JP4955792B2 - Electronic component operation function measuring apparatus and electronic component operation function measuring method - Google Patents

Description

  The present invention relates to an electronic component operation function measuring apparatus and electronic component operation for inspecting light emission and light reception which are operation functions of an optical element such as a light emitting diode (hereinafter referred to as an LED element) and a light receiving element, and inspecting an operation function of an LSI chip. It relates to a function measurement method.

  In recent years, the need for LEDs as energy-saving lighting parts, such as small size, long life, and no harmful substances, has been recognized from the viewpoint of global environmental protection, and the demand for low-priced LEDs has increased greatly. Yes.

  In a flow flow related to a manufacturing process of a conventional LED element, a plurality of LED chips assembled on a substrate are electrically connected to each other. In order to measure and inspect the individual electrical characteristics and optical characteristics of a plurality of LED chips, after dividing the plurality of LED chips into individual pieces, each LED chip is illuminated and the amount of light is measured by a conventional light emission measuring device. It is necessary to test by measuring electrical characteristics and optical characteristics, such as by measuring. This is shown in Patent Documents 1 and 2.

  In the chip component transport apparatus of Patent Document 1, a feeder that aligns and transports a plurality of chip components, a first table that includes a plurality of transport grooves that are vertically arranged and can be held one by one on the outer peripheral surface, And a second table that is disposed adjacent to and orthogonal to the first table and that can hold the chip component on the outer peripheral side surface. The first table and the second table are alternately intermittently rotated, and chip parts are transferred from the feeder to the first table and from the first table to the second table. An inspection is performed on each surface of the chip component.

  Even if the conveyance direction of the rectangular chip component is reversed in the front-rear direction, the image recognition device recognizes that the conveyance direction of the chip component is the reverse direction, and automatically reverses the probe +-to the chip component. The LED element can be illuminated to perform a light quantity inspection or the like.

  In the chip component supply device of Patent Document 2, a curved portion having a lane center angle of 90 degrees is provided in front of the lane pickup point for guiding the chip component supplied in parallel with the long side of the rectangle from the bulk case, A plurality of chip parts are arranged side by side, and the chip parts are supplied to the pickup point after the direction of the chip parts is changed by 90 degrees in the curved portion.

  Accordingly, when chip components such as LED element chips are adhered to each other, the adhesion of the chip components can be released using a curved portion having a lane center angle of 90 degrees.

JP 2007-153578 A JP-A-6-323599

  In the above-described conventional configurations disclosed in Patent Documents 1 and 2, electrical characteristics and optical characteristics are inspected by dividing into individual chip parts. For this reason, as a problem of chip part separation, an apparatus, a manpower, a conveyance for the separation, and an apparatus for aligning the chip parts at the time of testing are required. In addition, scratches, nicks, dirt, etc. are generated by chip parts. Furthermore, although there is a method of automatically separating an LED substrate on which a plurality of chip components are arranged into individual chip components, an expensive and complicated loader mechanism control and a camera recognition device are required.

  As a flow problem in the substrate state, when the electrical wiring pattern is separately formed on a chip component basis, the electrical processing necessary for generating the wiring pattern is complicated. Further, in the method of enlarging the distance between the chip parts (tape stretching), an enlarging device is required, the positional accuracy is poor, and the probe contact becomes difficult due to the coordinate deviation. Furthermore, in the insulation method by fitting an insulator, it is necessary to insert a magnifying device and a shielding plate.

  In any case, since all of the above-described test methods are measurements on a flat surface, the light emission at the time of DC measurement affects the measurement of the optical characteristics, so that a simultaneous test cannot be performed.

  The present invention solves the above-mentioned conventional problems, and in the state of a substrate on which a plurality of chip parts are mounted without dividing the chip parts into individual pieces, the device configuration is greatly simplified, and the electrical characteristics of each chip part are Another object is to provide an electronic component operation function measuring apparatus and an electronic component operation function measuring method capable of easily measuring and inspecting optical characteristics.

The electronic component operation function measuring apparatus according to the present invention has a plurality of electronic components that are individually cut in a state where a sheet is pasted on the back surface, and a plurality of mounted electronic component substrates arranged in a matrix. An electronic component operation function measuring apparatus for inspecting a functional operation function, wherein the electronic component side surface separating means is configured to bend the electronic component substrate along a curved surface or a corner and separate the side surfaces between adjacent electronic components. Measuring the electrical operation function of the one or more electronic components while driving one or more electronic components connected via the terminal connection means; It possesses the electrical operating function measuring means for, as electronic component side spacing means, either the cross section is circular or polygonal roll and polygonal section of the rotating shaft, intended to one or more placement Ri, the object is achieved.

  Further preferably, the terminal connection means in the electronic component operation function measuring device of the present invention is a probe pin that can be electrically connected to a terminal on a back surface or a side surface of the electronic component, and the electron to the probe pin. Drive voltage output means capable of supplying a drive voltage for driving the component.

  Further preferably, when there is a terminal on the back surface of the electronic component in the electronic component operation function measuring device of the present invention, the terminal connecting means penetrates the back sheet by two probe pins having a needle-like tip at the time of inspection. And connect to the terminals of the electronic component.

  Further preferably, when the electronic component in the electronic component operation function measuring device of the present invention is a light emitting element chip, the electrical operation function measuring means covers a predetermined number of light emitting element chips, and from the light emitting element chip. Based on the image pickup signal from the light receiving element that reflects the light emitted from the inside without leaking to the outside and guides it in a predetermined direction and photoelectrically converts the light from the light reflecting plate to obtain the image pickup signal A chip pass / fail judgment unit for judging the pass / fail of the light emitting element chip by comparing the light emission of the light emitting element chip and the threshold value thereof.

  Further preferably, when the electronic component in the electronic component operation function measuring device of the present invention is an LSI chip or a light receiving element chip, the electrical operation function measuring means is configured to connect the terminals of a predetermined number of LSI chips or light receiving element chips. A chip pass / fail judgment unit that judges the pass / fail of the electronic component by comparing the input / output value via the means and the threshold value of the input / output value.

  Further preferably, when the determination result of the electronic component determined by the chip quality determination unit in the electronic component operation function measuring device of the present invention is NG, the coordinate position of the electronic component is stored in the storage unit as NG information.

  Further preferably, the terminal connection means in the electronic component operation function measuring apparatus of the present invention is a first connector for inspecting the optical characteristics of the electronic component by connecting a probe pin to the terminal of the electronic component for each electronic component. In order to inspect the electrical characteristics of the electronic component by simultaneously connecting the probe pin to the terminals of the plurality of electronic components in one row different from the one-terminal connecting means and the plurality of electronic components inspecting the optical characteristics Second terminal connection means.

  Further preferably, the terminal connecting means in the electronic component operation function measuring device of the present invention comprises: a probe pin that is electrically connected to a back terminal of the electronic component; the probe pin is fixed to the upper surface; and the lower surface is a tapered surface A contact unit, a long moving shaft having a wedge-shaped protrusion formed on the upper surface, which is configured to be movable in a lateral direction immediately below the lower surface of the contact unit, and pushes up the tapered surface by the movement, and the probe pin Drive voltage output means capable of supplying a drive voltage for driving the electronic component.

  Further preferably, the terminal connecting means in the electronic component operation function measuring device of the present invention comprises: a probe pin that is electrically connected to a back terminal of the electronic component; the probe pin is fixed to the upper surface; and the lower surface is an air push. Arrangement of the electronic component comprising a contact unit whose end face is open so that it can be moved in the vertical direction depending on the presence or absence, and a longitudinal long tube at a position below the end face opening of the contact unit. A pressure air tube in which a plurality of air push holes for air push are formed at predetermined intervals, and a drive voltage output means capable of supplying a drive voltage for driving the electronic component to the probe pin by changing the angle at intervals. And have.

  Further preferably, the terminal connection means in the electronic component operation function measuring device of the present invention comprises: a probe pin that is electrically connected to a back surface terminal of the electronic component; the probe pin is fixed to the upper surface; The contact unit is configured to be movable in the vertical direction, and is configured to be rotatable by a long circular shaft in the left-right direction at the lower surface position of the contact unit. In other words, a predetermined number of protruding drum portions are formed for each electronic component at a predetermined interval, and the rotating drum pushes up the lower surface of the contact unit by rotation, and a driving voltage for driving the electronic component with respect to the probe pin Drive voltage output means that can supply the power.

  Further preferably, the terminal connection means in the electronic component operation function measuring device of the present invention is a position directly below the reflection plate via the insulation sheet 61B below the reflection plate, the insulation sheet, and the probe pin. Are integrated so that the tip of the reflecting plate contacts the surface of the light emitting element chip, and the probe pin contacts or separates from the side terminal of the light emitting element chip.

  Further preferably, the terminal connection means in the electronic component operation function measuring device of the present invention is such that the probe pin electrically connected to the back terminal of the electronic component, the rotation shaft, and the opposite sides of the circular cross section of the rotation shaft A crank-shaped upper and lower contact unit connected to each other, each having a probe pin fixed to each end face, and the upper and lower electronic terminals provided on opposite sides of each of the plurality of electronic component back terminals. A contact unit for connecting the back terminals of each of the plurality of electronic components and each of the probe pins simultaneously by rotation; drive voltage output means for supplying a drive voltage for driving the electronic components to the probe pins; have.

