JP4853760B2 - IC card, IC card manufacturing method, and IC card manufacturing apparatus - Google Patents

Description

  The present invention relates to an IC card that transmits and receives data to and from an external device, an IC card manufacturing method, and an IC card manufacturing apparatus.

  In recent years, IC cards that transmit and receive data without contact with external devices such as readers and writers are widely used. In general, an IC card includes an IC card base material having an antenna circuit having connection terminals, and an IC module having an IC circuit connected to the antenna circuit (for example, Patent Document 1).

  Further, IC cards that have external terminals and can exchange data with external devices not only in a non-contact state but also in a contact state have become widespread. Such an IC card is sometimes called a “two-way card”, “dual card”, or “hybrid card”.

In such an IC card, the antenna circuit and the IC module are not in direct contact due to manufacturing conditions and the like, but mainly through silver paste or anisotropic conductive adhesive. Electrically connected.
JP-A-9-123654

  By the way, when silver paste or anisotropic conductive adhesive is used, the antenna circuit and the IC module are dispersed in a binder made of non-conductive resin of silver paste or anisotropic conductive adhesive or the like. It is electrically connected through conductive particles. That is, the antenna circuit and the IC module are electrically connected by point contact via conductive particles, including an interface with silver paste, anisotropic conductive adhesive, and the like. When the antenna circuit and the IC module are electrically connected by such point contact, the connection resistance value between the antenna circuit and the IC module may increase, and generally, the connection resistance The dispersion of values will increase.

  The present invention has been made in consideration of such points, and an IC capable of stably manufacturing a high-quality IC card in which an antenna circuit and an IC module are electrically connected with a low connection resistance value. It is an object of the present invention to provide a card manufacturing method, an IC card manufacturing apparatus, and a high-quality and highly reliable IC card in which an antenna circuit and an IC module are electrically connected with a low connection resistance value.

  The present invention provides an IC module having a connection electrode in a concave portion of an IC card substrate having an antenna circuit having a connection terminal and having a concave portion in which at least a part of the connection terminal is exposed. The step of arranging the conductive material pieces provided on the connection terminals so as to face each other, and applying the ultrasonic vibration to the IC module arranged in the recess to electrically connect the antenna circuit and the IC module. An IC card manufacturing method comprising the steps of: According to the present invention as described above, the oxide film formed on the connection terminal, the conductive material piece, or the connection electrode can be largely removed, thereby reducing the connection resistance value between the IC module and the antenna. A reduced high quality IC card can be manufactured stably. Also, by adjusting the amplitude and time of the ultrasonic vibration, ultrasonic waves can be applied between one or both of the connection terminal of the antenna circuit and the conductive material piece and the conductive material piece and the connection electrode. Thus, the connection resistance value between the IC module and the antenna can be further reduced. Furthermore, by adjusting the conditions of the ultrasonic vibration and the shape of the IC module and the recess, the bottom surface portion of the recess and the portion facing the bottom surface portion of the IC module can be ultrasonically bonded. The IC module can be fixed in the concave portion of the base material for the IC card while being electrically connected to the antenna circuit.

  Such an IC card manufacturing method applies ultrasonic vibration to the conductive material piece while bringing the connection terminal exposed in the concave portion into contact with the conductive material piece before the step of placing the IC module in the concave portion. The step of electrically connecting the connection terminal and the conductive material piece may be further provided, or before the step of disposing the IC module in the recess, the connection electrode of the IC module The method may further include a step of electrically connecting the connection electrode and the conductive material piece by applying ultrasonic vibration to the IC module or the conductive material piece while contacting the conductive material piece. . According to the present invention, the oxide film formed on the connection terminal, the conductive material piece, or the connection electrode can be more significantly removed. It is also possible to reliably ultrasonically bond between the connection terminal of the antenna circuit and the conductive material piece and between the conductive material piece and the connection electrode. As a result, a high-quality IC card in which the connection resistance value between the IC module and the antenna is further reduced can be manufactured more stably.

  In addition, such a method of manufacturing an IC card is provided in a recess before an IC module is disposed, a conductive material piece before being disposed in the recess, or an IC module before being disposed in the recess. You may make it further provide the process of supplying an adhesive agent. According to the present invention as described above, the IC module can be firmly fixed in the recess of the IC card base material. Therefore, during the subsequent manufacturing process or use of the manufactured IC card, the IC module can be removed from the concave portion of the base material for the IC card, and further, the electrical connection between the IC module and the antenna circuit is impaired. This can be remarkably suppressed.

  The present invention provides an IC module having a connection electrode in a concave portion of an IC card substrate having an antenna circuit having a connection terminal and having a concave portion in which at least a part of the connection terminal is exposed. The antenna circuit and the IC module are electrically connected by applying ultrasonic vibration to the IC module disposed in the recess and the means disposed so as to face the conductive material piece provided on the connection terminal. And an IC card manufacturing apparatus. According to the present invention as described above, the oxide film formed on the connection terminal, the conductive material piece, or the connection electrode can be largely removed, thereby reducing the connection resistance value between the IC module and the antenna. A reduced high quality IC card can be manufactured stably. Also, by adjusting the amplitude and time of the ultrasonic vibration, ultrasonic waves can be applied between one or both of the connection terminal of the antenna circuit and the conductive material piece and the conductive material piece and the connection electrode. Thus, the connection resistance value between the IC module and the antenna can be further reduced. Furthermore, by adjusting the conditions of the ultrasonic vibration and the shape of the IC module and the recess, the bottom surface portion of the recess and the portion facing the bottom surface portion of the IC module can be ultrasonically bonded. The IC module can be fixed in the concave portion of the base material for the IC card while being electrically connected to the antenna circuit.

  Such an IC card manufacturing apparatus applies ultrasonic vibration to the conductive material piece while bringing the connection terminal exposed in the recess and the conductive material piece into contact with each other to electrically connect the connection terminal and the conductive material piece. Or a means for connecting to the IC module or the conductive material piece while contacting the connection electrode of the IC module and the conductive material piece, and applying ultrasonic vibration to the IC module or the conductive material piece, Means for electrically connecting the connection electrode and the conductive material piece may be further provided. According to the present invention, the oxide film formed on the connection terminal, the conductive material piece, or the connection electrode can be more significantly removed. It is also possible to reliably ultrasonically bond between the connection terminal of the antenna circuit and the conductive material piece and between the conductive material piece and the connection electrode. As a result, a high-quality IC card in which the connection resistance value between the IC module and the antenna is further reduced can be manufactured more stably.

  In addition, in such an IC card manufacturing apparatus, in the concave portion before the IC module is arranged, the conductive material piece before being arranged in the concave portion, or the IC module before being arranged in the concave portion, You may make it further provide the means to supply an adhesive agent. According to the present invention as described above, the IC module can be firmly fixed in the recess of the IC card base material. Therefore, during the subsequent manufacturing process or use of the manufactured IC card, the IC module can be removed from the concave portion of the base material for the IC card, and further, the electrical connection between the IC module and the antenna circuit is impaired. This can be remarkably suppressed.

