JP4799172B2 - Exposure apparatus, exposure method, and manufacturing method of display panel substrate - Google Patents

Description

  The present invention relates to an exposure apparatus that performs exposure of a substrate, an exposure method, and a method of manufacturing a display panel substrate using the same in manufacturing a display panel substrate such as a liquid crystal display device.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. In general, an exposure apparatus includes a chuck that holds a substrate by vacuum suction, and performs exposure by irradiating the surface of the substrate held by the chuck with light transmitted through a photomask.

  Conventionally, there are chucks having a flat substrate holding surface and those having a plurality of pin-shaped convex portions on the substrate holding surface. In the latter, the substrate is supported at a plurality of points by pin-shaped convex portions, and the space between the portion other than the pin-shaped convex portions and the substrate is evacuated to hold the substrate by vacuum suction. In such a chuck, in order to vacuum-suck a large substrate evenly, the space between the substrate and the portion other than the pin-shaped convex portion and the substrate is divided into a plurality of vacuum compartments for evacuation. For this reason, a bank (line) for forming a plurality of vacuum sections has been provided on the substrate holding surface.

  The substrate is normally mounted on the chuck through a plurality of push-up pins provided on the chuck. The push-up pin rises from the surface of the chuck, receives the substrate from a handling arm such as a robot, and then descends again to place the substrate on the surface of the chuck.

As a related technique, Patent Document 1 discloses a semiconductor wafer vacuum chuck in which a groove is provided on a wafer holding surface. Patent Document 2 discloses a reticle holder including a plurality of suction pins.
JP-A-9-32127 JP 2000-286191 A

  In a substrate that transmits light, such as a glass substrate, the light transmitted through the substrate during exposure is reflected by the chuck, passes through the substrate again, and reaches the surface of the substrate. The phenomenon of burning may occur. This phenomenon is called “backside transfer”. In a conventional chuck with a flat substrate holding surface, dirt on the back surface of the substrate accumulates on the chuck, and back surface transfer occurs due to this dirt. On the other hand, in the chuck in which the pin-shaped convex portion is provided on the substrate holding surface, the back surface transfer due to the accumulation of dirt is small.

  In a chuck in which a pin-shaped convex portion is provided on the substrate holding surface, the suction force for holding the substrate is determined by the air pressure in the vacuum compartment divided by the bank. If the air pressure in the vacuum compartment is lowered to increase the adsorption force too much, the substrate will bend and follow the shape of the substrate holding surface, and backside transfer will easily occur. When backside transfer occurs and the surface shape of the chuck is baked onto the surface of the substrate, the pin-shaped protrusions are small and difficult to recognize by the human eye, but this is not a problem. It is easily recognized by the eyes and causes defects. In order to suppress the back surface transfer, it is necessary to appropriately control the adsorption force and hold the substrate flat.

  On the other hand, in order to reduce the tact time in the exposure apparatus, there is a demand for quickly mounting the substrate on the chuck. In order to quickly mount the substrate, it is necessary to lower the push-up pin on which the substrate is placed at a high speed. However, when the size of the substrate increases, when the push-up pin is lowered at a high speed, the air between the substrate and the chuck does not escape and remains in the center of the substrate, and the center of the substrate swells due to the remaining air. appear. If the air left in this way with a conventional chuck is removed by vacuuming, the peripheral part of the substrate is already fixed by vacuum suction, causing distortion in the substrate and poor printing accuracy during exposure. There was a problem that occurred.

  Conventionally, in order to promote the discharge of air between the substrate and the chuck, it has been considered to provide a groove on the surface of the chuck. However, as the substrate becomes larger, the groove cross-sectional area needs to be increased in order to increase the amount of air discharged. If the groove width and depth are increased in order to increase the groove cross-sectional area, the rear surface transfer There was a problem that occurred.

  Further, in order to promote the discharge of air between the substrate and the chuck, it is conceivable to increase the suction force of the vacuum suction by the chuck. However, in a conventional exposure apparatus using a chuck having a pin-shaped convex portion provided on a substrate holding surface, if the adsorption force is increased, the substrate is bent and follows the shape of the substrate holding surface, so that backside transfer is likely to occur. There was a problem.

  It is an object of the present invention to quickly mount a substrate on a chuck and reduce defects due to substrate distortion and back surface transfer. Another object of the present invention is to manufacture a display panel substrate with a short tact time and high yield.

