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JP4949303B2 - LIGHT SOURCE AND ITS MANUFACTURING METHOD, LIGHTING DEVICE, DISPLAY DEVICE, AND TRAFFIC SIGNAL - Google Patents

LIGHT SOURCE AND ITS MANUFACTURING METHOD, LIGHTING DEVICE, DISPLAY DEVICE, AND TRAFFIC SIGNAL Download PDF

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JP4949303B2
JP4949303B2 JP2008088017A JP2008088017A JP4949303B2 JP 4949303 B2 JP4949303 B2 JP 4949303B2 JP 2008088017 A JP2008088017 A JP 2008088017A JP 2008088017 A JP2008088017 A JP 2008088017A JP 4949303 B2 JP4949303 B2 JP 4949303B2
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emitting element
light emitting
light source
core metal
reflective
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JP2008193113A (en
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正和 大橋
謙一 宇留賀
政律 伊藤
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Fujikura Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

本発明は、発光ダイオード(以下、LEDと記す。)などの発光素子を実装するための発光素子実装用基板に実装してなる光源とその製造方法、該光源を備えた照明装置、表示装置、交通信号機に関する。   The present invention relates to a light source that is mounted on a light emitting element mounting substrate for mounting a light emitting element such as a light emitting diode (hereinafter referred to as LED), a method for manufacturing the light source, an illumination device including the light source, a display device, It relates to traffic signals.

発光素子は、外力や湿気などの外部環境からの保護のため、通常は基板に実装し、さらに透明な樹脂で発光素子を封止してパッケージ化される。さらに、発光素子から発する光を集光、拡散などの制御を行うため、封止樹脂の上部にレンズ形状の突起を形成する場合もある。このようなレンズ形状を作製するには、例えば、硬化前の樹脂を表面張力により盛り上げて、その形状を保ったまま加熱硬化又は紫外線硬化させることにより、封止樹脂の上部をレンズ形状に仕上げることができる(例えば、特許文献1参照。)。
このようなレンズ形状の製造方法において、盛り上げる樹脂の盛り上げ量は、基板と樹脂の濡れ性に大きく影響を受ける。例えば、基板の表面状態のばらつきなどにより、封止樹脂の塗布量が多過ぎた場合や基板表面の濡れ性が良好であった場合、基板上面で硬化前の樹脂が流出してしまい、これを除去するのに手間がかかり、場合によっては流出した樹脂が基板側面などに設けられた電極を覆ってしまい、基板を半田で固定しようとした場合に電極に付着した樹脂が電気絶縁膜となって導通不良を招いてしまう問題がある。
In order to protect the light-emitting element from an external environment such as external force and moisture, the light-emitting element is usually mounted on a substrate and packaged by sealing the light-emitting element with a transparent resin. Furthermore, in order to control the light emitted from the light emitting element such as condensing and diffusing, a lens-shaped protrusion may be formed on the sealing resin. In order to produce such a lens shape, for example, the resin before curing is raised by surface tension, and the upper part of the sealing resin is finished into a lens shape by heat curing or ultraviolet curing while maintaining the shape. (For example, refer to Patent Document 1).
In such a lens-shaped manufacturing method, the raised amount of the resin to be raised is greatly influenced by the wettability between the substrate and the resin. For example, if the amount of sealing resin applied is too large due to variations in the surface condition of the substrate or if the wettability of the substrate surface is good, the uncured resin will flow out on the upper surface of the substrate. It takes time to remove, and in some cases, the resin that has flowed out covers the electrode provided on the side of the substrate, and the resin attached to the electrode becomes an electrical insulating film when the substrate is fixed with solder. There is a problem that leads to poor conduction.

近年、LEDは照明用途、交通信号機などへの適用が進められ、さらなる発光強度の向上が要求されている。印加する電流量を増大させることにより、LEDの発光強度を高めることができるが、この場合、同時に発光素子は発熱を伴うため、効率的に放熱する必要がある。放熱が十分でない場合、発光素子は点灯中に高温となるため、発光効率が低下してしまい、目標とする発光強度が得られなくなる。また、長期的に使用する場合、LEDの信頼性が低下し、不点灯などの不具合が発生する可能性が高くなる。   In recent years, LEDs have been applied to lighting applications, traffic signals, and the like, and further improvements in emission intensity are required. The light emission intensity of the LED can be increased by increasing the amount of current to be applied. However, in this case, since the light emitting element simultaneously generates heat, it is necessary to efficiently dissipate heat. When the heat radiation is not sufficient, the light emitting element becomes high temperature during lighting, and thus the light emission efficiency is lowered, and the target light emission intensity cannot be obtained. Moreover, when using for a long term, the reliability of LED falls and possibility that malfunctions, such as non-lighting, will generate | occur | produce becomes high.

