JP4535506B2 - Manufacturing method of semiconductor integrated circuit device - Google Patents

Description

  The present invention relates to a semiconductor integrated circuit device and a manufacturing technique thereof, and more particularly to a technology effective when applied to a semiconductor integrated circuit device having an SRAM (Static Random Access Memory).

  SRAM is used as a cache memory for personal computers and workstations.

  This SRAM is composed of a flip-flop circuit that stores 1-bit information and two MISFETs (Metal Insulator Semiconductor Field Effect Transistors) for information transfer. This flip-flop circuit is, for example, a pair of driving MISFETs and a pair of MISFETs. MISFET for load.

  For such a memory cell, a soft error due to α rays is a problem. Soft error caused by alpha rays means that alpha rays contained in external cosmic rays and alpha rays emitted from radioactive atoms contained in LSI packaging materials enter the memory cell and are stored in the memory cell. It is a phenomenon that destroys information.

  As a countermeasure against this α-ray, a method of adding a capacity to the information storage section (input / output section of the flip-flop circuit) in the memory cell and increasing the capacity of the information storage section has been studied.

  For example, in Japanese Patent Laid-Open No. 11-17027 (Patent Document 1), polycrystalline silicon 10 connected to drain regions of FETs Qp ′ and Qnd ′, and polycrystalline silicon 11 connected to drain regions of FETs Qp and Qnd are disclosed. Describes a technique for improving the soft error resistance by forming a capacitor.

Japanese Patent Laid-Open No. 10-163440 (Patent Document 2) discloses a capacitor composed of local wirings L1 and L2 that cross-couple input / output terminals of a flip-flop circuit that stores information, and a thin insulating film interposed therebetween. A technique for increasing the capacity of the storage node of the memory cell by configuring C and preventing the decrease in the resistance to α-ray soft error is described.
JP 11-17027 A JP-A-10-163440

  However, as miniaturization associated with higher integration of memory cells progresses, a region where a capacitor can be formed also becomes smaller. Therefore, there is a limit in increasing the capacity of the information storage unit.

  On the other hand, the target value of capacity is increasing according to the purpose of use of the product. FIG. 48 is a diagram showing the relationship between the incident energy (MeV) of α rays and the noise charge amount (C) for products whose power supply voltage (Vcc) is 1.2V and 1.5V. As shown in FIG. 48, when the information storage unit is irradiated with α rays, charges (noise) are stored in the information storage unit. The maximum value of this charge is 6.2 fC in the 1.2V product. Since the critical charge amount of this product is 4.3 fC, it is necessary to add a capacity capable of storing a charge amount of 1.9 (= 6.2-4.3) fC or more to each node. is there. Further, in the 1.5V product, the maximum value of this charge is 6.1 fC, and the critical charge amount is 3.4 fC. Therefore, each node has 2.7 (= 6.1-3). .4) It is necessary to add a capacity capable of accumulating the charge amount of fC. The critical charge amount is a charge amount that inverts information (1 or 0) held in the information storage unit.

  As described above, the required capacity is increasing in spite of the fact that the area where the capacity can be formed is reduced by miniaturization.

  An object of the present invention is to provide a technique capable of reducing soft errors due to α rays by securing a capacity of an information storage unit of a semiconductor integrated circuit device, for example, an SRAM memory cell.

  Another object of the present invention is to provide a semiconductor integrated circuit device, for example, a high-performance semiconductor integrated circuit device in which soft errors of SRAM memory cells are reduced.

  The above object and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  (1) A semiconductor integrated circuit device according to the present invention is a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected to each other. An interlayer insulating film formed on the type MISFET and a conductive layer connecting the gate electrode and the drain, formed in a connection hole extending from the gate electrode to the drain, and from the surface of the interlayer insulating film A conductive layer having a protruding portion; a capacitor insulating film formed along the upper portion of the conductive layer and along the sidewall of the protruding portion; and an upper electrode formed on the capacitor insulating film. According to such means, since a capacitance can be formed by the conductive layer, the capacitive insulating film, and the upper electrode, soft errors due to α rays can be reduced. Further, since a capacitor can be formed on the side wall of the protruding portion of the conductive layer, the capacitance can be increased.

  (2) A semiconductor integrated circuit device according to the present invention is a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected to each other. A conductive layer connecting the interlayer insulating film formed on the type MISFET and the gate electrode and the drain, the conductive layer formed in a connection hole extending from the gate electrode to the drain; and the conductive layer A lower electrode formed on the lower electrode, a capacitor insulating film formed on the lower electrode, and an upper electrode formed on the capacitor insulating film. According to such means, since a capacitance can be formed by the lower electrode, the capacitive insulating film, and the upper electrode, soft errors due to α rays can be reduced. Further, if the formation region of the lower electrode is made larger than the formation region of the conductive layer, the capacity can be increased.

  (3) A semiconductor integrated circuit device according to the present invention is a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected to each other. An interlayer insulating film formed on the type MISFET and a conductive layer connecting the gate electrode and the drain, formed in a connection hole extending from the gate electrode to the drain, and from the surface of the interlayer insulating film A conductive layer having a protruding portion; a lower electrode formed along an upper portion of the conductive layer and a side wall of the protruding portion; a capacitive insulating film formed on the lower electrode; and on the capacitive insulating film And an upper electrode formed. According to such means, a capacitor connected to the conductive layer can be formed by the lower electrode, the capacitor insulating film, and the upper electrode, so that soft errors due to α rays can be reduced. Further, if the lower electrode forming region is made larger than the conductive layer forming region, the capacitance can be increased, and the capacitor is also formed on the lower electrode formed along the side wall of the protruding portion of the conductive layer. Therefore, the capacity can be increased.

  (4) A semiconductor integrated circuit device according to the present invention is a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected to each other. A conductive layer that connects the interlayer insulating film formed on the type MISFET and the gate electrode and the drain, and is formed in a connection hole extending from the gate electrode to the drain, and has a recess on the surface thereof. A capacitor, a capacitor insulating film formed on the conductive layer including the inside of the recess, and an upper electrode formed on the capacitor insulating film. According to such means, since a capacitance can be formed by the conductive layer, the capacitive insulating film, and the upper electrode, soft errors due to α rays can be reduced. In addition, since a capacitor can be formed over the concave portion of the conductive layer, the capacitance can be increased.

  (5) A method for manufacturing a semiconductor integrated circuit device according to the present invention is a method for manufacturing a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected. A step of forming the n-channel MISFET, a step of forming an interlayer insulating film on the n-channel MISFET, and a connection hole extending from the gate electrode of the n-channel MISFET to the drain. A step of depositing a conductive film on the interlayer insulating film including the inside of the connection hole, and polishing the conductive film until the surface of the interlayer insulating film is exposed to be embedded in the connection hole. Forming a conductive layer and further etching the exposed surface of the interlayer insulating film to expose the upper portion of the sidewall of the conductive layer. And a step, a step of forming a capacitor insulating film along the top and the exposed sidewall of the conductive layer, and forming an upper electrode on the capacitive insulating film. According to such means, it is possible to form a semiconductor integrated circuit device in which soft errors are reduced by the capacitance constituted by the conductive layer, the capacitive insulating film, and the upper electrode. By further etching the surface of the interlayer insulating film to expose the upper part of the side wall of the conductive layer, the capacity can be increased.

