JP4693909B2 - Solid-state imaging device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a solid-state imaging device configured by mounting an imaging device (solid-state imaging device) such as a CCD on a base and a manufacturing method thereof.

  Solid-state imaging devices are widely used in video cameras, still cameras, mobile phones, and the like. For example, as disclosed in Patent Literature 1, Patent Literature 2, etc., an imaging device such as a CCD is mounted on an insulating base. The light receiving area is provided in the form of a package covered with a translucent plate. In order to reduce the size of the solid-state imaging device, the imaging element is mounted on the base as a bare chip. Such a conventional solid-state imaging device will be described with reference to FIG.

  FIG. 12 is a cross-sectional view showing the structure of a conventional solid-state imaging device. As shown in the figure, the solid-state imaging device is made of an insulating material such as an epoxy resin, and has a frame-like base 101 having an opening 100 at the center and one surface side of the base 101, for example, the lower surface side. And a window member made of a translucent material such as glass attached to the other surface side of the base 101, for example, the upper surface side so as to face the image sensor 102 with the opening 100 interposed therebetween. 103 and a solder ball 104.

Further, the periphery of the image sensor 102 and the interval between the image sensor 102 and the base 101 are filled and covered with a sealing resin 105.
A metal wiring 106 is embedded in the base 101, and one end of the metal wiring 106 is exposed from the mold resin constituting the base 101 in an area near the opening 100 on the lower surface of the base and is connected to an internal terminal. The other end portion of the wiring 106 is exposed from the mold resin constituting the base 101 at the outer edge portion of the lower surface of the base and becomes the external terminal portion 108.
JP 2005-134869 A JP 2002-299595 A

However, the conventional solid-state imaging device has room for improvement as described below in terms of miniaturization and thinning, and the background will be described.
2. Description of the Related Art In recent years, electronic devices that place importance on portability such as mobile phones are required to be reduced in size and thickness in the market. The image pickup element 102 is mounted in a housed form. In such a case, in the structure as shown in FIG. 12, the solder ball 104 mounted on the external terminal portion 108 of the solid-state imaging device hinders thinning. Therefore, to deal with this, it is conceivable to use a solid-state imaging device without the solder ball 104.

  However, if the conventional solid-state imaging device is to provide a shape in which the solder ball 104 is not mounted in order to meet the demand for thinner electronic devices, the sealing resin 105 filled as a reinforcement for the imaging element 102 is used. When a component that tends to wet and spread, such as a low-molecular component contained in the sealing resin 105, is applied, a surface 101a on the imaging element side and the external terminal portion 108 of the base 101 are connected to the base 101. Since the exposed surface 108a is the same surface, the bleed flowing along the surface 101a of the base 101 may cover part of the surface 108a of the external terminal portion 108. When this phenomenon occurs, the connection area of the external terminal portion 108 decreases, and as a result, there is a concern about a decrease in mounting yield when mounting on an electronic device, and further a decrease in mounting reliability.

  Further, when this structure is adopted, only the surface 108a of the external terminal portion 108 is exposed to the outside as the wiring 106 with good heat dissipation on the surface of the solid-state imaging device. Or, there is a drawback that it is difficult to obtain sufficient characteristics for the image sensor 102.

  SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and can realize a reduction in mounting yield and a decrease in mounting reliability while realizing downsizing and thinning of electronic devices, and has high heat dissipation characteristics with good productivity. An object of the present invention is to provide a solid-state imaging device and a manufacturing method thereof.

In order to solve the above-described conventional problems, the solid-state imaging device and the manufacturing method of the solid-state imaging device of the present invention have the following characteristics.
That is, the solid-state imaging device of the present invention is made of an insulating material, a base in which an opening is formed in an inner region, a metal wiring embedded in the base, and the surface on one surface of the base An internal terminal portion formed on the metal wiring so as to be exposed at a location near the opening, an external terminal portion formed on the metal wiring so as to be exposed at a location near the outer periphery of one surface of the base, and light reception An imaging device mounted in a state of being connected to the internal terminal portion on the one surface side of the base so that the light receiving region faces the opening, and a periphery of the imaging device. In a solid-state imaging device comprising: a sealing resin that fills and covers a gap between the imaging element and the base; and a window member that is attached to the other surface of the base and has a light transmitting property. On one side of the base to the metal wiring Wherein an internal terminal portion forming a metal exposure portion exposed at a location between the external terminal portion, the external terminal portion and the metal exposed portion protrudes from said metal wire, wherein said metallic exposed portion external terminal that The surface portion of the base and the surface portion of the base are substantially the same surface, and the connecting portion connecting the external terminal portion and the metal exposed portion in the metal wiring is formed with a concave dam , The connecting portion is exposed from the base .