さらに、発光素子から発する光を効率的に前方に放射するためには、図4に示すような反射凹部を設けることが望ましい。図4に示す発光素子のパッケージ構造では、すり鉢状の反射凹部2を有し、一部が該反射凹部2内に延設された電極3が設けられているパッケージ1を用い、このパッケージ1の反射凹部2内の一方の電極3上にLEDなどの発光素子4を実装し、また発光素子4と他方の電極3とを金線5によって電気的に接続し、さらに反射凹部2内に封止樹脂6を上部が盛り上がるように充填、硬化させてレンズ形状を形成した構成になっている。このパッケージ構造の光源は、電極3間に通電することで発光素子4を点灯し、発光素子4から発する光の一部は直接出射され、他部は反射凹部4で反射されて出射されるので、発光素子4から発した光を効率よくパッケージ前方に出射できるようになっている。
特開平9−153646号公報
Further, in order to efficiently emit light emitted from the light emitting element forward, it is desirable to provide a reflective recess as shown in FIG. In the package structure of the light emitting element shown in FIG. 4, a package 1 having a mortar-shaped reflective recess 2 and a part of which is provided with an electrode 3 extending into the reflective recess 2 is used. A light emitting element 4 such as an LED is mounted on one electrode 3 in the reflective recess 2, the light emitting element 4 and the other electrode 3 are electrically connected by a gold wire 5, and sealed in the reflective recess 2 The lens 6 is formed by filling and curing the resin 6 so that the upper part is raised. The light source of this package structure turns on the light emitting element 4 by energizing between the electrodes 3, part of the light emitted from the light emitting element 4 is directly emitted, and the other part is reflected by the reflecting recess 4 and emitted. The light emitted from the light emitting element 4 can be emitted to the front of the package efficiently.
JP-A-9-153646

放熱性の良好な基板として、例えば、図5に示すようなホーロー基板9が考えられる。このホーロー基板9は、すり鉢状の反射凹部11が形成されたコア金属7の表面をガラス等からなる薄いホーロー層8で被覆して構成されている。ホーロー層8上には、一部が該反射凹部11内に延設された電極3が設けられている。。
図5に示すような反射凹部11を持つホーロー基板9は、そのコア金属7を反射凹部11の形状となるように加工する必要がある。この加工方法としては、ドリルによる加工、金属プレスによる絞り加工などが挙げられるが、生産性、加工コストに観点から、プレス加工を用いることが望ましい。
As a substrate having good heat dissipation, for example, an enamel substrate 9 as shown in FIG. 5 is conceivable. The enamel substrate 9 is configured by covering the surface of the core metal 7 on which the mortar-shaped reflective recess 11 is formed with a thin enamel layer 8 made of glass or the like. On the enamel layer 8, an electrode 3 partially extending in the reflective recess 11 is provided. .
The enamel substrate 9 having the reflective recesses 11 as shown in FIG. 5 needs to be processed so that the core metal 7 has the shape of the reflective recesses 11. Examples of this processing method include processing using a drill and drawing processing using a metal press. From the viewpoint of productivity and processing cost, it is desirable to use press processing.

しかしながら、金属プレスによる絞り加工を行う場合、コア金属の形状に特に考慮しなかった場合、金属プレスによる押し圧により、基板全体が反ったり、局部的に金属の逃げが発生して膨らみや突起が生じてしまい、これらの修正のために後加工が必要となり、生産効率が悪化する問題があった。図6は、コア金属の絞り加工において生じ易い、膨れや突起を例示する図であり、図6(a)が作製しようとするコア金属7の断面図、(b)は反射凹部11の裏面側に膨れ12が発生した場合を示す断面図、(c)は反射凹部11の周縁が盛り上がって突起13を生じた場合を示す断面図である。これらの膨れ12や突起13を生じ、研削加工などによって修正するには、多くの手間と時間を要する。   However, when drawing with a metal press, if the shape of the core metal is not particularly taken into consideration, the entire substrate may be warped or the metal may escape locally due to the pressing force of the metal press, resulting in bulges and protrusions. As a result, there is a problem that post-processing is necessary for these corrections, and production efficiency deteriorates. 6A and 6B are diagrams illustrating bulges and protrusions that are likely to occur in the drawing process of the core metal. FIG. 6A is a cross-sectional view of the core metal 7 to be manufactured, and FIG. FIG. 4C is a cross-sectional view showing a case where a bulge 12 is generated, and FIG. It takes a lot of labor and time to generate these blisters 12 and protrusions 13 and correct them by grinding or the like.

