JP4952728B2 - Multilayer capacitor and multilayer capacitor manufacturing method - Google Patents

Description

  The present invention relates to a multilayer capacitor and a method for manufacturing the multilayer capacitor.

  2. Description of the Related Art Conventionally, a multilayer capacitor including an element body formed by laminating a plurality of dielectric layers, a plurality of internal electrodes formed in the element body, and a pair of terminal electrodes formed so as to cover both end faces of the element body is there. When a voltage is applied to the multilayer capacitor, mechanical distortion having a magnitude corresponding to the applied voltage is generated in the element body due to the electrostrictive effect. In particular, when an AC voltage is applied, vibration (electrostrictive vibration) is generated in the multilayer capacitor due to this mechanical strain. Therefore, when a multilayer capacitor is mounted on a substrate and an AC voltage is applied, electrostrictive vibration propagates to the substrate, and so-called noise may occur.

JP 2001-185446 A JP 2004-266110 A

  As described above, it is considered that the absorption of electrostrictive vibration using the bending of the metal terminal is effective in preventing the generation of noise from the multilayer capacitor. Therefore, it is important to further devise the configuration of the multilayer capacitor provided with such metal terminals to enhance the electrostrictive vibration absorption performance and to improve the ease of mounting on a substrate.

  Here, for example, in the multilayer capacitor described in Patent Document 2, a structure is disclosed in which the leg portion of the metal terminal is raised at the lower portion of the element body, and the tip portion of the leg portion is folded outside the element body. However, in the structure of Patent Document 2, when the multilayer capacitor is connected to the mounting substrate by solder reflow, a solder fillet is formed inside the upright surface of the metal terminal at the lower portion of the element body, and the solder fillet is formed in a different direction. It is constrained to be inward of the prime field.

  When the solder fillet is formed inward of the element body, it is advantageous in terms of the mounting density of the multilayer capacitor on the mounting board, but it is difficult to see the state of the solder fillet from the outside, and a sufficient connection yield can be obtained. There is a risk of disappearing. On the other hand, the structure in which the solder fillet is formed outward of the element body makes it easy to visually recognize the state of the solder fillet from the outside, but it is disadvantageous in terms of the mounting density of the multilayer capacitor on the mounting board. Accordingly, there is a demand for a metal terminal configuration that can select the solder fillet formation direction according to the required specifications.

  The present invention has been made to solve the above-described problems, and can prevent the generation of sound and can selectively set the formation direction of a solder fillet, and a simple procedure for such a multilayer capacitor. An object of the present invention is to provide a method for manufacturing a multilayer capacitor that can be manufactured by the following method.

  In order to solve the above problems, the multilayer capacitor according to the present invention is provided with an element body formed by laminating a plurality of dielectric layers, a terminal electrode formed so as to cover an end surface of the element body, and a periphery of the element body. A metal terminal, wherein the metal terminal is connected to the terminal connection surface connected to the terminal electrode on the end face side of the element body, and the terminal connection in a state separated from the bottom surface of the element body by a predetermined distance. The substrate connection surface arranged on the center side of the element body from the surface, the element support surface supporting the bottom surface of the element body on the center side of the element body from the substrate connection surface, and the substrate connection standing from the substrate connection surface A first connection surface that connects the surface and the terminal connection surface, and a second connection surface that stands up from the substrate connection surface and connects the substrate connection surface and the element support surface, The step portion formed by the element body support surface and the second connecting surface is the element body as viewed from the stacking direction of the dielectric layers. It is characterized by being located in a region to be.

  In this multilayer capacitor, even when electrostrictive vibration is generated in the multilayer capacitor during voltage application due to the metal terminals provided around the element body, the electrostrictive vibration is caused by the bending of the connecting surface of the metal terminals. It is mitigated and can prevent the generation of noise. Further, in this multilayer capacitor, the first connection surface and the second connection surface that stand up from the substrate connection surface can be selected as the formation position of the solder fillet when connecting to the mounting substrate by reflow, so that the required specifications are achieved. Accordingly, the solder fillet forming direction can be selectively set. When the solder fillet is formed on the first connecting surface so as to face the element body, the state of the solder fillet can be easily seen from the outside, and the connection yield can be secured. On the other hand, when the solder fillet is formed on the second connection surface facing the element body, the step formed by the substrate connection surface, the element support surface, and the second connection surface is viewed from the stacking direction of the dielectric layers. Since the solder fillet does not protrude from the element body, the mounting density on the mounting substrate can be improved.

