JP4525773B2 - Multilayer ceramic capacitor - Google Patents

Description

  The present invention relates to a multilayer ceramic capacitor, and more particularly to a multilayer ceramic capacitor that is a multi-terminal type in order to reduce equivalent series inductance (ESL).

  In a power supply circuit, if the voltage fluctuation in the power supply line increases due to the impedance existing in the power supply line or ground, the operation of the driving circuit becomes unstable or interference between the circuits occurs via the power supply circuit. Cause oscillation. Therefore, normally, a decoupling capacitor is connected between the power supply line and the ground. The decoupling capacitor reduces the impedance between the power supply line and the ground, and plays the role of suppressing fluctuations in the power supply voltage and interference between circuits.

  In recent years, in communication devices such as mobile phones and information processing devices such as personal computers, the speed of signals has been increased in order to process a large amount of information, and the clock frequency of ICs used has been increased. Yes. For this reason, noise containing a large amount of harmonic components is likely to occur, and it is necessary to perform stronger decoupling in the IC power supply circuit.

  In order to enhance the decoupling effect, it is effective to use a decoupling capacitor having excellent impedance frequency characteristics, and examples of such a decoupling capacitor include a multilayer ceramic capacitor. Since the multilayer ceramic capacitor has a small ESL, the multilayer ceramic capacitor has an excellent noise absorption effect over a wide frequency band as compared with the electrolytic capacitor.

  As a multilayer ceramic capacitor suitable for such decoupling, for example, in Patent Document 1 (Japanese Patent Laid-Open No. 2003-318066), a potential is applied so that a current in a predetermined direction flows in a part of the capacitor portion of the capacitor array. In addition, it is described that ESL is reduced by applying a potential so that a current in the reverse direction flows through another capacitor unit to cancel a magnetic field generated around the current flowing through the two capacitor units.

  However, the multilayer ceramic capacitor described in Patent Document 1 described above has the following problems to be solved.

  First, when a multilayer ceramic capacitor is mounted on a wiring board via solder, when a solder crack or the like occurs and the connection between a certain external terminal electrode and the conductive land is cut off, the connection is cut off to the external terminal. The capacitance for the array in which the electrode is involved cannot be acquired, and the capacitance is relatively greatly reduced. For example, even if a solder crack or the like occurs only at one place, the capacitance of “1 / number of arrays” is lost.

Moreover, the trouble for confirming the electrostatic capacitance as the whole of the multilayer ceramic capacitor is complicated. That is, since the electrostatic capacity of the entire multilayer ceramic capacitor is the sum of the capacities in each capacitor array part, in order to obtain the entire capacity, the capacity is measured for each capacitor array part, and these are added together, Either the measurement must be performed with all external terminal electrodes connected to a wiring board or the like.
JP 2003-318066 A

  Accordingly, an object of the present invention is to provide a multilayer ceramic capacitor that can solve the above-described problems.

  The multilayer ceramic capacitor according to the present invention includes a plurality of laminated ceramic layers, and has first and second main surfaces facing each other and a side surface connecting the first and second main surfaces. It has a capacitor body.

  A plurality of first external terminal electrodes connected to the first potential and a plurality of second external terminal electrodes connected to the second potential are formed on the side surface of the capacitor body.

  The capacitor body includes a first internal electrode electrically connected to the first external terminal electrode, a second internal electrode electrically connected to the second external terminal electrode, and a first A third internal electrode electrically connected to the external terminal electrode and a fourth internal electrode electrically connected to the second external terminal electrode are formed.

  In the capacitor body, one or more first capacitor portions are formed in which a capacitance is formed by disposing the first internal electrode and the second internal electrode with a specific ceramic layer interposed therebetween. In addition, the capacitor is arranged along with the first capacitor portion along the plane direction of the ceramic layer, and the third internal electrode and the fourth internal electrode are arranged with the specific ceramic layer interposed therebetween. One or more second capacitor parts are formed.

