JP4967241B2 - Capacitor-embedded wiring board, manufacturing method thereof, and electronic device - Google Patents

Description

  The present invention relates to a wiring board with a built-in capacitor, a manufacturing method thereof, and an electronic device.

  In recent years, electronic devices such as mobile phones and PDAs have been required to be downsized and multifunctional. Therefore, the components of electronic devices such as wiring boards, semiconductors, and circuit components can be downsized and densified. It is necessary to mount various circuit blocks close to each other.

  When a plurality of circuit blocks are close to each other, electromagnetic noise radiated from the circuit block is transmitted to the adjacent circuit block, which may affect the function. Particularly, in a communication device such as a mobile phone, a baseband portion that operates at high speed becomes a large radiation noise source, which may interfere with an RF portion centering on a high-sensitivity antenna. For this reason, it has become important to suppress electromagnetic noise radiated from the circuit block as much as possible.

  In recent years, the operating voltage of a semiconductor device has been lowered in accordance with the demand for miniaturization of design rules for increasing the information processing capability of semiconductor devices and the reduction of power consumption. Therefore, the fluctuation range of the power supply voltage that can be allowed for stable operation of the semiconductor device is also reduced, and it is important to reduce the power supply noise of the wiring board that is the power supply source of the semiconductor device.

  Electromagnetic noise and power supply noise are caused mainly by factors related to power supply to the semiconductor device and resonance factors of electrical signals that occur in the power supply wiring layer and the ground wiring layer of the wiring board.

  The cause of power supply to the semiconductor device is a phenomenon in which the power supply voltage fluctuates due to an increase in current value accompanying an increase in the number of transistors in the semiconductor device and an increase in time change rate of current accompanying an increase in switching speed.

  On the other hand, the cause of electrical signal resonance that occurs in the power supply wiring layer and ground wiring layer of the wiring board is that the standing wave generated by signal reflection due to impedance mismatch between the power supply wiring layer and the ground wiring layer is an antenna. This is a phenomenon in which electromagnetic waves are radiated by resonance and the potential of the ground wiring layer fluctuates.

  To counter these problems, measures are taken to place a bypass capacitor on the wiring board. As a means for disposing a capacitor on a wiring board, a method of mounting a circuit component such as a chip capacitor on the wiring board has been conventionally used. However, in this method, since the power supply wiring layer and the chip capacitor are separated via the insulating layer, there is a problem that the inductance component of the wiring weakens the effect of the capacitor. In addition, chip capacitors with alternating layers of dielectrics and electrodes have a limited frequency band that functions as a capacitor due to self-resonance, so multiple capacitors with different characteristics must be installed, and the number of mounted components increases. The problem of doing was happening.

  In order to solve these problems, efforts to form a bypass capacitor in a wiring board have recently become active. There are mainly two methods for forming a bypass capacitor in a wiring board.

  The first method is a method in which a dielectric having a high dielectric constant is formed over a certain layer in a wiring board. The second method is a method of embedding a chip capacitor in a dielectric formed on the entire surface between the power supply wiring layer and the ground wiring layer of the wiring board.

  As prior art document information related to the present invention, for example, Patent Document 1 and Patent Document 2 are known. In Patent Document 1, a configuration as shown in FIG. 10 is proposed. FIG. 10 shows a cross-sectional view of a wiring board on which a capacitor laminate is formed. In the wiring substrate 101, the wiring 102 is electrically connected through a through hole 104 that penetrates the insulating layer 103, and the entire region between the conductive power wiring layer 106 and the ground wiring layer 107 is dielectric 108. Capacitor laminate 109 is formed by sandwiching.