  Moreover, it is preferable that the cutout part is formed in the 1st connection surface. In this case, the ease of bending of the connecting surface is further ensured.

  Moreover, it is preferable that the 1st connection surface is located in the area | region which overlaps with an element body seeing from the lamination direction of a dielectric material layer. In this case, even when the solder fillet is formed on the first connecting surface so as to face outward from the element body, the solder fillet hardly protrudes from the element body, and the mounting density on the mounting substrate can be improved.

  Moreover, it is preferable that the height of a metal terminal is below the height of an element | base_body. In this case, the multilayer capacitor can be reduced in height.

  Moreover, it is preferable that the metal terminal does not have an overlapping portion when viewed from the stacking direction of the dielectric layers. In this case, for example, the metal terminal can be easily formed by pressing the lead frame in one direction.

  The multilayer capacitor manufacturing method according to the present invention is the above-described multilayer capacitor manufacturing method, wherein at least a pair of flat plate portions corresponding to metal terminals are patterned so as to face each other, and the flat plate portions are frame-connected. A step of preparing a lead frame connected to the outer frame by the portion, and pressing and bending each of the flat plate portions in one direction, and connecting the terminal connection surface, the substrate connection surface, the element support surface, the first connection surface, and the first And a step of connecting the terminal electrode and the terminal connection surface, and a step of separating the frame connecting portion from the flat plate portion. It is characterized by that.

  In this multilayer capacitor manufacturing method, the terminal connection surface, the substrate connection surface, the element support surface, the first connection surface, and the second connection are performed by a simple procedure of pressing the flat portion of the lead frame in one direction. Surfaces can be formed at once. Further, by placing the element body on the element support surface, the terminal electrode and the terminal connection surface can be easily connected, and the step formed by the substrate connection surface, the element support surface, and the second connection surface. The portion can be positioned in a region overlapping the element body when viewed from the stacking direction of the dielectric layers.

  Moreover, it is preferable that the flame | frame connection part has connected the terminal connection surface equivalent part side and outer frame in a flat plate part. In this case, since the fluctuation of the position of the terminal connection surface is suppressed before and after pressing the flat plate portion, it is possible to suppress the positional deviation between the terminal electrode and the terminal connection surface when placing the element body on the element support surface.

  Moreover, it is preferable that the blank part which is not bent by a press is provided in the connection part with a flame | frame connection part in a flat plate part. In this case, even if some cutting deviation occurs when the frame connecting portion is separated from the flat plate portion, damage to the terminal electrode can be avoided.

  Moreover, it is preferable that the frame connection part has connected the element body support surface equivalent part side in a flat plate part, and the outer frame. In this case, fluctuations in the position of the element support surface before and after the pressing of the flat plate portion are suppressed, so that variations in pitch between the flat plate portions due to pressing can be suppressed.

  Moreover, it is preferable that the surface of the lead frame is subjected to solder plating. In this case, after placing the element body on the element support surface, the terminal electrode and the terminal connection surface can be easily connected by heat treatment.

  According to the multilayer capacitor in accordance with the present invention, it is possible to prevent the generation of noise and to selectively set the formation direction of the solder fillet. In addition, according to the multilayer capacitor manufacturing method of the present invention, such a multilayer capacitor can be manufactured by a simple procedure.

1 is a perspective view showing an embodiment of a multilayer capacitor according to the present invention. FIG. 2 is a side view of the multilayer capacitor illustrated in FIG. 1. It is a figure which shows the manufacturing process of the multilayer capacitor shown in FIG. FIG. 4 is a diagram showing a step subsequent to FIG. 3. It is the perspective view which showed the modification of the formation direction of a solder fillet. It is the perspective view which showed the modification of the cutout part. It is the perspective view which showed the modification of the 1st connection surface. It is the figure which showed the modification of a lead frame. It is the figure which showed the further modification of the lead frame.

  Hereinafter, preferred embodiments of a multilayer capacitor and a method for manufacturing a multilayer capacitor according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing an embodiment of the multilayer capacitor according to the present invention. FIG. 2 is a side view of FIG.