Furthermore, the multilayer ceramic capacitor according to the present invention is formed inside the capacitor main body and spans two or more capacitor parts selected from the first capacitor part and the second capacitor part, and the plurality of first ceramic capacitors. A first same polarity connecting conductor electrically connected to two or more of the external terminal electrodes . And the said side surface has the 1st and 2nd side surface which mutually opposes, and the 1st same-polarity connection conductor is a some main part, and the some drawer | drawing-out part withdraw | derived from this main body part to the 1st side surface When the ceramic layer is viewed in a plane, a region defined by the side of the main body part and two adjacent sides in the two adjacent drawer parts drawn out to the first side surface is formed, and The side of the main body is characterized in that it is disposed closer to the first side surface among the first and second side surfaces .

  The multilayer ceramic capacitor according to the present invention is configured so that the direction of the current flowing through each internal electrode is opposite between at least the parts of the adjacent internal electrodes that are located on the same ceramic layer and face each other. It is preferably connected to a circuit.

  In the present invention, the first internal electrode is electrically connected to one first external terminal electrode, the second internal electrode is electrically connected to one second external terminal electrode, and the third The internal electrode may be electrically connected to one first external terminal electrode, and the fourth internal electrode may be electrically connected to one second external terminal electrode. Alternatively, the first internal terminal may be electrically connected to the first external terminal electrode. The internal electrode is electrically connected to the plurality of first external terminal electrodes, the second internal electrode is electrically connected to the plurality of second external terminal electrodes, and the third internal electrode is a plurality of The fourth external electrode may be electrically connected to the first external terminal electrode, and the fourth internal electrode may be electrically connected to the plurality of second external terminal electrodes.

  Moreover, in this invention, it is preferable that the 1st same-polarity connection conductor is electrically connected with all the 1st external terminal electrodes.

In the present invention , the first same-polarity connection conductor is electrically connected only to the first external terminal electrode formed on the first side surface, and the first homopolar connection conductor is formed on the second side surface. The first external terminal formed on the first side surface and the first external terminal formed on the second side surface, even if only those externally connected to the external terminal electrode are included. What is electrically connected with both of the electrodes may be included.

  In the present invention, either a single first homopolar connection conductor or a plurality of first homopolar connection conductors may be formed inside the capacitor body, but in the latter case, Preferably, the plurality of first homopolar connection conductors are continuously arranged in the stacking direction.

The first same-polarity connection conductor is electrically connected to the main body portion having a relatively large area and the plurality of first external terminal electrodes drawn from the main body portion with respect to the main body portion and the lead portion described above. It is preferable to have a plurality of drawers having a relatively small area.

  Instead of the above-described preferred embodiment, the first homopolar connection conductor may be formed in a line shape having a predetermined width. In this case, when viewed on a specific interface between the ceramic layers, it is preferable that the area occupied by the exposed portion of the ceramic layer is larger than the area occupied by the first homopolar connection conductor.

  In the present invention, on the interface between the ceramic layers where the first homopolar connection conductor is formed, it is not connected to the first homopolar connection conductor, but is connected to or close to the second external terminal electrode. It is preferable to further comprise a first dummy inner conductor positioned.

  Moreover, the 1st same-polarity connection conductor may contain what is arrange | positioned so as to oppose the 1st and 3rd internal electrode through a ceramic layer. Alternatively, the first same-polarity connection conductor is disposed in proximity to at least one of the first and second main surfaces, and faces the second and / or fourth internal electrodes via the ceramic layer. May be included.

  In addition, it is preferable that a buffer region where none of the first to fourth internal electrodes is formed is formed near the center in the stacking direction of the capacitor body. In this case, it is more preferable that the first homopolar connection conductor is disposed in the buffer region.

  The multilayer ceramic capacitor according to the present invention is formed inside the capacitor body, and extends over two or more capacitor parts selected from the first capacitor part and the second capacitor part, and a plurality of second external capacitors. It is preferable to further include a second homopolar connection conductor that is electrically connected to two or more of the terminal electrodes. With respect to such a second homopolar connection conductor, an embodiment similar to the case of the first homopolar connection conductor described above is possible as will be described in detail below.

  First, it is preferable that the second homopolar connection conductor is electrically connected to all the second external terminal electrodes.

  When the side surface has first and second side surfaces opposite to each other, the second homopolar connection conductor is electrically connected only to the second external terminal electrode formed on the first side surface. Alternatively, the second external terminal electrode formed on the first side surface and the second external terminal electrode formed on the second side surface may be electrically connected.

