JP4696740B2 - Panel, its construction structure, and panel cover material layer update method - Google Patents

Description

  The present invention relates to a panel capable of easily renewing a surface covering material layer without damaging an underlying thin plate or substrate, a construction structure of the panel, and a method for renewing the panel covering material layer.

  Conventionally, a floor heating structure for heating from the floor surface has been developed and put into practical use on the floors of buildings such as ordinary houses, apartment houses, hotels, hospitals, elderly care facilities, etc. A floor heating structure has been proposed. In particular, a floor heating structure provided with piping for passing a heat medium such as hot water has the advantage that it is less likely to overheat locally and has good heat dissipation, unlike the heater heating method. It is becoming.

  As a structure of the floor heating panel used for such a floor heating structure, FIG. 3 (a), (b) ((a) figure is sectional drawing, (b) figure is an enlarged view of the groove part of (a) figure.) )), A groove 12 is formed on the surface of a base material 11 such as a foamed resin such as expanded polystyrene or plywood, and a pipe 13 through which hot water as a heating medium flows is provided in the groove 12. In general, a thin plate 14 is affixed with an adhesive material such as an adhesive 15, and a surface material layer 16 is affixed on the thin plate 14 with an adhesive material such as an adhesive 17. As the pipe 13, a resin pipe such as a crosslinked polyethylene pipe or a metal pipe such as a copper pipe is used. The thin plate 14 on the surface of the substrate 11 serves to fix the pipe 13 and to homogenize the heat radiation from the pipe 13 within the panel. As this thin plate 14, an aluminum foil or the like is used. The surface covering material layer 16 forms a floor surface, and may be composed of a cushion material layer and a floor surface material layer bonded on the cushion material layer. In some cases, double-sided tape may be used in place of the adhesives 15 and 17, but in either case, the base 11, the thin plate 14, and the covering material layer (cushion material layer and floor surface material layer) 16 are adhered to each other. Has been. This floor heating panel is constructed by being adhered to the entire surface of the floor of the floor with an adhesive having sufficient adhesive strength.

  In a heated floor in which such a floor heating panel is constructed, the surface material layer is worn away due to long-term use and the surface pattern disappears, or the surface pattern is scratched or peeled off when it is noticeable. However, the lower part of the cover material layer is excellent in durability and can withstand long-term use sufficiently. In general, it is regularly or every time the resident changes in rental housing, and at the time of resale etc. Then, reforming is performed to replace the surface material layer.

  At the time of this reforming, it is only necessary to peel off the existing cover material layer and attach a new cover material layer. However, in the conventional floor heating panel shown in FIG. In addition, the thin plate 14 and further a part of the foamed resin of the base 11 adhered to the entire surface of the thin plate 14 are also peeled off together with the surface covering material layer 16 and are often damaged. When the thin plate 14 is peeled off, it is very difficult to adhere a very thin thin plate 14 such as an aluminum foil to the base 11 at the site, and the base 11 is peeled off. In some cases, it is very difficult to repair this on site. Therefore, in such a case, it becomes necessary to replace the entire floor heating panel, which requires much cost, construction time, and labor.

2. Description of the Related Art Conventionally, in order to improve the easy peelability of a surface material layer, there has been proposed one in which a synthetic resin layer is provided on the upper surface (surface material layer bonding surface side) of a thin metal foil (JP 2002-81662 A). . In Japanese Patent Laid-Open No. 2002-81662, it is said that only the surface material layer can be peeled by the interposition of the synthetic resin layer.
JP 2002-81662 A

  However, even when a synthetic resin layer is provided as in JP-A-2002-81662, if the adhesive strength between the synthetic resin layer and the cover material layer is high, the synthetic resin layer and the metal foil together with the cover material layer It may be stripped off. In addition, a part of the surface material layer may remain on the synthetic resin layer side and cannot be easily removed.

  Accordingly, an object of the present invention is to solve the above-mentioned conventional problems and to provide a technique capable of easily renewing a surface material layer without damaging a lower thin plate or a substrate.

  In view of the above-mentioned object, the present inventors have conducted intensive studies. As a result, by providing at least two thin plates at the part to be peeled and making it possible to peel between the thin plates, the underlying thin plate and the substrate can be easily damaged. The present inventors have found that the surface material layer can be renewed and completed the present invention.

The panel of the present invention (Claim 1) includes a plate-like substrate, a thin plate laminated on one plate surface of the substrate, and a surface material layer laminated on a surface of the thin plate opposite to the substrate. In a panel having
Thin plate in a plurality of layers stacked, a panel and overlapping at least two layers of thin plates is peelable, the face material layer side of the thin plate including at least the top layer sheet (hereinafter, referred to as "upper position sheet" )) Between the thin plate below the upper thin plate (hereinafter referred to as “lower thin plate ”) and the cover material layer when the cover material layer is updated in the future. A sheet-like pre-combined body used for adhering a material layer to the lower thin plate is arranged .

The panel of claim 2 is the panel according to claim 1, wherein a plurality of the bases are arranged in parallel. At least one of the thin plates laminated on the base parallel body. The layers are laminated so as to cross over the parallel substrates.

The panel according to claim 3 is the panel according to claim 2, wherein a part of the substrate is the one plate. A temperature control substrate in which a groove is provided on the surface, and a heat medium circulation pipe is disposed in the groove, Of these, the other is a flat substrate that does not include the groove and the piping for circulating the heat medium. The flat substrate is arranged alternately.

The panel according to claim 4 is the panel according to claim 3, wherein the upper thin plate is substantially equal in width to the flat substrate or It has a slightly larger width and is arranged above the flat substrate. To do.

The panel according to claim 5 is the panel according to any one of claims 1 to 4, wherein the pre-combined body is A thin plate-like main body portion approximately equal in width to the upper thin plate, and provided on at least one surface of the thin plate-like main body portion. The cut adhesive layer and the release paper that conceals the adhesive layer are integrated. It is what.

The panel according to claim 6 is the panel according to claim 5, wherein a part of the pressure-sensitive adhesive layer of the pre-combined body is the mold release. The pre-combined body is not partly covered with paper, and the pre-bonded body is partly covered with an adhesive layer not covered with the release paper. It is characterized by being adhered to the lower thin plate side.

The panel according to claim 7 is not covered with the release paper of the pre-combined body according to claim 6. The boundary between the adhesive layer and the adhesive layer covered with the release paper is a fold line, and the release paper is The preliminary assembly is folded along the fold line so as to be positioned on the surface material layer side, and folded. A wire line extends along the upper thin plate.

The panel according to claim 8 is the preliminary connection according to claim 6, respectively, on both sides of the upper thin plate. The combination is arranged.

The panel according to claim 9 is a thin panel in contact with the substrate according to any one of claims 1 to 8. Adhesive strength between the base plate (hereinafter referred to as “lowermost layer thin plate”) and the substrate is laminated adjacent to the lowermost layer thin plate. It becomes larger than the adhesive force between the thin plate (hereinafter referred to as “next layer thin plate”) and the lowermost layer thin plate. And at least part of the periphery of these thin plates between the lowermost layer thin plate and the next layer thin plate, A non-adhesive portion where these thin plates are not bonded to each other is provided, and the lowermost layer thin plate and the next layer thin plate There is an adhesive material between the adhesive material and one thin plate, and the adhesive material The non-adhesive part is provided by interposing a low-affinity low-affinity layer, To do.

The method for updating a panel covering material layer according to claim 10 is according to any one of claims 1 to 9. A method for updating a panel cover material layer by replacing the panel cover material layer with a new one. By peeling off between the thin plates, the surface material layer and at least the outermost After removing the upper thin plate, a new cover material layer is placed on the remaining thin plate via a new thin plate. It is characterized by being laminated.

The panel covering material layer updating method according to claim 11 is the method according to claim 10, wherein the covering material layer is updated. In removing the cover material layer and at least one of the upper thin plates. Laminating a new cover material layer through a new upper thin plate corresponding to the removed upper thin plate A method for updating a panel cover material layer, in which a gap between the upper thin plate and the lower thin plate is peeled off Therefore, when renewing the cover material layer, a new upper thin plate is constructed using the preliminary assembly. It is characterized by that.

The panel covering material layer updating method according to claim 12 is the method according to claim 11, wherein the panel is a claim. The panel according to 5 or 6, wherein a new upper thin plate is formed using the pre-combined body. The adhesive layer exposed by peeling off the release paper from the pre-bonded body is adhered to the lower thin plate, and the upper layer It is a thin plate.

The panel covering material layer updating method according to claim 13 is the method according to claim 12, wherein the panel is a claim. The pressure-sensitive adhesive which is the panel according to 7 or 8 and is exposed by peeling the release paper from the pre-bonded body The layer portion is inverted along the fold line portion and adhered to the lower thin plate. To do.

The method for updating a panel covering material layer according to claim 14 is the method according to any one of claims 10 to 13. The panel is a panel according to claim 9, and the thin plates having the non-adhesive portion are between each other. From the above, the thin plate and the covering material layer above the non-bonded portion are removed. .

A panel construction structure according to claim 15 is characterized in that the panel according to any one of claims 1 to 9 is constructed on a floor, a wall, or a ceiling.

The construction structure of the panel according to claim 16 is the construction structure of the panel according to claim 15 , wherein the panel is composed of a panel located in the central region and a panel located in the outer periphery, and at least one of the substrates of the panel located in the central region. The portion is a temperature control base provided with a groove on the one plate surface, and the base of the panel located on the outer periphery is a flat plate base provided with no groove on the one plate surface. It is what.

  The panel of the present invention can be applied to any of floors, walls, and ceilings. When renovating a panel that has been constructed, the surface material layer side is peeled off and updated.

According to the present invention, at the time of reforming a floor or the like, the material on the side of the surface material layer is not damaged between the two thin layers provided in a peelable manner, without damaging the lower thin plate or the underlying substrate. Without leaving the surface, the base material side and the surface material layer side can be easily separated to remove the surface material layer side. For this reason, only the surface material layer side can be updated efficiently in a short time while leaving the base side of the panel, and the construction cost is also low .

According to the ninth and fourteenth aspects , the thin plates can be smoothly peeled from the interface provided with the non-adhesive portion at the time of updating .

According to the second aspect of the present invention, a large panel can be configured by arranging the substrates in parallel.

According to the third aspect , the temperature control substrate and the flat plate substrate are alternately arranged, and a strong panel construction can be performed by hitting a fixing member such as a nail or a screw on the surface material layer on the flat plate substrate .

According to claim 4, 11, upon updating of the upholstery layer, peeled between the upper sheet and the lower sheet, it is possible to lower sheet is leaving, and updates the upper sheet and the face material layer with a new one .

According to the present invention, when the surface material layer is updated, the lower thin plate and the surface material layer can be attached by the preliminary combined body, so that the renewal work can be performed without bringing the new upper thin plate into the field. it can.

According to claim 5 and 12, since spare conjugate of the pressure-sensitive adhesive layer is covered with release paper, never pre-bonded body is搬去to accompany it when搬去the existing face material layer.
According to the twenty-fourth, twenty-fifth, and thirty-fifth aspects, a part of the pre-combined body is attached to the lower thin plate, thereby preventing displacement.

According to Claims 7, 8, and 13 , after removing the existing cover material layer and the upper thin plate, the front cover material layer side of the preliminary combined body is reversed from the fold line portion and stacked on the lower thin plate. The combined body can be used for fixing the cover material layer. Therefore, it is not necessary to position the pre-combined body at the time of updating, and the operation becomes extremely simple.

According to claim 8 , the spare joint on one side of the upper thin plate is used for the first renewal of the superficial material layer, the other side is left as it is, and the remaining spare material is renewed for the second renewal of the superficial material layer. Since a combined body can be used, the surface material layer can be easily updated up to twice in one panel.

According to the sixteenth aspect , it is possible to reduce the construction cost and the heat energy cost by not allowing the heat medium to flow through the outer periphery of the floor, wall, or ceiling that does not require heating or cooling.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, what is described below is an example of embodiments of the present invention, and the present invention is described below unless it exceeds the gist. It is not limited at all.

