JP4624295B2 - Reflow apparatus and method - Google Patents

Description

  The present invention relates to a reflow apparatus and method for soldering an attachment (for example, an electronic component) to a material to be mounted (for example, a circuit board), and more particularly, a reflow apparatus and method for performing soldering using ultrasonic vibration. About.

  In recent years, portable electronic devices such as digital cameras and DVD players have become highly functional and miniaturized. Along with this, substrates built into these devices are also miniaturized and are becoming thinner. Moreover, in order to improve the freedom degree when arrange | positioning a board | substrate in an apparatus, adoption of a film board is also advancing.

  As the functionality of devices increases, the heat resistance of electronic components mounted on a substrate tends to decrease. For example, the heat resistance temperature of electronic components such as CCD modules and optical pickups is extremely low compared to the heat resistance temperature of conventional electronic components, and is 150 ° C. or lower.

  Furthermore, the use of solder containing lead is being reconsidered due to increased awareness of environmental protection. For example, in Europe, the use of solder containing lead is restricted by laws and regulations. Therefore, research on lead-free solder containing no lead as a substitute material for solder containing lead has been actively conducted in recent years. However, the melting point of lead-free solder is generally 200 ° C. to 220 ° C., which is 20 to 40 ° C. higher than the melting point of solder containing lead.

  When an electronic component is mounted on a substrate using lead-free solder, the entire substrate is uniformly heated by using a reflow apparatus that has been generally used. Therefore, the temperature of the electronic component rises to the same extent (200 ° C. to 220 ° C.) as the melting point of lead-free solder. If an electronic component with a heat-resistant temperature of 150 ° C or lower is to be mounted on the substrate, the electronic component may be damaged. Therefore, mount an electronic component with a heat-resistant temperature of 150 ° C or lower on the substrate using lead-free solder. It is difficult.

  Therefore, when mounting an electronic component with a low heat-resistant temperature on the board, by using the difference in heat capacity between the electronic component and the board, heat is suddenly applied to the board from the back side of the board on which the electronic component is placed. A method for ensuring a temperature difference between an electronic component and a substrate has been proposed (see Patent Document 1). However, since the melting point of lead-free solder is 200 ° C. or higher, which is considerably higher than the heat resistant temperature of electronic components (150 ° C. or lower), it is difficult to maintain the heat resistant temperature of electronic components to 150 ° C. or lower by the above method. is there.

  On the other hand, Sn-58% Bi (tin alloy containing 58 wt% bismuth) solder having a low melting point of 138 ° C. has recently been developed. However, bismuth contained in a large amount in Sn-58% Bi solder has a hard and brittle property and segregates inside the solder when the solder is cooled. Therefore, when an electronic component is mounted on a substrate using Sn-58% Bi solder, the reliability of the bonding state between the electronic component and the substrate is lowered.

  In view of this, a method has been proposed in which, when the molten solder is cooled, a minute vibration is applied to the solder to suppress segregation of bismuth, thereby ensuring bonding strength (see Patent Document 2). As a method for applying minute vibrations to solder, a method for transmitting vibrations by bringing an ultrasonic horn into contact with one side of a printed circuit board has been proposed.

  Furthermore, a reflow apparatus having an impedance matching mechanism as shown in FIG. 15 has been proposed so that ultrasonic vibrations are efficiently transmitted to the substrate (see Patent Document 3). A micro vibration application device 100 of FIG. 15 includes a micro vibration generation device 101, a micro vibration application device 102, and an impedance matching mechanism 103. The impedance matching mechanism 103 includes a holding member 103a that holds a substrate and an urging member 103b such as a spring.

  The impedance matching mechanism 103 has a function of aligning each mounted material 105 on which the mounting object 104 conveyed to the reflow apparatus is placed. The impedance matching mechanism 103 finely adjusts the load applied from the biasing member 102b to the mounted material 105 in real time, so that the impedance to the vibration in the minute vibration applying device 102 and the impedance to the vibration in the mounted material 105 are equal. Then, the vibration energy from the minute vibration applying device 102 is efficiently transmitted to the mounted material 105. The mounted material 105 is transferred to the next step after the reflow step.

Japanese Patent No. 3529633 (Japanese Patent Laid-Open No. 2000-15431) Japanese Patent No. 3580731 (Japanese Patent Laid-Open No. 2000-351065) JP 2003-46228 A

  In the reflow device disclosed in Patent Document 3, the mounted material 105 is placed on a heavy metal pallet, and vibration energy from the minute vibration applying device 102 is transmitted to the mounted material 105 via the metal pallet. For example, vibration energy from the minute vibration applying device 102 is not easily transmitted to the mounting material 105, and the solder component cannot be uniformly dispersed in the molten solder during reflow, and wear and noise are generated. Problems can arise.

  Accordingly, an object of the present invention is to solve the above-described problem, and even when a material to be mounted is placed on a heavy metal pallet, a uniform solder is applied to the metal pallet so as to melt molten solder during reflow. It is an object of the present invention to provide a reflow apparatus and method that can uniformly disperse solder components therein.

According to the first aspect of the present invention, a solder heating unit that carries in a reflow by carrying a material to be attached to which an attachment is bonded by solder and melting the solder;
A micro-vibration generating device that generates micro-vibration that can be applied to the solder that joins the mounted material carried into the solder heating unit and the mounted object;
A micro-vibration application device that applies the micro-vibration generated by the micro-vibration generator as micro-vibration in the thickness direction of the mounted material to the solder in the solder heating unit;
A reflow apparatus comprising:
The micro-vibration applying device includes a vibration plate connected to the micro-vibration generation device, carried into the solder heating unit, and on which the mounted material is placed, and a holding frame that holds the periphery of the vibration plate. against the diaphragm of the mounting member supporting member having a small vibration in the thickness direction of the object to be mounted member having application unit for applying the solder above, to provide a reflow apparatus.

According to a second aspect of the present invention, the micro-vibration application device further includes a contact member that can contact the upper surface of the holding frame of the mounted material support member, and the application unit is the diaphragm. pair to when applying a small vibration in the thickness direction of the object to be mounted material on the solder above, the contact member is configured to contact with the upper face of the holding frame of the mating attachment member supporting member, the A reflow apparatus according to one aspect is provided.

According to a third aspect of the present invention, the application unit of the micro-vibration application device is connected to the micro-vibration generation device and is mounted on the vibration plate of the mounted material support member. The reflow device according to the first aspect has a vibration plate for minute vibration that transmits minute vibrations in the thickness direction of the mounted material without contact with the solder that joins the mounting material and the mounting object.

According to the fourth aspect of the present invention, the apparatus further includes a moving device that allows the contact member and the application unit to move between an application position in the solder heating unit and a retreat position outside the solder heating unit,
The mobile device is above application position, the application part is against the above vibrating plate is applied with a small vibration in the thickness direction of the object to be mounted material on the solder above, the contact member is the object mounting member supporting member The reflow device according to the second aspect, wherein the contact member and the application unit are moved from the application position in the solder heating unit to the retracted position outside the solder heating unit while being in contact with the holding frame. I will provide a.

According to the fifth aspect of the present invention, the material to be attached to which the attachment is to be joined by solder is carried into the solder heating part, the solder is melted and reflowed, and the minute vibration generated by the minute vibration generator is reduced. The solder that is carried into the solder heating unit is applied to the solder that joins the attachment with the attachment by a minute vibration application device as minute vibration in the thickness direction of the attachment,
A reflow method in which a minute vibration in a thickness direction of the attached material is applied to the solder by the minute vibration application device, and the attached material is taken out of the solder heating unit to cool the molten solder. And
When the mounted material is carried into the solder heating unit, the mounted material is placed on the vibration plate of the mounted material support member having a diaphragm and a holding frame that holds the periphery of the diaphragm. Bring it into the solder heating part,
When the minute vibration is applied by the minute vibration applying device, the application portion of the minute vibration applying device connected to the minute vibration generating device is brought into contact with the lower surface of the diaphragm in the solder heating unit, and the minute vibration in the thickness direction of the mounting member and adapted to apply the solder above, to provide a reflow method.

