JP4655574B2 - Electrolytic capacitor manufacturing method - Google Patents
Electrolytic capacitor manufacturing method Download PDFInfo
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- JP4655574B2 JP4655574B2 JP2004284822A JP2004284822A JP4655574B2 JP 4655574 B2 JP4655574 B2 JP 4655574B2 JP 2004284822 A JP2004284822 A JP 2004284822A JP 2004284822 A JP2004284822 A JP 2004284822A JP 4655574 B2 JP4655574 B2 JP 4655574B2
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- 239000003990 capacitor Substances 0.000 title claims description 36
- 238000004519 manufacturing process Methods 0.000 title claims description 33
- 239000011888 foil Substances 0.000 claims description 89
- 238000005530 etching Methods 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 10
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 92
- 238000003466 welding Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000004804 winding Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 231100000989 no adverse effect Toxicity 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Description
本発明は、電解コンデンサの製造方法に関するものであり、特に、パルス幅が１０００ｎｓｅｃ以下のレーザを照射することによって、電極箔の引き出し端子接続部位の加工精度を大幅に向上させることができる電解コンデンサの製造方法に関するものである。 The present invention relates to an electrolytic capacitor manufacturing method, and in particular, an electrolytic capacitor that can significantly improve the processing accuracy of a lead terminal connecting portion of an electrode foil by irradiating a laser with a pulse width of 1000 nsec or less. It relates to a manufacturing method.
従来、電解コンデンサを製造する際、例えば巻回型コンデンサの場合は、アルミニウムからなる芯金の表面にエッチング層と酸化皮膜層を有する電極箔に、引き出し端子をステッチ、コールドウェルド、超音波溶接などにより接続し、電極箔の間にセパレータを介して巻回又は積層してコンデンサ素子を形成し、このコンデンサ素子を駆動用電解液に含浸するとともに、外装ケースに収納して電解コンデンサを形成している。 Conventionally, when manufacturing an electrolytic capacitor, for example, in the case of a winding capacitor, an electrode foil having an etching layer and an oxide film layer on the surface of a cored bar made of aluminum, a lead terminal is stitched, cold welded, ultrasonic welding, etc. To form a capacitor element by winding or laminating between electrode foils via a separator, impregnating the capacitor element with a driving electrolyte solution, and storing the capacitor element in an outer case to form an electrolytic capacitor. Yes.
このような電極箔のうち、低圧箔は、芯金が厚く、エッチング層上には薄い酸化皮膜層が形成されているのに対し、高圧箔では、芯金が薄く、エッチング層上に厚い酸化皮膜が形成されている。 Among such electrode foils, the low pressure foil has a thick cored bar and a thin oxide film layer formed on the etching layer, whereas the high pressure foil has a thin cored bar and a thick oxidized layer on the etched layer. A film is formed.
このような電極箔と引き出し端子との接続においては、引き出し端子が、電極箔の表面にあるエッチング層や酸化皮膜層を超えて、電極箔の芯金部分と直接に接続されることが必要であるため、特に、酸化皮膜の厚い高圧箔では、電極箔と引き出し端子との接続状態の信頼性が劣っていた。 In such connection between the electrode foil and the lead terminal, it is necessary that the lead terminal is directly connected to the core metal portion of the electrode foil beyond the etching layer or oxide film layer on the surface of the electrode foil. Therefore, in particular, in the high-pressure foil having a thick oxide film, the reliability of the connection state between the electrode foil and the lead terminal is inferior.
このような問題点を解決するため、従来から種々の提案がなされている。例えば、電極箔の引き出し端子接続部の酸化皮膜を、予め、プレスや研磨などによって機械的に除去したり、あるいはアークなどによって電気的に除去し、その除去部分に引き出し端子を加締め接続したものがある（例えば、特許文献１参照）。 In order to solve such problems, various proposals have been conventionally made. For example, the oxide film on the lead terminal connection part of the electrode foil is mechanically removed beforehand by pressing or polishing, or electrically removed by arc or the like, and the lead terminal is crimped and connected to the removed part (For example, refer to Patent Document 1).