  In addition, a single second homopolar connection conductor may be formed inside the capacitor body, or a plurality of second homopolar connection conductors may be formed. In the latter case, a plurality of second homopolar connection conductors may be formed. It is preferable that the second homopolar connection conductor is continuously arranged in the stacking direction.

  The second homopolar connection conductor also has a relatively large area main body and a plurality of relatively small areas drawn from the main body and electrically connected to the plurality of second external terminal electrodes. It is preferable to have a drawer portion.

  Instead of the above-described preferred embodiment, the second homopolar connection conductor may be formed in a line shape having a predetermined width. In this case, the area occupied by the exposed portion of the ceramic layer is preferably larger than the area occupied by the second same-polarity connecting conductor when viewed on a specific interface between the ceramic layers.

  Further, on the interface between the ceramic layers where the second homopolar connection conductor is formed, the second homopolar connection conductor is not connected, but is connected to or close to the first external terminal electrode. Preferably, two dummy inner conductors are further provided.

  The second same-polarity connection conductor may include a conductor disposed so as to face the second and fourth internal electrodes with the ceramic layer interposed therebetween. Alternatively, the second same-polarity connection conductor is disposed in proximity to at least one of the first and second main surfaces, and faces the first and / or third internal electrodes via the ceramic layer. May be included.

  Further, when a buffer region where none of the first to fourth internal electrodes is formed is formed near the center in the stacking direction of the capacitor body, the second same-polarity connecting conductor is disposed in the buffer region. Is preferred.

  When both the first and second homopolar connection conductors are provided, the first homopolar connection conductor is disposed to face the first and third internal electrodes via the ceramic layer, and the first In addition, it is preferable to include the one disposed on the side opposite to the side where the third internal electrode is located so as to face the second same-polarity connecting conductor via the ceramic layer.

  According to this invention, two or more of the plurality of first external terminal electrodes are electrically connected to each other by the first same-polarity connection conductor. Therefore, in a state where the conductive lands on the wiring board and each of the external terminal electrodes are electrically connected via the solder, an accident such as a solder crack occurs in any of the first external terminal electrodes, and the first Even if the connection between any one of the external terminal electrodes and the conductive land is disconnected, the first external terminal electrode that has been disconnected is connected to the other first terminal via the same-polarity connection conductor. If it is electrically connected to the external terminal electrode, the capacitance that can be provided by the multilayer ceramic capacitor can be ensured to a desired value.

  In addition, the overall capacitance of the multilayer ceramic capacitor can be measured by using only one of the two or more first external terminal electrodes connected by the same-polarity connection conductor. Since it is not necessary to perform measurement using one external terminal electrode, the capacitance of the entire multilayer ceramic capacitor can be easily confirmed.

  In this invention, if the first same-polarity connection conductor is electrically connected to all the first external terminal electrodes, even if an accident such as a solder crack occurs in any of the first external terminal electrodes, In the multilayer ceramic capacitor, a desired capacitance can be ensured.

  Further, if only one first homopolar connection conductor is formed inside the capacitor body, the multilayer ceramic capacitor can be advantageously reduced in height.

  On the other hand, when a plurality of first homopolar connection conductors are formed inside the capacitor main body, the first homopolar connection conductors are arranged in the stacking direction and the first The connection reliability between the same-polarity connection conductor and the first external terminal electrode can be improved, and the effect of backup at the time of disconnection can be further ensured.

  The first same-polarity connection conductor includes a relatively large area main body, and a plurality of relatively small areas that are drawn from the main body and electrically connected to the plurality of first external terminal electrodes, respectively. When the single lead-out portion is provided, a current path is easily secured due to the presence of the main body portion having a relatively large area, and the backup effect at the time of disconnection can be more reliably exhibited. Such a configuration is effective when it is desired to reduce the number of first homopolar connection conductors.

  When the first homopolar connection conductor is formed in a line having a predetermined width, the exposed portion of the ceramic layer is larger than the area occupied by the first homopolar connection conductor when viewed on a specific interface between the ceramic layers. As a result, it is easy to make the area occupied by the ceramic layer wider, and as a result, the bonding strength between the ceramic layers can be increased.