According to the sixth aspect of the present invention, the material to be attached to which the attachment is to be joined by solder is carried into the solder heating unit, the solder is melted and reflowed, and the minute vibration generated by the minute vibration generator is reduced. The solder that is carried into the solder heating unit is applied to the solder that joins the attachment with the attachment by a minute vibration application device as minute vibration in the thickness direction of the attachment,
A reflow method in which a minute vibration in a thickness direction of the attached material is applied to the solder by the minute vibration application device, and the attached material is taken out of the solder heating unit to cool the molten solder. And
When the mounted material is carried into the solder heating unit, the mounted material is placed on the vibration plate of the mounted material support member having a diaphragm and a holding frame that holds the periphery of the diaphragm. Bring it into the solder heating part,
When the minute vibration is applied by the minute vibration applying device, the vibration supporting plate of the minute vibration applying device connected to the minute vibration generating device is connected to the minute vibration generating device in the solder heating unit. without contact with the solder for bonding placed on the diaphragm on the said mating attachment member and the above mounting material and adapted to transmit a small vibration in the thickness direction of the mounting member, to provide a reflow method.

According to the first, 5, or 6 embodiment of the present onset bright, the micro-vibration generated by the micro-vibration generator, minute vibrations in the thickness direction of the object to be mounted member relative to the solder in the solder heating unit As described above, even if a material to be mounted (for example, a substrate) is placed on a heavy metal pallet, a minute vibration is applied in the thickness direction of the metal pallet (in other words, It is possible to apply a minute vibration to the metal pallet as if hitting the metal pallet with a tool), and the metal pallet becomes easy to vibrate uniformly, and the solder component can be uniformly dispersed in the molten solder during the reflow. it can. On the other hand, when minute vibration is applied along the surface perpendicular to the thickness direction of the heavy metal pallet, the heavy metal pallet is difficult to vibrate, and not only can the solder components not be uniformly dispersed in the solder. There is a possibility that problems such as wear and noise occur. In the first , fifth , or sixth aspects of the present invention, minute vibrations are applied in the thickness direction of the metal pallet, so that the metal pallet is likely to vibrate uniformly, and such a problem does not occur.

According to a third aspect of the present invention, there is provided a mounting material support member having a diaphragm that is carried into the solder heating unit and on which the mounting material is placed, and a holding frame that holds the periphery of the vibration plate. When the minute vibration application device includes an application unit for applying minute vibration in the thickness direction of the attached material to the solder or a vibration plate for minute vibration with respect to the vibration plate, the minute vibration in the thickness direction of the attached material is provided. Since vibration is resonated by the diaphragm and amplified and transmitted to the solder of the mounted material placed on the diaphragm, the minute vibration is more easily transmitted by the solder of the mounted material, and the melting Solder components can be more uniformly dispersed in the solder.

Further, in the case where minute vibrations are efficiently applied along the surface perpendicular to the thickness direction of the mounted material, it is necessary to arrange a minute vibration applying member on almost the entire lower surface of the pallet on which the mounted material is placed. Therefore, hot air cannot be directly supplied to the pallet, and it takes time to heat the solder, resulting in a decrease in production efficiency. On the other hand, in the third , fifth , or sixth aspects of the present invention, in order to apply a minute vibration in the thickness direction of the mounted material, contact is made with respect to at least a part below or above the mounted material. It is only necessary to arrange the application part or the vibration plate for minute vibration so as to face each other in a non-contact manner, and it is not necessary to arrange the minute vibration application member on almost the entire lower surface of the mounted material. Can be supplied directly, the solder can be heated efficiently, and the production efficiency can be improved.

In addition, when the upper surface of the holding frame is capable of vibrating without being supported by any member and the application unit is in contact with the lower surface of the diaphragm and applies minute vibrations, the holding frame is attached to the mounted material. There is a case where the minute vibration is not transmitted efficiently to the solder due to the minute vibration in the thickness direction. On the other hand, in the second aspect of the present invention, the micro-vibration applying device further includes a contact member capable of contacting the upper surface of the holding frame of the mounted material support member, and the application unit There when in pairs on the diaphragm for applying a minute vibration in the thickness direction of the object to be mounted material on the solder above, since the contact member is configured to abut with the holding frame of the mating attachment member supporting member, The contact member prevents the holding frame from minutely vibrating in the thickness direction of the mounted material and prevents the minute vibration from being efficiently transmitted to the solder, and more reliably transmits the minute vibration to the solder. The solder component can be more uniformly dispersed in the molten solder.

Further, in the case where the minute vibration is applied only in the solder heating portion, the solder component may be segregated when it moves outside the solder heating portion and the minute vibration is not applied. There is. Further, when the minute vibration is applied only outside the solder heating part, the solder component is segregated before moving to the outside of the solder heating part and applying the minute vibration. There is a fear. In contrast, in the fourth aspect of the present invention, the applying portion is against the above vibrating plate is applied with a small vibration in the thickness direction of the object to be mounted material on the solder above, the contact member is to be the The contact member and the application unit can be moved between the application position in the solder heating unit and the retracted position outside the solder heating unit in contact with the holding frame of the mounting material support member. Since the moving device is further provided, the solder moves to the outside of the solder heating unit and is cooled while being applied with minute vibrations while being melted in the solder heating unit. Therefore, there is no fear that the solder component is segregated. That is, the solder component can be more uniformly dispersed in the molten solder.

Before continuing the description of the present invention, the same parts are denoted by the same reference numerals in the accompanying drawings.
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the invention will be described with reference to the drawings.

<< First Embodiment >>
The configuration of the reflow apparatus according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic plan view of the reflow apparatus according to the first embodiment of the present invention as viewed from the upper surface side. FIG. 2 is a schematic cross-sectional view of the reflow apparatus according to the first embodiment of the present invention as viewed from the lateral direction orthogonal to the substrate transport direction X. FIG. 3 is a perspective view showing a pallet of the reflow apparatus according to the first embodiment of the present invention, and FIG. 4 is a cross-sectional view when a substrate on which electronic components are mounted is placed on the pallet. FIG. 5A is a schematic explanatory view showing a state in which the application tool included in the micro-vibration application device applies micro vibrations to the pallet on which the substrate is placed in the reflow apparatus according to the first embodiment of the present invention, and FIG. It is a schematic explanatory drawing which shows how to transmit the minute vibration applied to the pallet by the application part with which a minute vibration application apparatus is provided. FIG. 6 is a partially enlarged cross-sectional view showing an application tool included in the pallet of the reflow device and the minute vibration application device according to the first embodiment of the present invention. FIG. 7 is a graph showing a preferable range of the frequency of the minute vibration generated by the minute vibration generator and the amplitude of the minute vibration applied to the solder in the reflow apparatus according to the first embodiment of the present invention.

  In the reflow apparatus according to the first embodiment of the present invention, a substrate 2 as an example of a material to be attached to which an electronic component 1 as an example of a mounted object is joined by solder 4 (see FIG. 4) is carried in, and the substrate 2, a solder heating unit 10 that melts and reflows the solder 4, and a micro-vibration that generates a micro-vibration that can be applied to the solder that joins the board 2 and the electronic component 1 carried into the solder heating unit 10. An ultrasonic vibrator 20 that is an example of a generator, and a minute vibration application that applies a minute vibration generated by the ultrasonic vibrator 20 as a minute vibration in the thickness direction of the substrate 2 to the solder in the solder heating unit 10. Device 30.

