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JP4683916B2 - Optical isolator - Google Patents

Optical isolator Download PDF

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JP4683916B2
JP4683916B2 JP2004375046A JP2004375046A JP4683916B2 JP 4683916 B2 JP4683916 B2 JP 4683916B2 JP 2004375046 A JP2004375046 A JP 2004375046A JP 2004375046 A JP2004375046 A JP 2004375046A JP 4683916 B2 JP4683916 B2 JP 4683916B2
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optical isolator
optical
bonding
bonding material
alignment substrate
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JP2006047955A (en
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友幸 廣瀬
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Kyocera Corp
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本発明は、小型機器の光通信技術に利用される光アイソレータ及びその製造方法に関するものである。   The present invention relates to an optical isolator used in an optical communication technology for small devices and a method for manufacturing the same.

光アイソレータは、光増幅器、半導体レーザ装置等に使用されている。この光アイソレータは、2枚の偏光子の相対角度を約45°に設定し、それらの間にファラデー回転角が約45°のファラデー回転子を挿入して互いに固定したものであり、順方向の光は透過させ、逆方向の光は遮断する作用を有するものである。   Optical isolators are used in optical amplifiers, semiconductor laser devices, and the like. In this optical isolator, the relative angle between two polarizers is set to about 45 °, and a Faraday rotator with a Faraday rotation angle of about 45 ° is inserted between them to fix them together. It has a function of transmitting light and blocking light in the reverse direction.

近年この光アイソレータに対しては、小型化、量産化、低価格化が強く要望されており、その対策として例えば、特許文献1に開示されたような光アイソレータの開発利用が盛んになってきた。   In recent years, there has been a strong demand for miniaturization, mass production, and cost reduction for this optical isolator. For example, the optical isolator disclosed in Patent Document 1 has been developed and used as a countermeasure. .

図6に示すように、光アイソレータ素子10は、偏光子1,3とファラデー回転子2から成り、また、直方体の磁石4を一枚の平板状の整列基板5に合金半田で接合・固定した構造を有したものが開示されている。   As shown in FIG. 6, the optical isolator element 10 includes polarizers 1 and 3 and a Faraday rotator 2, and a rectangular parallelepiped magnet 4 is bonded and fixed to a single flat plate-like alignment substrate 5 with alloy solder. What has a structure is disclosed.

また、特許文献2に開示された図7のような、偏光子1,3とファラデー回転子2から成る光学素子と、直方体磁石4をそれぞれ異なる段差を有する整列基板5上に接合材7で接合・固定した構造を有したものも開示されている。   Further, as shown in FIG. 7 disclosed in Patent Document 2, an optical element including polarizers 1 and 3 and a Faraday rotator 2 and a rectangular parallelepiped magnet 4 are bonded to an alignment substrate 5 having different steps by a bonding material 7. -The thing with the fixed structure is also disclosed.

このような構成の光アイソレータは、LD(レーザダイオード)モジュール内に搭載時に透過偏光方向の位置合わせが容易である、TEC(Thermoelectric Cooler)上に搭載可能である、小型化が容易である等の優位性があると考えられている。
特開平10−227996号公報 特開2001−264695号公報
The optical isolator having such a configuration can be easily mounted on a TEC (Thermoelectric Cooler), easily downsized, etc., when it is mounted in an LD (Laser Diode) module. It is considered superior.
JP-A-10-227996 JP 2001-264695 A

ところが、上述のように平面上に磁石と光学素子を配置する構造では、接合材を整列基板に滴下し、その接合材上に光学素子や磁石を配置するため、滴下量が多い場合や、滴下位置が所望の位置からずれた場合、接合材が整列基板の表面からはみ出して裏面に廻り込み、接合材を硬化するときに治具から脱離できない。   However, in the structure in which the magnet and the optical element are arranged on the plane as described above, the bonding material is dropped on the alignment substrate, and the optical element and the magnet are arranged on the bonding material. When the position deviates from a desired position, the bonding material protrudes from the front surface of the alignment substrate and moves to the back surface, and cannot be detached from the jig when the bonding material is cured.