  In the following, the case where the panel of the present invention is mainly applied to a floor heating panel will be described as an example, but the panel of the present invention can be applied to both cooling and heating. In the later-described piping, a hot medium such as hot water or a cold medium such as cold water is circulated as a heat medium. The panel of the present invention is not limited to floor cooling / heating, but is applied to surface cooling / heating applications in various places such as wall cooling / heating and ceiling cooling / heating. Furthermore, the panel of the present invention is also applicable to a floor, wall or ceiling surface forming panel which does not allow a heat medium to circulate and thus does not perform heating or cooling.

[1] The first reference example Figure 1a is a sectional view showing a reference example of panel, Figure 1b is an enlarged view of FIG. 1a. In FIG. 1a, each member is shown by being cut off for convenience of explanation, but these are actually laminated and integrated as shown in FIG. 1b. FIG. 1c is a cross-sectional view showing the lamination procedure. FIG. 2 is a cross-sectional view illustrating a reference example of the method for updating the floor heating panel cover material layer of FIGS. In FIGS. 1a, 1b, 1c, and 2, members having the same functions as those shown in FIG.

[Floor heating panel]
The floor heating panel shown in FIGS. 1a and 1b is provided with a groove 12 for accommodating a pipe on one plate surface (upper surface), and a plate-like shape as a temperature control substrate in which a pipe 13 is disposed in the groove 12. The base 11, the piping 13 for circulating the heat medium disposed in the groove 12, the two thin plates 14A and 14B stacked on the base 11, and the surface material layer 16 stacked on the thin plate 14B With. The thin plate 14A is a heat diffusion thin plate, and a resin coating layer 18 is provided on the upper surface (the surface opposite to the base 11). Hereinafter, the thin plate 14A provided with the resin coating layer 18 is referred to as a lowermost layer thin plate 14J. Moreover, the surface material layer 16 includes a cushion material layer 16A on the thin plate 14B side and a floor surface material layer 16B laminated thereon.

  In the floor heating panels of FIGS. 1a to 1c, the base 11, the lowermost layer thin plate 14J, the thin plate 14B, the cushioning material layer 16A, and the floor surface material layer 16B are laminated and integrated through adhesion materials 19A, 19B, 19C, and 19D, respectively. It has become.

Although this thin plate 14B is a next-layer thin plate, in this reference example , the next-layer thin plate 14B also serves as the uppermost layer thin plate.

  This floor heating panel is constructed as shown in FIG. 1c.

  First, as shown in (1) of FIG. 1c, a plurality of base bodies 11 are arranged so as to be laid out on the construction target floor. In addition, the some base | substrate 11 is mutually connected by sheet | seat material, is folded in folding screen shape, this is expand | deployed and it spreads on a construction object floor surface. A pipe 13 is arranged in the groove 12 of the base 11 laid in this way.

  Next, as shown in (2) of FIG. 1c, after the adhesion material 19A is applied on the substrate 11, the lowermost layer thin plate 14J is attached. The adhesion material 19A may be applied in advance to the lowermost layer thin plate 14J and covered with a release paper or film, and the lowermost layer thin plate 14J may be attached to the substrate 11 by peeling the release paper or film during construction. . In this case, the work process of applying the adhesion material 19A on site is omitted.

  Next, as shown in (3) of FIG. 1c, the next layer thin plate 14B is pasted on the lowermost layer thin plate 14J through the adhesion material 19B. In this case, it is desirable that the adhesion material 19B is applied in advance to the next-layer thin plate 14B and covered with release paper or a film. The release paper or film is peeled off, and the next layer thin plate 14B is pasted on the lowermost layer thin plate 14J.

  Thereafter, as shown in FIG. 1c (4), the surface covering material layer 16 is pasted on the next layer thin plate 14B through the adhesion material 19C. In this case, it is preferable to apply the adhering material 19C onto the next layer thin plate 14B. The surface covering material layer 16 is carried into the site as an integration of the floor surface material layer 16B and the cushion material layer 16A via the adhesion material 19D.

  1A to 1C and 2, since a heating medium such as hot water is circulated through the pipe 13, the base 11 is a heating base and the panel is a floor heating panel, but the cooling medium such as cold water is provided in the pipe 13. In this case, the base 11 is a cooling base, and the panel is a cooling panel suitable for walls, ceilings, and the like.

The detail of each member which comprises the panel of a reference example is demonstrated below.

<Substrate>
The material of the base 11 is not particularly limited, but is usually preferably made of a foamed synthetic resin with high heat insulation properties, and is preferably a foamed synthetic resin plate, specifically, polyurethane foam, polyethylene foam, polypropylene foam. Body, polystyrene foam, polyvinyl chloride foam, polymethyl methacrylate foam, polycarbonate foam, polyphenylene oxide foam, foam of polystyrene and polyethylene mixture, and the like. Among these, polyethylene foam, polypropylene foam, polystyrene foam and the like are preferable. The thickness of these plate-like bodies constituting the substrate 11 is preferably selected in the range of usually 9 to 50 mm.

<groove>
On one plate surface of the substrate 11, a plurality of grooves 12 for arranging the pipes 13 are formed along the side of the substrate 11.

  The width of the opening of the groove 12 is preferably the same as the outer diameter of the pipe 13 or slightly larger than this. The groove 12 is formed so that the cross-sectional shape perpendicular to the extending direction is U-shaped or U-shaped. In particular, the heat transfer from the pipe 13 to the floor surface, and the pipe 13 is embedded in the groove 12. From the viewpoint of workability at the time, it is preferable to have a U-shaped cross section.

  The depth of the groove 12 is preferably approximately the same as the outer diameter of the pipe 13. If the depth of the groove 12 is larger than the outer diameter of the pipe 13, when the pipe is embedded, a gap is formed on the upper side of the pipe 13, and the heat of the heating medium cannot be effectively transferred to the floor surface side. , Heat transfer efficiency tends to decrease.

<Heat dissipation piping 13>
As the pipe 13, a flexible tube is usually used, and specifically, a resin pipe such as a crosslinked polyethylene pipe or a polybutene pipe, or a metal pipe such as a copper pipe or a steel pipe may be used. Among these, metal pipes have higher thermal conductivity than resin pipes, but they are heavy, have problems such as workability and rusting, and increase costs, so they are used appropriately depending on the application of the cooling heat panel. Is done.

  The cross section of the pipe (the cross section in the direction perpendicular to the length direction) is not particularly limited and is generally circular as shown in FIG. It is possible to increase the contact area between the plate and the thin plate, and to further increase the efficiency of cooling to the surface side. However, in this case, the shape of the groove provided in the base is appropriately designed following the shape of the pipe.

  The diameter of the pipe 13 can be changed depending on the construction target of the floor heating panel and the kind and temperature of the heat medium to be circulated. Generally, the outer diameter is about 6 mm to 13 mm and the inner diameter is about 4 mm to 10 mm. The wall thickness is about 0.8 mm or more and 2.0 mm or less.

<Heat medium>
Examples of the heat medium (warm medium) passed through the pipe 13 include warm water, water vapor, heated oil, or an antifreeze liquid such as an ethylene glycol aqueous solution or a propylene glycol aqueous solution, preferably hot water.
On the other hand, cold water is usually used as the cooling medium.

<Thin plate>
Sheet 14A, 14B is adapted to secure the pipe 13, preferably has a transfer heat function by soaking the heat pipe 13 to the upholstery layer 16, a plurality of layers provided sheet in the present embodiment (the first In an embodiment, at least one of the thin plates 14A, 14B), preferably the thin plate 14A is preferably a metal foil as a heat diffusion thin plate. Examples of the metal foil include aluminum foil, tin foil, stainless steel foil, and copper foil. Among these, aluminum foil is preferable from the viewpoints of manufacturing difficulty and cost. If the thickness of the metal foil is too thin, the strength will not be sufficient, and if it is too thick, the product will not only become heavy, but the cost will increase, so the thickness of the thin plate per sheet is usually selected in the range of 10 μm to 2 mm. Is preferred. Examples of the thin plate other than the metal foil include a resin film, a resin sheet, a carbon fiber sheet, or a laminate of at least two of these, and the thickness is usually 10 μm to 2 mm.

In this reference example , such a thin plate is used by laminating two or more layers. There are no particular restrictions on the number of laminates, as long as the number of laminates is two or more. However, if the number of laminates is excessively large, the labor and cost of construction will increase, and the thickness of the floor heating panel will increase. As the distance between the floor and the floor surface increases, the heat transfer efficiency decreases. Therefore, the number of laminated thin plates is usually 2 to 5 layers, particularly preferably 2 layers, and the total thickness of the laminated thin plates is usually 10 μm or more, preferably 40 μm or more, Usually, it is 2 mm or less, preferably 200 μm or less.

  Of the plurality of laminated thin plates, at least one thin plate may be provided with a plurality of holes penetrating in the thickness direction. Such a thin plate is called a perforated thin plate. The purpose of providing a hole in the thin plate is to prevent noise, unevenness, and deterioration in heat transfer performance due to remaining bubbles by removing air remaining in the layer of the adhering material.

  The diameter of the hole is usually 0.01 mm or more, preferably 0.1 mm or more, and is usually 100 mm or less, preferably 50 mm or less. If the diameter of the hole is less than 0.01 mm, air may not be sufficiently removed, and if it exceeds 100 mm, the heat dissipation effect tends to decrease.

  In addition, when peeling a surface covering material layer and replacing | exchanging to a new surface covering material layer, a two-layered thin plate will come together through a peeling surface. Naturally, it is possible to provide holes in these thin plates, but in this case, it is preferable to control the diameter of the holes as follows. In other words, while effectively removing air, in order to prevent the thin plate closest to the peeled surface on the surface material layer side to be peeled and the remaining peeled surface on the substrate side from being integrated, making it difficult to update the surface material layer Of the peeled thin plates, the diameter of the hole of the thin plate closest to the peeling surface is preferably 0.1 to 2 mm. Further, the ratio of the total area of the holes to the area of the thin plate is usually 5 to 50%, preferably 10 to 30%. If this ratio is too low, the air may not be sufficiently extracted. If it is too high, the strength of the thin plate is impaired.

There is no restriction | limiting in particular in the shape (plan view shape) of a hole, For example, although a polygon, a circle, etc. are mentioned, Preferably it is circles, such as a circle | round | yen and an ellipse, from the surface of workability | operativity. In the case of a shape other than a circle, it is preferable that the diameter of a circle having the same area as the hole is in the above range.
The arrangement of the holes may be random or regular throughout the thin plate, but it is preferable to provide the holes regularly throughout the thin plate for industrial production.

  Examples of the method for forming a hole in the thin plate include a press or a method in which a needle capable of forming a predetermined hole is provided in a roller and the thin plate is passed over the roller. When the holes are formed in a random arrangement, the needles may be arranged in a random arrangement.

  The formation pitch of holes (the distance between the centers of adjacent holes) is preferably not more than the distance between the pipes embedded in the substrate, usually 5 mm or more, preferably 20 mm or more, usually 200 mm or less, Preferably it is 70 mm or less.

In this reference example , if the thin plate is a perforated thin plate in which all holes are formed, the function of heat-transferring the heat of the pipe 13 to the surface material layer 16 depending on how the holes of the laminated thin plates overlap each other May be lost. Therefore, it is preferable that at least one of the laminated thin plates is a non-hole thin plate having no holes, and the non-hole thin plate and the perforated thin plate are alternately laminated. By doing in this way, the residual bubbles of the material layer for adhesion between the non-perforated thin plate and the perforated thin plate are efficiently extracted from the holes of the perforated thin plate, and the effect of preventing noise, unevenness and heat transfer performance deterioration is prevented. Can be obtained. For example, in the panels of FIGS. 1a to 1c, the thin plate 14B is preferably a perforated thin plate. The thin plate may be composed of a plurality of partial thin plates. The same applies to the following embodiments.

[Sprayed or linear coating of adhesive material as an alternative to holes]
Instead of providing the holes, residual air between the thin plates can be prevented by providing the adhering material in the form of dots or lines (stripes).

Application area ratio of the adhesion material when the adhesion material is provided in the form of dots (when the area of the thin plate is M ₁ and the area of the portion where the adhesion material is applied is M ₂ , (M ₂ / M ₁ ) × 100% is defined as 50% or more, preferably 80% or more, and usually 99% or less. The shape of the scattered dots may be a circle or other than a circle. The area of one scattered point is usually 10 cm ² or more, preferably 20 cm ² or more, and usually 1000 cm ² or less, preferably 300 cm ² or less.

