JP4663068B2 - Optical element manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a color filter that is a constituent member of a color liquid crystal element used in a color television, a personal computer, a pachinko game machine, and the like, and an optical element such as an electroluminescence element having a plurality of light-emitting layers. More particularly, the present invention relates to an optical element manufactured by the manufacturing method and a liquid crystal element using a color filter which is one of the optical elements.
[0002]
[Prior art]
In recent years, with the development of personal computers, especially portable personal computers, the demand for liquid crystal displays, particularly color liquid crystal displays, has been increasing. However, cost reduction is necessary for further dissemination, and there is an increasing demand for cost reduction of color filters that are particularly heavy in terms of cost.
[0003]
Conventionally, various methods have been tried to meet the above-described requirements while satisfying the required characteristics of the color filter, but a method that satisfies all the required characteristics has not yet been established. Each method will be described below.
[0004]
The first method is a staining method. In the dyeing method, first, a water-soluble polymer material layer, which is a dyeing material, is formed on a transparent substrate, patterned into a desired shape by a photolithography process, and then the obtained pattern is immersed in a dyeing bath. To obtain a colored pattern. By repeating this step three times, a colored layer composed of three colored portions of R (red), G (green), and B (blue) is formed.
[0005]
The second method is a pigment dispersion method, which has been most actively performed in recent years. In this method, first, a photosensitive resin layer in which a pigment is dispersed is formed on a transparent substrate, and this is patterned to obtain a monochromatic pattern. By repeating this process three times, a colored layer composed of colored portions of R, G, and B is formed.
[0006]
There is an electrodeposition method as a third method. In this method, first, a transparent electrode is patterned on a transparent substrate, and immersed in an electrodeposition coating solution containing a pigment, a resin, an electrolytic solution, etc., and the first color is electrodeposited. This process is repeated three times to form a colored layer composed of three colored portions of R, G, and B, and finally fired.
[0007]
As a fourth method, a pigment is dispersed in a thermosetting resin, and printing is repeated three times to separate R, G, and B, and then the resin is thermally cured to form a colored layer. Is. In any method, a protective layer is generally formed on the colored layer.
[0008]
The point common to these methods is that it is necessary to repeat the same process three times in order to color the three colors of R, G, and B, resulting in high costs. Further, there is a problem that the yield decreases as the number of steps increases. Furthermore, in the electrodeposition method, the shape of the pattern that can be formed is limited, so that it is difficult to apply to the structure of a TFT type (active matrix driving method using a TFT, ie, a thin film transistor as a switching element) with the current technology. It is.
[0009]
Also, since the printing method has poor resolution, it is not suitable for forming a fine pitch pattern.
[0010]
In order to compensate for the above drawbacks, in recent years, a method for producing a color filter using an inkjet method has been actively studied. The method using the ink jet method has an advantage that the manufacturing process is simple and the cost is low.
[0011]
On the other hand, the ink jet method is not limited to the manufacture of color filters, but can also be applied to the manufacture of electroluminescent elements.
[0012]
An electroluminescence element has a structure in which a thin film containing a fluorescent inorganic and organic compound is sandwiched between a cathode and an anode, and excitons are obtained by injecting electrons and holes into the thin film and recombining them. Is generated by utilizing the emission of fluorescence when the exciton is deactivated. A fluorescent material used for such an electroluminescent element can be applied to a substrate on which an element such as a TFT is formed by an ink jet method to form a light emitting layer, whereby the element can be configured.
[0013]
[Problems to be solved by the invention]
As described above, since the ink jet system can simplify the manufacturing process and reduce the cost, it is applied to the manufacture of optical elements such as color filters and electroluminescent elements. However, in the manufacture of such an optical element, there are problems such as “color mixing” and “white spot” as problems peculiar to the ink jet system. Hereinafter, a case where a color filter is manufactured will be described as an example.
[0014]
“Mixed color” is a failure that occurs when ink is mixed between adjacent pixels (colored portions) of different colors. In the manufacturing method of the color filter in which the black matrix is used as a partition and ink is applied to the opening of the black matrix to form a colored portion, the volume is several to several tens of times the volume of the opening of the black matrix. It is necessary to apply an ink having When the solid content concentration of the colorant or the curing component contained in the ink is high, that is, when the volume of the applied ink is relatively small, the black matrix functions sufficiently as a partition wall, and the inside of the opening of the black matrix Since the ink can be held, the applied ink does not go over the black matrix and reach the colored portions of different colors adjacent to each other. However, when the solid concentration in the ink is low, that is, when it is necessary to apply a large amount of ink, the ink overflows beyond the black matrix serving as the partition wall, and color mixing occurs between adjacent colored portions. Resulting in. In particular, there is a limit to the viscosity of ink that can be stably ejected from the nozzles of an inkjet head, and there is also a limit to the concentration of solids contained in the ink, so a technique for avoiding color mixing is necessary. .
[0015]
In view of this, a method for preventing color mixing by utilizing a difference in wettability of ink between the colored portion and the partition wall has been proposed. For example, Japanese Patent Application Laid-Open No. 59-75205 proposes a method of forming a diffusion prevention pattern with a substance having poor wettability in order to prevent the ink from spreading outside the target area. Not disclosed. On the other hand, JP-A-4-123005 proposes a method of patterning a silicone rubber layer having a large water and oil repellency to form a partition wall for preventing color mixing. Further, JP-A-5-241011 and JP-A-5-241012 similarly disclose a method in which a silicone rubber layer is formed on a black matrix serving as a light shielding layer and used as a partition for preventing color mixing.
[0016]
According to these methods, even when an amount of ink far exceeding the height of the partition is applied, the surface layer of the partition shows ink repellency so that the ink is repelled, and the adjacent colored portion beyond the partition. Therefore, it is possible to effectively prevent color mixing.
[0017]
The conceptual diagram is shown in FIG. In the figure, 31 is a transparent substrate, 33 is a black matrix that also serves as a partition, and 36 is ink. When the upper surface of the black matrix 33 has ink repellency, as shown in FIG. 3B, the applied ink 36 is held in the opening of the black matrix 33 and reaches the adjacent colored portion. There is no. However, when the ink repellency on the upper surface of the black matrix 33 is low, as shown in FIG. 3A, the applied ink 36 spreads over the black matrix 33 and is applied to the adjacent openings. It mixes with ink.