また、整列基板が位置決め用のガイド構造になっていても、接合材上に光学素子や磁石を配置するために滴下量が多いと整列基板の所定の位置から光学素子や磁石が位置ずれを起こし、整列基板からはみ出してしまい、接合精度が困難となり、有効開口径を確保できない課題があった。   Even if the alignment substrate has a guide structure for positioning, if the amount of dripping is large in order to place the optical element or magnet on the bonding material, the optical element or magnet may be displaced from a predetermined position on the alignment substrate. However, it protrudes from the alignment substrate, so that the joining accuracy becomes difficult and the effective opening diameter cannot be secured.

従来の光アイソレータはLDへの近端反射戻り光を防ぐために、光アイソレータ全体を光軸に対して傾斜させる必要があり、LDモジュール内のスペースをより大きく使用し、LDモジュールの小型化の妨げになる課題があった。   The conventional optical isolator needs to tilt the entire optical isolator with respect to the optical axis in order to prevent the near-end reflected return light to the LD, and uses a larger space in the LD module, thereby preventing the miniaturization of the LD module. There was a problem to become.

また、LDモジュールはLD直近に配置するレンズと光アイソレータは個別に調芯配置するために工数が増加するとともに小型化の妨げになる課題があった。   Further, since the LD module and the lens and the optical isolator arranged in the immediate vicinity of the LD are individually aligned and arranged, there are problems that man-hours increase and miniaturization is hindered.

本発明の目的は、上述の課題に鑑みて案出されたものであり、高精度の接合を実現した上に小型化、低コスト化を可能とし、かつ組立時に発生した不具合を解消した光アイソレータを提供することにある。   The object of the present invention has been devised in view of the above-described problems, and is an optical isolator that realizes high-precision bonding, enables downsizing and cost reduction, and eliminates problems occurring during assembly. Is to provide.

上記課題に鑑みて本発明の光アイソレータは、少なくとも偏光子とファラデー回転子からなる光アイソレータ素子を含む光学部品を整列基板上に接合材を介して接合してなる光アイソレータにおいて、上記整列基板の上記光学部品を搭載する面の中央部に上記光学部品の接合面の面積よりも開口面積が小さい凹部を形成し、該凹部に充填されるとともに上記光学部品の接合面の周囲から表面張力を維持できる範囲内で微小にはみ出した上記接合材を介して接合上記光学部品が接合されていることを特徴とする。
In view of the above problems, an optical isolator according to the present invention is an optical isolator in which an optical component including an optical isolator element including at least a polarizer and a Faraday rotator is bonded to an alignment substrate via a bonding material. A recess having an opening area smaller than the area of the joint surface of the optical component is formed at the center of the surface on which the optical component is mounted, and the surface tension is applied from the periphery of the joint surface of the optical component while filling the recess. The bonded optical component is bonded through the bonding material that protrudes minutely within a range that can be maintained .

光アイソレータの製造方法としては、少なくとも偏光子とファラデー回転子からなる光アイソレータ素子を含む光学部品を整列基板上に接合材を介して接合してなる光アイソレータの製造方法において、上記整列基板の上記光学部品を搭載する面の中央部に上記光学部品の接合面よりも開口面積が小さい凹部を形成するとともに、該凹部に上記接合材を表面から溢れるとともに上記接合面に行き渡る滴下量となるように充填した後、上記光学部品を接合材上に配置し、表面張力を維持できる範囲内で接合面の周囲から微小にはみ出させた後、接合材を硬化させて上記光学部品と上記整列基板とを接合したことを特徴とする。 As an optical isolator manufacturing method, in an optical isolator manufacturing method in which an optical component including an optical isolator element including at least a polarizer and a Faraday rotator is bonded to an alignment substrate via a bonding material, A recess having an opening area smaller than the bonding surface of the optical component is formed at the center of the surface on which the optical component is mounted, and the bonding material overflows from the surface and reaches a dripping amount that reaches the bonding surface. After the optical component is placed on the bonding material, the optical component is allowed to protrude from the periphery of the bonding surface within a range in which the surface tension can be maintained , and then the bonding material is cured so that the optical component, the alignment substrate, It is characterized by joining.

