JP4970343B2 - Semiconductor element mounting structure - Google Patents

Description

  The present invention relates to a structure for attaching a semiconductor element to a radiation fin.

As shown in Patent Document 1 or FIG. 6 , conventionally, the semiconductor element 1 has three linear lead terminals 5 arranged in parallel at the same pitch P on the lower side of the element body 3 made of synthetic resin. The attachment to the printed circuit board 7 of the semiconductor element 1, the through hole 9 provided on the printed board 7 in accordance with the pitch P of the lead terminal 5, from the back side of the printed circuit board 7 by inserting the lead terminals 5 to the through hole 9 The lead terminal 5 is soldered.

  By the way, in the structural design of electronic equipment, heat dissipation of the heat generating component is an important issue, and conventionally, a structure in which the heat generating component is attached to the heat radiating fin is widely adopted as a heat dissipation measure.

The semiconductor device as a heat generating components also, which have the heat dissipation is achieved by installing the heat radiation fins, conventionally, when mounting the semiconductor element to the heat radiating fin and screwed to the printed circuit board 9 as shown in FIG. 7 The semiconductor element 1 is screwed directly or indirectly to the radiation fin 11 from the lateral direction by bringing the side surface 11a of the radiation fin 11 into contact with the back surface 3a side of the element body 3.

However, in the mounting structure of FIG. 7 , due to the relationship with the peripheral device mounted on the printed circuit board, when the semiconductor element is retrofitted to the heat radiating fin, the peripheral device becomes in the way and the tightening tool cannot be used. In some cases, mounting by screwing was not possible. Therefore, there is a restriction that the semiconductor element must be screwed to the heat radiating fin prior to mounting of other peripheral devices.

  In addition, when other peripheral devices are soldered to the printed circuit board, when it is desired to remove the semiconductor element from the printed circuit board by replacing parts or the like, the peripheral device becomes in the way and the tightening tool cannot be used. It was also pointed out that it could not be removed.

  The present invention has been devised in view of such circumstances, and an object of the present invention is to provide a semiconductor element mounting structure capable of mounting / removing a semiconductor element on / from a heat radiating fin without being affected by peripheral devices.

In order to achieve such an object, the mounting structure of the semiconductor device according to claim 1 is formed in a substantially mountain shape in cross section using a plate material, and is fixed to be deformed into a flat shape by screwing to the printed board from below. and pieces, extending into the acute angle obliquely upward from the fixed piece, a semiconductor mounting member comprising a pressing piece warps further acute angle by the deformation of the fixing piece by screws to a printed circuit board, attached to a printed circuit board A piece is formed in an L-shaped cross section, and a notch through which the lead terminal of the semiconductor element can be inserted is formed in the attachment piece, and is fastened to the printed circuit board with the fixing piece of the semiconductor attachment member and a screw. The insulating sheet is interposed between the radiating fin and the semiconductor element and the radiating fin. The insulating sheet extends to the fixed piece, and the insulating sheet, the radiating fin mounting piece, and the semiconductor mounting member Kyoshime rice on the printed board with a screw Johen causes Sorikaera the pressing piece in the deformation of the fixing piece by screwing, pressing the semiconductor element to the heat radiating fins on the printed circuit board in the pressure piece, holding to Turkey And features.

The invention according to claim 2 is the semiconductor element mounting structure according to claim 1, wherein the pressing piece extends in the lateral direction to form the semiconductor mounting member in the lateral direction, and A plurality of the fixing pieces are provided .

According to a third aspect of the present invention, in the semiconductor element mounting structure according to the second aspect, a plurality of semiconductor elements are arranged laterally on the printed circuit board, and all the semiconductor elements are connected to the one semiconductor mounting structure. It is characterized in that it is pressed and held by a member on a heat radiating fin .

According to the invention of claim 1, even if the peripheral device is already mounted on the printed circuit board, removal of the mounting and the semiconductor element of the heat radiation fins and the semiconductor element from the underside of the printed circuit board to the printed circuit board can be the result As a result, the degree of freedom in structural design was improved.
Thus also, the heat radiation fins and the semiconductor mounting member, since the insulating sheet can be fastened, together with the cost can be reduced in work in improving the workability, that insulation sheet deviates when removing the semiconductor device from the printed circuit board Therefore, there is an advantage that workability such as maintenance is improved.
In addition, since a notch through which the lead terminal of the semiconductor element can be inserted is formed in the mounting piece of the heat radiation fin, it is possible to cope with a lateral shift of the mounting position of the semiconductor element.