  Further, the reflow apparatus according to the first embodiment of the present invention further conveys the pallet 3 as an example of the mounted material support member on which the substrate 2 is placed in the substrate conveyance direction X, and the 10th floor of the solder heating unit. To the solder heating unit 10, and transports in the solder heating unit 10, and also transports the pallet 3 moved from the solder heating unit 10 to the outside of the solder heating unit 10 to the downstream side in the substrate transport direction X. 40 and the application unit 31 included in the minute vibration application device 30 and a pair of suction members 32, 32 as an example of a contact member are connected, and the application unit 31 and the pair of suction members 32, 32 are connected to the solder heating unit 10. A back-and-forth moving device 50 that is an example of a moving device that moves between the application position 30A inside and the retreat position 30B outside the solder heating unit 10, and a control device 60 that can control the operation of each part and each device. ing.

  The solder heating unit 10 is formed as a rectangular parallelepiped box, and a solder heating chamber 11 is formed therein. The solder heating chamber 11 is partitioned by a partition plate 12 into a preheating zone 11a for performing a solder preheating process for raising the temperature of the substrate 2 to a preset temperature and a reflow zone 11b for performing a reflow process for melting solder. . The temperature atmosphere of the solder preheating zone 11a is formed by hot air supplied by a hot air supply device 71 including a heater and a blower. The temperature atmosphere in the reflow zone 3b is formed by hot air supplied by a hot air supply device 72 including a heater and a blower. A pair of surfaces facing the substrate transport direction X of the solder heating unit 10 are provided with a carry-in port 10a or a carry-out port 10b through which the substrate 2 can pass, respectively. A transfer device 40 is provided so as to pass through the zone 11a and the reflow zone 11b. An edge detector 13 that detects the edge 3e of the tip of the pallet 3 is provided in the reflow zone 11b and on the downstream side in the substrate transport direction X. When the edge detection unit 13 detects the edge 3 e at the tip of the pallet 3, it transmits an edge detection signal to the control device 60.

  The conveyance device 40 is, for example, a chain conveyor type conveyance device. The transfer device 40 includes a pair of carry-in rails 41, 41, a pair of solder heating unit transfer rails 42, 42, and a pair of carry-out rails 43, 43. In the transport device 40, drive motors (not shown) separately provided for the rails 41 to 43 are driven in the forward direction, and chains 41a to 43a respectively provided along the rails 41 to 43 are provided. By being sent in the substrate transport direction X, the pallet 3 on which the substrate 2 is placed is moved into a pair of carry-in rails 41, 41, a pair of solder heating unit transport rails 42, 42, and a pair of carry-out rails 43, 43. It is comprised so that it can convey in the board | substrate conveyance direction X above. The driving operation of the driving motor is controlled by the control device 60.

  As shown in FIG. 4, the pallet 3 includes a rectangular diaphragm 3 a on which the substrate 2 is placed and a rectangular holding frame 3 b that holds the periphery of the diaphragm 3 a. The diaphragm 3a is made of, for example, a metal such as stainless steel and has a thickness of about 0.5 mm. A rectangular adhesive sheet 3c made of silicon, for example, is attached to the upper surface of the diaphragm 3a. As shown in FIGS. 3 and 4, the substrate 2 is detachably held on the pallet 3 by being affixed to the upper surface of the adhesive sheet 3c (the dashed line in FIG. 1 indicates the substrate 2). The holding frame 3b is made of, for example, a metal such as stainless steel and has a thickness of about 2.0 mm. As shown in FIG. 3, the diaphragm 3a and the holding frame 3b are fixed by a plurality of spot welds 3d. It is preferable to adjust the interval between the spot welds 3d to a multiple of the vibration period of the ultrasonic wave generated by the ultrasonic vibrator 20 because the vibration plate 3a is likely to resonate.

  As shown in FIGS. 1 and 2, the minute vibration application device 30 includes an application unit 31, a pair of suction members 32 and 32, and a vertical movement device 33 that is a device using, for example, an air cylinder or a hydraulic cylinder. ing. The application unit 31 includes a substantially rod-shaped ultrasonic horn 31a extending in the substrate conveyance direction X, and an application tool 31b attached to the upper side of the upstream end of the ultrasonic horn 31a in the substrate conveyance direction X. .

  An intermediate portion of the ultrasonic horn 31 in the substrate transport direction X is fixed to an elevating member (not shown) that is provided in the vertical movement device 33 and moves up and down by driving an elevating motor (not shown). That is, the end portion to which the application tool 31b of the ultrasonic horn 31a is attached is not fixed and is a free end. The end of the ultrasonic horn 31 on the downstream side in the board conveying direction X passes through the heat radiation fin 21 that radiates heat so that the heat in the solder heating unit 2 is not transmitted to the ultrasonic vibrator 20, and has a rectangular parallelepiped ultrasonic wave. The vibrator 20 is connected. That is, the ultrasonic horn 31, the radiation fins 21, and the ultrasonic transducer 20 are provided on the same axis parallel to the substrate transport direction X.

  The vertical movement device 33 drives the lifting motor to move the lifting member up and down, so that the ultrasonic horn 31a fixed to the lifting member, the application tool 31b connected to the ultrasonic horn 31a, the heat dissipation The fin 21 and the ultrasonic transducer 20 are configured to move up and down integrally. A lower end portion of the vertical movement device 33 is connected to a rectangular plate-shaped base 50 a of the front-back movement device 50.

  The pair of suction members 32, 32 are provided with suction pads 32a, 32a having a generally conical shape made of rubber or the like below the end portion on the upstream side in the substrate transport direction X, respectively. The suction pads 32a and 32a of the pair of suction members 32 and 32 are slightly above (for example, 1 mm) above the substrate 2 so as not to contact the substrate 2 transported in the solder heating unit 2 by the transport device 40. Are located apart. The pair of suction members 32 and 32 are connected to a suction device 34 that generates suction force capable of sucking the pallet 3 by the suction pads 32a and 32a. The downstream portions of the pair of suction members 32, 32 in the substrate transport direction X are bent from above the transport path 3A to a position outside the transport path 3A so as not to disturb the movement of the pallet 3. Further, it is bent downward at that position and connected to the plate-like base 50a of the forward / backward moving device 50.

  The back-and-forth moving device 50 is fixed to the screw shaft (not shown) extending in the substrate transport direction X, a nut (not shown) movable on the screw shaft by rotating the screw shaft, and the nut. Plate-like base 50a, and a motor for moving back and forth (not shown) for rotating the screw shaft. The forward / backward moving device 50 rotates the screw shaft in the forward direction by driving the forward / backward movement motor in the forward direction, and the plate-like base 50a fixed on the nut and the nut on the screw shaft. Is moved in the substrate transport direction X, and the vertical movement device 33 and the pair of suction members 32, 32 connected to the plate-like base 50a are moved in the substrate transport direction X. The back-and-forth moving device 50 rotates the screw shaft in the reverse direction by driving the back-and-forth moving motor in the reverse direction, and the plate-like base fixed to the nut and the nut on the screw shaft. The vertical movement device 33 and the pair of suction members 32, 32 connected to the plate-like base 50a are moved in the direction opposite to the substrate transfer direction X by moving the 50a in the direction opposite to the substrate transfer direction X. The moving operation of the front-rear moving device 50 in the front-rear direction X1 is controlled by the control device 60.

  When the back-and-forth movement device 50 moves the minute vibration application device 30 (that is, the application unit 31, the pair of adsorption members 32 and 32, and the vertical movement device 33) to the application position 30A, the ultrasonic horn 31a of the application unit 31 is The pair of suction members 32, 32 are positioned below the solder heating unit transport rail 42 and extend in the substrate transport direction X from the reflow zone 11b to the outside of the solder heating unit 2 through the carry-out port 10b. The vertical movement device 33 is located above the solder heating unit conveyance rail 42 and extends in the substrate conveyance direction X from the reflow zone 11b to the outside of the solder heating unit 2 through the carry-out port 10b. 2 and located downstream of the substrate transport direction X.