本発明の構成によれば、整列基板上に接合材を介して光アイソレータ素子を含む部品を接合するが、その接合材は光学部品の接合面の面積よりも開口面積が小さい凹部に充填されているために、光学部品が小型化、凹部に充填し接合材を凹部の開口面から突出させた場合、光学部品が表面張力により整列基板上の凹部の中央位置に移動するので位置ズレが防止できるとともに、光軸がずれることもなく接合ができ、従来構造と比較して、より一層、小型化することができるとともに、光アイソレータ素子を調整無しに配置する事が可能となるため歩留まりがよく低コストの光アイソレータを提供する事ができる。 According to the configuration of the present invention will be joining the optical science component including an optical isolator element through the bonding material on the alignment substrate, the bonding material is filled into the recess opening area smaller than the area of the junction surface of the optical component because they are, the optical components are compact, when projecting a bonding material filled in the concave portion from an opening surface of the concave portion, since the optical component is moved to the center position of the recess on the alignment substrate by surface tension position Because it can prevent misalignment and can be joined without shifting the optical axis, it can be further reduced in size compared to the conventional structure, and the optical isolator element can be arranged without adjustment. An optical isolator with a high yield and a low cost can be provided.

以下、本発明の実施の形態を図によって説明する。なお、従来技術と同じものについては同じ符号を用いるものとする。   Embodiments of the present invention will be described below with reference to the drawings. In addition, the same code | symbol shall be used about the same thing as a prior art.

図1は本発明の光アイソレータの構造を説明する図であり、(a)は本発明の光アイソレータの組立時の概略斜視図、(b)は接着固定後の組立完成品の斜視図である。   1A and 1B are views for explaining the structure of an optical isolator according to the present invention. FIG. 1A is a schematic perspective view of the optical isolator according to the present invention during assembly, and FIG. 1B is a perspective view of an assembled product after bonding and fixing. .

本発明の光アイソレータは、光アイソレータ素子10を含む光学部品Xを整列基板5上に接合材7を介して接合してなる。   The optical isolator of the present invention is formed by bonding an optical component X including an optical isolator element 10 onto an alignment substrate 5 via a bonding material 7.

整列基板5は光アイソレータ素子10と磁石4を含む光学部品Xを搭載する面のほぼ中央部(図では整列基板5の中央に光アイソレータ素子10、その両端に磁石4を搭載しており、それぞれの搭載領域の中央部分をいう)に光アイソレータ素子10、磁石4の接合面よりも開口面積が小さな凹部6を設けてある。ここで、接合面とは、各光学部品Xの下面の面積全体をいう。   The alignment substrate 5 has an optical isolator element 10 and an optical component X including the magnet 4 mounted on the substantially central portion (in the figure, the optical isolator element 10 is mounted at the center of the alignment substrate 5 and the magnets 4 are mounted at both ends thereof. Is provided with a recess 6 having an opening area smaller than the joint surface of the optical isolator element 10 and the magnet 4. Here, the bonding surface refers to the entire area of the lower surface of each optical component X.

この凹部6上に接合材7を凹部6の開口面積より溢れて開口から突出するように滴下して充填する。また、凹部6から溢れ出た接合材7は光アイソレータ素子10と磁石4の接合面積より小さい面積となるように広げ、後で詳細に説明するように接合材7上に光アイソレータ素子10と磁石4を押し当てて配置する。   The bonding material 7 is dropped and filled on the recess 6 so as to overflow the opening area of the recess 6 and protrude from the opening. Further, the bonding material 7 overflowing from the recess 6 is expanded so as to have an area smaller than the bonding area of the optical isolator element 10 and the magnet 4, and the optical isolator element 10 and the magnet are placed on the bonding material 7 as will be described in detail later. Press 4 to place.

本発明に用いられる整列基板5の材質は、光アイソレータの光学特性を安定化するためにも後述のファラデー回転子2の熱膨張係数に近似しているのが望ましく、50Ni−FeやSUS430、SF20Tなどの金属や、ジルコニアなどのセラミックスが望ましい。金属の場合は切削加工とエンドミル等の精密加工の他、MIM成型でも作製可能である。   The material of the alignment substrate 5 used in the present invention is preferably close to the thermal expansion coefficient of the Faraday rotator 2 to be described later in order to stabilize the optical characteristics of the optical isolator, such as 50Ni-Fe, SUS430, SF20T. Metals such as zirconia and ceramics such as zirconia are desirable. In the case of metal, it can be manufactured by MIM molding in addition to precision processing such as cutting and end milling.