With this configuration, a metal exposed portion exposed at a position between the internal terminal portion and the external terminal portion on one surface of the base is formed, and the metal exposed portion and the external terminal portion are formed from the metal wiring. Projecting, a surface portion of the metal exposed portion and the external terminal portion, and a surface portion of the base are substantially flush with a connection portion connecting the external terminal portion and the metal exposed portion in the metal wiring In addition, since the concave dam is formed, when the solder ball is not mounted on the external terminal part, even when the bleed flows out from the sealing resin along one surface of the base in the process of manufacturing, The bleed is stopped by a dam that is recessed in a concave shape to serve as a breakwater, and the bleed can be prevented from covering the external terminal portion. In addition, since not only the external terminal part but also the exposed metal part is exposed from the surface of the base, the exposed area on the base surface of the metal wiring with good heat dissipation increases and has high heat dissipation characteristics. Can do.

The solid-state imaging device manufacturing method of the present invention includes a pair of molds having cavities for resin-molding a plurality of bases, and an internal terminal portion and an external terminal portion corresponding to the plurality of bases, respectively. And a plurality of sets of metal wirings having a metal exposed portion between them, and a tape material carrying the metal thin plate leads, corresponding to the plurality of bases in the cavity. The tape material is loaded between the pair of molds so that each set of the thin metal plate leads is disposed in each region, and the cavity is filled with a sealing resin and cured, and each opening A plurality of solid-state imaging device formation regions corresponding to each base surrounding the molded body, and a molded body having metal wiring in which an internal terminal portion, an external terminal portion, and a metal exposed portion are formed for each solid-state imaging device formation region, In the metal wiring A connecting portion connecting the external terminal portion and the exposed metal portion is provided with a recessed dam, and a step of separating the formed body into a plurality of pieces, A step of mounting a solid-state imaging device on the internal terminal portion side constituted by the metal wiring, a step of filling and covering the periphery of the imaging device and the interval between the imaging device and the molded body with a sealing resin, and the molding Attaching a window member made of a translucent material to a surface of the body facing the surface on which the imaging element is mounted , the metal exposed portion and the external terminal portion projecting from the metal wiring, and the metal exposed The surface portion of the portion and the external terminal portion and the surface portion of the base are substantially flush with each other, and the connection portion is formed so as to be exposed from the base . Solid-state imaging device can be manufactured well

Further, in the method of manufacturing the solid-state imaging device according to the present invention, in the step of forming the molded body, when the metal thin plate lead is disposed on the tape material, the internal terminal portion of the metal wiring formed from the metal thin plate lead; The thickness difference between the external terminal part and the exposed metal part is arranged to absorb the deformation in the thickness direction of the tape material, and the cavity is filled with a sealing resin and hardened. The solid-state imaging device having the above-described configuration can be satisfactorily manufactured while the thickness difference between the internal terminal portion, the external terminal portion, and the metal exposed portion is well absorbed by the tape material.

According to the present invention as described above, the metal wiring which is embedded in the base, forming a metal exposure portion exposed at a location between the internal terminal portion and the external terminal section in the one surface of the base, wherein The metal exposed portion and the external terminal portion protrude from the metal wiring, and the surface portion of the metal exposed portion and the external terminal portion and the surface portion of the base are substantially flush with each other in the metal wiring. By forming a concave dam in the connecting part that connects the external terminal part and the exposed metal part, the bleed can be removed from the sealing resin in the course of manufacturing without mounting solder balls on the external terminal part. Even if it flows out, it can be prevented that the bleed is stopped by the dam recessed in the concave shape and covered on the external terminal part, and there is no risk of lowering the mounting yield and mounting reliability when mounting on electronic equipment . Therefore, an increase in the size of the solid-state imaging device due to the occurrence of this bleed can be suppressed, and a good mounting yield and mounting reliability can be obtained while being able to easily achieve a reduction in size and thickness. In addition, since not only the external terminal part but also the exposed metal part is exposed from the surface of the base, the exposed area on the base surface of the metal wiring with good heat dissipation increases and has high heat dissipation characteristics. Therefore, sufficient heat dissipation characteristics can be obtained for an electronic device or an image sensor that requires high heat dissipation.