  The present invention provides an IC card substrate having an antenna circuit having a connection terminal and having a recess in which at least a portion of the connection terminal is exposed, and a connection terminal and a surface that are disposed in the recess and exposed in the recess An IC card comprising: a contacted conductive material piece; and an IC module having a connection electrode disposed in a recess and in surface contact with the conductive material piece. According to the present invention, since the connection electrode and the conductive material piece and the conductive material piece and the connection terminal are electrically connected by surface contact, the IC module and the antenna circuit are connected to each other. It becomes a high quality IC card in which the connection resistance value between them is greatly reduced.

  In such an IC card, at least one of the connection terminal and the conductive material piece and / or the conductive material piece and the connection terminal may be ultrasonically bonded. According to the present invention as described above, a higher quality IC card is obtained in which the connection resistance value between the IC module and the antenna circuit is further greatly reduced.

  Moreover, in such an IC card, the IC module may be fixed in the recess of the IC card substrate via an adhesive. According to the present invention, the IC module can be removed from the concave portion of the base material for the IC card during use and the electrical connection between the IC module and the antenna circuit is greatly impaired. It is suppressed. In this case, it is preferable that an adhesive is provided around the conductive material piece. According to the present invention, the relative positions of the connection electrode, the conductive material piece, and the connection terminal are firmly fixed, and the electrical connection between the IC module and the antenna circuit can be firmly maintained.

  Furthermore, in such an IC card, the bottom surface portion of the recess and the portion facing the bottom surface portion of the IC module may be ultrasonically bonded. According to the present invention, the IC module is firmly fixed in the recess of the IC card substrate, and the IC module can be removed from the recess of the IC card substrate during use. Is greatly suppressed from damaging the electrical connection between the IC module and the antenna circuit.

  According to the present invention, it is possible to stably manufacture a high-quality IC card in which an antenna circuit and an IC module are electrically connected with a low connection resistance value.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 10 are views showing an embodiment of an IC card, an IC card manufacturing method, and an IC card manufacturing apparatus according to the present invention. 1 is a perspective view showing an IC card, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, and FIG. 3 is a perspective view showing a base material for IC card. FIG. 5 is a schematic configuration diagram showing an IC card manufacturing apparatus and an IC card manufacturing method, and FIGS. 5 to 10 are cross-sectional views for explaining each step in the IC card manufacturing method together with the manufacturing apparatus.

<IC card>
First, the IC card 10 according to the present embodiment will be described mainly with reference to FIGS.

  As shown in FIGS. 1 to 3, the IC card 10 includes an antenna circuit 34 having a connection terminal 34 a, and an IC card substrate 20 having a recess 22 in which a part of the connection terminal 34 a is exposed, A conductive material piece (also referred to as a conductive shim) 19 disposed in contact with the connection terminal 34a and electrically connected to the connection terminal 34a, and disposed in the recess 22 and electrically connected to the conductive material piece 19 IC module 11. Such an IC card 10 can communicate with an external device (reader / writer, etc.) not shown in a non-contact manner, reads information stored in the IC module 11 from the external device, or sends new information to the IC module 11. Can be written. As will be described later, in the present embodiment, the IC module 11 is provided with an external terminal 13a (FIGS. 1 and 2), and the IC card 10 and the external device are in contact with each other via the external terminal 13a. It is also possible to send and receive information to and from the device.

  As shown in FIG. 2, in the present embodiment, the IC card substrate 20 includes a first plate-like member 40 and a second plate-like member 30 laminated on the upper side of the first plate-like member 40. And a third plate member laminated on the upper side of the second plate member 30, and the antenna circuit 34 is formed in advance on the second plate member 30. Various methods can be used for stacking the plate-like members 40, 30, 46. In the present embodiment, as can be understood from FIG. 2, adhesive layers 25 and 28 made of a polyester-based thermoplastic resin are provided between the plate-like members 40, 30, and 46 and subjected to thermocompression treatment. Each plate-like member is bonded and fixed to an adjacent plate-like member. However, such an aspect is an example, and is not limited to this.

  The first to third plate-like members 40, 30, and 46 are generally made of white PET or paper and are non-conductive. On the other hand, the antenna circuit 34 functions as an antenna when communicating with an external device in a non-contact state, and is made of a conductive material such as copper or aluminum.

  As shown in FIG. 3, the IC card substrate 20 has a recess 22 formed therein. As will be described in detail later with reference to FIG. 6, the recess 22 has a through-hole 48 in the third plate-like member 46, a through-hole 32 in the second plate-like member 30, and a first plate-like formed by cutting. It is constituted by the opening hole 42 of the member 40. 2, the through hole 48 of the third plate member 46, the through hole 32 of the second plate member 30, and the opening hole 42 of the first plate member 40 are combined to form an IC. The module 11 can be accommodated.

  In the present embodiment, the antenna circuit 34 takes the form of a coiled antenna, as shown in FIG. 3, and both ends of the coiled antenna form a pair of connection terminals 34a and 34a. . As shown in FIG. 2, the pair of connection electrodes 34 a, 34 a faces and contacts a pair of conductive material pieces 19, 19 arranged corresponding to each. As shown in FIGS. 2 and 4, the antenna circuit 34 is bonded in advance to the lower surface of the second plate-shaped member 30 via the adhesive layer 24. In such an antenna circuit 34, for example, a conductive metal foil such as copper or aluminum is first laminated on the second plate member 30 via the adhesive layer 24, and then patterned into a desired shape by etching. Is obtained. Here, as the adhesive layer 24, for example, an epoxy-based thermosetting resin can be used.

  Incidentally, the adhesive layer 24 is also provided on the upper surface of the second plate-shaped member 30 (FIGS. 2 and 4). In forming the antenna circuit 34, a bridge portion (not shown) made of a conductive metal such as copper or aluminum is provided as necessary so as not to short-circuit the coil portion of the antenna circuit 34. For example, the bridge portion is provided at a portion extending across the coil portion of the antenna circuit 34 to the connection terminal 34a (the connection terminal 34a disposed on the right side in FIG. 3) in FIG. The adhesive layer 24 provided on the upper side surface of the second plate-shaped member 30 bonds the metal foil when forming such a bridge portion on the upper side surface of the second plate-shaped member 30 in the same manner as described above. It is used for this purpose. The formed bridge portion has, for example, a hole penetrating the second plate-shaped member 30 and fills the hole with a conductive material (for example, silver paste) to form a lower surface of the second plate-shaped member 30. It is electrically connected to the antenna circuit 34. The configuration of the bridge portion is not limited to the above-described embodiment. For example, a conductive material (metal foil or the like) is attached to a desired location of the antenna circuit 34 via a non-conductive adhesive. It can be formed by various methods.

  Further, in the present embodiment, the example in which the antenna circuit 34 is formed of a coiled antenna is shown, but the present invention is not limited to this. Depending on the electromagnetic wave used for communication in a non-contact state, for example, an antenna circuit may be configured by a pair of substantially rod-shaped conductors that function as a dipole antenna. In this case, a part of the substantially rod-shaped conductor constitutes a connection terminal 34 a for connection to the IC module 11.

