JP4757477B2 - 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 - Google Patents
光源ユニット、それを用いた照明装置及びそれを用いた表示装置 Download PDFInfo
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Liquid Crystal (AREA)
Description
SID03 Digest、 pp.1262‐1265(2003) SID04 Digest、 pp.1222‐1225(2004)
Claims (14)
- 発光ダイオードチップと、リードフレームと、透明封止剤を有する光源ユニットにおいて、
前記リードフレームは、少なくても3組以上有し、前記リードフレームのそれぞれに同色の発光ダイオードチップが複数個直列接続され、
前記同色の発光ダイオードチップが複数個直列接続された前記リードフレームの両端部に当該発光ダイオードチップの光照射側に折れ曲がって、隣接部材に対する位置決め、あるいは給電端子として機能する折れ曲り部を有し、
前記発光ダイオードチップは赤、緑、青の3色からなり、
前記赤の発光ダイオードチップの温度依存性が前記緑、青のダイオードチップの温度依存性よりも高く、
前記赤の発光ダイオードチップが接続された前記リードフレームの表面積が、他の色の発光ダイオードチップが接続されたリードフレームの表面積より大きく、
前記赤、緑、青の3色からなる発光ダイオードチップを前記透明樹脂で一体に封止してなり、
前記透明樹脂で封止した回りに、前記赤、緑、青の発光ダイオードチップからの光を前方に出射させる反射モールドが形成されたことを特徴とする光源ユニット。 - 請求項1において、
前記発光ダイオードチップの光出射部に反射型偏光板を配置したことを特徴とする光源ユニット。 - 請求項1において、
前記リードフレームは銅または銅を主材料とした合金であり、かつ前記リードフレームの少なくとも前記発光ダイオードチップの実装部には銀または銀を主材料としためっきが施されていることを特徴とする光源ユニット。 - 請求項1乃至3の何れかにおいて、
前記透明樹脂剤が2層以上になっており、少なくても前記発光ダイオードチップに接する側の前記透明封止剤が屈折率の異なる微粒子を含む散乱性を有することを特徴とする光源ユニット。 - 請求項4において、
前記散乱性を有する透明樹脂剤に含まれる微粒子の屈折率が1.6以上であることを特徴とする光源ユニット。 - 請求項1乃至5の何れかにおいて、
前記発光ダイオードチップの2つの電極がそれぞれ同一の面にあり、前記電極を前記リードフレーム側に向けて当該リードフレームに実装してあることを特徴とする光源ユニット。 - 請求項1乃至6の何れかにおいて、
前記発光ダイオードチップの前記2つの電極がそれぞれ異なる面にあり、前記リードフレームとは反対側の面にある電極をワイヤで前記リードフレームに接続していることを特徴とする光源ユニット。 - 請求項1乃至7の何れかにおいて、
前記リードフレームが絶縁層を介して金属基板に貼り付けられていることを特徴とする光源ユニット。 - 発光ダイオードチップとリードフレームと透明封止剤を有し、前記リードフレームは少なくても3組以上有して前記リードフレームのそれぞれに同色の発光ダイオードチップが複数個直列接続されており、
前記同色の発光ダイオードチップが複数個直列接続された前記リードフレームの両端部に当該発光ダイオードチップの光照射側に折れ曲がって、隣接部材に対する位置決め、あるいは給電端子として機能する折れ曲り部を有し、
前記発光ダイオードチップは赤、緑、青の3色からなり、
前記赤の発光ダイオードチップの温度依存性が前記緑、青のダイオードチップの温度依存性よりも高く、
前記赤の発光ダイオードチップが接続された前記リードフレームの表面積が、他の色の発光ダイオードチップが接続されたリードフレームの表面積より大きく、
前記赤、緑、青の3色からなる発光ダイオードチップを前記透明樹脂で一体に封止してなる光源ユニットをM行×N列(M,Nは1以上の整数で少なくても一方が2以上の整数)に配列し、前記光源ユニットの光出射側に空隙を介して拡散板を配置したことを特徴とする照明装置。 - 請求項9において、
前記光源ユニットの光出射側に空隙を介して拡散板を配置し、前記光源ユニットの光出射部以外には反射板を配置したことを特徴とする照明装置。 - 請求項9において、
前記光源ユニットの光出射部以外には反射板を配置し、前記同色の発光ダイオードチップは前記行毎にすべて直列接続されて独立に明るさ制御することを特徴とする照明装置。 - 請求項11において、
前記発光ダイオードチップの各色毎にPM変調制御で明るさ制御することを特徴とする照明装置。 - 請求項11又は12において、
明るさを検出する光センサまたは温度を検出する温度センサの一方または双方を具備し、前記光センサまたは前記温度センサの一方または双方からの出力を基に、各色の前記行毎に独立に明るさ制御する明るさ制御回路を備えたことを特徴とする照明装置。 - 非発光型画像表示パネルと、前記非発光型画像表示パネルの裏面に、請求項9〜13の何れかに記載の照明装置を備え、前記非発光型画像表示パネルが前記照明装置からの光の透過光量を制御するための前記行毎の走査信号に同期して前記照明装置の明るさを前記行毎に制御することで画像を可視表示することを特徴とする表示装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004320383A JP4757477B2 (ja) | 2004-11-04 | 2004-11-04 | 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 |
TW094137045A TWI289366B (en) | 2004-11-04 | 2005-10-21 | Light source unit, illumination device using the same, and display device using the same |