When the back-and-forth moving device 50 moves the minute vibration applying device 30 to the retracted position 30B, the applying unit 31 and the pair of suction members 32 and 32 are located outside the solder heating unit 2 and downstream in the substrate transport direction X. It is configured as follows. That is, when the minute vibration application device 30 is located at the retracted position 30B, the application tool 31b of the application unit 31 and the suction pads 32a and 32a of the pair of suction members 32 and 32 are outside the solder heating unit 2 and transported to the substrate. It is configured to be located on the downstream side in the direction X.
The back-and-forth moving device 50 is configured to always position the application tool 31b and the suction pads 32a and 32a of the pair of suction members 32 and 32 at the application position 30A, that is, within the solder heating unit 10. ing.

  The ultrasonic horn 31a and the application tool 31b of the application unit 31 are made of, for example, aluminum alloy, stainless steel, titanium, or the like. The ultrasonic horn 31a has a function of expanding the amplitude of the minute vibration generated by the minute vibration generator 20. As shown in FIG. 5A, the application tool 31b contacts the lower surface of the diaphragm 3a of the pallet 3 on which the substrate 2 on which the electronic component 1 is mounted is placed, and minute vibrations generated by the ultrasonic vibrator 20 are By being transmitted through the ultrasonic horn 31a, the minute vibration in the thickness direction of the substrate 2 can be applied to the solder 4 as shown in FIG. 5B. In addition, it is preferable that the contact position with the lower surface of the diaphragm 3a of the application tool 31b exists in the center part of the diaphragm 3a. Thereby, it becomes easy to apply a minute vibration uniformly to the whole substrate 2.

As shown in FIG. 6, the application tool 31b has a male screw shape, and is screwed into a female screw portion 31d formed on the upper side of the upstream end portion of the ultrasonic horn 31a in the substrate transport direction X.
In addition, since the diaphragm 3a of the pallet 3 and the application tool 31b may be scratched if they are in direct contact with each other, as shown in FIG. 6, it is formed of a resin such as polyimide so as to cover the head of the application tool 31b. You may attach the cap 31b which is an example of the made protective member. Further, a plate-like scratch-preventing protective member 3d made of a resin such as polyimide may be provided on the lower surface of the diaphragm 3a of the pallet 3. In this case, it is preferable that the cap 31c and the scratch-preventing protective member 3d have a thickness of, for example, about 0.3 mm.

  In the state where the vertical movement device 33 is located at the application position 30A, the control device 60 receives the edge detection signal of the edge detection unit 13, and the control device 60 drives the lifting motor in the forward direction to move the lifting member. As shown in FIG. 4, the application tool 31b is moved from the application preparation position 31A to the application possible position 31B. In the state where the vertical movement device 33 is located at the retreat position 30B, the control device 60 drives the lifting motor in the reverse direction to lower the lifting member, so that the application preparation position 31A is changed from the application possible position 31B. It is configured to be moved.

  Further, when moving the application tool 31b from the application preparation position 31A to the application possible position 31B, the vertical movement device 33 brings the application tool 31b into contact with the lower surface of the diaphragm 3a of the pallet 3, and the pallet 3 with the application tool 31b. Is slightly lifted from above the chains 42a and 42a of the solder heating part conveying rails 42 and 42, and the upper surfaces of the holding frames 3b of the pallet 3 are adsorbed to the adsorbing pads 32a and 32a of the pair of adsorbing members 32 and 32, respectively. It is configured to be able to.

  The pair of adsorbing members 32 and 32 are moved upward and downward by the application tool 31b from the vertical movement device 33 to slightly lift the pallet 3 from above the chains 42a and 42a of the solder heating part transport rails 42 and 42, and the holding frame 3b of the pallet 3 is lifted. The suction device 34 is configured to be capable of sucking the pallet 3 by causing the suction pads 32a and 32a to generate a suction force capable of sucking the pallet 3 while the suction device 34 is in contact with the upper surface. The suction pads 32a and 32a are preferably configured so that the holding frame 3b can be sucked by the upper surface of the intermediate portion of the peripheral edge in the substrate transport direction X of the holding frame 3b. The suction pads 32a and 32a and the application tool 31b are preferably arranged on the same line orthogonal to the substrate transport direction X. As a result, it is easy to balance the adsorption of the pallet 3, and minute vibrations applied from the application tool 31 b are easily transmitted to the solder 4 effectively. The suction operation of the suction device 34 is controlled by the control device 60.

  The ultrasonic vibrator 20 is, for example, a piezo element having a property of being deformed when a voltage is applied. When the voltage is applied, the substrate 2 and the electronic component 1 carried into the solder heating unit 10 by the transfer device 40 are provided. A minute vibration that can be applied to the solder 4 that joins is generated. If the frequency of the minute vibration generated by the ultrasonic vibrator 20 is too large, a minute vibration having a large amplitude is applied to the solder 4, the surface of the solder 4 is waved, and the electronic component 1 is inclined with respect to the substrate 2. Will be joined. On the other hand, if the frequency of the minute vibration generated by the ultrasonic vibrator 20 is too small, the minute vibration having a sufficiently large amplitude is not applied to the solder 4 and the solder component cannot be uniformly dispersed. Therefore, as shown in FIG. 7, it is preferable that the frequency of the minute vibration generated by the ultrasonic transducer 20 is set within a range of 20 kHz to 40 kHz, and the amplitude of the minute vibration applied to the solder 4 is set within a range of 5 μm to 15 μm. Specifically, the frequency may be set to 35 kHz and the amplitude may be set to 5 μm. Note that the micro vibration generation operation of the ultrasonic transducer 20 is controlled by the control device 60.

  Further, a cooling device 22 for cooling the solder 4 of the substrate 2 carried out from the solder heating chamber 11 on the downstream side in the substrate conveyance direction X outside the solder heating unit 10 and above the conveyance path 3A of the pallet 3A. Is provided. The cooling device 22 can be configured by a fan that supplies cold air, for example. The cooling operation of the cooling device 22 is controlled by the control device 60.

  The control device 60 has a storage unit (not shown) having a storage table storing a temperature profile and an operation procedure according to the size and type of the substrate 2 to be heat-treated, the heat resistance of the components, the material of the solder 4, and the like. )). The control device 60 supplies hot air corresponding to each of the solder preheating zone 11a and the reflow zone 3b based on the storage table of the storage unit, and forms hot air that forms the temperature atmosphere of the solder preheating zone 11a in the solder heating unit 10. The hot air supply device 72 that forms the temperature atmosphere of the supply device 71 and the reflow zone 3b is controlled, and the operation of each of the above parts and each device is controlled to bond the electronic component 1 to the substrate 2 with the solder 4.

The reflow apparatus of the first embodiment of the present invention is configured as described above.
Next, the reflow operation by the reflow apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 4, 5 </ b> A, 5 </ b> B, and 8. FIG. 8 is a flowchart showing a reflow operation by the reflow apparatus according to the first embodiment of the present invention.

  In the initial state, the control device 60 controls driving of the hot air supply devices 71 and 72 to supply hot air corresponding to each of the solder preheating zone 11a and the reflow zone 3b, and solder preheating in the solder heating unit 10. It is assumed that the temperature atmosphere of the zone 11a and the temperature atmosphere of the reflow zone 3b are formed. Further, it is assumed that the minute vibration applying device 30 is located at the application position 30A and the application tool 31b is located at the application preparation position 31A by the back-and-forth moving device 50.