  (6) A method for manufacturing a semiconductor integrated circuit device according to the present invention is a method for manufacturing a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected. A step of forming the n-channel MISFET; a step of forming an interlayer insulating film on the n-channel MISFET; and extending to one gate electrode or the other drain of the pair of n-channel MISFETs. A step of forming an existing connection hole, a step of depositing a conductive film on the interlayer insulating film including the inside of the connection hole, a step of forming a lower electrode on the conductive layer, and on the lower electrode Forming a capacitive insulating film; and forming an upper electrode on the capacitive insulating film. According to such means, it is possible to form a semiconductor integrated circuit device in which soft errors are reduced by the capacitance constituted by the lower electrode, the capacitive insulating film, and the upper electrode. Further, if the formation region of the lower electrode is made larger than the formation region of the conductive layer, the capacity can be increased.

  (7) The method for manufacturing a semiconductor integrated circuit device according to the present invention is a method for manufacturing a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected. And forming an n-channel MISFET, forming an interlayer insulating film on the n-channel MISFET, and extending from one gate electrode to the other drain of the pair of n-channel MISFETs. A step of forming an existing connection hole, a step of depositing a conductive film on the interlayer insulating film including the inside of the connection hole, and polishing the conductive film until a surface of the interlayer insulating film is exposed. Forming a conductive layer embedded in the connection hole, and further etching the exposed surface of the interlayer insulating film to thereby form the conductive layer; Exposing the upper portion of the sidewall, forming the lower electrode along the upper portion of the conductive layer and the exposed sidewall, forming the capacitive insulating film on the lower electrode, and upper on the capacitive insulating film Forming an electrode. According to such means, it is possible to form a semiconductor integrated circuit device in which soft errors are reduced by the capacitance constituted by the lower electrode, the capacitive insulating film, and the upper electrode. Further, if the formation region of the lower electrode is made larger than the formation region of the conductive layer, the capacity can be increased. In addition, since a capacitor can be formed on the lower electrode formed along the exposed side wall of the conductive layer, the capacitance can be increased.

  (8) A method for manufacturing a semiconductor integrated circuit device according to the present invention is a method for manufacturing a semiconductor integrated circuit device having a memory cell including a pair of n-channel MISFETs whose gate electrodes and drains are cross-connected. A step of forming the n-channel MISFET, a step of forming an interlayer insulating film on the n-channel MISFET, and a connection hole extending from the gate electrode of the n-channel MISFET to the drain. A step of depositing a conductive film on the interlayer insulating film including the inside of the connection hole, the step of depositing a conductive film having a thickness smaller than the radius of the connection hole, and the conductive film Polishing until the surface of the interlayer insulating film is exposed to form a conductive layer embedded in the connection hole and having a recess on the upper portion thereof; and the conductive layer And a step of forming a capacitor insulating film on the top, and forming an upper electrode on the capacitive insulating film. According to such means, it is possible to form a semiconductor integrated circuit device in which soft errors are reduced by the capacitance constituted by the conductive layer, the capacitive insulating film, and the upper electrode. In addition, since a capacitor can be formed over the concave portion of the conductive layer, the capacitance can be increased.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  (1) Capacitance insulating film (silicon nitride film) on the cross connection wiring (MD1, MD2) of the SRAM memory cell having a pair of n-channel type MISFETs (Qd1, Qd2) in which the respective gate electrodes and drains are cross connected. 23) and the upper electrode 24 are formed, the capacitance can be formed by the wiring, the capacitor insulating film, and the upper electrode. As a result, soft errors due to α rays can be reduced.

  Further, since the wiring surface has a shape protruding from the surface of the interlayer insulating film (silicon nitride film 17, PSG film 20 and silicon oxide film 21), a capacitance can be formed also on the side wall of the protruding portion. The capacity can be increased.

  (2) The lower electrode 22 and the capacitive insulating film (silicon nitride film) on the cross connection wiring (MD1, MD2) of the SRAM memory cell having a pair of n-channel type MISFETs in which the respective gate electrodes and drains are cross connected. 23) and the upper electrode 24 are formed, and a capacitor composed of the lower electrode, the capacitor insulating film, and the upper electrode can be formed on the wiring. As a result, soft errors due to α rays can be reduced. Further, if the lower electrode forming region is made larger than the wiring forming region, the capacitance can be increased.

  (3) The surface of the cross connection wiring (MD1, MD2) of the SRAM memory cell having a pair of n-channel MISFETs in which the respective gate electrodes and drains are cross-connected is projected from the surface of the interlayer insulating film. Since the capacitor composed of the lower electrode, the capacitor insulating film, and the upper electrode is formed on the wiring, soft errors due to α rays can be reduced, and the capacitance can be increased.

  (4) Since the recess a is formed on the surface of the cross connection wiring (MD1, MD2) of the SRAM memory cell having a pair of n-channel type MISFETs in which the respective gate electrodes and drains are cross-connected, also on the recess Since a capacitor can be formed, the capacity can be increased.

  (5) A high-performance SRAM memory cell in which soft errors due to α rays are reduced can be manufactured.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

(Embodiment 1)
FIG. 1 is an equivalent circuit diagram showing an SRAM memory cell according to the first embodiment. As shown in the figure, this memory cell MC is arranged at the intersection of a pair of complementary data lines (data line DL, data line / (bar) DL) and a word line WL, and a pair of driving MISFETs Qd1, Qd2,. It is composed of a pair of load MISFETs Qp1, Qp2 and a pair of transfer MISFETs Qt1, Qt2. The drive MISFETs Qd1 and Qd2 and the transfer MISFETs Qt1 and Qt2 are configured by n-channel MISFETs, and the load MISFETs Qp1 and Qp2 are configured by p-channel MISFETs.

  Of the six MISFETs constituting the memory cell MC, the driving MISFET Qd1 and the load MISFET Qp1 constitute a CMOS inverter INV1, and the driving MISFET Qd2 and the load MISFET Qp2 constitute a CMOS inverter INV2. The mutual input / output terminals (storage nodes A and B) of the pair of CMOS inverters INV1 and INV2 are cross-coupled to form a flip-flop circuit as an information storage unit for storing 1-bit information. One input / output terminal (storage node A) of the flip-flop circuit is connected to one of the source and drain regions of the transfer MISFET Qt1, and the other input / output terminal (storage node B) is the source of the transfer MISFET Qt2. , Connected to one of the drain regions.