Hereinafter, a solid-state imaging device and a method for manufacturing the solid-state imaging device according to embodiments of the present invention will be described with reference to the drawings.
First, the solid-state imaging device according to the first embodiment of the present invention will be described. FIG. 1A is a cross-sectional view of the solid-state imaging device according to the present embodiment, and FIG. 1B is a bottom view of the solid-state imaging device as viewed from below. In the following description, for the sake of easy understanding, the case where the imaging element is disposed on the lower surface side of the base and the window member is disposed on the upper surface side of the base is described and illustrated. However, it is not limited to these upper and lower arrangements, and it is needless to say that the relative positions of the respective components may be the same.

  As shown in FIGS. 1A and 1B, the solid-state imaging device is made of an insulating material such as an epoxy resin and has a frame-like and substantially planar base 2 having an opening 1 at the center, and a base. The image sensor 3 attached to the lower surface side of the base 2 and the window member 4 made of a translucent material such as glass attached to the upper surface side of the base 2 so as to face the image sensor 3 with the opening 1 interposed therebetween. And.

  In addition, the sealing resin 5 is filled in the periphery of the image sensor 3 and the interval between the image sensor 3 and the base 2, and these portions are covered with the sealing resin 5. On the other hand, on the upper surface of the base 2, the gap between the base 2 and the window member 4 is sealed with a sealing resin 6 provided around the window member 4.

  A metal wiring 7 is embedded in the base 2. One end of the metal wiring 7 is an internal terminal portion 8 formed so as to be exposed from the mold resin constituting the base 2 in a region near the opening 1 on the base, and the other end of the metal wiring 7 The end portion is an external terminal portion 9 formed to protrude from the mold resin constituting the base 2 in the vicinity of the outer peripheral portion on the base.

  The imaging element 3 is attached in the peripheral region of the opening 1 on the base so that the light receiving region 10 is exposed to the opening 1. An electrode pad for inputting / outputting electrical signals between the image sensor 3 and an external device is provided near the outer periphery of the surface of the image sensor 3 where the light receiving region 10 is formed. The internal terminal portion 8 and the electrode pad are electrically connected via the bump 11.

  Further, in particular, the metal exposed portion 12 that is exposed at a position between the internal terminal portion 8 and the external terminal portion 9 on the lower surface of the base 2 (exposed and protruded in this embodiment) is integrated with the metal wiring 7. Is formed. Here, in this embodiment, the surface of the metal exposed portion 12 (the lower surface that is the protruding end surface) and the surface of the external terminal portion 9 (the lower surface that is the protruding end surface) are substantially the same surface (so as to have the same height). Is formed.

  Next, a method for manufacturing the solid-state imaging device will be described with reference to the drawings. 2 (a), 2 (b), 4 (a), 4 (b), 5 (a), and 5 (b) are partial cross-sectional views illustrating the method of manufacturing the solid-state imaging device for each process. However, in the steps shown in FIGS. 2A, 2B, and 4A, a case in which only the region for forming two solid-state imaging devices is shown is displayed. The manufacturing process proceeds using the lead frame 21 in which the formation regions of a large number of solid-state imaging devices are provided in a grid pattern. 3A and 3B are cross-sectional views respectively showing a molding process among the manufacturing processes of the solid-state imaging device.

  First, as shown in FIG. 2A, the lead frame 21 on which the wiring pattern is formed is placed on the sealing tape 22. Most of the lead frame 21 is provided with a recess in the lower part by half-etching or pressing, and only the portion that becomes the external terminal portion 9, the metal exposed portion 12, and the internal terminal portion 8 protrudes downward from the bottom surface of the recess. In this posture, it is placed on the sealing tape 22. Furthermore, the external terminal portion 9 and the exposed metal portion 12 have a structure protruding downward from the internal terminal portion 8, and when placed on the sealing tape 22, the difference in protruding distance from the internal terminal portion 8. Is loaded with a load so as to absorb the deformation in the thickness direction of the sealing tape 22. For example, when the difference in protrusion distance between the internal terminal portion 8 and the external terminal portion 9 and the exposed metal portion 12 is about 50 μm, the sealing tape 22 having an adhesive layer (not shown) having a thickness of about 50 μm is used. As a result, the amount of deformation that can absorb the difference in protrusion distance can be secured, and a desired difference in protrusion distance can be created.