Patent Document 2 proposes a configuration as shown in FIG. FIG. 11 shows a cross-sectional view of a wiring board in which a chip capacitor is embedded in an insulating layer. In the wiring substrate 101, the wiring 102 is electrically connected between the layers through through holes 104 penetrating the insulating layer 103, and the chip capacitor 105 having a structure in which electrodes and dielectrics are alternately stacked is connected to the power wiring layer 106. The entire area between the ground wiring layers 107 is embedded in a capacitor laminate 109 with a dielectric 108 interposed therebetween.
Japanese Patent No. 2738590 JP 2003-204163 A

  However, in the method of forming a dielectric material over the entire layer in the wiring board, a large-capacity capacitor can be obtained from a large-area wiring board in a large electronic device, but the power supply to the semiconductor device is stabilized. However, there is a problem that the required capacity cannot be easily obtained because the area of an electronic device that is required to be reduced is small. In addition, resonance of a standing wave generated by reflection of a signal due to impedance mismatch between the power supply wiring layer and the ground wiring layer is generated at the frequency shown in the following (Equation 1). Then, the resonance frequency is lowered, and there is a problem that radiation noise is generated from the wiring board in the tens to thousands [MHz] generally used.

  In addition, since a dielectric is formed on the entire surface of the layer, a part of the signal wiring passes through the high-capacity layer and the signal quality is deteriorated. However, there is a problem that the design of the circuit pattern is restricted and the density of wiring that can meet the demand for downsizing of electronic devices is hindered.

  In the method of embedding the chip capacitor in the built-in capacitor formed between the power wiring layer and the ground wiring layer of the wiring board, the power supply when the semiconductor device is mounted may be stabilized, but it is formed on the entire surface of the interlayer. Since the built-in capacitor has a high dielectric constant, the resonance generated between the power supply wiring layer and the ground wiring layer shown in (Equation 1) is reduced in frequency. For this reason, the embedded chip capacitor is required to have stable dielectric characteristics in the high frequency range from low to high frequencies. However, the chip capacitor itself also causes self-resonance at a specific frequency and deteriorates the characteristics. It becomes difficult to completely suppress the resonance that is a cause of the occurrence. Furthermore, since it is necessary to embed a plurality of chip capacitors having different dielectric characteristics in order to cope with a wide band of resonance, it becomes a problem for miniaturization of the wiring board.

  In view of the above problems, an object of the present invention is to provide a wiring board in which radiation noise generated from the wiring board and fluctuations in power supply voltage are suppressed without causing deterioration in signal quality.

In order to solve the above-mentioned conventional problems, the present invention uses, as a dielectric, a resin multilayer wiring board having at least two layers used in an electronic device and a resin containing ceramic particles having a dielectric constant higher than that of an insulating layer of the wiring board. first capacitor, a between the power supply wiring layer and the ground wiring layer, the closest the wiring substrate to the end portion of the insulating layer and the source wiring layer are opposed to each other via the said ground wiring layer At least one or more capacitor-provided wiring boards are provided only within a range of 4/5 of the length of one side of the wiring board from the end face. This suppresses radiated noise caused by standing waves caused by signal reflection caused by the end of the power supply wiring layer and the ground wiring layer being regarded as an open end, and reduces the noise between the power supply wiring layer and the ground wiring layer. Can suppress voltage fluctuations. Furthermore, since the periphery of the power supply wiring layer and the ground wiring layer is an insulating layer having a low dielectric constant, signal quality is not deteriorated, circuit pattern design restrictions are reduced, and wiring density can be increased.

  The wiring board with a built-in capacitor according to the present invention reflects a signal generated when the end of the power wiring layer and the ground wiring layer is regarded as an open end by providing the capacitor at the end between the power wiring layer and the ground wiring layer. Therefore, it is possible to suppress radiation noise caused by the occurrence of a standing wave due to, and to suppress voltage fluctuation between the power supply wiring layer and the ground wiring layer. Further, since the periphery of the power supply wiring layer and the ground wiring layer is an insulating layer having a low dielectric constant, signal quality is not deteriorated, restrictions on circuit pattern design are reduced, and wiring density can be increased.

(Embodiment 1)
Hereinafter, the substrate with a built-in capacitor according to the first embodiment of the present invention will be described with reference to the drawings.

  1 is a cross-sectional view of a capacitor built-in substrate according to the first embodiment of the present invention, and FIGS. 2, 3, 4, and 5 are respectively a power supply wiring layer and a ground wiring of the capacitor built-in substrate according to the first embodiment of the present invention. It is plane sectional drawing between layers.