  Further, the other of the source and drain regions of the transfer MISFET Qt1 is connected to the data line DL, and the other of the source and drain regions of the transfer MISFET Qt2 is connected to the data line / DL. Further, one end (the source regions of the load MISFETs Qp1, Qp2) of the flip-flop circuit is connected to the power supply voltage (Vcc), and the other end (the source regions of the drive MISFETs Qd1, Qd2) is connected to the reference voltage (Vss). ing.

  Explaining the operation of the above circuit, when the storage node A of one CMOS inverter INV1 is at a high potential ("H"), the driving MISFET Qd2 is turned on, so that the storage node B of the other CMOS inverter INV2 is at a low potential. ("L"). Accordingly, the driving MISFET Qd1 is turned OFF, and the high potential (“H”) of the storage node A is held. That is, the state of the mutual storage nodes A and B is held by a latch circuit in which a pair of CMOS inverters INV1 and INV2 are cross-coupled, and information is stored while the power supply voltage is applied.

  A word line WL is connected to each gate electrode of the transfer MISFETs Qt1 and Qt2, and conduction and non-conduction of the transfer MISFETs Qt1 and Qt2 are controlled by the word line WL. That is, when the word line WL is at a high potential ("H"), the transfer MISFETs Qt1 and Qt2 are turned on, and the flip-flop circuit and the complementary data lines (data lines DL and / DL) are electrically connected. Therefore, the potential state (“H” or “L”) of the storage nodes A and B appears on the data lines DL and / DL and is read as information of the memory cell MC.

  In order to write information in the memory cell MC, the word line WL is set to the “H” potential level, the transfer MISFETs Qt1 and Qt2 are turned on, and the information on the data lines DL and / DL is transmitted to the storage nodes A and B.

  Next, a method for manufacturing the SRAM according to the present embodiment will be described with reference to FIGS.

  First, as shown in FIGS. 2 and 3, element isolation 2 is formed in a semiconductor substrate 1. FIG. 3 is a plan view of a semiconductor substrate showing a region for about one memory cell, and FIG. 2 is a cross-sectional view of FIG. 3, corresponding to the AA cross section of FIG. This element isolation 2 is formed as follows. For example, an element isolation trench having a depth of about 250 nm is formed by etching the semiconductor substrate 1 made of p-type single crystal silicon having a specific resistance of about 1 to 10 Ωcm.

  Thereafter, the semiconductor substrate 1 is thermally oxidized at about 1000 ° C. to form a thin silicon oxide film (not shown) having a thickness of about 10 nm on the inner wall of the groove. This silicon oxide film recovers damage caused by dry etching that has occurred on the inner wall of the groove, and also relieves stress generated at the interface between the silicon oxide film 5 embedded in the groove and the semiconductor substrate 1 in the next step. Form.

  Next, a silicon oxide film 5 having a thickness of about 450 to 500 nm is deposited on the semiconductor substrate 1 including the inside of the groove by a CVD (Chemical Vapor deposition) method, and the groove is formed by a chemical mechanical polishing (CMP) method. The upper silicon oxide film 5 is polished to flatten the surface.

  Next, after p-type impurities (boron) and n-type impurities (for example, phosphorus) are ion-implanted into the semiconductor substrate 1, the impurities are diffused by heat treatment at about 1000 ° C., so that the p-type well 3 and the semiconductor substrate 1 are diffused. An n-type well 4 is formed. As shown in FIG. 3, active regions An1, An2, Ap1, Ap2 which are two p-type wells 3 and two n-type wells 4 main surfaces are formed in the semiconductor substrate 1, and these active regions are oxidized. It is surrounded by an element isolation 2 in which a silicon film 5 is embedded.

  Further, as will be described in detail later, among the six MISFETs (Qt1, Qt2, Qd1, Qd2, Qp1, Qp2) constituting the memory cell MC, the n-channel MISFETs (Qt1, Qd1) are active region Ap1 ( An n-channel MISFET (Qt2, Qd2) is formed on the p-type well 3), and is formed on the active region Ap2 (p-type well 3). The p-channel type MISFET (Qp2) is formed on the active region An1 (n-type well 4), and the p-channel type MISFET (Qp1) is formed on the active region An2 (n-type well 4).

  Next, n-channel MISFETs (Qt1, Qd1, Qt2, Qd2) and p-channel MISFETs (Qp1, Qp2) are formed on the main surface of the semiconductor substrate 1.

  First, the surface of the semiconductor substrate 1 (p-type well 3 and n-type well 4) is wet-cleaned using a hydrofluoric acid-based cleaning solution, and then the p-type well 3 is thermally oxidized at about 800 ° C. as shown in FIG. A clean gate oxide film 8 having a thickness of about 6 nm is formed on each surface of the n-type well 4.

  Next, a gate electrode G is formed on the gate oxide film 8. FIG. 5 is a plan view of the semiconductor substrate showing a region corresponding to about one memory cell, and FIG. 4 corresponds to the AA cross section of FIG. The gate electrode G is formed as follows. First, a low resistance polycrystalline silicon film 9 having a thickness of about 100 nm is deposited on the gate oxide film 8 by the CVD method.

  Next, the polycrystalline silicon film 9 is dry-etched using a photoresist film (not shown) as a mask to form a gate electrode G made of the polycrystalline silicon film 9. As shown in FIG. 5, the gate electrode G of the transfer MISFET Qt1 and the gate electrode G of the drive MISFET Qd1 are formed on the active region Ap1, and the gate electrode G of the transfer MISFET Qt2 is formed on the active region Ap2. A gate electrode G of the driving MISFET Qd2 is formed. Further, the gate electrode G of the load MISFET Qp2 is formed on the active region An1, and the gate electrode G of the load MISFET Qp1 is formed on the active region An2. These gate electrodes are respectively formed in a direction orthogonal to AA in the figure, the gate electrode G of the load MISFET Qp1 and the gate electrode of the drive MISFET Qd1 are common, and the gate electrode of the load MISFET Qp2 and The gate electrode of the driving MISFET Qd2 is common.

Next, an n ⁻ type semiconductor region is formed by implanting an n type impurity (phosphorus) on both sides of the gate electrode G on the p type well 3, and a p type impurity (arsenic) is formed on the n type well 4. The p ⁻ type semiconductor region 14 is formed by implantation.

  Next, a silicon nitride film having a film thickness of about 40 nm is deposited on the semiconductor substrate 1 by CVD, and then anisotropically etched to form side wall spacers 16 on the side walls of the gate electrode G.

Next, n ⁺ -type semiconductor regions (source and drain) are formed by ion-implanting n-type impurities (phosphorus or arsenic) into the p-type well 3, and p-type impurities (boron) are ion-implanted into the n-type well 4. Thus, the p ⁺ type semiconductor region 18 (source and drain) is formed.

  Up to this step, six MISFETs (driving MISFETs Qd1, Qd2, transfer MISFETs Qt1, Qt2, and load MISFETs Qp1, Qp2) constituting the memory cell MC are completed.