The electronic component operation function measuring method according to the present invention is a method of measuring the electronic component in a state of a plurality of mounted electronic component substrates in which a plurality of electronic components cut individually with a sheet attached to the back surface are arranged in a matrix. Electronic component operation function measuring method for inspecting the functional operation function, wherein the electronic component side surface separation means bends the electronic component substrate along a curved surface or a corner to separate the side surfaces between adjacent electronic components. The electronic component side surface separation step, the terminal connecting means for connecting to the predetermined terminal of the electronic component, and the electrical operation function measuring means connected to the one or more electronic components via the terminal connecting means It possesses the electrical operating function measuring step of measuring an electrical operating functions of the one or more electronic components in a state of being driven, as electronic component side separating means, a circular cross section or One of rectangular roll and polygonal section of the rotating shaft, which makes one or more arrangements, the object is achieved.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, the electronic component substrate is bent along a curved surface or a corner, and the electronic component side surface separating means for separating the side surfaces between adjacent electronic components is connected to the predetermined terminal of the electronic component. And an electric operation function measuring means for measuring an electric operation function of the one or more electronic components while driving the one or more electronic components connected via the terminal connection means. .

  As a result, the electrical operation function of the electronic component is measured in the state of the substrate on which a plurality of chip components are mounted without dividing the chip components into individual pieces. Electrical characteristics and optical characteristics can be measured and inspected more easily.

  As described above, according to the present invention, since the electrical operation function of the electronic component is measured while the substrate is mounted with a plurality of chip components without separating the chip components, the device configuration is greatly simplified. Thus, the electrical characteristics and optical characteristics of each chip component can be measured and inspected more easily.

It is a perspective view which shows typically the principal part structural example of the electronic component side surface separation means of the electronic component operation function measuring apparatus in Embodiment 1 of this invention. It is a short side direction sectional view showing typically an example of important section composition of terminal connection means and electrical operation function measuring means of an electronic component operation function measuring device in Embodiment 1 of the present invention. It is a long side direction sectional view showing typically the example of important section composition of the terminal connection means of the electronic parts operation function measuring device in Embodiment 1 of the present invention, and the electric operation function measuring means. FIG. 2 and FIG. 3 are plan views of the reflector plate and the LED chip as an electronic component. It is a perspective view which shows typically the example of a principal part structure of the electronic component side surface separation means and terminal connection means of the electronic component operation function measuring apparatus in Embodiment 2 of this invention. It is a block diagram which shows typically the principal part structural example of the electronic component side surface separation means of the electronic component operation function measuring apparatus in Embodiment 3 of this invention, and an electrical operation function measurement means. It is a block diagram which shows typically the principal part structural example of the terminal connection means of the electronic component operation function measuring apparatus in Embodiment 3 of this invention. (A)-(c) is a wedge type block diagram which shows typically the 1st example of the terminal connection means of the electronic component operation function measuring apparatus in Embodiment 4 of this invention. (A)-(c) is a block diagram of the air push system which shows typically the 2nd example of the terminal connection means of the electronic component operation function measuring apparatus in Embodiment 5 of this invention. (A)-(c) is a block diagram of the rotating drum system which shows typically the 3rd example of the terminal connection means of the electronic component operation function measuring apparatus in Embodiment 6 of this invention. It is a block diagram of the reflector and probe integrated system which shows typically the 4th example of the terminal connection means of the electronic component operation function measuring apparatus in Embodiment 7 of this invention. It is a block diagram of the shaft system which shows typically the 5th example of the terminal connection means of the electronic component operation function measuring apparatus in Embodiment 8 of this invention. It is a longitudinal cross-sectional view of the terminal connection means of FIG. It is a perspective view which shows typically the modification of the electronic component side surface separation means of the electronic component operation function measuring apparatus of FIG. 5, and a terminal connection means.

  Embodiments 1 to 8 of the electronic component operation function measuring device and the electronic component operation function measuring method of the present invention will be described below in detail with reference to the drawings. In addition, each thickness, length, etc. of the structural member in each figure are not limited to the structure to illustrate from a viewpoint on drawing preparation.

(Embodiment 1)
FIG. 1 is a perspective view schematically showing a configuration example of a main part of an electronic component side surface separation unit of the electronic component operation function measuring apparatus according to Embodiment 1 of the present invention. 2 and FIG. 3 are cross-sectional views schematically showing an exemplary configuration of main parts of the terminal connection means and the electrical operation function measurement means of the electronic component operation function measurement apparatus according to Embodiment 1 of the present invention. FIG. 4 is a plan view of the reflector and the electronic component shown in FIGS.

  1 to 4, the electronic component operation function measuring apparatus 1 according to the first embodiment has a plurality of electronic components 2 that are individually cut in a state in which an adhesive sheet (UV sheet) is pasted on the back surface. The electronic component side surface separating means 5 for bending the plurality of mounted electronic component substrates 3 along the curved surface and opening and separating the side surfaces between the adjacent electronic components 2 before and after the bending direction, and the bending direction. One or a plurality of electronic components 2 are driven via the terminal connection means 6 and the terminal connection means 6 for sequentially connecting each of the electronic components 2 to predetermined terminals on the side surface or the back surface of the electronic component 2 whose front and rear side surfaces are separated from each other. And an electrical operation function measuring means 7 for inspecting the electrical operation function (optical characteristics such as light emission amount and electrical characteristics) of one or a plurality of electronic components 2 in a state.

  Here, the electronic component operation function measuring device 1 of the first embodiment is applied to a light emission measuring device, and the optical characteristics (emission amount, light emission directivity, etc.) and electrical characteristics of the LED chip 21 are used as the operation function of the electronic component 2. A case where (DC inspection) or the like is measured will be described.

  In addition to the LSI chip, the electronic component 2 includes an LED chip as a semiconductor light emitting chip and an optical element such as an imaging chip and a light receiving chip as a semiconductor light receiving chip. The LED chip 21 will be described here.

  The electronic component substrate 3 is mounted with a plurality of LED chips 21 that are individually cut in the vertical direction and the horizontal direction in a state where an adhesive sheet is pasted on the back surface, arranged in a matrix in the column direction and the row direction. . The pressure-sensitive adhesive sheet is somewhat stretchable and can be held in a state where a plurality of LED chips 21 are aligned. The + terminal and the − terminal of the LED chip 21 may be on the side surface or the back surface. Here, the case where the + terminal and the − terminal of the LED chip 21 are on the back surface will be described. A lens 22 is provided at the center of the surface of the LED chip 21, and LED light emission is emitted to the outside through the lens 22.

  Here, the electronic component side surface separation means 5 is constituted by a cylindrical roll 51 having a circular cross section. The size of the roll 51 is such that when the pressure-sensitive adhesive sheet of the electronic component substrate 3 is wound along the curved surface of the roll 51 as the diameter decreases, the opening of the opening 4 becomes large and the bending direction (row direction or longitudinal direction) ) Both side surfaces between the front and rear adjacent LED chips 21 can be further separated, but the plurality of LED chips 21 assembled on the substrate are electrically disconnected from each other. As long as the individual LED chips 21 can emit light. In short, by bending the electronic component substrate 3 along the curved surface of the roll 51, it is possible to cut off the electrical continuity between the LED chips 21 and control the light emission of only the LED chip 21 to be measured. When the electronic component substrate 3 is placed along the curved surface of the roll 51, a separation distance is generated between adjacent chips due to the difference between the inner diameter and the outer diameter due to the thickness of the LED chip 21.

  The terminal connecting means 6 pushes up the pedestal with the two needle-like probe pins insulated from each other with respect to the + terminal and the − terminal on the back surface of the LED chip 21 so that the two needle-like probe pins are The adhesive sheet is penetrated and connected. The pedestal with the two needle pins is arranged for each LED chip 21 directly below the plurality of LED chips 21 in one row (lateral direction) in the predetermined direction of the electronic component substrate 3 wound around the roll 51. Yes. Therefore, in order to sequentially emit a plurality of LED chips 21 in a predetermined direction (row), the pedestal with two needle pins is sequentially pushed up, and the two probe pins are connected to the + terminal of the LED chip 21. -It is possible to cause the LED chip 21 to emit light sequentially by supplying a predetermined power supply voltage from two probe pins by being electrically connected to the terminal. At this time, the LED chip 21 is driven to emit light by supplying the light emission voltage to the two probe pins from the light emission voltage output source as the drive voltage output means.

  The electrical operation function measuring means 7 covers the periphery of a predetermined number (here, 5) of LED chips 21 and reflects the light emitted from the LED chips 21 on the inner surface without leaking to the outside and guides it in a predetermined direction. A light receiving element 72 (photodiode) that photoelectrically converts light from the reflecting plate 71 to obtain an imaging signal, and a light emitting amount and a threshold value of the LED chip 21 based on the imaging signal from the light receiving element 72 to compare the LED chip 21, a chip pass / fail judgment unit 73 for judging pass / fail, and light emission of one or a plurality of LED chips 21 in a state where one or a plurality of LED chips 21 are caused to emit light via two probe pins of the terminal connection means 6. Inspect the amount.