  In FIG. 1, a power wiring layer 2 is formed in the second layer from the top, and a ground wiring layer 3 is formed in the third layer from the top, and the power wiring layer 2 and the ground wiring layer 3 are opposed to each other with an insulating layer 4 interposed therebetween. . Although FIG. 1 shows a four-layer substrate, the number of layers is arbitrary as long as the substrate has a power wiring layer and a ground wiring layer.

The wiring 5 is patterned by etching a metal foil such as Cu. As the insulating layer 4, for example, a glass epoxy substrate in which glass fiber is impregnated with an epoxy resin, a composite sheet in which an inorganic filler such as SiO ₂ is combined with a resin such as an epoxy resin, or the like can be used. The wiring layers are electrically connected by the inner via 6 in FIG. 1, but can be electrically connected by a through-through hole.

  A first capacitor 7 is formed at the end between the power supply wiring layer 2 and the ground wiring layer 3. In the first capacitor 7, a dielectric 8 is sandwiched between electrodes 9. For the electrode 9, for example, resin or metal foil in which metal powder such as Cu is dispersed can be used.

  As described above, in the present embodiment, by providing the first capacitor 7 at the end between the power supply wiring layer 2 and the ground wiring layer 3, the ends of the power supply wiring layer 2 and the ground wiring layer 3 are open ends. It is possible to suppress radiation noise accompanying generation of a standing wave caused by reflection of a signal caused by being regarded as a signal, and to suppress voltage fluctuation between the power supply wiring layer 2 and the ground wiring layer 3. Further, since the periphery of the power supply wiring layer 2 and the ground wiring layer 3 is the insulating layer 4 having a low dielectric constant, the signal quality is not deteriorated, the restriction on the design of the circuit pattern is reduced, and the wiring 5 can be densified.

In the present embodiment, as shown in FIG. 2A, the first capacitor 7 is arranged at the corner portion of the wiring board 1 so that the standing wave generated by resonance is independent of the resonance frequency. Since the displacement is always large at the end of the substrate, the displacement is the largest at the corner that is the intersection of the sides of the wiring substrate 1, and the occurrence of radiation noise is suppressed by arranging the first capacitor 7 at this position, Voltage fluctuation between the power supply wiring layer 2 and the ground wiring layer 3 can be efficiently suppressed .

  Further, in the present embodiment, as shown in FIG. 3A, the first capacitor 7 is generated by resonance by installing the first capacitor 7 at a position that divides the length of the side in the wiring board 1 into n equal parts. Since the standing wave has a large displacement at the position where the side of the wiring board 1 is equally divided, the first capacitor 7 is disposed at this position to suppress the generation of radiation noise, and the power wiring layer 2 and the ground wiring layer 3. The voltage fluctuation can be efficiently suppressed between the two. At this time, as the capacitor 7 is arranged at a position where the number of sides of the wiring board 1 is reduced, the displacement of many standing waves can be suppressed. In particular, when the first capacitor 7 is arranged at a position that bisects the wiring board 1, the most displacement of the standing wave can be suppressed.

  If the first capacitor 7 is arranged not only on one side of the wiring board 1 as shown in FIG. 3A but also on any plural sides of the wiring board 1 as shown in FIG. The displacement of the standing wave can be effectively suppressed.

In the reference example of the present embodiment, as shown in FIG. 4, the first capacitor 7 is provided so as to surround the end portion of the wiring substrate 1 in an annular shape, so that the first capacitor 7 is formed at the end portion of the wiring substrate 1. Since it is not interrupted, radiation noise accompanying generation of a standing wave due to reflection of a signal caused by the end of the wiring substrate 1 of the power wiring layer 2 and the ground wiring layer 3 being regarded as an open end is suppressed, and the power wiring Voltage fluctuation can be efficiently suppressed between the layer 2 and the ground wiring layer 3.