The exposure apparatus of the present invention is an exposure apparatus provided with a chuck for holding a substrate through which light is transmitted , and the chuck has a diameter of 4 mm or less on the substrate holding surface so that back surface transfer to the substrate does not become a problem. Thus, when the substrate is mounted on the chuck, it has a plurality of air holes for discharging air between the substrate and the chuck to the back surface of the chuck.

The exposure method of the present invention is an exposure method for exposing a substrate held by a chuck through which light is transmitted , and has a diameter of 4 mm or less so that back surface transfer to the substrate does not cause a problem on the substrate holding surface of the chuck. When the substrate is mounted on the chuck, the air between the substrate and the chuck is discharged to the back surface of the chuck through the air hole.

When the substrate is mounted on the chuck, the air between the substrate and the chuck is discharged to the back surface of the chuck through the air holes, so that the air between the substrate and the chuck passes along a short path corresponding to the thickness of the chuck. Efficiently discharged. Air hole is a size smaller than the diameter 4 mm, even going on backside transfer to the substrate, not a problem because hardly recognized by the human eye.

  Further, in the exposure apparatus of the present invention, the chuck has an air passage wider on the back surface than the air hole leading to the air hole. In the exposure method of the present invention, an air passage wider than an air hole communicating with an air hole provided on the substrate holding surface of the chuck is provided on the back surface of the chuck. Since the back surface of the chuck is provided with an air passage wider than the air hole leading to the air hole provided on the chuck substrate holding surface, when the substrate is mounted on the chuck, the air between the substrate and the chuck is moved from the air hole to the air hole. It is discharged more efficiently through a wider air passage.

Further, in the exposure apparatus of the present invention, the chuck includes a plurality of convex portions that support the substrate on the substrate holding surface, a bank that divides a space between the portion other than the convex portions and the substrate into a plurality of vacuum compartments, and each vacuum compartment. A plurality of suction means that vacuum-suck the substrate disposed on the substrate, and when the substrate is mounted on the chuck, a first suction force is generated in each suction means, and the first suction force is applied to each suction means when the substrate is exposed. It is provided with a suction force generating means for generating a second suction force weaker than the suction force.

Further, the exposure method of the present invention includes a plurality of convex portions that support the substrate on the substrate holding surface of the chuck, a bank that divides the space between the portion other than the convex portions and the substrate into a plurality of vacuum compartments, and each vacuum compartment. A plurality of suction means for vacuum-sucking the disposed substrate, and when the substrate is mounted on the chuck, each suction means is discharged while discharging air between the substrate and the chuck to the back surface of the chuck through the air holes. the first adsorbing the substrate with suction force, during exposure of the substrate, it is to adsorb the substrate at a first weak second suction force than the suction force of the respective suction unit.

  When the substrate is mounted on the chuck, the substrate is vacuum-sucked with a relatively strong first suction force. Thereby, the air between the substrate and the chuck can be efficiently discharged by the adsorption means. On the other hand, when the substrate is exposed, the substrate is vacuum-sucked with a second suction force that is weaker than the first suction force and does not bend. Since the substrate is held flat on the chuck, the occurrence of back surface transfer is suppressed.

Further, the exposure apparatus of the present invention, the chuck has a non-vacuum section on the substrate holding surface, and has a plurality of air holes in the non-vacuum zone. In the exposure method of the present invention, a non-vacuum section is provided on the substrate holding surface of the chuck, and a plurality of air holes are provided in the non-vacuum section. Since a non-vacuum section is provided on the substrate holding surface of the chuck and an air hole is provided in the non-vacuum section, when the substrate is mounted on the chuck, air between the substrate and the chuck passes through the non-vacuum section to the side surface of the chuck. In addition to being discharged, it is discharged from the non-vacuum compartment to the back surface of the chuck through the air hole. On the other hand, the air in each vacuum compartment is discharged by each adsorption means. Therefore, the air between the substrate and the chuck is discharged more efficiently.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, when the substrate is mounted on the chuck, the air between the substrate and the chuck is efficiently discharged, so that the substrate can be mounted quickly, and the substrate The number of substrates that are defective due to the distortion and back surface transfer is reduced.