また、電極箔の引き出し端子接続部の酸化皮膜層及びエッチング層を、粗面性のある回転ローラにより電極箔を挟み込み、回転させたり、電極箔に超音波振動装置を接触させて粉砕するなどして予め除去し、その除去部分に引き出し端子を加締め接続したものがある（例えば、特許文献２参照）。さらに、切削、研削、破壊、折り曲げ、ヒートショック等の方法を用いて、予め接続部に酸化皮膜を形成しないようにしたものがある（例えば、特許文献３参照）。 Also, the oxide film layer and the etching layer of the electrode foil lead-out terminal connection portion are rotated by sandwiching the electrode foil with a rough roller, or pulverized by contacting the electrode foil with an ultrasonic vibration device. In some cases, the lead-out terminal is crimped and connected to the removed portion (see, for example, Patent Document 2). Further, there is a technique in which an oxide film is not formed on a connection portion in advance using a method such as cutting, grinding, destruction, bending, heat shock, or the like (for example, see Patent Document 3).
しかしながら、従来の技術には次のような問題点があった。
すなわち、酸化皮膜層をプレスや研磨などによって機械的に除去する方法や、酸化皮膜層及びエッチング層を回転ローラや超音波振動などによって機械的に除去する方法では、電極箔に除去治具を直接的に接触させて酸化皮膜層やエッチング層を除去しているため、接触時の機械的ストレスが、電極箔自体、例えば電極箔の芯金部分や除去部分近傍の酸化皮膜層及びエッチング層に加わることによって、損傷や歪み等が起こり、また前記除去治具の一部が電極箔に転写するなどにより、電極箔の信頼性を悪化させるという問題点があった。
However, the conventional technique has the following problems.
That is, in the method of mechanically removing the oxide film layer by pressing or polishing, or the method of mechanically removing the oxide film layer and the etching layer by a rotating roller or ultrasonic vibration, a removal jig is directly attached to the electrode foil. Since the oxide film layer and the etching layer are removed by contact with each other, mechanical stress at the time of contact is applied to the electrode foil itself, for example, the core metal part of the electrode foil and the oxide film layer and the etching layer near the removal part. As a result, damage, distortion, and the like occur, and a part of the removal jig is transferred to the electrode foil, thereby deteriorating the reliability of the electrode foil.
また、酸化皮膜層及びエッチング層を機械的に除去した際に、除去部分にバリ等が発生し、バリを除去する工程を追加する必要が生じ、製造工程が煩雑化するといった問題点もあった。さらに、酸化皮膜層をアークによって電気的に除去する際、アークの投入エネルギーの調節やアーク放電位置の調節などのアーク放電現象の制御が困難であるため、例えば、小型品等のように電極箔の箔幅が狭く、除去範囲が限られているなど、特定箇所のみの除去には適していなかった。また、予め酸化皮膜を形成しないようにするには、マスキングなどを施す必要があり、工程が煩雑なものとなっていた。 In addition, when the oxide film layer and the etching layer are mechanically removed, burrs or the like are generated in the removed portion, and it is necessary to add a process for removing the burrs, which causes a problem that the manufacturing process becomes complicated. . Furthermore, when the oxide film layer is electrically removed by an arc, it is difficult to control arc discharge phenomena such as adjustment of arc input energy and arc discharge position. The foil width was narrow and the removal range was limited. Further, in order not to form the oxide film in advance, it is necessary to perform masking or the like, and the process is complicated.
そこで、本出願人は、先にレーザにより酸化皮膜を除去する方法を見出し、特許出願した（特許文献４参照）。しかし、特許文献４に示したようなレーザによる酸化皮膜層の除去では、酸化皮膜を除去した接続部とその周囲の酸化皮膜層との境界部分で、バリなどの凹凸が生じてしまうことがあった。 Therefore, the present applicant previously found a method for removing the oxide film by laser and applied for a patent (see Patent Document 4). However, when the oxide film layer is removed by laser as shown in Patent Document 4, irregularities such as burrs may occur at the boundary between the connection part from which the oxide film has been removed and the oxide film layer around it. It was.