  First, the control device 60 controls the drive of drive motors (not shown) for the carry-in rails 41 and 41 of the transport device 40 to drive in the forward direction, and the substrate 2 on which the electronic component 1 is mounted becomes the adhesive sheet 3c. The pallet 3 placed on and transported to the pair of carry-in rails 41 and 41 is transported along the pair of carry-in rails 41 and 41 in the board transport direction X, passed through the carry-in entrance 10a, and the solder heating unit 2 is transported until it is placed on the chains 42a, 42a of the pair of solder heating part transport rails 42, 42 in the rail 2.

  Next, the control device 60 controls the drive of driving motors (not shown) for the solder heating unit transport rails 42 and 42 of the transport device 40 to drive in the forward direction, thereby transporting the pair of solder heating units. The pallet 3 is transported along the rails 42, 42, passes through the solder preheating zone 11a, and is transported to the reflow zone 11b. Here, the substrate 2 placed on the pallet 3 is preheated in the solder preheating zone 11a.

  Next, the control device 60 controls the driving of the driving motors for the solder heating unit transport rails 42 and 42 to drive in the forward direction, and the pallet 3 is moved along the pair of solder transport rails 42 and 42. When transported, the edge detection unit 13 provided in the reflow zone 11 b detects the edge 3 e at the tip of the pallet 3 and transmits an edge detection signal to the control device 60. Here, the solder 4 of the substrate 2 placed on the pallet 3 is melted by the temperature atmosphere of the reflow zone 11b. Next, when receiving the edge detection signal from the edge detection unit 13, the control device 60 controls the driving of the drive motors for the solder heating unit conveyance rails 42 and 42 to stop (step S1).

  Next, the control device 60 controls the drive of the lifting / lowering motor (not shown) of the vertical movement device 33 to drive in the forward direction to raise the ultrasonic horn 31a of the application unit 31 and apply the application tool 31b. The entire pallet 3 on which the substrate 2 is placed by the application tool 31b is moved onto the chains 42a and 42a of the solder heating unit transport rails 42 and 42 by moving from the preparation position 31A to the application possible position 31B and contacting the lower surface of the diaphragm 3a. The upper surface of the holding frame 3b of the pallet 3 is brought into contact with the suction pads 32a and 32a of the pair of suction members 32 and 32 (step S2). At the same time, the control device 60 controls the driving of the suction device 34 to generate suction force capable of sucking the pallet 3 by the suction pads 32a and 32a, and the upper surface of the holding frame 3b of the pallet 3 by the suction pads 32a and 32a. Adsorb and hold.

The control device 60 controls the driving of the suction device 34 to generate suction force capable of sucking the pallet 3 by the suction pads 32a and 32a, and sucks the upper surface of the holding frame 3b of the pallet 3 by the suction pads 32a and 32a. After the holding, the ultrasonic horn 31a of the application unit 31 may be raised by controlling the drive of a lifting motor (not shown) of the vertical movement device 33 to drive in the forward direction.
In addition, the control device 60 controls the drive of a lifting motor (not shown) of the vertical movement device 33 to drive in the forward direction to raise the ultrasonic horn 31a of the application unit 31 and to make a pair of suction members After the upper surfaces of the holding frames 3b of the pallet 3 are brought into contact with the respective suction pads 32a, 32a of 32, 32, the suction pads 32a, 32a have a suction force capable of sucking the pallet 3 by controlling the driving of the suction device 34. The upper surface of the holding frame 3b of the pallet 3 may be sucked and held by the suction pads 32a and 32a.

  Next, the control device 60 controls the driving of the ultrasonic transducer 20 to generate minute vibrations. At this time, the minute vibration generated by the ultrasonic transducer 20 is transmitted to the ultrasonic horn 31a, the amplitude thereof is enlarged by the ultrasonic horn 31a, and transmitted to the application tool 31b, and the vibration plate 3a and the adhesive sheet 3c. Then, the solder 4 of the substrate 2 is minutely vibrated in the thickness direction of the substrate 2.

  Next, the control device 60 controls the drive of the ultrasonic transducer 20 to continuously generate minute vibrations, and the application tool 31b comes into contact with the lower surface of the vibration plate 3a of the pallet 3 so that the pair of suction members 32 and 32 are in contact. With the respective suction pads 32a and 32a sucking and holding the upper surface of the holding frame 3b of the pallet 3, the front and rear movement motor (not shown) of the front and rear movement device 50 is controlled to drive in the forward direction. Then, the plate-like base 50a is moved in the substrate transport direction X, and the suction pads 32a and 32a and the application tool 31b of the pair of suction members 32 and 32 are moved from the application position 30A to the retreat position 30B. By this operation, the pallet 3 passes from the inside of the solder heating unit 10 through the carry-out port 10b and is conveyed to the pair of unloading rails 43, 43 outside the solder heating unit 10.

  At this time, the control device 60 controls the driving of the cooling device 22 to cool the solder 4 of the substrate 2 on the pallet 3 carried out from the solder heating unit 10. As a result, the solder components are uniformly dispersed in the molten solder 4 of the substrate 2 and cooled and solidified, and the electronic component 1 and the substrate 2 are joined by the solder 4 (step S3).

  At this time, before the suction pads 32a and 32a and the application tool 31b reach the retreat position 30B, the control device 60 controls the driving of the ultrasonic transducer 20 to stop the generation of minute vibrations and apply the application. The application of minute vibrations to the solder 4 of the substrate 2 by the tool 31b is stopped (step S4). In addition, the control device 60 does not segregate until the solder component is cooled and solidified in the molten solder 4 of the substrate 2, for example, for 5 to 10 seconds after the substrate 2 is transported outside the solder heating unit 2. It is preferable to control the driving of the ultrasonic transducer 20 so that minute vibrations in the thickness direction of the substrate 2 are applied to the solder 4 of the substrate 2.

  Next, the control device 60 controls the driving of the lifting / lowering motor of the vertical movement device 33 to drive in the reverse direction to lower the ultrasonic horn 31a of the application unit 31 and apply the application tool 31b from the application possible position 31B. It moves to the preparation position 31A, releases the contact state between the application tool 31b and the diaphragm 3a of the pallet 3, and controls the driving of the suction device 34 to stop the generation of the suction force that can attract the pallet 3. The suction state (contact state) between the suction pads 32a and 32a of the suction members 32 and 32 and the holding frame 3b of the pallet 3 is released, and the pallet 3 is placed on the chains 43a and 43a of the carry-out rails 43 and 43. (Step S5).

  Next, the control device 60 controls the drive of drive motors (not shown) for the unloading rails 43 and 43 of the transport device 40 to drive in the forward direction, along the pair of discharge rails 43 and 43. The pallet 3 is transported further downstream in the substrate transport direction X, and the plate-like base 50a is driven in the reverse direction by controlling the driving of the front / rear moving motor of the front / rear moving device 50. The suction pads 32a, 32a of the pair of suction members 32, 32 and the application tool 31b are moved from the retracted position 30B outside the solder heating unit 10 to the application position 30A inside the solder heating unit 10. . Thereby, the application tool 31b is located in the application preparation position 31A in the solder heating part 10 (step S6).

  As described above, the reflow operation by the reflow apparatus of the first embodiment of the present invention is performed. In addition, what is necessary is just to repeat step S1-S6 mentioned above when reflow-processing the 2 or more board | substrate 2. Further, in order to improve the production efficiency, the steps S1 to S6 are performed on the plurality of substrates 2, for example, the operation of step S1 is performed on the second substrate 2 while the operation of step S6 is performed on the first substrate 2. These operations may be performed concurrently.