  Next, the IC module 11 will be described with reference to FIG.

  The IC module 11 in the present application is an element connected to the antenna circuit 34 and having a function capable of transmitting and receiving information in a non-contact state with an external device. The IC module 11 in the present embodiment is such It has an IC chip 15 written with a circuit capable of achieving its function. As shown in FIG. 2, the IC module 11 includes a pair of connection electrodes 18 and 18 each having a flat end surface that faces and contacts the pair of conductive material pieces 19 and 19, and the external terminal 13a described above. Is provided on the surface, and further includes a substrate 13 for connecting the external terminal 13a to the IC chip 15 to enable communication in a contact state with an external device. As shown in FIG. 2, the substrate 13 is provided on one side of the IC chip 15 so that the external terminals 13 a are exposed to the outside of the IC card 10. The connection electrode 18 is provided on the surface of the substrate 13 opposite to the surface on which the external terminals 13a are provided.

  As shown in FIG. 2, in order to firmly fix the IC module 11 in the concave portion 22 of the IC card substrate 20, the gap in the concave portion 22, particularly the periphery of the conductive material piece 19, is adhesive 38. Is preferably filled with. In this case, the IC module 11 is detached from the recess 22 of the IC card substrate 20 during use of the IC card 10, and further, the electrical connection between the IC module 11 and the antenna circuit 20 is impaired. Can be remarkably suppressed. Furthermore, in order to ensure the firm fixation of the IC module 11 in the recess 22, the bottom surface portion 22a of the recess 22 and the bottom portion 11a of the IC module 11 facing the bottom surface portion 22a are ultrasonically bonded. Further preferred.

  Next, the pair of conductive material pieces 19 provided corresponding to the pair of connection terminals 34a and 34a will be described.

  In the present embodiment, the conductive material piece 19 is composed of a metal piece. In this case, it is preferable to use copper or aluminum having good conductivity as the material of the metal piece. The pair of conductive material pieces 19 and 19 preferably have a substantially flat plate shape so that they can be stably disposed on the pair of connection terminals 34a exposed in the recess 22, for example, In addition, it is preferably a substantially semi-disc shape or a substantially disc shape having a pair of flat bottom surfaces 19a and 19b at both ends. Such a conductive material piece 19 can be obtained at a low cost, for example, by punching a metal thin plate material.

  As shown in FIG. 2, the bottom surface 19a on one side of the conductive material piece 19 (the lower side of the paper surface in FIG. 2) is in surface contact with and electrically connected to the connection terminal 34a of the antenna circuit 34 (electrical). Connected). Further, the bottom surface 19b on the other side of the conductive material piece 19 (upper side of the drawing in FIG. 2) is in surface contact with and electrically connected (electrically connected) to the connection electrode 18 of the IC module 11. . Due to the surface contact between the conductive material piece 19 and the connection terminal 34a and the connection electrode 18, the antenna circuit 34 and the IC module 11 have a low connection resistance value via the conductive material piece 19 that is conductive per se. It is designed to be electrically connected. Further, in order to further reduce the connection resistance value between the conductive material piece 19 and the antenna circuit 34, the conductive material piece 19 is ultrasonically bonded (metal-to-metal) with the connection terminal 34a and the connection electrode 18. It is preferable.

  By the way, the “surface contact” referred to here does not require that the conductive material piece 19 is in contact with the entire surface facing the connection terminal 34 a and the connection electrode 18. If the two conductive materials are at least partially in contact with each other, the connection resistance value between the two is sufficiently low so that the IC card 10 can fully perform the various functions required. Because it becomes.

  Therefore, fine convex portions may be formed on the bottom surface of the conductive material piece 19 having a substantially semicircular shape or a substantially disk shape, or the bottom surface of the conductive material piece 19 may be roughened. When a convex portion is formed on the bottom surface, or when the bottom surface is roughened, as will be described later, the conductive material piece 19, the connection terminal 34a, and the connection electrode 18 are partially in surface contact. The conductive material piece 19 and the connection terminal 34a and the connection electrode 18 can be electrically connected with a sufficiently low connection resistance value. For example, when the thickness of the conductive material piece 19 itself is about 0.1 to 0.3 mm, the fine convex portion can be about 5 to 50 μm. Thus, if the convex part is fine, it can also be stably arranged on the connection terminal 34a. In addition, such a conductive material piece 19 formed a convex part on the surface of the both sides of a metal thin plate material, for example, by first embossing a metal thin plate material, and this convex part was then formed. It is obtained by stamping a thin metal sheet.

  According to the IC card 10 configured as described above, the information can be obtained by bringing the IC card 10 close to an external device that emits electromagnetic waves for communication, or by physically contacting the IC card 10 with the external device. For example, authentication of the owner of the IC card 10 can be performed. In addition, information can be transmitted / received, for example, data can be written or modified, with the IC card 10 inserted into a slot of an external device and in electrical contact (connection) via the external terminal 34a.

<IC card manufacturing apparatus and manufacturing method>
Next, an IC card manufacturing apparatus 50 and a manufacturing method according to the present embodiment will be described mainly with reference to FIGS.

[Schematic Configuration of IC Card Manufacturing Apparatus 50 and Manufacturing Method]
First, a schematic configuration of an IC card manufacturing apparatus 50 and a manufacturing method will be described.

  As shown in FIG. 4, the IC card manufacturing method manufactures an IC card substrate 20 having an antenna circuit 34 having a connection terminal 34a and having a recess 22 in which at least a part of the connection terminal 34a is exposed. The step of supplying the adhesive 38 into the recess 22 before the IC module 11 and the conductive material piece 19 are disposed, and the inside of the recess 22 so as to face the connection terminal 34 a exposed in the recess 22. The conductive material piece 19 is disposed on the conductive material piece 19 while the conductive material piece 19 is in contact with the connection terminal 34a exposed in the recess 22 and the conductive material piece 19 in contact with the connection terminal 34a. A step of electrically connecting the conductive material piece 19 and a step of supplying an adhesive 38 into the recess 22 before the IC module 11 is arranged and after the conductive material piece 19 is arranged. The step of disposing the IC module 11 in the recess 22 so that the connection electrode 18 and the connection terminal 34a face each other through the conductive material piece 19, and the ultrasonic vibration in the IC module 11 disposed in the recess 22 And electrically connecting the antenna circuit 34 and the IC module 11 to each other.