  When the first dummy inner conductor connected to or close to the second external terminal electrode is formed on the interface between the ceramic layers where the first same-polarity connection conductor is formed, the first same-polarity connection conductor is formed. It is possible to absorb a step that may be caused by the presence or absence of a lead portion extending from the pole connection conductor and connected to the first external terminal electrode.

  If the first homopolar connection conductor is disposed so as to face the first and third internal electrodes via the ceramic layer, the first homopolar connection conductor does not substantially contribute to capacity formation. The variation in capacitance due to the provision of the first same-polarity connection conductor can be substantially eliminated.

  On the other hand, the first same-polarity connection conductor is disposed in proximity to at least one of the first and second main surfaces, and faces the second and / or fourth internal electrodes via the ceramic layer. When the first common-polarity connecting conductor is disposed, the capacitance is formed by facing the first homopolar connecting conductor and the second and / or fourth internal electrodes. The first homopolar connecting conductor has at least two lead portions. Therefore, the current dispersion effect is large, and by arranging the first same-polarity connection conductor near the mounting surface, it is possible to reduce the loop inductance, thereby achieving low ESL. .

  A buffer region in which none of the first to fourth internal electrodes is formed is formed near the center of the capacitor body in the stacking direction. When the first homopolar connection conductor is disposed in this buffer region, Such an effect is produced. When a material having a high dielectric constant is used as the dielectric constituting the ceramic layer, the capacitor body expands and contracts due to the electrostrictive effect of the dielectric, and the capacitor body may crack due to the stress generated thereby. The buffer region described above acts to relieve the stress that causes this crack. On the other hand, since no internal electrode is formed in the buffer region, the flexure strength is lowered as it is. Therefore, as described above, when the first homopolar connection conductor is arranged in the buffer region, the first homopolar connection conductor fulfills the function of improving the strength in addition to the original function.

  When the multilayer ceramic capacitor according to the present invention further includes the second same-polarity connection conductor, an effect substantially similar to the effect brought about by the first same-polarity connection conductor described above is obtained. Provided by the homopolar conductor.

  In the above case, the first same-polarity connecting conductor is disposed so as to face the first and third internal electrodes through the ceramic layer, and the side on which the first and third internal electrodes are located On the opposite side, including the one disposed so as to face the second homopolar connection conductor via the ceramic layer, no capacitance is generated between each homopolar connection conductor and each internal electrode. A capacitance is generated between the first and second same-polarity connection conductors. Therefore, the capacitance of the entire multilayer ceramic capacitor can be finely adjusted by adjusting the capacitance generated between the first and second same-polarity connecting conductors.

  In the present invention, when the direction of the current flowing through each internal electrode is reversed between at least the portions of the adjacent internal electrodes facing each other, magnetic field cancellation occurs between the adjacent internal electrodes. Therefore, ESL can be effectively reduced.

  1 to 4 are for explaining a multilayer ceramic capacitor 1 according to a first embodiment of the present invention. Here, FIG. 1 is a perspective view showing the appearance of the multilayer ceramic capacitor 1, and FIG. 2 is a plan view showing the appearance of the multilayer ceramic capacitor 1. FIG. 3 is a plan view showing the internal structure of the multilayer ceramic capacitor 1 with several cross sections, and the numbers (1) to (4) also indicate the stacking order from above. FIG. 4 is a perspective view showing a mounted state of the multilayer ceramic capacitor 1 shown in FIG.

The multilayer ceramic capacitor 1 includes a rectangular parallelepiped capacitor body 3 that includes a plurality of laminated ceramic layers 2. The ceramic layer 2 is made of, for example, a dielectric ceramic mainly composed of BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO _{3 and the} like. Note that subcomponents such as a Mn compound, an Fe compound, a Cr compound, a Co compound, and a Ni compound may be added to these main components. Moreover, the thickness of the ceramic layer 2 shall be 2.0-3.0 micrometers, for example.

