JP4642499B2 - Polyolefin resin composition and packaging film - Google Patents

Description

  The present invention relates to an antistatic packaging film, and more particularly to an antistatic packaging film having low gloss.

  Polyolefin-based resin films are excellent in moldability, processability, and cost. In addition to standard bags, plastic bags, garbage bags, etc., food, daily necessities, electrical products, electronic parts, precision equipment, pharmaceuticals, rice grains, fertilizers, resins Widely used as a packaging material for various products such as pellets. Among polyolefin-based resins, linear low-density polyethylene is particularly frequently used as a packaging material as a single-layer film or as a constituent layer of a laminated film because of its excellent strength, sealability and pinhole resistance. These packaging materials are usually made into sheets or tubes, and are printed as needed, and then processed through slits, cuts, welding, etc., but polyolefins have low conductivity. Therefore, countermeasures against static electricity problems that occur in printing and processing processes have been demanded.

  Examples of static electricity troubles include printing failure due to film delivery disturbance and ink repulsion, quality deterioration due to dust adhering to the film, electric shock due to discharge from the film to an operator, and bag making failure due to film delivery disturbance. Also, when filling a product into a packaging bag, for example, when the product is a powder, there is often a problem of sealing failure due to powder blowing or powder adhesion to the heat seal portion of the packaging bag. Furthermore, in the packaging of electronic parts such as ICs, there has been a problem that the electronic parts are destroyed due to an overcurrent caused by electrostatic discharge.

  For this reason, conventionally, nonionic, anionic and cationic surfactants, so-called low molecular weight antistatic agents, have been kneaded into polyolefin films (see, for example, Patent Documents 1 and 2). . However, these low molecular weight antistatic agents have problems that they exude on the film surface over time and deteriorate printability and heat sealability, or contaminate the contents.

For this reason, a so-called polymer antistatic agent (for example, see Patent Document 3) containing a hydrophilic block in the structure and a polyolefin film (for example, see Patent Document 4) containing a polymer type antistatic agent have been proposed. It was. In many cases, the problem of low molecular weight antistatic agents is improved by using a high molecular weight antistatic agent. In general, however, high molecular weight antistatic agents are 2-5 in comparison with low molecular weight antistatic agents. There is a problem that it is twice as expensive and the amount of addition is usually 10 to 20 wt%, and it is extremely expensive compared to a low molecular weight antistatic agent that usually requires 2 wt% or less. On the other hand, high-gloss products have traditionally been the mainstream for polyolefin-based packaging materials, but in recent years, low-gloss products are often required to give products a calm appearance and a high-class feel, giving them low gloss in printing. There is also a case.
JP 2004-115600 A Japanese Patent Laid-Open No. 2004-223795 JP 2001-278985 A JP 2002-121297 A

  In view of the above-described conventional problems, the present invention significantly reduces the amount of expensive polymer antistatic agent used, does not cause various static electricity troubles, has low gloss, and has excellent strength and sealing properties. It is an object to provide a polyolefin-based packaging film.

The present inventors have studied to solve the above problems,
A linear low having a melt flow rate (ASTM D1238, 190 ° C., load 2.16 kg) of 0.1 to 5 g / 10 min and a density (ASTM 1505, 23 ° C.) of 0.900 to 0.940 g / cm ³ Density polyethylene (A) 55-90 wt%, melt flow rate (ASTM D1238, 230 ° C., load 2.16 kg) 5-100 g / 10 min polypropylene resin (B) 5-25 wt%, polymer type charging Polyolefin that maintains antistatic properties while reducing the amount of polymer antistatic agent used by the resin composition consisting of 5 to 20% by weight of the inhibitor (C), and that is excellent in low gloss, strength and sealability The present invention has been completed by finding that a system packaging film is provided.
The polyolefin-based packaging film of the present invention can be obtained by molding the above resin composition by a known method.