  According to the reflow apparatus of the first embodiment of the present invention, the application unit 31 converts the minute vibration generated by the ultrasonic transducer 20 into minute vibration in the thickness direction of the substrate 2 with respect to the solder 4 in the solder heating unit 10. Therefore, even if the pallet 3 is made of heavy metal and the substrate 2 is placed on the pallet 3, a minute vibration can be applied in the thickness direction of the pallet 3, The pallet 3 easily vibrates uniformly, and the solder components can be uniformly dispersed in the molten solder 4 during reflow.

  Further, according to the reflow device of the first embodiment of the present invention, the minute vibration applying device 30 includes the application unit 31 that applies the minute vibration in the thickness direction of the substrate 2 to the solder 4 with respect to the vibration plate 3 a of the pallet 3. Since the minute vibration in the thickness direction of the substrate 2 is resonated and amplified by the vibration plate 3a and transmitted to the solder 4 of the substrate 2 placed on the vibration plate 3a, the minute vibration is transmitted to the solder 4 of the substrate 2. Therefore, the solder component can be more uniformly dispersed in the molten solder 4.

  Moreover, according to the reflow apparatus of 1st Embodiment of this invention, in order to apply a minute vibration to the thickness direction of the board | substrate 2, it arrange | positions so that a part of application part 31 may contact the downward direction of the board | substrate 2. FIG. Since it is not necessary to arrange almost all over the lower surface of the substrate 2, the hot air from the hot air supply device 72 can be directly supplied to the pallet 3, and the solder 4 can be efficiently heated. Production efficiency can be improved.

  Moreover, according to the reflow apparatus of 1st Embodiment of this invention, it further has a pair of adsorption | suction members 32 and 32 which can contact | abut with the upper surface of the holding frame 3b of the pallet 3, and the application tool 31b of the application part 31 has it. When a minute vibration in the thickness direction of the substrate 2 is applied to the solder 4 in contact with the lower surface of the vibration plate 3a, the pair of adsorbing members 32, 32 are in contact with and adsorbed to the upper surface of the holding frame 3b of the pallet 3. Therefore, the vibration of the pallet 3 itself can be prevented more reliably, and the minute vibration can be transmitted to the solder 4 more reliably, and the solder components can be more uniformly dispersed in the molten solder 4.

  Further, according to the reflow apparatus of the first embodiment of the present invention, the application unit 31 contacts the lower surface of the vibration plate 3 a to apply minute vibrations in the thickness direction of the substrate 2 to the solder 4 and a pair of adsorption members 32. , 32 are in contact with and adsorbed to the holding frame 3b of the pallet 3, and the pair of adsorbing members 32, 32 and the application unit 31 are connected to the application position 30A in the solder heating unit 10 and the retreat position 30B outside the solder heating unit 10. The pallet 3 is moved from the application position 30A in the solder heating unit 10 to the retreat position 30B outside the solder heating unit 10 by the back and forth movement device 50. Then, the solder 4 is pulled out of the solder heating unit 10 and cooled and solidified while being applied with minute vibrations while being melted in the solder heating unit 10. Therefore, there is no possibility of segregation even when the solder component is cooled. That is, the solder component can be more uniformly dispersed and solidified in the molten solder 4.

  In the reflow device according to the first embodiment of the present invention, when the minute vibration applying device 30 is located at the application possible position 30A, the ultrasonic vibrator 20 is located outside the solder heating unit 10 and the application unit 31 is soldered. Although it has been configured so as to be positioned below the heating unit conveyance rails 42 and 42 and extend from the reflow zone 11b to the outside of the solder heating unit 2 through the carry-out port 10b, the present invention is not limited thereto.

  For example, as shown in FIG. 9, in the reflow zone 11 b, the ultrasonic transducer 20 is provided below the solder heating part transport rails 42, 42 of the transport device 40, and the lower surface of the vibration plate 3 a of the pallet 3. In the crossing direction (for example, the vertical direction), for example, the application unit 31-1 having a substantially triangular prism shape or a substantially rectangular parallelepiped shape may be configured to apply a minute vibration by line contact or surface contact. In this case, the surroundings of the ultrasonic vibrator 20 and the heat radiation fin 21 are covered with a heat insulating wall 23 or the like so that the heat in the solder heating unit 2 is not transmitted to the ultrasonic vibrator 20, and hot air for heating the substrate 2 is formed. The hot air supply heating device 72 is provided in the periphery of the heat insulating wall 23.

  Further, instead of the application unit 31-1, for example, as shown in FIG. 10, it is formed in a tapered shape such as a substantially conical shape, and a small area (for example, 20 mm square or less) is formed on the lower surface of the diaphragm 3a of the pallet 3. The application unit 31-2 configured to be able to be touched with may be used. With this configuration, it is possible to apply a minute vibration only to a desired electronic component 1 such as a weak heat-resistant component. In this case, the distance L between the application axis 31A of the application unit 31-2 and the line 1A passing through the center of the desired electronic component 1 in the vertical direction is the half wavelength of the minute vibration generated by the ultrasonic transducer 20 (for example, 35 mm) is preferably set. In addition, the length of the application unit 31-2 in the direction of the application axis 31A is preferably set to a length corresponding to one wavelength (for example, 70 mm) of minute vibration generated by the ultrasonic transducer 20. With this configuration, the vibration plate 3 a can easily resonate, and minute vibrations can be efficiently transmitted to the solder 4.

  In the reflow device according to the first embodiment of the present invention, when the control device 60 receives the edge detection signal from the edge detection unit 13, the drive motors for the solder heating unit conveyance rails 42 and 42 of the conveyance device 40 are used. After the drive is temporarily stopped, the application tool 31b of the vertical movement device 33 is raised and brought into contact with the lower surface of the diaphragm 3b, and the entire pallet 3 is moved by the application tool 31b to the chains 42a, 42a, 42a of the solder heating unit transport rails 42, 42. The holding frame 3b of the pallet 3 is adsorbed to the adsorbing pads 32a and 32a by slightly lifting from the upper surface 42a. In this state, the application tool 31b and the adsorbing pads 32a and 32a are moved out of the solder heating unit 10 by the forward / backward moving device 50. Although configured as described above, the present invention is not limited to this.

  For example, when the control device 60 receives the edge detection signal of the edge detection unit 13, the application tool is applied by the vertical movement device 33 while driving the driving motors for the solder heating unit conveyance rails 42, 42 of the conveyance device 40. 31b is raised and brought into contact with the lower surface of the diaphragm 3b, and the pallet 3 is slightly lifted from the chains 42a and 42a of the solder heating unit transport rails 42 and 42 by the application tool 31b, and the pallet 3 is placed on the suction pads 32a and 32a. The holding frame 3b may be brought into contact, and in this state, it may be conveyed outside the solder heating unit 10 by the conveying device 40. In this case, since the transport device 40 transports the pallet 3 to the outside of the solder heating unit 10, the suction pads 32a and 32a do not necessarily have to be configured to suck the holding frame 3b of the pallet 3b. Since the load of the pallet 3 is applied downward only to the upstream side of the substrate conveying direction X of the ultrasonic horn 31a via the application tool 31b, the rigidity is increased or a reinforcing material or the like is applied so that the ultrasonic horn 31a does not bend. It is preferable to use and reinforce.

<< Second Embodiment >>
The configuration of the reflow apparatus according to the second embodiment of the present invention will be described with reference to FIGS. 11A and 11B. FIG. 11A is a partially enlarged cross-sectional view of the reflow apparatus according to the second embodiment of the present invention, and FIG. 11B is a schematic diagram illustrating minute vibrations applied to the solder 4. In the reflow device according to the second embodiment of the present invention, the minute vibration application device does not contact the lower surface of the diaphragm 3a of the pallet 3 and indirectly applies the minute vibration to the solder 4 without contact from above the solder 4. It differs from the reflow apparatus concerning 1st Embodiment of this invention by the point comprised in this way. Since the other points are the same, the following mainly describes differences from the reflow apparatus according to the first embodiment of the present invention, components having the same functions are denoted by the same reference numerals, and overlapping descriptions are omitted. Omitted.

