JP4611409B2 - プラズマ温度制御装置 - Google Patents
プラズマ温度制御装置 Download PDFInfo
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- JP4611409B2 JP4611409B2 JP2008225485A JP2008225485A JP4611409B2 JP 4611409 B2 JP4611409 B2 JP 4611409B2 JP 2008225485 A JP2008225485 A JP 2008225485A JP 2008225485 A JP2008225485 A JP 2008225485A JP 4611409 B2 JP4611409 B2 JP 4611409B2
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- 239000007789 gas Substances 0.000 claims description 85
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 7
- 238000009529 body temperature measurement Methods 0.000 description 5
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 239000000470 constituent Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 210000002889 endothelial cell Anatomy 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/0006—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2240/00—Testing
- H05H2240/10—Testing at atmospheric pressure
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Description
The 35th IEEE International Conference onPlasma Science (ICOPS 2008) Oral Session 1E onMonday, June 16, 09:30−12:00 ConferenceAbstracts、2D4 TOXICITY OFNON-THERMAL PLASMA TREATMENT OF ENDOTHELIAL CELLS マイクロ・ナノプラズマ技術とその産業応用、株式会社シーエムシー出版、2006年12月27日発行
(2)また、本発明は、室温以下、特に、零下のプラズマを生成可能とすることにある。
12・・・ガス配管
14・・・断熱材
20・・・プラズマ用ガス供給部
22・・・プラズマ用ガス保存部
24・・・圧力調節器
26・・・流量調節器
30・・・プラズマ用ガス温度制御部
32・・・冷却機
34・・・プラズマ用ガス温度測定部
36・・・プラズマ用ガス冷却部
38・・・プラズマ用ガス加熱部
40・・・プラズマ発生部
50・・・電源
60・・・プラズマ温度測定部
62・・・熱電対
64・・・温度表示部
Claims (3)
- プラズマ用ガスをプラズマにするプラズマ発生部と、
冷却部及び加熱部からなり、前記プラズマ発生部に供給するプラズマ用ガスの温度を制御するプラズマ用ガス温度制御部と、
プラズマの温度を測定する温度測定部と、を備え、
前記温度測定部で測定されたプラズマの温度を前記プラズマ用ガス温度制御部にフィードバックして、プラズマ用ガスの温度を制御することにより、前記プラズマ発生部で発生するプラズマの温度を零下の温度に制御する、プラズマ温度制御装置。 - 請求項1に記載のプラズマ温度制御装置において、
前記プラズマ発生部に断熱材が配置されている、プラズマ温度制御装置。 - 請求項1または請求項2に記載のプラズマ温度制御装置において、
前記プラズマ用ガス温度制御部は液体窒素によりプラズマ用ガスを冷却する、プラズマ温度制御装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008225485A JP4611409B2 (ja) | 2008-09-03 | 2008-09-03 | プラズマ温度制御装置 |
SG2013063599A SG193813A1 (en) | 2008-09-03 | 2009-09-03 | Plasma temperature control apparatus and plasma temperature control method |
KR1020117006844A KR101603812B1 (ko) | 2008-09-03 | 2009-09-03 | 플라즈마 온도 제어장치 및 플라즈마 온도제어방법 |
MYPI2011000936A MY155509A (en) | 2008-09-03 | 2009-09-03 | Plasma temperature control apparatus and plasma temperature control method |
PCT/JP2009/065394 WO2010027013A1 (ja) | 2008-09-03 | 2009-09-03 | プラズマ温度制御装置及びプラズマ温度制御方法 |
CN200980138949.5A CN102172105B (zh) | 2008-09-03 | 2009-09-03 | 等离子体温度控制装置和等离子体温度控制方法 |
EP09811538.9A EP2328389B1 (en) | 2008-09-03 | 2009-09-03 | Plasma temperature control apparatus and plasma temperature control method |
US13/061,926 US8866389B2 (en) | 2008-09-03 | 2009-09-03 | Plasma temperature control apparatus and plasma temperature control method |
Applications Claiming Priority (1)
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JP2008225485A JP4611409B2 (ja) | 2008-09-03 | 2008-09-03 | プラズマ温度制御装置 |
Publications (3)
Publication Number | Publication Date |
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JP2010061938A JP2010061938A (ja) | 2010-03-18 |
JP2010061938A5 JP2010061938A5 (ja) | 2010-08-05 |
JP4611409B2 true JP4611409B2 (ja) | 2011-01-12 |
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JP2008225485A Active JP4611409B2 (ja) | 2008-09-03 | 2008-09-03 | プラズマ温度制御装置 |
Country Status (8)
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---|---|
US (1) | US8866389B2 (ja) |
EP (1) | EP2328389B1 (ja) |
JP (1) | JP4611409B2 (ja) |
KR (1) | KR101603812B1 (ja) |
CN (1) | CN102172105B (ja) |
MY (1) | MY155509A (ja) |
SG (1) | SG193813A1 (ja) |
WO (1) | WO2010027013A1 (ja) |