  As shown in FIGS. 1 and 2, the multilayer capacitor 1 is, for example, a 2012 type (length 2.0 mm, width 1.2 mm, height 1.0 mm) multilayer ceramic capacitor, and a plurality of dielectric layers 2 are stacked. A substantially rectangular parallelepiped element body 3, a pair of terminal electrodes 4, 4 formed so as to cover the end faces 3 a, 3 a in the longitudinal direction of the element body 3, and a pair of terminals provided around the element body 3 Metal terminals 5 and 5 are provided.

The dielectric layer 2 constituting the element body 3 is a ceramic green sheet laminate including a dielectric ceramic such as a BaTiO ₃ system, a Ba (Ti, Zr) O ₃ system, or a (Ba, Ca) TiO ₃ system. It is formed by tying. In the element body 3, the dielectric layers 2 are integrated to such an extent that their boundaries cannot be visually recognized.

  Inside the element body 3, a first internal electrode and a second internal electrode (not shown) are provided. The first internal electrode and the second internal electrode are formed by, for example, patterning a conductive paste containing Ni on a ceramic green sheet by printing or the like, and sintering the pattern together with the ceramic green sheet.

  The first internal electrode and the second internal electrode are alternately arranged in the stacking direction so as to sandwich at least the dielectric layer 2 corresponding to one green sheet layer. The end portion of the first internal electrode extends to one of the longitudinal end surfaces 3a of the element body, and the end portion of the second internal electrode extends to the other end of the longitudinal end surface 3a of the element body.

  The element region sandwiched between the first internal electrode and the second internal electrode is a portion that substantially generates a capacitance in the multilayer capacitor 1. This element region is also a region where mechanical strain is generated by the electrostrictive effect. That is, the element region expands in the stacking direction of the element body 3 when a voltage is applied between the first inner electrode and the second inner electrode, and in a direction connecting the opposing side surfaces of the element body 3. Shrink.

  The terminal electrode 4 is formed, for example, by applying a conductive paste containing conductive metal powder and glass frit to the end faces 3a and 3a of the element body 3 and baking them. A plating layer is formed on the surface of the baked terminal electrode 4 as necessary. For the application of the conductive paste, for example, an immersion method can be used.

  Next, the metal terminal 5 will be described. The metal terminal 5 has a plate shape substantially equal in width to the element body 3, a terminal connection surface 11 serving as a connection end to the terminal electrode 4, a substrate connection surface 12 serving as a connection end to the mounting substrate K, and an element body 3, the base body support surface 13 that supports the bottom surface 3 b of the third substrate, the first connection surface 14 that connects the terminal connection surface 11 and the substrate connection surface 12, and the first connection surface 14 that connects the substrate connection surface 12 and the base body support surface 13. 2 connecting surfaces 15 and a flange surface 16 provided at the tip of the terminal connecting surface 11.

  The terminal connection surface 11 extends along the lower edge portion of the end surface 3a of the element body 3, and is joined to the terminal electrode 4 by, for example, a solder plating heat treatment. Further, the substrate connection surface 12 extends in correspondence with the longitudinal edge portion of the bottom surface 3 b of the element body 3 in a state of being separated from the bottom surface 3 b of the element body 3 by a predetermined distance. The element body support surface 13 is disposed closer to the center of the element body 3 than the substrate connection surface 12, and is in contact with the bottom surface 3 b of the element body 3.

  The first connecting surface 14 stands up at a substantially right angle with respect to the board connection surface 12 and connects the end of the substrate connection surface 12 outside the element body and the lower end of the terminal connection surface 11. A rectangular cutout 17 is formed at the center of the first connecting surface 14. The cutout portion 17 extends in the width direction of the element body 3 of the first connecting surface 14. The area of the first connecting surface 14 is reduced by the cutout portion 17, and the flexibility is ensured. In addition, solder fillets 18 are formed at two locations outside the first connecting surface 14 with the cutout portion 17 interposed therebetween. Thereby, the multilayer capacitor 1 is connected to the mounting substrate K in a state where the substrate connection surface 12 is in contact with the land electrode (not shown).

  On the other hand, the second connection surface 15 stands up substantially at right angles to the substrate connection surface 12, similarly to the first connection surface 14. The second connecting surface 15 forms a stepped portion 19 by connecting an end portion inside the element body on the substrate connecting surface 12 and an end portion outside the element body on the element support surface 13. The step portion 19 is located in a region overlapping the element body 3 when the multilayer capacitor 1 is viewed from the lamination direction of the dielectric layer 2, and is sandwiched between the multilayer capacitor 1 and the mounting substrate K in the mounted state. Located in space.