接合面8、9は接合材7の接合力を高めるために、接合面積の増加やアンカー効果を目的として面粗さを粗くする他にショットブラスト処理や梨地処理することが望ましい。また、光アイソレータ素子10と磁石6が接合材7を介して直接接合された場合、熱膨張係数の違いにより偏光子1、3にクラックが生じる場合がある。そのため物理的に接合しない構造として接合面8と接合面9は段差構造となっていることが望ましいが、治具等により接合時に両者が接合しない方法があれば、その限りではない。   In order to increase the bonding force of the bonding material 7, the bonding surfaces 8 and 9 are preferably subjected to shot blasting or matte processing in addition to roughening the surface roughness for the purpose of increasing the bonding area or anchoring effect. Further, when the optical isolator element 10 and the magnet 6 are directly bonded via the bonding material 7, cracks may occur in the polarizers 1 and 3 due to a difference in thermal expansion coefficient. For this reason, it is desirable that the bonding surface 8 and the bonding surface 9 have a step structure as a structure that is not physically bonded. However, there is no limitation as long as there is a method in which both are not bonded by a jig or the like.

光アイソレータ素子10は、ガラス基板に誘電体粒子を内包するタイプや誘電体積層タイプなどの透過偏光方向と直交する偏光方向を吸収する偏光子1、3と、TbやGdもしくはHoを添加したBi置換ガーネットやYIGガーネットからなるファラデー回転子2から構成され、予め偏光子1と3の透過偏波面の角度が45°となるよう回転調芯された後、各々接合材により貼り合わせ固定される。   The optical isolator element 10 includes polarizers 1 and 3 that absorb a polarization direction orthogonal to a transmission polarization direction, such as a type in which dielectric particles are included in a glass substrate or a dielectric laminated type, and Bi added with Tb, Gd, or Ho. It is composed of a Faraday rotator 2 made of a substitution garnet or a YIG garnet, and is rotated and aligned in advance so that the angle of the transmission polarization plane of the polarizers 1 and 3 is 45 °, and then bonded and fixed by a bonding material.

この光アイソレータ素子10はLDモジュールからの信号光の光束面積を確保し、かつ整列基板5の接合面8内に収納することを考慮し、所定の大きさに切断して形成し接合面8に接着固定される。ファラデー回転子2に十分な飽和磁界強度を付与するための磁石4は、磁界強度の耐熱性に優れた直方体からなるSm−Co系やNd−Fe−B系の磁石が望ましい。   This optical isolator element 10 is formed by cutting into a predetermined size on the bonding surface 8 in consideration of securing the light beam area of the signal light from the LD module and accommodating it in the bonding surface 8 of the alignment substrate 5. Bonded and fixed. The magnet 4 for imparting a sufficient saturation magnetic field strength to the Faraday rotator 2 is preferably an Sm—Co based or Nd—Fe—B based magnet made of a rectangular parallelepiped excellent in heat resistance of the magnetic field strength.

磁石4は焼結体のため、作製時に粉末が磁石表面につき、異物として光アイソレータの光路を塞ぐ可能性がある他、作製時の不慮の作業にて磁力の引力により磁石同士が衝突して磁石が割れる可能性がある。それらを防止するために磁石の表面にNiなどのメッキを施すことが望ましい。   Since the magnet 4 is a sintered body, there is a possibility that the powder hits the magnet surface at the time of production, and may block the optical path of the optical isolator as a foreign substance. May break. In order to prevent them, it is desirable to plate Ni or the like on the surface of the magnet.

但し、ファラデー回転子2が自己保磁力を有するファラデー回転子2を用いる場合は磁石4が不要となる。   However, when the Faraday rotator 2 having a self-coercive force is used as the Faraday rotator 2, the magnet 4 is not necessary.

さらに、図2(a)は図1(a)に示した本発明の光アイソレータに、光学部品Xとして整列基板5に光アイソレータ素子10の入射側にレンズ21を配置した組立時の概略斜視図である。整列基板5は光アイソレータ素子10とレンズ21を含む光学部品Xを搭載する接合面8のほぼ中心線に光アイソレータ素子10、レンズ21の接合面よりも開口面積が小さく、かつ光アイソレータ素子10とレンズ21の双方に対面する溝部20を設けてある。ここで、接合面8とは、各光学部品Xの下面の面積全体をいう。   Further, FIG. 2A is a schematic perspective view of the optical isolator of the present invention shown in FIG. 1A in which the lens 21 is disposed on the alignment substrate 5 on the incident side of the optical isolator element 10 as the optical component X. It is. The alignment substrate 5 has an opening area smaller than the joint surface of the optical isolator element 10 and the lens 21 at the center line of the joint surface 8 on which the optical component X including the optical isolator element 10 and the lens 21 is mounted, and the optical isolator element 10. A groove 20 facing both the lenses 21 is provided. Here, the bonding surface 8 refers to the entire area of the lower surface of each optical component X.