Further, in the present embodiment, the capacitance of the first capacitor 7 is C [F], the drive frequency of the circuit block mounted on the wiring board 1 is f [Hz], and between the power wiring layer 2 and the ground wiring layer 3 By setting C so that Z ₀ > 1 / (2πfC) when the characteristic impedance is Z ₀ [Ω], the impedance ½πfC of the first capacitor 7 becomes the power wiring layer 2 and the ground wiring layer. When the electric capacitance C is set so as to be smaller than the characteristic impedance Z _{0 of} 3, the reflection of the signal caused by the end portions of the wiring substrate 1 of the power supply wiring layer 2 and the ground wiring layer 3 being regarded as open ends is suppressed. Therefore, radiation noise accompanying the generation of standing waves can be suppressed, and voltage fluctuations between the power supply wiring layer 2 and the ground wiring layer 3 can be suppressed.

In this embodiment, the long side of the insulating layer 4 between the power wiring layer 2 and the ground wiring layer 3 is a [m], the dielectric constant is ε, and the drive frequency of the circuit block mounted on the wiring board 1 is By setting the long side a so that f> 3 × 10 ⁶ / (2 × a × √ε) when f [Hz] is set, 3 between the power supply wiring layer 2 and the ground wiring layer 3. This is due to the reflection of the signal generated when the ends of the wiring substrate 1 of the power supply wiring layer 2 and the ground wiring layer 3 are regarded as open ends at a frequency of × 10 ⁸ / (2 × a × √ε) [Hz] or higher. Since a standing wave is generated, the first capacitor 7 is placed at the end of the wiring substrate 1 when the resonance frequency 3 × 10 ⁸ / (2 × a × √ε) [Hz] is less than 100 times the drive frequency. By arranging, the resonance is suppressed, the generation of electromagnetic waves is suppressed, and the power is connected between the power wiring layer 2 and the ground wiring layer 3. Fluctuations can be suppressed of.

  In the present embodiment, the dielectric of the first capacitor 7 is made of a resin containing ceramic particles having a high dielectric constant, so that there are few restrictions on the area and shape of the dielectric formation, and at the end of the wiring board 1 Since it is easy to form partly and it becomes possible to control the compounding quantity of the high dielectric constant ceramic in resin, the 1st capacitor | condenser 7 corresponding to a required performance can be formed easily.

  Further, in the present embodiment, compared with the case where the chip capacitors are arranged around the power supply wiring layer and the ground wiring layer, it is possible to efficiently suppress higher harmonic components that are included in the electric signal and become radiation noise. .

  The end portion between the power wiring layer 2 and the ground wiring layer 3 where the first capacitor 7 is disposed here does not necessarily include the end face of the wiring board 1 as shown in FIG. If one capacitor 7 is arranged within a range of about 4/5 of the length of the side of the wiring board 1 from the end face of the wiring board 1, reflected waves from the end of the wiring board can be suppressed.

  Further, when a plurality of power supply wiring layers 2 and ground wiring layers 3 exist in the wiring board 1, a plurality of power supply wiring layers 2 and ground wiring layers 3 are formed by forming first capacitors 7 at the end portions between the respective layers. The standing wave generated from can be suppressed.

(Embodiment 2)
Hereinafter, a capacitor built-in substrate according to Embodiment 2 of the present invention will be described with reference to the drawings.

  FIG. 6 is a cross-sectional plan view between the power supply wiring layer and the ground wiring layer of the capacitor built-in substrate according to Embodiment 2 of the present invention.

  In FIG. 6, a second capacitor 13 is provided on the inner side of the plurality of first capacitors 7 provided at the ends of two opposing sides in the insulating layer of the wiring board 1.

  As described above, in the present embodiment, by providing the second capacitor 13 on the inner side of the plurality of first capacitors 7 provided at the end portions in the insulating layer of the wiring substrate 1 on the two opposite sides, By arranging the second capacitor 13 for the electromagnetic wave generated by the loop current between the first capacitors 7 facing each other, the generation of the electromagnetic wave is suppressed by reducing the loop, and between the power supply wiring layer 2 and the ground wiring layer 3. Can suppress voltage fluctuations.

Further, the second capacitor 13 in the present embodiment, since by providing so that equal spacing between the first capacitor 7, the magnitude of the radiated noise is proportional to the size of the loop, a small number of The second capacitor 13 can efficiently reduce the loop, suppress radiation noise, and suppress voltage fluctuation between the power supply wiring layer 2 and the ground wiring layer 3.