  The light emission measuring method of the electronic component operation function measuring apparatus 1 having the above configuration will be described in detail.

  First, an electronic component substrate 3 on which a plurality of LED chips 21 that are individually cut in a vertical direction and a horizontal direction and arranged in a matrix in the column direction and the row direction with an adhesive sheet pasted on the back surface is mounted. The tip is fixed, and the pressure sensitive adhesive sheet is wound around a cylindrical roll 51 as the electronic component side surface separation means 5.

  Next, when the roll 51 is rotated and one row of the plurality of LED chips 21 of the electronic component substrate 3 comes to the top of the roll, the rotation of the roll 51 is stopped and the reflecting plate 71 is lowered together with the light receiving element 72 to be predetermined. A plurality of LED chips 21 (here, 5) are covered with a reflecting plate 71. In this case, five LED chips 21 are provided, and a plurality of subsequent reflectors 71 are sequentially prepared.

  Subsequently, the pedestal with the two needle-like probe pins in the cylindrical roll 51 is sequentially pushed up together with the LED chip 21 for each LED chip 21, and the two needle-like probe pins are attached to each LED chip 21. The light is emitted sequentially by sequentially connecting the + terminal and the − terminal on the back surface. When sequentially emitting light, the chip quality determination unit 73 is informed of which LED chip 21 is emitting light by the counter.

  At this time, based on the imaging signal from the light receiving element 72, the chip quality determination unit 73 compares the light emission amount of the LED chip 21 and the threshold value to determine the quality of the LED chip 21. Furthermore, when the result determined by the chip pass / fail determination unit 73 is NG (defective), the coordinate position (address information) is stored in the storage unit (RAM). This coordinate position (address information) specifies the position of the LED chip 21 by coordinates (X, Y), where X is the row direction and Y is the column direction in the matrix arrangement of the plurality of LED chips 21. In this case, when the column direction Y is “1” and the position numbers in the row direction X are 1 to 5, 11 to 15, 21 to 25,..., And the coordinates (21, 1) are NG This is stored in a storage unit (RAM).

  Thereafter, the plurality of reflecting plates 71 are once lifted together with the light receiving elements 22, shifted by five LED chips 21, and then the plurality of reflecting plates 71 are lowered together with the light receiving elements 22 to reduce a predetermined number of LED chips 21 (here, 5) are covered with a reflector 71.

  Subsequently, the pedestal with the two probe pins in the cylindrical roll 51 is sequentially pushed up together with the LED chip 21 for each LED chip 21, and the two probe pins are moved to the + terminal and the − terminal on the back surface of each LED chip 21. Are sequentially connected to emit light. When sequentially emitting light, the chip quality determination unit 73 is informed of which LED chip 21 is emitting light by the counter.

  At this time, based on the imaging signal from the light receiving element 72, the chip quality determination unit 73 compares the light emission amount of the LED chip 21 and the threshold value to determine the quality of the LED chip 21. Furthermore, when the result determined by the chip pass / fail determination unit 73 is NG (defective), the coordinate position (address information) is stored in the storage unit (RAM). This coordinate position (address information) specifies the position of the LED chip 21 by coordinates (X, Y), where X is the row direction and Y is the column direction in the matrix arrangement of the plurality of LED chips 21. In this case, it is assumed that the column direction Y is “1”, and the position numbers in the row direction X are 6 to 10, 16 to 20, 26 to 30... No NG information is stored.

  Thereby, the measurement inspection of the light emission amount of the plurality of LED chips 21 in one row is completed. Next, the roll 51 is rotated by one LED chip 21, and when one row of the plurality of LED chips 21 on the electronic component substrate 3 comes to the top of the roll, the rotation of the roll 51 is stopped and a plurality of reflections are performed. The plate 71 is lowered together with the light receiving element 22, the periphery of a predetermined number of LED chips 21 (here, five) is covered with the reflecting plate 71, and the measurement and inspection of the light emission amounts of the plurality of LED chips 21 in the next row is started. By repeating this, the measurement inspection of the light emission amounts of the plurality of LED chips 21 in a predetermined row in a predetermined column can be executed.

  As described above, in the electronic component operation function measuring method according to the first embodiment, the electronic component side surface separating means 5 bends the electronic component substrate 3 along the curved surface or the corner, and the side surfaces between the LED chips 21 adjacent to each other in the front and rear directions. The electronic component side surface separating step for separating the terminal, the terminal connecting unit 6 for connecting to the predetermined terminal of the LED chip 21, and the electrical operation function measuring unit 7 are connected via the terminal connecting unit 6. Alternatively, an electrical operation function measuring step of measuring an electrical operation function of the one or more LED chips 21 in a state where a plurality of electronic components are driven.

  As described above, according to the first embodiment, the plurality of LED chips 21 divided in a state where the pressure-sensitive adhesive sheet is pasted are adhered to the electronic component substrate 3 while the plurality of mounted electronic component substrates are arranged in a matrix. Since the optical measurement is performed in a state where damage (breaking, chipping, and dirt) of the LED chip 21 when the sheet is separated into individual pieces is also suppressed, the alignment of the individual LED chips 21 themselves in the transport direction and the alignment at the time of component transport The mechanism is unnecessary (no complicated and expensive parts feeder or sort mechanism is required), the device size can be made compact, and the positioning of each LED chip 21 during optical measurement can also be made unnecessary. Optical measurement of each LED chip 21 and simultaneous optical measurement of a plurality of LED chips 21 can be facilitated. Also it can be held accurately in the storage unit as the data.

  In the first embodiment, in the electronic component operation function measuring apparatus 1, the case where the electronic component side surface separation means 5 is the cylindrical roll 51 having a circular cross section has been described. In the measuring apparatus 1, the electronic component side surface separation means 5 may be a rectangular or pentagonal roll whose cross section is a quadrangle or a pentagon, and a polygon whose side is matched to the width of the LED chip 21.

(Embodiment 2)
In the first embodiment, the electronic component side surface separation means 5 has been described with respect to the cylindrical roll method in which the cross section of the electronic component side surface separation means 5 is circular or polygonal. However, in the second embodiment, the electronic component side surface separation means 5 uses a rotation shaft having a square cross section. A saddle method for hanging the electronic component board 3 will be described.

  FIG. 5 is a perspective view schematically showing a configuration example of main parts of the electronic component side surface separation means and the terminal connection means of the electronic component operation function measuring apparatus according to Embodiment 2 of the present invention. In this case, the electrical operating function measuring means 7 of FIGS. 2 to 4 is used, the terminal connecting means 6 of FIGS. 2 and 3 is not used, and only the terminal on the side surface of the LED chip 21 is used as the terminal connecting means 6. A probe pin that can be electrically connected is used.

  2 to 5, the electronic component operation function measuring apparatus 1A according to the second embodiment has a plurality of electronic components 2 that are individually cut in a state in which a sheet is pasted on the back side and arranged in a matrix. Electronic component side surface separation means 5A for bending the electronic component substrate 3 along the corners of the quadrangular cross section and opening and separating the side surfaces between the adjacent electronic components 2 before and after the bending direction, and the folding direction. 6A of terminal connection means connected to the predetermined terminal of the side surface of the electronic component 2 which the front and back both side surfaces were spaced apart, and one or a plurality of electronic components with the one or a plurality of electronic components 2 being driven via the terminal connection means 6A And an electric operation function measuring means 7 for measuring two electric operation functions.

  Here, the electronic component operation function measuring device 1A of the second embodiment is applied to the light emission measurement device, and the optical characteristics (light emission amount, light emission directivity, etc.) and electrical characteristics of the LED chip 21 as the operation function of the electronic component 2 are described. A case where (DC inspection) or the like is measured will be described.

  Here, the electronic component side surface separating means 5 </ b> A is constituted by a rotating shaft 52 having a quadrangular cross section. The plurality of LED chips 21 assembled on the substrate are electrically connected to each other, so that the individual LED chips 21 can emit light by being electrically disconnected from each other. By bending 90 degrees along the corner of the rotating shaft 52, it is possible to open a large gap between adjacent LED chips 21 to cut off electrical continuity and control only the LED chip 21 to be measured. Become. When the electronic component substrate 3 is placed along the corner of the rotating shaft 52, a large separation distance is generated between adjacent chips due to the difference between the inner diameter and the outer diameter due to the thickness of the LED chip 21.

  The terminal connecting means 6A is configured to press and electrically connect two needle-like probe pins 61 that are insulated from each other to the + terminal and the − terminal on the side surface of the LED chip 21. The two needle pins 61 are pressed against the terminals on the side surfaces of a predetermined number of LED chips 21 in one predetermined row (lateral direction) of the electronic component substrate 3 wound around the rotating shaft 52 for each LED chip 21. Are arranged as follows. Therefore, when the plurality of LED chips 21 in a predetermined direction (horizontal direction) are caused to emit light sequentially, the two needle pins 61 are sequentially pressed against the terminals on the side surface of the LED chip 21, and two LED chips 21 are applied to the LED chip 21. A predetermined power supply voltage can be supplied from the probe pins 61 to sequentially emit light. At this time, the LED chip 21 can be driven to emit light by supplying the light emission voltage to the two probe pins 61 from the light emission voltage output source as the drive voltage output means.