この溝部20上に図1の実施の形態と同様に接合材7を溝部20の開口面積より溢れて開口から突出するように滴下して充填する。また、溝部20から溢れ出た接合材7は光アイソレータ素子10と磁石4の接合面積より小さい面積となるように広げ、接合材7上に光アイソレータ素子10とレンズ21を配置する。図2(b)は接着固定後の組立完成品の斜視図である。   As in the embodiment of FIG. 1, the bonding material 7 is dropped and filled on the groove 20 so as to overflow the opening area of the groove 20 and protrude from the opening. Further, the bonding material 7 overflowing from the groove 20 is expanded so as to have an area smaller than the bonding area between the optical isolator element 10 and the magnet 4, and the optical isolator element 10 and the lens 21 are disposed on the bonding material 7. FIG. 2B is a perspective view of the assembled product after adhesion and fixing.

図3に本発明の光アイソレータ素子10と整列基板5の接合面8と接合材7での接合状態について示す。接合面8のほぼ中央部に施した凹部6上にディスペンサを用いて接合材7を滴下する。滴下量については接合材7の粘性、ディスペンサの空気圧、接合材7が入っているシリンダー(不図示)の針穴径を調整して適宜設定し、凹部6の開口面から突出し、その開口面積より大きく凹部6を充填でき、光アイソレータ素子10の接着面より小さい滴下量とする。(a)に示すように、光アイソレータ素子10の接合面の中心位置と滴下した接合材7の中心位置が一致するように光アイソレータ素子10を配置、接触させた。光アイソレータ素子10の自重により、接合材7は光アイソレータ素子10〜接合面8で広がるが、表面張力により、(b)のように表面張力を維持できる範囲内で光アイソレータ素子10から微小にはみ出すか、もしくは(c)のように光アイソレータ素子10との接触面よりはみ出すことはなく、光アイソレータ素子10を微小サイズにしても凹部6を略中心として設置することができる。   FIG. 3 shows a bonding state between the bonding surface 8 and the bonding material 7 of the optical isolator element 10 and the alignment substrate 5 of the present invention. The bonding material 7 is dropped onto the concave portion 6 formed in the substantially central portion of the bonding surface 8 using a dispenser. The amount of dripping is appropriately set by adjusting the viscosity of the bonding material 7, the air pressure of the dispenser, and the diameter of the needle hole of the cylinder (not shown) containing the bonding material 7, and protrudes from the opening surface of the recess 6. The recessed portion 6 can be largely filled, and the amount of dripping is smaller than the adhesion surface of the optical isolator element 10. As shown to (a), the optical isolator element 10 was arrange | positioned and contacted so that the center position of the joint surface of the optical isolator element 10 and the center position of the dripped joining material 7 might correspond. Due to the weight of the optical isolator element 10, the bonding material 7 spreads on the optical isolator element 10 to the bonding surface 8. However, due to the surface tension, the bonding material 7 protrudes slightly from the optical isolator element 10 within the range where the surface tension can be maintained as shown in FIG. Or it does not protrude from the contact surface with the optical isolator element 10 as shown in (c), and even if the optical isolator element 10 has a very small size, the concave portion 6 can be set substantially at the center.

光アイソレータ素子10を接合材7と接触させた際に光アイソレータ素子10に押圧を施す場合があるが、押圧が大きすぎる場合や接合面8に対して垂直でない方向からの押圧の場合には、接合材7が光アイソレータ素子10の接触面からはみ出し、接合面8からもはみ出す場合があるため、押圧せずに自重にまかせたほうが望ましい。また、磁石4と整列基板5の接合面9との接合においても同様である。   When the optical isolator element 10 is brought into contact with the bonding material 7, the optical isolator element 10 may be pressed, but when the pressure is too large or when the pressure is not perpendicular to the bonding surface 8, Since the bonding material 7 may protrude from the contact surface of the optical isolator element 10 and may protrude from the bonding surface 8, it is preferable to leave the bonding material 7 under its own weight without pressing. The same applies to the bonding between the magnet 4 and the bonding surface 9 of the alignment substrate 5.