[0018]
In general, it is possible to obtain better ink repellency by using a fluorine compound than by using a silicon compound. For example, Japanese Patent Laid-Open No. 2000-35511 discloses a method of forming a positive resist pattern on a light shielding portion and further applying an ink repellent treatment agent on the pattern. The use of fluorine compounds is disclosed. However, in this method, it is necessary to remove the positive resist pattern provided on the light-shielding portion after forming the colored portion. However, when the resist pattern is removed, problems such as dissolution, peeling, and swelling of pixels may occur. is there.
[0019]
As a method for fluorinating the surface of the resin layer, Japanese Patent Application Laid-Open No. 6-65408 proposes a method in which a reaction gas of a fluorine compound is converted into plasma. Further, as an example in which this technique is applied to a color filter, in Japanese Patent Laid-Open No. 11-271753, the partition wall has a multilayer structure of a lower layer having affinity for ink and an upper layer having non-affinity, and the upper layer is used for ink. As a technique for making it non-affinity, a plasma treatment method using a gas containing a fluorine compound is disclosed.
[0020]
However, any of the above-described methods is to multi-layer the partition walls, and it is necessary to carry out the photolithography process a plurality of times. Therefore, there is a problem that the process is complicated, the cost is increased, and the yield is lowered.
[0021]
On the other hand, “blank” is a failure that occurs mainly because the applied ink cannot be sufficiently and uniformly diffused in the area surrounded by the partition walls, such as color unevenness and a decrease in contrast. It causes display failure.
[0022]
FIG. 4 shows a conceptual diagram of white spots. In the figure, the same members as those in FIG. Reference numeral 38 denotes a white portion.
[0023]
In recent years, in the color filter for TFT type liquid crystal elements, the shape of the opening of the black matrix 33 has become complicated for the purpose of protecting the TFT from external light or obtaining a bright display by increasing the aperture ratio. In addition, since those having a plurality of corner portions are generally used, as shown in FIG. 4A, there is a problem that the ink 36 does not sufficiently diffuse to the corner portions. Further, when forming the black matrix 33, a photolithography process using a resist is generally used, and contaminants adhere to the surface of the transparent substrate 31 due to various components contained in the resist. This may hinder the diffusion of 36. Furthermore, when the ink repellency on the side surface of the black matrix 33 is extremely high compared to the surface of the transparent substrate 31, the ink 36 is repelled on the side surface of the black matrix 33 as shown in FIG. There may be a problem that the color becomes light at the portion where the ink 36 and the black matrix 33 are in contact.
[0024]
As a technique for solving such problems of color mixture and white spots, in Japanese Patent Application Laid-Open No. 9-203803, a region (concave portion) surrounded by a black matrix (convex portion) has a contact angle of 20 ° or less with respect to water. It has been proposed to use a substrate that has been subjected to ink-philic treatment so that Examples of methods for imparting ink affinity include water-soluble leveling agents and water-soluble surfactants. Furthermore, in order to solve the above-mentioned problem of color mixing at the same time, a technique for imparting ink repellency by treating the surface of the convex portion with an ink repellent treatment agent in advance has been disclosed. A method of coating with a fluorinated solvent using a silane coupling agent is exemplified. At this time, as a method for selectively repelling only the surface layer of the convex portion and not repelling the side surface of the convex portion,
(1) Two kinds of materials are laminated so that the convex part itself has such a property.
(2) Cover the portions other than the convex portions with a resist, and perform ink repellent treatment only on the upper surfaces of the convex portions.
(3) A method is exemplified in which a resist layer is formed on a transparent substrate, the entire surface is subjected to ink repellent treatment, and then the resist layer is patterned by a photolithography process to form convex portions.
[0025]
Similarly, Japanese Patent Application Laid-Open No. 9-230129 discloses a method of irradiating energy rays as a method of making a concave portion an ink-philic process. Also in this case, as a method of performing the ink repellent treatment only on the surface layer of the convex portion, a photosensitive material for forming the convex portion is applied on a glass substrate, and the entire surface is treated with an ink repellent treatment agent, and then photo A technique for patterning a photosensitive material by a lithography process is illustrated. Thereafter, the convex portion and the concave portion are simultaneously or selectively subjected to ink-inking treatment by irradiation with energy rays.
[0026]
However, all of these methods are such that the surface of the convex portion is subjected to the ink repellent treatment and then the concave portion is subjected to the ink repellent treatment. There is a problem that the ink repellency is lowered. Therefore, it is difficult to obtain sufficient ink affinity on the transparent substrate surface and the side surface of the black matrix, and sufficient ink repellency on the upper surface of the black matrix.
[0027]
The above problem also occurs when an electroluminescent element is manufactured by an ink jet method. That is, in an electroluminescence element, for example, when an organic semiconductor material that emits R, G, and B light is used as an ink, and the ink is applied to a region surrounded by a partition wall to form a pixel (light emitting layer). When ink is mixed between adjacent light emitting layers, there arises a problem that the light emitting layer cannot emit light having a desired color and luminance. Even in the case of a single color light emitting layer, the amount of ink filled in the partition is made uniform, so when ink flows into adjacent pixels, the amount of ink becomes non-uniform, which is recognized as luminance unevenness, which is a problem. It becomes. Further, when the ink is not sufficiently diffused in the region surrounded by the partition walls, there is a problem that sufficient light emission luminance cannot be obtained at the boundary portion between the light emitting layer and the partition walls. In the following description, for the sake of convenience, even when an electroluminescent element is manufactured, the mixing of ink between adjacent light emitting layers is “mixed color”, and the light emission luminance due to the repulsion of ink at the boundary between the light emitting layer and the partition wall. The occurrence of unevenness is referred to as “white spots”.
[0028]
An object of the present invention is to solve the above problems and provide a highly reliable optical element with a high yield when an optical element such as a color filter or an electroluminescence element is manufactured at low cost by a simple process using an inkjet method. There is. Specifically, when ink is applied to the area surrounded by the partition walls, color mixing between adjacent pixels is prevented, and the ink is sufficiently diffused in the area so that pixels without white spots are formed. It is to form. A further object of the present invention is to provide a liquid crystal element excellent in color display characteristics at a lower cost by using the optical element obtained by the production method.
