JP4798811B2 - Preservative composition for manufacturing engineering wood and engineering wood - Google Patents

Description

  The present invention relates to a wood preservative composition. More specifically, an antiseptic composition for producing engineering wood, which is obtained by blending a specific preservative with an adhesive used in the production of so-called processed wood (engineering wood) such as veneer laminate (LVL) and plywood, The present invention relates to an engineering wood produced using an antiseptic composition.

  So-called processed wood (engineering wood) such as plywood and veneer laminate (LVL) is an excellent material that has improved the defects of solid wood, and future production expansion is expected. However, as a raw material of engineering wood, a low quality material such as a southern ocean material is used, and therefore, there is a drawback that it is susceptible to biological deterioration (rotation, insect damage).

  Engineering wood's antiseptic and insecticidal treatment is roughly divided into chemical injection and chemical-containing adhesive treatment. In the injection process, a large-scale pressurized injection plant is separately required, whereas in the adhesive treatment, the antiseptic engineering wood can be produced simply by mixing the chemical into the adhesive. Therefore, it can be said that the adhesive treatment is a more efficient treatment method.

  In the adhesive treatment, it is necessary to select a chemical (preservative) in consideration of treatment conditions different from those of pressure injection and surface treatment. In other words, since the adhesive used in the manufacture of engineering wood is generally based on a thermosetting resin in an alkaline region such as a phenol resin, the antiseptic compounded in this adhesive has basic antiseptic activity. In addition to being (1) compatible with the base resin, (2) not denatured in the alkaline region of pH 9-13 (having alkali resistance), and (3) thermosetting conditions (130- The performance of not changing in quality at 150 ° C. (having heat resistance) is required.

  However, there is no prior art document that specifically discloses a preservative that satisfies the above conditions (1) to (3). In addition, there is no prior art document that specifically describes the production of engineering wood having actually excellent antiseptic properties using an adhesive containing such an antiseptic.

  Epoxyconazole used in the preservative composition for producing engineering wood of the present invention (hereinafter sometimes abbreviated as “wood preservative composition”) is a known compound, and there are many references from old times.

  For example, Japanese Patent Publication No. 4-74355 (US Pat. No. 4,464,381) (Patent Document 1) discloses that epoxiconazole can be used for controlling wood-degrading fungi. Japanese Patent No. 3541975 (Australian Patent No. 698343) (Patent Document 2), Japanese Patent Application Laid-Open No. 2000-95621 (International Publication No. 00/004776 pamphlet) (Patent Document 3), Japanese Patent Application Laid-Open No. 2003-73211. (Patent Document 4), JP 2003-81714 A (Patent Document 5), JP 2003-252705 A (Patent Document 6), JP 2005-47056 A (Patent Document 7), JP 2007-118261 A. No. (Patent Document 8), Japanese Patent Application Laid-Open No. 2007-254321 (Patent Document 9), and Japanese Patent Application Laid-Open No. 2009-96751 (Patent Document 10), which list many bactericides and preservatives, respectively. By way of example, it is stated that compositions containing epoxiconazole can also be used for adhesive treatment. However, these documents do not describe any examples of actually using epoxiconazole for adhesive treatment. WO98 / 018328 pamphlet (Patent Document 11) discloses a binder for producing a timber material containing a specific insecticidal compound and an azole compound as a bactericide, but describes epoxyconazole. Not.

  These prior arts do not describe an example of manufacturing engineering wood having antiseptic performance by actually using epoxyconazole to treat with adhesive, and epoxyconazole is treated with adhesive as in the present invention. There is no prior art that describes a particularly high preservative effect in the law.

Japanese Patent Publication No. 4-74355 (U.S. Pat. No. 4,464,381) Japanese Patent No. 3541975 (Australian Patent No. 698343) JP 2000-95621 A (International Publication No. 00/004776 pamphlet) Japanese Patent Laid-Open No. 2003-73211 JP 2003-81714 A JP 2003-252705 A JP 2005-47056 A JP 2007-118261 A JP 2007-254321 A JP 2009-96751 A International Publication No. 98/018328 Pamphlet

  Accordingly, an object of the present invention is to provide an antiseptic composition for producing engineering wood, which can be used for producing engineering wood such as plywood and veneer laminate (LVL), and can efficiently produce engineering wood having a high antiseptic effect, and the antiseptic composition thereof. It is to provide an engineering wood obtained by using the composition.