  The light emission measuring method of the electronic component operation function measuring apparatus 1A having the above configuration will be described in detail.

  First, a plurality of mounted electronic component substrates 3 in which a plurality of LED chips 21 individually cut in the vertical direction and the horizontal direction are arranged in a matrix in the column direction and the row direction with the adhesive sheet pasted on the back surface, The tip is fixed, and the adhesive sheet 31 is wound around the rotary shaft 52 having a quadrangular cross section as the electronic component side surface separating means 5A.

  Next, the rotation shaft 52 having a quadrangular cross section is rotated, and when one row of the plurality of LED chips 21 of the electronic component board 3 comes to the upper surface position of the rotation shaft 52, the rotation of the rotation shaft 52 is stopped and reflected. The plate 71 is lowered together with the light receiving element 72 and the periphery of a predetermined number of LED chips 21 (here, 5) is covered with the reflection plate 71. In this case, five LED chips 21 are provided, and a plurality of subsequent reflectors 71 are sequentially prepared.

  Subsequently, it is wound around the corner of the rotary shaft 52 having a quadrangular cross section, the adjacent front and rear LED chips 21 are opened at a right angle along the corner, and the side surfaces are greatly separated from each other. The two needle-like probe pins 61 are pressed against the + terminal and the − terminal on the side surface of the LED chip 21 whose upper surface is covered with the reflecting plate 71, and two needle-like probes A predetermined voltage is supplied from the pin 61 to the + terminal and the − terminal on the side surface of the LED chip 21 to emit light. When sequentially emitting light, the chip quality determination unit 73 is informed of which LED chip 21 is emitting light by the counter.

  At this time, based on the imaging signal from the light receiving element 72, the chip quality determination unit 73 compares the light emission amount of the LED chip 21 and the threshold value to determine the quality of the LED chip 21. Furthermore, when the result determined by the chip pass / fail determination unit 73 is NG (defective), the coordinate position (address information) is stored in the storage unit (RAM). This coordinate position (address information) specifies the position of the LED chip 21 by coordinates (X, Y), where X is the row direction and Y is the column direction in the matrix arrangement of the plurality of LED chips 21. In this case, when the column direction Y is “1” and the position numbers in the row direction X are 1 to 5, 11 to 15, 21 to 25,..., And the coordinates (21, 1) are NG This is stored in a storage unit (RAM). This is the same as in the case of the first embodiment.

  Thereafter, the plurality of reflecting plates 71 are once lifted together with the light receiving elements 22, shifted by five LED chips 21, and then the plurality of reflecting plates 71 are lowered together with the light receiving elements 22 to reduce a predetermined number of LED chips 21 (here, 5) are covered with a reflector 71.

  Subsequently, two needle-like probe pins 61 are pressed against the + terminal and the − terminal on the side surface of the LED chip 21 which is located on the upper surface of the rotating shaft 52 and whose upper surface is covered with the reflection plate 71. A predetermined voltage is supplied from the two needle-like probe pins 61 to the + terminal and the − terminal on the side surface of the LED chip 21 to cause the LED chip 21 to emit light. When sequentially emitting light, the chip quality determination unit 73 is informed of which LED chip 21 is emitting light by the counter.

  At this time, based on the imaging signal from the light receiving element 72, the chip quality determination unit 73 compares the light emission amount of the LED chip 21 and the threshold value to determine the quality of the LED chip 21. Furthermore, when the result determined by the chip pass / fail determination unit 73 is NG (defective), the coordinate position (address information) is stored in the storage unit (RAM). This coordinate position (address information) specifies the position of the LED chip 21 by coordinates (X, Y), where X is the row direction and Y is the column direction in the matrix arrangement of the plurality of LED chips 21. In this case, it is assumed that the column direction Y is “1”, and the position numbers in the row direction X are 6 to 10, 16 to 20, 26 to 30... No NG information is stored. This is the same as in the case of the first embodiment.

  Thereby, the measurement inspection of the light emission amount of the plurality of LED chips 21 in one row is completed. Next, the rotation shaft 52 having a square cross section is rotated by an angle of 90 degrees by one LED chip 21, and one row of the next plurality of LED chips 21 on the electronic component substrate 3 comes to the upper surface of the rotation shaft 52. Sometimes, the rotation of the rotating shaft 52 is stopped, the plurality of reflecting plates 71 are lowered together with the light receiving elements 22, and the periphery of a predetermined number of LED chips 21 (here, five) is covered with the reflecting plate 71. The measurement inspection of the light emission amount of the LED chip 21 is started. By repeating this, the measurement inspection of the light emission amounts of the plurality of LED chips 21 in a predetermined row in a predetermined column can be executed.

  In the case of the second embodiment, compared to the case of the first embodiment, the adjacent front and rear LED chips 21 are opened at a right angle along the corners and the side surfaces are greatly separated from each other. The two needle-like probe pins 61 are easily pressed against the + terminal and the − terminal on the side surface of the LED chip 21 covered with 71.

  As described above, according to the second embodiment, when the electronic component substrate 3 is placed along the rotation shaft 52 (rotary shaft) having a quadrangular cross section, due to the difference between the inner diameter and the outer diameter due to the thickness of the electronic component substrate 3, Since the LED chips 21 are opened at a right angle along the corners and the side surfaces are separated from each other, the chips that are in a conductive state can be more reliably insulated from each other. The two needle-like probe pins 61 can be easily pressed against the terminal on the side surface, and the test process can be carried out more easily and reliably in this substrate state.

  In the second embodiment, the electronic component side surface separating means 5A employs a scissors method in which the electronic component substrate 3 is suspended using the rotation shaft 52 having a quadrangular cross section, so that probe points are located at several locations on one rotation shaft. Although the case where it can be set has been described, the present invention is not limited to this, and as shown in FIG. You may comprise so that the electronic component board | substrate 3 may be wound around the upper rotating shaft 52. FIG. In this case, as the terminal connecting means 6A, two needle-like probe pins 61 that are insulated from each other are pressed against and electrically connected to the + terminal and the − terminal on the side surface of the LED chip 21. It will be done in two places. That is, the connecting operation of the probe pin 61 to the LED chip 21 is performed for each rotating shaft 52. Similarly, the electronic component side surface separation means 5 is configured by arranging two rolls 51 having a circular section in the upper and lower directions and winding the electronic component substrate 3 from the lower roll 51 to the upper roll 51. May be. In this case, as the terminal connection means 6, two needle-like probe pins 61 that are insulated from each other are pressed against and electrically connected to the + terminal and the − terminal on the bottom surface of the LED chip 21. This is performed for each roll 51. The number of these rotating shafts 52 and rolls 51 may be provided at three locations or at four locations. In short, the electronic component side surface separation means may be configured by arranging one or a plurality of rolls having a circular or polygonal cross section and a rotating shaft having a polygonal cross section, and providing a terminal connecting means for each arrangement.

  As a result, the electronic component side surface separating means 5A employs a saddle method in which the electronic component substrate 3 is suspended using the rotation shaft 52 having a quadrangular cross section, so that several probe points to be inspected can be set on one rotation shaft. The probe points to be inspected can be further increased by increasing the rotation shaft 52.

  In the second embodiment, the plurality of LED chips 21 assembled on the substrate are electrically connected to each other, so that the individual LED chips 21 can emit light by being electrically disconnected from each other. In this way, by bending the electronic component board 3 along the corner of the rotating shaft 52 at an angle of 90 degrees (cross-sectional quadrangular shape), a large opening is formed between adjacent LED chips 21 to cut off the electrical continuity, and the measurement object However, the opening angle is not limited to 90 degrees, and when the rotation shaft 52 is increased to, for example, three positions, the opening angle is more than 90 degrees. However, there is no problem as long as the probe contact is possible.

(Embodiment 3)
In the first embodiment, the electronic component side surface separation means 5 has been described with respect to the cylindrical roll method in which the cross section of the electronic component side surface separating means 5 is circular or polygonal. However, in the third embodiment, a plurality of LEDs in a predetermined row in the predetermined column of the first embodiment. In addition to the measurement inspection of the light emission amount of the chip 21, an electrical inspection such as a DC inspection is performed on the plurality of LED chips 21 in one row before and after the measurement inspection of the light emission amount of the plurality of LED chips 21 in one row. explain.

  FIG. 6 is a block diagram schematically showing an example of the configuration of the main parts of the electronic component side surface separation means and the electrical operation function measurement means of the electronic component operation function measurement apparatus according to Embodiment 3 of the present invention. FIG. 7 is a configuration diagram schematically showing a configuration example of a main part of the terminal connecting means of the electronic component operation function measuring apparatus according to Embodiment 3 of the present invention.