  As shown in FIG. 11A, the reflow device according to the second embodiment of the present invention includes the substrate 2 and the solder heating unit transport rails 42, 42 of the transport device 40 in the reflow zone 11 b of the solder heating unit 2. As shown in FIG. 11B, the ultrasonic vibrator 20 that generates a fine vibration that can be applied to the solder 4 that joins the electronic component 1 and the fine vibration generated by the ultrasonic vibrator 20 And an application unit 80 that applies to the solder 4 as minute vibration in the thickness direction. The ultrasonic transducer 20 is connected to the application unit 80 via the heat radiation fin 21 so that heat in the solder heating unit 2 is not transmitted, and the periphery thereof is covered with a heat insulating wall 23, and the temperature atmosphere of the reflow zone 11 b The hot air supply and heating device 72 for forming is provided around the heat insulation wall 23. In the present embodiment, the application unit 80 constitutes a minute vibration application device. Further, the heat dissipating fins 21 are not necessarily provided as long as the heat in the solder heating unit 2 can be prevented from being transmitted to the ultrasonic vibrator 20 by the heat insulating wall 23.

  As shown in FIG. 11A, the application unit 80 has a lower portion formed in a tapered shape such as a substantially conical shape or a substantially polygonal pyramid shape, and an upper portion formed in a cylindrical shape and connected to the ultrasonic transducer 20, The thickness of the ultrasonic horn 81 that expands the amplitude of minute vibrations generated by the ultrasonic transducer 20 and the thickness of the substrate 2 that is attached to the lower end of the ultrasonic horn 81 so as to face the substrate 2 and is transmitted from the ultrasonic horn 81. A rectangular micro-vibration diaphragm 82 that transmits micro vibrations in the direction to the solder 4 in a non-contact manner is provided.

The area of the lower surface of the minute vibration diaphragm 82 is formed larger than the area of the upper surface of the substrate 1 so that minute vibrations can be applied to the entire upper surface of the substrate 1. A distance H from the lower surface of the minute vibration diaphragm 82 to the electronic component 1 mounted on the substrate 2 is set in a range of 2 mm to 5 mm, for example.
As described above, the reflow apparatus according to the second embodiment of the present invention is configured.

  According to the reflow apparatus of the second embodiment of the present invention, the minute vibration generated by the ultrasonic transducer 20 is applied as the minute vibration in the thickness direction of the substrate 2 to the solder 4 in the solder heating section 10. In this case, the pallet 3 is made of a heavy metal, and any kind of the substrate 2 is formed on the pallet 3. Can be applied to the solder 4 with certainty in the thickness direction of the substrate 2 and the solder components can be uniformly dispersed in the molten solder 4 during reflow.

  Further, according to the reflow apparatus of the second embodiment of the present invention, since the minute vibration is applied to the solder 4 from the upper side of the solder 4, the vibration plate 3a of the pallet 3 is not vibrated. Minute vibrations can be transmitted to the solder 4, and contact members (adsorption members 32, 32) are provided to contact the upper surface of the holding frame 3b of the pallet 3 as in the reflow device of the first embodiment of the present invention. Even if it is not, minute vibrations can be efficiently applied to the solder 4.

  Further, according to the reflow apparatus of the second embodiment of the present invention, the minute vibration diaphragm 82 is disposed so as to face the upper side of the substrate 2 in a non-contact manner in order to apply the minute vibration in the thickness direction of the substrate 2. Since it should just arrange | position, the hot air of the hot air supply apparatus 72 from the downward direction can be directly supplied to the pallet 3, the solder 4 can be heated efficiently, and production efficiency can be improved. .

  Moreover, in the reflow apparatus of 1st Embodiment of this invention, since the application tool 31b contacts the lower surface of the diaphragm 3a, the application tool 31b may be worn out, but the reflow apparatus of 2nd Embodiment of this invention. According to the above configuration, since the minute vibration is applied to the solder 4 in a non-contact manner from above the solder 4 by the vibration plate 82 for minute vibration, the above-described possibility can be eliminated.

  In the reflow device according to the second embodiment of the present invention, the vibration plate 82 for minute vibration is attached to the lower end portion of the ultrasonic horn 81 so as to face the substrate 2, and minute vibration is generated from above the solder 4 without contact. Although configured to apply, the present invention is not limited to this. For example, instead of using the vibration plate 82 for minute vibration, instead of the ultrasonic horn 81, as shown in FIGS. 12A and 12B, the substrate 1 is opposed to the solder 4 so that minute vibration can be applied linearly. An ultrasonic horn 81-1 formed so as to have a substantially straight tip surface on the side to be soldered may be configured to apply minute vibrations to the solder 4 from above the solder 4 without contact. 12A and 12B, the ultrasonic horn 81-1 is illustrated as having a substantially straight tip surface parallel to the substrate transport direction X. However, the ultrasonic horn 81-1 intersects the substrate transport direction X (for example, an orthogonal direction). It may be configured to have a generally straight tip surface. By being configured in this way, for example, minute vibrations can be collectively applied to the solder 4 that joins the plurality of electronic components 1 and the substrate 2 arranged in a straight line.

Further, for example, instead of using the ultrasonic vibration horn 81 without using the vibration plate 82 for fine vibration, as shown in FIGS. 13A and 13B, for example, an ultrasonic wave having a generally sharp shape on the side facing the solder 4 is formed. The horn 81-2 may be configured to apply minute vibrations from above the solder 4 without contact.
With this configuration, it is possible to apply a minute vibration only to the solder 4 that joins a desired electronic component 1 such as a weak heat-resistant component or a retrofitted component and the substrate 2, and other adjacent components. It is possible to prevent application to electronic components. Therefore, the minute vibration generator and the minute vibration application device can be downsized as compared with the device that applies the minute vibration to the entire substrate 2.

  In the reflow device according to the second embodiment of the present invention, the application unit 80 constituting the minute vibration application device is fixedly provided in the reflow zone 11b of the solder heating unit 10, but the present invention is not limited to this. Not. For example, a pallet that is connected to the back-and-forth moving device 50 described in the first embodiment of the present invention and is transported in the substrate transport direction X by the transport device 40 while moving from the solder heating unit 10 to the outside of the solder heating unit 10. 3 may be configured to apply a minute vibration to the solder 4 of the substrate 2 on the substrate 3 in a non-contact manner.

As mentioned above, although embodiment of this invention has been described, this invention is not limited to said each embodiment, A various deformation | transformation is possible.
For example, in each of the above embodiments, a single-sided substrate in which the electronic component 1 is mounted only on the upper surface of the substrate 2 has been described, but the present invention is not limited to this. For example, the present invention can also be applied to a double-sided board 2-1 in which the electronic component 1-1 is soldered to the lower surface of the board 2 in a mounted state. In this case, for example, as shown in FIG. 14, the electronic component 1-1 on the lower surface of the substrate 2 is not in contact with the central portions of the diaphragm 3a and the adhesive sheet 3c of the pallet 3, and the periphery of the double-sided substrate 2-1. The electronic component 1 on the upper surface of the double-sided substrate 2-1 can be obtained in the same manner as the substrate 2 by using the pallet 3-1 having the diaphragm 3a-1 and the adhesive sheet 3c-1 provided with openings capable of holding the substrate. Soldering is possible. In this case, the solder 4-1 that joins the lower surface of the double-sided substrate 2-1 and the electronic component 1-1 has a higher melting point than the solder 4 that joins the upper surface of the double-sided substrate 2-1 and the electronic component 1. The temperature atmosphere of the reflow zone 11b is higher than the melting point of the solder 4 and lower than the melting point of the solder 4-1. In this case, the standby position 31A and the applicable position 31B of the application tool 31b are located near the holding frame 3b as shown in FIG. 14 because an opening is provided in the center of the diaphragm 3a.