Subsequently, after cleaning the surface of the semiconductor substrate 1, a Co film and a Ti film are sequentially deposited on the semiconductor substrate 1 by sputtering. Next, as shown in FIG. 6, heat treatment is performed at 600 ° C. for 1 minute, and the CoSi ₂ layer 19 is formed on the exposed portion (n ⁺ type semiconductor region, p ⁺ type semiconductor region 18) of the semiconductor substrate 1 and the gate electrode G. Form.

Next, after removing the unreacted Co film and Ti film by etching, heat treatment is performed at 700 to 800 ° C. for about 1 minute to reduce the resistance of the CoSi ₂ layer 19.

  Next, as shown in FIG. 7, a silicon nitride film 17 having a thickness of about 50 nm is deposited on the semiconductor substrate 1 by the CVD method. The silicon nitride film 17 serves as an etching stopper when forming a contact hole C1 and the like which will be described later.

  Subsequently, a PSG (Phosphor Silicate Glass) film 20 may be applied on the silicon nitride film 17, subjected to heat treatment, planarized, and then a silicon oxide film 21 may be deposited. The silicon oxide film 21 is formed by plasma CVD using, for example, tetraethoxysilane as a raw material. The PSG film 20, the silicon oxide film 21, and the silicon nitride film 17 serve as an interlayer insulating film between the gate electrode G and the first layer wiring M1. Further, after depositing a silicon oxide film 21 having a thickness of about 700 nm to 800 nm on the silicon nitride film 17 by a CVD method, the surface of the silicon oxide film 21 is polished by a CMP (Chemical Mechanical Polishing) method to flatten the surface. May be used.

Next, as shown in FIGS. 8 and 9, the silicon oxide film 21 and the PSG film 20 are dry-etched by dry etching using a photoresist film (not shown) as a mask, and then the silicon nitride film 17 is dry-etched. Thus, the contact hole C1 and the wiring trench HM are formed on the n ⁺ type semiconductor region (source, drain) and the p ⁺ type semiconductor region 18 (source, drain). A contact hole C1 is formed on the gate electrode G of the transfer MISFETs Qt1 and Qt2. Of the two wiring grooves HM in FIG. 9, one wiring groove HM extends from the drain of the driving MISFET Qd1 to the gate electrode of the driving MISFET Qd2 via the drain of the load MISFET Qp1. The other wiring groove HM extends from the drain of the driving MISFET Qd2 to the gate electrode of the driving MISFET Qd1 via the drain of the load MISFET Qp2 (FIG. 9).

  Next, a plug P1 and wirings MD1 and MD2 (conductive layer) are formed by embedding a conductive film in the contact hole C1 and the wiring groove HM. First, a Ti film (not shown) having a film thickness of about 10 nm and a TiN film having a film thickness of about 50 nm are sequentially formed on the silicon oxide film 21 including the inside of the contact hole C1 and the wiring groove HM by a sputtering method. Heat treatment is performed at a temperature of 1 ° C. for 1 minute. Next, a W film is deposited by a CVD method, etch back or CMP is performed until the surface of the silicon oxide film 21 is exposed, and the Ti film, the TiN film, and the W film outside the contact hole C1 and the wiring trench HM are removed. A plug P1 is formed in the contact hole C1, and wirings MD1 and MD2 are formed in the wiring groove HM. At this time, the surface of the silicon oxide film 21 and the surfaces of the plug P1 and the wirings MD1 and MD2 substantially coincide.

  Next, as shown in FIG. 10, the surface of the silicon oxide film 21 is further etched. At this time, the upper portions of the side walls of the plug P1 and the wirings MD1, MD2 are exposed. When the PSG film 20 is formed, it is necessary to adjust the film thickness of the silicon oxide film 21 so that the surface of the PSG film 20 is not exposed.

  Next, as shown in FIG. 11, a silicon nitride film 23 is formed on the silicon oxide film 21, the plug P1, and the wiring MD2. The silicon nitride film 23 is formed between the wirings MD1 and MD2 serving as the lower electrodes and the upper electrode 24 described later, and serves as a capacitive insulating film.

  Next, a TiN film is deposited on the silicon nitride film 23 by sputtering and patterned to form an upper electrode 24 extending on the wirings MD1, MD2 and on the plug P1 on the sources of the load MISFETs Qp1, Qp2. Form (FIG. 12). The upper electrode 24 is patterned so as not to extend over the plug P1 on one end (side connected to the data line) of the transfer MISFETs Qt1 and Qt2 and the plug P1 on the sources of the drive MISFETs Qd1 and Qd2.

  Through the above-described steps, the capacitor C composed of the wirings MD1 and MD2 serving as the lower electrode, the silicon nitride film 23, and the upper electrode 24 can be formed.

  As described above, according to the present embodiment, since the capacitor C connected to the wirings MD1 and MD2 is formed, soft errors caused by α rays incident on the SRAM memory cell can be reduced. Further, since the surfaces of the silicon oxide film 21 are further etched after the wirings MD1 and MD2 are formed, the upper portions of the sidewalls of the wirings MD1 and MD2 are exposed, and the silicon nitride film 23 serving as a capacitive insulating film is formed along these sidewalls. Since it can be formed, the capacity can be increased.

  FIG. 18 is a diagram showing the relationship between the etching amount of the surface of the silicon oxide film 21 and the thickness of the silicon nitride film 23 and the capacity increase amount (fF) of the memory cell. Graphs (a), (b), and (c) show the increase in capacitance when the etching amount of the surface of the silicon oxide film 21 is 200 nm, 100 nm, and 0 nm, respectively. As shown in FIG. 18, for example, when the etching amount of the surface of the silicon oxide film 21 is 200 nm and the thickness of the silicon nitride film 23 is 10 nm, the capacitance can be increased by about 6 fF. Further, when the etching amount of the surface of the silicon oxide film 21 is 100 nm and the thickness of the silicon nitride film is 10 nm, the capacitance can be increased by about 4 fF.

  Thereafter, a first layer wiring M1 and a second layer wiring M2 are formed on the upper electrode 24 via an interlayer insulating film. Next, the process for forming these wirings will be described.

  First, as shown in FIGS. 13 and 14, a silicon oxide film 25 is deposited on the upper electrode 24 by a CVD method. Next, the contact hole C2 is formed by removing the silicon oxide film 25 on the plug P1 by etching. Here, since the silicon nitride film 23 exists on the plugs P1 on the sources of the load MISFETs Qp1 and Qp2, the upper electrode 24 and the silicon nitride film 23 are removed by etching in addition to the silicon oxide film 25.

  Next, a plug P2 is formed by embedding a conductive film in the contact hole C2. First, a Ti film (not shown) having a film thickness of about 10 nm and a TiN film having a film thickness of about 50 nm are sequentially formed on the silicon oxide film 25 including the inside of the contact hole C2 by a sputtering method, and is performed at 500 to 700 ° C. for 1 minute. Apply heat treatment. Next, a W film is deposited by CVD, etch back or CMP is performed until the surface of the silicon oxide film 25 is exposed, and the plug P2 is formed by removing the Ti film, TiN film, and W film outside the contact hole C2. . In the plan view of FIG. 14, the display of the gate electrode G, the active region An1, etc. is omitted.