本発明は前記事情に鑑みてなされ、反射凹部を有するホーロー基板を効率よく低コストで作製できる反射凹部付きのホーロー基板からなる発光素子実装基板に発光素子を実装してなる光源、該光源を備えた照明装置、表示装置及び交通信号機の提供を目的とする。   The present invention has been made in view of the above circumstances, and includes a light source formed by mounting a light emitting element on a light emitting element mounting substrate made of a hollow substrate with a reflective recess, which can efficiently produce a hollow substrate having a reflective recess at low cost, and the light source. An object is to provide a lighting device, a display device and a traffic signal.

前記目的を達成するため、本発明は、コア金属と、該コア金属の表面を被覆するホーロー層と、該ホーロー層の表面に形成された電極パターンとからなる発光素子実装用基板と、該発光素子実装用基板に実装された発光素子と、該発光素子を被覆する封止樹脂とからなる光源であって、
前記発光素子は、前記コア金属に凹部を形成することによって設けられた発光素子実装用基板の反射凹部に実装されてなり、
前記反射凹部の周りには、コア金属プレス加工時に発生する応力を緩和するとともに、前記反射凹部に実装した発光素子を封止樹脂で封止する際に該封止樹脂の流出を防止するための溝が形成され、前記反射凹部が円形をなし、前記溝が反射凹部の外周に同心円状に設けられていることを特徴とする光源を提供する。
In order to achieve the above object, the present invention provides a light emitting element mounting substrate comprising a core metal, a hollow layer covering the surface of the core metal, and an electrode pattern formed on the surface of the hollow layer; A light source comprising a light emitting element mounted on an element mounting substrate and a sealing resin covering the light emitting element,
The light emitting element is mounted in a reflective recess of a light emitting element mounting substrate provided by forming a recess in the core metal,
Around the reflective recess, the stress generated during core metal pressing is relaxed, and the sealing resin is prevented from flowing out when the light emitting element mounted on the reflective recess is sealed with the sealing resin. There is provided a light source characterized in that a groove is formed , the reflecting recess is circular, and the groove is provided concentrically on the outer periphery of the reflecting recess .

本発明の光源において、周囲に前記溝を有する前記反射凹部が前記発光素子実装用基板上に複数設けられていることが好ましい。 In the light source of the present invention, it is preferable that a plurality of the reflective recesses having the groove around are provided on the light emitting element mounting substrate .

本発明の光源において、前記封止樹脂の上部がレンズ形状に突出していることが好ましい。   In the light source of the present invention, it is preferable that an upper portion of the sealing resin protrudes in a lens shape.

また本発明は、コア金属を用意し、該コア金属の反射凹部を形成する予定位置の外周に、ドリル加工により、コア金属プレス加工時に発生する応力を緩和するとともに、前記反射凹部に実装した発光素子を封止樹脂で封止する際に該封止樹脂の流出を防止するための溝を同心円状に形成し、
次いで、該コア金属にプレス加工を施して円形の反射凹部を形成し、
次いで、該コア基板の表面にホーロー層を形成してホーロー基板を作製し、
次いで、該ホーロー基板の表面に電極パターンを形成して発光素子実装用基板を作製し、
次いで、該発光素子実装用基板の反射凹部に発光素子を実装し、
次いで、反射凹部内に実装された発光素子を樹脂で封止し、前述した本発明に係る光源を得ることを特徴とする光源の製造方法を提供する。
In addition, the present invention provides a core metal, and reduces the stress generated at the time of core metal pressing by drilling on the outer periphery of the position where the reflective recess of the core metal is to be formed, and the light emitting device mounted on the reflective recess. When the element is sealed with a sealing resin, a groove for preventing the sealing resin from flowing out is formed concentrically .
Next, the core metal is pressed to form a circular reflective recess,
Next, a hollow substrate is formed by forming a hollow layer on the surface of the core substrate,
Next, an electrode pattern is formed on the surface of the hollow substrate to produce a light emitting element mounting substrate,
Next, the light emitting element is mounted in the reflective recess of the light emitting element mounting substrate,
Next, the light emitting device mounted in the reflective recess is sealed with a resin, and the above-described light source manufacturing method is provided.