  On the other hand, the IC card manufacturing apparatus 50 corresponds to the manufacturing method, and has an antenna circuit 34 having a connection terminal 34a and an IC card substrate 20 having a recess 22 in which at least a part of the connection terminal 34a is exposed. Manufacturing apparatus 52, first adhesive supply means 70 for supplying adhesive 38 into recess 22 before IC module 11 and conductive material piece 19 are arranged, and connection terminal 34 a exposed in recess 22. First arrangement means (in this embodiment, also referred to as conductive material piece arrangement means) 74 that arranges the conductive material piece 19 in the recess 22 so as to face each other, and the connection terminal 34a exposed in the recess 22 The first connection means 76 for applying ultrasonic vibration to the conductive material piece 19 while contacting the conductive material piece 19 and the conductive material piece 1 before the IC module 11 is arranged. IC module 11 in such a manner that the second adhesive supply means 82 for supplying the adhesive 38 into the recess 22 after the, is disposed, the connection electrode 18 and the connection terminal 34a face each other through the conductive material piece 19. 2nd arrangement means (also referred to as IC module arrangement means in this embodiment), and second connection means for applying ultrasonic vibration to the IC module 11 arranged in the recess 22 Curing means for curing the adhesive 38.

  Hereinafter, each step will be described in detail.

[Process for producing substrate for IC card]
As shown in FIGS. 4 to 6, the IC card substrate manufacturing apparatus 52 stacks each plate-like member 40, 30, 46 to manufacture the laminate 21, and the laminate 21 is cut. And a cutting means 66 for forming the recess 22 in the laminate 21.

  As shown in FIGS. 4 and 5, in the process of manufacturing the IC card substrate 20, first, the second plate-like member in which the first plate-like member 40 and the antenna circuit 34 are formed using the stacking means 62. The member 30 and the third plate-like member 46 are thermocompression bonded via the adhesive layers 25 and 28 to produce the laminate 21.

  Specifically, first, a second plate member 30 having an antenna circuit 34 having a pair of connection terminals 34a and 34a is prepared. As described above, the first plate-like member 30 has a conductive foil adhered to the first plate-like member 30 via the adhesive layer 24, and then patterned into a desired shape by etching. Can be obtained.

  Next, the first plate-like member 40 is superimposed on the second plate-like member 30 so as to sandwich the antenna circuit 34, and the third plate-like member 46 is provided with the first plate-like member 40 of the second plate-like member 30. Overlay on the side that is not. In addition, an adhesive made of a thermoplastic resin is supplied between the plate-like members 40, 30, 46. As the adhesive, for example, a liquid adhesive or a sheet adhesive can be used.

  As shown in FIG. 4, the first to third plate-like members 40, 30, 46 overlapped in this way are supplied to the stacking means 62. In the present embodiment, the laminating means 62 corresponds to the adhesive supplied between the plate-like members 40, 30, 46 being a thermoplastic adhesive, and is composed of a thermocompression bonding machine 64. The thermocompression bonding machine 64 presses the first to third plate-like members 40, 30, and 46 while heating them. As a result, the adhesive provided between the plate-like members 30, 40, 46 is once melted, and thereafter, the adhesive layers 25, 28 are formed to fuse the plate-like members with each other as the temperature decreases. (Fig. 2).

  Thus, the laminated body 21 is manufactured, and the manufactured laminated body 21 includes the second plate-like member 30, the first plate-like member 40 laminated on the second plate-like member 30, and the second plate-like member. And an antenna circuit 34 having a connection terminal 34 a provided between the first plate-like member 40 and the first plate-like member 40.

  The laminated body 21 has a substantially symmetric layer configuration. Therefore, even if heated by the thermocompression bonding machine 64, the thermal stress generated inside due to thermal expansion is substantially the same on the first plate member 40 side and the third plate member 46 side. For this reason, the bending of the level which causes a malfunction by the thermal stress does not occur in the laminate 21.

  Next, as shown in FIGS. 4 and 6, the recess 22 is formed in the laminate 21 by the cutting means 66.

  In the present embodiment, the cutting means 66 is constituted by a milling machine to which an end mill 68 is attached as a cutting blade. As is well known, when milling using the end mill 68 is performed, the bottom surface of the recess 22 can be made substantially flat.

  The end mill 67 is a portion corresponding to the connection terminal 34 a of the antenna circuit 34, and starts cutting from the surface of the IC card substrate 20 on the second plate member 30 side with the connection terminal 34 a as a reference. That is, as shown in FIG. 6, in the present embodiment, the end mill 68 starts cutting from the third plate-like member 46 side of the IC card substrate 20 and cuts it toward the connection terminal 34a. The through hole 48 is formed in the third plate member 46, the through hole 32 is formed in the second plate member 30, and the opening hole 42 is further formed in the first plate member. In this way, the recess 22 in which the connection terminal 34a is exposed is formed.

  The IC card substrate 20 is manufactured as described above, and the manufactured IC card substrate 20 includes the first plate member 40 and the second plate member laminated on the first plate member 40. 30 and an antenna circuit 34 having a connection terminal 34a provided between the first plate-like member 40 and the second plate-like member 30, and a recess 22 exposing at least a part of the connection terminal 34a is formed. Has been.

  Although the IC card manufacturing method and manufacturing apparatus 50 according to the present embodiment have been described as being incorporated with the IC card base material manufacturing method and manufacturing apparatus 52, the present invention is not limited thereto. It is also possible to omit the IC card substrate manufacturing method and the manufacturing apparatus 52 from the IC card manufacturing method and manufacturing apparatus 50 by obtaining the manufactured IC card substrate 20 and inserting it.

[Step of supplying adhesive into recess, step of disposing conductive material piece in recess, step of applying ultrasonic vibration to conductive material piece]
As shown in FIG. 4, the first adhesive supply means 70 is provided on the downstream side of the IC card substrate manufacturing apparatus 52, and the first placement means 74 is provided on the downstream side of the first adhesive supply means 70. The first ultrasonic vibration applying means 76 is provided on the downstream side of the first arrangement means 74.

  The 1st adhesive supply means 70 can be comprised from the dispenser 72 (FIG. 7) and a screen printer. As shown in FIG. 7, the 1st adhesive supply means 70 supplies the adhesive 38 on the connection terminal 34a in the recessed part 22 of the base material 20 for IC cards. As the adhesive 38, for example, a thermosetting adhesive is used.

  As shown in FIG. 4, the first arrangement means 74 can include, for example, a first suction nozzle (also referred to as a conductive material piece suction nozzle in this embodiment) 75. . The first suction nozzle 75 sucks the supplied conductive material pieces 19 one by one, and conveys the conductive material pieces 19 above the connection terminals 34a in the recess 2 to which the adhesive 38 is supplied. Thereafter, the first suction nozzle 75 is lowered so that the bottom surface 19a on one side of the conductive material piece 19 faces the connection terminal 34a via the adhesive 38 supplied on the flat connection terminal 34a. , Disposed in the recess 22.

  By the way, a parts feeder can be used as the conductive material piece supply means (not shown) for supplying the conductive material pieces 19 to the first arrangement means 74. The parts feeder is a means for aligning a number of workpieces by vibration and supplying the workpieces one by one. On the other hand, as described above, a metal piece or the like having a substantially semicircular shape obtained by punching is used as the conductive material piece 19. If a parts feeder is used, a large number of charged conductive material pieces 19 are dispersed and aligned by vibration, and fine conductive material pieces 19 can be stably and accurately supplied to the suction nozzle 75 one by one. it can.

