JP4746003B2 - 移載装置及び移載方法 - Google Patents
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/16—Surface bonding means and/or assembly means with bond interfering means [slip sheet, etc. ]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
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Description
特許文献1には、ウエハを吸着保持するロボットアームからなる移載装置が開示されている。
本発明は、このような不都合に着目して案出されたものであり、その目的は、大型化、極薄化した半導体ウエハ等の板状部材を移載対象としても、当該板状部材の損傷原因を回避して移載することに適した移載装置及び移載方法を提供することにある。
前記板状部材の支持面を備えた支持手段と当該支持手段を移動させる移動手段とを備え、
前記支持面は、シート基材に接着剤層が積層された接着シートを相互に剥離可能に積層した積層体により構成され、
前記積層体の最外層となる接着シートと前記板状部材との接着、剥離により、前記載置手段間で板状部材を移載し、前記板状部材に接着する最外層の接着シートの接着力が低下したときに、当該接着シートを剥離して次の接着シートを最外層の接着シートとする、という構成を採っている。
相互に剥離可能に積層された接着シートの積層体を支持手段に支持するとともに、最外層となる接着シートの接着剤層を載置手段に載置された板状部材に接着して当該板状部材を支持し、
前記支持手段を他の載置手段側に移動して当該載置手段に板状部材を載せ、
次いで、前記最外層の接着シートを板状部材から剥離することで前記板状部材を移載し、
前記板状部材に接着する最外層の接着シートの接着力が低下したときに、当該接着シートを剥離して次の接着シートを最外層の接着シートとする、という方法を採っている。
更に、前記支持面を板状部材の相対する全面に接着する構成とした場合には、板状部材が数十μmの極薄タイプのウエハであっても、その外周側の垂れ下がりを確実に防止でき、テーブルに載せるときの外周側の破損が回避可能となる。
また、接着シートの面位置を部分的に変位させる変位手段を含む構成では、例えば、板状部材の側面視において、その中央部から両端部に向かうように接着シートを板状部材に接着させることができ、これにより、接着シートと板状部材との間に空気が混入することを回避することができ、確実な支持が可能となる。
この一方、板状部材の両端部から中央部に向かうように接着シートを板状部材から剥離することで、板状部材から支持手段の接着シートが離間するときの剥離抵抗を軽減することができ、容易に切り離しが可能となる。
なお、本実施形態における多関節型ロボット12は、本出願人によって既に出願された特願2006−115106号に記載されたものと実質的に同一のものであり、従って、ここでは更に詳細な説明を省略する。
また、最外層にある接着シートSは、一定限度において継続利用可能とされているため、ランニングコストを低減することができる。
すなわち、本発明は、主に特定の実施の形態に関して特に図示し、且つ、説明されているが、本発明の技術的思想及び目的の範囲から逸脱することなく、以上に述べた実施の形態に対し、形状、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。
従って、上記に開示した形状などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状などの限定の一部若しくは全部の限定を外した部材の名称での記載は、本発明に含まれるものである。
11 支持手段
12 多関節型ロボット(移動手段)
16 変位手段
T1 第1のテーブル(載置手段)
T2 第2のテーブル(載置手段)
T3 第3のテーブル(載置手段)
A 接着剤層
S 接着シート
SB シート基材
SL 積層体(支持面)
W 半導体ウエハ(板状部材)
Claims (8)
- 板状部材が載置される複数の載置手段間で前記板状部材を移載する移載装置において、
前記板状部材の支持面を備えた支持手段と当該支持手段を移動させる移動手段とを備え、
前記支持面は、シート基材に接着剤層が積層された接着シートを相互に剥離可能に積層した積層体により構成され、
前記積層体の最外層となる接着シートと前記板状部材との接着、剥離により、前記載置手段間で板状部材を移載し、前記板状部材に接着する最外層の接着シートの接着力が低下したときに、当該接着シートを剥離して次の接着シートを最外層の接着シートとすることを特徴とする移載装置。 - 前記支持面は、当該支持面に相対する板状部材の全面に接着する大きさを備えていることを特徴とする請求項1記載の移載装置。
- 前記支持手段は、前記板状部材に対して前記接着シートの面位置を部分的に変位させる変位手段を含むことを特徴とする請求項1又は2記載の移載装置。
- 前記変位手段は、前記接着シートと板状部材とを接着するときに、前記移動手段と同期して前記板状部材の側面視中央部から両端部に向かって接着するように前記接着シートを変位させることを特徴とする請求項3記載の移載装置。
- 前記変位手段は、前記板状部材に接着された接着シートを板状部材から剥離するときに、前記移動手段と同期して前記板状部材の側面視両端部から中央部に向かって剥離するように前記接着シートを変位させることを特徴とする請求項3記載の移載装置。
- 板状部材が載置される複数の載置手段間で前記板状部材を移載する移載方法において、
相互に剥離可能に積層された接着シートの積層体を支持手段に支持するとともに、最外層となる接着シートの接着剤層を載置手段に載置された板状部材に接着して当該板状部材を支持し、
前記支持手段を他の載置手段側に移動して当該載置手段に板状部材を載せ、
次いで、前記最外層の接着シートを板状部材から剥離することで前記板状部材を移載し、
前記板状部材に接着する最外層の接着シートの接着力が低下したときに、当該接着シートを剥離して次の接着シートを最外層の接着シートとすることを特徴とする移載方法。 - 前記接着シートと板状部材とを接着するときに、板状部材の側面視中央部から両端部に向かって接着することを特徴とする請求項6記載の移載方法。
- 前記板状部材を移載する際に、当該板状部材に接着された接着シートを板状部材の側面視両端部から中央部に向かって剥離することを特徴とする請求項6記載の移載方法。
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JP2007122303A JP4746003B2 (ja) | 2007-05-07 | 2007-05-07 | 移載装置及び移載方法 |
US12/111,477 US7875144B2 (en) | 2007-05-07 | 2008-04-29 | Transferring device and transferring method |
CN2008100964069A CN101303996B (zh) | 2007-05-07 | 2008-05-06 | 移载装置及移载方法 |
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JP2007122303A JP4746003B2 (ja) | 2007-05-07 | 2007-05-07 | 移載装置及び移載方法 |
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JP2008277688A JP2008277688A (ja) | 2008-11-13 |
JP4746003B2 true JP4746003B2 (ja) | 2011-08-10 |
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US (1) | US7875144B2 (ja) |
JP (1) | JP4746003B2 (ja) |
CN (1) | CN101303996B (ja) |
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CN101303996B (zh) | 2011-10-05 |
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