  Subsequently, as shown in FIGS. 15 and 16, a first layer wiring M1 is formed on the silicon oxide film 25 and the plug P2. A Ti film (not shown) having a thickness of about 10 nm and a TiN film having a thickness of about 50 nm are sequentially formed by sputtering, and heat treatment is performed at 500 to 700 ° C. for 1 minute. Next, a W film is deposited by a CVD method and patterned to form a first layer wiring M1. Of the first layer wiring M1, the first layer wiring M1 that connects the gate electrodes G of the transfer MISFETs Qt1 and Qt2 via the plug P1 serves as a word line WL.

  Next, as shown in FIG. 17, a silicon oxide film 27 (not shown in FIG. 17) is deposited on the first layer wiring M1 and the silicon oxide film 25 by the CVD method, and then the first layer wiring M1. The upper silicon oxide film 27 is removed by etching to form a contact hole C3.

  Next, a plug P3 is formed by embedding a conductive film in the contact hole C3. The plug P3 is formed in the same manner as the plug P2.

  Subsequently, a second layer wiring M2 is formed on the silicon oxide film 27 and the plug P3. First, a Ti film (not shown) having a thickness of about 10 nm and a TiN film having a thickness of about 50 nm are sequentially formed by sputtering, and heat treatment is performed at 500 to 700 ° C. for 1 minute. Next, a second layer wiring M2 is formed by depositing and patterning a W film by the CVD method. A reference potential (Vss) is supplied to the sources of the driving MISFETs Qd1 and Qd2 via the second layer wiring M2.

  Further, the power supply potential (Vcc) is supplied to the sources of the load MISFETs Qp1 and Qp2 via the second layer wiring M2. Accordingly, as shown in FIG. 13, since the upper electrode 24 is in contact with the side wall of the plug P2 connected to the sources of the load MISFETs Qp1 and Qp2, the power supply potential (Vcc) is supplied to the upper electrode 24. The As a result, the above-described capacitor C is a capacitor connected between the storage node A or B in FIG. 1 and the power supply potential (Vcc).

  The second layer wiring connected to one end of the driving MISFETs Qd1 and Qd2 serves as data lines (DL, / DL).

  Through the above steps, the SRAM memory cell described with reference to FIG. 1 is almost completed.

(Embodiment 2)
A method for manufacturing the SRAM of the present embodiment will be described with reference to FIGS. Since the plug P1 and the wiring MD1 and MD2 forming steps described with reference to FIGS. 2 to 9 are the same as those in the first embodiment, the description thereof is omitted.

  First, the semiconductor substrate 1 shown in FIGS. 8 and 9 described in the first embodiment is prepared. As shown in FIG. 19, a TiN film is deposited on the silicon oxide film 21, the plug P1, and the wiring MD2 by sputtering. Then, the lower electrode 22 is formed on the wirings MD1 and MD2 by patterning. This lower electrode 22 formation region is larger than the wiring MD1, MD2 formation region (FIG. 20).

  Next, as shown in FIGS. 21 and 22, a silicon nitride film 23 is formed on the lower electrode 22 and the silicon oxide film 21. The silicon nitride film 23 is formed between the lower electrode 22 and an upper electrode 24 described later, and becomes a capacitive insulating film.

  Next, a TiN film is deposited on the silicon nitride film 23 by sputtering and patterned to form the upper electrode 24 extending on the lower electrode 22 and on the plug P1 on the sources of the load MISFETs Qp1 and Qp2. To do. The upper electrode 24 is patterned so as not to extend over the plug P1 on one end (side connected to the data line) of the transfer MISFETs Qt1 and Qt2 and the plug P1 on the sources of the drive MISFETs Qd1 and Qd2.

  Through the above steps, the capacitor C composed of the lower electrode 22, the silicon nitride film 23, and the upper electrode 24 can be formed.

  As described above, according to the present embodiment, since the capacitor C connected to the wirings MD1 and MD2 is formed, soft errors caused by α rays incident on the SRAM memory cell can be reduced. Further, since the lower electrode 22 formation region is made larger than the wiring MD1, MD2 formation region, the capacity can be increased.

  Next, after the silicon oxide film 25 is deposited on the upper electrode 24 by the CVD method, the first layer wiring M1 and the second layer wiring M2 are formed. For these forming processes, refer to FIGS. However, since it is similar to the case of the first embodiment described above, the description thereof is omitted.

(Embodiment 3)
A method for manufacturing the SRAM of the present embodiment will be described with reference to FIGS. Note that the steps up to the etching process of the surface of the silicon oxide film 21 described with reference to FIGS. 2 to 10 are the same as those in the first embodiment, and thus the description thereof is omitted.

  First, the semiconductor substrate 1 shown in FIG. 10 described in the first embodiment is prepared. As shown in FIG. 23, a TiN film is deposited by sputtering on the silicon oxide film 21, the plug P1, and the wiring MD2, and patterned. Thus, the lower electrode 22 is formed on the wirings MD1 and MD2. At this time, since a step is generated between the surfaces of the wirings MD1 and MD2 and the surface of the silicon oxide film 21, a step corresponding to the step is also generated on the surface of the lower electrode 22. The formation region of the lower electrode 22 is larger than the formation region of the wirings MD1 and MD2 (similar to FIG. 20).

  Next, as shown in FIG. 24, a silicon nitride film 23 is formed on the lower electrode 22, the silicon oxide film 21, and the plug P1. The silicon nitride film 23 is formed between the lower electrode 22 and an upper electrode 24 described later, and becomes a capacitive insulating film.

  Next, a TiN film is deposited on the silicon nitride film 23 by sputtering and patterned to form an upper electrode 24 extending on the wirings MD1, MD2 and on the plug P1 on the sources of the load MISFETs Qp1, Qp2. Form (similar to FIG. 22). The upper electrode 24 is patterned so as not to extend over the plug P1 on one end (side connected to the data line) of the transfer MISFETs Qt1 and Qt2 and the plug P1 on the sources of the drive MISFETs Qd1 and Qd2.

  Through the above steps, the capacitor C composed of the lower electrode 22, the silicon nitride film 23, and the upper electrode 24 can be formed.

  As described above, according to the present embodiment, since the capacitor C connected to the wirings MD1 and MD2 is formed, soft errors caused by α rays incident on the SRAM memory cell can be reduced. At this time, since a step corresponding to the step between the surfaces of the wirings MD1 and MD2 and the surface of the silicon oxide film 21 is formed on the surface of the lower electrode 22, the lower electrode 22 and the capacitor are formed along the step. A silicon nitride film 23 serving as an insulating film can be formed, and the capacity can be increased. Further, since the lower electrode 22 formation region is made larger than the wiring MD1, MD2 formation region, the capacity can be increased.