  In addition, a pair of connecting terminals 34a and 34a are exposed in the recess 22, and in this step, the conductive material piece 19 is disposed on each connecting terminal 34a and 34a. That is, two conductive material pieces 19 and 19 are arranged in one recess 22. Therefore, it is preferable to use two suction nozzles, and further two means for supplying conductive material. In this case, the arrangement of the two conductive material pieces 19 and 19 is advanced simultaneously, which is advantageous in terms of production efficiency. good.

  Further, as shown in FIGS. 4 and 8, the first connecting means 76 of the present embodiment is a pair of first pressing members that press the pair of conductive material pieces 19 and 19 toward the connecting terminals 34a facing each other. Devices (also referred to as pressing devices for conductive material pieces) 80, 80 and a pair of first pressing devices 80, 80, respectively, and a pair of first superstructures for applying ultrasonic vibration to the corresponding first pressing device 80 A sonic horn (also referred to as an ultrasonic applicator for the conductive material piece). As shown in FIG. 8, the first pressing device 80 has a suction hole 81 communicating with a suction device (not shown) so that the conductive material piece 19 can be sucked and held by operating the suction device. It has become.

  In the step of applying ultrasonic vibration to the conductive material piece 19, first, a suction device (not shown) operates, and the first pressing device 80 holds the conductive material piece 19 by suction. Then, the first pressing device 80 presses the conductive material piece 19 adsorbed and held toward the connection terminal 34a. Thus, the adhesive 38 interposed between the conductive material piece 19 and the connection terminal 34a is compressed and pushed away from below the conductive material piece 19, and the bottom surface 19a on one side of the conductive material piece 19 is connected to the connection terminal. It contacts the flat exposed surface of 34a. On the other hand, the pushed-off adhesive 38 spreads into the recess 22, and, for example, as shown in FIG. 8, there is a gap between the conductive material piece 19 and the IC card substrate 20 on the side of the conductive material piece 19. Filled with adhesive 38.

  Next, in this state, the first ultrasonic horn 78 is operated while the conductive material piece 19 is pressed against the connection terminal 34 a by the first pressing device 80, and the conductive material piece 19 is superposed on the conductive material piece 19 via the first pressing device 80. Sonic vibration is applied. Thus, the conductive material piece 19 vibrates ultrasonically with respect to the connection terminal 34 a while being in contact with the connection terminal 34 a of the antenna circuit 34. The friction between the conductive material piece 19 and the connection terminal 34a greatly removes the conductive material piece 19 or the oxide film formed on the connection terminal 34a. As a result, the conductive material piece 19 and the antenna circuit are removed. 34, the connection resistance value and the dispersion of the connection resistance value can be greatly reduced. Furthermore, the conductive material piece 19 and the connection terminal 34a are adjusted by adjusting the amplitude, period, and vibration application time of the ultrasonic vibration applied by the first ultrasonic horn 78, the pressing force by the first pressing device 80, and the like. Can be ultrasonically bonded (intermetallic bond). In this case, the connection resistance value and the variation in the connection resistance value between the conductive material piece 19 and the antenna circuit 34 can be drastically reduced.

  By the way, as described above, when the convex portion is formed on the bottom surface of the conductive material piece 19 or when the bottom surface is roughened, the conductive material piece 19 and the connection terminal 34a are partially formed. However, it becomes easy to contact. Further, since the pressing force by the first pressing device 80 concentrates on the contact portion, the conductive material piece 19 and the connection terminal 34a are likely to come into surface contact with the contact portion as the center while removing the oxide film. Further, when ultrasonic vibration is applied by the first ultrasonic horn 78, friction concentrates on this contact portion, and the conductive material piece 19 and the connection terminal 34a are more easily ultrasonically bonded. From these facts, when the convex portion is formed on the bottom surface of the conductive material piece 19 or when the bottom surface is roughened, the conductive material piece 19 and the connection terminal 34a are accurately connected to each other with a low connection resistance value. Can be electrically connected.

  Thus, the conductive material piece 19 is disposed in the recess 20 of the IC card substrate 20 so as to be electrically connected to the connection terminal 34 a of the antenna circuit 34 exposed in the recess 22.

  In the present embodiment, the example in which the first adhesive supply means 70 supplies the adhesive 38 onto the connection terminal 34 a in the recess 22 has been described. However, the present invention is not limited to this, and before being disposed in the recess 22. The adhesive 38 may be supplied around the conductive material piece 19.

  In the present embodiment, an example is shown in which the first arrangement means 74 and the first connection means 76 are provided separately, but the present invention is not limited to this. For example, the first suction nozzle 75 is omitted, and the pressing device 80 of the first connection means 76 receives the conductive material piece 19 directly from the conductive material piece supply means (for example, a parts feeder) and arranges it in the recess 22. It may be.

  Furthermore, in this Embodiment, although the example provided with a pair of 1st ultrasonic horn corresponding to each of a pair of 1st press apparatuses 80 and 80 was shown, it is not restricted to this. A single ultrasonic horn connected to both of the pair of first pressing devices 80 and 80 can also be used.

[Process for supplying adhesive into recess, process for placing IC module in recess, process for applying ultrasonic vibration to IC module]
As shown in FIG. 4, the second adhesive supply means 82 is provided downstream of the first connection means 76, the second placement means 86 is provided downstream of the second adhesive supply means 82, Second connection means 90 is provided downstream of the two arrangement means 86.

  The second adhesive supply means 82 can be configured in the same manner as the first adhesive supply means 70. As shown in FIG. 9, the second adhesive supply means 82 supplies the adhesive 38 on the bottom surface portion 22 a or the conductive material piece 19 in the recess 22 of the IC card substrate 20. ing.

  Further, the second arrangement means 86 can be configured in the same manner as the first arrangement means 74, and for example, can include a second suction nozzle (also referred to as an IC module suction nozzle) 88. The second suction nozzle 88 sucks the supplied IC modules 11 one by one, and conveys the IC module 11 above the recess 20 supplied with the adhesive 38 by the second adhesive supply means 82. Thereafter, the second suction nozzle 88 is lowered so that the IC module 11 faces the pair of connection electrodes 18, 18 and the pair of connection terminals 34 a of the antenna circuit 34 through the conductive material piece 19. And stored in the recess 22.

  As an IC module supply means (not shown) for supplying the IC module 11 to the second arrangement means 86, a parts feeder can be used as in the case of the conductive material piece supply means. According to the parts feeder, the IC modules 11 can be stably and accurately supplied to the second suction nozzle 88 one by one.

  As shown in FIGS. 4 and 10, the second connecting means 90 of the present embodiment includes a second pressing device (also referred to as an IC module pressing device) that presses the IC module 11 toward the IC card substrate 20. 94) and a second ultrasonic horn (also referred to as an IC module ultrasonic wave applying device) that is connected to the second pressing device 94 and applies ultrasonic vibrations to the second pressing device 94. As shown in FIG. 10, the second pressing device 94 has a suction hole 95 communicating with a suction device (not shown), and the IC module 11 can be sucked and held by operating the suction device. ing.