  In the present embodiment, the first capacitor 7 and the second capacitor 13 are formed in the same step by using the same material for the dielectric of the first capacitor 7 and the dielectric of the second capacitor 13. Therefore, a wiring board having a stable power supply voltage can be easily mass-produced.

(Embodiment 3)
Hereinafter, the substrate with a built-in capacitor according to the third embodiment of the present invention will be described with reference to the drawings.

  FIG. 7 is a cross-sectional view of a semiconductor device mounted on a wiring board according to Embodiment 3 of the present invention.

  In FIG. 7, the semiconductor device 10 is mounted by being electrically connected to the wiring substrate 1 with solder 11 and reinforcing the adhesive strength with an underfill 12. The semiconductor device 10 is, for example, a semiconductor element, a semiconductor package, a semiconductor wafer level package, or the like. In addition to the first capacitor 7 at the end of the wiring board 1, a second capacitor 13 is built in the vicinity of the mounting portion of the semiconductor device 10 in the wiring board 1.

  As described above, in the present embodiment, the second capacitor 13 is provided in the vicinity of the mounting portion of the semiconductor device 10 in the insulating layer 4 of the wiring substrate 1 on which the semiconductor device 10 is mounted. The power supply to the semiconductor device 10 whose power supply voltage is likely to fluctuate due to the increase of the time change rate of the current is stabilized by the second capacitor 13 installed in the vicinity of the semiconductor, and at the same time, the loop is reduced and the generation of electromagnetic waves is suppressed. In addition, the power supply voltage of the wiring board 1 can be stabilized.

  Further, in the present embodiment, the second capacitor 13 has a larger electric capacity than the first capacitor 7 so that the second capacitor 13 can provide a stable power supply to the semiconductor device 10 that consumes a large amount of power. At the same time, the loop can be reduced to suppress the generation of electromagnetic waves, and the power supply voltage of the wiring board 1 can be stabilized. In this case, as the second capacitor 13, a large-capacity capacitor such as a solid electrolytic capacitor is suitable. The solid electrolytic capacitor is embedded in the wiring substrate 1 by a method such as that disclosed in Japanese Patent Application Laid-Open No. 2004-221534.

(Embodiment 4)
Hereinafter, the capacitor built-in substrate according to the fourth embodiment of the present invention will be described.

  In the embodiment of the present invention, since the wiring board with a built-in capacitor can suppress radiation noise, even if a plurality of circuit blocks are arranged close to each other in an electronic device, there is a possibility of affecting the operation of other circuit blocks. Can be small. In particular, when used as a wiring board for a baseband unit in an electronic device in which the baseband unit and the RF unit are mounted, radiation noise and power supply noise generated from the baseband unit are suppressed, and the operation of the RF unit is not affected. Circuit blocks can be mounted adjacent to each other, which is particularly effective for downsizing electronic devices. Examples of the electronic device include a mobile phone and a PDA.

(Embodiment 5)
Hereinafter, a capacitor built-in substrate according to Embodiment 5 of the present invention will be described with reference to the drawings.

  FIG. 8 is a cross-sectional view for explaining a method of manufacturing a capacitor built-in substrate according to Embodiment 5 of the present invention.

  First, in FIG. 8A, the dielectric layer 8 is formed by screen printing or the like on the end of the wiring substrate 17 provided with the circuit pattern of the ground wiring layer as a surface layer on the ground wiring layer side. Further, a conductor layer 9 is formed on the dielectric layer 8 by screen printing or the like to form a capacitor. Here, a capacitor formed at a location corresponding to the end of the wiring board 17 is a first capacitor, and when there is a capacitor formed inside the wiring board 17, it is a second capacitor.

  Next, in FIG. 8B, the wiring board 16 provided with the circuit pattern of the power wiring layer and the wiring board 17 on which the capacitor is formed and the uncured insulating layer 18 are aligned.

  Thereafter, in FIG. 8C, the aligned wiring boards 16 and 17 and the insulating layer 18 are thermocompression bonded.