  Next, a molding process is performed in the process shown in FIG. That is, as shown in FIGS. 3A and 3B, a lead frame 21 with a sealing tape 22 attached is mounted on a mold 23, and a mold resin 24 such as an epoxy resin is attached to the mold 23. A portion of the lead frame 21 other than the internal terminal portion 8, the external terminal portion 9, and the metal exposed portion 12 is filled with the mold resin 24 to fill the die cavity 25, thereby forming a molded body 26. The mold mold 23 is formed with partition portions 27 for separating the cavities, and the partition portion 27 is not filled with the mold resin 24. Therefore, an area in the molded body 26 where each solid-state imaging device is formed (solid-state imaging). In the central portion of the device forming region), an opening 1 to which the image pickup device 3 is attached is formed.

  Next, as shown in FIG. 4A, after the sealing tape 22 is peeled off from the molded body 26, a blade (cutting jig) 28 is used between adjacent solid-state imaging device forming regions of the molded body 26. The boundary portion is cut to form the base 2 of each solid-state imaging device from the molded body 26. At this time, from the base 2, the internal terminal portion 8, the metal exposed portion 12, and the external terminal portion 9 are exposed on the surface, and other portions of the metal wiring 7 connecting them are embedded in the base 2. It is.

  Next, as shown in FIG. 4B, the imaging device 3 is mounted on the base 2 that is turned upside down with its light receiving region 10 facing downward. At that time, bumps 11 are provided on the electrode pads on each imaging device 3, and these bumps 11 are connected to the corresponding internal terminal portions 8 on the base 2.

Next, as shown in FIG. 5A, the sealing resin 5 is filled in the gap between the connection portion between the base 2 and the image pickup device 3 and the periphery of the image pickup device 3, and these sealing portions are sealed. Cover with a stop resin 5.
Next, as shown in FIG. 5B, the base 2 to which the image sensor 3 is attached is turned upside down, and the opening 1 is formed on the surface of the base 2 opposite to the side on which the image sensor 3 is mounted. The window member 4 made of glass to be covered is placed, the sealing resin 6 is filled in the space between the window member 4 and the base 2, and the opening 1 is sealed with the sealing resin 6.

  According to this configuration of the fixed imaging device, not only the external terminal portion 9 but also the metal exposed portion 12 is exposed from the surface of the base 2, so that the metal wiring 7 with good heat dissipation is on the surface of the base 2. The exposed area of the substrate can be increased and high heat dissipation characteristics can be obtained. Therefore, sufficient heat dissipation characteristics can be obtained for an electronic device or an image sensor that requires high heat dissipation.

  Furthermore, since the protruding surfaces of the exposed metal portion 12 and the external terminal portion 9 are substantially the same surface, the exposed metal portion 12 can be used as a mounting reinforcement portion of the external terminal portion 9 and mounted on an electronic device or the like. It is easy to improve the mounting reliability at the time.

  In addition, when applying the sealing resin 5 that fills and covers the space between the imaging element 3 and the base 2, a component that tends to wet and spread such as a low-molecular component contained in the sealing resin 5, so-called bleeding occurs, Even when the bleed flows out from the sealing resin 5 along the upper surface of the base 2, the exposed metal 12 protrudes from the surface of the base 2, so that the exposed metal 12 serves as a breakwater, It is possible to prevent the external terminal portion 9 from being covered. With this structure, it is possible to prevent the bleed from covering the external terminal portion 9 without mounting the solder ball on the external terminal portion as in the conventional solid-state imaging device, and the mounting yield when mounting on the electronic device can be prevented. There is no risk of lowering or mounting reliability. Therefore, an increase in the size of the solid-state imaging device due to the occurrence of the bleed can be suppressed, and a reduction in size and thickness can be easily realized, and a good mounting yield and mounting reliability can be obtained.

In this embodiment, the shape of the exposed metal portion 12 is a rectangle. However, the shape of the exposed metal portion 12 is not limited to this, and may be any shape such as a circle or a square.
Next, a solid-state imaging device according to the second embodiment of the present invention will be described. FIG. 6A is a cross-sectional view of the solid-state imaging device according to the second embodiment, and FIG. 6B is a bottom view of the solid-state imaging device as viewed from below.