  When provided in a stripe shape, the width of the stripe is usually 10 mm or more, preferably 30 mm or more, and is usually 200 mm or less, preferably 50 mm or less. The interval between the non-adhesive portions between the stripes is usually 1 mm or more, and usually 100 mm or less, preferably 30 mm or less.

<Resin coating layer>
The resin coating layer 18 is provided to facilitate the peeling of the thin plate 14A and the thin plate 14B and to facilitate the renewal of the floor heating panel.

  Examples of the resin that forms the resin coating layer 18 include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polycarbonate, polyethylene, and polypropylene, and polyamide resins such as polyamide 6 and polyamide 6/6. Can be mentioned. Among these, polyethylene terephthalate is preferable from the viewpoints of strength, ease of layer formation, cost, and the like. If the thickness of the resin coating layer 18 is too thin, the effect of improving the peelability due to the provision of the resin coating layer cannot be sufficiently obtained. If the thickness is too thick, the thickness of the floor heating panel is the same as when the thin plate is thick. Since the problem of increase, cost increase, and decrease in heat transfer efficiency occurs, it is usually 3 μm or more, preferably 10 μm or more, and is usually 300 μm or less, preferably 50 μm or less.

  The lowermost layer thin plate 14J is made of a thin plate 14A by a method of directly heat-sealing a heat-melted resin to a thin plate, a method of bonding through an adhesive material as necessary, a method of bonding a coating film through an adhesive, or the like. It can be manufactured by laminating a coating material on the substrate.

<Outer material layer>
Although there is no restriction | limiting in particular as a surface material layer, What has 16 A of cushioning material layers by the side of a thin board and the floor surface material layer 16B laminated | stacked on this is preferable. However, the cushion material layer is not necessarily required, and only the floor surface material layer may be used. Further, when the outer covering material layer is composed of the cushioning material layer 16A and the floor surface material layer 16B, the cushioning material layer 16A and the floor surface material layer 16B are attached by an adhesion material 19D (details will be described later). Preferably it is.

  The cushion material layer 16A includes, for example, a foamed resin such as a polyurethane foam or a polyolefin-based foam, or a non-woven fabric from the viewpoint of obtaining an excellent walking sensation on the floor surface material layer.

  Although the thickness of the cushioning material layer 16A varies depending on the material and the floor heating panel construction target, sufficient walking performance is achieved without excessively thickening the floor heating panel and without impairing the heat transfer efficiency from the piping. Etc., it is usually 1 mm or more, preferably 2 mm or more, and usually 6 mm or less, preferably 5 mm or less.

  The floor surface material layer 16B is intended to protect the substrate in which the pipes are embedded and to enhance the design and durability of the floor surface appearance. Usually, the floor surface material layer 16B is made of wood such as plywood or foam rubber, preferably wood. A plastic film, a non-woven fabric, a reinforced paper, etc., preferably a natural timber board or a reinforced paper, is usually attached to the surface thereof.

  If the thickness of the floor surface material layer 16B is too thin, the strength will be insufficient and it will be easily damaged, and if it is too thick, the heat transfer efficiency from the piping will decrease and the thickness of the floor heating panel will increase. The following range is preferable.

  In addition, you may give resin coating etc. further on such a floor surface material layer 16B.

<Adhesive material>
In this reference example , (i) the base and the lowermost layer thin plate (details will be described later), (ii) the thin plates, and (iii) a thin plate in contact with the outer covering material layer (hereinafter referred to as “uppermost layer thin plate”). It is preferable that the surface covering material layers are respectively attached by an attachment material (19A to 19D in FIG. 1).
The adhering materials 19A to 19D need only satisfy the mutual relationship of the adhesive force described later, as long as they do not erode the components of the floor heating panel in contact therewith. An adhesive, an adhesive, and a double-sided tape can be used. The adhesion of each member by these adhering materials is preferably a full adhesion, but may be a partial adhesion that adheres 3% or more of the area. In the case of partial bonding, the shape of the bonding portion may be either linear or dotted, but especially when bonding a thin plate such as a metal foil to another thin plate, the substrate, the cushion material layer, etc. In addition, it is preferable that at least the entire periphery is an adhesive portion.

<Adhesive strength>
In the panel of the present reference example , at least two overlapping thin plates (in FIG. 1, the lowermost thin plate 14J and the thin plate 14B) among the thin plates laminated in a plurality of layers can be peeled off. Preferably, the adhesive force between the thin plate in contact with the substrate (the lowermost layer thin plate) and the substrate is larger than the adhesive force between the thin plate (next layer thin plate) laminated adjacent to the lowermost layer thin plate and the lowermost layer thin plate. When renewing the surface material layer, when peeling from the surface material layer that is the upper layer of the floor heating panel in order, it is easy between the next layer thin plate and the bottom layer thin plate laminated adjacent to the bottom layer thin plate The lower layer thin plate is left on the substrate side, a new thin plate layer is laminated on the lower layer thin plate, and the surface material layer is laminated thereon, so that the surface material layer is not damaged. Update.

  The correlation between the adhesive forces will be described with reference to FIG. The adhesive force between the lowermost layer thin plate in contact with the substrate 11, that is, the lowermost layer thin plate 14J, and the substrate 11 is 110% or more of the adhesive force between the next layer thin plate 14B and the lowermost layer thin plate 14J laminated adjacent to the lowermost layer thin plate 14J. It is preferable that Here, there are no particular restrictions on the evaluation criteria for the adhesive strength, but it is measured by, for example, a 180-degree peeling adhesion test (hereinafter referred to as “JIS Z 0237 method”) defined in JIS Z 0237. .

For example, when the adhesive force between the lowermost layer thin plate (lowermost layer thin plate 14J) and the next layer thin plate (thin plate 14B) laminated thereon is 100%, the substrate and the lowermost layer thin plate (substrate 11 and lowermost layer thin plate 14J) The adhesive strength is preferably 110% or more, and specifically, the adhesive strength according to JIS Z 0237 method is preferably as follows.
(a) Adhesive force between the substrate and the lowermost layer thin plate (substrate 11 and lowermost layer thin plate 14J): usually 3 to 30 N, preferably 5 to 20 N
(b) Adhesive force between the lowermost layer thin plate (lowermost layer thin plate 14J) and the next layer thin plate (thin plate 14B) laminated thereon: usually 1 to 27N, preferably 2 to 18N

  In addition, the adhesive force between the thin plate 14 </ b> B, which is also the uppermost thin plate, and the cover material layer only needs to be at a level that can provide the strength necessary to withstand normal daily life use.

  Therefore, it is preferable that the members are bonded with the adhering material so as to satisfy the mutual relationship of the above-described adhesive force.

  In order to satisfy such an interrelationship of adhesive strength, where the adhesive force is increased, for example, an acrylic adhesive that increases the coating amount or a urethane adhesive is used, and the adhesive force is decreased. For example, it is preferable to adjust the adhesive force by using, for example, an acrylic pressure-sensitive adhesive with a small coating amount. The adhesive force can also be adjusted by the adhesive area. In this case, a portion having a large adhesive force may be adhered to the entire surface and a portion having a small adhesive force may be partially adhered. In addition, the adhesive force in the case of partial adhesion can be calculated by S × Ms ÷ M from the adhesive force S per unit area of the adhesive portion, the total area M, and the adhesive portion area Ms.

However, in this reference example , the surface material layer is composed of a cushion material layer and a floor surface material layer, and between the base and the lowermost layer thin plate, and between the lowermost layer thin plate and the next lower layer thin plate, In the floor heating panel that is bonded to the entire surface, the effect of the present reference example by providing a plurality of thin plates can be effectively exhibited, which is preferable.

<Manufacturing and construction>
The panel of this reference example is manufactured and constructed by providing an adhesion material between members in a predetermined laminated structure and laminating and integrating the members.

The panel of this reference example has the structure shown in FIG. 1, for example, and a floor heating panel manufactured in advance as a structure excluding the floor surface material layer and the cushion material layer is bonded to the floor frame surface in the field. Further, a floor surface material layer and a cushion material layer may be constructed from above, and each member may be laminated and constructed so as to have the structure shown in FIG. However, in this case as well, those obtained by laminating each member in advance at the factory may be combined on site. For example, the “surface material layer 16”, “thin plate 14B” and “laminate of the lowermost layer thin plate 14J and the substrate 11” are manufactured in advance at the factory and assembled on site; “the surface material layer 16” and “the thin plate 14B” A laminate of the lowermost layer thin plate 14J and the substrate 11 "can be manufactured in advance in a factory and assembled on site.

[How to update the surface material layer]
To replace the cover material layer of the panel of this reference example as described above, after removing the cover material layer and at least one thin plate by peeling between adjacent and peelable laminated thin plates Then, a new cover material layer is laminated on the remaining thin plate via a new thin plate. Preferably, after removing the surface material layer and the thin plate other than the lowermost layer thin plate by peeling between the lowermost layer thin plate and the next lower layer thin plate adjacent to the lowermost layer thin plate, a new layer is formed on the remaining lowermost layer thin plate. A new cover material layer is laminated through a thin sheet.

  Hereinafter, an updating method for exchanging the surface material layer of the floor heating panel shown in FIG. 1 will be described with reference to FIG.

  (1) First, the floor surface material layer 16B is peeled off from the state shown in FIG. 1 (FIG. 2A).

  (2) Next, the cushion material layer 16A is peeled off. In this case, it is preferable from the viewpoint of work efficiency that the thin plate 14B is pulled up and the thin plate 14B is peeled off from the lowermost layer thin plate 14J together with the cushion material layer 16A (FIG. 2B). As described above, since the adhesive force between the thin plate 14B and the lowermost layer thin plate 14J is smaller than the adhesive force between the lowermost layer thin plate 14J and the substrate 11, the thin plate 14B can be easily peeled off from the lowermost layer thin plate 14J. Further, the lowermost thin plate 14J and the base 11 are not damaged, and there is no problem of remaining of the cushioning material layer 16A and the thin plate 14B.

  (3) After the floor surface material layer 16B, the cushion material layer 16A and the thin plate 14B are peeled off, the resin coating layer 18 of the lowermost layer thin plate 14J is exposed, so that a new adhering material 19B ′ is interposed thereon. Then, a new thin plate 14B ′ is bonded (FIG. 2C). In this case, a material obtained by previously laminating the adhesion material 19B 'on the thin plate 14B' may be used.

  (4) Next, as shown in FIG. 2D, a surface material layer 16 'is pasted on the thin plate 14B' via a new adhesion material 19C '. The facing material layer 16 ′ is the same as the facing material layer 16. In addition, a new cushioning material layer 16A ′ may be bonded to the thin plate 14B ′ via an adhesion material 19C ′, and a floor surface material layer 16B ′ may be further bonded via an adhesion material 19D ′. .

  The above steps can be carried out easily and efficiently with good workability.

  In the above description of FIG. 2, it is preferable that the cushioning material layer 16A is peeled off after the floor surface material layer 16B is peeled off, and the cushioning material layer 16A is preferably peeled off together with the next layer thin plate 14B.

  The reason for this will be described with reference to FIG. FIG. 1d is a detailed view of the peeling method of the existing cover material layer (the cover material layer before update).

  When the floor surface material layer 16B is to be turned up so as to peel off the existing cover material layer 16, the cushion material layer 16A made of foamed resin or the like more fragile than the floor surface material layer 16B has 2 in the upper half side and the lower half side. The floor surface material layer 16B and the upper half side of the cushion material layer 16A are peeled off (see (1) in FIG. 1d).

  The lower half side of the cushion material layer 16A remains attached to the next layer thin plate 14B.

  Therefore, as shown in FIG. 1d (2), the next-layer thin plate 14B is peeled off from the lowermost-layer thin plate 14J, and the remaining portion of the cushion material layer 16A attached to the next-layer thin plate 14B is also removed.

  (3) of FIG. 1d shows the state after the lowermost thin plate 14J is removed, and is the same view as FIG. 2 (b).

  As described above, the resin coating layer 18 is provided on the thin plate 14A, and the adhesion between the adhesion material 19B and the lowermost layer thin plate 14J is low. The material 19B is peeled off from the lowermost layer thin plate 14J.