According to the inventions according to claim 2 and claim 3 , since a plurality of semiconductor elements can be attached to the heat radiating fins by one semiconductor attachment member, workability is remarkably improved as compared with the conventional case, and further work is performed. There is an advantage that the cost can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same thing as the prior art example shown in FIG. 7 , and those description is abbreviate | omitted.

1 to 4 relates to a mounting structure of a semiconductor device according to an embodiment of claim 1 and claim 2, At a 1, 21, like the semiconductor device 1 of FIG. 7, the lower side of the device body 23 3 is a semiconductor element in which three lead terminals 5 are arranged in parallel at the same pitch. As shown in FIG. 3, a pair of left and right mounting pieces 25a to the printed circuit board 7 are formed on the lower side with a notch 27 therebetween. The heat dissipating fin 25 is an L-shaped heat dissipating fin, which is wider than the semiconductor element 21 and is elongated in the lateral direction.

As shown in FIG. 1, the radiating fins 25 are arranged on the printed circuit board 7 in the opposite direction to the radiating fins 11 of FIG. 7 , and the mounting pieces 25a have screw insertion holes provided in the printed circuit board 7. A screw hole 31 is provided corresponding to 29. As shown in FIGS. 1 and 4, the radiating fins 25 are fastened by screws 33 inserted into the screw insertion holes 29 from below the printed circuit board 7 and nuts 35 disposed on a fixing piece 37a described later. The through-hole 9 of the printed circuit board 7 is opened in the notch 27 by being attached to the printed circuit board 7.

  A semiconductor mounting member (hereinafter referred to as “mounting member”) 37 formed of a plate material such as phosphor copper or stainless steel and having substantially the same lateral width as that of the heat radiating fin 25 is disposed on the mounting piece 25 a of the radiating fin 25. ing.

  As shown in FIGS. 1 and 3, the mounting member 37 includes a pair of left and right fixing pieces 37a formed corresponding to the mounting piece 25a, and a pressing piece extending obliquely upward from the both fixing pieces 37a at an acute angle. 37b, and the lateral width of the fixing piece 37a is substantially the same as that of the mounting piece 25a. The fixing piece 37a is formed in a substantially mountain shape in cross section along the pressing piece 37b, and is deformed into a flat shape as shown in FIG. As the fixing piece 37a is deformed by screwing to the printed circuit board 7, the pressing piece 37b warps more acutely in the direction of arrow A. And the front-end | tip of the press piece 37b is curving in the reverse direction.

Further, the fixing piece 37a, the is provided with a large so-called fool-hole 39 than the screw hole 31 corresponding to the screw hole 31, the mounting member 37 (fixing portion 37a) is in the screw 33 and the nut 35 The printed circuit board 7 is fastened together with the heat radiating fins 25 (mounting pieces 25a). When the lower printed circuit board 7 as described above is tightened to the screw 33, the fixing piece 37a is deformed into a flattened shape in the clamping force of the nut 35 arranged with the screw 33 on the fixing piece 37a The heat radiation fin 25 is fastened together with the printed circuit board 7 while being fixed on the mounting piece 25a. As the fixing piece 37a is deformed, the pressing piece 37b warps in the direction of arrow A, and the back surface 23a side of the element body 23 is pressed against the side surface 25b of the radiation fin 25 from the front surface of the semiconductor element 21 as shown in FIG. The semiconductor element 21 is held by the heat radiating fins 25.

  Therefore, when attaching the radiation fin 25 and the attachment member 37 to the printed circuit board 7, the semiconductor element 21 is brought into contact with the side surface 25b of the radiation fin 25 as shown in FIG. It is necessary to keep. And after fixing the radiation fin 25 and the attachment member 37 to the printed circuit board 7 and holding the semiconductor element 21 on the radiation fin 25 with the attachment member 37 (pressing piece 37b), the lead terminals 5 are soldered from the back side of the printed circuit board 7, respectively. By attaching, the attachment of the semiconductor element 25 to the printed circuit board 7 and the radiation fin 25 is completed.

As shown in FIGS. 1 and 4, a well-known insulating sheet 41 is interposed between the radiation fin 25 and the semiconductor element 21 (element body 23). The insulating sheet 41 is a fixed piece of the mounting member 37. is extended every 37a to the fixing piece 37a, it is sandwiched between the attachment piece 25a of the fixing piece 37a and the heat dissipating fins 25. The insulation sheet 41 is fastened at the fixing piece 37a and the mounting pieces 25a and the screw 33. Therefore, the insulating sheet 41 is provided with screw insertion holes (not shown) corresponding to the screw holes 31.