本発明は、上述したような従来技術の問題点を解決するために提案されたものであり、その目的は、接続部とその周囲の酸化皮膜層との境界部分におけるバリの発生を低減し、引き出し端子接続部位の酸化皮膜を任意の形状にて、精度良く除去し、信頼性の高い引き出し端子と電極箔の接続状態を得ることができる電解コンデンサの製造方法を提供することにある。 The present invention has been proposed in order to solve the problems of the prior art as described above, and its purpose is to reduce the occurrence of burrs at the boundary between the connection portion and the surrounding oxide film layer, It is an object of the present invention to provide an electrolytic capacitor manufacturing method capable of accurately removing an oxide film at an extraction terminal connecting portion in an arbitrary shape and obtaining a highly reliable connection state between an extraction terminal and an electrode foil.
上記課題を解決するため、請求項１に記載の発明は、アルミニウム芯金の表面に酸化皮膜層及びエッチング層を備えた電極箔に引き出し端子を接続し、この電極箔を、セパレータを介して巻回又は積層する電解コンデンサの製造方法において、前記電極箔の前記引き出し端子接続部位に、パルス幅が１０００ｎｓｅｃ以下のレーザを照射することにより、前記電極箔の引き出し端子接続部位の酸化皮膜層を、アルミニウム芯金に対してレーザ光を遮断するに足る厚さの酸化皮膜を残して、除去することを特徴とする。 In order to solve the above problems, the invention according to claim 1 is characterized in that a lead terminal is connected to an electrode foil having an oxide film layer and an etching layer on the surface of an aluminum core, and the electrode foil is wound via a separator. In the manufacturing method of the electrolytic capacitor to be laminated or laminated, the oxide film layer of the lead terminal connecting portion of the electrode foil is made of aluminum by irradiating the lead terminal connecting portion of the electrode foil with a laser having a pulse width of 1000 nsec or less. It is characterized by leaving and removing an oxide film having a thickness sufficient to block the laser beam from the core metal.
このように、パルス幅が１０００ｎｓｅｃ以下のレーザ装置により複数回照射されるレーザエネルギーは、パルス幅がこの範囲より高いレーザ装置に比べて、短時間に照射部分の加熱が可能となるため、電極箔の引き出し端子接続部位にレーザを照射した際に、接続部位以外の電極箔へのレーザ照射熱などによる悪影響を及ぼすことがなく、接続部とその周囲の酸化皮膜層との境界部分におけるバリなどの凹凸の発生を低減することができるので、酸化皮膜層を局部的に高精度に除去することが可能となる。 In this way, the laser energy irradiated multiple times by the laser device having a pulse width of 1000 nsec or less enables heating of the irradiated portion in a short time compared to a laser device having a pulse width higher than this range. When irradiating laser to the lead terminal connection part, there is no adverse effect due to laser irradiation heat etc. on the electrode foil other than the connection part, such as burrs at the boundary between the connection part and the surrounding oxide film layer. Since the occurrence of unevenness can be reduced, the oxide film layer can be locally removed with high accuracy.
請求項２に記載の発明は、請求項１に記載の電解コンデンサの製造方法において、前記酸化皮膜層を除去した引き出し端子接続部位を、機械的に圧接して平坦とした後、引き出し端子を接続することを特徴とする。 According to a second aspect of the present invention, in the method for manufacturing an electrolytic capacitor according to the first aspect, the lead terminal connecting portion from which the oxide film layer has been removed is flattened by mechanical pressure contact, and then the lead terminal is connected. It is characterized by doing.
請求項２に記載の発明によれば、特に、酸化皮膜層の厚みが比較的厚く（６００ｎｍ）、エッチング層も厚く形成された高圧用の電極箔において、レーザ照射により酸化皮膜層が除去された接続部にバリなどの凹凸形状が生じた場合でも、平坦状の接続部を形成することができる。 According to the second aspect of the present invention, in particular, in the high-voltage electrode foil in which the thickness of the oxide film layer is relatively thick (600 nm) and the etching layer is also thick, the oxide film layer is removed by laser irradiation. Even when a concavo-convex shape such as a burr occurs in the connection portion, a flat connection portion can be formed.
請求項３に記載の発明は、請求項１に記載の電解コンデンサの製造方法において、前記酸化皮膜層を除去した引き出し端子接続部位に、該引き出し端子を載置した後、レーザを照射することにより、前記引き出し端子の一部を溶融させて、前記引き出し端子接続部位に接続することを特徴とする。 According to a third aspect of the present invention, in the method of manufacturing an electrolytic capacitor according to the first aspect, the lead terminal is placed on the lead terminal connecting portion from which the oxide film layer has been removed, and then irradiated with a laser. A part of the lead terminal is melted and connected to the lead terminal connecting portion.