また本発明は、前述した本発明に係る光源を有していることを特徴とする照明装置を提供する。   Moreover, this invention provides the illuminating device characterized by having the light source which concerns on this invention mentioned above.

また本発明は、前述した本発明に係る光源を有していることを特徴とする表示装置を提供する。   The present invention also provides a display device comprising the light source according to the present invention described above.

また本発明は、前述した本発明に係る光源を有していることを特徴とする交通信号機を提供する。   Moreover, this invention provides the traffic signal characterized by having the light source which concerns on this invention mentioned above.

本発明の光源は、発光素子を実装する反射凹部の周りに溝を形成したホーロー基板を用いているので、金属プレスによる絞り加工でコア金属を作製した場合、コア金属が反ったり、変形することなく反射凹部を形成することができ、変形等を修正するための後加工を行う必要がなくなり、効率よく安価に基板を作製することができる。
また、反射凹部の周りに溝を形成したので、封止樹脂を多量に塗布してしまった場合でも、基板の外側まで樹脂が流出せず、流出した樹脂によって電極表面に電気絶縁膜が形成される不具合を防ぐことができる。
また、コアが金属であるホーロー基板に発光素子を実装する構造としたので、放熱性が良好となり、多数の発光素子を実装した場合、発光素子1個あたりに通電する電力量を増やした場合でも、温度上昇による発光効率の低下を抑制でき、発光強度を期待通りに向上させることができる。
Since the light source of the present invention uses a hollow substrate in which a groove is formed around the reflective recess for mounting the light emitting element, when the core metal is produced by drawing with a metal press, the core metal is warped or deformed. Therefore, it is possible to form a reflective concave portion without the need for post-processing for correcting deformation and the like, and it is possible to manufacture a substrate efficiently and inexpensively.
In addition, since a groove is formed around the reflective recess, even if a large amount of sealing resin is applied, the resin does not flow out to the outside of the substrate, and an electric insulating film is formed on the electrode surface by the flowed resin. Can be prevented.
In addition, since the structure is such that the light emitting element is mounted on the hollow substrate whose core is a metal, the heat dissipation is good, even when a large number of light emitting elements are mounted, even when the amount of power to be energized per light emitting element is increased. Therefore, it is possible to suppress a decrease in light emission efficiency due to a temperature rise, and to improve the light emission intensity as expected.

以下、図面を参照して本発明の実施形態を説明する。
図1〜図3は、本発明の一実施形態を示す図であり、図1は、本発明の光源に用いられるコア金属21の一例を示し、図1(a)はコア金属21の側面図、(b)は平面図である。図2は、本発明の光源に用いられる発光素子実装用基板20の一例を示す断面図である。また図3は、図2に示す発光素子実装用基板20に発光素子29を実装して構成された本発明の光源28の一例を示す断面図である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1-3 is a figure which shows one Embodiment of this invention, FIG. 1 shows an example of the core metal 21 used for the light source of this invention, Fig.1 (a) is a side view of the core metal 21 , (B) is a plan view. FIG. 2 is a cross-sectional view showing an example of the light emitting element mounting substrate 20 used in the light source of the present invention. 3 is a cross-sectional view showing an example of the light source 28 of the present invention configured by mounting the light emitting element 29 on the light emitting element mounting substrate 20 shown in FIG.

本発明の光源に用いられる発光素子実装用基板20は、一方の面側に発光素子29の実装位置となる反射凹部23と、その周囲に溝24が設けられた図1に示すコア金属21の表面に、ホーロー層22を被覆してなるホーロー基板を主体とし、このホーロー基板の一方の面側に、一部が反射凹部23に延設されている一対の電極27を設けた構成になっている。   The light emitting element mounting substrate 20 used for the light source of the present invention has a reflective recess 23 which is a mounting position of the light emitting element 29 on one surface side, and a core metal 21 shown in FIG. The surface is mainly composed of an enamel substrate that covers the enamel layer 22, and a pair of electrodes 27 that are partially extended to the reflective recesses 23 are provided on one surface side of the enamel substrate. Yes.

この発光素子実装用基板20に形成された反射凹部23は、すり鉢状をなしており、発光素子29が実装される平坦な底面25と、その周縁のテーパ面26とを有している。
また、反射凹部23の周囲に設けられた溝24は、本例示にあっては反射凹部23の外周に同心円状に設けられている。
The reflective recess 23 formed in the light emitting element mounting substrate 20 has a mortar shape, and has a flat bottom surface 25 on which the light emitting element 29 is mounted, and a tapered surface 26 on the periphery thereof.
Moreover, the groove | channel 24 provided in the circumference | surroundings of the reflective recessed part 23 is concentrically provided in the outer periphery of the reflective recessed part 23 in this illustration.