  The inventors have performed a very comprehensive and extensive experiment with actual adhesives used in the manufacture of engineering wood and a number of agents with antiseptic activity. As a result, among these many chemicals, only epoxiconazole was found to be compatible with the manufacturing conditions of engineering wood such as plywood and veneer laminate (LVL), and exhibit an antiseptic effect at an extremely low concentration. Was completed.

That is, this invention provides the following antiseptic composition for engineering wood manufacture, and engineering wood.
1. An antiseptic composition for producing engineering wood, comprising epoxyconazole and a thermosetting resin.
2. 2. The antiseptic composition for producing engineering wood according to 1, wherein the thermosetting resin is selected from the group consisting of a phenol resin, a phenol / resorcinol copolymer resin, a urea resin, a urea / melamine resin, and a melamine / phenol resin.
3. 3. The preservative composition for engineering wood production according to 1 or 2 above, wherein the engineering wood is a plywood, a single board laminate (LVL), a particle board or a fiber board.
4). The engineering wood manufactured using the antiseptic composition for engineering wood manufacture in any one of said 1-3.
5. 5. The engineering wood as described in 4 above, which is a plywood, a single plate laminate (LVL), a particle board or a fiber board.

  This invention provides the wood preservative composition which mix | blended the specific preservative (epoxyconazole) which does not change by manufacturing conditions with the adhesive agent used at the time of manufacture of engineering wood. According to the wood preservative composition of the present invention, an engineering wood exhibiting an excellent antiseptic effect can be efficiently produced by blending a small amount of active ingredients.

In the present invention, epoxiconazole is used as an active ingredient of an antiseptic composition for producing engineering wood.
Epoxyconazole used as an active ingredient in the present invention can be produced by a known method, for example, a method described in JP-B-4-74355 (US Pat. No. 4,464,381).

  When preparing the antiseptic composition for producing engineering wood of the present invention, the active ingredient may be added to the resin as it is, but usually the active ingredient is mixed with a solid carrier, liquid carrier or gas carrier in advance. If necessary, add surfactants and other formulation aids, formulate oils, emulsions, solubilizers, wettable powders, suspensions, flowables, powders, etc., and add them to the resin. To do.

  Examples of solvents that can be used in the preparation of these preparations include aromatic organic solvents such as toluene, xylene, and methylnaphthalene solvents, halogenated hydrocarbons such as dichloromethane and trichloroethane, alcohols such as isopropyl alcohol and benzyl alcohol, Examples include glycol solvents such as polyethylene glycol and polypropylene glycol, kerosene N-methylpyrrolidone, phosphate esters, and benzoate esters.

  As the surfactant used for formulation, an anionic, nonionic or zwitterionic surfactant can be used.

  The wood preservative composition of the present invention contains 0.01 to 90% by mass, preferably 0.1 to 50% by mass of the active ingredient.

  When the active ingredient of the wood preservative composition of the present invention is used in combination with other antibiotic compounds, the antibiotic effect of the drug can be further enhanced or the action spectrum can be expanded. Wood treatment with these antibiotic compounds can also be carried out as a pretreatment (treatment of single veneer before bonding) or posttreatment (treatment of engineering wood after production) of the wood preservative composition (adhesive) treatment according to the present invention. However, the wood treatment can be performed simultaneously with the addition of the wood preservative composition of the present invention.