図4は本発明の光アイソレータの上面図を示す。半導体レーザ素子への近端反射による戻り光を抑制するため、光アイソレータ素子10は光軸に対して4〜10度°傾斜している。整列基板5の接合面8の横幅は光アイソレータ素子10がはみ出さないように適宜設定している。同様に、図5の本発明の光アイソレータに示すように光アイソレータ素子10は図4に示す直方体形状ではなく、上面図からみて平行四辺形形状で入射面と出射面が光軸に対して傾斜している四角柱でも良い。   FIG. 4 shows a top view of the optical isolator of the present invention. In order to suppress return light due to near-end reflection to the semiconductor laser element, the optical isolator element 10 is inclined by 4 to 10 degrees with respect to the optical axis. The lateral width of the bonding surface 8 of the alignment substrate 5 is appropriately set so that the optical isolator element 10 does not protrude. Similarly, as shown in the optical isolator of the present invention in FIG. 5, the optical isolator element 10 is not a rectangular parallelepiped shape shown in FIG. 4, but a parallelogram shape as viewed from the top view, and the incident surface and the outgoing surface are inclined with respect to the optical axis It may be a square pole.

なお、このような構成の光アイソレータは、LD(レーザダイオード)モジュール内に搭載時に透過偏光方向の位置合わせが容易である、TEC(Thermoelectric Cooler)上に搭載される。   The optical isolator having such a configuration is mounted on a TEC (Thermoelectric Cooler), which can easily align the transmission polarization direction when mounted in an LD (Laser Diode) module.

以下、本発明の実施例として図1に示す光アイソレータと、従来例として図7に示す光アイソレータを各100個作製し、歩留まりの比較を行った。   Hereinafter, 100 optical isolators shown in FIG. 1 as an example of the present invention and 100 optical isolators shown in FIG. 7 as a conventional example were manufactured, and yields were compared.

図1において、50Ni−Feからなり、寸法が幅3mm(接合面8の幅;1.2mm、接合面9の幅;0.9mm)×奥行き2mm×接合面8の高さ0.4mm(接合面9の高さ0.3mm)の整列基板5において接合面8,9のそれぞれの中央部にφ0.2mm、座繰り深さ0.1mmの凹部6を設けた。接合面8,9はショットブラスト処理をして面を粗く加工している。一方、光アイソレータ素子10は半導体レーザからの出射光のビーム径がφ0.8mmであるためにそれを包含するために□0.9mm×厚み0.8mmの直方体に切断して形成した。なお、光アイソレータ素子10の切断形成前に偏光子1、ファラデー回転子2、偏光子3は、予め偏光子1と3の透過偏波面の角度が45°となるよう回転調芯した後、接合材により貼り合わせ固定している。   In FIG. 1, it is made of 50Ni—Fe and has a width of 3 mm (width of the joint surface 8; 1.2 mm, width of the joint surface 9; 0.9 mm) × depth of 2 mm × height of the joint surface 8 of 0.4 mm (joint). In the alignment substrate 5 having a height 9 mm of the surface 9, a recess 6 having a diameter of 0.2 mm and a countersink depth of 0.1 mm was provided at the center of each of the bonding surfaces 8 and 9. The joint surfaces 8 and 9 are processed by shot blasting to roughen the surfaces. On the other hand, the optical isolator element 10 was formed by cutting into a rectangular solid of □ 0.9 mm × thickness 0.8 mm in order to include the beam diameter of the light emitted from the semiconductor laser, which is φ0.8 mm. Before the optical isolator element 10 is cut and formed, the polarizer 1, the Faraday rotator 2, and the polarizer 3 are rotated and aligned in advance so that the angle of the transmission polarization plane of the polarizers 1 and 3 is 45 °, and then bonded. It is bonded and fixed by the material.

接合面8の凹部6上にディスペンサにより接合材7を滴下してその上に光アイソレータ素子10のほぼ中央部と一致するように配置し、加熱により接合材を硬化固定した。このとき、偏光子1の透過偏波面は整列基板5の接合面8に対して平行になるように設置する。   The bonding material 7 was dropped onto the concave portion 6 of the bonding surface 8 by a dispenser, and the bonding material 7 was disposed thereon so as to coincide with the substantially central portion of the optical isolator element 10, and the bonding material was cured and fixed by heating. At this time, the transmission polarization plane of the polarizer 1 is installed so as to be parallel to the bonding surface 8 of the alignment substrate 5.