  The difference from the solid-state imaging device according to the first embodiment is that, in the solid-state imaging device according to the second embodiment, as shown in FIGS. That is, the surface of the connecting portion 13 connecting the external terminal portion 9 and the exposed metal portion 12 is not covered with the mold resin 24 and is exposed on the surface of the base 2. Also in this embodiment, the surface (lower surface) of the exposed metal portion 12 and the surface (lower surface) of the external terminal portion 9 are formed on substantially the same surface (so as to have the same height). The exposed portion 12 and the external terminal portion 9 protrude from the surface (lower surface) of the base 2.

  Next, a method for manufacturing the solid-state imaging device will be described with reference to the drawings. 7 (a), 7 (b), 9 (a), 9 (b), 10 (a), and 10 (b) are partial cross-sectional views illustrating the method of manufacturing the solid-state imaging device for each process. However, in the steps shown in FIGS. 7A, 7B, and 9A, the case where only the region where two solid-state imaging devices are formed is displayed, but in general, The manufacturing process proceeds using a lead frame 31 in which formation regions of a large number of solid-state imaging devices are provided in a grid pattern. 8A and 8B are cross-sectional views respectively showing a molding process in the manufacturing process of the solid-state imaging device.

  First, as shown in FIG. 7A, the lead frame 31 on which the wiring pattern is formed is placed on the sealing tape 22. Most of the lead frame 31 is provided with a recess in the lower part by half-etching or pressing, and only the metal exposed region 32 located at the periphery of the solid-state imaging device forming region and the portion serving as the internal terminal portion 8 are downward from the bottom surface of the recess. It has a protruding structure. Further, the metal exposed region 32 has a structure protruding from the internal terminal portion 8, and when placed on the sealing tape 22, the difference in protruding distance from the internal terminal portion 8 is determined in the thickness direction of the sealing tape 22. It is placed with a weight applied so that it can be absorbed using the deformation of.

  Next, a molding process is performed in the process shown in FIG. That is, as shown in FIGS. 8A and 8B, a lead frame 31 with a sealing tape 22 attached is mounted on a mold die 23, and a mold resin 24 such as an epoxy resin is attached to the mold die 23. The die cavity 25 is filled, and a portion other than the internal terminal portion 8 and the metal exposed region 32 of the lead frame 31 is embedded with the mold resin 24 to form a molded body 33. The mold mold 23 is formed with a partition portion 27 that separates the cavities, and the partition portion 27 is not filled with the mold resin 24. Therefore, in the central portion of each solid-state imaging device formation region in the molded body 33, An opening 1 is formed so that the imaging element 3 faces and is attached.

  Next, as shown in FIG. 9A, after the sealing tape 22 is peeled off from the molded body 33, the blades (cutting jigs) 34 use the blade (cutting jig) 34 between adjacent solid-state imaging device forming regions. The boundary portion is cut to form the base 2 of each solid-state imaging device from the molded body 33. At this time, by using the same blade 34 used when the molded body 33 is separated into a plurality of pieces, each solid-state imaging device formation region exposed on the surface of the base 2 is changed to a necessary size of the external terminal portion 9. The external terminal portion 9, the metal exposed portion 12, and the exposed surface of the connecting portion 13 between them are formed by half-cutting so as to form a recess. At this time, on the base 2, the internal terminal portion 8, the metal exposed portion 12, and the external terminal portion 9 are exposed on the surface, and further, the connecting portion that connects the metal exposed portion 12 and the external terminal portion 9. The surface of 13 is also exposed. The other part of the metal wiring 7 is embedded in the base 2.

  Next, as shown in FIG. 9B, the imaging device 3 is mounted on the base 2 with the light receiving region 10 facing downward. At that time, bumps 11 are provided on the electrode pads on each imaging device 3, and these bumps 11 are connected to the corresponding internal terminal portions 8 on the base 2.

Next, as shown in FIG. 10 (a), the gap between the connection portions between the base 2 and the image pickup device 3 and the periphery of the image pickup device 3 are filled with the sealing resin 5, and these sealing portions are sealed. Cover with a stop resin 5.
Next, as shown in FIG. 10B, the base 2 to which the image sensor 3 is attached is turned upside down, and the opening 1 is formed on the surface of the base 2 opposite to the side on which the image sensor 3 is mounted. The window member 4 made of glass to be covered is placed, the sealing resin 6 is filled in the space between the window member 4 and the base 2, and the opening 1 is sealed with the sealing resin 6.