Moreover, it is preferable that the surface specific resistance value of the film of the present invention is less than 1 × 10 ¹⁴ Ω, and the gloss (ASTM D523, measurement angle 20 °) is less than 30%.
This film may be a single layer or a multilayer, but in the case of a multilayer, a layer made of the above-described resin composition is essential, the surface specific resistance value of the layer is less than 1 × 10 ¹⁴ Ω, gross (ASTM D523, measurement The angle 20 ° is preferably less than 30%.
Moreover, it is desirable that the polymer type antistatic agent (C) used in the present invention contains a polyether block in its structure.

  Such a polyolefin-based packaging film of the present invention is inexpensive because the amount of the polymeric antistatic agent added is less than usual, and has excellent antistatic performance and uses a linear low density polyethylene. Because it has excellent strength and heat-sealability and low gloss, it has a high-class feeling and contributes to the improvement of product value, so food, daily necessities, electrical products, electronic parts, precision equipment, pharmaceuticals, rice grains, It can be used as packaging material for various products such as fertilizer and resin pellets.

The linear low density polyethylene (A) used in the present invention is a copolymer of ethylene and an α-olefin having 4 to 12 carbon atoms. Specific α-olefins include 1-butene and 4-methyl. -1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, and the like can be used. The melt flow rate (ASTM D1238, 190 ° C., load 2.16 kg) of the linear low density polyethylene (A) is 0.1 to 5 g / 10 minutes, and the density (ASTM 1505, 23 ° C.) is 0.900. It is desirably 0.940 g / cm ³ .
A melt flow rate of 0.1 (g / 10 min) or more and 5 (g / 10 min) or less is preferable because the moldability of the film is good. A density of 0.900 g / cm ³ or more is preferred because the film is difficult to block during molding, and a density of 0.940 g / cm ³ or less is preferred because of good heat sealability.

The polypropylene resin (B) used in the present invention is a homopolymer of propylene or a copolymer of propylene and one or more α-olefins having 2 to 12 carbon atoms (excluding 3 carbon atoms). Mention may be made of propylene-ethylene copolymers, propylene-butene copolymers, propylene-ethylene block copolymers, propylene-butene block copolymers, propylene-ethylene-butene copolymers.
When using a copolymer of propylene and an α-olefin, the α-olefin content is preferably 10 mol% or less. Further, the decane-soluble part amount of the propylene-based block copolymer at 23 ° C. is preferably in the range of 5-20 wt%.

The melt flow rate (ASTM D1238, 230 ° C., load 2.16 kg) of the polypropylene resin (B) is desirably 5 to 100 g / 10 minutes, and more preferably 6 to 60 g / 10 minutes. When the melt flow rate of the polypropylene resin (B) is 5 g / 10 min or more, the surface specific resistance value of the film is usually 1 × 10 ¹⁴ Ω or less, which is preferable from the viewpoint of antistatic performance. 100 g / 10 min or less is preferable because the strength of the film is maintained.

  The polymer type antistatic agent (C) used in the present invention is preferably a block polymer containing a hydrophilic polyether block (I) in its structure. As the block (II) other than the polyether contained in the structure of the polymer type antistatic agent (C), a polymer block such as polyolefin, polyamide, polyurethane, polyester, polyesteramide, linear, branched or cyclic One or more types among divalent aliphatic groups, divalent aliphatic groups containing unsaturated bonds and aromatic rings, and the like can be mentioned. As the polymer antistatic agent (C) containing the polyether block (I), a block polymer compound described in JP-A-2001-278985 can be suitably used. Among these, a block polymer in which the polyether block (I) is composed of ethylene glycol units and the block (II) other than the polyether is composed of polyolefin is preferable.

  The structure of the block polymer is the simplest I-II diblock type, I-II-I or II-I-II triblock type, and a linear structure such as a tetrablock type. Examples include so-called comb structures and star structures that exist as chains. Each block of (I) and (II) is usually bonded through an ester bond, an ether bond, an amide bond, a urethane bond, an imide bond, or the like.