  Further, the flange surface 16 protrudes at a substantially right angle from the tip of the terminal connection surface 11 toward the outside of the element body 3. The protruding width of the flange surface 16 is, for example, about 0.3 mm, and the protective member for the terminal electrode 4 when the metal terminal 5 is separated from the lead frame 21 (see FIG. 3) in the manufacturing process of the multilayer capacitor 1 described later. Function as.

  In such a metal terminal 5, the terminal connection surface 11, the substrate connection surface 12, the element body support surface 13, the first connection surface 14, the second connection surface 15, and the flange surface 16 are dielectric bodies in the element body 3. The metal terminal 5 can be formed by a simple procedure in which the lead frame 21 is pressed in one direction without having an overlapping portion when viewed from the stacking direction of the layer 2. In the metal terminal 5, the height from the position of the substrate connection surface 12 to the position of the flange surface 16 is smaller than the height of the element body 3. Thereby, the multilayer capacitor 1 is reduced in height.

  Next, the manufacturing process of the multilayer capacitor 1 described above will be described.

  First, as shown in FIG. 3A, a lead frame 21 is prepared. A pattern is formed on the lead frame 21 at a predetermined pitch so that a pair of flat plate portions 22 and 22 corresponding to the metal terminals 5 face each other, for example, by punching a metal plate. The surface of the lead frame 21 is pre-soldered.

  The flat plate portion 22 includes, in order from the distal end side, an element body support surface equivalent portion 23, a second connection surface equivalent portion 24, a board connection surface equivalent portion 25, a first connection surface equivalent portion 26, and a terminal connection surface equivalent portion 27. It has become. A rectangular hole portion 28 corresponding to the cutout portion 17 is provided in the first connecting surface equivalent portion 26 in advance. A strip-shaped frame connecting portion 29 extends from an edge of the flat plate portion 22 on the terminal connection surface equivalent portion 27 side, and the flat plate portion 22 is connected to the outer frame 30 of the lead frame 21.

  Next, by using a predetermined jig, the flat plate portions 22 are respectively pressed and bent in one direction, and as shown in FIG. 3B, the terminal connection surface 11, the substrate connection surface 12, and the element support surface. 13, the first connecting surface 14 and the second connecting surface 15 are formed simultaneously. At this time, in the flat plate portion 22, a blank portion 31 that is not bent by a press is provided in a connection portion with the frame connection portion 29.

  After pressing the flat plate portion 22, as shown in FIG. 4A, while the terminal connection surface 11 aligns the terminal electrode 4 along the end surface 3a of the element body 3, the element body 3 is moved to the terminal connection surface 11. Placed on. Then, the terminal connection surface 11 is heated to melt the solder plating, and the terminal electrode 4 and the terminal connection surface 11 are connected as shown in FIG. Thereafter, the tip of the frame connecting portion 29 is cut with a blade or the like, and the flat plate portion 22 is cut off from the frame connecting portion 29, whereby the multilayer capacitor 1 shown in FIGS. 1 and 2 is completed.

  When cutting the front end of the frame connecting portion 29, the blank portion 31 becomes the flange surface 16 of the metal terminal 5 as it is. Thereby, even if some cutting | disconnection shift | offset | difference arises when separating the frame connection part 29 from the flat plate part 22, the damage to the terminal electrode 4 can be avoided. When connecting the multilayer capacitor 1 and the mounting substrate K, solder fillets 18 are formed on the outside of the first connection surface 14 rising from the substrate connection surface 12 by, for example, reflow of cream solder, and the mounting substrate K What is necessary is just to join this land electrode and the board | substrate connection surface 12. FIG.

  Further, as shown in FIG. 5, the solder fillet 18 may be formed inside the second connecting surface 15 erected from the substrate connection surface 12 so as to face the element body. In this case, the step portion 19 formed by the substrate connection surface 12, the element body support surface 13, and the second connection surface 15 is located in a region overlapping the element body 3 when viewed from the stacking direction of the dielectric layer 2. Therefore, the solder fillet 18 can be formed so as not to protrude from the element body. Whether the solder fillet 18 is formed on the first connection surface 14 or the second connection surface 15 may be appropriately selected according to specifications.

  As described above, in the multilayer capacitor 1, even if electrostrictive vibration is generated in the multilayer capacitor 1 during voltage application due to the metal terminals 5 provided around the element body 3, When the first connecting surface 14 and the second connecting surface 15 are bent, electrostrictive vibration is mitigated, and generation of noise can be prevented. In the multilayer capacitor 1, a cutout portion 17 extending in the width direction of the element body 3 is formed on the first connecting surface 14, and sufficient flexibility is ensured.