  Next, after the silicon oxide film 25 is deposited on the upper electrode 24 by the CVD method, the first layer wiring M1 and the second layer wiring M2 are formed. For these forming processes, refer to FIGS. However, since it is similar to the case of the first embodiment described above, the description thereof is omitted.

(Embodiment 4)
A method for manufacturing the SRAM of the present embodiment will be described with reference to FIGS. The steps up to the step of forming the silicon oxide film 21 described with reference to FIGS. 2 to 7 are the same as those in the first embodiment, and thus the description thereof is omitted.

First, the semiconductor substrate 1 shown in FIG. 7 described in the first embodiment is prepared, and as shown in FIG. 25, the silicon oxide film 21 and the PSG film 20 are formed by dry etching using a photoresist film (not shown) as a mask. Then, the silicon nitride film 17 is dry etched to form the contact hole C1 and the wiring trench HM on the n ⁺ type semiconductor region (source, drain) and the p ⁺ type semiconductor region 18 (source, drain). Form. Further, a contact hole C1 is formed on the gate electrode G (same as FIG. 9). Of the two wiring grooves in the drawing, one wiring groove HM extends from the drain of the driving MISFET Qd1 to the gate electrode of the driving MISFET Qd2 via the drain of the load MISFET Qp1. The other wiring groove HM extends from the drain of the driving MISFET Qd2 to the gate electrode of the driving MISFET Qd1 via the drain of the load MISFET Qp2.

  Next, a Ti film (not shown) having a film thickness of about 10 nm and a TiN film having a film thickness of about 50 nm are sequentially formed on the silicon oxide film 21 including the inside of the contact hole C1 and the wiring groove HM by a sputtering method. Heat treatment is performed at a temperature of 1 ° C. for 1 minute. Next, a W film is deposited by the CVD method. At this time, the film thickness of the W film is made smaller than the radius of the contact hole C1. Next, the Ti film, TiN film, and W film are etched back or CMP until the surface of the silicon oxide film 21 is exposed, and the Ti film, TiN film, and W film outside the contact hole C1 and the wiring trench HM are removed. As a result, the plug P1 embedded in the contact hole C1 and the wirings MD1 and MD2 having the recess a on the upper part thereof are formed.

  Next, as shown in FIG. 26, a silicon nitride film 23 is formed over the silicon oxide film 21, the plug P1, and the wiring MD2. The silicon nitride film 23 is formed between the wirings MD1 and MD2 serving as the lower electrodes and the upper electrode 24 described later, and serves as a capacitive insulating film.

  Next, a TiN film is deposited on the silicon nitride film 23 by sputtering and patterned to form an upper electrode 24 extending on the wirings MD1, MD2 and on the plug P1 on the sources of the load MISFETs Qp1, Qp2. Form (similar to FIG. 22). The upper electrode 24 is patterned so as not to extend over the plug P1 on one end (side connected to the data line) of the transfer MISFETs Qt1 and Qt2 and the plug P1 on the sources of the drive MISFETs Qd1 and Qd2.

  Through the above-described steps, the capacitor C composed of the wirings MD1 and MD2 serving as the lower electrode, the silicon nitride film 23, and the upper electrode 24 can be formed.

  As described above, according to the present embodiment, since the capacitor C connected to the wirings MD1 and MD2 is formed, soft errors caused by α rays incident on the SRAM memory cell can be reduced. Further, since the wirings MD1 and MD2 are formed using the W film having a thickness smaller than the radius of the contact hole C1, a recess a is formed above the wirings MD1 and MD2, and becomes a capacitive insulating film along the recess a. Since the silicon nitride film 23 can be formed, the capacity can be increased.

  Next, after the silicon oxide film 25 is deposited on the upper electrode 24 by the CVD method, the first layer wiring M1 and the second layer wiring M2 are formed. For these forming processes, refer to FIGS. However, since it is similar to the case of the first embodiment described above, the description thereof is omitted.

  In this embodiment, after the plug P1 and the wirings MD1 and MD2 are formed, the silicon nitride film 23 may be formed after the surface of the silicon oxide film 21 is etched as in the first embodiment. In this case, since the silicon nitride film 23 is formed along the side walls of the wirings MD1 and MD2 exposed by the etching, the capacitance can be further increased.

  In order to increase the capacitance, the silicon nitride film 23 may be formed after the formation of the wirings MD1 and MD2 and the formation of the lower electrode 22 on these wirings as in the second embodiment. Further, after the plug P1 and the wirings MD1 and MD2 are formed, the silicon nitride film 23 may be formed after the surface of the silicon oxide film 21 is etched and the lower electrode 22 is formed as in the third embodiment.

(Embodiment 5)
In the fifth embodiment (the same applies to the second to fourth embodiments), the power supply potential (Vcc) is connected to the upper electrode 24 through the side wall of the plug P2 (connected to the sources of the load MISFETs Qp1 and Qp2). However, the power supply potential (Vcc) can also be supplied via the bottom surface of the plug P2.

  A method for manufacturing the SRAM of the present embodiment will be described with reference to FIGS. Note that the steps up to the etching process of the surface of the silicon oxide film 21 described with reference to FIGS. 2 to 10 are the same as those in the first embodiment, and thus the description thereof is omitted.

  First, the semiconductor substrate 1 shown in FIG. 10 described in the first embodiment is prepared, and as shown in FIG. 27, a silicon nitride film 23 is formed over the silicon oxide film 21, the plug P1, and the wiring MD2. The silicon nitride film 23 is formed between the wirings MD1 and MD2 serving as the lower electrodes and the upper electrode 24 described later, and serves as a capacitive insulating film.

  Next, as shown in FIGS. 28 and 29, the silicon nitride film 23 on the plug P1 on the source of the load MISFET is removed, and an opening OP1 is formed.

  Next, as shown in FIGS. 30 and 31, a TiN film is deposited by sputtering on the silicon nitride film 23 including the inside of the opening OP1, and is patterned to thereby form the wirings MIS1, MD2 and the load MISFETs Qp1, Qp2 An upper electrode 24 extending to the upper part of the plug P1 on the source is formed. The upper electrode 24 is patterned so as not to extend over the plug P1 on one end (side connected to the data line) of the transfer MISFETs Qt1 and Qt2 and the plug P1 on the sources of the drive MISFETs Qd1 and Qd2.

  Through the above-described steps, the capacitor C composed of the wirings MD1 and MD2 serving as the lower electrode, the silicon nitride film 23, and the upper electrode 24 can be formed.

  Next, as shown in FIG. 32, a silicon oxide film 25 is deposited on the upper electrode 24 by a CVD method. Next, the contact hole C2 is formed by removing the silicon oxide film 25 above the plug P1 by etching.

  As described above, in this embodiment, since the silicon nitride film 23 of the plug P1 on the sources of the load MISFETs Qp1 and Qp2 is removed in advance, only the silicon oxide film 25 on the plug P1 is removed. Well, the contact hole C2 on the plug P1 can be easily formed.