このような請求項３に記載の発明によれば、接続部に引き出し端子を載置し、レーザ照射によりこの引き出し端子の一部を溶融させると、溶融した引き出し端子の金属（アルミニウム）が、接続部に形成された凹凸部内に供給されて接続されるため、強固な接続状態が得られる。 According to the invention described in claim 3, when the lead terminal is placed on the connecting portion and a part of the lead terminal is melted by laser irradiation, the molten metal (aluminum) of the lead terminal is connected. Since it is supplied and connected in the uneven part formed in the part, a strong connection state is obtained.
請求項４に記載の発明は、請求項１に記載の電解コンデンサの製造方法において、前記酸化皮膜層を除去した引き出し端子接続部位に、所定のレーザ光を照射することによりその照射部位を加熱し、該電極箔を構成するアルミニウム芯金と前記接続部位の背面側の酸化皮膜層とを溶融させて、アルミニウムと酸化皮膜層との混合層を形成する工程と、形成された混合層に前記引き出し端子を接続する工程を有することを特徴とする。 According to a fourth aspect of the present invention, in the method for manufacturing an electrolytic capacitor according to the first aspect, the irradiation part is heated by irradiating the lead terminal connection part from which the oxide film layer has been removed with a predetermined laser beam. A step of melting the aluminum core bar constituting the electrode foil and the oxide film layer on the back side of the connection part to form a mixed layer of aluminum and the oxide film layer, and the drawing to the formed mixed layer It has the process of connecting a terminal, It is characterized by the above-mentioned.
このような請求項４に記載の発明によれば、電極箔の引き出し端子接続部位の酸化皮膜層を除去した後、さらに所定のレーザ光を照射することにより、接続部位のアルミニウム芯金とその背面側の酸化皮膜層が加熱されて溶融し、アルミニウムと酸化皮膜層との混合層からなる平坦状の新たな接続部を形成することができる。この混合層からなる接続部は、その表面に酸化皮膜層がなく、また、予め酸化皮膜層が除去された状態で形成されているため、接続部中の酸化皮膜層の絶対量を少なくでき、従って抵抗が低く良好な接続部であると共に、平坦であり且つ所定の厚さを維持することができるため、接続部としての強度が増し、これによって、引き出し端子とのより良好な接続状態を得ることができる。 According to the invention described in claim 4, after removing the oxide film layer at the lead terminal connecting portion of the electrode foil, further irradiating with a predetermined laser beam, the aluminum core at the connecting portion and the back surface thereof. The oxide film layer on the side is heated and melted to form a new flat connection portion composed of a mixed layer of aluminum and the oxide film layer. The connection part made of this mixed layer has no oxide film layer on its surface, and since it is formed in a state where the oxide film layer has been removed in advance, the absolute amount of the oxide film layer in the connection part can be reduced, Therefore, it is a good connection portion with low resistance, and it is flat and can maintain a predetermined thickness, so that the strength as the connection portion is increased, thereby obtaining a better connection state with the lead terminal. be able to.
請求項５に記載の発明は、請求項４に記載の電解コンデンサの製造方法において、前記レーザ光が、パルスＹＡＧレーザ光であることを特徴とする。
パルスＹＡＧレーザは、１照射あたりの発光のピーク値が比較的低く、発光幅が長いため、電極箔にレーザ照射される際に、照射側の反対側まで十分な加熱がなされ、その結果、電極箔のアルミニウム芯金、エッチング層及び酸化皮膜層が溶融して混合され、良好な接続部が形成される。
According to a fifth aspect of the present invention, in the method for manufacturing an electrolytic capacitor according to the fourth aspect, the laser beam is a pulsed YAG laser beam.
Since the pulse YAG laser has a relatively low light emission peak value per irradiation and a long light emission width, when the electrode foil is irradiated with the laser, sufficient heating is performed up to the opposite side of the irradiation side. The aluminum cored bar, the etching layer, and the oxide film layer of the foil are melted and mixed to form a good connection.