[0029]
[Means for Solving the Problems]
  A first aspect of the present invention is a method for producing an optical element having at least a partition made of a resin composition located between a plurality of pixels and adjacent pixels on a support substrate,
  Forming a partition made of a resin composition on a support substrate;
  A step of carrying out an ink repellency treatment on the surface of the support substrate and the side wall of the partition wall exposed in the region surrounded by the partition wall;
  Forming a negative photosensitive resin composition layer on the entire surface of the support substrate on which the partition walls are formed;
  Exposing the photosensitive resin composition layer in a region surrounded by the partition wall by exposing the negative photosensitive resin composition layer from the back surface of the support substrate using the partition wall as a mask;
  Removing the unexposed photosensitive resin composition layer;
  Fluorination treatment is applied to the upper surface of the partitionTo improve the ink repellency of the upper surface of the partition wallProcess,
  In the area surrounded by the bulkheadPhotosensitivityResin compositionlayerRemoving the
  Forming a pixel by applying ink to a region surrounded by a partition wall by an inkjet method; and
  In this order,
  The partition is a light shielding layer,
  In the optical element manufacturing method, the fluorination treatment is a plasma treatment in which a gas containing at least fluorine atoms is introduced to perform plasma irradiation on the surface of the partition wall.
[0030]
  In the present invention, the partition is formed of a resin composition containing carbon black.TheIt is included as a preferred embodiment.
[0031]
  Furthermore, the present invention,UpThe ink-inking process is any one of an alkaline aqueous cleaning process, a UV cleaning process, an excimer cleaning process, a corona discharge process, and an oxygen plasma process, and the ink contains at least a curing component, water, and an organic solvent. The ink contains a colorant and a color filter in which a pixel is a colored portion is manufactured, or an electroluminescent element in which the pixel is a light emitting layer is manufactured as a preferred embodiment.
[0035]
DETAILED DESCRIPTION OF THE INVENTION
In the method for producing an optical element of the present invention, the opening of the partition formed on the support substrate is filled with a resin composition, and the upper surface of the partition is subjected to fluorination treatment while protecting the side of the partition and the surface of the support substrate. The ink repellency is increased and the resin composition is removed, and then ink is applied to the region surrounded by the partition wall by an ink jet method to form a pixel. Therefore, in the present invention, when ink is applied, a large amount of ink is well retained by the ink repellency on the upper surface of the partition wall to prevent color mixing. Ink spreads on the surface and white spots are prevented.
[0036]
In the present invention, the above “ink” is a generic term for, for example, optically and electrically functional liquids after being dried and cured, and is not limited to conventionally used coloring materials.
[0037]
Examples of the optical element of the present invention manufactured by the manufacturing method of the present invention include a color filter and an electroluminescence element. First, embodiments of the optical element of the present invention will be described.
[0038]
FIG. 8 schematically shows a cross section of an example of a color filter which is an embodiment of the optical element of the present invention. In the figure, 101 is a transparent substrate as a support substrate, 102 is a black matrix that also serves as a partition, 103 is a colored portion that is a pixel, and 104 is a protective layer that is formed as necessary. When a liquid crystal element is formed using the color filter of the present invention, ITO (indium tin oxide) for driving the liquid crystal is formed on the colored portion 103 or on the protective layer 104 formed on the colored portion 103. A transparent conductive film made of a transparent conductive material such as oxide) may be formed and provided.
[0039]
FIG. 9 is a schematic cross-sectional view of an embodiment of the liquid crystal element of the present invention, which is configured using the color filter of FIG. In the figure, 107 is a common electrode (transparent conductive film), 108 is an alignment film, 109 is a liquid crystal, 111 is a counter substrate, 112 is a pixel electrode, and 113 is an alignment film. Therefore, the description is omitted.
[0040]
A color liquid crystal element is generally formed by combining a substrate 101 on the color filter side and a counter substrate 111 and enclosing a liquid crystal 109. TFTs (not shown) and pixel electrodes 112 are formed in a matrix inside one substrate 111 of the liquid crystal element. Further, a color filter coloring portion 103 is formed inside the substrate 101 on the color filter side so that R, G, and B are arranged at a position facing the pixel electrode 112, and a transparent common electrode is formed thereon. 107 is formed. Further, alignment films 108 and 113 are formed in the planes of both substrates, and liquid crystal molecules are arranged in a certain direction. These substrates are arranged to face each other via a spacer (not shown), are bonded together by a sealing material (not shown), and the gap is filled with liquid crystal 109.
[0041]
When the liquid crystal element is a transmissive type, the substrate 111 and the pixel electrode 112 are formed of a transparent material, a polarizing plate is bonded to the outside of each substrate, and a backlight that generally combines a fluorescent lamp and a scattering plate. Is used to make the liquid crystal compound function as an optical shutter that changes the light transmittance of the backlight. In the case of a reflective type, the substrate 111 or the pixel electrode 112 is formed of a material having a reflection function, or a reflective layer is provided on the substrate 111, and a polarizing plate is provided outside the transparent substrate 101. Display is performed by reflecting light incident from the filter side.
[0042]
FIG. 7 shows a schematic cross-sectional view of an example of an organic electroluminescence element (hereinafter referred to as “EL element”), which is another embodiment of the optical element of the present invention. In the figure, 91 is a drive substrate as a support substrate, 92 is a partition, 93 is a light emitting layer as a pixel, 94 is a transparent electrode, and 96 is a metal layer. In this figure, only one pixel region is shown for simplification.
[0043]
The driving substrate 91 has a multi-layered structure of TFTs (not shown), wiring films, insulating films, etc., and a voltage can be applied in units of light emitting layers between the transparent electrodes 94 disposed for each of the metal layers 96 and the light emitting layers 93. It is configured. The drive substrate 91 is manufactured by a known thin film process.
[0044]
The structure of the organic EL device of the present invention is such that at least one of a pair of anode and cathode that is transparent or translucent is filled with at least a light emitting material in a partition made of a resin composition. For example, there is no particular limitation, and a known structure can be adopted, and various modifications can be made without departing from the gist of the present invention.