According to the exposure apparatus and the exposure method of the present invention, the substrate is mounted on the chuck by providing a plurality of air holes with a diameter of 4 mm or less on the substrate holding surface of the chuck, where transfer of the back surface to the substrate is not a problem. At this time, since the air between the substrate and the chuck can be efficiently discharged, the substrate can be quickly mounted on the chuck, and defects due to the distortion of the substrate and the back surface transfer can be reduced.

  Furthermore, by providing a wider air passage on the back surface of the chuck than the air holes leading to the air holes provided on the chuck substrate holding surface, the air between the substrate and the chuck can be discharged more efficiently. Can be mounted on the chuck more quickly, and defects due to distortion of the substrate can be further reduced.

Further, when the substrate is mounted on the chuck, the substrate is adsorbed by the first adsorbing means by each adsorbing means arranged in each vacuum compartment, and the first adsorbing means arranged in each vacuum compartment is exposed by the first adsorbing force when the substrate is exposed. By adsorbing the substrate with a second adsorbing force that is weaker than the adsorbing force, the air between the substrate and the chuck can be efficiently discharged by the adsorbing means, and the occurrence of back surface transfer can be suppressed. In addition, the substrate can be mounted on the chuck more quickly, and defects due to substrate distortion and back surface transfer can be further reduced.

Furthermore, the non-vacuum zone provided on the substrate holding surface of the chuck, by providing a plurality of air holes in the non-vacuum zone, it is possible to more efficiently discharge the air between the substrate and the chuck, the substrate chuck Can be mounted more quickly, and defects due to substrate distortion can be further reduced.

  According to the method for manufacturing a display panel substrate of the present invention, when the substrate is exposed, the time required for mounting the substrate on the chuck can be shortened, and defects due to substrate distortion and back surface transfer can be reduced. Therefore, the display panel substrate can be manufactured with a short tact time and a high yield.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. This embodiment shows an example of a proximity type exposure apparatus that provides a minute gap (proximity gap) between a mask and a substrate and transfers the mask pattern to the substrate. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a Z-tilt mechanism 9, a chuck 10, and a mask holder 20. In addition to the above, the exposure apparatus includes an exposure light source, a supply unit that supplies the substrate 1 to the chuck 10, a recovery unit that recovers the substrate 1 from the chuck 10, a temperature control unit that manages the temperature in the apparatus, and the like. However, in this embodiment, portions not directly related to the invention are omitted.

  In FIG. 1, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is supplied to the chuck 10 by a supply unit (not shown), and the substrate 1 is recovered from the chuck 10 by a recovery unit (not shown). The substrate 1 is mounted on the chuck 10 via a plurality of push-up pins provided on the chuck 10. The push-up pin rises from the surface of the chuck 10, receives the substrate 1 from the handling arm of the supply unit, and then descends again to place the substrate 1 on the substrate holding surface of the chuck 10. A mask 2 is held by a mask holder 20 above the exposure position where the substrate 1 is exposed.

  The chuck 10 is mounted on the θ stage 8 via a Z-tilt mechanism 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 moves in the X direction (the horizontal direction in the drawing) along the X guide 4 provided on the base 3. As the X stage 5 moves in the X direction, the chuck 10 moves between the delivery position and the exposure position. In addition, although a linear motor etc. are used as a drive means, illustration is abbreviate | omitted. The Y stage 7 moves in the Y direction (the drawing depth direction) along the Y guide 6 provided on the X stage 5. The θ stage 8 rotates in the θ direction, and the Z-tilt mechanism 9 moves and tilts in the Z direction (vertical direction in the drawing).

  At the exposure position, the substrate 1 is positioned during exposure by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Further, the gap control between the mask 2 and the substrate 1 is performed by the movement and tilt of the Z-tilt mechanism 9 in the Z direction.

  FIG. 2 is a top view of the chuck of the exposure apparatus according to the embodiment of the present invention. Protrusions 11, banks 12, suction holes 13, and air holes 14 are provided on the substrate holding surface of the chuck 10. An air passage 15 indicated by a broken line is provided on the back surface of the chuck 10. The push-up pin 16 is inserted into a through hole penetrating from the back surface of the chuck 10 to the substrate holding surface.