本発明によれば、接続部とその周囲の酸化皮膜層との境界部分におけるバリの発生を低減し、引き出し端子接続部位の酸化皮膜を精度良く除去し、信頼性の高い引き出し端子と電極箔の接続状態を得ることができる電解コンデンサの製造方法を提供することができる。 According to the present invention, the generation of burrs at the boundary between the connecting portion and the surrounding oxide film layer is reduced, the oxide film at the lead terminal connecting portion is accurately removed, and the reliable lead terminal and electrode foil are formed. The manufacturing method of the electrolytic capacitor which can obtain a connection state can be provided.
以下、本発明の実施の形態について図を参照して詳細に説明する。
（１）電解コンデンサ素子の構成
図１は、本発明に係る巻回型電解コンデンサ素子２の構成を示したものであって、巻回型コンデンサ素子２は、その最外側に第１のセパレータ４が配置され、その内側に陰極箔６が積層される。この陰極箔６の内側にさらに第２のセパレータ８が積層され、第２のセパレータ８の内側に陽極箔１０が積層される。また、巻回型電解コンデンサ素子２は、陽極箔１０に陽極引き出し端子１２が、また、陰極箔６に陰極引き出し端子１４がそれぞれ接続されている。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(1) Configuration of Electrolytic Capacitor Element FIG. 1 shows the configuration of a wound
そして、第１のセパレータ４と陰極箔６、第２のセパレータ８と陽極箔１０とは先に述べた順序で積層され、陽極箔１０を内側にして巻回され、巻終わり端が巻止めテープにて固定された巻回型構造とされている。なお、陽極箔１０及び陰極箔６はアルミニウム箔で形成されている。
The first separator 4 and the cathode foil 6, the
（２）電解コンデンサの製造方法
（２−１）製造方法−その１
次に、図２に基づき、本発明の巻回型電解コンデンサの製造方法を説明する。
まず、陽極箔１０としてアルミニウムなどの弁作用金属からなる金属箔１６に、エッチング処理及び化成処理により、酸化皮膜層１８及びエッチング層を形成し（図２（Ａ））、陰極箔６はエッチング処理が施されているが、必要に応じて酸化皮膜層が設けられる。
(2) Manufacturing method of electrolytic capacitor (2-1) Manufacturing method-1
Next, based on FIG. 2, the manufacturing method of the winding type electrolytic capacitor of this invention is demonstrated.
First, an
図２（Ｂ）に示すように、電極箔６，１０の上部にレーザ源２４を配置し、電極箔６，１０とレーザ源２４の間にレンズ２２を配置する。そして、電極箔６，１０の表面に形成された酸化皮膜層１８の所定の部位、すなわち、引き出し端子１２，１４を接続する部位３０に、レンズ２２を通過して集束されたレーザ光２０を照射して、電極箔の酸化皮膜層及びエッチング層を除去する。
As shown in FIG. 2B, the
なお、照射するレーザ光としては、例えば、パルス幅が１０００ｎｓｅｃ以下、より好ましくは２００〜３００ｎｓｅｃ、波長１０６４ｎｍ程度、レーザパワー１５Ｗ程度のパルスＹＡＧレーザマーカを用いることが好ましい。
また、電極箔の接続部への引き出し端子の接続方法は、超音波溶接、加締め、コールドウェルド、スポット溶接、レーザなど多くの方法があり、特に限定されない。
As the laser beam to be irradiated, for example, a pulse YAG laser marker having a pulse width of 1000 nsec or less, more preferably 200 to 300 nsec, a wavelength of about 1064 nm, and a laser power of about 15 W is preferably used.
Moreover, there are many methods for connecting the lead terminal to the electrode foil connecting portion, such as ultrasonic welding, caulking, cold welding, spot welding, and laser, and there is no particular limitation.
パルス幅が１０００ｎｓｅｃ以下のレーザ装置により照射されるレーザエネルギーは、パルス幅がこの範囲より高いレーザ装置に比べて、短時間に照射部分の加熱が可能となる。従って、電極箔の引き出し端子接続部位にレーザを照射した際に、接続部位以外の電極箔へのレーザ照射熱などによる悪影響を及ぼすことがなく、図３に示すように、良好な接続部３０ａを形成することができる。特に、接続部とその周囲の酸化皮膜層との境界部分におけるバリなどの凹凸の発生を低減することができるので、酸化皮膜層を局部的に高精度に除去することが可能となる。 The laser energy irradiated by a laser device having a pulse width of 1000 nsec or less can heat the irradiated portion in a shorter time than a laser device having a pulse width higher than this range. Therefore, when a laser is irradiated to the lead terminal connection portion of the electrode foil, there is no adverse effect due to the heat of laser irradiation to the electrode foil other than the connection portion. As shown in FIG. Can be formed. In particular, since it is possible to reduce the occurrence of irregularities such as burrs at the boundary between the connecting portion and the surrounding oxide film layer, the oxide film layer can be locally removed with high accuracy.