[Preferable configuration for facilitating peeling of the next layer thin plate 14B]
When the next layer thin plate 14B is peeled off from the lowermost layer thin plate 14J as shown in FIG. 1d (2) above, when the operator grasps and peels the next layer thin plate 14B with a fingertip or a tool, the lowermost layer thin plate 14J is also removed together. There is a risk of peeling.

  In order to prevent such a situation, a non-adhesive portion where the thin plates are not bonded to each other is provided on at least a part of the peripheral edges of the two thin plates that can be peeled. Specifically, as shown in FIG. 1e, between the next layer thin plate 14B and the lowermost layer thin plate 14J, the next layer thin plate 14B and the lowermost layer thin plate 14J are bonded to at least a part of the peripheral edge of both. It is preferable to provide a non-bonded portion 80 that is not present. When this non-adhesive portion 80 is provided, as shown in FIG. 1e (3), when the next layer thin plate 14B is peeled off together with the remaining cushion material layer 16A, the end of the next layer thin plate 14B is simply lifted up. The lower layer thin plate 14B and the lowermost layer thin plate 14J are turned up so that the mouth is opened. Therefore, it is possible to smoothly peel off the next layer thin plate 14B by firmly grasping the end of the next layer thin plate 14B.

  As this non-adhesion part, it can comprise using non-adhesive thin pieces (low affinity layer), such as a film, resin impregnated paper, resin coated paper, and a nonwoven fabric. If this non-adhesive thin piece is attached to the lowermost layer thin plate 14J, the next-layer thin plate 14B can be peeled off from the non-adhesive portion 80 no matter how many times the next-layer thin plate 14B and the surface material layer 16 are updated. Can be convenient. However, the non-adhesive thin piece may be attached to the next layer thin plate 14B side.

  Further, the non-adhesive portion may be formed by not distributing the adhering material 19B to the peripheral portion of the next layer thin plate 14B, instead of providing a non-adhesive thin piece.

  In addition, the non-adhesion part 80 may be provided over the perimeter of the interface of the next layer thin plate 14B and the lowest layer thin plate 14J, and may be provided in a part. When providing a non-adhesion part in part, it is preferable to provide it in at least a part of the corner (corner part) of the next layer thin plate 14B and the lowermost layer thin plate 14J. In this case, it may be provided at all corners or at some corners.

The width of the next-layer thin plate 14B and the lowermost-layer thin plate 14J in the non-adhesive portion is usually 1 mm or more, preferably 5 mm or more, and usually 50 mm or less, preferably 20 mm or less from the edge of the panel.
By doing in this way, the thin plate and surface covering material layer above a non-bonding part can be removed from between the thin plates in which a non-bonding part exists, and the panel surface covering material layer can be updated.

[2] In a reference example of the second reference example FIG 1, the pipe 13 although temperature control base 11 with grooves 12 arranged is used, as shown in FIG. 4 in this reference example A substrate (a flat substrate) 11A without a groove may be used. FIG. 4A shows a panel of this reference example in the case of using a flat substrate 11A as a substrate (this panel can be applied to any of a floor, a wall, and a ceiling, as shown in FIGS. 4 is a cross-sectional view showing a reference example of FIG. 4 (b), in which heating panel circulation piping is not provided and heating and cooling cannot be performed with this panel alone. It is an enlarged view of Fig.4 (a). 4, members having the same functions as those shown in FIG. 1 are denoted by the same reference numerals.

  The panel shown in FIG. 4 has the same configuration as the panel shown in FIG. 1 except that the flat substrate 11A is used as the substrate. For example, when a floor heating panel as shown in FIGS. 1 and 2 is laid in a living room, it is not necessary to lay a floor heating panel throughout the living room, and the surrounding area of the living room may be a panel without a heating function. In this case, in order to prevent a step from being generated between the place where the floor heating panel is laid and the place where the floor heating panel is not laid, there is a heating medium circulation pipe around the floor heating panel. A so-called dummy mat is laid on a flat substrate on which is not disposed. The panel shown in FIG. 4 can be used as this dummy mat. Of course, it goes without saying that the panel shown in FIG. 4 may be laid on the entire surface of the floor, ceiling, and wall of the living room.

  The flat mat substrate 11A of the dummy mat is not particularly limited because it is not necessary to form a groove for arranging the heat medium distribution pipe, but the substrate 11 of the floor heating panel of FIGS. The same as the above, preferably a wooden plate member such as plywood or particle board is used, and foamed resin is preferably used from the viewpoint of light weight. The thickness of the flat substrate 11A is normally 9 to 50 mm, and it is preferable that the thickness be the same as that of the temperature control substrate 11 of the above-described floor heating panel because a step can be prevented.

  Further, as will be described later, such a flat substrate 11A may be provided in order to form a fixing region for the cover material layer. In this case, it is preferable that the flat substrate 11A has sufficient strength to support the overload including the cover material layer, such as wood such as cedar, cherry, cypress, lauan, and plywood, or a resin molded body. The length is usually about 300 to 4000 mm, the thickness is usually about 9 to 50 mm, and the width is usually about 20 to 100 mm.

  The panel shown in FIG. 4 is usually made of the same material and dimensions as those of the base 11 except that the base 11A has no grooves. The thin plate, the covering material layer, the adhesion material, the adhesive strength between the thin plates, and the manufacturing The same description as the panel shown in FIGS. 1 and 2 can be applied as it is to the construction method and the method of updating the cover material layer.

  Even in this panel, it is possible to easily update the surface covering material layer 16 without damaging the flat plate base 11A and the lowermost layer thin plate 14J by separating both the lowermost layer thin plate 14J and the thin plate 14B. Can do.

[3] Third Reference Example FIGS. 1 and 2 show only one substrate 11, and FIG. 4 shows only one substrate 11A (flat plate substrate). However, in this reference example , a plurality of substrates may be arranged in parallel to form a substrate parallel body. And on this base parallel body, at least 1 layer of the multiple laminated thin plates may be laminated | stacked so that each base parallel body may be crossed. A specific example of such a panel will be described below.

That is, the base body may be formed by arranging a temperature control base body 11 with grooves 12 and a flat base body 11A without grooves as shown in FIGS.
FIG. 5 is a cross-sectional view showing a reference example of such a panel.

  In FIG. 5, a plurality of flat plate base bodies 11A and temperature control base bodies 11 are alternately arranged in parallel to constitute a base body parallel body. Among the substrates constituting the substrate parallel body, a part of the substrates is the temperature adjustment substrate 11, and among the substrates constituting the substrate parallel body, the other substrate is the flat substrate 11A. The temperature adjustment substrate 11 and the flat substrate 11A are alternately arranged. Then, an adhesion material 19A and a lowermost layer thin plate 14J are laminated on the upper side of the parallel substrate. On the upper side of the lowermost thin plate 14J, in the upper region of the flat plate base 11A, there are the adhesion material 20, the thin plate 21, the adhesion material 22, the thin plate 23, and the adhesion material 24 that are the same width or slightly larger than the flat plate base 11A. The surface covering material layer 16 is laminated and disposed thereon. In addition, on the lowermost layer thin plate 14J, the thin plate 21, and the thin plate 23, indications 31, 32, and 33 indicating the position of the base 11A are provided, respectively. The thin plate 14A of the lowermost layer thin plate 14J is a heat diffusion thin plate, and this heat diffusion thin plate is continuously provided from the temperature control substrate 11 to the flat plate substrate 11A.

In FIG. 5, the thin plate 23 is the uppermost thin plate. The thin plates (thin plates 21 and 23) on the side of the outer covering material layer 16 including the uppermost thin plate (thin plate 23) are called upper thin plates. In FIG. 5, the upper thin plates (thin plates 21 and 23) have substantially the same width as or slightly larger than the flat plate base 11A, and are disposed above the flat plate base 11A.
Hereinafter, a specific example of the relationship between the width of the upper thin plate (thin plates 21, 23) and the width of other members will be described.

The widths W _{b of the} thin plates 21 and 23 are set such that when the surface covering material layer 16 is installed, the adhesion material 24 between the surface covering material layer 16 and the thin plate 23 and the adhesion material 22 between the thin plate 21 and the thin plate 23. It is preferable not to protrude. Therefore, the width _{W b} of the thin plate 21 and 23, it is preferable to be larger than the width _{W c} of the flat base 11A fixed area. The widths W _{b of the} thin plates 21 and 23 are usually 110% or more, preferably 130% or more, and usually 160% or less, preferably 150% or less with respect to the width W _a of the flat substrate 11A. It is also preferable to provide the thin plates 21 and 23 so as to project on both sides of the flat plate base 11A.

In this reference example , for the renewal of the covering material layer 16, a display indicating the position of the flat substrate 11 </ b> A is provided on the upper surface of the thin plate on the substrate side among the two thin plates that can be peeled off. Is preferred. An example of such display is shown in FIG. The indications 31, 32 and 33 on the lowermost layer thin plate 14J and the thin plates 21 and 23 in FIG. 5 are markers for fixing the cover material layer 16, specifically, fixing members such as nails and screws. It is formed to be a mark for. The indications 31 to 33 are preferably formed in the vicinity of the center in the width direction of the base body 11A and the thin plates 21 and 23 by applying a colored paint and sticking a colored tape. The width W _c is a fixing member such as a nail and Da設to ensure flat base 11A, the temperature adjustment substrate 11, in particular smaller than the thin plate 21 and 23 so as not to damage the pipe, flat base 11A The width W _a is preferably 20 to 80%. The width W _d of the adhesion materials 20, 22, 24 is preferably about 20 to 80% of the width W _a in order to prevent the adhesion material from protruding.

  For example, as shown in FIG. 12 described later, the surface material layer 16 is actually provided with a real part 16a on the side edge, and this real part 16a is a fixing member such as a nail or a screw (in FIG. 12). It is fixed to the substrate (flat substrate) 11A by a nail 70). The display 31 (or 32, 33) is used as a mark when the nail or the like is hit. If a nail or the like is struck at the position of the display 31 (or 32, 33), the nail is always driven into the base body (flat base body) 11A, and the pipe 13 is not accidentally damaged.

  The indications 31, 32, and 33 are used as marks when the thin plates 21 and 23 are pasted on the lowermost thin plate 14J, respectively. By attaching the thin plates 21 and 23 in accordance with the displays 31, 32 and 33, the thin plates 21 and 23 are always arranged above the base 11A.

  In FIG. 5, the substrate parallel body, each thin plate, and the layer of the material for adhesion are separately shown in the figure, but this is for explaining the layer structure, and these are actually overlapped with each other. And bonded by an adhesive material.

  Among the adhering materials 19A, 20, 22, and 24 of FIG. 5, the interlaminar bonding force between the thin plate 21 and the lowermost layer thin plate 14J by the adhering material 20 is smaller than the interlaminar bonding force of the other adhering material layers. It has become. Therefore, when the surface material layer 16 is peeled off, peeling occurs between the thin plate 21 and the lowermost layer thin plate 14J.

  When the surface covering material layer 16 of the panel having the configuration of FIG. 5 is updated, the surface covering material layer 16 is first peeled off. At this time, as described above, for example, the thin plate 21 and the thin plate 14J are peeled off.

  After the surface material layer 16 is peeled off and removed in this way, a laminate of new adhesion materials 20, 22, 24 and thin plates 21, 23 is pasted on the display 31 as a mark. A new cover material layer 16 is disposed on the surface. In this way, the surface material layer 16 can be updated easily and quickly.

  In FIG. 5, it has a five-layer structure in which two thin plates 21, 23 and three layers of adhesive materials 20, 22, 24 are laminated, but one thin plate 21 and two adhesive layers 20, 24 are stacked. It may be a three-layer structure in which are stacked.

  In FIG. 5, the adhesive material 20 portion is set to have the weakest adhesive force, and the adhesive material 20 portion is peeled off when the surface material layer 16 is updated. However, the adhesive material 22 portion is set to the weakest adhesive force, It is good also as a structure which the adhesion material 22 part peels at the time of a surface material layer update.

  Details of each member constituting the panel of FIG. 5 will be described below.

<Substrate>
Although the material of the base | substrates 11 and 11A is not specifically limited, Usually, the thing made from the foaming synthetic resin which was rich in heat insulation is preferable, and the plate-like body made from a foaming synthetic resin, specifically, a polyurethane foam, a polyethylene foam, Examples include polypropylene foam, polystyrene foam, polyvinyl chloride foam, polymethyl methacrylate foam, polycarbonate foam, polyphenylene oxide foam, foam of polystyrene and polyethylene mixture, and the like. Among these, polyethylene foam, polypropylene foam, polystyrene foam and the like are preferable. The thickness of these plate-like bodies constituting the base 11, 11A is usually preferably selected within a range of 9 to 50 mm.