  Even if misalignment occurs between the plug P1 and the contact hole C2, the plug P1 and the plug P2 formed in the contact hole C2 are connected via the upper electrode 24. The conduction failure can be reduced. In addition, a margin for a short circuit between the gate electrode G and the plug P2 can be secured.

  Next, the first layer wiring M1 and the second layer wiring M2 are formed on the silicon oxide film 25. The formation process of these wirings is the same as that of the first embodiment described with reference to FIGS. Since this is the same as the case, the description thereof is omitted.

  In the case of the second to fourth embodiments, similarly, the silicon nitride film 23 of the plug P1 on the sources of the load MISFETs Qp1 and Qp2 is removed to form the opening OP1, and then the upper electrode 24 and the plug P2 are formed. The above-described effects can be obtained.

(Embodiment 6)
In the sixth embodiment (the same applies to the second to fourth embodiments), the region for about one memory cell has been described. However, the case where the present invention is applied to a memory cell array will be described.

  As shown in FIG. 33, the memory cells MC are arranged in a matrix at intersections of the data line pairs (DL, / DL) and the word lines WL. In the memory cell array, in addition to normal memory cells, redundant relief memory cells are formed. This redundant relief memory cell is also arranged at the intersection of the data line pair (DL, / DL) and the word line WL. When a defect occurs in a normal memory cell, the same data line (DL , / DL) is replaced with a memory cell column for redundancy relief by cutting a fuse (FUSE). FIG. 34 shows a layout of the memory cell array arranged on the chip. As shown in FIG. 34, the memory cell array is composed of a plurality of memory mats. Around the memory cell array, an input buffer (input Buf.), An output circuit, and peripheral circuits such as FUSE are arranged. Note that the above-described redundancy relief memory cell columns need not be formed in all memory mats.

  FIG. 35 is a fragmentary plan view of the semiconductor substrate showing the SRAM of the present embodiment. In the figure, two vertical and horizontal memory cells MC11, MC12, MC21, MC22 are arranged. The memory cells MC11 and MC21 have the same configuration as that of the memory cell according to the first embodiment described with reference to FIGS. Further, the memory cells MC21 and MC22 have a structure that is the same as the memory cells MC11 and MC12 with respect to BB in the drawing. Although not shown, memory cells MC11 and MC12 and target memory cells are arranged with respect to CC in the drawing, and memory cells MC21 and MC22 and target memory cells are set with respect to CC in the drawing. Be placed.

  Here, the upper electrodes 24 of the memory cells MC11 and MC12 are connected. The upper electrodes 24 of the memory cells MC21 and MC22 are also connected. Further, the upper electrode 24 of the memory cell (MC11, MC12) connected to the pair of data lines (DL, / DL) and the memory cell (MC21, MC) connected to another data line pair (DL, / DL). The upper electrode 24 of MC22) is independent (not connected).

  In this way, if the upper electrode 24 is divided for each data line pair (DL, / DL), redundant relief for each memory cell column connected to the same data line pair (DL, / DL) can be easily performed. It can be carried out.

  In the case of Embodiments 2 to 4, similarly, if the upper electrode 24 is divided for each data line pair (DL, / DL), they are connected to the same data line pair (DL, / DL). Redundant relief for each memory cell column can be easily performed.

  Further, in the case where redundant relief is performed for each memory cell row connected to the same word line pair (WL), the upper electrode 24 may be divided for each word line (WL). In addition, in the case where redundant relief is performed for each memory cell (for each bit), the upper electrode 24 may be divided for each memory cell.

(Embodiment 7)
In the seventh embodiment (the same applies to the second to fourth embodiments), the power supply potential (Vcc) is supplied to the upper electrode 24, and the storage node A or B and the power supply potential (Vcc) in FIG. Although the capacitor C is formed between them, a capacitor can also be formed between the storage nodes AB in FIG.

  A method for manufacturing the SRAM of the present embodiment will be described with reference to FIGS. Note that the steps up to the etching process of the surface of the silicon oxide film 21 described with reference to FIGS. 2 to 10 are the same as those in the first embodiment, and thus the description thereof is omitted.

  First, the semiconductor substrate 1 shown in FIG. 10 described in the first embodiment is prepared. As shown in FIGS. 36, 37, and 38, a silicon nitride film is formed on the silicon oxide film 21, the plug P1, and the wirings MD1, MD2. 23 is formed. The silicon nitride film 23 is formed between the wirings MD1 and MD2 serving as the lower electrodes and the upper electrode 24 described later, and serves as a capacitive insulating film. FIG. 38 is a plan view of the essential part of the substrate showing the method of manufacturing the SRAM of the present embodiment. 36 and FIG. 37 correspond to the AA cross section and the DD cross section in FIG. 38, respectively.

  Next, the silicon nitride film 23 on the wiring MD1 is removed, and an opening OP2 is formed.

  Next, as shown in FIGS. 39 and 40, a TiN film is deposited on the silicon nitride film 23 including the inside of the opening OP2 by sputtering and patterned, so that the upper part extending above the wirings MD1 and MD2 is formed. The electrode 24 is formed. The upper electrode 24 is connected to the wiring MD1 through the opening OP2.

  Through the above steps, a capacitor C composed of the wiring MD2 serving as the lower electrode, the silicon nitride film 23, and the upper electrode 24 connected to the wiring MD1 can be formed. This capacitor C is a capacitor connected between the storage nodes AB in FIG.

  As described above, according to the present embodiment, the capacitor C is formed by the wiring MD2 serving as the lower electrode, the silicon nitride film 23, and the upper electrode 24 connected to the wiring MD1, so that the capacitor C is incident on the SRAM memory cell. Soft errors due to alpha rays can be reduced. Further, when a capacitor is formed between the storage nodes AB in FIG. 1 as in this embodiment, a capacitor C is formed between the storage node A or B in FIG. 1 and the power supply potential (Vcc). Compared to the case, the critical charge amount (C) becomes larger.

  FIG. 47 shows the result of simulating the critical charge amount at which the data held in the storage node is inverted when a noise (current) pulse is applied to the storage node (A or B). The horizontal axis of the graph indicates the pulse width (s), and the vertical axis indicates the critical charge amount (C). As shown in FIG. 47, when the capacitor C is not formed (a), when the capacitor (2 fF) is formed between the storage nodes AB (c) and between the storage node A (B) and the power supply potential (Vcc) In the case where a capacitance (2 fF) is formed between the storage nodes A (B) and the power supply potential (Vcc), the critical charge amount is increased in both cases (b). When a capacitor is formed between the storage nodes AB, the critical charge amount is larger in (c). For example, at a pulse width of 20 nm, the capacity in the case of (b) is 2.4 fC larger than that in the case of (a), whereas the capacity in the case of (c) is 3.5 fC larger than in the case of (a). About 1.5 times more effective.