ファラデー回転子2に磁界を印加するための直方体形状(幅0.8mm×奥行き1.8mm×高さ1.2mm)の磁石6はSm−Co製であり、表面にはNiメッキを施している。 A rectangular parallelepiped magnet 6 (width 0.8 mm × depth 1.8 mm × height 1.2 mm) for applying a magnetic field to the Faraday rotator 2 is made of Sm—Co, and the surface thereof is plated with Ni. .

同様に接合面9の凹部6上にディスペンサにより接合材7を滴下してその上に磁石6のほぼ中央部と一致するように配置し、加熱により接合材を硬化固定した。今回は熱硬化性接合材を用いたが、接合力を確保できる紫外線硬化接合材、可視硬化接合材であってもよい。 Similarly, the bonding material 7 was dropped onto the concave portion 6 of the bonding surface 9 by a dispenser, and the bonding material 7 was arranged on the concave portion 6 so as to coincide with the substantially central portion of the magnet 6, and the bonding material was cured and fixed by heating. Although a thermosetting bonding material is used this time, an ultraviolet curable bonding material or a visible curable bonding material that can ensure bonding strength may be used.

図7に示す従来例の光アイソレータの整列基板5にはそれぞれの接合面に凹部6を施していない。作製方法は本発明実施例と同様である。   The alignment substrate 5 of the optical isolator of the conventional example shown in FIG. The manufacturing method is the same as that of the embodiment of the present invention.

表1に従来例の光アイソレータと本発明光アイソレータにおける、整列基板からの光アイソレータ素子のはみだし、光学素子クラック、整列基板からの接合材はみだし、整列基板からの磁石はみだしの歩留まりについての比較を示す。

Figure 0004683916
Table 1 shows a comparison between the optical isolator of the conventional example and the optical isolator of the present invention in terms of the yield of the optical isolator element protruding from the alignment substrate, the optical element crack, the bonding material protruding from the alignment substrate, and the magnet protruding from the alignment substrate. .
Figure 0004683916

本実施例の光アイソレータでは、光アイソレータ素子10と接合材7との滴下量と位置関係により整列基板5の接合面8中央部に固定されるため、光アイソレータ素子10が位置ずれを起こし、有効開口径小や磁石との接合による光学素子のクラック発生が無くなったため、従来例よりそれぞれ13%、18%改善できた。   In the optical isolator of this embodiment, since the optical isolator element 10 and the bonding material 7 are fixed to the central portion of the bonding surface 8 of the alignment substrate 5 depending on the dropping amount and positional relationship, the optical isolator element 10 is displaced and effective. Since there was no cracking of the optical element due to the small opening diameter and the joining with the magnet, it was improved by 13% and 18%, respectively, from the conventional example.

また、滴下する接合材6は接合面8、9の中央部の位置となり、接着量も制御されるために接合時の接合材の接合面8、9からのはみ出しは無くなり、光アイソレータ素子10と同様に磁石6においても整列基板5からのはみ出しが無くなるように制御することが可能となった。   Further, the dropped bonding material 6 is located at the center of the bonding surfaces 8 and 9, and the amount of adhesion is controlled, so that the bonding material does not protrude from the bonding surfaces 8 and 9 during bonding, and the optical isolator element 10 and Similarly, the magnet 6 can be controlled so as not to protrude from the alignment substrate 5.