  A copper compound is mentioned as a suitable example of the antibiotic compound which can be used for this purpose. Examples of copper compounds include copper sulfate, copper chloride, copper phosphate, copper hydroxide, copper carbonate, basic copper carbonate, basic copper acetate, basic copper phosphate, basic copper chloride, copper oxide, suboxide Copper, copper acetate, copper naphthenate, copper oleate, copper stearate, copper octoate, copper benzoate, copper citrate, copper lactate, copper tartrate, copper 2-ethylhexanoate, and these copper compounds Examples include complexes stabilized in a water-soluble state, and hydrates of these compounds. When prescribing these preparations as water-dilutable preparations, conventionally known ammonium-based compounds and amine-based compounds can be used to make the copper compound a stable solution. , Ammonium carbonate, ammonium bicarbonate, ethanolamine, diethanolamine, triethanolamine, propanolamine, triisopropanolamine, N-methylethanolamine, N-methyldiethanolamine, N, N-dimethylethanolamine, N-ethylethanolamine, N -Ethyldiethanolamine, isopropanolamine, aminoethylethanolamine, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, polyethyleneimine , N, N-dimethylethylenediamine, 1,2-propanediamine, 1,3-propanediamine, polyallylamine and the like. In addition, various carbonate compounds, carboxylic acid compounds, or mineral acids can be further added to adjust the pH. Specifically, boric acid, naphthenic acid, formic acid, acetic acid, propionic acid, hexane can be used. Acid, heptanoic acid, octanoic acid, stearic acid, palmitic acid, oleic acid, benzoic acid, citric acid, lactic acid, tartaric acid, malic acid, succinic acid, adipic acid, fumaric acid, malonic acid, gluconic acid, sebacic acid, cyclohexane acid 2-ethylhexanoic acid, isooctanoic acid, sodium bicarbonate, ammonium bicarbonate, phosphoric acid, sodium dihydrogen phosphate, potassium dihydrogen phosphate, and the like, and hydrates thereof can be used.