  6 and 7, the electronic component operation function measuring apparatus 1B according to the first embodiment has a plurality of LED chips 21 that are individually divided in a state where a sheet is pasted on the back surface and are arranged in a matrix. The electronic component substrate 3 is bent along a curved surface, and the side surfaces between the LED chips 21 adjacent to each other in the front and rear directions in the bending direction are opened as openings 4 to be separated from each other. An optical test terminal connection for sequentially connecting to a predetermined terminal on the back surface of each spaced LED chip 21 and a plurality of LED chips 21 in one row in a column different from the plurality of LED chips 21 in one row performing the optical test In order to perform an electrical test, an electrical test that is simultaneously connected to predetermined terminals on the back surface of a plurality of LED chips 21 in a row in which both side surfaces before and after the bending direction are separated from each other are performed. Terminal connection means 6B for performing terminal connection, and an electrical operation function (optical test and electrical test) of one or a plurality of electronic components 2 in a state where one or a plurality of LED chips 21 are driven via the terminal connection means 6B And an electrical operation function measuring means 7 for inspecting.

  The terminal connecting means 6B pushes up the pedestal with the two needle-like probe pins insulated from each other with respect to the + terminal and the − terminal on the back surface of the LED chip 21 so that the two needle-like probe pins are The adhesive sheet is penetrated and connected. The pedestal with the two needle pins is arranged immediately below the plurality of LED chips 21 in one row (lateral direction) of the electronic component substrate 3 wound around the roll 51 for each LED chip 21 during the optical test. Has been. Therefore, in the case of an optical test in which a plurality of LED chips 21 in one row (horizontal direction) sequentially emit light, the pedestal with two needle pins is sequentially pushed up, and the two probe pins are connected to the + terminal of the LED chip 21. The LED chip 21 can be made to emit light sequentially by supplying a predetermined power supply voltage from two probe pins. At this time, the LED chip 21 is driven to emit light by supplying the light emission voltage to the two probe pins from the light emission voltage output source as the drive voltage output means.

  The pedestal with the two needle pins is disposed immediately below the plurality of LED chips 21 in one row at the time of an electrical test such as a DC test for testing the output current or the output voltage with respect to a predetermined input voltage. The two pedestals with two needle pins are pushed up at the same time, and the two probe pins are all electrically connected to the positive terminal and the negative terminal of the LED chip 21 so that two probes are connected to the LED chip 21. A predetermined power supply voltage is supplied from a pin, a predetermined input voltage is supplied to all of the plurality of LED chips 21 in one row, and each output voltage for each LED chip 21 can be obtained simultaneously. Based on each output voltage for each LED chip 21, it can be compared with a predetermined threshold value to determine whether the electrical characteristics of the LED chip 21 are good or bad.

  As described above, according to the third embodiment, whether the optical characteristics of the LED chip 21 are good or bad and whether the electrical characteristics are good or bad are measured by the cylindrical roll 53 having a circular cross section as the electronic component side surface separation means 5. By simply changing the position, the inspection can be performed at the same time, which greatly reduces the inspection time. Here, the optical property pass / fail determination and the electrical property pass / fail determination are performed at positions different by an angle of 180 degrees. However, the present invention is not limited to this, and either the optical property pass / fail determination or the electrical property pass / fail determination is made. You may perform the other at the position of the 90 degree front-back angle with respect to one position.

  Accordingly, the terminal connection means 6B is connected to the first terminal connection means 6 for inspecting the optical characteristics of the LED chip 21 by connecting the probe pin to the terminal of the LED chip 21 for each LED chip 21, and inspecting the optical characteristics. And a second terminal connection means 62 for inspecting the electrical characteristics of the LED chip 21 by simultaneously connecting probe pins to the terminals of the entire LED chip 21 in a row different from the plurality of LED chips 21. ing.

(Embodiment 4)
In the first embodiment, at the time of the optical test, the two probe pins are sequentially pushed up together with the pedestal for each LED chip 21 to electrically connect the two probe pins to the + terminal and the − terminal of the LED chip 21. Although the LED chips 21 are configured to emit light sequentially, in the fourth embodiment, a plurality of LED chips 21 in one row are sequentially emitted one by one in a plurality of (here, 5) blocks. A specific example will be described.

  FIG. 8A to FIG. 8C are wedge-type configuration diagrams schematically showing a first example of the terminal connection means of the electronic component operation function measuring apparatus according to Embodiment 4 of the present invention.

  As shown in FIGS. 8A to 8C, the wedge-type terminal connection means 6B of the first example can be electrically connected to the + terminal and the − terminal on the back surface of the LED chip 21. The contact pins 63 which are two needle-like probe pins insulated from each other and the two contact pins 63 are fixed to the upper surface at a predetermined interval (the same interval as the interval between the + terminal and the − terminal), and the lower surface is vertically ( The contact unit 64 has a tapered surface that is inclined so that it can move, and is configured to be movable in the left-right direction (lateral direction) on the long shaft at a position below the tapered surface of the contact unit 64. And a moving shaft 65 provided with wedge-shaped projections 65a at predetermined intervals in the longitudinal direction on the upper surface.

  The contact unit 64 having two contact pins 63 on the upper surface is configured to be movable up and down for each rear surface of the LED chip 21. In other words, the contact pin 63 and the contact unit 64 are arranged immediately below the plurality of LED chips 21 in one row (lateral direction) of the electronic component substrate 3 wound around the roll 51 for each LED chip 21 during the optical test. ing.

  The operation of the terminal connecting means 6B having the above configuration will be described.

  First, as shown in FIG. 8A to FIG. 8B, during the optical test, the reflecting plate 71 is lowered together with the light receiving element 72, and the periphery of the predetermined number of LED chips 21 (here, five) is reflected on the reflecting plate 71. Cover with. In this case, five LED chips 21 are provided, and a plurality of subsequent reflectors 71 are sequentially prepared.

  In this state, the moving shaft 65 moves to the right side, and the tapered surface of the wedge-shaped protrusion 65a on the upper surface of the moving shaft 65 pushes up the tapered surface of the lower surface of the contact unit 64 with the two contact pins 63 attached. Here, two needle-like contact pins 63 penetrate the adhesive sheet 31 (UV sheet) with respect to the + terminal and the − terminal on the back surface of each of the first, eleventh and twenty-first LED chips 21. And make an electrical connection. As described above, the two contact pins 63 are electrically connected to the + terminal and the − terminal of the LED chip 21, and the LED chip 21 is supplied with a predetermined power supply voltage from the two contact pins 63 to emit light. An optical test (inspection of whether the amount of light is equal to or greater than a threshold value) is performed on each of the first, eleventh and twenty-first LED chips 21 that have emitted light. In short, when the wedge-shaped protrusion 65a is moved by one chip, the contact unit 64 with the two contact pins 63 is lifted, and the two contact pins 63 penetrate through the adhesive sheet 31 (UV sheet), so that the LED chip 21 Connect to the + and-terminals on the back.

  Subsequently, as shown in FIG. 8B to FIG. 8C, the moving shaft 65 is further moved to the right side, and the tapered surface of the wedge-shaped protrusion 65a on the upper surface of the moving shaft 65 has two contacts. The tapered surface of the lower surface of the contact unit 64 with the pin 63 is pushed up, and here, two pieces of the second, seventh and twelfth LED chips 21 have a positive terminal and a negative terminal. The needle-like contact pin 63 penetrates the adhesive sheet 31 (UV sheet) and is electrically connected. In this way, the two contact pins 63 are electrically connected to the + terminal and the − terminal of the LED chip 21, and a predetermined power supply voltage is supplied to the LED chip 21 from the two contact pins 63 to emit light from the LED chip 21. Let An optical test (inspection of whether the amount of light is equal to or greater than a threshold value) is performed on each of the second, twelfth, and twenty-second light-emitting LED chips 21. In short, when the wedge-shaped protrusion 65a is further moved by one chip, the previous contact unit 64 is lowered and returned to the original position, and the next contact unit 64 is lifted together with the two contact pins 63, and the adhesive sheet 31 (UV sheet). ) Pass through the two contact pins 63 and connect to the + terminal and the − terminal on the back surface of the next LED chip 21.

  This operation is repeated, and an optical test (inspection of whether the amount of light is equal to or greater than the threshold) of each of the five light-emitting LED chips 21 of 1st to 5th, 11th to 15th and 21st to 25th. Complete. As in the case of the first embodiment, the coordinate information of the NG LED chip 21 is stored in the storage unit (RAM).

  Next, the plurality of reflecting plates 71 are once lifted together with the light receiving elements 22, shifted to the right side over five LED chips 21 for which the optical test has been completed, and then the plurality of reflecting plates 71 together with the light receiving elements 22 are lowered. Then, the periphery of the next predetermined number of LED chips 21 (here, five) is covered with a reflecting plate 71.

  The above-described inspection operation is repeated, and the sixth to tenth, sixteenth to twentieth and twenty-sixth to thirtieth optical tests of each of the five LED chips 21 that emit light sequentially (inspection of whether the light quantity is equal to or greater than a threshold ) Is completed. As in the case of the first embodiment, the coordinate information of the NG LED chip 21 is stored in the storage unit (RAM).