  In particular, the flat substrate 11A for forming the fixed region of the cover material layer 16 preferably has sufficient strength to support the overload including the cover material layer 16, such as cedar, cherry, cypress, It is composed of wood such as lauan and plywood, and a resin molded body. The dimensions are usually about 300 to 4000 mm, the thickness is usually about 9 to 50 mm, and the width is usually about 20 to 60 mm. The

  In FIG. 5, the arrangement pitch between the flat substrate 11A and the temperature adjusting substrate 11 is not particularly limited. However, if the width of the flat substrate 11A is too large with respect to the width of the temperature adjusting substrate 11, the temperature adjustment efficiency of the entire panel is achieved. On the other hand, if the width of the flat substrate 11A is too small with respect to the width of the temperature control substrate 11, a sufficient fixing area for the cover material layer 16 cannot be secured. Therefore, it is preferable that the ratio of the width of the flat substrate 11A is about 0.1 to 0.2 with respect to the total width of the temperature control substrate 11 and the flat substrate 11A.

<groove>
On one plate surface of the base body (temperature control base body) 11, a plurality of grooves 12 for arranging the pipes 13 are formed along the side of the base body 11.

  The width of the opening of the groove 12 is preferably the same as the outer diameter of the pipe 13 or slightly larger than this. The groove 12 is formed so that the cross-sectional shape perpendicular to the extending direction is U-shaped or U-shaped. In particular, the heat transfer from the pipe 13 to the floor surface, and the pipe 13 is embedded in the groove 12. From the viewpoint of workability at the time, it is preferable to have a U-shaped cross section.

  The depth of the groove 12 is preferably approximately the same as the outer diameter of the pipe 13. If the depth of the groove 12 is larger than the outer diameter of the pipe 13, when the pipe is embedded, a gap is formed on the upper side of the pipe 13, and the heat of the heating medium cannot be effectively transferred to the floor surface side. , Heat transfer efficiency tends to decrease.

<Piping>
As the pipe 13, a flexible tube is usually used, and specifically, a resin pipe such as a crosslinked polyethylene pipe or a polybutene pipe, or a metal pipe such as a copper pipe or a steel pipe may be used. Among these, metal pipes have higher thermal conductivity than resin pipes, but they are heavy, have problems such as workability and rusting, and increase costs, so they are used appropriately depending on the application of the cooling heat panel. Is done.

  There is no particular limitation on the shape of the cross section of the pipe (the cross section in the direction perpendicular to the length direction). Generally, the pipe has a circular shape as shown in FIG. It is possible to increase the contact area between the plate and the thin plate, and to further increase the efficiency of cooling to the surface side. However, in this case, the shape of the groove provided in the base is appropriately designed following the shape of the pipe.

  The dimensions of the pipe 13 can be changed depending on the floor heating panel construction target and the type and temperature of the heat medium to be circulated, but generally the outer diameter is about 6 mm to 13 mm and the inner diameter is about 4 mm to 10 mm. The wall thickness is about 0.8 mm or more and 2.0 mm or less.

<Heat medium>
Examples of the heat medium (warm medium) passed through the pipe 13 include warm water, water vapor, heated oil, or an antifreeze liquid such as an ethylene glycol aqueous solution or a propylene glycol aqueous solution, preferably hot water.
On the other hand, cold water is usually used as the cooling medium.

<Thin plate>
Sheet 14A, 21, 23 is adapted to secure the pipe 13, thin plate heat pipe 13 to the upholstery layer 16 by soaking preferably has a transfer heat function, providing a plurality of layers in the present embodiment (the In the reference example 3, at least one of the thin plates 14A, 21, 23), preferably the thin plate 14A preferably uses a metal foil as a heat diffusion thin plate. Examples of the metal foil include aluminum foil, tin foil, stainless steel foil, and copper foil. Among these, aluminum foil is preferable from the viewpoints of manufacturing difficulty and cost. If the thickness of the metal foil is too thin, the strength will not be sufficient, and if it is too thick, the product will not only become heavy, but the cost will increase, so the thickness of the thin plate per sheet is usually selected in the range of 10 μm to 2 mm. Is preferred. Examples of the thin plate other than the metal foil include a resin film, a resin sheet, a carbon fiber sheet, or a laminate of at least two of these, and the thickness is usually 10 μm to 2 mm.

In this reference example , such a thin plate is used by laminating two or more layers. There are no particular restrictions on the number of laminates, as long as the number of laminates is two or more. However, if the number of laminates is excessively large, the labor and cost of construction will increase, and the thickness of the floor heating panel will increase. As the distance between the floor and the floor surface increases, the heat transfer efficiency decreases. Therefore, the number of laminated thin plates is usually 2 to 5 layers, particularly preferably 2 layers, and the total thickness of the laminated thin plates is usually 10 μm or more, preferably 40 μm or more, Usually, it is 2 mm or less, preferably 200 μm or less.

As in the first reference example , among the plurality of laminated thin plates, at least one thin plate may be provided with a plurality of holes penetrating in the thickness direction. Such a thin plate is called a perforated thin plate. The purpose of providing a hole in the thin plate is to prevent noise, unevenness, and deterioration in heat transfer performance due to remaining bubbles by removing air remaining in the layer of the adhering material.

  The diameter of the hole is usually 0.01 mm or more, preferably 0.1 mm or more, and is usually 100 mm or less, preferably 50 mm or less. If the diameter of the hole is less than 0.01 mm, air may not be sufficiently removed, and if it exceeds 100 mm, the heat dissipation effect tends to decrease.

  In addition, when peeling a surface covering material layer and replacing | exchanging to a new surface covering material layer, a two-layered thin plate will come together through a peeling surface. Naturally, it is possible to provide holes in these thin plates, but in this case, it is preferable to control the diameter of the holes as follows. In other words, while effectively removing air, in order to prevent the thin plate closest to the peeled surface on the surface material layer side to be peeled and the remaining peeled surface on the substrate side from being integrated, making it difficult to update the surface material layer Of the peeled thin plates, the diameter of the hole of the thin plate closest to the peeling surface is preferably 0.1 to 2 mm. Further, the ratio of the total area of the holes to the area of the thin plate is usually 5 to 50%, preferably 10 to 30%. If this ratio is too low, the air may not be sufficiently extracted. If it is too high, the strength of the thin plate is impaired.

There is no restriction | limiting in particular in the shape (plan view shape) of a hole, For example, although a polygon, a circle, etc. are mentioned, Preferably it is circles, such as a circle | round | yen and an ellipse, from the surface of workability | operativity. In the case of a shape other than a circle, it is preferable that the diameter of a circle having the same area as the hole is in the above range.
The arrangement of the holes may be either random or regular, but it is preferably provided regularly for industrial production.

  Examples of the method for forming a hole in the thin plate include a press or a method in which a needle capable of forming a predetermined hole is provided in a roller and the thin plate is passed over the roller. When the holes are formed in a random arrangement, the needles may be arranged in a random arrangement.

  The formation pitch of holes (the distance between the centers of adjacent holes) is preferably not more than the distance between the pipes embedded in the substrate, usually 5 mm or more, preferably 20 mm or more, usually 200 mm or less, Preferably it is 70 mm or less.

In this reference example , if the thin plate is a perforated thin plate in which all holes are formed, the function of heat-transferring the heat of the pipe 13 to the surface material layer 16 depending on how the holes of the laminated thin plates overlap each other May be lost. Therefore, it is preferable that at least one of the laminated thin plates is a non-hole thin plate having no holes, and the non-hole thin plate and the perforated thin plate are alternately laminated. By doing in this way, the residual bubbles of the material layer for adhesion between the non-perforated thin plate and the perforated thin plate are efficiently extracted from the holes of the perforated thin plate, and the effect of preventing noise, unevenness and heat transfer performance deterioration is prevented. Can be obtained. In this reference example , as in the first reference example , instead of providing the holes, the air remaining between the thin plates can also be obtained by providing the adhering material in the form of dots or lines (stripes). Can be prevented. In this case, the attachment material may be provided in the same manner as in Reference Example 1.

<Resin coating layer>
The resin coating layer 18 is provided to facilitate the peeling of the thin plate 14A and the thin plate 21B and to facilitate the renewal of the floor heating panel.

  Examples of the resin that forms the resin coating layer 18 include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polycarbonate, polyethylene, and polypropylene, and polyamide resins such as polyamide 6 and polyamide 6/6. Can be mentioned. Among these, polyethylene terephthalate is preferable from the viewpoints of strength, ease of layer formation, cost, and the like. If the thickness of the resin coating layer 18 is too thin, the effect of improving the peelability due to the provision of the resin coating layer cannot be sufficiently obtained. If the thickness is too thick, the thickness of the floor heating panel is the same as when the thin plate is thick. Since the problem of increase, cost increase, and decrease in heat transfer efficiency occurs, it is usually 3 μm or more, preferably 10 μm or more, and is usually 300 μm or less, preferably 50 μm or less.

  The lowermost layer thin plate 14J is made of a thin plate 14A by a method of directly heat-sealing a heat-melted resin to a thin plate, a method of bonding through an adhesive material as necessary, a method of bonding a coating film through an adhesive, or the like. It can be manufactured by laminating a coating material on the substrate.

<Outer material layer>
There is no restriction | limiting in particular as a surface material layer. For example, it may be the same as the first reference example . Specifically, it is preferable to include a cushion material layer on the thin plate side and a floor surface material layer laminated thereon. However, the cushion material layer is not necessarily required, and only the floor surface material layer may be used. Although FIG. 5 shows the side which comprised the surface material layer 16 only by the floor surface material layer without providing a cushion material layer, you may provide a cushion material layer further.

  The cushion material layer includes, for example, a foamed resin such as polyurethane foam or polyolefin-based foam, or a nonwoven fabric from the viewpoint of obtaining an excellent walking sensation on the floor surface material layer.

  The thickness of the cushioning material layer varies depending on the material and the floor heating panel construction target, but it does not make the floor heating panel excessively thick and does not impair the heat transfer efficiency from the piping. Is usually 1 mm or more, preferably 2 mm or more, and usually 6 mm or less, preferably 5 mm or less.

  The floor surface material layer is intended to protect the substrate in which the pipe is embedded and to enhance the design and durability of the floor surface appearance. Usually, it is made of wood such as plywood or foam rubber, preferably wood. A plastic film, a nonwoven fabric, a reinforced paper, etc., preferably a natural timber board or a reinforced paper, is usually attached to the surface thereof.

  If the thickness of the floor surface material layer is too thin, the strength will be insufficient and it will be easily damaged, and if it is too thick, the heat transfer efficiency from the piping will decrease and the thickness of the floor heating panel will increase. It is preferable to be in the range.

  In addition, you may give resin coating etc. further on such a floor surface material layer.

<Adhesive material>
The adhesion material may be the same as that in the first reference example . A specific example will be described below.
The adhering materials 19A, 20, 22, and 24 may be any material that sufficiently satisfies the mutual relationship of the adhesive force described later and that does not erode the components of the floor heating panel in contact therewith. Various adhesives, pressure-sensitive adhesives, and double-sided tapes can be used. The adhesion of each member by these adhering materials is preferably a full adhesion, but may be a partial adhesion that adheres 3% or more of the area. In the case of partial bonding, the shape of the bonding portion may be either linear or dotted, but especially when bonding a thin plate such as a metal foil to another thin plate, the substrate, the cushion material layer, etc. In addition, it is preferable that at least the entire periphery is an adhesive portion.

<Adhesive strength>
In the panel of this reference example , at least two overlapping thin plates (in FIG. 5, the lowermost layer thin plate 14J and the thin plate 21) among the thin plates stacked in a plurality of layers can be peeled off. Preferably, the adhesive force between the thin plate in contact with the substrate (the lowermost layer thin plate) and the substrate is larger than the adhesive force between the thin plate (next layer thin plate) laminated adjacent to the lowermost layer thin plate and the lowermost layer thin plate. When renewing the surface material layer, when peeling from the surface material layer that is the upper layer of the floor heating panel in order, it is easy between the next layer thin plate and the bottom layer thin plate laminated adjacent to the bottom layer thin plate The lower layer thin plate is left on the substrate side, a new thin plate layer is laminated on the lower layer thin plate, and the surface material layer is laminated thereon, so that the surface material layer is not damaged. Update.