コア金属21の材質は、熱伝導率がよく、ホーロー層22を強固に焼き付けることができる金属材料が好ましく、例えば、低炭素鋼板などが望ましい。
また、ホーロー層22の材質は、コア金属21の表面に薄く焼き付けることができ、十分な電気絶縁性が得られる材料が好ましく、例えば、ガラスなどが望ましい。
The material of the core metal 21 is preferably a metal material having good thermal conductivity and capable of firmly baking the enamel layer 22, for example, a low carbon steel plate.
Moreover, the material of the enamel layer 22 is preferably a material that can be thinly baked on the surface of the core metal 21 and can obtain sufficient electrical insulation, and for example, glass is desirable.

図3に示す光源28は、前述した発光素子実装用基板20を用い、その反射凹部23の底面25上に延設された一方の電極27の上にダイボンドなどによって発光素子29を実装し、発光素子29と他方の電極27とを金線30で接続し、さらに上部が盛り上がった状態で反射凹部23内を封止樹脂31で封止した構成になっている。   The light source 28 shown in FIG. 3 uses the light emitting element mounting substrate 20 described above, and a light emitting element 29 is mounted on one electrode 27 extended on the bottom surface 25 of the reflective recess 23 by die bonding or the like. The element 29 and the other electrode 27 are connected by a gold wire 30, and the inside of the reflective recess 23 is sealed with a sealing resin 31 with the upper part raised.

発光素子29は、窒化化合物半導体のような青色発光素子、緑色発光素子でもよく、GaPで代表されるような赤色、赤外発光素子でもよい。また、窒化化合物半導体のような青色発光素子を実装し、封止樹脂31中に、例えばセリウムを賦活したイットリウム・アルミニウム・ガーネット蛍光体のような青色励起の黄色発光蛍光体を分散させて、白色LEDとしてもよい。   The light emitting element 29 may be a blue light emitting element or a green light emitting element such as a nitride compound semiconductor, or may be a red or infrared light emitting element represented by GaP. Also, a blue light emitting element such as a nitride compound semiconductor is mounted, and a blue excited yellow light emitting phosphor such as yttrium, aluminum, and garnet phosphor activated with cerium is dispersed in the sealing resin 31 to obtain a white color. It is good also as LED.

次に、本発明の光源の製造方法の一例を説明する。
まず、コア金属21とする金属板に、反射凹部23の形成位置の周りに溝24を形成する。この溝24は、ドリル加工により形成する。
次に、前記金属板に、金属プレスによる絞り加工を施し、反射凹部23を形成して図1に示す形状のコア金属21を作製する。
Next, an example of the manufacturing method of the light source of this invention is demonstrated.
First, the groove 24 is formed around the position where the reflective recess 23 is formed in the metal plate used as the core metal 21. The groove 24 is formed by drilling.
Next, the metal plate is subjected to a drawing process using a metal press to form a reflective recess 23 to produce the core metal 21 having the shape shown in FIG.

反射凹部23形成位置の外周に溝24をあらかじめ設けておくことで、金属プレスによる絞り加工によって金属板に反射凹部23を形成する際、押し圧で反射凹部23を作製した時に発生する応力が、前記の溝24の方向に発生するため、金属板全体が反ったり、金属板の一部が膨らむことが抑制される。   By providing the groove 24 in the outer periphery of the position where the reflective recess 23 is formed in advance, when the reflective recess 23 is formed on the metal plate by drawing with a metal press, the stress generated when the reflective recess 23 is produced by pressing pressure is Since it occurs in the direction of the groove 24, it is possible to prevent the entire metal plate from being warped or part of the metal plate from expanding.

また、溝24の幅を広めに取っておくことにより、絞り加工後に金属が逃げ込んだあとも一定量の幅の溝24が残る。この溝24が残存した状態で、基板表面をホーロー処理し、さらに電極を形成して発光素子実装用基板20を用いて光源28を作製する際に、封止樹脂31が反射凹部23から流出しても、これを溝24で止めて他部への樹脂流出を防ぐことができる。   Also, by keeping the width of the groove 24 wider, the groove 24 with a certain amount of width remains even after the metal escapes after the drawing process. When the groove 24 remains, the substrate surface is enameled, and electrodes are formed. When the light source 28 is manufactured using the light emitting element mounting substrate 20, the sealing resin 31 flows out of the reflective recess 23. However, this can be stopped by the groove 24 to prevent the resin from flowing out to other parts.