  As described above, an optical test can be performed by sequentially emitting light from a plurality of LED chips 21 in one row (lateral direction). Thereafter, the roll 54 is rotated by a predetermined distance, and the next one row (horizontal direction) of the plurality of LED chips 21 is caused to emit light sequentially to perform an optical test.

(Embodiment 5)
In the first embodiment, at the time of the optical test, the two probe pins are sequentially pushed up together with the pedestal for each LED chip 21 to electrically connect the two probe pins to the + terminal and the − terminal of the LED chip 21. Although the LED chips 21 are configured to emit light sequentially, in the fifth embodiment, an air push method in which the plurality of LED chips 21 in one row sequentially emit light one by one in a plurality of (here, 5) blocks. A specific example will be described.

  FIGS. 9A to 9C are air push configuration diagrams schematically showing a second example of the terminal connection means of the electronic component operation function measuring apparatus according to the fifth embodiment of the present invention.

  As shown in FIGS. 9A to 9C, the air push type terminal connection means 6 </ b> C of the second example can be electrically connected to the + terminal and the − terminal on the back surface of the LED chip 21. There are two needle-like probe pins insulated from each other, and the two contact pins 63 are fixed to the upper surface at a predetermined interval (the same interval as the + terminal and the-terminal), and the lower surface is air. The LED unit 21 is configured to be freely rotatable by a left and right long tube at a position below the opening of the contact unit 66 that can be moved up and down (vertically) by the presence or absence of a push. The pressure air pipes 67 are formed with predetermined numbers (five here) of air vent holes 67a at predetermined intervals by changing the angle according to the arrangement interval.

  The contact unit 66 having two contact pins 63 on the upper surface is configured to be movable up and down for each rear surface of the LED chip 21. That is, the same number of contact pins 63 and contact units 66 are provided immediately below the plurality of LED chips 21 in one row (lateral direction) of the electronic component substrate 3 wound around the roll 51 for each LED chip 21 during the optical test. Just arranged.

  The operation of the terminal connecting means 6C having the above configuration will be described.

  First, as shown in FIGS. 9A to 9B, during the optical test, the reflecting plate 71 is lowered together with the light receiving elements 72, and the reflecting plate 71 surrounds a predetermined number of LED chips 21 (here, five). Cover with. In this case, five LED chips 21 are provided, and a plurality of subsequent reflectors 71 are sequentially prepared.

  In this state, the long pressure air pipe 67 rotates by a predetermined angle, and the air vent hole 67a of the pressure air pipe 67 comes immediately below the lower surface opening of the contact unit 66 with the two contact pins 63 attached. Then, air contact is pushed from the air vent 67a toward the lower surface opening and the contact unit 66 is pushed up together with the two contact pins 63. Here, each of the first, eleventh and twenty-first LED chips 21 is pushed. Two needle-like contact pins 63 penetrate the adhesive sheet 31 (UV sheet) and are electrically connected to the + terminal and the − terminal on the back surface. As described above, the two contact pins 63 are electrically connected to the + terminal and the − terminal of the LED chip 21, and the LED chip 21 is supplied with a predetermined power supply voltage from the two contact pins 63 to emit light. An optical test (inspection of whether the amount of light is equal to or greater than a threshold value) is performed on each of the first, eleventh and twenty-first LED chips 21 that have emitted light. In short, when the pressure air pipe 67 is rotated by an angle of 360 degrees / the number of chips N (N is 5), the contact unit 66 with the two contact pins 63 is pushed up and lifted, and the adhesive sheet 31 The two contact pins 63 penetrate through the (UV sheet) and connect to the + terminal and the − terminal on the back surface of the LED chip 21.

  Subsequently, as shown in FIGS. 9B to 9C, the pressure air pipe 67 is further rotated by a predetermined angle so that the next air vent 67a is a contact with two contact pins 63 attached thereto. It comes directly below the lower surface opening of the unit 66, and air is pushed from the air vent hole 67 a toward the lower surface opening to push up only the contact unit 66 together with the two contact pins 63. Here, two needle-like contact pins 63 penetrate the adhesive sheet 31 (UV sheet) with respect to the + terminal and the − terminal on the back surface of each of the second, twelfth and twenty-second LED chips 21. And make an electrical connection. In this way, the two contact pins 63 are electrically connected to the + terminal and the − terminal of the LED chip 21, and a predetermined power supply voltage is supplied to the LED chip 21 from the two contact pins 63 to emit light from the LED chip 21. Let An optical test (inspection of whether the amount of light is equal to or greater than a threshold value) is performed on each of the second, twelfth, and twenty-second light-emitting LED chips 21. In short, when the pressure air pipe 67 is further rotated by an angle corresponding to one chip (angle 360 degrees / number of chips 5), the previous contact unit 66 returns to its original position without air push, and returns to the next contact unit. 66 is lifted together with the two contact pins 63 by air push, and the two contact pins 63 penetrate through the adhesive sheet 31 (UV sheet) to connect to the + terminal and the − terminal on the back surface of the next LED chip 21.

  This operation is repeated, and an optical test (inspection of whether the amount of light is equal to or greater than a threshold value) of each of the five LED chips 21 that sequentially emit light, the first to fifth, the 11th to 15th, and the 21st to 25th. Is completed. As in the case of the first embodiment, the coordinate information of the NG LED chip 21 is stored in the storage unit (RAM).

  Next, the plurality of reflecting plates 71 are once lifted together with the light receiving elements 22, shifted to the right side over five LED chips 21 for which the optical test has been completed, and then the plurality of reflecting plates 71 together with the light receiving elements 22 are lowered. Then, the periphery of the next predetermined number of LED chips 21 (here, five) is covered with a reflecting plate 71.

  The above-described inspection operation is repeated, and the sixth to tenth, sixteenth to twentieth, and twenty-sixth to thirtieth optical tests of each of the five light-emitting LED chips 21 (inspection of whether the amount of light is equal to or greater than a threshold) Is completed. As in the case of the first embodiment, the coordinate information of the NG LED chip 21 is stored in the storage unit (RAM).

  As described above, an optical test can be performed by sequentially emitting light from a plurality of LED chips 21 in one row (lateral direction). Thereafter, the roll 54 is rotated by a predetermined distance, and the next one row (horizontal direction) of the plurality of LED chips 21 is caused to emit light sequentially to perform an optical test.

  Accordingly, the terminal connecting means 6C includes a contact pin 63 that is a probe pin that is electrically connected to the back surface terminal of the LED chip 21, and the contact pin 63 is fixed to the upper surface, and the lower surface is in the vertical direction depending on the presence or absence of air push. The contact unit 66 is open at the end face so that it can be moved to the right, and is configured to be rotatable by a long horizontal tube at a position below the end face opening of the contact unit 66. And a driving voltage output means for supplying a driving voltage for driving the LED chip 21 to the contact pin 63 and a pressure air pipe 67 having a plurality of air push holes 67a formed at predetermined intervals. (Not shown).

(Embodiment 6)
In the first embodiment, at the time of the optical test, the two probe pins are sequentially pushed up together with the pedestal for each LED chip 21 to electrically connect the two probe pins to the + terminal and the − terminal of the LED chip 21. Although the LED chips 21 are configured to emit light sequentially, in the sixth embodiment, a rotating drum system in which the plurality of LED chips 21 in one row are sequentially emitted one by one in a plurality of (here, 5) blocks. A specific example will be described.

  FIG. 10A to FIG. 10C are configuration diagrams of a rotating drum system schematically showing a third example of the terminal connecting means of the electronic component operation function measuring apparatus according to Embodiment 6 of the present invention.

  As shown in FIGS. 10A to 10C, the rotary drum type terminal connecting means 6 </ b> D of the third example can be electrically connected to the + terminal and the − terminal on the back surface of the LED chip 21. The contact pin 63, which is two needle-like probe pins insulated from each other, and the two contact pins 63 are fixed to the upper surface at a predetermined interval (the same interval as the interval between the + terminal and the − terminal), and the lower surface corner portion The contact unit 68 is configured to be movable up and down (vertically) with a rounded corner, and is configured to be rotatable on a long circular axis in the left-right direction at the lower surface position of the contact unit 68. The projecting drum portion 69a has a rotating drum 69 formed at a predetermined interval by a predetermined number (here, five) by changing the angle at the arrangement interval.

  The contact unit 68 having two contact pins 63 on the upper surface is configured to be movable up and down for each rear surface of the LED chip 21. That is, the same number of contact pins 63 and contact units 68 are provided immediately below the plurality of LED chips 21 in one row (lateral direction) of the electronic component substrate 3 wound around the roll 51 for each LED chip 21 during the optical test. Just arranged.

  The operation of the terminal connecting means 6D having the above configuration will be described.

  First, as shown in FIGS. 10 (a) to 10 (b), during an optical test, the reflecting plate 71 is lowered together with the light receiving elements 72, and the reflecting plate 71 surrounds a predetermined number of LED chips 21 (here, five). Cover with. In this case, five LED chips 21 are provided, and a plurality of subsequent reflectors 71 are sequentially prepared.