  The correlation between the adhesive forces will be described with reference to FIG. The lowermost thin plate in contact with the bases 11 and 11A, that is, the lowermost thin plate 14J and the base 11 and 11A have an adhesive force between the next thin layer 21 and the lowermost thin plate 14J laminated adjacent to the lowermost thin plate 14J. It is preferable to set it to 110% or more. Here, there are no particular restrictions on the evaluation criteria for the adhesive strength, but it is measured by, for example, a 180-degree peeling adhesion test (hereinafter referred to as “JIS Z 0237 method”) defined in JIS Z 0237. .

For example, when the adhesive force between the lowermost layer thin plate (lowermost layer thin plate 14J) and the next layer thin plate (thin plate 21) laminated thereon is 100%, the substrate and the lowermost layer thin plate (substrates 11, 11A and the lowermost layer thin plate) 14J) is 110% or more, and specifically, it is preferable that the adhesive strength according to JIS Z 0237 method is as follows.
(a) Adhesive force between the substrate and the lowermost layer thin plate (bases 11 and 11A and the lowermost layer thin plate 14J): usually 3 to 30 N, preferably 5 to 20 N
(b) Adhesive force between the lowermost layer thin plate (lowermost layer thin plate 14J) and the next layer thin plate (thin plate 21) laminated thereon: usually 1 to 27N, preferably 2 to 18N

  In addition, the adhesive force between the uppermost layer thin plate 23 and the surface covering material layer 16 may be a level that can obtain a strength necessary to withstand normal daily life use.

  Therefore, it is preferable that the members are bonded with the adhering material so as to satisfy the mutual relationship of the above-described adhesive force.

  In order to satisfy such an interrelationship of adhesive strength, where the adhesive force is increased, for example, an acrylic adhesive that increases the coating amount or a urethane adhesive is used, and the adhesive force is decreased. For example, it is preferable to adjust the adhesive force by using, for example, an acrylic pressure-sensitive adhesive with a small coating amount. The adhesive force can also be adjusted by the adhesive area. In this case, a portion having a large adhesive force may be adhered to the entire surface and a portion having a small adhesive force may be partially adhered. In addition, the adhesive force in the case of partial adhesion can be calculated by S × Ms ÷ M from the adhesive force S per unit area of the adhesive portion, the total area M, and the adhesive portion area Ms.

However, in this reference example , the surface material layer is composed of a cushion material layer and a floor surface material layer, and between the base and the lowermost layer thin plate, and between the lowermost layer thin plate and the next lower layer thin plate, In the floor heating panel that is bonded to the entire surface, the effect of the present reference example by providing a plurality of thin plates can be effectively exhibited, which is preferable.

[4] implementation Embodiment FIG. 6 (a), the coupling body 50 provided with an adhesive layer 51 on one side of one thin plate 52 and the attachment material 20 and 22 in FIG. 5, a stack of the thin plate 21, 23 FIG. 6B is an enlarged view of a portion B in FIG. 6A, FIG. 6C is a cross-sectional view showing the layer structure of the combined body 50, and FIG. 6 is a cross-sectional view showing the configuration of the pre-combined body 50 ′ in FIG. 6, and FIGS. FIG. 12 is a cross-sectional view showing a fixing structure of a surface material layer.

  As shown in FIG. 6B, the lowermost layer thin plate 14J is laminated on the base parallel body in which a plurality of base bodies (temperature control base bodies) 11 and a base body (flat plate base body) 11A are arranged in parallel via an adhesion material 19A. ing. As in FIG. 5, the lowermost layer thin plate 14 </ b> J includes a thin plate 14 </ b> A and a resin coating layer 18.

  The thin plate 52 of the combined body 50 has a slightly larger width than the base (flat base) 11A, like the thin plates 21 and 23 of FIG. The thin plate 52 is provided with a display 54 near the center in the width direction of the substrate (flat substrate) 11A. This display 54 is the same as the display 32 in FIG. That is, the thin plate 52 of the combined body 50 becomes the upper thin plate. The thin plate 14A is a thin plate (lower thin plate) below the upper thin plate.

  The surface covering material layer 16 is attached to the lowermost layer thin plate 14J through the adhesive layers 51 and 53 of the bonded body 50. The lower adhesive layer 51 of the bonded body 50 has a lower adhesive force than the upper adhesive layer 53 and the adhesive material 19A. A specific method for determining the adhesive force will be described later.

  In this embodiment, a sheet-like pre-combined body 50 ′ is disposed between the thin plate 14 A (lower thin plate) and the outer covering material layer 16 adjacent to the combined body 50 (upper thin plate: thin plate 52). Yes. The pre-combined body 50 ′ is used to adhere the surface material layer 16 to the lower thin plate when the surface material layer 16 is updated in the future.

  As shown in FIG. 7 (a), the pre-combined body 50 ′ includes a thin plate (thin plate-like main body) 52 that is substantially equal in width to the combined body 50, and adhesive layers 51 and 53 provided on the thin plate 52. Release papers 55 and 56 that conceal the adhesive layers 51 and 53 are integrated. The thickness of the release paper 55 and 56 is preferably about 2 to 100 μm. In FIG. 7A, the pressure-sensitive adhesive layers 51 and 53 and the release papers 55 and 56 for concealing the pressure-sensitive adhesive layers 51 and 53 are integrated on both surfaces of the thin plate 52, but from the viewpoint of cost and workability. The adhesive layer 53 and the release paper 55 may not be provided.

  The pre-combined body 50 ′ is folded in two so that one side edge portion 50 a is folded on the remaining portion, and a fold line 50 b is arranged along the combined body 50 on the side of the combined body 50. In this embodiment, the pressure-sensitive adhesive layer 51 of the one side edge portion 50a is exposed without being covered with the release paper, and the pressure-sensitive adhesive layer 51 of the exposed portion is exposed on the lower thin plate (thin plate 14A) side. It adheres to the lower layer thin plate 14J. That is, the boundary between the pressure-sensitive adhesive layer not covered with the release paper of the pre-bonded body 50 ′ and the pressure-sensitive adhesive layer covered with the release paper is taken as a fold line so that the release paper is positioned on the surface layer layer side. In addition, the pre-combined body is folded along the folding line, and the folding line extends along the upper thin plate.

  FIG. 12 shows in detail an example of the attachment state of the surface covering material layer 16 in FIG. 6B. The outer edge of the surface covering material layer 16 is located on the upper side of the flat plate base 11A, and a real part 16a projects from the end edge. The real part 16a is fastened to the flat plate base 11A by a nail 70 or the like. . When updating the surface covering material layer 16, the nail 70 and the like are pulled out, a new surface covering material layer 16 is disposed, and nailing is performed again. When arranging the surface covering material layer 16, the display 54 is used as a mark.

  In updating the cover material layer 16, the cover material layer 16 is first peeled off. At this time, the pressure-sensitive adhesive layer 51 having a low adhesive strength is peeled off, and the bonded body 50 is peeled off from the lowermost layer thin plate 14J while adhering to the surface covering material layer 16 as shown in FIG. As shown in FIG. 7A, since the release sheet 56 is interposed between the bonded body 50 'and the surface covering material layer 16, it does not adhere to the surface covering material layer 16, but remains attached to the thin plate 14J.

  Next, the release paper 56 is peeled off from the pre-combined body 50 ′, and the pre-combined body 50 ′ is inverted by 180 ° about the fold line 50b as shown in FIGS. 9A and 9B. 50 'is overlaid on the lowermost sheet 14J. At this time, the pre-combined body 50 'comes to the upper side of the flat substrate 11A. Therefore, the release paper 55 of the pre-combined body 50 'is peeled off, and a new cover material layer 16' is attached in an overlapping manner as shown in FIGS. 7 (b) and 9 (c). In FIG. 7A, when the pre-bonded body 50 ′ is not provided with the pressure-sensitive adhesive layer 53 and the release paper 55, an adhesive is applied to a width substantially equal to the display 54, and the adhesive and A new surface covering material layer 16 ′ is stacked and attached using the nail in parallel.

  6 to 9, when the surface covering material layer 16 is updated, the preliminary combined body 50 ′ disposed below the existing surface covering material layer 16 is inverted by 180 ° and used as a combined body. Therefore, it is not necessary to prepare a new combined body 50, and it is not necessary to accurately position and attach the new combined body.

  In FIGS. 6 to 9, since one preliminary combined body 50 ′ is arranged adjacent to the combined body 50, it is suitable when the surface covering material layer 16 is updated only once.

  In FIG. 10 (a), preliminary combined bodies 50 ′ and 50 ″ are arranged on both sides of the combined body 50 (upper thin plate: thin plate 52) so that the surface material layer can be updated up to two times without a new combined body 50. FIG. 10B is an enlarged view of a portion B in FIG. 10A, and FIG. 11 is a cross-sectional view showing a method of using the pre-combined body 50 ″.

  This pre-combined body 50 ″ has the same configuration as that of the pre-combined body 50 ′, and is arranged symmetrically with respect to the combined body 50 as shown in FIG. 10B.

  In the first renewal of the outer covering material layer, one pre-combined body 50 'is used in the same manner as in FIGS. FIG. 11A is a cross-sectional view after the first renewal of the outer covering material layer, and the outer covering material layer 16 is attached to the lowermost layer thin plate 14J via the preliminary joined body 50 '.

  At the time of the second surface material layer update, the surface material layer 16 ′ is peeled off in the state of FIG. Then, the first pre-combined body 50 ′ is removed while adhering to the cover material layer 16 ′, and only the second pre-combined body 50 ″ remains. Therefore, the release paper 56 is peeled off from the pre-combined body 50 ″. 11B, the pre-combined body 50 ″ is inverted 180 ° with the fold line as the center of rotation as shown in FIG. 11B, and is disposed above the base 11A. Here, the release paper 55 is peeled off, and then a new one is formed. When the surface material layer (not shown) is fixed using the adhesive layer 53 of the adhering material, the updated structure is the same as in FIGS. 7B and 9C.

  Details of each member constituting the panels of FIGS. 6 to 12 will be described below.

<Substrate>
Although the material of the base | substrates 11 and 11A is not specifically limited, Usually, the thing made from the foaming synthetic resin which was rich in heat insulation is preferable, and the plate-like body made from a foaming synthetic resin, specifically, a polyurethane foam, a polyethylene foam, Examples include polypropylene foam, polystyrene foam, polyvinyl chloride foam, polymethyl methacrylate foam, polycarbonate foam, polyphenylene oxide foam, foam of polystyrene and polyethylene mixture, and the like. Among these, polyethylene foam, polypropylene foam, polystyrene foam and the like are preferable. The thickness of these plate-like bodies constituting the base 11, 11A is usually preferably selected within a range of 9 to 50 mm.

  In particular, the flat substrate 11A for forming the fixed region of the cover material layer 16 preferably has sufficient strength to support the overload including the cover material layer 16, such as cedar, cherry, cypress, It is composed of wood such as lauan and plywood, and a resin molded body. The dimensions are usually about 300 to 4000 mm, the thickness is usually about 9 to 50 mm, and the width is usually about 20 to 100 mm. The

  6 to 12, the arrangement pitch between the flat substrate 11 </ b> A and the temperature adjusting substrate 11 is not particularly limited, but if the width of the flat substrate 11 </ b> A is too large with respect to the width of the temperature adjusting pitch 11, the temperature of the entire panel is increased. If the width of the flat substrate 11A is too small with respect to the width of the temperature adjustment substrate 11, the adjustment area is poor and the fixing region of the cover material layer 16 cannot be secured sufficiently. Therefore, it is preferable that the ratio of the width of the flat substrate 11A is about 0.1 to 0.2 with respect to the total width of the temperature control substrate 11 and the flat substrate 11A.

<groove>
On one plate surface of the base body (temperature control base body) 11, a plurality of grooves 12 for arranging the pipes 13 are formed along the side of the base body 11.