In the wood preservative composition of the present invention, for the purpose of enhancing the antibiotic effect or expanding the action spectrum, other suitable antibiotic compounds used in combination include azaconazole, viteltanol, bromconazole, Cyproconazole, diniconazole, fenbuconazole, fukuquinconazole, flusilazole, flutriazole, hexaconazole, imibenconazole, ipconazole, metconazole, microbutanyl, paclobutrazole, penconazole, propiconazole, tebuconazole, tetra Conazole, triadimephone, triadimenol, triticonazole, uniconazole, hexaconazole, 2- (2,4-difluorophenyl) -1- (1H-1,2,4-triazol-1-yl)- 3- (Trimethyl Ril) propan-2-ol and other triazoles; azoxystrobin, picoxystrobin, pyraclostrobin and other strobins; dichlorofluanide (eupalene), trifluanide (methylleupalene), cyclofluoride, phorpet, fluoro Sulfonamides such as phorpet; Benzimidazoles such as carbendazim (MBC), benomyl, fuberitazole, thiabendazole or their salts; Thiocyanates such as thiocyanatomethylthiobenzothiazole (TCMTB), methylebis thiocyanate (MBT) C11-C14-4-alkyl-2,6-dimethylmorpholine homologue (tridemorph), (±) -cis-4- [3- (t-butylphenyl) -2-methylpropyl] -2,6- Dimethylmo Morpholine derivatives such as ruphorin (phenpropimorph, farimorph); o-phenylphenol, tribromophenol, tetrachlorophenol, pentachlorophenol, 3-methyl-4-chlorophenol, dichlorophenol, chlorophene and salts thereof Phenols; 3-iodo-2-propynyl-n-butylcarbamate (IPBC), 3-iodo-2-propynyl-n-hexylcarbamate, 3-iodo-2-propynylcyclohexylcarbamate, 3-iodo-2-propynylphenyl Carbamate, 3-iodo-2-propynyl-n-butylcarbamate, p-chlorophenyl-3-iodopropargyl formal (IF-1000), 3-bromo-2,3-diiodo-2-propenylethyl carbonate (Sanplus), organic iodo compounds such as 1-[(diiodomethyl) sulfonyl] -4-methylbenzene (amicar); organic bromo derivatives such as bronopol; N-methylisothiazolin-3-one, 5-chloro-N-methyl Isothiazolines such as isothiazoline-3-one, 4,5-dichloro-N-octylisothiazoline-3-one, N-octylisothiazolin-3-one (octyrinone); benzisothiazolines such as cyclopentaisothiazoline; 1-hydroxy- Pyridines such as 2-pyridinethione (or its sodium salt, iron salt, manganese salt, zinc salt, etc.), tetrachloro-4-methylsulfonylpyridine; tin, copper, zinc naphthate, octoate, 2-ethylhexanoate Oleate, phosphate, benzo Metal soaps such as over preparative; Cu ₂ O, CuO, oxides such as ZnO; tributyltin naphthenate, organic tin derivatives, such as t- butyl tin oxide; tris -N- (cyclohexyl diazenium dioxin) - tributyltin or K salts , Metal compounds such as bis- (N-cyclohexyl) diazonium-dioxin copper or aluminum; Na or Zn salts of dialkyldithiocarbamates, carbamates such as tetramethyldiuram disulfide (TMTD); 2,4,5,6-tetra Nitriles such as chloroisophthalonitrile (chlorothalonil); microbial agents having an active halogen atom such as Cl-Ac, MCA, tectamer, bronopol, blomidox; benzthiazols such as 2-mercaptobenzotisols and dazomet Quinolines such as 8-hydroxyquinoline; compounds producing formaldehyde such as benzyl alcohol mono (poly) hemiformal, oxazolidine, hexahydro-s-triazine, N-methylol chloroacetamide; sodium octaborate tetrahydrate Compounds, boron compounds such as boric acid and borax; fluorine compounds such as sodium fluoride and sodium silicofluoride; azinophos-ethyl, azinophos-methyl, 1- (4-chlorophenyl) -4- (O-ethyl, S-propyl) ) Phosphoryloxypyrazole (TIA-230), chloropyrifos, tetrachlorobinphos, coumafos, detomen-S-methyl, diazinon, dichlorvos, dimethoate, etoprofos, etrimphos, fenitrothion, pyridafenthion, f Phosphate esters such as tenofos, parathion, parathion-methyl, propetanephos, fosalon, foxime, pyrimphos-ethyl, pyrimiphos-methyl, profenofos, prothiofos, sulfprofos, triazophos and torquerolphon; aldicarb, benicurve, BPMC ( Carbamates such as 2- (1-methylpropyl) phenylmethylcarbamate, butocarboxyme, butoxycarboxyme, carbaryl, carbofuran, carbosulfan, cloetocarb, isoprocarb, methomyl, oxamyl, pirimicarb, promecarb, propoxl and tidicarb; Alphamethrin, empentrin, profluthrin, tralomethrin, metfurthrin, phenothrin, imiprotri , Ciphenothrin, phthalthrin, pyrethrin, praretrin, framethrin, dimefluthrin, profluthrin, tefluthrin, bioareslin, esbioslin, violesmethrin, cycloprotorin, cyfluthrin, decamethrin, cyhalothrin, cypermethrin, deltamethrin, permethrin, methrin Pyrethroids such as thrin, fenvalerate, flucitrinate, flumtrin, fulvalinate, etofenprox; and neonicotinoids such as acetamiprid, imidacloprid, thiacloprid, nitenpyram, clothianidin, dinotefuran, thiamethoxam, and nitenpyram. These antibiotic compounds may be used alone or in combination.

[Wood-rot fungi]
Wood decay fungi that the wood preservative composition of the present invention works effectively include the following bacterial species.
Coniophora puteana, Trametes versicolor, Postia placenta, Postia vaporaria, Poria vaillantii, Gloeophyria sepialium sepialium , Gloeophylium adoratum, Gloeophylium abietinum, Gloeophylium trabeum, Gloeophylium protactum, Lentinus enti lepidus L Eddes (Lentinus edodes), Lentinus cyathiformes (Lentinus cyathiformes), Lentinus squarrolosus (Lentinus squarrolosus), Paxillas Panuides (Pa xillus panuoides, Fomitopsis palustris, Pleurotus ostreatus, Donkioporia expansa, Serpula lacrymans, serpulno es Glenospora graphii), Fomitopsis lilacino-gilva, Perenniporia tephropora, Antrodia xantha, Antrodia vaillantii Incomplete fungi including (Cladosporium herbarum), Chaetomiumu globsum, Ketotomium alba-arenulum, Petriella Setiffera Petriella setifera), Torichurasu-Supirarisu (Trichurus spiralis), whatever child ascomycete such a Fumikoura-Gurisera (Humicola grisera).