[0045]
The laminated structure is, for example,
(1) Electrode (cathode) / light emitting layer / hole injection layer / electrode (anode)
(2) Electrode (anode) / light emitting layer / electron injection layer / electrode (cathode)
(3) Electrode (anode) / hole injection layer / light emitting layer / electron injection layer / electrode (cathode)
(4) Electrode (anode or cathode) / light emitting layer / electrode (cathode or anode)
However, the present invention can also be applied to an EL element having a stacked structure in which an organic compound layer having any one of the above structures is provided.
[0046]
  Above (1) is a two-layer structure, (3) is a three-layer structure,(4) is a single-layer structureConstructionIt is called. Although the organic EL element of the present invention is based on these laminated structures, it may have a structure obtained by combining (1) to (4) other than these or a plurality of layers. Further, a full color display may be realized by combining with a color filter. The shape, size, material, manufacturing method, and the like of the organic EL element of the present invention having such a laminated structure are appropriately selected according to the use of the organic EL element, and there are no particular restrictions on these.
[0047]
The light emitting material used for the light emitting layer of the organic EL device of the present invention is not particularly limited, and various materials can be applied. Specifically, low molecular phosphors and polymer phosphors are preferable, and polymer phosphors are more preferable.
[0048]
For example, the low molecular organic compound is not particularly limited, but naphthalene and derivatives thereof, anthracene and derivatives thereof, perylene and derivatives thereof, polymethine, xanthene, coumarin, and cyanine dyes, 8-hydroxyquinoline, and the like. And metal complexes of the derivatives thereof, aromatic amines, tetraphenylcyclopentadiene and derivatives thereof, tetraphenylbutadiene and derivatives thereof, and the like can be used. Specifically, for example, known ones such as those described in JP-A-57-51781 and JP-A-59-194393 can be used.
[0049]
In addition, the high molecular organic compound that can be used as the light emitting material is not particularly limited, and examples thereof include polyphenylene vinylene, polyarylene, polyalkylthiophene, and polyalkylfluorene.
[0050]
The polymeric fluorescent substance used in the organic EL device of the present invention may be a random, block or graft copolymer, or a polymer having an intermediate structure thereof, for example, a random copolymer having a block property. It may be a polymer. From the viewpoint of obtaining a polymer fluorescent substance having a high fluorescence quantum yield, a random copolymer having a block property and a block or graft copolymer are preferable to a complete random copolymer. In addition, since the organic EL element of the present invention utilizes light emission from a thin film, the polymer fluorescent substance having fluorescence in a solid state is used.
[0051]
Examples of the good solvent for the polymeric fluorescent substance include chloroform, methylene chloride, dichloroethane, tetrahydrofuran, toluene, xylene and the like. Although depending on the structure and molecular weight of the polymeric fluorescent substance, it can usually be dissolved in these solvents in an amount of 0.1% by weight or more.
[0052]
In the organic EL device of the present invention, an electron transport property used in an electron transport layer when an electron transport layer is further provided between a layer containing a light emitting material and a cathode, or mixed with a hole transport material and a light emitting material. The material has a function of transmitting electrons injected from the cathode to the light emitting material. There is no restriction | limiting in particular about such an electron transport material, Arbitrary things can be selected and used from a conventionally well-known compound.
[0053]
Preferable examples of the electron transporting material include nitro-substituted fluorenone derivatives, anthraquinodimethane derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, heterocyclic tetracarboxylic acid anhydrides, and carbodiimides.
[0054]
Further examples include fluorenylidenemethane derivatives, anthraquinodimethane derivatives and anthrone derivatives, oxadiazole derivatives, and the like. Further, although disclosed as a material for forming a light-emitting layer, 8-hydroxyquinoline and metal complexes of derivatives thereof can also be used as an electron transporting material.
[0055]
Next, a typical method for manufacturing an organic EL element having a laminated structure as an example of the present invention will be described. As a pair of electrodes composed of an anode and a cathode, as a transparent or translucent electrode, for example, a transparent substrate such as transparent glass or transparent plastic on which a transparent or translucent electrode is formed is used.
[0056]
In the EL device of the present invention, the light emitting layer is generally combined with an appropriate binder resin to form a thin film. The binder can be selected from a wide range of binder resins such as polyvinyl carbazole resin, polycarbonate resin, polyester resin, polyarylate resin, butyral resin, polystyrene resin, polyvinyl acetal resin, diallyl phthalate resin, acrylic resin, methacrylic resin. , Phenol resin, epoxy resin, silicone resin, polysulfone resin, urea resin and the like, but are not limited thereto. These may be used alone or in combination as a copolymer polymer.
[0057]
As the anode material, a material having a work function as large as possible is preferable. For example, nickel, gold, platinum, palladium, selenium, rhenium, iridium or an alloy thereof, tin oxide, indium tin oxide (ITO), or copper iodide is preferable. In addition, conductive polymers such as poly (3-methylthiophene), polyphenylene sulfide, and polypyrrole can also be used.
[0058]
On the other hand, silver, lead, tin, magnesium, aluminum, calcium, manganese, indium, chromium, or alloys thereof having a small work function are used as the cathode material.
[0059]
Hereinafter, a method for producing an optical element of the present invention will be described with reference to the drawings.
[0060]
1 and 2 are process diagrams schematically showing a method for producing an optical element of the present invention. Each step will be described below. The following steps (a) to (h) correspond to (a) to (h) in FIGS. 1 and 2, (a-1) to (h-1) on the left side of the drawing are schematic plan views of the substrate, and (a-2) to (h-2) on the right side of the drawing are (a-). It is an AB sectional schematic diagram of 1) to (h-1). In the figure, 1 is a support substrate, 2 is a resin composition layer, 3 is a partition, 4 is an opening of the partition 3, 5 is a resin composition, 6 is an inkjet head, 7 is ink, and 8 is a pixel.
[0061]
Step (a)
A support substrate 1 is prepared. The support substrate 1 is a transparent substrate 101 in the case of manufacturing the color filter illustrated in FIG. 8, and a glass substrate is generally used. However, for the purpose of constituting a liquid crystal element, desired transparency and mechanical strength are used. A plastic substrate or the like can be used as long as it has the necessary characteristics.
[0062]
When the EL element illustrated in FIG. 7 is manufactured, the support substrate 1 is the drive substrate 91 on which the transparent electrode 94 is formed. When light emission is observed from the substrate side as shown in FIG. A transparent substrate such as a glass substrate is used for 91. It is preferable to subject the surface of the substrate to surface treatment such as plasma treatment, UV treatment, or coupling treatment so that the material of the light emitting layer 93 is easily attached in a later step.