  Further, in this multilayer capacitor 1, the first connection surface 14 and the second connection surface 15 rising from the substrate connection surface 12 can be selected as the formation position of the solder fillet 18 when connected to the mounting substrate by reflow. The formation direction of the solder fillet 18 can be selectively set according to the required specifications. As shown in FIG. 1, when the solder fillet 18 is formed on the first connecting surface 14 so as to face the element body outward, the state of the solder fillet 18 can be easily seen from the outside, and the yield of connection can be ensured.

  On the other hand, as shown in FIG. 5, when the solder fillet 18 is formed on the second connection surface 15 facing the element body, the solder fillet 18 is formed by the substrate connection surface 12, the element support surface 13, and the second connection surface 15. Since the step portion 19 is located in a region overlapping the element body 3 when viewed from the stacking direction of the dielectric layer 2, the solder fillet 18 does not protrude from the element body, and the mounting density on the mounting substrate K can be improved. .

  In the multilayer capacitor 1, even if the solder fillet 18 is formed on one of the first connecting surface 14 and the second connecting surface 15, the first connecting surface 14 and the second connecting surface 14 that do not form the solder fillet 18. Since the other of the connecting surfaces 15 becomes free, the ease of bending is ensured.

  Further, in this multilayer capacitor manufacturing method, the terminal connection surface 11, the substrate connection surface 12, the element body support surface 13, and the first connection are obtained by a simple procedure of pressing the flat plate portion 22 of the lead frame 21 in one direction. The surface 14 and the second connecting surface 15 can be formed simultaneously. Since the surface of the lead frame 21 is solder-plated, the terminal electrode 4 and the terminal connection surface 11 can be easily connected by placing the element body 3 on the element body support surface 13 and performing a heat treatment. At the same time, the step portion 19 is disposed in a region overlapping the element body 3 when viewed from the stacking direction of the dielectric layer 2.

  In the lead frame 21, the frame connecting portion 29 connects the terminal connection surface equivalent portion 27 side of the flat plate portion 22 and the outer frame 30. For this reason, since the fluctuation | variation of the position of the terminal connection surface 11 is suppressed before and after the press of the flat plate part 22 (refer FIG. 3), the terminal electrode 4 and terminal connection at the time of mounting the element | base_body 3 on the terminal connection surface 11 are carried out. The positional deviation with respect to the surface 11 can be suppressed.

  The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the rectangular cutout portion 17 extends in the width direction of the element body 3 at the center portion of the first connecting surface 14, but the metal terminal as in the multilayer capacitor 41 shown in FIG. 6. 45, a pair of rectangular cutouts 47 are formed from both edges in the width direction of the element body 3 on the first connecting surface 44 to the center side so that only the central portion of the first connecting surface 44 remains. Also good. Even with such a configuration, the ease of bending of the first connecting surface 44 is ensured.

  In the above-described embodiment, the first connecting surface 14 connects the end of the substrate connecting surface 12 outside the element body and the lower end of the terminal connecting surface 11, but the multilayer capacitor shown in FIG. As shown in FIG. 51, an overhanging surface 11a projecting from the lower end of the terminal connection surface 11 along the bottom surface 3b of the element body 3 is formed on the metal terminal 55, and the end of the substrate connection surface 12 outside the element body and the overhanging surface You may connect with the 1st connection surface 14 the edge part of the element body center side in 11a.

  In this case, similarly to the step portion 19, the first connecting surface 14 is located in a region overlapping the element body when viewed from the stacking direction of the dielectric layer 2. Thereby, even when the solder fillet 18 is formed outward of the element body outside the first connecting surface 14, the solder fillet 18 is unlikely to protrude from the element body 3, and the mounting density on the mounting substrate can be improved. .

  In the above-described embodiment, in the manufacturing process of the multilayer capacitor, the terminal connection surface equivalent portion 27 side of the flat plate portion 22 and the outer frame 30 are connected by the frame connecting portion 29. For example, FIG. Like the lead frame 61 shown, the flat plate portion 22 may be connected by the element support surface equivalent portion 23 side, the outer frame 30, and the frame connecting portion 69. In this case, as shown in FIG. 8B, the variation in the position of the element support surface 13 before and after the pressing is suppressed, so that the pitch variation between the flat plate portions 22 and 22 due to the pressing can be suppressed. This configuration is particularly significant when the length of the flat plate portion 22 with respect to the pressing direction is long.