  In the step of applying ultrasonic vibration to the IC module 11, first, a suction device (not shown) operates and the second pressing device 94 sucks and holds the conductive material piece 19. Then, the second pressing device 94 presses the IC module 11 sucked and held toward the IC card substrate 20. As a result, the adhesive 38 interposed between the connection electrode 18 of the IC module 11 and the conductive material piece 19 is compressed and pushed away, and the flat end surface of the connection electrode 18 of the IC module 11 is formed on the conductive material piece 19. It contacts the bottom surface 19b on the other side. On the other hand, the pushed-off adhesive 38 spreads into the recess 22 and preferably fills the space other than the portion occupied by the IC module 11 and the conductive material piece 19 in the recess 22 as shown in FIG.

  Next, in this state, while pressing the IC module 11 into the recess 22 by the second pressing device 94, the second ultrasonic horn 92 operates to ultrasonically vibrate the IC module 11 via the second pressing device 94. Is granted. Accordingly, the IC module 11 ultrasonically vibrates with respect to the conductive material piece 19 while the connection electrode 18 of the IC module 11 contacts the conductive material piece 19. Due to the friction between the connection electrode 18 and the conductive material piece 19, the oxide film formed on the connection electrode 18 or the conductive material piece 19 is largely removed, whereby the IC module 11 and the conductive material piece 19 are removed. The connection resistance value and the dispersion of the connection resistance value between the IC module 11 and the antenna circuit 34 via the conductive material piece 19 are greatly reduced. Variation can be greatly reduced. Furthermore, the connection electrode 18 and the conductive material piece 19 are adjusted by adjusting the amplitude, period, and vibration applying time of the ultrasonic vibration applied by the second ultrasonic horn 92 and the pressing force by the second pressing device 94. Can be ultrasonically bonded (intermetallic bond). In this case, the connection resistance value and the variation in the connection resistance value between the IC module 11 and the antenna circuit 34 via the conductive material piece 19 can be drastically reduced.

  By the way, as described above, when the convex portion is formed on the bottom surface of the conductive material piece 19 or the bottom surface is roughened, the conductive material piece 19 and the connection electrode 18 are partially separated. However, it becomes easy to contact. In addition, since the pressing force by the second pressing device 94 is concentrated on the contact portion, the conductive material piece 19 and the connection electrode 18 are likely to come into surface contact with the contact portion as the center while removing the oxide film. Further, when ultrasonic vibration is applied by the second ultrasonic horn 92, friction is concentrated on the contact portion, and the conductive material piece 19 and the connection terminal 34a are more easily ultrasonically bonded. From these facts, when the convex portion is formed on the bottom surface of the conductive material piece 19 or when the bottom surface is roughened, the conductive material piece 19 and the connection electrode 18 are accurately connected to each other with a low connection resistance value. Can be electrically connected.

  In order for the I module 11 to ultrasonically vibrate with respect to the IC card substrate 20, there must be a gap between the IC module 11 and the IC card substrate 20 in the recess 22. According to the experimental results, if a gap of about 10 μm on one side is provided between the IC module 11 and the IC card substrate 20, the connection electrode 18 and the conductive material piece 19 of the IC module 11 are ultrasonicated. We were able to join.

  By the way, when the connection electrode 18 of the IC module 11 comes into contact with the conductive material piece 19 by the pressing by the second pressing device 94, the bottom surface portion 22a of the concave portion 22 of the IC card substrate 20 faces the bottom surface portion 22. It is preferable that the bottom portion 11a of the IC module 11 to be brought into contact. In this state, by applying ultrasonic vibration to the IC module 11 under appropriate conditions, the bottom portion 11a of the IC module 11 and the bottom portion 22a of the IC card substrate 20 can be ultrasonically bonded. In this case, the IC module 11 and the antenna circuit 34 can be electrically connected with a low connection resistance value, and at the same time, the IC module 11 can be firmly fixed to the IC card substrate 20 in this state. . Thereby, in a subsequent manufacturing process or the like, the IC module 11 moves in the recess 22 of the base member 20 for the IC card, and between the connection electrode 18 and the conductive material piece 19 or between the conductive material piece 19 and the connection terminal. It is possible to greatly suppress the loss of the electrical connection once formed with 34a.

  In the present embodiment, the example in which the second adhesive supply means 82 supplies the adhesive 38 into the concave portion 22 before the IC module 11 is disposed has been described. You may make it supply the adhesive agent 38 to the part which faces the base material 20 for IC cards or the electroconductive material piece 19 of IC module 11 before arrange | positioning.

  In the present embodiment, an example is shown in which the second placement means 86 and the second connection means 90 are provided separately, but the present invention is not limited to this. For example, the second suction nozzle 88 may be omitted, and the pressing device 94 of the second connection means 90 may receive the IC module 11 directly from the IC module supply means and place it in the recess 22.

[Process of curing adhesive]
As shown in FIG. 4, a curing means 98 for curing the adhesive 38 is provided on the downstream side of the second connection means 90. The mode of the curing means 98 is selected according to the type of the adhesive 38 supplied from the first adhesive supply means 70 and the second adhesive supply means 82. For example, when the adhesive 38 used is made of a thermosetting resin, the curing means 98 has a heating device 98 that can heat the periphery of the IC module 11 as shown in FIG.

  By such curing means 98, the IC card base is connected in a state where the connection electrode 18 of the IC module 11 is in surface contact with the conductive material piece 19 and the conductive material piece 19 is in surface contact with the connection terminal 34 a of the antenna circuit 34. The adhesive 38 interposed between the IC module 11, the conductive material piece 19, and the IC card substrate 20 in the recess 22 of the material 20 is cured. As a result, the IC module 11 and the IC card substrate 20 are electrically connected to each other through the conductive material piece 19 in a state where the IC module 11 and the antenna circuit 34 are electrically connected with the connection resistance value greatly reduced. The relative position with the material piece 19 is firmly fixed.

  The IC card 10 is manufactured as described above, and the manufactured IC card 10 includes the first plate-like member 40, the second plate-like member 30 laminated on the first plate-like member 40, and the first plate. And an antenna circuit 34 having a connection terminal 34a provided between the plate-like member 40 and the second plate-like member 30, and for the IC card formed with the recess 22 in which at least a part of the connection terminal 34a is exposed. The base material 20, the conductive material piece 19 disposed in the recess 22 in contact with the connection terminal 34 a and electrically connected to the connection terminal 34, and the conductive material piece 19 disposed in the recess 22 and electrically connected to the connection terminal 34 a And the IC module 11 having the connection electrodes 18.