[0063]
Step (b)
A resin composition layer 2 for forming the partition walls 3 is formed on the support substrate 1. The partition 3 according to the present invention corresponds to the black matrix 102 in the case of the color filter of FIG. 8, and corresponds to the partition 92 in the case of the electroluminescence element of FIG. The partition 3 is preferably a light-shielding layer that shields between adjacent pixels, as shown by 102 in FIG. 8, particularly in the case of manufacturing a color filter. In this case, the black matrix 102 as shown in FIG. Or a black stripe. In addition, a light shielding layer can also be used when manufacturing an EL element.
[0064]
In the present invention, the resin composition used for forming the partition walls 3 is a photosensitive resin such as an epoxy resin, an acrylic resin, a polyimide resin containing polyamide-imide, a urethane resin, a polyester resin, or a polyvinyl resin. Alternatively, a non-photosensitive resin material can be used, but it preferably has a heat resistance of 250 ° C. or higher. From this point, an epoxy resin, an acrylic resin, or a polyimide resin is preferably used.
[0065]
Moreover, when using this partition 3 as a light shielding layer, the resin composition layer 2 is formed using the black resin composition which disperse | distributed the light shielding agent in the said resin composition. As the light-shielding agent, it is desirable to use carbon black. As the carbon black, those manufactured by a contact method called channel black, roller black, disk black, gas furnace black, oil furnace black It is possible to use those manufactured by the furnace method called thermal black, thermal black, those manufactured by the thermal method called acetylene black, etc., especially channel black, gas furnace black, oil Furnest black is preferred. If necessary, a mixture of R, G, and B pigments may be added. Moreover, the black resist generally marketed can also be used. If necessary, a light-shielding layer with a high resistance may be used.
[0066]
The resin composition layer 2 can be formed by a method such as spin coating, roll coating, bar coating, spray coating, dip coating, or printing.
[0067]
Step (c)
When a photosensitive material is used as the resin composition layer 2, the partition wall 3 having a plurality of openings 4 is formed by patterning by photolithography or the like. When a non-photosensitive material is used, it may be formed by patterning by wet or dry etching or lift-off using a photoresist as a mask.
[0068]
Step (d)
A region surrounded by the partition 3, that is, the opening 4 is filled with the resin composition 5. The resin composition 5 used here is used to protect the surface of the support substrate 1 exposed to the openings 4 and the side surfaces of the partition walls 3 in the fluorination treatment described later. Therefore, the resin composition 5 fills and fills the opening 4 of the partition wall 3.
[0069]
Examples of the method for filling the resin composition 5 in the opening 4 include the following methods.
(1) A negative photosensitive resin composition layer is formed on the entire surface of the support substrate 1, and the photosensitive resin composition layer in a region surrounded by the partition walls 3 is exposed to form an unexposed photosensitive resin composition. Remove. In particular, when the partition wall 3 is formed as a light shielding layer, the entire surface is exposed from the back surface of the support substrate 1 using the light shielding layer 3 as a mask.
(2) A resin composition layer is formed on the entire surface of the support substrate 1, and the resin composition is removed by dry etching using oxygen plasma until the upper surface of the partition wall 3 is reached.
(3) A resin composition is selectively applied into the opening 4 by an inkjet method.
(4) A positive photosensitive resin composition layer is formed on the entire surface of the support substrate 1, and the photosensitive resin composition layer on the partition walls 3 is exposed and developed and removed.
[0070]
In this invention, it is not limited to the method of said (1)-(4). Moreover, as the resin composition 5 to be used, it is necessary to use what can be removed after the fluorination process mentioned later. Furthermore, in the present invention, it is preferable to perform an ink affinity treatment on the surface of the support substrate 1 and the side surfaces of the partition wall 3 in advance before filling the opening 4 with the resin composition 5. For example, methods such as cleaning with an alkaline aqueous solution, UV cleaning, excimer cleaning, corona discharge, and oxygen plasma are preferably used.
[0071]
Step (e)
A fluorination treatment is performed on the upper surface of the partition wall 3 to increase the ink repellency of the treated region. As a method of the fluorination treatment, since the process is simple and the surface of the partition wall 3 made of the resin composition can be effectively fluorinated, plasma that irradiates plasma by introducing a gas containing at least fluorine atoms. Treatment is preferably used.
[0072]
The gas introduced at this step containing at least fluorine atoms is CF._Four, CHF_Three, C₂F₆, SF₆, C_ThreeF₈, C_FiveF₈It is preferable to use at least one halogen gas selected from In particular, C_FiveF₈(Octafluorocyclopentene) has zero ozone depletion ability and has an atmospheric lifetime (CF less than that of conventional gas)._Four: 50,000 years, C_FourF₈: 3200) 0.98, very short. Therefore, the global warming potential is 90 (CO₂= 100 years integrated value = 2) and (CF) compared with conventional gas_Four: 6500, C_FourF₈: 8700) Very small, extremely effective for protecting the ozone layer and the global environment, and desirable for use in the present invention.
[0073]
Further, as the introduced gas, a gas such as oxygen, argon, or helium may be used in combination as necessary. In the present invention, the CF_Four, CHF_Three, C₂F₆, SF₆, C_ThreeF₈, C_FiveF₈At least one halogen gas selected from₂If the mixed gas is used, it is possible to control the degree of ink repellency on the surface of the partition wall 3 to be fluorinated in this step. However, in the mixed gas, O₂If the mixing ratio exceeds 30%, O₂Oxidation reaction due to becomes dominant and the effect of improving ink repellency is hindered.₂When the mixing ratio exceeds 30%, damage to the resin becomes significant.₂It is necessary to use in a range where the mixing ratio is 30% or less.
[0074]
In addition, plasma generation methods such as low frequency discharge, high frequency discharge, and microwave discharge can be used. Conditions such as pressure, gas flow rate, discharge frequency, and processing time during plasma processing are arbitrarily set. can do.