  Next, in FIG. 8D, the capacitor built-in wiring board 1 is manufactured by dividing into pieces by laser or dicing so that the capacitor built in after thermocompression bonding becomes an end.

  As described above, in this embodiment, a dielectric material is provided at the end of the power wiring layer or the ground wiring layer with respect to at least two or more resin multilayer substrates having the circuit pattern of the power wiring layer or the ground wiring layer provided on the surface layer. A method of manufacturing a conventional wiring board by including a step of forming a layer and a conductor layer to provide a capacitor, and a step of laminating the surface of the power supply wiring layer or ground wiring layer so that the insulating layer is in contact with the surface Capacitors can be placed at the end of the wiring board without compromising the process of laminating the insulating layer and the wiring layer, and a wiring board that suppresses voltage fluctuations between the power wiring layer and the ground wiring layer can be easily achieved. Can be mass-produced.

(Embodiment 6)
Hereinafter, a capacitor built-in substrate according to a sixth embodiment of the present invention will be described with reference to the drawings.

  FIG. 9 is a cross-sectional view for explaining a method of manufacturing a capacitor built-in substrate according to Embodiment 6 of the present invention.

  First, in FIG. 9A, a first capacitor dielectric 8 is formed on a copper foil 14 by a doctor blade method or the like, and a dielectric sheet 15 is prepared by drilling with a laser or a puncher.

  Next, in FIG. 9B, the wiring board 16 having the circuit pattern of the power wiring layer on the surface layer, the wiring board 17 having the circuit pattern of the ground wiring layer on the surface layer, the hole-processed sheet 15, The cured insulating layer 18 is aligned.

  At this time, when the wiring board 1 provided with the second capacitor in advance is laminated, a wiring board in which the second capacitor is built inside the end portion of the board can be manufactured.

  At this time, the thickness of an arbitrary electrode may be controlled by plating, applying a conductive resin, or etching the wiring of the wiring board 17 which becomes the capacitor electrode. When the electrode becomes thicker, when the dielectric sheets are laminated, the dielectric on the electrode becomes more compressed and thinner, and the electric capacity of the capacitor increases. Conversely, when the electrode becomes thinner, the dielectric becomes thicker and the electric capacity decreases. By controlling the thickness of the electrode, it can be suppressed to an optimum electric capacity.

  Thereafter, in FIG. 9C, the aligned wiring boards 16 and 17 and the insulating layer 18 are thermocompression bonded.

  Next, in FIG. 9D, the capacitor built-in wiring board 1 is manufactured by dividing into pieces by laser or dicing so that the first capacitor built in after thermocompression bonding becomes the end of the wiring board 1.

  As described above, in the present embodiment, a step of drilling a sheet-like dielectric and a conductor, and at least two or more resin multilayer substrates provided with a circuit pattern of a power supply wiring layer or a ground wiring layer on the surface layer, By using the sheet-like material in which it is difficult to form a capacitor locally in the wiring board by including the step of laminating the hole-formed sheet-like dielectric, conductor, and insulating layer, Thus, a capacitor can be easily disposed as a capacitor at the end of the wiring board without impairing the method of manufacturing the wiring board in which the insulating layer and the wiring layer are laminated, and a wiring board with stabilized power supply voltage can be provided.

According to the present invention, it is possible to provide a capacitor-embedded wiring board that reduces radiation noise and suppresses power fluctuation, a manufacturing method thereof, and an electronic device , and a small electronic device in which different circuit blocks are close to each other can be manufactured. .

Sectional drawing of the board | substrate with a built-in capacitor in Embodiment 1 of this invention The top view which shows the layer between the power supply wiring layer of the board | substrate with a built-in capacitor in Embodiment 1 of this invention, and a ground wiring layer The top view which shows the layer between the power supply wiring layer of the board | substrate with a built-in capacitor in Embodiment 1 of this invention, and a ground wiring layer The top view which shows the layer between the power supply wiring layer of the board | substrate with a built-in capacitor in Embodiment 1 of this invention, and a ground wiring layer The top view which shows the layer between the power supply wiring layer of the board | substrate with a built-in capacitor in Embodiment 1 of this invention, and a ground wiring layer The top view which shows the layer between the power supply wiring layer and ground wiring layer of the board | substrate with a built-in capacitor in Embodiment 2 of this invention Sectional drawing which shows the board | substrate with a built-in capacitor in Embodiment 3 of this invention Sectional drawing which shows the board | substrate with a built-in capacitor in Embodiment 5 of this invention Sectional drawing which shows the board | substrate with a built-in capacitor in Embodiment 6 of this invention Sectional view of a conventional capacitor built-in substrate Sectional view of a conventional capacitor built-in substrate