<Effect>
As described above, according to the present embodiment, the flat exposed surface of the connection terminal 34 a and the flat one side bottom surface 19 a of the conductive material piece 19 face each other on the connection terminal 34 a in the recess 22. The conductor material piece 19 is disposed, and the IC module 11 is disposed in the recess 22 such that the flat other bottom surface 19b of the conductive material piece 19 and the flat end surface of the IC module 11 face each other. Therefore, the antenna circuit 34 and the conductive material piece 19 are in surface contact and electrically connected, and the conductive material piece 19 and the IC module 11 are in surface contact and electrically connected. Further, the IC card manufacturing apparatus 50 is provided with the first connection means 76 and the second connection means 90, and ultrasonic vibration is applied to the conductive material piece 19 arranged in the recess 22, and Ultrasonic vibration is applied to the arranged IC module 11. Therefore, the oxide film formed on the connection terminal 34a, the conductive material piece 19, or the connection electrode 18 can be significantly removed. Accordingly, the high-quality IC card 10 in which the connection resistance value between the IC module 11 and the antenna circuit 34 is reduced can be stably manufactured.

  Further, according to the current cutting accuracy, there may be a defective cutting product in which the adhesive layer 24 on the connection terminal 34a is not completely cut in the cutting process. Such defective cutting products are difficult to visually discern due to the fact that the adhesive layer 24 is usually colorless and transparent, and have finally been discovered in the final operation check inspection. In other words, under the present circumstances, subsequent processing is performed even on defective cutting products, and the manufacturing yield and manufacturing efficiency are significantly deteriorated. However, according to the present embodiment, by adjusting the pressing force of the conductive material piece 19 toward the connection electrode 34a by the first connection means 76 and the condition of ultrasonic vibration, etc., the residual on the connection terminal 34a. The conductive material piece 19 and the antenna circuit 34 can be electrically connected by breaking through the adhesive layer 24. Thereby, the manufacturing yield and manufacturing efficiency of the IC card 10 can be improved.

  Further, by adjusting the amplitude or time of the ultrasonic vibration, any one between the connection terminal 34a of the antenna circuit 34 and the conductive material piece 19 and between the conductive material piece 19 and the connection electrode 18 is provided. Alternatively, both can be ultrasonically bonded, whereby the connection resistance value between the IC module 11 and the antenna circuit 34 can be further reduced.

  Furthermore, by adjusting the conditions of ultrasonic vibration and the shape of the IC module 11 and the concave portion 22, the bottom surface portion 22a of the concave portion 22 and the bottom portion 11a of the IC module 11 facing the bottom surface portion 22a are ultrasonically bonded. Accordingly, the IC module 11 can be firmly fixed in the recess 22 of the IC card substrate 20. In this case, the IC module 11 is detached from the recess 22 of the IC card substrate 20 during the subsequent manufacturing process or use of the manufactured IC card 10, and further, the electrical connection between the IC module 11 and the antenna circuit 34. It can be remarkably suppressed that the target connection is damaged. That is, the reliability with respect to the quality of the manufactured IC card 10 can be improved.

  Moreover, according to this Embodiment, the 1st adhesive supply means 70 which supplies the adhesive agent 38 in the recessed part 22 before IC module 11 and the conductive material piece 19 are arrange | positioned, and the conductive material piece 19 are provided. A second adhesive supply means 82 for supplying the adhesive 38 is provided in the recess 22 after the placement and before the IC module 11 is placed. According to the present embodiment as described above, the adhesive 38 can be supplied into the recess 22 of the IC card substrate 20 in two portions, whereby not only the entire area of the recess 22 but also the conductive material. The adhesive 38 can also be applied to the entire periphery of the piece 19. Therefore, the IC module 11 can be firmly fixed in the recess 22 of the IC card substrate 20. In addition, the relative positions of the IC module 11, the conductive material piece 19, and the connection terminal 34 a of the antenna circuit 34 in the recess 22 are firmly fixed. Thereby, it is possible to prevent the IC module 11 from coming off from the recess 22 of the IC card substrate 20 in the subsequent manufacturing process or use after manufacturing the IC card. Furthermore, the IC module 11 and the antenna circuit can be prevented. The electrical connection with 34 can be maintained firmly.

<Modification>
Various modifications can be made to the above-described embodiment within the scope of the present invention. Hereinafter, an example of a modification will be described.

[Variation of the step of arranging and electrically connecting the conductive material pieces]
In the above-described embodiment, before the IC module 11 is disposed in the recess 22 of the IC card substrate 20, the conductive material piece 19 is disposed in the recess 22 and the conductive material piece 19 is disposed in the recess 22. Although the example which electrically connects with the connection terminal 34a exposed to was shown, it is not restricted to this.

  For example, first, prior to disposing the conductive material piece 19 in the recess 22, the IC module 11 and the conductive material piece 19 are connected to the flat end surface of the connection electrode 18 and the bottom surface on the other side of the conductive material piece 19. It is held (arranged) so as to face 19b. Next, the IC module 11 and the conductive material piece 19 are pressed toward each other to bring the connection electrode 18 and the conductive material piece 19 into contact with each other, and the first connection means 74 or the second connection means 90 causes the IC module 11 to be in contact with each other. Alternatively, ultrasonic vibration is applied to the conductive material piece 19 to electrically connect the connection electrode 18 and the conductive material piece 19. Then, the adhesive 38 may be supplied into the recess 22 by the second adhesive supply means 82, and then the IC module 11 and the conductive material piece 19 may be disposed in the recess 22. Also in this example, before the step of holding (arranging) the IC module 11 and the conductive material piece 19 so as to face each other, either the IC module 11 or the conductive material piece 19 is performed by the first adhesive supply means 70. The adhesive 38 may be supplied to the contact electrode 18, and the connection electrode 18 and the conductive material piece 19 may be ultrasonically bonded in the step of applying ultrasonic vibration. In this case, the IC module 11 and the conductive material piece 19 are in a state of being fixed to each other, which is preferable in that the subsequent arrangement work in the recess 22 can be smoothly advanced.

In addition, the step of applying ultrasonic vibration to the conductive material piece 19 by the first connecting means 76 described above can be omitted, and the first connecting means 76 can be omitted from the manufacturing apparatus 50. In this example, after the conductive material piece 19 is arranged in the concave portion 22 of the IC card substrate 20, the IC module 11 is arranged in the concave portion 22 by the second arrangement means 86, and then the second connection. The means 90 applies ultrasonic vibration to the IC module 11. During this time,
Before the conductive material piece 19 is disposed in the recess 22, the adhesive 38 is supplied by the first adhesive supply means 70, and in addition to or instead of this, the conductive material piece 19 in the recess 22. The adhesive 38 may be supplied by the second adhesive supply means 82 after the IC module 11 is placed and before the IC module 11 is placed in the recess 22. In such an example, the type and supply amount of the adhesive 38 supplied by the first adhesive supply means 70 and the second adhesive supply means 82, the condition of ultrasonic vibration applied by the second connection means 90, etc. Is adjusted, the second connecting means 90 vibrates the connection electrode 18 of the IC module 11 with respect to the conductive material piece 19 and the conductive material by friction between the connection electrode 18 and the conductive material piece 19. The piece 19 can be vibrated with respect to the connection terminal 34 a of the antenna circuit 34. As a result, the connection electrode 18, the conductive material piece 19, and the oxide film formed on the connection terminal 34a are removed. Furthermore, not only between the connection electrode 18 and the conductive material piece 19, but also the conductive material piece. 19 and the connection terminal 34a can be ultrasonically bonded in the same process, which is very preferable from the viewpoint of production efficiency.