  In this state, the long rotating drum 69 rotates by a predetermined angle, and the protruding drum portion 69a of the rotating drum 69 moves to a position directly below the lower surface of the contact unit 68 with the two contact pins 63 to contact the contacts. The unit 68 is pushed up together with the two contact pins 63, and here, two needle-like contact pins with respect to the + terminal and the − terminal on the back surface of the first, eleventh and twenty-first LED chips 21. 63 penetrates and is electrically connected to the adhesive sheet 31 (UV sheet). As described above, the two contact pins 63 are electrically connected to the + terminal and the − terminal of the LED chip 21, and the LED chip 21 is supplied with a predetermined power supply voltage from the two contact pins 63 to emit light. An optical test (inspection of whether the amount of light is equal to or greater than a threshold) is simultaneously performed on the first, eleventh and twenty-first LED chips 21 that have emitted light. In short, when the rotary drum 69 is rotated by an angle of 360 degrees / the number of chips N (N is 5), the contact unit 68 with the two contact pins 63 is lifted by the protruding drum portion 69a, and the adhesive sheet 31 The two contact pins 63 penetrate through the (UV sheet) and connect to the + terminal and the − terminal on the back surface of the LED chip 21.

  Subsequently, as shown in FIGS. 10B to 10C, the rotating drum 69 is further rotated by a predetermined angle, and the next protruding drum portion 69 a is a contact unit having two contact pins 63. The projecting drum portion 69 a pushes up the lower surface of the contact unit 68 together with the two contact pins 63. Here, two needle-like contact pins 63 penetrate the adhesive sheet 31 (UV sheet) with respect to the + terminal and the − terminal on the back surface of each of the second, twelfth and twenty-second LED chips 21. And make an electrical connection. In this way, the two contact pins 63 are electrically connected to the + terminal and the − terminal of the LED chip 21, and a predetermined power supply voltage is supplied to the LED chip 21 from the two contact pins 63 to emit light from the LED chip 21. Let An optical test (inspection of whether the amount of light is equal to or greater than a threshold value) is performed on each of the second, twelfth, and twenty-second light-emitting LED chips 21. In short, when the rotating drum 69 is further rotated by an angle of one chip (angle 360 degrees / number of chips 5), the contact unit 68 descends from the first projecting drum portion 69a and returns to the original position. The next contact unit 68 is lifted together with the two contact pins 63 by the second protruding drum portion 69a, and the two contact pins 63 penetrate through the adhesive sheet 31 (UV sheet), and the + terminal on the back surface of the next LED chip 21 Connect to the-and-terminals.

  By repeating this operation, the optical test of the LED chip 21 in which each of the first to fifth, 11th to 15th, and 21st to 25th light emitting elements sequentially emits light (inspection of whether the amount of light is equal to or greater than a threshold value). Is completed. As in the case of the first embodiment, the coordinate information of the NG LED chip 21 is stored in the storage unit (RAM).

  Next, the plurality of reflecting plates 71 are once lifted together with the light receiving elements 22, shifted to the right side over five LED chips 21 for which the optical test has been completed, and then the plurality of reflecting plates 71 together with the light receiving elements 22 are lowered. The periphery of the next predetermined number of uninspected LED chips 21 (here, five) is covered with a reflecting plate 71.

  The above-described inspection operation is repeated, and an optical test of the LED chip 21 in which each of the sixth to tenth, sixteenth to twentieth and twenty-sixth to thirty-five lights emits light (inspection whether the light amount is equal to or greater than a threshold value) To complete. As in the case of the first embodiment, the coordinate information of the NG LED chip 21 is stored in the storage unit (RAM).

  As described above, an optical test can be performed by sequentially emitting light from a plurality of LED chips 21 in one row (lateral direction). Thereafter, the roll 54 is rotated by a predetermined distance, and the next one row (horizontal direction) of the plurality of LED chips 21 is caused to emit light sequentially to perform an optical test.

Accordingly, the terminal connecting means 6D includes a contact pin 63 that is a probe pin that is electrically connected to the back surface terminal of the LED chip 21, and the contact pin 63 is fixed to the upper surface, and a rounded corner is attached to the lower surface corner portion in the vertical direction. The contact unit 68 is configured so as to be movable at the lower surface of the contact unit 68, and is configured to be rotatable by a long circular axis in the lateral direction at the lower surface position of the contact unit 68. The driving drum 69 is formed with a predetermined number of protruding drum portions 69a at every predetermined interval, and the driving drum 69 drives the LED chip 21 relative to the contact pin 63 with the rotating drum 69 that pushes up the lower surface of the contact unit 68 by rotation. Drive voltage output means (not shown).
(Embodiment 7)
FIG. 11: is a block diagram of the reflector and probe integrated system which shows typically the 4th example of the terminal connection means of the electronic component operation function measuring apparatus in Embodiment 7 of this invention.

  As shown in FIG. 11, the electronic component substrate 3 is wound around a roll 55 having a polygonal cross section as the electronic component side surface separating means 5, and a reflector 71 </ b> A and an insulating sheet 61 </ b> B are interposed on the surface and side terminals of the LED chip 21. The reflecting plate 71A, the insulating sheet 61B, and the probe pin 61A are integrated directly below each other, and each tip is in contact (the reflecting plate 71A is in contact with the surface and the probe pin 61A is in contact with the side terminal). ing. Two needle-like probe pins 61A that are insulated from each other are pressed against and electrically connected to the + terminal and the − terminal on the side surface of the ED chip 21. The two probe pins 61A are connected to the terminals on the side surfaces of a predetermined number of LED chips 21 in one predetermined row (lateral direction) of the electronic component substrate 3 wound around the roll 55 having a polygonal cross section for each LED chip 21. They are arranged to press each other. Therefore, when the plurality of LED chips 21 in a predetermined direction (horizontal direction) are caused to emit light sequentially, the two needle-like probe pins 61A immediately below the reflecting plate 71A are sequentially led along the back surface of the reflecting plate 71A. The LED chip 21 is pressed against a terminal on the upper side of the side 21, and a predetermined power supply voltage is supplied from the two probe pins 61A to the LED chip 21 to sequentially emit light. At this time, the LED chip 21 can be driven to emit light by supplying a light emission voltage to the two probe pins 61A from a light emission voltage output source as a drive voltage output means. The insulating sheet 61B is a sheet member for electrically insulating the probe pin 61A and the reflecting plate 71A.

Therefore, the terminal connecting means of the seventh embodiment is such that the reflecting plate 71A, the insulating sheet 61B, and the probe pin 61A are integrated at a position directly below the reflecting plate 71A via the insulating sheet 61B below the reflecting plate 71A. The tip of the plate 71A is in contact with the surface of the LED chip 21, and the probe pin 61A is configured to be in contact with or separated from the side surface terminal of the LED chip 21.
(Embodiment 8)
FIG. 12 is a block diagram of a shaft system schematically showing a fifth example of the terminal connection means of the electronic component operation function measuring apparatus according to Embodiment 8 of the present invention, and FIG. 13 is a longitudinal sectional view of the terminal connection means of FIG. is there.

  As shown in FIG. 12 and FIG. 13, the terminal connecting means 6E of the eighth embodiment has the electronic component substrate 3 wound around a roll 56 having a circular cross section as the electronic component side surface separating means 5, and a predetermined number (here, The contact pins 63E are simultaneously in contact with the back surfaces of the five (5) LED chips 21, and the contact pins 63E are also simultaneously in contact with the back surfaces of a predetermined number (here, five) of the LED chips 21 opposite to the angle of 180 degrees. Can do. A plurality of contact pins 63E provided at the tip of each of the LED pins 21 are connected to the + terminals on the back surface of each of the five LED chips 21 through the crank-shaped contact units 68E connected vertically by rotating the central rotation shaft 69E. -Two pairs of needle-shaped contact pins 63E insulated from each other can be pressed against each other simultaneously to be electrically connected. Five sets of the two contact pins 63E are provided on the opposite side of the angle 180 degrees, and five sets of the two contact pins 63E are provided, and each LED chip 21 is wound around a roll 56 having a circular cross section. Terminals on the back surface of a predetermined number of LED chips 21 in one row (horizontal direction) of the electronic component substrate 3 and terminals on the back surface of a predetermined number of LED chips 21 in one row (horizontal direction) of the electronic component substrate 3 on the opposite side. Can be pressed at the same time. Therefore, a plurality of LED chips 21 in one row (lateral direction) and a plurality of LED chips 21 in one row (lateral direction) on the opposite side can be simultaneously conducted and inspected. Also in this case, a driving voltage such as a predetermined light emitting voltage is supplied from the light emitting voltage output source as the driving voltage output means to the two contact pins 63E to drive the LED chip 21 to emit light or obtain a predetermined output voltage. can do.

  Accordingly, the terminal connecting means 6E is coupled to the contact pins 63E, which are probe pins that are electrically connected to the back terminal of the LED chip 21, the rotating shaft 69E, and the rotating shaft 69E on the opposite sides of the circular cross section. A crank-shaped upper and lower contact unit 68E, with contact pins 63E fixed to both end faces, and rotation of the rotary shaft 69E with respect to the back terminals of the plurality of LED chips 21 provided on the opposite sides of the upper and lower sides. The contact unit 68E capable of connecting the back terminals of the plurality of LED chips 21 and the contact pins 63E simultaneously, and the drive voltage output capable of supplying the drive voltage for driving the LED chips 21 to the contact pins 63E. Means (not shown).