1 Wiring Board 2 Power Supply Wiring Layer 3 Ground Wiring Layer 4 Insulating Layer 5 Wiring 6 Inner Via 7 First Capacitor 8 First Capacitor Dielectric 9 Electrode

Claims (11)

At least two or more resin multilayer wiring boards used in electronic devices, and a first capacitor using a resin containing ceramic particles having a dielectric constant higher than that of an insulating layer of the wiring board as a dielectric, a power wiring layer and a ground wiring layer The length of one side of the wiring board from the end face of the wiring board closest to the ends of the power supply wiring layer and the ground wiring layer facing each other through the insulating layer A wiring board with a built-in capacitor provided at least one in a range of 4/5 or less. The wiring board with a built-in capacitor according to claim 1, wherein the first capacitor is disposed at a corner portion of the wiring board. The wiring board with a built-in capacitor according to claim 1, wherein the first capacitor is arranged by dividing the length of the side in the wiring board into n equal parts (n is 2 or more). The capacitor built-in wiring board according to claim 1, wherein the first capacitor is provided so as to surround an end portion of the wiring board in an annular shape. When the electric capacity of the first capacitor is C [F], the drive frequency of the circuit block mounted on the wiring board is f [Hz], and the characteristic impedance between the power supply wiring layer and the ground wiring layer is Z ₀ [Ω], The capacitor built-in wiring board according to claim 1, wherein C is set so that Z ₀ > 1 / (2πfC). When the long side of the insulating layer between the power wiring layer and the ground wiring layer is a [m], the dielectric constant is ε, and the drive frequency of the circuit block mounted on the wiring board is f [Hz], f> 3 The wiring board with a built-in capacitor according to claim 1, wherein f and a are set so as to be × 10 ⁶ / (2 × a × √ε). A second electrode made of a solid electrolytic capacitor having a larger electric capacity than the first capacitor in an insulating layer inside the wiring substrate than the plurality of first capacitors provided at the ends of the two opposing wiring substrates. The wiring board with a built-in capacitor according to claim 1, wherein at least one capacitor is provided. The wiring board with a built-in capacitor according to claim 7, wherein the second capacitor is provided at an equal interval between the first capacitors. At least two or more resin multilayer wiring boards used in electronic devices, and a first capacitor using a resin containing ceramic particles having a dielectric constant higher than that of an insulating layer of the wiring board as a dielectric, a power wiring layer and a ground wiring layer 4 of the length of one side of the wiring board from the end face of the wiring board closest to the ends of the power supply wiring layer and the ground wiring layer facing each other through the insulating layer. Electronic equipment comprising: a wiring board with a built-in capacitor provided only in a range within / 5, and a semiconductor device provided with at least one or more on the wiring board with a built-in capacitor. 8. A wiring board for mounting a semiconductor device, wherein a second capacitor made of a solid electrolytic capacitor having a larger electric capacity than the first capacitor is provided in an insulating layer of the wiring board near the semiconductor device mounting portion. Wiring board with built-in capacitor as described. Provided only within a range of 4/5 of the length of one side of the wiring board from the end face of the wiring board closest to the ends of the power wiring layer and the ground wiring layer facing each other through the insulating layer ; a step of drilling the dielectric and conductor using a resin containing a high ceramic particles dielectric constant than the insulating layer of the wiring substrate, at least 2 with a circuit pattern of the power supply wiring layer or the ground wiring layer on the surface layer A manufacturing method of a wiring board with a built-in capacitor, comprising a step of laminating a resin multilayer substrate having at least two layers, the hole-formed sheet-like dielectric, a conductor, and an insulating layer.

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