  Next, after the silicon oxide film is deposited on the upper electrode 24 by the CVD method, the first layer wiring M1 and the second layer wiring M2 are formed. These steps are described with reference to FIGS. Since it is similar to the case of the first embodiment described, the description thereof is omitted. As shown in FIG. 40, the upper electrode 24 does not extend over the sources of the load MISFETs Qp1 and Qp2, so the plugs P1, P2 on the sources of the load MISFETs Qp1 and Qp2 and the upper electrode 24 are not connected. .

  Similarly, in the case of the fourth embodiment (when the lower electrode 22 is not formed), after the silicon nitride film 23 on the wiring MD1 is removed and the opening OP2 is formed, the inside of the opening OP2 is included. By forming the upper electrode 24 on the silicon nitride film 23, a capacitance can be formed between the storage nodes AB in FIG.

  The case of Embodiments 2 and 3 having the lower electrode 22 will be described below.

  First, the semiconductor substrate 1 shown in FIG. 8 described in the first embodiment is prepared. As shown in FIGS. 41 and 42, a TiN film is formed on the silicon oxide film 21, the plug P1, and the wirings MD1 and MD2 by sputtering. Are deposited and patterned to form lower electrodes 22a and 22b on the wirings MD1 and MD2. The formation regions of the lower electrodes 22a and 22b are larger than the formation regions of the wirings MD1 and MD2, respectively. FIG. 42 is a plan view of the essential part of the substrate showing the method of manufacturing the SRAM of the present embodiment. 41 corresponds to the DD cross section in FIG.

  Next, a silicon nitride film 23 is formed on the lower electrodes 22 a and 22 b and the silicon oxide film 21. The silicon nitride film 23 is formed between the lower electrodes 22a and 22b and an upper electrode 24 described later, and becomes a capacitive insulating film.

  Next, as shown in FIGS. 43 and 44, the silicon nitride film 23 on the wiring MD1 is removed to form an opening OP2.

  Next, as shown in FIG. 45 and FIG. 46, a TiN film is deposited on the silicon nitride film 23 including the inside of the opening OP2 by sputtering and patterned, so that the upper part extending above the wirings MD1 and MD2 is formed. The electrode 24 is formed. The upper electrode 24 is connected to the lower electrode 22a on the wiring MD1 through the opening OP2.

  Through the above steps, the capacitor C composed of the lower electrode 22b, the silicon nitride film 23, and the upper electrode 24 connected to the wiring MD1 can be formed. This capacitor C is a capacitor connected between the storage nodes AB in FIG.

  Similarly, in the case of the third embodiment, the silicon nitride film 23 on the lower electrode 22a is removed from the lower electrodes 22a and 22b on the wirings MD1 and MD2, and the opening OP2 is formed. Capacitance can be formed between the storage nodes AB in FIG. 1 by forming the upper electrode 24 on the silicon nitride film 23 including the inside of OP2. The same applies to the case where the lower electrode 22 of the fourth embodiment is formed.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  As described above, the present invention is particularly effective when applied to a semiconductor integrated circuit device mounted on a mobile communication device such as a mobile phone, a memory card, and an IC card, as well as a cache memory for a personal computer or a workstation. It is.

1 is an equivalent circuit diagram showing an SRAM memory cell according to Embodiment 1 of the present invention; FIG. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 1 of this invention. It is a figure for demonstrating the effect of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 2 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 2 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 2 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 2 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 3 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 3 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 4 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 4 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 5 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 5 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 5 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 5 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 5 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 5 of this invention. It is a figure which shows arrangement | positioning of the memory cell of SRAM which is Embodiment 6 of this invention. It is a figure which shows arrangement | positioning of the memory cell array of SRAM which is Embodiment 6 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 6 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is principal part sectional drawing of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is a principal part top view of the board | substrate which shows the manufacturing method of SRAM which is Embodiment 7 of this invention. It is a figure for demonstrating the effect of this invention. It is a figure for demonstrating the subject of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor substrate 2 Element isolation | separation 3 P-type well 4 N-type well 5 Silicon oxide film 8 Gate oxide film 9 Polycrystalline silicon film 14 P ^- type semiconductor region 16 Side wall spacer 17 Silicon nitride film 18 p ⁺ type semiconductor region 19 CoSi ₂ Layer 20 PSG film 21 Silicon oxide film 22 Lower electrode 22a Lower electrode 22b Lower electrode 23 Silicon nitride film 24 Upper electrode 25 Silicon oxide film 27 Silicon oxide film A Storage node B Storage node An1 Active region An2 Active region Ap1 Active region Ap2 Active region C capacitance C1 contact hole C2 contact hole C3 contact hole DL, / DL data line G gate electrode HM wiring trench INV1 CMOS inverter INV2 CMOS inverter M1 first layer wiring M2 second layer wiring MC memory cell MC11, MC12 Memory cell MC21, MC22 Memory cell MD1 Wiring MD2 Wiring OP1 Opening OP2 Opening P1 Plug P2 Plug P3 Plug Qd1 Driving MISFET
Qd2 drive MISFET
Qp1 load MISFET
Qp2 load MISFET
Qt1 transfer MISFET
Qt2 transfer MISFET
WL Word line a Recessed Vcc Power supply voltage Vss Reference voltage

Claims (2)

First and second transfer MISFETs, first and second drive MISFETs, and first and second load MISFETs arranged at the intersections of a pair of complementary data lines and word lines, A semiconductor integrated circuit device having a memory cell in which the first drive MISFET and the first load MISFET, and the second drive MISFET and the second load MISFET are cross-coupled. A method,
The first transfer MISFET, the second transfer MISFET, the first drive MISFET, the second drive MISFET, the first load MISFET, and the second load MISFET are formed. Process,
Said first transfer MISFET, the second transfer MISFET, the first drive MISFET, the second drive MISFET, a surface on the first load MISFET and the second load MISFET on Forming a planarized interlayer insulating film; and
A first wiring groove that extends in gate electrode machining gap of the first of the drain of the driving MISFET via a drain above said first load MISFET second drive MISFET, the second Forming a second wiring trench in the interlayer insulating film extending from the drain of the driving MISFET to the gate electrode of the first driving MISFET via the drain of the second load MISFET. When,
Depositing a conductive film on the interlayer insulating film including inside the first wiring groove and the second wiring groove ;
By polishing the conductive film to expose the surface of the interlayer insulating film, a first conductive layer embedded in the first wiring groove, the buried in the second wiring groove forming a second conductive layer,
Exposing the upper surfaces of the side walls of the first conductive layer and the second conductive layer by further etching the exposed surface of the interlayer insulating film;
Forming a capacitive insulating film along the top and exposed sidewalls of the first and second conductive layers ;
Forming an upper electrode on the capacitive insulating film;
A method for manufacturing a semiconductor integrated circuit device, comprising: The semiconductor integrated circuit device, said memory cell having a first direction and the memory cell array in which a plurality arranged in a second direction perpendicular thereto,
2. The semiconductor integrated circuit device according to claim 1, wherein the upper electrode is connected along the first direction, but is divided for each memory cell arranged in the second direction. Production method.

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