[Modified example of supplying adhesive]
In the above-described embodiment, an example in which the first adhesive supply unit 70 and the second adhesive supply unit 82 are provided in the manufacturing apparatus 50 and the adhesive 38 is supplied into the recess 22 in two portions is shown. However, it is not limited to this. For example, when the conductive material piece 19 and the connection terminal 34 a of the antenna circuit 34 are ultrasonically bonded, the step of supplying the adhesive 38 by the first adhesive supply means 70 may be omitted. Further, for example, when the bottom surface portion 22a of the IC card substrate 20 and the bottom portion 11a of the IC module 11 are ultrasonically bonded, the step of supplying the adhesive 38 by the second adhesive supply means 82 is omitted. May be.

[Modification of the structure of the base material for IC card]
Further, in the above-described embodiment, the example in which the IC card substrate 20 is configured by the three plate-like members 40, 30, and 46 and the antenna circuit 34 is shown, but the present invention is not limited thereto. As long as the IC card substrate 20 has the antenna circuit 34 having the connection terminals 34a and the recesses 22 in which at least a part of the connection terminals 34a are exposed are formed in the IC card substrate 20, various changes are made. Is possible. Also, the manufacturing method of the base material for the IC card can be variously changed from the above-described methods including the method for forming the antenna circuit 34 and the method for forming the recess 22. For example, the base member 20 for IC card may be produced using a plate-like member having a through-hole formed in advance, and the recess 22 may be formed by the through-hole of the plate-like member. Furthermore, the IC card substrate 20 may be produced using two or four or more plate-like members, or the IC card base may be formed from a plate-like member having a substantially U-shaped cross section or a substantially L-shaped cross section. The material 20 may be manufactured, may be constituted by a conductive wire in which the coil portion of the antenna circuit is coiled, or the antenna circuit may be formed by silver paste applied from a screen printer.

[Modification of IC module configuration]
Further, in the above-described embodiment, the IC module 11 has the external terminal 13a, and the manufactured IC card 10 can communicate with an external device in a contact state. Not limited to. The present invention is applied to the IC module 11 that does not have the external terminal 13a, that is, to the IC module 11 in which the obtained IC card 10 can communicate with an external device only in a non-contact state. Can be applied.

  Further, in the above-described embodiment, the example in which the connection electrode 18 of the IC module 11 protrudes from the lower surface of the substrate 13 is shown. However, the present invention is not limited to this. You may make it project to.

The perspective view which shows one Embodiment of the IC card by this invention. Sectional drawing along the II-II line of FIG. The perspective view which shows the base material for IC cards. BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram which shows one Embodiment of the manufacturing apparatus and IC card manufacturing method by this invention. Sectional drawing explaining the manufacturing method of the base material for IC cards with the manufacturing apparatus of the base material for IC cards. Sectional drawing explaining the manufacturing method of the base material for IC cards with the manufacturing apparatus of the base material for IC cards. Sectional drawing explaining the process of supplying an adhesive agent with an adhesive supply means. Sectional drawing explaining the method of electrically connecting the connection terminal and conductive material piece of an antenna circuit with a connection means. Sectional drawing explaining the process of supplying an adhesive agent with an adhesive supply means. Sectional drawing explaining the method of electrically connecting the connection electrode and conductive material piece of an IC module with a connection means.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 IC card 11 IC module 11 Bottom part 13a External terminal 20 IC card base material 22 Recess 22 Bottom part 34 Antenna circuit 34a Connection terminal 38 Adhesive 50 IC card manufacturing apparatus 70 Means for supplying adhesive (first adhesive Supply means)
76 Means for connection (first connection means)
82 Means for supplying adhesive (second adhesive supplying means)
86 Arranging means (second arranging means)
90 Means for connection (second connection means)

Claims (10)

A step of disposing the conductive material pieces in the recesses of the substrate for an IC card having an antenna circuit having a connection terminal and forming a recess in which at least a part of the connection terminal is exposed ;
Applying ultrasonic vibration to the conductive material piece while contacting the flat exposed surface of the connection terminal exposed in the recess and the flat one side bottom surface of the conductive material piece, the connection terminal and the Electrically connecting the conductive material pieces;
Disposing the IC module having the connection electrode such that the flat end surface of the connection electrode faces the flat bottom surface of the conductive material piece;
And a step of applying ultrasonic vibration to the IC module disposed in the recess to electrically connect the conductive material piece and the IC module. Method. Applying ultrasonic vibration to ultrasonically join at least one of the connection terminal of the antenna circuit and the conductive material piece and between the conductive material piece and the connection electrode. The method of manufacturing an IC card according to claim 1 . 3. The IC according to claim 1, wherein in the step of applying ultrasonic vibration to the IC module, the bottom surface portion of the concave portion and the portion facing the bottom surface portion of the IC module are ultrasonically bonded. Card manufacturing method. Supplying an adhesive to the concave portion before the IC module is disposed, the conductive material piece before being disposed in the concave portion, or the IC module before being disposed in the concave portion; , IC card manufacturing method according to any one of claims 1 to 3, characterized in that it comprises further. Means for disposing an electrically conductive material piece in the recess of the IC card substrate having an antenna circuit having a connection terminal and having a recess in which at least a part of the connection terminal is exposed ;
Applying ultrasonic vibration to the conductive material piece while contacting the flat exposed surface of the connection terminal exposed in the recess and the flat one side bottom surface of the conductive material piece, the connection terminal and the Means for electrically connecting the conductive material pieces;
Means for disposing an IC module having a connection electrode such that a flat end surface of the connection electrode faces a flat bottom surface on the other side of the conductive material piece;
Means for manufacturing an IC card, comprising: means for applying ultrasonic vibration to the IC module disposed in the recess to electrically connect the conductive material piece and the IC module. apparatus. Means for supplying an adhesive to the concave portion before the IC module is arranged, the conductive material piece before being arranged in the concave portion, or the IC module before being arranged in the concave portion The IC card manufacturing apparatus according to claim 5 , further comprising: A base material for an IC card having an antenna circuit having a connection terminal and having a recess in which at least a part of the connection terminal is exposed;
A conductive material piece disposed in the recess and having a flat one side bottom surface in surface contact with a flat exposed surface of the connection terminal exposed in the recess;
An IC module having a connection electrode disposed in the recess and having a flat end surface in surface contact with a flat bottom surface on the other side of the conductive material piece ;
An IC card, wherein the connection terminal and the conductive material piece and the conductive material piece and the connection electrode are ultrasonically bonded . The IC card according to claim 7 , wherein the IC module is fixed in the concave portion of the base material for the IC card through an adhesive. 9. The IC card according to claim 8 , wherein the adhesive is provided around the conductive material piece. The method for manufacturing an IC card according to claim 7 , wherein a bottom surface portion of the concave portion and a portion facing the bottom surface portion of the IC module are ultrasonically bonded.

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