  According to this configuration of the fixed imaging device, not only the external terminal portion 9 and the metal exposed portion 12 but also the connecting portion 13 are exposed from the surface of the base 2, so that the metal wiring 7 with good heat dissipation can be formed. The exposed area on the surface of the base 2 can be further increased, and further high heat dissipation characteristics can be obtained. Furthermore, since the protruding surfaces of the exposed metal portion 12 and the external terminal portion 9 are substantially the same surface, the exposed metal portion 12 can be used as a mounting reinforcement portion of the external terminal portion 9 and mounted on an electronic device or the like. It is easy to improve the mounting reliability at the time.

  Also in the present embodiment, when applying the sealing resin 5 that fills and covers the space between the imaging element 3 and the base 2, components that easily spread and spread, such as low-molecular components contained in the sealing resin 5. Even when so-called bleed occurs, the external terminal portion 9 and the exposed metal portion 12 protrude from the surface of the base 2, so that the exposed metal portion 12 serves as a breakwater, and the bleed is on the external terminal portion 9. Can be prevented. With this structure, it is possible to prevent the bleed from being placed on the external terminal portion 9 without mounting solder balls on the external terminal portion as in the conventional solid-state imaging device. There is no risk of lowering or mounting reliability. Therefore, an increase in the size of the solid-state imaging device due to the occurrence of the bleed can be suppressed, and a reduction in size and thickness can be easily realized, and a good mounting yield and mounting reliability can be obtained.

In this embodiment as well, the shape of the exposed metal portion 12 is not limited to a rectangular shape, and may be any shape such as a circular shape or a square shape.
In the solid-state imaging device according to the second embodiment, the surface of the connection portion 13 that connects the external terminal portion 9 and the metal exposed portion 12 in the metal wiring 7 is not covered with the mold resin 24. The case where the metal exposed portion 12 and the external terminal portion 9 are projected from the surface (upper surface) of the base 2 while being exposed on the surface of the base 2 has been described, but the present invention is not limited to this. 11 (a) and 11 (b), the surface portion of the metal exposed portion 12 and the external terminal portion 9 and the surface portion of the base 2 may be in the shape of substantially the same plane. That is, if the surface of the connection portion 13 that connects the external terminal portion 9 and the metal exposed portion 12 in the metal wiring 7 is not covered with the mold resin 24, the 7 external terminal portion 9 and the metal exposed portion 12 of the metal wiring are insulated. Even if it is substantially flush with the surface of the base 2 made of a conductive material, the connecting portion 13 that connects the external terminal portion 9 and the metal exposed portion 12 has a concave shape between the external terminal portion 9 and the metal exposed portion 12. Thus, the same bleed covering suppression effect can be realized.

  In each of the above embodiments, the case where only one metal exposed portion 12 is formed between the internal terminal portion 8 and the external terminal portion 9 has been described. However, the present invention is not limited to this. A plurality of metal exposed portions 12 may be provided between the terminal portion 8 and the external terminal portion 9. For example, a plurality of metal exposed portions 12 can be formed by performing half cutting with the blade 34 a plurality of times. is there. Thereby, the area exposed from the base 2 in the metal wiring 7 further increases, and a further better heat dissipation characteristic can be obtained.

  The solid-state imaging device and the solid-state imaging device manufacturing method of the present invention are useful as a solid-state imaging device configured by mounting an imaging element such as a CCD on a base and a manufacturing method thereof.

(A) is sectional drawing of the solid-state imaging device which concerns on the 1st Embodiment of this invention, (b) is the bottom view which looked at the solid-state imaging device from the downward direction (A) And (b) is the fragmentary sectional view which each showed the manufacturing method of the solid-state imaging device according to each process (A) And (b) is each the fragmentary sectional view which each showed the mold process in the manufacturing method of the solid-state imaging device (A) And (b) is the fragmentary sectional view which each showed the manufacturing method of the solid-state imaging device according to each process (A) And (b) is the fragmentary sectional view which each showed the manufacturing method of the solid-state imaging device according to each process (A) is sectional drawing of the solid-state imaging device which concerns on the 2nd Embodiment of this invention, (b) is the bottom view which looked at the solid-state imaging device from the downward direction (A) And (b) is the fragmentary sectional view which each showed the manufacturing method of the solid-state imaging device according to each process (A) And (b) is each the fragmentary sectional view which each showed the mold process in the manufacturing method of the solid-state imaging device (A) And (b) is the fragmentary sectional view which each showed the manufacturing method of the solid-state imaging device according to each process (A) And (b) is the fragmentary sectional view which each showed the manufacturing method of the solid-state imaging device according to each process (A) is sectional drawing of the solid-state imaging device which concerns on other embodiment of this invention, (b) is the bottom view which looked at the solid-state imaging device from the downward direction Sectional view of a conventional solid-state imaging device