[0075]
5 and 6 are schematic views of a plasma generator that can be used in the plasma treatment step. In the figure, 51 is an upper electrode, 52 is a lower electrode, 53 is a substrate to be processed, and 54 is a high-frequency electrode. The apparatus generates a plasma by applying a high-frequency voltage to two electrodes on parallel plates. FIG. 5 shows a cathode coupling system, and FIG. 6 shows an anode coupling system. In either system, the ink repellency on the surface of the partition wall 3 is desired depending on conditions such as pressure, gas flow rate, discharge frequency, treatment time, and the like. The degree can be as follows.
[0076]
In the plasma generator shown in FIGS. 5 and 6, the cathode coupling method of FIG. 5 can shorten the processing time, which is advantageous for the processing step. Further, the anode coupling method of FIG. 6 is advantageous in that the support substrate 1 is not damaged more than necessary. Therefore, the plasma generator used in this step may be selected according to the material of the support substrate 1 and the partition 3.
[0077]
Step (f)
The resin composition 5 filled in the opening 4 is removed. The method of removing the resin composition 5 differs depending on the material of the resin composition 5 used, but a method that does not adversely affect the adhesion to the partition walls 3 and the ink repellency of the upper surface of the fluorinated partition walls 3. It is necessary to use it. For example, when the filling method (1) is used in the step (d) described above, a negative photosensitive resin composition that can be developed with water or a weak alkaline aqueous solution (for example, about pH 9 to 10) is used as the photosensitive resin composition. It may be used after being swollen with an alkaline aqueous solution of strong alkali (for example, about pH 11 to 12) and then peeled off by a high pressure shower. Further, when the filling methods (2) and (3) are used, it is not necessary to have curability as long as the resin composition has a film property, and a resin composition that is soluble in water or an organic solvent is used. It can be dissolved and removed using water or an organic solvent. Furthermore, when the filling method (4) is used, since a commercially available positive resist can be used, it can be dissolved and removed by exposure and development, or an organic solvent.
[0078]
Through these series of steps, only the upper surface of the partition wall 3 is fluorinated to have ink repellency, and the surface of the support substrate 1 exposed to the opening 4 and the side surface of the partition wall 3 have ink affinity are obtained. Can do.
[0079]
Step (g)
The ink 7 is applied from the ink jet head 6 to the region (opening 4) surrounded by the partition walls 3 using an ink jet recording apparatus. As the ink jet, a bubble jet type using an electrothermal transducer as an energy generating element, a piezo jet type using a piezoelectric element, or the like can be used. The ink 7 includes a colorant of each color so as to form a colored portion of R, G, B after curing in the case of a color filter. In the case of an EL element, the ink 7 emits light by application of a voltage after curing. A material for forming the light emitting layer is used. In any case, the ink 7 preferably contains at least a curing component, water, and a solvent. Hereinafter, the composition of the ink used when the color filter is produced by the production method of the present invention will be described in more detail.
[0080]
[1] Colorant
As the colorant to be contained in the ink in the present invention, both dyes and pigments can be used. However, when a pigment is used, it is necessary to add a separate dispersant in order to uniformly disperse in the ink. A dye-based colorant is preferably used because the ratio of the colorant in the total solid content becomes low. Moreover, it is preferable that it is the same amount or less as the addition amount of a coloring agent with the hardening component mentioned later.
[0081]
[2] Curing component
In consideration of process resistance, reliability, and the like in the subsequent step, it is preferable to contain a component that is cured by a heat treatment or light irradiation and immobilizes the colorant, that is, a crosslinkable monomer or polymer. In particular, it is preferable to use a curable resin composition in consideration of heat resistance in the subsequent process. Specifically, for example, as a base resin, acrylic resin having a functional group such as hydroxyl group, carboxyl group, alkoxy group, amide group, silicone resin; or cellulose derivatives such as hydroxypropylcellulose, hydroxyethylcellulose, methylcellulose, carboxymethylcellulose, or These modified products; or vinyl polymers such as polyvinyl pyrrolidone, polyvinyl alcohol, and polyvinyl acetal. Furthermore, it is possible to use a crosslinking agent and a photoinitiator for curing these base resins by light irradiation or heat treatment. Specifically, melamine derivatives such as methylolated melamine are used as crosslinking agents, and dichromate, bisazide compounds, radical initiators, cationic initiators, anionic initiators, etc. are used as photoinitiators. Is possible. Moreover, these photoinitiators can also be used by mixing multiple types or combining with another sensitizer.
[0082]
[3] Solvent
As the ink medium used in the present invention, a mixed solvent of water and an organic solvent is preferably used. As water, it is preferable to use ion-exchanged water (deionized water) instead of general water containing various ions.
[0083]
Examples of the organic solvent include alkyl alcohols having 1 to 4 carbon atoms such as methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol; dimethylformamide, dimethylacetamide Amides such as acetone, ketones such as acetone and diacetone alcohol, or ethers such as tetrahydrofuran and dioxane, polyalkylene glycols such as polyethylene glycol and polypropylene glycol, ethylene glycol, propylene glycol, butylene glycol, and triethylene Alkylene glycols containing 2 to 4 carbons such as glycol, thiodiglycol, hexylene glycol, diethylene glycol, etc. Glycerins; Lower alkyl ethers of polyhydric alcohols such as ethylene glycol monomethyl ether, diethylene glycol methyl ether, triethylene glycol monomethyl ether; N-methyl-2-pyrrolidone, 2-pyrrolidone, etc. Is preferred.
[0084]
In addition to the above components, two or more kinds of organic solvents having different boiling points may be used in combination to obtain an ink having a desired physical property value, if necessary, or a surfactant, antifoaming agent, preservative. Etc. may be added.
[0085]
Step (h)
The pixel 8 is formed by performing necessary processing such as heat treatment and light irradiation, removing the solvent component in the ink 7 and curing it.
[0086]
Furthermore, in the case of a color filter, as described above, a protective layer and a transparent conductive film are formed as necessary. As the protective layer in this case, a photocuring type, a thermosetting type, or a photothermal combined curing type resin material, or an inorganic film formed by vapor deposition, sputtering, or the like can be used. Any material can be used as long as it has transparency and can withstand a subsequent transparent conductive film formation process, alignment film formation process, and the like. Moreover, you may form a transparent conductive film directly on a coloring part, without passing through a protective layer. In the case of an EL element, a necessary member such as a metal layer is formed on the pixel.