  In addition, by appropriately combining arbitrary embodiments of the above-described embodiments, the effects possessed by them can be produced.

  The reflow apparatus and method of the present invention uniformly disperse the solder components in the molten solder during reflow by uniformly applying vibration to the metal pallet even when the mounting material is placed on a heavy metal pallet. Therefore, the present invention is useful for a reflow apparatus and method for soldering an electronic component to an object to be mounted using ultrasonic vibration.

The schematic plan view which looked at the reflow apparatus concerning 1st Embodiment of this invention from the upper surface side. 1 is a schematic cross-sectional view of a reflow apparatus according to a first embodiment of the present invention, viewed from a lateral direction orthogonal to a substrate transport direction. The perspective view which shows the pallet of the reflow apparatus concerning 1st Embodiment of this invention. Sectional drawing when the board | substrate which mounted the electronic component was mounted in the pallet of the reflow apparatus concerning 1st Embodiment of this invention. The schematic explanatory drawing which shows the state which the application tool with which a minute vibration application apparatus is equipped with on the pallet which mounted the board | substrate mounted the minute vibration of the reflow apparatus concerning 1st Embodiment of this invention. The schematic explanatory drawing which shows how to transmit the micro vibration applied to the pallet by the application part with which the micro vibration application apparatus is provided of the reflow apparatus concerning 1st Embodiment of this invention. The partially expanded sectional view which shows the application tool with which the pallet of the reflow apparatus concerning 1st Embodiment of this invention and a micro vibration application apparatus are provided. The graph which shows the preferable range of the frequency of the minute vibration which the minute vibration generator produces | generates, and the amplitude of the minute vibration applied to solder of the reflow apparatus concerning 1st Embodiment of this invention. The flowchart which shows operation | movement of the reflow apparatus concerning 1st Embodiment of this invention. Sectional drawing which shows the modification of the reflow apparatus concerning 1st Embodiment of this invention. Sectional drawing which shows the other modification of the reflow apparatus concerning 1st Embodiment of this invention. The partially expanded sectional view of the reflow apparatus concerning 2nd Embodiment of this invention. Schematic explaining the minute vibration applied to solder of the reflow apparatus concerning 2nd Embodiment of this invention. Sectional drawing which shows the modification of the reflow apparatus concerning 2nd Embodiment of this invention. The schematic perspective view which shows the modification of the reflow apparatus concerning 2nd Embodiment of this invention. Sectional drawing which shows the other modification of the reflow apparatus concerning 2nd Embodiment of this invention. The schematic perspective view which shows the other modification of the reflow apparatus concerning 2nd Embodiment of this invention. The schematic sectional drawing which shows the pallet of the modification of the reflow apparatus of this invention Schematic showing a minute vibration application unit included in a conventional reflow apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Board | substrate 3 Pallet 3a Vibration board 3b Holding frame 3c Adhesive sheet 3d Spot welding part 4 Solder 10 Solder heating part 11 Solder heating chamber 11a Solder preheating zone 11b Reflow zone 12 Partition plate 13 Edge detection part 20 Ultrasonic vibrator 21 Radiation fin 22 Cooling device 23 Heat insulation wall 30 Micro vibration application device 31 Application unit 31a Ultrasonic horn 31b Application tool 32 Adsorption member 32a Adsorption pad 33 Vertical movement device 34 Suction device 40 Substrate conveyance device 41 Loading rail 42 Solder heating unit conveyance Rail 43 Unloading rail 50 Forward / backward moving device 60 Control device

Claims (6)

A solder heating unit that carries in a material to be attached to which the attachment is to be joined by solder, melts the solder, and performs reflow;
A micro-vibration generating device that generates micro-vibration that can be applied to the solder that joins the mounted material carried into the solder heating unit and the mounted object;
A micro-vibration application device that applies the micro-vibration generated by the micro-vibration generator as micro-vibration in the thickness direction of the mounted material to the solder in the solder heating unit;
A reflow apparatus comprising:
The micro-vibration applying device includes a vibration plate connected to the micro-vibration generation device, carried into the solder heating unit, and on which the mounted material is placed, and a holding frame that holds the periphery of the vibration plate. with respect to the diaphragm of the mounting member supporting member, having an applied portion to be applied to solder the minute vibration in the thickness direction of the object to be mounted material, reflow apparatus. The fine vibration applying device includes the mating attachment member with the top surface capable of contacting the contact member of the holding frame of the support member further, the thickness of the object to be mounted material the application unit is against the above vibrating plate The reflow device according to claim 1 , wherein the contact member is configured to contact an upper surface of the holding frame of the mounted material support member when a minute vibration in a direction is applied to the solder. The application unit of the minute vibration applying device is connected to the minute vibration generating device and joins the mounted material and the mounted object placed on the vibration plate of the mounted material supporting member. The reflow apparatus according to claim 1 , further comprising a vibration plate for minute vibration that transmits minute vibration in a thickness direction of the mounted material in a non-contact manner with the solder. A moving device that allows the contact member and the application unit to move between an application position in the solder heating unit and a retreat position outside the solder heating unit;
The mobile device is above application position, the application part is against the above vibrating plate is applied with a small vibration in the thickness direction of the object to be mounted material on the solder above, the contact member is the object mounting member supporting member The reflow device according to claim 2 , wherein the contact member and the application unit are moved from the application position in the solder heating unit to the retracted position outside the solder heating unit while being in contact with the holding frame. . The material to be attached to which the attachment is to be joined by solder is carried into the solder heating unit, the solder is melted and reflowed, and the micro vibration generated by the micro vibration generator is carried into the solder heating unit. Applied to the solder for joining the mounted material and the mounted object by a minute vibration application device as a minute vibration in the thickness direction of the mounted material,
A reflow method in which a minute vibration in a thickness direction of the attached material is applied to the solder by the minute vibration application device, and the attached material is taken out of the solder heating unit to cool the molten solder. And
When the mounted material is carried into the solder heating unit, the mounted material is placed on the vibration plate of the mounted material support member having a diaphragm and a holding frame that holds the periphery of the diaphragm. Bring it into the solder heating part,
When the minute vibration is applied by the minute vibration applying device, the application portion of the minute vibration applying device connected to the minute vibration generating device is brought into contact with the lower surface of the diaphragm in the solder heating unit, and the minute vibration in the thickness direction of the mounting member and adapted to apply the solder above reflow process. The material to be attached to which the attachment is to be joined by solder is carried into the solder heating unit, the solder is melted and reflowed, and the micro vibration generated by the micro vibration generator is carried into the solder heating unit. Applied to the solder for joining the mounted material and the mounted object by a minute vibration application device as a minute vibration in the thickness direction of the mounted material,
A reflow method in which a minute vibration in a thickness direction of the attached material is applied to the solder by the minute vibration application device, and the attached material is taken out of the solder heating unit to cool the molten solder. And
When the mounted material is carried into the solder heating unit, the mounted material is placed on the vibration plate of the mounted material support member having a diaphragm and a holding frame that holds the periphery of the diaphragm. Bring it into the solder heating part,
When the minute vibration is applied by the minute vibration applying device, the vibration supporting plate of the minute vibration applying device connected to the minute vibration generating device is connected to the minute vibration generating device in the solder heating unit. It said without contact with the solder, the reflow method so as to transmit the minute vibration in the thickness direction of the mounting member for bonding the placed thereon above the mounting member and the mounting thereof to the vibration plate.

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