従って、従来のように、電極箔の表面の一部に酸化皮膜を形成しないようにするためにマスキングなどを施す、または電極箔の表面の酸化皮膜層を後処理にて除去するなどの煩雑な工程が不要となる。また、酸化皮膜層が厚く形成された高圧箔であっても、上記レーザの照射工程のみによって、表面に酸化皮膜のない良好な接続部を形成することができる。 Therefore, as in the prior art, a masking or the like is performed to prevent the formation of an oxide film on a part of the surface of the electrode foil, or the oxide film layer on the surface of the electrode foil is removed by post-processing. A process becomes unnecessary. Even in the case of a high-pressure foil having a thick oxide film layer, a good connection portion having no oxide film on the surface can be formed only by the laser irradiation step.
なお、上記の製造方法を適用して、レーザ照射により酸化皮膜層及びエッチング層を除去する場合、元の酸化皮膜層及びエッチング層の厚みに対して、約２０％の厚み分の酸化皮膜層及びエッチング層を残すことが好ましい。その理由は、レーザ照射時に、レーザ光が前記残存したエッチング層に形成された酸化皮膜によって遮断されるため、アルミニウム芯金に加わる熱ストレスを低減することができるので、アルミニウム芯金が損傷することを防止でき、その結果、引き出し端子を接続した際の信頼性が向上するからである。 In addition, when the oxide film layer and the etching layer are removed by laser irradiation by applying the above manufacturing method, the oxide film layer having a thickness of about 20% with respect to the thickness of the original oxide film layer and the etching layer, and It is preferable to leave an etching layer. The reason is that during laser irradiation, the laser beam is blocked by the oxide film formed on the remaining etching layer, so that thermal stress applied to the aluminum core can be reduced, and the aluminum core is damaged. This is because the reliability when connecting the lead terminals is improved.
（２−２）製造方法−その２
トンネルエッチング処理と化成によって、厚みが６００ｎｍ程度の酸化皮膜層が形成された高圧用の電極箔に、（２−１）に示した製造方法を適用して、引き出し端子接続部位の酸化皮膜層及びエッチング層を除去した場合、図４に示したように、接続部３０ｂにバリなどが発生して凹凸形状となる場合がある。
(2-2) Manufacturing method-2
The manufacturing method shown in (2-1) is applied to the high-voltage electrode foil in which the oxide film layer having a thickness of about 600 nm is formed by tunnel etching treatment and chemical conversion, and the oxide film layer at the lead terminal connection site and When the etching layer is removed, as shown in FIG. 4, burrs or the like may be generated in the
このように、酸化皮膜層の厚みが比較的厚く（６００ｎｍ）、エッチング層も厚く形成され、酸化皮膜層及びエッチング層とアルミニウム芯金との境界が不均一である高圧用の電極箔では、酸化皮膜層が強固なために除去されにくく、レーザ照射により酸化皮膜層が除去された接続部にはバリなどの凹凸形状となる場合があるが、この場合には、電極箔の接続部に生じた凹凸をローラ成形などにより圧接して平坦状にし、その後に引き出し端子を接続することが好ましい。これにより、引き出し端子との良好な接続状態を得ることができる。 In this way, the oxide film layer is relatively thick (600 nm), the etching layer is also formed thick, and the oxide film layer and the high-pressure electrode foil in which the boundary between the etching layer and the aluminum core metal is uneven are oxidized. Since the coating layer is strong, it is difficult to remove, and the connection part from which the oxide film layer has been removed by laser irradiation may have an uneven shape such as a burr. In this case, it occurred at the connection part of the electrode foil. It is preferable that the unevenness is pressed and flattened by roller molding or the like, and then the lead terminal is connected. Thereby, a favorable connection state with the lead-out terminal can be obtained.