次に、前記コア金属1の表面にガラスを焼き付け、コア金属21表面をホーロー層22で被覆してホーロー基板とする。ホーロー層22形成方法としては、例えば、ガラス粉末を2−プロパノールのような適当な分散媒に分散させ、その分散媒質中に前記コア金属21を入れ、さらに対極となる電極を該分散媒中に挿入配置し、コア金属21と対極間に通電することにより、ガラス粉末をコア金属21表面に電着する。その後、ガラス電着後のコア金属21を引き上げ、乾燥し、高温の焼付炉に入れて加熱し、ガラスを焼き付けることにより、コア金属21表面に緻密で均一な薄いホーロー層22を形成することができる。さらにホーロー層22を強固に被覆するために、前記コア金属21の表面を酸化処理させておいても良い。   Next, glass is baked on the surface of the core metal 1, and the surface of the core metal 21 is covered with the enamel layer 22 to form an enamel substrate. As a method for forming the enamel layer 22, for example, glass powder is dispersed in a suitable dispersion medium such as 2-propanol, the core metal 21 is placed in the dispersion medium, and an electrode serving as a counter electrode is placed in the dispersion medium. The glass powder is electrodeposited on the surface of the core metal 21 by being inserted and disposed and energized between the core metal 21 and the counter electrode. Thereafter, the core metal 21 after the electrodeposition of the glass is pulled up, dried, put in a high-temperature baking furnace, heated, and the glass is baked to form a dense and uniform thin enamel layer 22 on the surface of the core metal 21. it can. Furthermore, in order to coat the enamel layer 22 firmly, the surface of the core metal 21 may be oxidized.

次に、前記の通り作製したホーロー基板の表面に、発光素子29に電力供給を行うための一対の電極27を作製する。この電極27は、図2に示すように、一部が反射凹部23内に延設されるようなパターンに沿って銀ペースト又は銅ペーストを塗布し、その後焼き付けて作製することが望ましい。これによって図2に示す発光素子実装用基板20が作製される。   Next, a pair of electrodes 27 for supplying power to the light emitting element 29 is formed on the surface of the enamel substrate manufactured as described above. As shown in FIG. 2, the electrode 27 is preferably manufactured by applying a silver paste or a copper paste along a pattern such that a part of the electrode 27 extends into the reflective recess 23 and then baking the paste. Thus, the light emitting element mounting substrate 20 shown in FIG. 2 is manufactured.

次に、発光素子29を銀ペーストにより反射凹部23内の一方の電極27上にダイボンドし、さらに、ワイヤボンディングを行って発光素子29と他方の電極27とを金線30で接続する。その後、反射凹部23内に、その上部が表面張力で十分盛り上がるまで封止樹脂、例えば、熱硬化性エポキシ樹脂を注入し、その形状を保ったまま硬化させ、レンズ形状を持つ封止樹脂31を形成する。これによって、図3に示す光源28が作製される。   Next, the light emitting element 29 is die-bonded on one electrode 27 in the reflective recess 23 with silver paste, and further, wire bonding is performed to connect the light emitting element 29 and the other electrode 27 with the gold wire 30. Thereafter, a sealing resin, for example, a thermosetting epoxy resin, is injected into the reflective recess 23 until the upper part is sufficiently raised by the surface tension, and is cured while maintaining its shape. Form. Thereby, the light source 28 shown in FIG. 3 is produced.