  The proportion of the polyether block (I) contained in the polymer type antistatic agent (C) is usually 20 to 80% by weight, preferably 30 to 70% by weight. The number average molecular weight (polystyrene basis) of the polymeric antistatic agent (C) is usually 1000 to 60000, preferably 5000 to 50000. Conventionally, when a polymer-type antistatic agent is used for polyolefin film applications, a practical level of performance cannot be obtained unless it is added at least 10% by weight, usually 15 to 20% by weight. Exhibits the same performance even when the amount of the polymeric antistatic agent (C) is 5 to 10% by weight. If a higher level of antistatic properties is required, the amount of the polymeric antistatic agent (C) may be increased up to 20% by weight, but if it exceeds 20% by weight, the strength of the film will be lowered. And may be expensive.

In addition, the resin composition of the present invention includes a colorant, a nucleating agent, a weather resistance stabilizer, an ultraviolet absorber, an antioxidant, a flame retardant, a plasticizer, a slip agent, an antiblocking agent, an antifogging agent, and an antifogging agent as necessary. Well-known additives such as antibacterial and antifungal agents can be contained.
The thickness of the packaging film of the present invention is not particularly limited because it depends on the application, but is usually 10 to 200 μm.

  In producing the resin composition of the present invention, dry blending or melt blending can be used. That is, linear low density polyethylene (A), polypropylene resin (B), and polymer type antistatic agent (C) are mixed in a solid state such as pellets and powder and melt kneaded at the time of molding. Alternatively, a composition obtained by melt-kneading (A), (B), and (C) in advance can also be used.

The method for forming the packaging film of the present invention is not particularly limited, and for example, inflation molding or T-die molding can be employed.
In the case of a multilayer film, for example, a dry lamination method or an extrusion lamination method may be adopted in addition to the coextrusion method, and an adhesive layer can be provided between the layers as necessary. Examples of the thermoplastic resin used in layers other than the resin composition layer mainly composed of the linear low-density polyethylene of the present invention include polyethylene, ethylene-α-olefin copolymer, ethylene-vinyl acetate copolymer Polymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-acrylic acid ester copolymer, ethylene-methacrylic acid ester copolymer, ethylene-vinyl alcohol copolymer, ionomer resin, polypropylene , Propylene-α-olefin copolymer, polymethylpentene, polybutene, polybutadiene, polyvinyl chloride, polyvinylidene chloride, polystyrene, polylactic acid, polycaprolactone, polybutylene succinate, polyethylene terephthalate, polyamide and the like. The packaging film of the present invention and each layer constituting the packaging film may be uniaxially or biaxially stretched as necessary, and a thin film of metal aluminum, alumina, silica, or the like may be formed on the surface thereof. .

EXAMPLES Hereinafter, although an Example demonstrates this invention further, this invention is not limited to this. The surface resistivity and gloss are measured by the following measurement method.
(Surface specific resistance)
Using a digital ultrahigh resistance / microammeter R8340A manufactured by Advantest Corporation, measurement was performed under the conditions of 23 ° C., 50% RH, and DC voltage 500 V in accordance with ASTM D257.
(Gloss [Glossy])
Using a gloss meter VG2000 manufactured by Nippon Denshoku Industries Co., Ltd., measurement was performed at a measurement angle of 20 degrees in accordance with ASTM D523.

[Example 1]
Linear low density polyethylene [Evolue (registered trademark) SP2320, manufactured by Mitsui Chemicals, Ltd., density (JIS K7112) = 919 kg / m3, MFR (JIS K7210, 190 ° C.) = 1.9 g / 10 min], 85 parts by weight , Propylene-ethylene random copolymer [Mitsui Polypro (registered trademark) J208, manufactured by Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 40 g / 10 min] (PP-1) from 10 parts by weight and polyethylene glycol Polyester block containing (polyether block content of about 50% by weight) Polymer type antistatic agent [trade name Perestat 303 manufactured by Sanyo Chemical Co., Ltd.] 5 parts by weight (dry blending) with a Henschel mixer to resin composition I got a thing.