  The width of the opening of the groove 12 is preferably the same as the outer diameter of the pipe 13 or slightly larger than this. The groove 12 is formed so that the cross-sectional shape perpendicular to the extending direction is U-shaped or U-shaped. In particular, the heat transfer from the pipe 13 to the floor surface, and the pipe 13 is embedded in the groove 12. From the viewpoint of workability at the time, it is preferable to have a U-shaped cross section.

  The depth of the groove 12 is preferably approximately the same as the outer diameter of the pipe 13. If the depth of the groove 12 is larger than the outer diameter of the pipe 13, when the pipe is embedded, a gap is formed on the upper side of the pipe 13, and the heat of the heating medium cannot be effectively transferred to the floor surface side. , Heat transfer efficiency tends to decrease.

<Piping>
As the pipe 13, a flexible tube is usually used, and specifically, a resin pipe such as a crosslinked polyethylene pipe or a polybutene pipe, or a metal pipe such as a copper pipe or a steel pipe may be used. Among these, metal pipes have higher thermal conductivity than resin pipes, but they are heavy, have problems such as workability and rusting, and increase costs, so they are used appropriately depending on the application of the cooling heat panel. Is done.

  The cross section of the pipe (the cross section in the direction perpendicular to the length direction) is not particularly limited, and is generally circular as shown in FIGS. In addition, the contact area between the pipe and the thin plate can be increased, and the cooling heat efficiency to the surface side can be further increased. However, in this case, the shape of the groove provided in the base is appropriately designed following the shape of the pipe.

  The dimensions of the pipe 13 can be changed depending on the floor heating panel construction target and the type and temperature of the heat medium to be circulated, but generally the outer diameter is about 6 mm to 13 mm and the inner diameter is about 4 mm to 10 mm. The wall thickness is about 0.8 mm or more and 2.0 mm or less.

<Heat medium>
Examples of the heat medium (warm medium) passed through the pipe 13 include warm water, water vapor, heated oil, or an antifreeze liquid such as an ethylene glycol aqueous solution or a propylene glycol aqueous solution, preferably hot water.
On the other hand, cold water is usually used as the cooling medium.

<Thin plate>
It is preferable that the thin plates 14A and 52 have a function of fixing the pipe 13 and also soaking the heat of the pipe 13 to the surface material layer 16 to transfer the heat. In the present invention, the thin plates (fourth embodiment) are provided. In the embodiment, at least one of the thin plates 14A, 52), preferably the thin plate 14A is preferably a metal foil as a heat diffusion thin plate. Examples of the metal foil include aluminum foil, tin foil, stainless steel foil, and copper foil. Among these, aluminum foil is preferable from the viewpoints of manufacturing difficulty and cost. If the thickness of the metal foil is too thin, the strength will not be sufficient, and if it is too thick, the product will not only become heavy, but the cost will increase, so the thickness of the thin plate per sheet is usually selected in the range of 10 μm to 2 mm. Is preferred. Examples of the thin plate other than the metal foil include a resin film, a resin sheet, a carbon fiber sheet, or a laminate of at least two of these, and the thickness is usually 10 μm to 2 mm.

  In the present invention, such a thin plate is used by laminating two or more layers. There are no particular restrictions on the number of laminates, as long as the number of laminates is two or more. However, if the number of laminates is excessively large, the labor and cost of construction will increase, and the thickness of the floor heating panel will increase. As the distance between the floor and the floor surface increases, the heat transfer efficiency decreases. Therefore, the number of laminated thin plates is usually 2 to 5 layers, particularly preferably 2 layers, and the total thickness of the laminated thin plates is usually 10 μm or more, preferably 40 μm or more, Usually, it is 2 mm or less, preferably 200 μm or less.

As in the first reference example , among the plurality of laminated thin plates, at least one thin plate may be provided with a plurality of holes penetrating in the thickness direction. Such a thin plate is called a perforated thin plate. The purpose of providing a hole in the thin plate is to prevent noise, unevenness, and deterioration in heat transfer performance due to remaining bubbles by removing air remaining in the layer of the adhering material.

  The diameter of the hole is usually 0.01 mm or more, preferably 0.1 mm or more, and is usually 100 mm or less, preferably 50 mm or less. If the diameter of the hole is less than 0.01 mm, air may not be sufficiently removed, and if it exceeds 100 mm, the heat dissipation effect tends to decrease.

  In addition, when peeling a surface covering material layer and replacing | exchanging to a new surface covering material layer, a two-layered thin plate will come together through a peeling surface. Naturally, it is possible to provide holes in these thin plates, but in this case, it is preferable to control the diameter of the holes as follows. In other words, while effectively removing air, in order to prevent the thin plate closest to the peeled surface on the surface material layer side to be peeled and the remaining peeled surface on the substrate side from being integrated, making it difficult to update the surface material layer Of the peeled thin plates, the diameter of the hole of the thin plate closest to the peeling surface is preferably 0.1 to 2 mm. Further, the ratio of the total area of the holes to the area of the thin plate is usually 5 to 50%, preferably 10 to 30%. If this ratio is too low, the air may not be sufficiently extracted. If it is too high, the strength of the thin plate is impaired.

There is no restriction | limiting in particular in the shape (plan view shape) of a hole, For example, although a polygon, a circle, etc. are mentioned, Preferably it is circles, such as a circle | round | yen and an ellipse, from the surface of workability | operativity. In the case of a shape other than a circle, it is preferable that the diameter of a circle having the same area as the hole is in the above range.
The arrangement of the holes may be either random or regular, but it is preferably provided regularly for industrial production.

  Examples of the method for forming a hole in the thin plate include a press or a method in which a needle capable of forming a predetermined hole is provided in a roller and the thin plate is passed over the roller. When the holes are formed in a random arrangement, the needles may be arranged in a random arrangement.

  The formation pitch of holes (the distance between the centers of adjacent holes) is preferably not more than the distance between the pipes embedded in the substrate, usually 5 mm or more, preferably 20 mm or more, usually 20 mm or less, Preferably it is 70 mm or less.

In the present invention, if the thin plate is a perforated thin plate in which all holes are formed, depending on how the holes of the laminated thin plates overlap each other, the heat of the pipe 13 is soaked to the surface material layer 16 to transfer heat. You may not have it. Therefore, it is preferable that at least one of the laminated thin plates is a non-hole thin plate having no holes, and the non-hole thin plate and the perforated thin plate are alternately laminated. By doing in this way, the residual bubbles of the material layer for adhesion between the non-perforated thin plate and the perforated thin plate are efficiently extracted from the hole of the perforated thin plate, and the effect of preventing noise, unevenness, and heat transfer performance deterioration Can be obtained. For example, in the panels of FIGS. 6 to 9, it is preferable that the thin plate 52 be a perforated thin plate.
Note that, instead of providing the holes, the adhering material may be provided in the form of dots or lines.

<Resin coating layer>
The resin coating layer 18 is provided in order to facilitate the peeling of the thin plate 14A and the thin plate 52 and to facilitate the renewal of the floor heating panel.

  Examples of the resin that forms the resin coating layer 18 include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polycarbonate, polyethylene, and polypropylene, and polyamide resins such as polyamide 6 and polyamide 6/6. Can be mentioned. Among these, polyethylene terephthalate is preferable from the viewpoints of strength, ease of layer formation, cost, and the like. If the thickness of the resin coating layer 18 is too thin, the effect of improving the peelability due to the provision of the resin coating layer cannot be sufficiently obtained. If the thickness is too thick, the thickness of the floor heating panel is the same as when the thin plate is thick. Since problems such as an increase, an increase in cost, and a decrease in heat transfer efficiency occur, it is preferably set in a range of 3 μm to 300 μm, particularly 10 μm to 50 μm.

  The lowermost layer thin plate 14J is made of a thin plate 14A by a method of directly heat-sealing a heat-melted resin to a thin plate, a method of bonding through an adhesive material as necessary, a method of bonding a coating film through an adhesive, or the like. It can be manufactured by laminating a coating material on the substrate.

<Outer material layer>
There is no restriction | limiting in particular as a surface material layer. For example, it may be the same as the first reference example . Specifically, it is preferable to include a cushion material layer on the thin plate side and a floor surface material layer laminated thereon. However, the cushion material layer is not necessarily required, and only the floor surface material layer may be used. 6-12 shows the side which comprised the surface covering material layer 16 only by the floor surface material layer, without providing a cushioning material layer, You may provide a cushioning material layer further.

  The cushion material layer includes, for example, a foamed resin such as polyurethane foam or polyolefin-based foam, or a nonwoven fabric from the viewpoint of obtaining an excellent walking sensation on the floor surface material layer.

  The thickness of the cushioning material layer varies depending on the material and the floor heating panel construction target, but it does not make the floor heating panel excessively thick and does not impair the heat transfer efficiency from the piping. Is usually 1 mm or more, preferably 2 mm or more, and usually 6 mm or less, preferably 5 mm or less.

  The floor surface material layer is intended to protect the substrate in which the pipe is embedded and to enhance the design and durability of the floor surface appearance. Usually, it is made of wood such as plywood or foam rubber, preferably wood. A plastic film, a nonwoven fabric, a reinforced paper, etc., preferably a natural timber board or a reinforced paper, is usually attached to the surface thereof.

  If the thickness of the floor surface material layer is too thin, the strength will be insufficient and it will be easily damaged, and if it is too thick, the heat transfer efficiency from the piping will decrease and the thickness of the floor heating panel will increase. It is preferable to be in the range.

  In addition, you may give resin coating etc. further on such a floor surface material layer.

<Adhesive material>
The adhesion material may be the same as that in the first reference example . A specific example will be described below.
The adhering material 19A and the adhering materials for the pressure-sensitive adhesive layers 51 and 53 sufficiently satisfy the mutual relationship of the adhesive force described later, and do not erode the constituent members of the floor heating panel in contact therewith. Any adhesives, adhesives, and double-sided tapes can be used. The adhesion of each member by these adhering materials is preferably a full adhesion, but may be a partial adhesion that adheres 3% or more of the area. In the case of partial bonding, the shape of the bonding portion may be either linear or dotted, but especially when bonding a thin plate such as a metal foil to another thin plate, the substrate, the cushion material layer, etc. In addition, it is preferable that at least the entire periphery is an adhesive portion.

<Adhesive strength>
In the panel of the present invention, among the thin plates laminated in a plurality of layers, at least two overlapping thin plates (in FIGS. 6 to 12, the lowermost layer thin plate 14 </ b> J and the thin plate 52) can be separated from each other. Preferably, the adhesive force between the thin plate in contact with the substrate (the lowermost layer thin plate) and the substrate is larger than the adhesive force between the thin plate (next layer thin plate) laminated adjacent to the lowermost layer thin plate and the lowermost layer thin plate. When renewing the surface material layer, when peeling from the surface material layer that is the upper layer of the floor heating panel in order, it is easy between the next layer thin plate and the bottom layer thin plate laminated adjacent to the bottom layer thin plate The lower layer thin plate is left on the substrate side, a new thin plate layer is laminated on the lower layer thin plate, and the surface material layer is laminated thereon, so that the surface material layer is not damaged. Update.

The correlation between the adhesive forces will be described with reference to FIGS. The adhesion between the lowermost layer thin plate 14J in contact with the bases 11 and 11A, that is, the lowermost layer thin plate 14J and the bases 11 and 11A is the adhesion between the next layer thin plate 52 and the lowermost layer thin plate 14J laminated adjacent to the lowermost layer thin plate 14J. It is preferable to set it to 110% or more. Here, the evaluation criteria for the adhesive strength are not particularly limited. For example, a 180 degree peeling adhesion test (hereinafter referred to as “JIS Z 0237” defined in JIS Z 0237).
Method 0237 ”. ).

For example, when the adhesive strength between the lowermost layer thin plate (lowermost layer thin plate 14J) and the next layer thin plate (thin plate 52) laminated thereon is 100%, the substrate and the lowermost layer thin plate (substrates 11, 11A and the lowermost layer thin plate) 14J) is 110% or more, and specifically, it is preferable that the adhesive strength according to JIS Z 0237 method is as follows.
(a) Adhesive force between the substrate and the lowermost layer thin plate (bases 11 and 11A and the lowermost layer thin plate 14J): usually 3 to 30 N, preferably 5 to 20 N
(b) Adhesive force between the lowermost layer thin plate (lowermost layer thin plate 14J) and the next layer thin plate (thin plate 52) laminated thereon: usually 1 to 27N, preferably 2 to 18N

  Note that the adhesive force between the thin plate 52, which is also the uppermost thin plate, and the cover material layer 16 may be such that the strength necessary to withstand the use in normal daily life is obtained.