本実施形態の発光素子実装用基板20は、発光素子29を実装する反射凹部23の周りに溝24を形成したホーロー基板を用いているので、金属プレスによる絞り加工でコア金属21を作製した場合、コア金属21が反ったり、変形することなく反射凹部23を形成することができ、変形等を修正するための後加工を行う必要がなくなり、効率よく安価に基板を作製することができる。
また、反射凹部23の周りに溝24を形成したので、封止樹脂31を多量に塗布してしまった場合でも、基板の外側まで樹脂が流出せず、流出した樹脂によって電極表面に電気絶縁膜が形成される不具合を防ぐことができる。
また、コアが金属であるホーロー基板に発光素子29を実装する構造としたので、放熱性が良好となり、多数の発光素子を実装した場合、発光素子1個あたりに通電する電力量を増やした場合でも、温度上昇による発光効率の低下を抑制でき、発光強度を期待通りに向上させることができる。
Since the light emitting element mounting substrate 20 of the present embodiment uses a hollow substrate having grooves 24 formed around the reflective recesses 23 for mounting the light emitting elements 29, the core metal 21 is produced by drawing with a metal press. The reflective recess 23 can be formed without the core metal 21 being warped or deformed, and there is no need to perform post-processing for correcting the deformation or the like, and the substrate can be produced efficiently and inexpensively.
Further, since the grooves 24 are formed around the reflective recesses 23, even when a large amount of the sealing resin 31 is applied, the resin does not flow out to the outside of the substrate, and the electrically insulating film is formed on the electrode surface by the discharged resin. It is possible to prevent the problem that the is formed.
In addition, since the light emitting element 29 is mounted on a hollow substrate whose core is a metal, the heat dissipation is improved, and when a large number of light emitting elements are mounted, the amount of power to be energized per light emitting element is increased. However, a decrease in light emission efficiency due to a temperature rise can be suppressed, and the light emission intensity can be improved as expected.

なお、前述した例示では、プレス加工(絞り加工)を前提として説明したが、ドリル加工などの他の機械加工によってコア金属に反射凹部を形成する場合でも、反射凹部の周囲に溝を設けることにより、封止樹脂でレンズ体を形成する場合の樹脂の流出防止に効果があることは言うまでもない。
また、前述した例示では、ホーロー基板に1個の反射凹部を作製した場合について説明したが、周囲に溝を持つ反射凹部をホーロー基板上に複数個設けてもよい。
In the above-described example, the description has been made on the premise of press working (drawing). However, even when the reflective recess is formed in the core metal by other machining such as drilling, a groove is provided around the reflective recess. Needless to say, it is effective in preventing the resin from flowing out when the lens body is formed of the sealing resin.
Further, in the above-described example, the case where one reflecting recess is formed on the enamel substrate has been described, but a plurality of reflecting recesses having grooves around may be provided on the enamel substrate.

1.5mm厚の低炭素鋼板に、金属プレスによる絞り加工により反射凹部を形成する予定の位置の周縁部に円形状の溝をドリルにより作製した。寸法は内周φ10mm、外周φ12mm、深さ0.5mmとなるように加工した。その後金属プレス加工により、図1に示すような形状となるよう金属板の打ち抜き、反射凹部の成型を行った。コア金属のサイズは、15×15mmとし、反射凹部の寸法は、深さ0.6mm、底面φ2.1mm、テーパ面の傾斜角度45°となるように作製した。その結果、反射凹部についてはほぼ設計通りの寸法が得られ、溝は当初2mmの幅が平均で0.8mm程度と小さくなったことを確認した。   A circular groove was formed on a peripheral edge at a position where a reflective concave portion was to be formed on a 1.5 mm-thick low carbon steel plate by drawing with a metal press. The dimensions were processed so that the inner diameter was 10 mm, the outer diameter was 12 mm, and the depth was 0.5 mm. Thereafter, a metal plate was punched out and a reflective recess was formed by metal pressing so as to have a shape as shown in FIG. The size of the core metal was 15 × 15 mm, and the dimensions of the reflective recess were made such that the depth was 0.6 mm, the bottom surface was φ2.1 mm, and the inclination angle of the tapered surface was 45 °. As a result, it was confirmed that the dimensions of the reflective recess were almost as designed, and the width of the groove was initially reduced to an average of about 0.8 mm.

本発明の光源に用いられるコア金属の一例を示し、(a)はコア金属の断面図、(b)は平面図である。An example of the core metal used for the light source of this invention is shown, (a) is sectional drawing of a core metal, (b) is a top view. 本発明の光源に用いられる発光素子実装用基板の一例を示す断面図である。It is sectional drawing which shows an example of the light emitting element mounting substrate used for the light source of this invention. 本発明の光源の一例を示す断面図である。It is sectional drawing which shows an example of the light source of this invention. 従来の発光素子のパッケージ構造を例示する断面図である。It is sectional drawing which illustrates the package structure of the conventional light emitting element. ホーロー基板の一例を示す断面図である。It is sectional drawing which shows an example of an enamel substrate. コア金属の加工時に生じる膨らみや突起を例示する断面図である。It is sectional drawing which illustrates the swelling and protrusion which arise at the time of processing of a core metal.