CNB2005101160371A CN100446247C (zh) | 2004-11-04 | 2005-10-27 | 光源单元、照明装置及使用该照明装置的显示装置 |
KR1020050104659A KR100717226B1 (ko) | 2004-11-04 | 2005-11-03 | 광원 유닛, 그를 이용한 조명 장치 및 그를 이용한 표시장치 |
US11/265,259 US7478925B2 (en) | 2004-11-04 | 2005-11-03 | Lighting source unit, illuminating apparatus using the same and display apparatus using the same |
Applications Claiming Priority (1)
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JP2004320383A JP4757477B2 (ja) | 2004-11-04 | 2004-11-04 | 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 |
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JP2006134992A JP2006134992A (ja) | 2006-05-25 |
JP4757477B2 true JP4757477B2 (ja) | 2011-08-24 |
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US (1) | US7478925B2 (ja) |
JP (1) | JP4757477B2 (ja) |
KR (1) | KR100717226B1 (ja) |
CN (1) | CN100446247C (ja) |
TW (1) | TWI289366B (ja) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070102718A1 (en) * | 2005-11-07 | 2007-05-10 | Akira Takekuma | Lens in light emitting device |
JP4724618B2 (ja) * | 2005-11-11 | 2011-07-13 | 株式会社 日立ディスプレイズ | 照明装置及びそれを用いた液晶表示装置 |
JP2007206282A (ja) * | 2006-01-31 | 2007-08-16 | Toshiba Corp | 情報処理装置、及び輝度制御方法 |
CN101421556A (zh) * | 2006-04-19 | 2009-04-29 | 夏普株式会社 | 照明装置和具备该照明装置的液晶显示装置 |
JP5007395B2 (ja) * | 2006-06-23 | 2012-08-22 | シーシーエス株式会社 | 立体光源体 |
JP4300223B2 (ja) * | 2006-06-30 | 2009-07-22 | 株式会社 日立ディスプレイズ | 照明装置および照明装置を用いた表示装置 |
DE102007021042A1 (de) | 2006-07-24 | 2008-01-31 | Samsung Electro-Mechanics Co., Ltd., Suwon | Leuchtdiodenmodul für Lichtquellenreihe |
JP2008060344A (ja) * | 2006-08-31 | 2008-03-13 | Toshiba Corp | 半導体発光装置 |
JP5028562B2 (ja) * | 2006-12-11 | 2012-09-19 | 株式会社ジャパンディスプレイイースト | 照明装置及びこの照明装置を用いた表示装置 |
JPWO2008078789A1 (ja) * | 2006-12-27 | 2010-04-30 | 昭和電工株式会社 | 光源連結体、発光装置、表示装置 |
ATE525891T1 (de) * | 2007-01-17 | 2011-10-15 | Osram Gmbh | Led-modul |
JP4862667B2 (ja) * | 2007-01-24 | 2012-01-25 | ソニー株式会社 | 光源モジュール及び光源装置 |
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- 2005-10-21 TW TW094137045A patent/TWI289366B/zh active
- 2005-10-27 CN CNB2005101160371A patent/CN100446247C/zh active Active
- 2005-11-03 KR KR1020050104659A patent/KR100717226B1/ko active IP Right Grant
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US20060092634A1 (en) | 2006-05-04 |
KR20060052423A (ko) | 2006-05-19 |
TW200633259A (en) | 2006-09-16 |
CN100446247C (zh) | 2008-12-24 |
KR100717226B1 (ko) | 2007-05-11 |
US7478925B2 (en) | 2009-01-20 |
JP2006134992A (ja) | 2006-05-25 |
TWI289366B (en) | 2007-11-01 |
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