Wood discoloration bacteria to which the preservative for preservation of wood of the present invention works effectively include the following bacterial species.
Aureobasidium pullulans, Scleroph pithyophila, Scopular phycomyces, Aspergillus niger, Penicillium varie , Incomplete fungi including Trichoderma rignorum and Dactyleum fusarioides. Ascomycetes, including Caratocystis minor. A zygomycete containing Mucor spinosus.

[Processing object]
The wood preservative composition of the present invention can be used for the production of various engineering woods, that is, plywood, veneer laminate (LVL), particle board and fiber board, and imparts a very high antiseptic effect to these engineering woods. can do.

  Plywood refers to a board made of thinly stripped wood, that is, a single board that is bonded together by odd-numbered sheets obtained by crossing the fiber directions of adjacent single boards.

  LVL is a product made by laminating and bonding several to several tens of layers, with the fiber direction being almost parallel to each other, with a thickness of about 2 to 4 mm cut by a rotary lace or slicer. It is also called a material (Laminated Veneer Lumber; LVL) or a parallel single plate laminate (parallel plywood).

The particle board is a wooden board obtained by mixing a small piece of wood with an adhesive and hot-pressing it.
The fiber board is a wood board that has been cooked by mixing the digested wood fibers with an adhesive and hot-pressed. From the lowest density, insulation board (density less than 0.35 g / cm ³ ), medium density fiber board (Mid Density Fiber Board; MDF) (density of ^{0.35g / cm 3 ~0.80g / cm 3} ), it is divided into hardboard (density 0.85 g / cm ³ or higher).

  As the base resin of the adhesive used in the wood preservative composition of the present invention, phenol resin (alkaline resole resin), phenol-resorcinol copolymer resin, urea resin, urea-melamine resin, melamine-phenol resin can be used. Yes, phenolic resin (alkaline resole resin), phenol / resorcinol copolymer resin, and melamine / phenolic resin, which are alkaline base resins, can be used suitably, and phenolic resin (alkaline resole resin) can be used more suitably is there.

In general, these adhesives use wheat flour, wood flour, walnut flour, palm flour, and inorganic salts as hardeners to prevent excessive penetration into wood, promote curing, control viscosity, and prevent aging of the adhesive layer. It is done.
In the present invention, it is desirable to add an active ingredient (preservative) when blending these additives into the adhesive.

The concentration of active ingredients (absorbed amount of wood) in engineering wood (plywood, LVL, etc.) produced using the wood preservation composition of the present invention is usually 0.1 to 500 g / m ³ , preferably 1 to 1 150 g / m ³ .

The wood preservative composition of the present invention, which is an adhesive containing an active ingredient, is added to the surface of a veneer by a glue spreader, a roll spreader or an extruder coater. The standard coating amount is 50 to 500 g / m ² . After laminating the coated veneer, the adhesive is cured by cold pressure and heating to obtain a final product. The hot-pressing temperature varies somewhat depending on the adhesive and is usually 50 to 200 ° C, preferably 100 to 150 ° C. The hot pressing time varies somewhat depending on the adhesive and is usually 5 to 300 seconds / mm, but 10 to 60 seconds / mm is preferable. The pressing pressure varies depending on the wood species and specific gravity of the veneer used, and is usually 5 to 20 kgf / cm ² , but 7 to 15 kgf / cm ² is preferable.

  Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to these examples.