符号の説明Explanation of symbols

20…発光素子実装用基板、21…コア金属、22…ホーロー層、23…反射凹部、24…溝、25…底面、26…テーパ面、27…電極、28…光源、29…発光素子、30…金線、31…封止樹脂。   DESCRIPTION OF SYMBOLS 20 ... Light emitting element mounting substrate, 21 ... Core metal, 22 ... Hollow layer, 23 ... Reflective recess, 24 ... Groove, 25 ... Bottom surface, 26 ... Tapered surface, 27 ... Electrode, 28 ... Light source, 29 ... Light emitting element, 30 ... gold wire, 31 ... sealing resin.

Claims (7)

コア金属と、該コア金属の表面を被覆するホーロー層と、該ホーロー層の表面に形成された電極パターンとからなる発光素子実装用基板と、該発光素子実装用基板に実装された発光素子と、該発光素子を被覆する封止樹脂とからなる光源であって、
前記発光素子は、前記コア金属に凹部を形成することによって設けられた発光素子実装用基板の反射凹部に実装されてなり、
前記反射凹部の周りには、コア金属プレス加工時に発生する応力を緩和するとともに、前記反射凹部に実装した発光素子を封止樹脂で封止する際に該封止樹脂の流出を防止するための溝が形成され
前記反射凹部が円形をなし、前記溝が反射凹部の外周に同心円状に設けられていることを特徴とする光源。
A light emitting element mounting substrate comprising a core metal, a hollow layer covering the surface of the core metal, and an electrode pattern formed on the surface of the enamel layer; and a light emitting element mounted on the light emitting element mounting substrate; A light source comprising a sealing resin covering the light emitting element,
The light emitting element is mounted in a reflective recess of a light emitting element mounting substrate provided by forming a recess in the core metal,
Around the reflective recess, the stress generated during core metal pressing is relaxed, and the sealing resin is prevented from flowing out when the light emitting element mounted on the reflective recess is sealed with the sealing resin. Grooves are formed ,
The light source, wherein the reflective recess is circular and the groove is provided concentrically on the outer periphery of the reflective recess .
周囲に前記溝を有する前記反射凹部が前記発光素子実装用基板上に複数設けられていることを特徴とする請求項1に記載の光源。 2. The light source according to claim 1, wherein a plurality of the reflective recesses having the groove around are provided on the light emitting element mounting substrate . 前記封止樹脂の上部がレンズ形状に突出していることを特徴とする請求項1又は2に記載の光源。   The light source according to claim 1, wherein an upper portion of the sealing resin protrudes in a lens shape. コア金属を用意し、該コア金属の反射凹部を形成する予定位置の外周に、ドリル加工により、コア金属プレス加工時に発生する応力を緩和するとともに、前記反射凹部に実装した発光素子を封止樹脂で封止する際に該封止樹脂の流出を防止するための溝を同心円状に形成し、
次いで、該コア金属にプレス加工を施して円形の反射凹部を形成し、
次いで、該コア基板の表面にホーロー層を形成してホーロー基板を作製し、
次いで、該ホーロー基板の表面に電極パターンを形成して発光素子実装用基板を作製し、
次いで、該発光素子実装用基板の反射凹部に発光素子を実装し、
次いで、反射凹部内に実装された発光素子を樹脂で封止し、請求項1〜3のいずれか一項に記載の光源を得ることを特徴とする光源の製造方法。
The core metal is prepared, and the stress generated during the core metal press processing is reduced by drilling on the outer periphery of the position where the core metal reflective recess is to be formed, and the light emitting element mounted in the reflective recess is sealed with resin Forming a groove to prevent the sealing resin from flowing out concentrically when sealing with,
Next, the core metal is pressed to form a circular reflective recess,
Next, a hollow substrate is formed by forming a hollow layer on the surface of the core substrate,
Next, an electrode pattern is formed on the surface of the hollow substrate to produce a light emitting element mounting substrate,
Next, the light emitting element is mounted in the reflective recess of the light emitting element mounting substrate,
Then, the light emitting element mounted in the reflective recessed part is sealed with resin, and the light source manufacturing method characterized by obtaining the light source as described in any one of Claims 1-3.
請求項1〜3のいずれか一項に記載の光源を有していることを特徴とする照明装置。 It has the light source as described in any one of Claims 1-3, The illuminating device characterized by the above-mentioned. 請求項1〜3のいずれか一項に記載の光源を有していることを特徴とする表示装置。 Display device, characterized in that a light source according to any one of claims 1 to 3. 請求項1〜3のいずれか一項に記載の光源を有していることを特徴とする交通信号機。 Traffic signal, characterized in that it has a light source according to any one of claims 1 to 3.
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