[0087]
【Example】
Example 1
[Formation of black matrix]
A black resist containing carbon black (“V-259BK resist” manufactured by Nippon Steel Chemical Co., Ltd.) is applied onto a glass substrate (Corning “1737”), and subjected to predetermined exposure, development, and post-baking treatment to obtain a film thickness of 2 μm. A black matrix pattern (partition) having a rectangular opening of 75 μm × 225 μm was prepared.
[0088]
[Ink adjustment]
Using an acrylic copolymer having the composition shown below as a thermosetting component, R, G, and B inks were prepared with the following compositions.
[0089]
Curing component
50 parts by weight of methyl methacrylate
30 parts by weight of hydroxyethyl methacrylate
N-methylolacrylamide 20 parts by weight
[0090]
R ink
C. I. Acid Orange 148 3.5 parts by weight
C. I. Acid Red 289 0.5 parts by weight
30 parts by weight of diethylene glycol
20 parts by weight of ethylene glycol
40 parts by weight of ion exchange water
6 parts by weight of the above curing component
[0091]
G ink
C. I. Acid Yellow 23 2 parts by weight
2 parts by weight of zinc phthalocyanine sulfoamide
30 parts by weight of diethylene glycol
20 parts by weight of ethylene glycol
40 parts by weight of ion exchange water
6 parts by weight of the above curing component
[0092]
B ink
C. I. Direct Blue 199 4 parts by weight
30 parts by weight of diethylene glycol
20 parts by weight of ethylene glycol
40 parts by weight of ion exchange water
6 parts by weight of the above curing component
[0093]
[Filling of resin composition]
After the glass substrate (black matrix substrate) on which the black matrix is formed is UV-cleaned, a negative photosensitive resin composition (“PVP resist” manufactured by Sanyo Chemical Co., Ltd.) is spin-coated so as to have a film thickness of 2 μm. The entire surface was exposed from the back side. Next, development was performed with water to remove the resin composition other than the black matrix opening.
[0094]
[Fluorination treatment]
Using a parallel plate type plasma processing apparatus, the black matrix substrate was subjected to plasma processing under the following conditions.
[0095]
Gas used: CF_Four
Gas flow rate: 80sccm
Pressure: 8Pa
RF power: 150W
Processing time: 60 sec
[0096]
[Removal of resin composition]
After the plasma treatment, the substrate to be treated was immersed in an alkaline aqueous solution (“NMD-3” manufactured by Tokyo Ohka Kogyo Co., Ltd.), followed by high pressure shower treatment using pure water, and the resin composition in the opening of the black matrix was peeled off. .
[0097]
[Evaluation of ink repellency]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top: 125 °
Glass substrate surface: 15 °
Met.
[0098]
(Preparation of colored part)
Using an ink jet recording apparatus equipped with an ink jet head having a discharge amount of 20 pl, the above R, G and B inks are applied every 100 pl in the range of 200 to 800 pl per opening on a plasma-treated black matrix substrate. And changed. Next, heat treatment was performed at 90 ° C. for 10 minutes and subsequently at 230 ° C. for 30 minutes to cure the ink to form colored portions (pixels), and seven types of color filters with different ink application amounts were produced.
[0099]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0100]
  (referenceExample 2)
  A color filter was obtained in the same manner as in Example 1 except that the resin composition was filled into the openings of the black matrix in the following steps.
[0101]
[Filling of resin composition]
After ashing the black matrix substrate with oxygen plasma, cresol novolac resin was dissolved in ethyl cellosolve acetate and spin coated to a thickness of 4 μm. Next, dry etching treatment was performed with oxygen plasma until the upper surface of the black matrix was exposed.
[0102]
[Evaluation of ink repellency]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top: 130 °
Glass substrate surface: 8 °
Met.
[0103]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0104]
  (referenceExample 3)
  A color filter was obtained in the same manner as in Example 1 except that the black matrix opening was filled and removed with the following steps.
[0105]
[Filling of resin composition]
After the black matrix substrate was washed with an aqueous sodium hydroxide solution having pH = 13, 200 pl of a resin composition solution having the following composition was selectively applied to the openings of the black matrix using an ink jet recording apparatus.
[0106]
Resin solid content (1: 1 copolymer of methyl methacrylate and hydroxyethyl methacrylate) 15 parts by weight
20 parts by weight of diethylene glycol
Isopropyl alcohol 15 parts by weight
50 parts by weight of ion exchange water
Subsequently, a drying treatment was performed in a vacuum oven at 90 ° C. for 5 minutes.
[0107]
[Removal of resin composition]
The black matrix substrate subjected to plasma treatment was immersed in ethyl cellosolve to remove the resin composition in the black matrix opening.
[0108]
[Evaluation of ink repellency]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 120 °
Glass substrate surface: 20 °
Met.
[0109]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0110]
(Example 4)
Excimer cleaning is used instead of UV cleaning for black matrix substrates, and CF is used as the fluorine-based gas in fluorination treatment._FourInstead of C₂F₆A color filter was obtained in the same manner as in Example 1 except that was used.
[0111]
[Evaluation of ink repellency]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top: 125 °
Glass substrate surface: 15 °
Met.
[0112]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0113]
(Example 5)
Instead of UV cleaning of the black matrix substrate, corona discharge treatment is performed and CF is used as the fluorine-based gas in the surface roughening treatment._FourSF instead of₆A color filter was obtained in the same manner as in Example 1 except that was used.
[0114]
[Evaluation of ink repellency]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 120 °
Glass substrate surface: 20 °
Met.
[0115]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0116]
  (referenceExample 6)
  A color filter was produced in the same manner as in Example 1 except that the black matrix substrate was not subjected to UV cleaning.
[0117]
[Evaluation of ink repellency]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top: 125 °
Glass substrate surface: 50 °
Met.
[0118]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, white spots were observed in the color filter having an ink application amount of 300 pl or less. In addition, no color mixture was observed in all the color filters.
[0119]
(Comparative Example 1)
A black matrix was formed on a glass substrate in the same manner as in Example 1, and immediately after ink was applied in the same manner as in Example 1 to form a colored portion, a color filter was produced.
[0120]
[Evaluation of ink repellency]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 70 °
Glass substrate surface: 50 °
Met.
[0121]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, white spots were observed in the color filter having an ink application amount of 300 pl or less. In addition, color mixing was observed in a color filter having an ink application amount of 400 pl or more.