  The convex portion 11 has a pin shape, and a plurality of convex portions 11 are provided on the substrate holding surface of the chuck 10 at a predetermined interval. When the substrate 1 is mounted on the chuck 10, the convex portion 11 supports the substrate 1 at a plurality of points. At this time, a space is formed between the portion of the substrate holding surface other than the convex portion 11 and the substrate 1.

  The bank 12 is a continuous wall having a predetermined width, and divides a space formed between a portion other than the convex portion 11 of the substrate holding surface and the substrate 1 into a plurality of vacuum compartments and non-vacuum compartments. FIG. 3 is a diagram illustrating a vacuum section and a non-vacuum section of the chuck shown in FIG. In the present embodiment, the substrate holding surface of the chuck 10 is divided by the bank 12 into nine vacuum compartments 10a, six vacuum compartments 10b, six vacuum compartments 10c, and one non-vacuum compartment 10d. Yes.

  In the present embodiment, nine vacuum compartments 10a, six vacuum compartments 10b, and six vacuum compartments 10c are each formed in a rectangular shape, and one non-vacuum compartment 10d is formed in a cross-beam shape. The number and shape of the non-vacuum compartments are not limited thereto.

  4 and 5 are views showing a state in which a substrate is mounted on the chuck shown in FIG. As shown in FIG. 4, when the rectangular substrate 1 is mounted horizontally, the chuck 10 holds the substrate 1 by vacuum suction using nine vacuum compartments 10a and six vacuum compartments 10b. As shown in FIG. 5, when the rectangular substrate 1 is mounted vertically, the chuck 10 holds the substrate 1 by vacuum suction using nine vacuum compartments 10a and six vacuum compartments 10c.

  6A is a partial cross-sectional view of the AA portion in FIG. 2, and FIG. 6B is a partial cross-sectional view of the BB portion. 6A and 6B show a state in which the substrate 1 is mounted horizontally on the chuck 10 as shown in FIG. As shown in FIGS. 6A and 6B, the air holes 14 are through-holes extending from the substrate holding surface of the chuck 10 to the back surface, and a plurality of air holes 14 are provided in the non-vacuum compartment 10d at predetermined intervals. . The air hole 14 has a diameter of, for example, 4 mm or less, and even if the back surface transfer to the substrate 1 occurs, it does not cause a problem because it is difficult to be recognized by human eyes.

  An air passage 15 leading to the air hole 14 is provided on the back surface of the substrate 1. The air passage 15 is configured wider than the air hole 14. In the present embodiment, the air passage 15 is a circular hole having a predetermined depth, and one air passage 15 communicates with the four air holes 14.

  When the substrate 1 is mounted on the chuck 10, air between the substrate 1 and the chuck 10 is discharged to the side surface of the chuck 10 through the non-vacuum section 10 d, and the air holes 14 and the air passages from the non-vacuum section 10 d. 15 is efficiently discharged to the back surface of the chuck 10.

  In FIG. 2, a total of 144 air holes 14 are provided, but the number of air holes 14 and their arrangement are appropriately determined according to the size of the substrate. Further, the shape of the air passage 15 is not limited to a circular shape, and may be, for example, a groove provided on the back surface of the substrate 1.

  FIG. 7 is a diagram illustrating a cross-section of the CC section of FIG. 2 and a configuration of a pneumatic circuit. 7 shows a state in which the substrate 1 is mounted horizontally on the chuck 10 as shown in FIG. As shown in FIG. 7, the suction holes 13 are through holes extending from the substrate holding surface of the chuck 10 to the back surface, and a plurality of suction holes 13 are provided at predetermined intervals in the vacuum compartment 10a, the vacuum compartment 10b, and the vacuum compartment 10c. A pipe 40a is connected to the suction hole 13 provided in the vacuum section 10a on the back surface of the chuck 10 via a pipe joint 30a. A pipe 40b is connected to the suction hole 13 provided in the vacuum compartment 10b via a pipe joint 30b.

  The pipe 40a is bifurcated, and one of the pipes 40a is connected to a high-vacuum vacuum facility via an electromagnetic valve 41a. The other is connected to a low-vacuum vacuum facility via an electromagnetic valve 42a. Similarly, the pipe 40b is bifurcated, and one of the pipes 40b is connected to a high-vacuum vacuum facility via an electromagnetic valve 41b. The other is connected to a low-vacuum vacuum facility via an electromagnetic valve 42b.