なお、この場合も、電極箔の接続部への引き出し端子の接続方法は、超音波溶接、加締め、コールドウェルド、スポット溶接、レーザなど多くの方法があり、特に限定されない。また、この製造方法は、高圧箔に限らず、低圧箔に適用することができることは言うまでもない。 In this case as well, there are many methods for connecting the lead terminal to the electrode foil connecting portion, such as ultrasonic welding, caulking, cold welding, spot welding, and laser, and there is no particular limitation. Needless to say, this manufacturing method can be applied not only to the high-pressure foil but also to the low-pressure foil.
（２−３）製造方法−その３
（２−２）に示したような高圧用の電極箔の引き出し端子接続部位に、前記レーザ照射により凹凸が残存した場合でも、その接続部に引き出し端子を載置し、その後レーザ溶接を行うと良好な接続状態が得られる。
(2-3) Manufacturing method-3
Even if unevenness remains due to the laser irradiation in the lead terminal connection portion of the high-voltage electrode foil as shown in (2-2), when the lead terminal is placed on the connection portion and then laser welding is performed A good connection state is obtained.
すなわち、接続部に引き出し端子を載置して、レーザ照射によりこの引き出し端子の一部を溶融させると、溶融した引き出し端子の金属（アルミニウム）が前記凹凸部に供給されて接続されるため、強固な接続状態が得られる。このレーザ溶接としては、パルスＹＡＧレーザ、エキシマレーザ、半導体レーザ、ＣＯ2レーザなどが用いられる。また、この製造方法は、高圧箔に限らず、低圧箔に適用することができることは言うまでもない。 That is, when a lead terminal is placed on the connecting portion and a part of the lead terminal is melted by laser irradiation, the melted metal (aluminum) of the lead terminal is supplied to and connected to the concave and convex portions. Connection state is obtained. As this laser welding, a pulse YAG laser, an excimer laser, a semiconductor laser, a CO 2 laser, or the like is used. Needless to say, this manufacturing method can be applied not only to the high-pressure foil but also to the low-pressure foil.
（２−４）製造方法−その４
（２−２）に示したような高圧用の電極箔の引き出し端子接続部位に、前記レーザ照射により凹凸が残存した場合でも、その接続部位に下記の条件にてレーザ照射を行うと、図５に示したように、接続部位のアルミニウム芯金とその背面側の酸化皮膜層が加熱されて溶融し、アルミニウムと酸化皮膜層との混合層からなる平坦状の新たな接続部３０ｃが形成される。
(2-4) Manufacturing Method—Part 4
Even when unevenness remains due to the laser irradiation in the lead terminal connection portion of the high-voltage electrode foil as shown in (2-2), when laser irradiation is performed on the connection portion under the following conditions, FIG. As shown in FIG. 2, the aluminum cored bar at the connection site and the oxide film layer on the back side thereof are heated and melted to form a new
なお、照射するレーザ光としては、例えば、パルス幅５ｍｓｅｃ、波長１０６４ｎｍ、出力４．３ＪのパルスＹＡＧレーザを用いることができる。なお、パルス幅は０．５〜２０ｍｓｅｃ、出力は１〜１０Ｊが好ましい。パルスＹＡＧレーザは、１照射あたりの発光のピーク値が比較的低く、発光幅が長いため、電極箔にレーザ照射される際に、照射側の反対側まで十分な加熱がなされ、電極箔のアルミニウム芯金、エッチング層及び酸化皮膜層が溶融して混合し、良好な接続部が形成される。 As a laser beam to be irradiated, for example, a pulse YAG laser having a pulse width of 5 msec, a wavelength of 1064 nm, and an output of 4.3 J can be used. The pulse width is preferably 0.5 to 20 msec and the output is preferably 1 to 10 J. Since the pulse YAG laser has a relatively low emission peak value per irradiation and a long emission width, when the electrode foil is irradiated with the laser, sufficient heating is performed to the opposite side of the irradiation side, and the aluminum of the electrode foil The cored bar, the etching layer, and the oxide film layer are melted and mixed to form a good connection portion.