[0122]
(Example 7)
On the TFT driving substrate formed by a thin film process, in which a wiring film and an insulating film are laminated in multiple layers, a pixel (light emitting layer) unit is formed with ITO as a transparent electrode so as to have a thickness of 40 nm by sputtering, Patterning was performed according to the pixel shape by the photolithography method.
[0123]
Next, partition walls filling the light emitting layer were formed. A transparent photosensitive resin ("CT-2000L" manufactured by Fuji Film Olin) is applied, and predetermined exposure, development, and post-bake treatment are performed. A rectangular film having a film thickness of 0.4 μm and 75 μm × 225 μm is formed on the ITO transparent electrode. A transparent matrix pattern having a plurality of openings was prepared. The substrate was filled with a resin composition and subjected to fluorination treatment and removal of the resin composition under the same conditions as in Example 1. The contact angles for pure water on the ITO transparent electrode and on the transparent matrix pattern are as follows:
On ITO transparent electrode: 17 °
On transparent matrix pattern: 101 °
Met.
[0124]
Next, the light emitting layer was filled in the partition walls of the substrate. As the light-emitting layer, an electron-transporting 2,5-bis (5-tert-butyl-2-benzoxazolyl) -thiophene [electron-transporting blue light-emitting dye having a fluorescence peak of 450 nm is used. One. Hereinafter, 30% by weight of “BBOT”] is molecularly dispersed in a hole transporting host compound composed of poly-N-vinylcarbazole (molecular weight: 150,000, manufactured by Kanto Chemical Co., Inc., hereinafter referred to as “PVK”). Both were dissolved in a dichloroethane solution so that they could. In the PVK-BBOT dichloroethane solution, another luminescent center forming compound, Nile Red, was dissolved to 0.015 mol%, and the solution was used as an ink to form an opening surrounded by the partition walls by an inkjet method. The portion was filled and dried to form a light emitting layer having a thickness of 200 nm. At this time, each pixel (light emitting layer) was independent, and the solution containing the light emitting material was not mixed in adjacent pixels between the partition walls. Further, Mg: Ag (10: 1) was vacuum-deposited thereon to form a Mg: Ag cathode having a thickness of 200 nm. When a voltage of 18 V is applied to each pixel of the EL element thus manufactured, 480 cd / m.²Uniform white light emission was obtained.
[0125]
【The invention's effect】
As described above, according to the present invention, it is possible to manufacture a highly reliable optical element having pixels with no color mixture or white spots by a simple process with a simple process, and to produce density unevenness in the colored portion. There can be provided an EL element having no unevenness of light emission luminance in a light emitting layer with no color filter and a light emitting layer. Therefore, a liquid crystal element having excellent color display characteristics can be provided at a lower cost by using the color filter.
[Brief description of the drawings]
FIG. 1 is a process diagram of an embodiment of a method for producing an optical element of the present invention.
FIG. 2 is a process diagram of an embodiment of a method for producing an optical element of the present invention.
FIG. 3 is a conceptual diagram of color mixing that occurs in an optical element manufacturing method using an inkjet method.
FIG. 4 is a conceptual diagram of white spots that occur in an optical element manufacturing method using an inkjet method.
FIG. 5 is a schematic view showing an example of the configuration of a plasma generator that can be used in the manufacturing method of the present invention.
FIG. 6 is a schematic view showing another configuration of a plasma generating apparatus that can be used in the manufacturing method of the present invention.
FIG. 7 is a schematic cross-sectional view of an example of an electroluminescence element which is an embodiment of the optical element of the present invention.
FIG. 8 is a schematic cross-sectional view of an example of a color filter that is another embodiment of the optical element of the present invention.
FIG. 9 is a schematic cross-sectional view of an embodiment of a liquid crystal element of the present invention.
[Explanation of symbols]
1 Support substrate
2 Resin composition layer
3 Bulkhead
4 openings
5 Resin composition
6 Inkjet head
7 Ink
8 pixels
31 Transparent substrate
33 Black Matrix
36 ink
38 White
51 Upper electrode
52 Lower electrode
53 Substrate
54 High frequency electrode
91 Drive board
92 Bulkhead
93 Light emitting layer
94 Transparent electrode
96 metal layers
101 Transparent substrate
102 black matrix
103 Coloring part
104 Protective layer
107 Common electrode
108 Alignment film
109 liquid crystal
111 Counter substrate
112 pixel electrode
113 Alignment film

Claims (6)

A manufacturing method of an optical element having at least a partition made of a resin composition located between a plurality of pixels and adjacent pixels on a support substrate,
Forming a partition made of a resin composition on a support substrate;
A step of carrying out an ink repellency treatment on the surface of the support substrate and the side wall of the partition wall exposed in the region surrounded by the partition wall;
Forming a negative photosensitive resin composition layer on the entire surface of the support substrate on which the partition walls are formed;
Exposing the photosensitive resin composition layer in a region surrounded by the partition wall by exposing the negative photosensitive resin composition layer from the back surface of the support substrate using the partition wall as a mask;
Removing the unexposed photosensitive resin composition layer;
A step of improving the ink repellency of the partition top provide Reinforced fluorination treatment in the bulkhead upper surface,
Removing the photosensitive resin composition layer in the region surrounded by the partition;
Forming a pixel by applying ink to a region surrounded by a partition wall by an inkjet method;
In this order,
The partition is a light shielding layer,
The method for producing an optical element, wherein the fluorination treatment is a plasma treatment in which a gas containing at least fluorine atoms is introduced to perform plasma irradiation on the surface of the partition wall.   The method for producing an optical element according to claim 1, wherein the partition walls are formed of a resin composition containing carbon black. Said ink-philic treatment, washing treatment with an aqueous alkali solution, UV cleaning, excimer cleaning, corona discharge treatment, method of manufacturing an optical element according to claim 1 or 2 is either an oxygen plasma treatment. The ink of at least the curing component, water, method of manufacturing an optical element according to any one of claims 1 to 3 containing an organic solvent. The manufacturing method of the optical element of any one of Claims 1-4 in which the said ink contains a coloring agent and manufactures the color filter whose pixel is a coloring part. The manufacturing method of the optical element of any one of Claims 1-5 which manufactures the electroluminescent element whose said pixel is a light emitting layer.

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