Preparation Example 1:
The following compounds known to have wood preservative activity were dissolved in methylethylene triglycol at a concentration of 10% (W / W) to obtain solutions of the respective compounds.
Epoxyconazole (manufactured by Wako Pure Chemical Industries, the same applies hereinafter) (Example 1), hexaconazole (Comparative Example 1), 2- (2,4-difluorophenyl) -1- (1H-1,2,4- Triazol-1-yl) -3- (trimethylsilyl) propan-2-ol (prepared according to the method of JP-B-7-68251) (Comparative Example 2), benzalkonium chloride (Comparative Example 3), didecyldimethylammonium chloride ( Comparative Example 4), Cyproconazole (Comparative Example 5), Tebuconazole (Comparative Example 6), Azaconazole (Comparative Example 7), Cimeconazole (Comparative Example 8), Fenbuconazole (Comparative Example 9), Flucilazole (Comparative Example 10) , Flutriahole (Comparative Example 11), imibenconazole (Comparative Example 12), ipconazole (Comparative Example 13), metconazole (Comparative Example 14), Miku Butanyl (Comparative Example 15), penconazole (Comparative Example 16), propiconazole (Comparative Example 17), tetraconazole (Comparative Example 18), triazimephone (Comparative Example 19), triticonazole (Comparative Example 20), Azoxystrobin (Comparative Example 21), pyraclostrobin (Comparative Example 22), 3-iodo-2-propynyl-n-butylcarbamate (IPBC) (manufactured by Nagase ChemteX) (Comparative Example 23), N-octyl Isothiazoline-3-one (manufactured by Nagase ChemteX) (Comparative Example 24), chlorothalonil (manufactured by SDS Biotech) (Comparative Example 25).

Test Example 1: Miscibility test with phenol resin adhesive Phenol resin adhesive Dianol D-117 (manufactured by Oshika) 1000 g, flour 70 g, and calcium carbonate 100 g were mixed and kneaded well. The solutions of Example 1 and Comparative Examples 1 to 25 were added to 17 g of this kneaded product, mixed further, and the viscosity change of the adhesive was visually observed for 60 minutes. The results are shown in Table 1. From Table 1, it was revealed that the compounds of Comparative Examples 3 and 4 cured the adhesive and had practical problems. Although many documents listed in the prior art documents describe that quaternary ammonium compounds can also be applied to the adhesive mixing method, it is clear that there are practical problems (Comparative Example 3 and 4). On the other hand, it was clarified that other compounds including Example compounds have no problem in terms of compatibility.

Preparation Example 2: Preparation of antiseptic plywood with urea-melamine resin 1000 g of urea-melamine resin (PWP-60, manufactured by Oshika) was added to 180 g of wheat flour and kneaded to obtain a kneaded product. To this kneaded product, 8 g of ammonium chloride was added as a curing agent, and the solutions of the compounds of Example 1 and Comparative Examples 1, 2, and 5 to 25 were adjusted to 150, 100, 50, and 25 g / m ³ as the concentration in the finished wood. Each was added and kneaded. 18 g of the kneaded material was applied to the adhesive surface of three single red lauan plates each having a width of 30 × 30 cm and a thickness of 0.85 mm / 2.4 mm / 0.85 mm. After 20 minutes of cold pressure, 120 ° C. hot pressure (10 kgf / cm ² ) was added for 2 minutes to prepare the desired plywood. Each prepared plywood was processed into a size of 20 × 20 × 4.1 mm and used as a test sample.

Preparation Example 3 Preparation of Preservative LVL Using Phenol Resin 1000 g of phenol resin adhesive Danol D-117 (manufactured by Oshika), 70 g of flour, and 100 g of calcium carbonate were mixed and kneaded well. To this kneaded product, the solutions of Example 1 and Comparative Examples 1, 2, and 5 to 25 were added at concentrations of 150, 100, 50, and 25 g / m ³ in the finished wood, and further kneaded. 18 g of the kneaded material was applied to the bonding surface of 3 sheets of Radiata pine each having a size of 30 × 30 cm and a thickness of 3 mm, bonded together, cooled at room temperature for 20 minutes, and then heated at 140 ° C. (10 kgf / cm ² ) was added for 2 minutes to prepare the target LVL. Each prepared LVL was processed into a size of 20 × 20 × 9 mm, and used as a test sample.