Since this embodiment is constructed as this, it has been already implemented multiple devices 43, 45 and 47 around the mounting region of the semiconductor element 21 and the radiating fins 25 as shown in FIG. 2, the mounting structure of FIG. 7 1 can be used, after disposing the radiation fin 25 on the printed circuit board 7 as shown in FIG. 1 and placing the attachment member 37 on the attachment piece 25a via the insulating sheet 41, The screw 33 is lightly screwed from below the printed board 7 to the nut 35 disposed on the screw hole 31 and the fixing piece 37a from the screw insertion hole 29, and the heat radiation fin 25 and the mounting member 37 are temporarily fixed on the printed board 7. . In this state, the fixed piece 37a is slightly deformed, and accordingly, the pressing piece 37b slightly warps in the direction of the arrow A.

Thereafter, disposed between one of the lead terminals 5 of the semiconductor element 21 is inserted into the through hole 9 of the printed circuit board 7 notwithstanding et al, the semiconductor element 21 radiating fin 25 and the pressing piece 37b as shown in FIG. 3 Then, the back surface 23 a of the element body 23 is brought into contact with the side surface 25 b of the heat radiation fin 25. If the screw 33 is strongly tightened in this state, the fixing piece 37a is deformed into a flat shape by the tightening force of the screw 33 and the nut 35 as described above, and is fixed to the mounting piece 25a of the radiation fin 25. At the same time, the heat radiating fins 25 are fastened together with the printed circuit board 7. Then, along with the deformation of the fixing piece 37a, the pressing piece 37b further warps in the direction of the arrow A, pressing the back surface 23a side of the element body 23 from the front surface of the semiconductor element 21 to the side surface 25b of the radiation fin 25 as shown in FIG. The semiconductor element 21 is held by the heat radiation fin 25.

  Further, when a situation occurs in which the semiconductor element 21 is replaced due to long-term use, the screw 33 is loosened from below the printed circuit board 7 even if other peripheral devices 43, 45, 47 are soldered to the printed circuit board 7. Then, the pressing piece 37b that presses the semiconductor element 21 against the heat radiating fin 25 moves in the direction of arrow B in FIG. 4 and moves away from the element main body 23, so that the solder of the printed circuit board 7 and the lead terminal 5 is removed. The semiconductor element 21 can be removed from the printed circuit board 7.

  And even if it removes the semiconductor element 21 from the printed circuit board 7 in this way, since the insulating sheet 41 is clamped between the fixing piece 37a and the attachment piece 25a, the insulating sheet 41 will not come off. Thereafter, a new semiconductor element may be attached to the radiation fin 25 by the procedure described above.

Thus, according to the present embodiment, even if the peripheral devices 43, 45, 47 are already mounted on the printed circuit board 7, the heat radiation fins 25 and the semiconductor elements 21 from the lower side of the printed circuit board 7 to the printed circuit board 7 are provided. And the semiconductor element 21 can be detached, and the degree of freedom in structural design is improved. In addition, even if the mounting position of the semiconductor element 21 is laterally shifted in the notch 27, it can be dealt with.

Further, as compared with the conventional example of FIG. 7, the screwing man-hour is reduced, and the heat radiation fin 25 and the mounting member 37 can be fastened together, so that the workability is improved and the cost can be reduced.

  Furthermore, according to this embodiment, since the insulating sheet 41 does not come off when the semiconductor element 21 is removed from the printed board 7, workability such as maintenance is improved.

  In the above embodiment, the mounting of one semiconductor element 21 has been described. However, as an example, two semiconductor elements 21 can be mounted side by side in the notch 27, and a plurality of semiconductor elements 27 are further aligned. When attaching, the attachment member which changed the width | variety of the notch 27 according to the attachment number should just be used.

Figure 5 shows a radiation fin and a mounting member used in the mounting structure according to an embodiment of the claims 1 to 3, the mounting member 51 further many semiconductor elements on the printed circuit board compared to the embodiment Used for mounting in a single row, it has a long shape such that three of the mounting members 37 are juxtaposed in the lateral direction, and six fixing pieces 51a having the same shape as the fixing pieces 37a are provided at the bottom of the pressing piece 51b. It is a thing.