Cited By (2)
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---|---|---|---|---|
WO2019123915A1 (ja) | 2017-12-18 | 2019-06-27 | サカタインクス株式会社 | プラズマ硬化型オフセット印刷用インキ組成物、並びにそれを用いた印刷物の製造方法及び印刷方法 |
WO2020045151A1 (ja) | 2018-08-28 | 2020-03-05 | サカタインクス株式会社 | プラズマ硬化用インキ組成物、及び、プラズマ硬化用インキ組成物のための添加剤 |
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JP5933222B2 (ja) * | 2011-11-08 | 2016-06-08 | 東京エレクトロン株式会社 | 温度制御方法、制御装置及びプラズマ処理装置 |
GB2501933A (en) * | 2012-05-09 | 2013-11-13 | Linde Ag | device for providing a flow of non-thermal plasma |
KR101477676B1 (ko) * | 2013-03-29 | 2014-12-31 | 한양대학교 산학협력단 | 플라즈마의 라디칼 제어 장치 및 방법 |
US10037869B2 (en) | 2013-08-13 | 2018-07-31 | Lam Research Corporation | Plasma processing devices having multi-port valve assemblies |
JP2015144078A (ja) * | 2014-01-31 | 2015-08-06 | 富士機械製造株式会社 | 大気圧プラズマ発生装置 |
WO2015120113A1 (en) * | 2014-02-05 | 2015-08-13 | Weinberg Medical Physics Llc | Electromagnetic devices with integrated cooling |
KR102110636B1 (ko) | 2014-03-03 | 2020-05-13 | 가부시키가이샤 후지 | 대기압 플라스마 발생 장치, 쌍피처리체 작업기 |
US9666415B2 (en) * | 2015-02-11 | 2017-05-30 | Ford Global Technologies, Llc | Heated air plasma treatment |
CN105430861A (zh) * | 2015-12-15 | 2016-03-23 | 大连理工大学 | 一种温度可控的低温等离子体产生方法 |
CN110463354B (zh) * | 2017-04-04 | 2022-05-13 | 株式会社富士 | 等离子体产生系统 |
RU2673783C1 (ru) * | 2018-02-13 | 2018-11-29 | Федеральное государственное бюджетное учреждение науки Институт ядерных исследований Российской академии наук (ИЯИ РАН) | Способ измерения температуры ионов в d-t плазме |
ES1226210Y (es) * | 2018-07-25 | 2019-05-31 | Ion Biotec S L | Dispositivo de plasma físico para desinfección de heridas cutáneas |
CN109316935A (zh) * | 2018-11-06 | 2019-02-12 | 广州市真诚环保科技股份有限公司 | 一种恶臭气体的低温等离子电离方法 |
CN110015729B (zh) * | 2019-03-26 | 2020-10-27 | 西安交通大学 | 等离子体处理水的控温与水蒸气冷凝装置及方法 |
WO2020254430A1 (en) * | 2019-06-17 | 2020-12-24 | INSERM (Institut National de la Santé et de la Recherche Médicale) | Medical device for applying plasma |
JP7448120B2 (ja) | 2019-11-14 | 2024-03-12 | 国立研究開発法人農業・食品産業技術総合研究機構 | プラズマを用いてゲノム編集酵素を植物細胞内に導入する方法 |
CN111556641B (zh) * | 2020-06-05 | 2021-04-16 | 清华大学 | 一种低温范围的裸露电极型大气压等离子体发生器系统 |
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2008
- 2008-09-03 JP JP2008225485A patent/JP4611409B2/ja active Active
-
2009
- 2009-09-03 KR KR1020117006844A patent/KR101603812B1/ko active IP Right Grant
- 2009-09-03 EP EP09811538.9A patent/EP2328389B1/en active Active
- 2009-09-03 WO PCT/JP2009/065394 patent/WO2010027013A1/ja active Application Filing
- 2009-09-03 MY MYPI2011000936A patent/MY155509A/en unknown
- 2009-09-03 CN CN200980138949.5A patent/CN102172105B/zh active Active
- 2009-09-03 US US13/061,926 patent/US8866389B2/en active Active
- 2009-09-03 SG SG2013063599A patent/SG193813A1/en unknown
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WO2019123915A1 (ja) | 2017-12-18 | 2019-06-27 | サカタインクス株式会社 | プラズマ硬化型オフセット印刷用インキ組成物、並びにそれを用いた印刷物の製造方法及び印刷方法 |
WO2020045151A1 (ja) | 2018-08-28 | 2020-03-05 | サカタインクス株式会社 | プラズマ硬化用インキ組成物、及び、プラズマ硬化用インキ組成物のための添加剤 |
Also Published As
Publication number | Publication date |
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CN102172105B (zh) | 2014-06-04 |
SG193813A1 (en) | 2013-10-30 |
US20110156590A1 (en) | 2011-06-30 |
US8866389B2 (en) | 2014-10-21 |
WO2010027013A1 (ja) | 2010-03-11 |
EP2328389A4 (en) | 2014-09-10 |
KR101603812B1 (ko) | 2016-03-15 |
EP2328389A1 (en) | 2011-06-01 |
JP2010061938A (ja) | 2010-03-18 |
KR20110056393A (ko) | 2011-05-27 |
EP2328389B1 (en) | 2018-01-03 |
CN102172105A (zh) | 2011-08-31 |
MY155509A (en) | 2015-10-30 |
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