なお、この場合も、電極箔の接続部への引き出し端子の接続方法は、超音波溶接、加締め、コールドウェルド、スポット溶接、レーザなど多くの方法があり、特に限定されない。また、照射するレーザ光は、電極箔の所定部位を加熱溶融できるものであれば、その種類は特に限定されず、また、照射回数も特に限定されない。また、この製造方法は、高圧箔に限らず、低圧箔に適用することができることは言うまでもない。 In this case as well, there are many methods for connecting the lead terminal to the electrode foil connecting portion, such as ultrasonic welding, caulking, cold welding, spot welding, and laser, and there is no particular limitation. Further, the type of laser light to be irradiated is not particularly limited as long as it can heat and melt a predetermined portion of the electrode foil, and the number of times of irradiation is not particularly limited. Needless to say, this manufacturing method can be applied not only to the high-pressure foil but also to the low-pressure foil.
（３）他の実施形態
なお、上記の実施形態では巻回型電解コンデンサについて説明したが、陰極箔に陰極用引き出し端子を接続し、陽極箔に陽極用引き出し端子を接続し、電極箔間にセパレータを介在して電極箔を交互に複数重ね合わせた積層型電解コンデンサにも適用することができる。
(3) Other Embodiments Although the winding type electrolytic capacitor has been described in the above embodiment, the cathode lead terminal is connected to the cathode foil, the anode lead terminal is connected to the anode foil, and the electrode foil is interposed between the electrode foils. The present invention can also be applied to a multilayer electrolytic capacitor in which a plurality of electrode foils are alternately stacked with a separator interposed therebetween.
また、本発明において、レーザ源２４からのレーザ光２０をレンズ２２により集束させて所定部位に照射する際に、レンズ２２の形状や照射距離を変えることで照射するレーザ光２０の面積やレーザエネルギーを容易に変更することができる。
Further, in the present invention, when the
さらに、レーザ光２０を照射する際に、ヘリウムガスやアルゴンガスなどの不活性気体を所定部位に吹き付けると、電極箔の接続部分の表面状態が良好となる。
また、酸化皮膜層の引き出し端子接続部分にカーボン層を設けて、そのカーボン層にレーザ光２０を照射すると、酸化皮膜層１８及びエッチング層の熱吸収が高められるので、加熱溶融を促進させることができる。あるいは、まずレーザ光２０を照射することにより少なくとも酸化皮膜層１８を一部溶融した後、その表面にカーボン層を設け、さらにレーザ光２０を照射することで加熱溶融の速度を上げることもできる。
Further, when an inert gas such as helium gas or argon gas is sprayed onto a predetermined part when irradiating the
Further, when a carbon layer is provided at the lead terminal connecting portion of the oxide film layer and the carbon layer is irradiated with the
２…巻回型電解コンデンサ素子
４…第１のセパレータ
６…陰極箔
８…第２のセパレータ
１０…陽極箔
１２…陽極引き出し端子
１４…陰極引き出し端子
１６…金属箔（アルミニウム芯金）
２０…レーザ光
２２…レンズ
２４…レーザ源
３０…接続部
2 ... Winding type electrolytic capacitor element 4 ... First separator 6 ...
20 ...
Claims (5)
前記電極箔の前記引き出し端子接続部位に、パルス幅が１０００ｎｓｅｃ以下のレーザを照射することにより、前記電極箔の引き出し端子接続部位の酸化皮膜層を、アルミニウム芯金に対してレーザ光を遮断するに足る厚さの酸化皮膜を残して、除去することを特徴とする電解コンデンサの製造方法。 In the method of manufacturing an electrolytic capacitor in which a lead terminal is connected to an electrode foil provided with an oxide film layer and an etching layer on the surface of an aluminum core, and this electrode foil is wound or laminated via a separator.
By irradiating the lead terminal connecting portion of the electrode foil with a laser having a pulse width of 1000 nsec or less, the oxide film layer at the lead terminal connecting portion of the electrode foil blocks the laser beam from the aluminum cored bar. A method of manufacturing an electrolytic capacitor, wherein an oxide film having a sufficient thickness is left and removed.
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| JP2008042079A (en) * | 2006-08-09 | 2008-02-21 | Nippon Chemicon Corp | Electrolytic capacitor, and fabrication method thereof |
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| JPS5558517A (en) * | 1978-10-26 | 1980-05-01 | Marukon Denshi Kk | Method of manufacturing electrolytic condenser |
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