  When the substrate 1 is mounted on the chuck 10 at the delivery position, first, the electromagnetic valve 41a is opened with the electromagnetic valve 42a closed. The air in the vacuum compartment 10a is sucked from the suction hole 13 to the high-vacuum vacuum facility through the pipe joint 30a, the pipe 40a, and the electromagnetic valve 41a. Subsequently, the electromagnetic valve 41b is opened with the electromagnetic valve 42b closed. The air in the vacuum compartment 10b is sucked from the suction hole 13 to the high-vacuum vacuum facility through the pipe joint 30b, the pipe 40b, and the electromagnetic valve 41b. As a result, the air in the vacuum compartment 10a and the vacuum compartment 10b is discharged, and the substrate 1 is vacuum-sucked to the chuck 10 with a relatively strong first suction force.

  In the present embodiment, out of the vacuum compartments 10a and 10b, first, the air in the vacuum compartment 10a is extracted to vacuum-suck the central portion of the substrate 1, and then the air in the vacuum compartment 10b is extracted to remove the peripheral portion of the substrate 1. Can be discharged from the central portion of the substrate 1 faster than the peripheral portion of the substrate 1. Accordingly, it is possible to prevent air from remaining in the central portion of the substrate 1.

  In the present embodiment, all the suction holes 13 are connected to the same pipe 40a for a plurality of vacuum compartments 10a, and evacuation is performed simultaneously. However, the plurality of vacuum compartments 10a are further divided into the vicinity of the center of the substrate 1 and the periphery thereof, and separate pipes are connected to each other, so that the vacuum suction is sequentially performed from the vacuum compartment near the center to the surrounding vacuum compartments. You may start.

  After mounting the substrate 1, the chuck 10 is moved from the delivery position to the exposure position. When the substrate 1 is exposed at the exposure position, the electromagnetic valves 41a and 41b are closed and the electromagnetic valves 42a and 42b are opened. The air in the vacuum compartment 10a is sucked from the suction hole 13 through the pipe joint 30a, the pipe 40a, and the electromagnetic valve 42a to a low-vacuum vacuum facility. Similarly, the air in the vacuum section 10b is sucked from the suction hole 13 to the vacuum equipment having a low vacuum through the pipe joint 30b, the pipe 40b, and the electromagnetic valve 42b. Thus, the substrate 1 is vacuum-sucked to the chuck 10 with a second suction force that is weaker than the first suction force and does not bend. Thereby, since the substrate 1 is held flat on the chuck 10, the occurrence of back surface transfer is suppressed.

  After the substrate 1 is exposed at the exposure position, the chuck 1 is moved again to the delivery position. When the substrate 1 is recovered at the delivery position, the vacuum suction of the substrate 1 is released, the push-up pin is raised, and the substrate 1 is lifted from the chuck 10. At this time, air is introduced into the non-vacuum compartment 10d from the side surface of the chuck 10 and into the non-vacuum compartment 10d from the back surface of the chuck 10 through the air passage 15 and the air hole 14, so that the substrate 1 is removed from the chuck 10. It can be easily lifted, and no extra force is applied to the substrate 1.

  According to the embodiment described above, when the substrate 1 is mounted on the chuck 10 by providing the plurality of air holes 14 having such a size that the back surface transfer to the substrate 1 does not cause a problem on the substrate holding surface of the chuck 10. In addition, since the air between the substrate 1 and the chuck 10 can be discharged efficiently, the substrate 1 can be quickly mounted on the chuck 10 and defects due to distortion of the substrate 1 and back surface transfer can be reduced. it can.

  Further, by providing an air passage 15 wider than the air holes 14 communicating with the air holes 14 provided on the substrate holding surface of the chuck 10 on the back surface of the chuck 10, the air between the substrate 1 and the chuck 10 is discharged more efficiently. Therefore, the substrate 1 can be mounted on the chuck 10 more quickly, and defects due to distortion of the substrate 1 can be further reduced.

  Further, when the substrate 1 is mounted on the chuck 10, the substrate 1 is adsorbed by the adsorption hole 13 with the first adsorption force, and when the substrate 1 is exposed, the second adsorption force is weaker than the first adsorption force by the adsorption hole 13. By adsorbing the substrate 1, the air between the substrate 1 and the chuck 10 can be efficiently discharged through the adsorption holes 13, and the occurrence of backside transfer can be suppressed. The substrate 1 can be mounted more rapidly, and defects due to distortion and back surface transfer of the substrate 1 can be further reduced.