DESCRIPTION OF SYMBOLS 1 Opening part 2 Base 3 Image sensor (solid-state image sensor)
4 Window member 5 Sealing resin 6 Sealing resin 7 Metal wiring 8 Internal terminal portion 9 External terminal portion 10 Light receiving region 11 Bump 12 Metal exposed portion 13 Connection portions 21 and 31 Lead frame 22 Sealing tape 23 Mold die 24 Mold resin 25 Die cavity 26, 33 Molded body 27 Partition 28, 34 Blade (Jig for cutting)
32 Metal exposed area

Claims (8)

A base made of an insulating material and having an opening formed in the inner region;
Metal wiring embedded in the base;
An internal terminal portion formed on the metal wiring so as to be exposed at a position near the opening on one surface of the base;
An external terminal portion formed on the metal wiring so as to be exposed at a position near the outer periphery of one surface of the base;
An image sensor that has a light receiving region and is mounted in a state of being connected to the internal terminal portion on the one surface side of the base so that the light receiving region faces the opening;
A sealing resin that fills and covers the periphery of the imaging element and the gap between the imaging element and the base;
In the solid-state imaging device that is attached to the other surface of the base and includes a window member having translucency,
In the metal wiring, a metal exposed portion exposed at a location between the internal terminal portion and the external terminal portion on one surface of the base is formed,
The metal exposed portion and the external terminal portion protrude from the metal wiring,
The surface portion of the metal exposed portion and the external terminal portion and the surface portion of the base are substantially flush with each other,
In the connection part that connects the external terminal part and the metal exposed part in the metal wiring, a concave dam is formed ,
The solid-state imaging device, wherein the connection portion is exposed from the base . The solid-state imaging device according to claim 1, wherein the base is made of an epoxy resin. The solid-state imaging device according to claim 1, wherein the window member is made of glass. The solid-state imaging device according to claim 1, wherein the metal exposed portion is rectangular. The solid-state imaging device according to claim 1, wherein the metal exposed portion is square. The solid-state imaging device according to claim 1, wherein the metal exposed portion is circular. A plurality of sets each having a pair of molds having cavities for resin-molding a plurality of bases, and an internal terminal part, an external terminal part, and a metal exposed part between them corresponding to the plurality of bases Each set of the thin metal plate leads is disposed in a region corresponding to the plurality of bases in the cavity, using a thin metal plate lead having the metal wiring formed thereon and a tape material supporting the thin metal plate lead. As described above, the tape material is loaded between the pair of molds, and the cavity is filled with a sealing resin and cured, and a solid-state imaging device forming region corresponding to each base surrounding each opening A molded body having a metal wiring in which an internal terminal portion, an external terminal portion, and a metal exposed portion are formed for each solid-state imaging device forming region, and the external terminal portion and the metal exposed portion in the metal wiring. And In a state where the dam recessed concavely on sushi connecting portion is provided, and forming,
Separating the molded body into a plurality of pieces;
Mounting a solid-state imaging device on the internal terminal portion side constituted by the metal wiring of the molded body;
Filling and covering the periphery of the image sensor and the space between the image sensor and the molded body with a sealing resin;
Attaching a window member made of a translucent material to a surface facing the surface on which the imaging element of the molded body is mounted ,
The metal exposed portion and the external terminal portion protrude from the metal wiring,
The surface portion of the metal exposed portion and the external terminal portion and the surface portion of the base are substantially flush with each other,
The method of manufacturing a solid-state imaging device, wherein the connecting portion is formed so as to be exposed from the base . In the step of forming the molded body,
When the metal thin plate lead is disposed on the tape material , the thickness difference between the internal terminal portion, the external terminal portion and the metal exposed portion of the metal wiring formed from the metal thin plate lead is utilized in the thickness direction deformation of the tape material. The solid-state imaging device manufacturing method according to claim 7, wherein the solid-state imaging device is disposed so as to be absorbed, and the cavity is filled with a sealing resin and cured.

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