  In the first to eighth embodiments, when the electronic component 2 is a light emitting element chip, the electrical operation function measuring unit 7 covers the periphery of the LED chips 21 as a predetermined number of light emitting element chips. Are reflected on the inner surface without leaking to the outside and guided in a predetermined direction, a light receiving element 72 that photoelectrically converts light from the reflecting plate 71 to obtain an imaging signal, and an imaging signal from the light receiving element 72 The case of having the chip pass / fail judgment unit 73 for judging the pass / fail of the LED chip 21 by comparing the light emission of the LED chip 21 and the threshold value thereof has been described. However, the present invention is not limited to this, and the electronic component 2 is an LSI chip or a light receiving element chip. In this case, the electrical operation function measuring means 7 compares the input / output value via the terminal connection means 6 of the predetermined number of LSI chips or light receiving element chips with the threshold value of the input / output value, For the case where the goods 2 with the acceptability determining chip quality determination unit also to be able to apply the present invention, it is possible to achieve the object of the present invention.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-8 of this invention, this invention should not be limited and limited to this Embodiment 1-8. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments 1 to 8 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to an electronic component operation function measuring apparatus and electronic component operation for inspecting light emission and light reception which are operation functions of an optical element such as a light emitting diode (hereinafter referred to as an LED element) and a light receiving element, and inspecting an operation function of an LSI chip. In the field of function measurement methods, the electrical operation function of electronic components is measured in the state of a substrate with multiple chip components mounted without dividing the chip components into individual pieces, greatly simplifying the device configuration, Electrical characteristics and optical characteristics of each chip component can be measured and inspected more easily.

1, 1A, 1B Electronic component operation function measuring device 2 Electronic component 21 LED chip 22 Lens 3 Electronic component substrate 31 Adhesive sheet (UV sheet)
4 Opening 5, 5A Electronic component side surface separation means 51, 53-56 Roll 52 Rotating shaft (Rotating shaft)
6, 6A-6E Terminal connection means 61, 61A, 62 Probe pin 61B Insulating sheet 63, 63E Contact pin (probe pin)
64, 66, 68, 68E Contact unit 65 Moving shaft 65a Wedge-shaped projection 67 Pressure air pipe 67a Air vent hole 69 Rotating drum 69a Projecting drum 69E Rotating shaft 7 Electrical operation function measuring means 71 Reflector 72 Light receiving element 73 Chip pass / fail Judgment part 71A Reflector

Claims (13)

Electronic component operation function measurement for inspecting the electrical operation function of a plurality of electronic component substrates in which a plurality of electronic components cut individually with a sheet on the back surface are arranged in a matrix. A device,
Bending the electronic component substrate along a curved surface or a corner, separating the side surfaces between adjacent electronic components, and terminal connecting means for connecting to predetermined terminals of the electronic component; It possesses the electrical operating function measuring means for measuring the electrical operating functions of the one or more electronic components in a state of driving the one or more electronic components that are connected via the terminal connection means,
An electronic component operation function measuring device in which one or a plurality of rolls having a circular or polygonal cross section and a rotating shaft having a polygonal cross section are arranged as the electronic component side surface separation means .   The electronic component operation function measuring apparatus according to claim 1, wherein the terminal connection means is a probe pin that can be electrically connected to a terminal on a back surface or a side surface of the electronic component, and the electron to the probe pin. An electronic component operation function measuring device comprising drive voltage output means capable of supplying a drive voltage for driving a component. 3. The electronic component operation function measuring apparatus according to claim 2 , wherein when there is a terminal on the back surface of the electronic component, the terminal connecting means penetrates the back sheet by two probe pins each having a needle shape at the time of inspection. Electronic component operation function measuring device to be connected to the terminal of the electronic component.   2. The electronic component operation function measuring apparatus according to claim 1, wherein when the electronic component is a light emitting element chip, the electrical operation function measuring means covers a predetermined number of light emitting element chips and from the light emitting element chip. Based on the image pickup signal from the light receiving element that reflects the light emitted from the inside without leaking to the outside and guides it in a predetermined direction and photoelectrically converts the light from the light reflecting plate to obtain the image pickup signal An electronic component operation function measuring device comprising: a chip pass / fail judgment unit for judging the pass / fail of the light-emitting element chip by comparing the light emission of the light-emitting element chip and its threshold value.   2. The electronic component operation function measuring apparatus according to claim 1, wherein when the electronic component is an LSI chip or a light receiving element chip, the electrical operation function measuring means connects the terminal connection of a predetermined number of LSI chips or light receiving element chips. An electronic component operation function measuring device having a chip pass / fail judgment unit for judging pass / fail of an electronic component by comparing an input / output value via a means and a threshold of the input / output value. 6. The electronic component operation function measuring device according to claim 4 or 5 , wherein when the determination result of the electronic component determined by the chip quality determination unit is NG, the coordinate position of the electronic component is stored in the storage unit as NG information. Electronic component operation function measuring device. In the electronic component operation function measuring device according to claim 2 ,
The terminal connection means includes a first terminal connection means for connecting a probe pin to a terminal of the electronic component for each electronic component and inspecting optical characteristics of the electronic component, and a plurality of terminals for inspecting the optical characteristics. Electronic component operation function measuring device comprising: second terminal connection means for simultaneously connecting probe pins to terminals of all of a plurality of electronic components in a line different from the electronic component of the electronic component and inspecting the electrical characteristics of the electronic component . In the electronic component operation function measuring device according to claim 1,
The terminal connection means includes a probe pin that is electrically connected to a back surface terminal of an electronic component, a contact unit having the probe pin fixed to the upper surface, and a lower surface having a tapered surface, and a lower portion of the contact unit. It is configured to be movable in the horizontal direction, and it can supply a long moving shaft with a wedge-shaped projection on the top surface that pushes up the tapered surface by the movement, and a drive voltage for driving the electronic component to the probe pin An electronic component operation function measuring device having drive voltage output means. In the electronic component operation function measuring device according to claim 1,
The terminal connecting means includes a probe pin that is electrically connected to the back terminal of the electronic component, and the probe pin is fixed to the upper surface, and the end surface is opened so that the lower surface can be moved in the vertical direction with or without air push. The air unit is configured to be freely rotatable by a long horizontal tube at a position below the open end face of the contact unit and the end face of the contact unit. An electronic component operation function measuring device comprising: a plurality of pressure air tubes formed at predetermined intervals; and drive voltage output means capable of supplying a drive voltage for driving the electronic component to the probe pin. In the electronic component operation function measuring device according to claim 1,
The terminal connection means includes a probe pin that is electrically connected to a back surface terminal of the electronic component, and the probe pin is fixed to the upper surface and is configured to be movable in the vertical direction with rounded corners on the lower surface. The contact unit and the bottom surface of the contact unit are configured to be rotatable by a long circular shaft in the left-right direction, and a predetermined number of projecting drum portions are provided for each electronic component by changing the angle according to the arrangement interval of the electronic components. A rotating drum which is formed at a predetermined interval and whose projecting drum portion pushes up the lower surface of the contact unit by rotation; and a driving voltage output means capable of supplying a driving voltage for driving the electronic component to the probe pin. Electronic component operation function measuring device. In the electronic component operation function measuring device according to claim 4 ,
The terminal connecting means is located immediately below the reflecting plate via an insulating sheet below, and the reflecting plate, the insulating sheet, and the probe pin are integrated, and the tip of the reflecting plate is the light emitting element chip. An electronic component operation function measuring device configured to abut on a surface and have the probe pin abut or separate from a side terminal of the light emitting element chip. In the electronic component operation function measuring device according to claim 1,
The terminal connecting means is a probe pin that is electrically connected to a back terminal of an electronic component, a rotating shaft, and a crank-shaped upper and lower contact unit coupled to opposite sides of a circular cross section of the rotating shaft. The probe pins are fixed to both end faces, and the back terminals of the plurality of electronic components provided on the opposite sides of the upper and lower sides are simultaneously rotated by the rotation of the rotating shaft and the back terminals of the plurality of electronic components. An electronic component operation function measuring device comprising: a contact unit for connecting each of the probe pins; and a drive voltage output means capable of supplying a drive voltage for driving the electronic component to the probe pin. Electronic component operation function measurement for inspecting the electrical operation function of a plurality of electronic component substrates in which a plurality of electronic components cut individually with a sheet on the back surface are arranged in a matrix. A method,
The electronic component side surface separation means bends the electronic component substrate along a curved surface or a corner, and separates the side surfaces between adjacent electronic components, and the terminal connection means includes the electronic component. A terminal connection step for connecting to the predetermined terminal, and the electrical operation function measuring means drives the one or more electronic parts connected via the terminal connection means in an electrically driven state. possess the electrical operating function measuring step of measuring the operating function,
An electronic component operation function measuring method in which one or a plurality of rolls having a circular or polygonal cross section and a rotating shaft having a polygonal cross section are arranged as the electronic component side surface separation means .