  Further, the non-vacuum section 10d is provided on the substrate holding surface of the chuck 10, the suction holes 13 are provided in the vacuum sections 10a, 10b, and 10c, and the air holes 14 are provided in the non-vacuum section 10d. Since the air can be discharged more efficiently, the substrate 1 can be mounted on the chuck 10 more quickly, and defects due to distortion of the substrate 1 can be further reduced.

  By exposing the substrate using the exposure apparatus or exposure method of the present invention, the time required for mounting the substrate on the chuck can be shortened, and defects due to substrate distortion and backside transfer can be reduced. Therefore, the display panel substrate can be manufactured with a short tact time and a high yield.

  For example, FIG. 8 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on a glass substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the glass substrate.

  FIG. 9 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the glass substrate by processes such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the glass substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 8, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 9, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus or the exposure method of the present invention can be applied.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. It is a top view of the chuck | zipper of the exposure apparatus by one Embodiment of this invention. It is a figure explaining the vacuum division and non-vacuum division of the chuck | zipper shown in FIG. It is a figure which shows the state which mounted the board | substrate in the chuck | zipper shown in FIG. It is a figure which shows the state which mounted the board | substrate in the chuck | zipper shown in FIG. 6A is a partial cross-sectional view of the AA portion in FIG. 2, and FIG. 6B is a partial cross-sectional view of the BB portion. It is a figure which shows the cross section of CC section of FIG. 2, and the structure of a pneumatic circuit. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Z-tilt mechanism 10 Chuck 10a, 10b, 10c Vacuum section 10d Non-vacuum section 11 Convex part 12 Bank 13 Adsorption hole 14 Air hole 15 Air passage 16 Push-up pin 20 Mask holder 30a, 30b Pipe joint 40a, 40b Piping 41a, 41b, 42a, 42b Solenoid valve

Claims (8)

An exposure apparatus having a chuck for holding a substrate through which light is transmitted ,
The chuck has a diameter of 4 mm or less on the substrate holding surface where transfer of the back surface to the substrate is not a problem. When the substrate is mounted on the chuck, air between the substrate and the chuck is discharged to the back surface of the chuck. A plurality of air holes , a plurality of protrusions that support the substrate, a bank that divides the space between the portion other than the protrusions and the substrate into a plurality of vacuum compartments, and a substrate disposed in each vacuum compartment is vacuum-adsorbed A plurality of adsorption means,
When the substrate is mounted on the chuck, a first suction force is generated in each suction means, and a suction force generation that causes each suction means to generate a second suction force that is weaker than the first suction force when the substrate is exposed. exposure apparatus comprising the means.   The exposure apparatus according to claim 1, wherein the chuck has an air passage wider on the back surface than the air hole communicating with the air hole. The chuck has a non-vacuum section on the substrate holding surface, the exposure apparatus according to the plurality of air holes to claim 1 or claim 2 characterized in that it has on the non-vacuum zone. An exposure method for exposing a substrate held by a chuck through which light passes ,
On the substrate holding surface of the chuck, there are a plurality of air holes with a diameter of 4 mm or less, a plurality of convex portions that support the substrate, and a space between the substrate and the portion other than the convex portions so that the back surface transfer to the substrate is not a problem. A bank that divides into a plurality of vacuum compartments, and a plurality of suction means for vacuum-sucking the substrate disposed in each vacuum compartment ,
When mounting the base plate to the chuck, the air between the substrate and the chuck while discharging to the rear surface of the chuck through the air hole, to adsorb the substrate at a first suction force by the suction means,
An exposure method comprising: adsorbing a substrate with a second suction force that is weaker than the first suction force by each suction means during exposure of the substrate . 5. The exposure method according to claim 4 , wherein an air passage wider than an air hole communicating with an air hole provided on a substrate holding surface of the chuck is provided on the back surface of the chuck. 6. The exposure method according to claim 4 , wherein a non-vacuum section is provided on the substrate holding surface of the chuck, and a plurality of air holes are provided in the non-vacuum section. A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to any one of claims 1 to 3 . A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure method according to any one of claims 4 to 6 .

Images