  Therefore, it is preferable that the members are bonded with the adhering material so as to satisfy the mutual relationship of the above-described adhesive force.

  In order to satisfy such an interrelationship of adhesive strength, where the adhesive force is increased, for example, an acrylic adhesive that increases the coating amount or a urethane adhesive is used, and the adhesive force is decreased. For example, it is preferable to adjust the adhesive force by using, for example, an acrylic pressure-sensitive adhesive with a small coating amount. The adhesive force can also be adjusted by the adhesive area. In this case, a portion having a large adhesive force may be adhered to the entire surface and a portion having a small adhesive force may be partially adhered. In addition, the adhesive force in the case of partial adhesion can be calculated by S × Ms ÷ M from the adhesive force S per unit area of the adhesive portion, the total area M, and the adhesive portion area Ms.

  However, in the present invention, the surface material layer is composed of a cushion material layer and a floor surface material layer, and between the base and the lowermost layer thin plate, and between the lowermost layer thin plate and the next lower layer thin plate, respectively. In the floor heating panel bonded to the entire surface, the effect of the present invention can be effectively exhibited by providing a plurality of thin plates, which is preferable.

[5] Panel construction structure The panel of the present invention is preferably constructed on a floor, wall or ceiling.
The panel of this invention can comprise various construction structures combining the above-mentioned temperature control base | substrate 11 and the flat substrate 11A. Specifically, the panel is composed of a panel located in the central region and a panel located in the outer periphery, and at least a part of the substrate of the panel located in the central region is a temperature control substrate, The panel substrate is preferably a flat substrate. Such a specific example will be described below.

For example, as shown in FIG. 13A, the temperature control substrate 11 and the flat substrate 11A are alternately arranged in parallel to form a central region of the chamber, and the flat substrate 11A is arranged in the outer peripheral region. it can.
Further, as shown in FIG. 13B, it is also possible to form a central region of the chamber only by the temperature control substrate 11 and arrange the flat plate substrate 11B in the outer peripheral region.

  In the form shown in FIG. 13 (b), the material of the flat plate base 11B is preferably the same as that of the flat plate base 11A, the length is usually about 500 to 1000 mm, and the thickness is usually about 9 to 50 mm. The width is usually about 1500 to 2500 mm. At the corner of the chamber, the flat plate base 11B is cut and used in accordance with the area of the corner.

In any case, a uniform construction surface without a step can be formed by arranging the thickness of the base and arranging the thin plate and the covering material layer thereon .

Ru theory Aquiraz by way of experimental examples and comparative examples below.

Experimental Example 1 (experimental example of the first reference example)
The floor heating panel shown in FIG. 1 was formed. What was used as a structural member of a floor heating panel is as follows.
Substrate 11: 12 mm-thick polystyrene foam plate-like body in which the following groove 12 is formed
Groove shape: U-shaped cross section
Groove opening width: 8mm
Groove depth: 7.2 mm
Pipe 13: Cross-linked polyethylene pipe having outer diameter of 7.2 mm and inner diameter of 5 mm Lowermost layer thin plate 14J: Coating of polyethylene terephthalate having a thickness of 25 μm
40 μm thick aluminum foil by heat-sealing the layers
Thin plate 14B: 40 μm thick aluminum foil Cushion material layer 16A: 4 mm thick polyester nonwoven fabric Floor surface material layer 16B: 9 mm thick plywood flooring

Further, the adhesion material used for adhesion between each member and the adhesion force measured by the JIS Z 0237 method are as follows.
Adhesive material 19A: An acrylic adhesive is used between the substrate 11 and the lowermost thin plate 14J.
The whole surface was adhered. Adhesive strength: 15N
Adhesive material 19B: Acrylic adhesive material between the lowermost sheet 14J and the sheet 14B
More fully bonded. Adhesive strength: 10N
Adhesive material 19C: Between the thin plate 14B and the cushion material layer 16A, a urethane adhesive is used.
More fully bonded. Adhesive strength: 4N (However, breakage of cushion layer material
Strength), actual adhesive strength: 50N or more Adhesive material 19D: urethane-based contact between cushion material layer 16A and floor surface material layer 16B
The entire surface was adhered by the dressing. Adhesive strength: 4N (however, cushion layer material
Strength due to material breakage), actual adhesive strength: 50 N or more (adhesive strength 4N of the above-mentioned adhesion materials 19C, 19D is the adhesive strength of urethane adhesive actually measured by JIS Z 0237 method, Cushion material layer breaks. Actual bond strength of 50 N or more is an expected value measured by JIS Z 0237 method and assuming that the cushion material layer does not break.)

  The floor heating panel was bonded to the floor of the floor with a urethane adhesive at a pitch of 150 mm and a width of 30 mm.

  About this floor heating panel, when renewal work was performed in the procedure of the above-mentioned (1)-(4) in order to renew a covering material layer, the upper layer part was peeled off cleanly between thin board 14B and the lowest layer thin board 14J. After that, the thin plate, the cushioning material layer, and the floor surface material layer could be sequentially applied with good workability.

Comparative Example 1
In Experimental Example 1, a floor heating panel was formed in the same manner except that the thin plate 14B was not provided and the cushion material layer 16 was directly bonded to the lowermost layer thin plate 14J. The cushion material layer 16 and the lowermost layer thin plate 14J were bonded with a urethane adhesive, and the adhesive force was 50N.

  As a result, when the cover material layer is peeled off at the time of renewal, it is peeled off between the panel base and the resin-coated thin plate, and part of the foam resin on the base bonded to the resin-coated thin plate is also peeled off together with the resin-coated thin plate. In addition, the piping jumped out and was damaged.

It is a sectional view showing a reference example of panel. FIG. 1b is an enlarged view of FIG. 1a. It is a construction procedure figure of a panel. It is a peeling procedure figure of a surface covering material layer. It is sectional drawing of the panel which concerns on another reference example . It is sectional drawing which shows embodiment of the update method of the panel covering material layer of this reference example . It is sectional drawing which shows the conventional floor heating panel. (A) figure is a sectional view showing another reference example of the panel of the present reference example, (b) Figure is an enlarged view of (a) view. It is sectional drawing which shows another reference example . It is a cross-sectional view showing the form of implementation. FIG. 7 is a cross-sectional view showing a configuration of a pre-combined body 50 ′ in the embodiment of FIG. 6. It is sectional drawing which shows the surface covering material layer update method in embodiment of FIG. It is sectional drawing which shows the surface covering material layer update method in embodiment of FIG. It is sectional drawing which shows different embodiment. It is sectional drawing which shows the surface covering material layer update method in embodiment of FIG. It is sectional drawing which shows the fixing structure of a surface material layer. It is a top view of the chamber which shows the arrangement | sequence condition of a base | substrate.

11 Temperature control substrate 11A, 11B Flat substrate 12 Groove 13 Piping 14, 14A, 14B, 14B 'Thin plate 14J Resin coated thin plate 16 Surface covering material layer 16A, 16A' Cushion material layer 16B, 16B 'Floor surface material layer 18 Resin coating layer 19A , 19B, 19B ', 19C, 19C', 19D, 19D 'Adhesive material 50 Combined body 50', 50 "Pre-bonded body 80 Non-adhesive part

Claims (16)

In a panel having a plate-like substrate, a thin plate laminated on one plate surface of the substrate, and a surface material layer laminated on a surface of the thin plate opposite to the substrate,
A plurality of the thin plates are laminated, and at least two overlapping thin plates can be peeled from each other ,
A thin plate (hereinafter, referred to as “lower thin plate”) that is adjacent to the side of the thin plate (hereinafter referred to as “upper thin plate”) that includes at least the uppermost thin plate and that is lower than the upper thin plate. And a sheet-like pre-bonded body used for adhering the cover material layer to the lower thin plate at the time of renewal of the cover material layer in the future. A panel. Oite to claim 1, wherein the substrate constitutes a substrate parallel body with a plurality arranged in parallel,
A panel, wherein at least one of the thin plates laminated in a plurality of layers is laminated on the parallel substrate so as to traverse each parallel substrate. In claim 2 , a part of the base body is a temperature control base body in which a groove is provided on the one plate surface, and a heat medium circulation pipe is disposed in the groove.
The other one of the substrates is a flat substrate that does not include the groove and the heat medium distribution pipe.
A panel characterized in that the temperature control substrate and the flat substrate are alternately arranged. According to claim 3, wherein the upper thin plate, the plate base body and has a slightly larger width such width or more even substantially, the panel being characterized in that disposed above the flat plate substrate. 5. The pre-bonded body according to claim 1 , wherein the pre-combined body includes a thin plate-like main body portion having substantially the same width as the upper thin plate, and an adhesive provided on at least one surface of the thin plate-like main body portion. A panel comprising a layer and a release paper for concealing the pressure-sensitive adhesive layer. In claim 5 , a part of the adhesive layer of the pre-bonded body is not covered with the release paper,
The panel according to claim 1, wherein the preliminary bonded body is partially attached to the lower thin plate side through an adhesive layer not covered with the release paper. The boundary material between the pressure-sensitive adhesive layer not covered with the release paper and the pressure-sensitive adhesive layer covered with the release paper in the pre-combined body according to claim 6 , wherein the release paper is the cover material. A panel characterized in that the preliminary combined body is folded along the fold line so as to be positioned on the layer side, and the fold line extends along the upper thin plate. The panel according to claim 6 , wherein the preliminary combined bodies are respectively disposed on both sides of the upper thin plate. 9. The thin plate (hereinafter referred to as “laminate”) having a bonding force between the thin plate in contact with the base (hereinafter referred to as “lowermost layer thin plate”) and the base according to any one of claims 1 to 8 . , referred to as "the next layer sheet".) and have a size Kuna' than the adhesive force between the outermost lower sheet,
Between the lowermost layer thin plate and the next layer thin plate, at least a part of the periphery of these thin plates is provided with a non-adhesive portion where these thin plates are not bonded to each other,
There is an adhesive material between the lowermost sheet and the next-layer sheet, but a low-affinity layer with a low-affinity layer is interposed between the adhesive material and one sheet. panel, characterized in that the non-adhesive portion is kicked set by. A panel covering material layer updating method for replacing the panel covering material layer according to any one of claims 1 to 9 with a new covering material layer,
After removing the outer covering material layer and at least the uppermost thin plate by peeling between any adjacent thin plates, a new outer covering material layer is formed on the remaining thin plate via a new thin plate. A method for updating a panel covering material layer, comprising stacking. According to claim 10, when updating the previous SL upholstery layer, through said upholstery layer, of the upper sheet, after removing the at least one layer, a new upper sheet corresponding to said upper sheet has been removed A method for updating a panel cover material layer in which a new cover material layer is laminated ,
Aforementioned time to update the upholstery layer, updating of the panel face material layer, characterized in that constructed using the new upper sheet the preliminary conjugate by peeling between the lower sheet and the upper sheet Method. In Claim 11 , when the said upper panel is a panel of Claim 5 or 6 using the said preliminary | backup coupling | bonding body, the said adhesive panel which peeled off the release paper from this preliminary | backup coupling | bonding body, and was exposed A method for updating a panel covering material layer, wherein an agent layer is attached to a lower thin plate to form an upper thin plate. 13. The panel according to claim 12 , wherein the panel is the panel according to claim 7 or 8 , wherein an adhesive layer portion exposed by releasing a release paper from the preliminary bonded body is inverted along the fold line portion to form the lower layer. A method for renewing a panel covering material layer, characterized by being attached to a thin plate. The panel according to any one of claims 10 to 13 , wherein the panel is the panel according to claim 9 .
A method for updating a panel covering material layer, comprising: removing a thin plate and a covering material layer above the non-bonding portion from between thin plates where the non-bonding portion exists. A panel construction structure, wherein the panel according to any one of claims 1 to 9 is constructed on a floor, a wall, or a ceiling. 16. The panel according to claim 15 , wherein the panel includes a panel positioned in a central region and a panel positioned in an outer periphery, and at least a part of a base body of the panel positioned in the central region has a groove in the one plate surface. The panel construction structure is characterized in that the substrate of the panel located on the outer periphery is a flat substrate having no groove on the one plate surface.

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