これにより、従来例と比較して接合材7の整列基板5からのはみ出し、磁石6の整列基板5はみ出しについて、それぞれ8%、10%改善できた。さらに、組立上、接合材滴下位置が光アイソレータ素子10や磁石6の位置決めの目印にもなるため、接合面8,9に搭載時の作業効率も従来例と比較して30%改善できた。それとともに光アイソレータ素子10の位置決めが容易に出来ることから従来例と比較して光アイソレータ素子10のサイズも小さくすることが可能となる。上記より、従来例と比較して本実施例では、歩留まり改善、作業効率改善、小型化可能となるため低コストな光アイソレータを提供することが可能となった。   Thereby, compared with the conventional example, the protrusion of the bonding material 7 from the alignment substrate 5 and the protrusion of the alignment substrate 5 of the magnet 6 can be improved by 8% and 10%, respectively. Furthermore, since the bonding material dropping position becomes a mark for positioning the optical isolator element 10 and the magnet 6 in assembly, the working efficiency when mounted on the bonding surfaces 8 and 9 can be improved by 30% compared to the conventional example. At the same time, since the optical isolator element 10 can be easily positioned, the size of the optical isolator element 10 can be reduced as compared with the conventional example. From the above, it is possible to provide a low-cost optical isolator in this embodiment as compared with the conventional example because yield improvement, work efficiency improvement, and miniaturization are possible.

本発明の光アイソレータの組立斜視図である。It is an assembly perspective view of the optical isolator of the present invention. 本発明の光アイソレータの組立斜視図である。It is an assembly perspective view of the optical isolator of the present invention. 本発明の光アイソレータの接合概略図である。It is a junction schematic diagram of the optical isolator of the present invention. 本発明の光アイソレータの上面図である。It is a top view of the optical isolator of the present invention. 本発明の光アイソレータの上面図である。It is a top view of the optical isolator of the present invention. 従来の光アイソレータの斜視図である。It is a perspective view of the conventional optical isolator. 従来の光アイソレータの斜視図である。It is a perspective view of the conventional optical isolator.

符号の説明Explanation of symbols

1…偏光子
2…ファラデー回転子
3…偏光子
4…磁石
5…整列基板
6…凹部
7…接合材
8…光アイソレータ素子との接合面
9…磁石との接合面
10…光アイソレータ素子
20…溝部
21…レンズ
DESCRIPTION OF SYMBOLS 1 ... Polarizer 2 ... Faraday rotator 3 ... Polarizer 4 ... Magnet 5 ... Alignment board | substrate 6 ... Concave material 7 ... Bonding material 8 ... Bonding surface 9 with an optical isolator element ... Bonding surface 10 with a magnet ... Optical isolator element 20 ... Groove 21 ... Lens

Claims (2)

少なくとも偏光子とファラデー回転子からなる光アイソレータ素子を含む光学部品を整列基板上に接合材を介して接合してなる光アイソレータにおいて、上記整列基板の上記光学部品を搭載する面の中央部に上記光学部品の接合面よりも開口面積が小さい凹部を形成し、該凹部に充填されるとともに上記光学部品の接合面の周囲から表面張力を維持できる範囲内で微小にはみ出した上記接合材を介して上記光学部品が接合されていることを特徴とする光アイソレータ。 In an optical isolator in which an optical component including an optical isolator element including at least a polarizer and a Faraday rotator is bonded to an alignment substrate via a bonding material, a central portion of a surface of the alignment substrate on which the optical component is mounted is provided. A recess having a smaller opening area than the bonding surface of the optical component is formed, and the bonding material is filled in the recess and protrudes minutely within a range in which surface tension can be maintained from the periphery of the bonding surface of the optical component. An optical isolator, wherein the optical component is bonded. 少なくとも偏光子とファラデー回転子とからなる光アイソレータ素子を含む光学部品を整列基板上に接合材を介して接合してなる光アイソレータの製造方法において、上記整列基板の上記光学部品を搭載する面の中央部に上記光学部品の接合面よりも開口面積が小さい凹部を形成するとともに、該凹部に上記接合材を表面から溢れるとともに上記接合面に行き渡る滴下量となるように充填した後、上記光学部品を接合材上に配置し、表面張力を維持できる範囲内で接合面の周囲から微小にはみ出させた後、接合材を硬化させて上記光学部品と上記整列基板とを接合したことを特徴とする光アイソレータの製造方法。 In an optical isolator manufacturing method in which an optical component including an optical isolator element including at least a polarizer and a Faraday rotator is bonded to an alignment substrate via a bonding material, a surface of the alignment substrate on which the optical component is mounted A concave portion having an opening area smaller than the bonding surface of the optical component is formed in the central portion, and the optical material is filled in the concave portion so that the bonding material overflows from the surface and reaches the bonding surface. Is placed on the bonding material , protruded from the periphery of the bonding surface within a range in which the surface tension can be maintained , and then the bonding material is cured to bond the optical component and the alignment substrate. Manufacturing method of optical isolator.
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