  Also, for example, as in the lead frame 71 shown in FIG. 9A, the element body support surface equivalent portion 23, the second connection surface equivalent portion 24, the board connection surface equivalent portion 25, and the first connection surface in the flat plate portion 22. The orientation of the equivalent portion 26 and the terminal connection surface equivalent portion 27 may be orthogonal to the case of the lead frame 21, and the substrate connection surface equivalent portion 25, the outer frame 30, and the frame connection portion 79 may be connected. Even in this case, as shown in FIG. 13 (b), the terminal connection surface 11, the substrate connection surface 12, the element body support surface 13, The first connecting surface 14 and the second connecting surface 15 can be formed at a time.

DESCRIPTION OF SYMBOLS 1,41,51 ... Multilayer capacitor, 2 ... Dielectric layer, 3 ... Element body, 3a ... End surface, 3b ... Bottom surface, 4 ... Terminal electrode, 5, 45, 55 ... Metal terminal, 11 ... Terminal connection surface, 12 ... Board connection surface, 13 ... Element body support surface, 14, 44 ... First connection surface, 15 ... Second connection surface, 17, 47 ... Cutout part, 19 ... Step part, 21, 61, 71 ... Lead frame, 22 ... Flat plate portion, 23 ... Element body support surface equivalent portion, 27 ... Terminal connection surface equivalent portion, 29, 69, 79 ... Frame connecting portion, 30 ... Outer frame, 31 ... Margin portion.

Claims (10)

An element body formed by laminating a plurality of dielectric layers;
A terminal electrode formed so as to cover an end face of the element body;
A multilayer capacitor including a metal terminal provided around the element body,
The metal terminal is
A terminal connection surface connected to the terminal electrode on the end surface side of the element body;
In a state of being separated from the bottom surface of the element body by a predetermined distance, a board connection surface disposed on the center side of the element body from the terminal connection surface;
An element body support surface that supports the bottom surface of the element body on the center side of the element body from the substrate connection surface;
A first connection surface that stands up from the substrate connection surface and connects the substrate connection surface and the terminal connection surface;
A second connection surface that stands up from the substrate connection surface and connects the substrate connection surface and the element support surface;
The step portion formed by the substrate connection surface, the element body support surface, and the second connection surface is located in a region overlapping the element body when viewed from the stacking direction of the dielectric layer ,
The multilayer capacitor is characterized in that the first connection surface and the second connection surface face each other, and the width of the first connection surface is smaller than the width of the terminal connection surface .   The multilayer capacitor according to claim 1, wherein a cutout portion is formed on the first connection surface.   3. The multilayer capacitor according to claim 1, wherein the first connecting surface is located in a region overlapping the element body when viewed from the lamination direction of the dielectric layers.   The multilayer capacitor according to claim 1, wherein a height of the metal terminal is equal to or less than a height of the element body.   5. The multilayer capacitor according to claim 1, wherein the metal terminal does not have an overlapping portion when viewed from the lamination direction of the dielectric layers. A method for manufacturing a multilayer capacitor according to any one of claims 1 to 5,
Preparing a lead frame in which at least a pair of flat plate portions corresponding to the metal terminals are patterned so as to face each other, and the flat plate portions are connected to an outer frame by a frame connecting portion;
Forming the terminal connection surface, the substrate connection surface, the element body support surface, the first connection surface, and the second connection surface by pressing and bending each of the flat plate portions in one direction;
After placing the element body on the element support surface, connecting the terminal electrode and the terminal connection surface;
And a step of separating the frame connecting portion from the flat plate portion.   The method of manufacturing a multilayer capacitor according to claim 6, wherein the frame connecting portion connects a terminal connection surface equivalent portion side of the flat plate portion and the outer frame.   8. The method of manufacturing a multilayer capacitor according to claim 7, wherein in the flat plate portion, a blank portion that is not bent by the press is provided in a connection portion with the frame connection portion.   The method of manufacturing a multilayer capacitor according to claim 6, wherein the frame connecting portion connects the element support surface equivalent portion side of the flat plate portion and the outer frame.   The method for manufacturing a multilayer capacitor according to claim 6, wherein a solder plating is applied to a surface of the lead frame.

Images