In addition, although not shown, the radiating fin used in the present embodiment is also formed to be long in the horizontal direction corresponding to the mounting member 51, and the mounting piece is formed corresponding to each fixing piece 51a. The heat dissipating fins are arranged on the printed circuit board in the same direction as the heat dissipating fins 25 in FIG. 1 , and the mounting pieces are provided with screw holes corresponding to the screw insertion holes provided in the printed circuit board. .
As with the heat radiating fin 25, the heat radiating fin is fixed to the printed circuit board by being tightened with a screw inserted into the screw insertion hole from below and a nut disposed on the fixing piece 51a. , insulating sheet extends in each fixing piece 51a of the mounting member 51 to the fixing piece 51a.

Radiating fin and the mounting member 51 of the present embodiment, the insulating sheet is constituted as this, the present embodiment also, similar to the embodiment of FIG. 1, a plurality of semiconductor elements on the heat radiating fins from the lower side of the printed circuit board Since it can be attached, even if peripheral devices are already mounted on the printed circuit board 7, it is possible to attach and remove the heat dissipating fins and the semiconductor elements to the printed circuit board, and the degree of freedom in structural design compared to the conventional case. Will improve.

In this embodiment, for example, when the two fixing pieces 51a on the left side of the mounting member 51 are tightened to fix the semiconductor element between the fixing pieces 51a, the pressing piece 51b on the adjacent fixing piece 51a side also warps, The semiconductor element can be temporarily fixed to the radiating fin on the side of the adjacent fixed piece 51a by the warping of the pressing piece 51b.

  For this reason, according to the present embodiment, there is an advantage that it is excellent in workability when mounting many semiconductor elements, and can be handled even when the mounting position of the semiconductor elements is shifted in the lateral direction.

Even in the present embodiment, similar to the embodiment of FIG. 1, when removing the semiconductor device printed circuit board or, et al., Since no insulating sheet comes off, the work of maintenance and the like are improved When removing the semiconductor element from the printed circuit board, there is an advantage that the radiating fin does not rattle.

It is a side view of the attachment structure which concerns on one Embodiment of Claim 1 and Claim 2 before the attachment of a semiconductor element. It is explanatory drawing of the attachment condition of a peripheral device. It is a whole perspective view of a radiation fin and an attachment member. It is a side view after a semiconductor element attachment. It is a perspective view of the attachment member used for the attachment structure of the semiconductor element which concerns on one Embodiment of Claims 1 thru | or 3 . It is explanatory drawing of the attachment method of the conventional semiconductor element. It is a side view of the conventional semiconductor element mounting structure.

Explanation of symbols

5 Lead terminal 7 Printed circuit board 9 Through hole 21 Semiconductor element 25 Radiation fin 25a Mounting piece 27 Notch 37, 51 Mounting member (semiconductor mounting member)
37a, 51a Fixed pieces 37b, 51b Pressing piece 41 Insulating sheet

Claims (3)

A fixed piece that is formed into a substantially mountain shape in cross section using a plate material and deforms into a flat shape when screwed to the printed board from below, and is extended obliquely upward from the fixed piece at an acute angle to the printed board. A semiconductor mounting member consisting of a pressing piece that further warps sharply by deformation of the fixed piece by screwing ;
An attachment piece to the printed board is formed in an L-shaped cross section, a notch through which the lead terminal of the semiconductor element can be inserted is formed in the attachment piece, and the printed board is formed by the fixing piece and the screw of the semiconductor attachment member Radiating fins fastened together,
An insulating sheet interposed between the semiconductor element and the heat radiating fin,
Wherein an insulating sheet is extended to the fixed piece, the insulating sheet and Kyoshime tanning the fixing piece of the mounting piece and the semiconductor mounting member to the printed circuit board by screws of the heat radiating fins, the pressing piece in the deformation of the fixing piece by screws was Sorikaera mounting structure of a semiconductor device according to the pressing the semiconductor element to the heat radiating fins on the printed circuit board, holding to features and Turkey in the pressure piece. The semiconductor element mounting structure according to claim 1, wherein the pressing piece extends in the lateral direction to form a semiconductor mounting member elongated in the lateral direction, and a plurality of the fixing pieces are provided . The semiconductor element mounting structure according to claim 2 , wherein a plurality of semiconductor elements are arranged laterally on the printed circuit board, and all the semiconductor elements are pressed against and held by the heat radiating fins by one semiconductor mounting member. .

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