by an appearance inspection by the mounting state inspection device 8.

電子部品実装装置1で生産された基板はその全てについてこのようなデータベースが構築されるので、ある基板を最終的に搭載した製品に経年的な不具合が発生した場合にID情報からデータベースに含まれる生産履歴をトレースバックすることができる。特に基板の反りに関しては、半田印刷装置3で半田を印刷する前段階および半田を印刷した後段階と、リフロー装置7で電子部品を半田付けした後段階において生成した近似曲面データを記憶しているので、基板の反りと不具合との因果関係を基板の生産過程に沿って段階的に解析することができる。   Since such a database is constructed for all the boards produced by the electronic component mounting apparatus 1, when a product with a certain board finally mounted has a problem over time, it is included in the database from the ID information. The production history can be traced back. In particular, with respect to the warping of the board, approximate curved surface data generated in the stage before printing solder with the solder printing device 3 and the stage after printing solder and the stage after soldering electronic components with the reflow device 7 are stored. Therefore, the causal relationship between the warp and the defect of the substrate can be analyzed step by step along the production process of the substrate.

具体的には、基板のある電子部品との接合箇所に半田クラックが生じたような場合に、この接合箇所について基板の反り状態を印刷前後および実装後の各段階で生成した近似曲面データを参照することになる。この結果、例えば当該接合箇所においては印刷の前段階から反りが生じていたことが判明した場合には、半製品として入荷した基板自体に問題があったのであって生産工程自体には問題がなかったと結論付けることができる。この場合、基板検査装置2での外観検査基準を見直し、より平板に近い状態にある基板のみを生産工程に移行するようにするという対策を講じことになる。また、当該基板と同じロットの基板を搭載した製品に関しても同様の不具合が多発することが考えられるので、予め対策を講じておくことができる。   Specifically, when a solder crack occurs at a joint with an electronic component on the board, refer to the approximate curved surface data generated at each stage before and after printing and the board warpage state for this joint. Will do. As a result, for example, when it has been found that warpage has occurred at the joining portion from the previous stage of printing, there was a problem with the substrate itself received as a semi-finished product, and there was no problem with the production process itself. It can be concluded that In this case, it is necessary to review the appearance inspection standard in the substrate inspection apparatus 2 and take measures to shift only the substrate closer to the flat plate to the production process. Moreover, since it is possible that the same malfunction occurs frequently also about the product which mounts the board | substrate of the same lot as the said board | substrate, a countermeasure can be taken beforehand.

また、例えば半田付け後の段階でのみ当該接合箇所に反りが確認された場合には、リフロー装置7での加熱によって基板に熱変形が生じたと結論付けることができる。この場合の対策としては、リフロー工程におけるプロファイルデータを確認し、例えば設定温度や加熱時間、基板の設置場所等のリフロー条件の見直しを行うことになる。   Further, for example, when warping is confirmed at the joint portion only at the stage after soldering, it can be concluded that the substrate is thermally deformed by heating in the reflow apparatus 7. As a countermeasure in this case, the profile data in the reflow process is confirmed, and the reflow conditions such as the set temperature, the heating time, the substrate installation location, etc. are reviewed.

生産過程において基板に反りが発生していたことが判明した場合、入荷した基板自体には特段の問題はなかったということなので、少なくとも基板自体に対するロット追跡によるトレースフォワードを行う必要はなくなる。この場合はデータベースに記憶されている
生産データやログデータを確認し、反りの発生との因果関係を解析し、生産条件の見直し等の適切な対策を講じることになる。
If it is found that the substrate is warped during the production process, it means that there is no particular problem with the received substrate itself, so that it is not necessary to perform trace forward by at least lot tracking on the substrate itself. In this case, production data and log data stored in the database are confirmed, a causal relationship with the occurrence of warpage is analyzed, and appropriate measures such as review of production conditions are taken.

このように本発明の電子部品実装装置1は、生産した全ての基板に対し生産工程の各段階での基板の形状を示す近似曲面データをデータベース化しておくことで、経年的に不具合を生じさせる原因となった基板の反りがどの段階で発生したのかを確認することができる。その結果、生産条件の見直し等の必要な対策を早急に講じることが可能になるとともに、無駄なトレースバックやトレースフォワードを行うことがなくなり、トレーサビリティの効率的、効果的な運用が可能になる。   As described above, the electronic component mounting apparatus 1 of the present invention causes a problem over time by creating a database of approximate curved surface data indicating the shape of the substrate at each stage of the production process for all the produced substrates. It is possible to confirm at which stage the substrate warpage that has occurred is generated. As a result, necessary measures such as a review of production conditions can be taken as soon as possible, and unnecessary traceback and traceforward are not performed, enabling efficient and effective operation of traceability.

本発明は電子部品を基板に半田付けする電子部品の実装分野において有用である。   The present invention is useful in the field of electronic component mounting where an electronic component is soldered to a substrate.

本発明の実施の形態の電子部品実装装置の構成を示したブロック図The block diagram which showed the structure of the electronic component mounting apparatus of embodiment of this invention 管理コンピュータに構築されたデータベースのデータ構成図Data structure diagram of the database built on the management computer

符号の説明Explanation of symbols

1 電子部品実装装置
3 半田印刷装置
7 リフロー装置
9 管理コンピュータ
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Solder printing apparatus 7 Reflow apparatus 9 Management computer

Claims (1)

半田印刷装置と電子部品搭載装置とリフロー装置を備えた電子部品実装装置において、基板の表面の三次元データを取得する手段と、取得した三次元データに基づいて基板の外観を表す近似曲面データを生成する手段と、基板のID情報と前記近似曲面データとを関連付けて記憶する手段を備え
前記近似曲面データを、前記半田印刷装置で半田を印刷する前段階及び半田を印刷した後段階及び前記リフロー装置で電子部品を半田付けした後段階において生成し、記憶することで、基板の反りと半田クラックとの因果関係を基板の生産過程に沿って段階的に解析することを特徴とする電子部品実装装置。
In an electronic component mounting apparatus including a solder printing apparatus, an electronic component mounting apparatus, and a reflow apparatus, means for acquiring three-dimensional data on the surface of the board, and approximate curved surface data representing the appearance of the board based on the acquired three-dimensional data Means for generating, and means for storing the ID information of the substrate and the approximate curved surface data in association with each other ,
The approximate curved surface data is generated and stored in a stage before printing the solder with the solder printing apparatus, a stage after printing the solder, and a stage after soldering the electronic component with the reflow apparatus. An electronic component mounting apparatus characterized in that a causal relationship with a solder crack is analyzed step by step along a board production process .
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JP5528193B2 (en) 2010-04-30 2014-06-25 株式会社日立ハイテクインスツルメンツ Component mounting apparatus and method for identifying cause of reduction in production throughput
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