  Next, using this resin composition, a T-die molding machine (die width: 300 mm, extruder: 40 mmφ, L / D = 26) manufactured by Modern Machinery Co., Ltd., extruder setting temperature: 230 ° C., die setting temperature : 230 ° C., chill roll temperature: 40 ° C., take-up speed: 10 m / min, molded on the condition of single-sided air cooling to obtain a single-layer film having a thickness of 30 μm. The surface resistivity and gloss of the chill roll surface of this film were measured. The results are shown in Table 1.

[Examples 2 to 8 and Comparative Examples 1 to 8]
A 30 μm single layer film was obtained in the same manner as in Example 1 except that the content of the resin composition was changed to those shown in Tables 1 to 3. The same linear low density polyethylene (LLDPE) and antistatic agent as in Example 1 were used.
The surface resistivity and gloss of each film were measured. The results are shown in Tables 1 to 3.

PP-2: Polypropylene [Same as above, F109V, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 33 g / 10 min]
PP-3: Propylene-ethylene random copolymer [same as above F329RA, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 27 g / 10 min]
PP-4: Polypropylene [Same as above F107BV, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 7.3 g / 10 min]
PP-5: Propylene-ethylene random copolymer [F337D made by Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 7.0 g / 10 min]
PP-6: Propylene-ethylene random copolymer [S229R, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 59 g / 10 min]
PP-7: Polypropylene [Same as above, F143W, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 4.1 g / 10 min]
PP-8: Propylene-ethylene random copolymer [same as MJS468, manufactured by Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 1.5 g / 10 min]
LD-1: High-pressure method low-density polyethylene [Mirason (registered trademark) 252, manufactured by Mitsui Chemicals, density (JIS K7112) = 926 kg / m3, MFR (JIS K7210, 190 ° C.) = 7.5 g / 10 min]
LD-2: High-pressure method low-density polyethylene [supplied by MV0607, Mitsui Chemicals, density (JIS K7112) = 926 kg / m3, MFR (JIS K7210, 190 ° C.) = 23 g / 10 min]
EEA-1: Ethylene-ethyl acrylate copolymer [Evaflex-EEA (registered trademark) A-701, manufactured by Mitsui DuPont Polychemical Co., Ltd., density (JIS K7112) = 920 kg / m3, MFR (JIS K7210, 190 ° C. ) = 5g / 10min]
EL-1: Polyolefin Elastomer [Tuffmer (registered trademark) A4050 Mitsui Chemicals (
Co., Ltd., density (JIS K7112) = 860 kg / m3, MFR (JIS K7210, 190 ° C.) = 4 g / 10 min]

  The packaging film provided by the present invention has an antistatic effect equivalent to or higher than that of the normal use amount even if the use amount of the expensive polymer type antistatic agent is greatly reduced. It is advantageous. In addition, the packaging film provided by the present invention has a low-gloss, so that it has a high-grade appearance without post-processing such as printing. Thus, the packaging film provided by the present invention is suitable as a packaging material for various products including electronic parts, precision instruments, and powders.

Claims (6)

Melt flow rate (ASTM D1238, 190 ° C., load 2.16 kg) is 0.1
~ 5g / 10min, density (ASTM 1505, 23 ° C) is 0.900 to 0.940g / c
m ³ linear low density polyethylene (A) 55-90% by weight, melt flow rate (A
STM D1238, 230 ° C., load 2.16 kg) 5 to 100 g / 10 min of polypropylene resin (B) 5 to 25% by weight, polymer type antistatic agent (C) 5 to 20% by weight . The resin composition according to claim 1, wherein the polymer antistatic agent (C) includes a polyether block in the structure thereof. A packaging film obtained by molding the resin composition according to claim 1 . Surface resistivity is less than 1 × 10 ¹⁴ Ω, gross (ASTM D523, measurement angle 20 °)
The packaging film according to claim 3 , wherein is less than 30%. Claim 1 or 2 thermoplastic resin packaging multilayered film comprising at least a layer comprising the resin composition according to. Surface resistivity is less than 1 × 10 ¹⁴ Ω, gross (ASTM D523, measurement angle 20 °)
The packaging multilayer film according to claim 5 , wherein is less than 30%.