Test Example 2: Preservation test of antiseptic plywood and LVL The plywood and LVL sample prepared in Preparation Examples 2 and 3 were evaluated by an antiseptic performance test for JIS K 1571: 2004 injection treatment. The weathering operation and the antiseptic test method were carried out according to the test method. The results are shown in Tables 2 and 3. As for the comparative example compound, the compound of Comparative Example 1 showed an antiseptic effect at 50 g / m ³ or more for Prunus and Kawatake, and the compound of Comparative Example 2 was 50 g / m ³ or more for Prunus edulis, and 100 g / m for Kawatake. ^The epoxyconazole as an example compound showed a sufficient antiseptic effect even at 25 to 50 g / m ³ , compared to showing no effect except that it exhibited an antiseptic effect at ³ or more.

Preparation Example 4: Preparation of antiseptic plywood with urea-melamine resin An antiseptic plywood was prepared in the same manner as in Preparation Example 2. Each prepared plywood was processed into a size of 8.9 × 8.9 × 100 mm to obtain a test sample.

Preparation Example 5: Preparation of preservative LVL with phenol resin Preservative LVL was prepared in the same manner as Preparation Example 3. Each of the prepared LVLs was processed into a size of 9 × 9 × 100 mm and used as a test sample.

Test example 3: Preservation test of antiseptic plywood and LVL (fungus cellar decay tank test)
The plywood and LVL samples prepared in Preparation Examples 4 and 5 were evaluated by the JISK1571: 2004 fan gas cellar decay tank test. The weathering operation and the antiseptic test method were carried out according to the test method. The test temperature was 25 ° C. and the test period was 6 months (because the average damage degree of the untreated specimen exceeded 2.5 in 6 months). The results are shown in Tables 4 and 5. Surprisingly, the compounds of Comparative Examples 1 and 2 that showed the effect in Test Example 2 were not effective in the adhesive mixing method. Nasol showed a sufficient antiseptic effect even at 25-50 g / m ³ . With regard to many existing preservatives, the effect of the adhesive treatment method was actually examined, and it was confirmed that only epoxiconazole was compatible with the adhesive treatment method at a low concentration. That is, it was shown that only epoxiconazole has sufficient antiseptic activity even under the harsh conditions of the adhesive mixing method. Japanese Patent No. 4223558 discloses a composition containing an insecticidal component (imidacloprid) used in an adhesive mixing method, and IPBC and azoles such as tebuconazole, propiconazole and cyproconazole can be added together with the insecticidal component. However, the active ingredient used in the wood preservative composition of the present invention showed an outstanding effect as compared with the compounds described in the patent. Therefore, it is clear that the wood preservative composition of the present invention cannot be easily achieved by those skilled in the art based on the techniques described in the prior art documents.

  This invention provides the wood preservative composition which mix | blended the specific preservative (epoxyconazole) which does not change by manufacturing conditions with the adhesive agent used at the time of manufacture of engineering wood. According to the wood preservative composition of the present invention, an engineering wood exhibiting an excellent antiseptic effect can be efficiently produced by blending a small amount of active ingredients.

Claims (5)

  An antiseptic composition for producing engineering wood, comprising epoxyconazole and a thermosetting resin.   The antiseptic composition for producing engineering wood according to claim 1, wherein the thermosetting resin is selected from the group consisting of a phenol resin, a phenol / resorcinol copolymer resin, a urea resin, a urea / melamine resin, and a melamine / phenol resin.   The preservative composition for engineering wood production according to claim 1 or 2, wherein the engineering wood is a plywood, a single board laminate (LVL), a particle board or a fiber board.   The engineering wood manufactured using the antiseptic composition for engineering wood manufacture in any one of Claims 1-3.   The engineering wood according to claim 4, which is a plywood, a single-plate laminate (LVL), a particle board or a fiber board.