  The capacitor body 3 includes first, second, third, and fourth side surfaces 6 and 7 that connect the first and second main surfaces 4 and 5 and the first and second main surfaces 4 and 5 that face each other. , 8 and 9. Here, the ceramic layer 2 extends in the direction of the main surfaces 4 and 5, and the side surfaces 6 to 9 extend in the laminating direction of the ceramic layer 2. The first and second side surfaces 6 and 7 face each other, the third and fourth side surfaces 8 and 9 face each other, and the first and second side surfaces 6 and 7 are the long sides of the ceramic layer 2. It is in a position along.

  On the side surface of the capacitor body 3, in this embodiment, on the first and second side surfaces 6 and 7, a plurality of, in this embodiment, four first and second external terminal electrodes 10, respectively. And 11 are formed. A first potential is connected to the first external terminal electrode 10, and a second potential is connected to the second external terminal electrode 11. The first and second external terminal electrodes 10 and 11 are preferably arranged so as to be alternately arranged.

  In the following description, when it is necessary to distinguish between the four first external terminal electrodes 10, “10-1”, “10-2”, “10” -3 ”and“ 10-4 ”, and when it is necessary to distinguish between the four second external terminal electrodes 11,“ 11-1 ”for the second external terminal electrodes , “11-2”, “11-3” and “11-4” are used.

  For example, Cu, Ni, Ag, Pd, an Ag—Pd alloy, or Au can be used as the conductive component of the external terminal electrodes 10 and 11. When mounting the multilayer ceramic capacitor 1 using solder, it is preferable that the external terminal electrodes 10 and 11 have a structure in which Ni plating and Sn plating are sequentially applied on a metal layer as a base. Further, when mounting with the multilayer ceramic capacitor 1 embedded in the resin substrate, the external terminal electrodes 10 and 11 were subjected to Cu plating with good adhesion to the resin on the metal layer as a base. A structure is preferable. Moreover, when mounting using a conductive adhesive, it is preferable to use Ag, Pd, or an Ag—Pd alloy as the conductive component contained in the external terminal electrodes 10 and 11. Furthermore, it is preferable to use Au as the conductive component contained in the external terminal electrodes 10 and 11 when mounting by wire bonding.

  A plurality of first, second, third and fourth internal electrodes 12, 13, 14 and 15 are formed in the capacitor body 3 as shown in FIGS. 3 (2) and 3 (3). The For example, Ni, Cu, Ag, Pd, an Ag—Pd alloy, or Au can be used as the conductive component included in the internal electrodes 12 to 15. The thickness of each of the internal electrodes 12 to 15 is about 0.8 to 1.2 μm.

  The first and second internal electrodes 12 and 13 constitute the first capacitor unit 16 and are opposed to each other via the ceramic layer 2 so as to form a capacitance between them. The third and fourth internal electrodes 14 and 15 constitute the second capacitor unit 17 and face each other through the ceramic layer 2 so as to form a capacitance between them. Yes. The second capacitor portion 17 is arranged side by side with the first capacitor portion 16 along the planar direction of the ceramic layer 2.

  In this embodiment, as shown in FIGS. 3 (2) and (3), two internal electrodes 12 to 15 are formed on a specific interface between the ceramic layers 2. In the following description, when it is necessary to distinguish between each of the internal electrodes 12 to 15 between the two, the reference numerals “12-1” and “12-2” are used for the first internal electrode. Used for the second internal electrode, reference numerals "13-1" and "13-2" are used, and for the third internal electrode, reference numerals "14-1" and "14-2" are used. The reference numerals “15-1” and “15-2” are used for the fourth internal electrode.

  In this embodiment, two first capacitor portions 16 and two second capacitor portions 17, that is, a total of four capacitor portions 16 and 17 are formed. Each of the internal electrodes 12 and 15 has one lead portion to be connected to the external terminal electrode 10 or 11, and each lead portion of the internal electrodes 12 to 15 is drawn to the side surface 6. Those that are drawn out to the side surface 7 facing this are alternately arranged, and are electrically connected to the corresponding ones of the external terminal electrodes 10 or 11.

  More specifically, as shown in FIG. 3B, the first internal electrodes 12-1 and 12-2 are electrically connected to the first external terminal electrodes 10-1 and 10-2, respectively. Is done. As shown in FIG. 3 (3), the second internal electrodes 13-1 and 13-2 are electrically connected to the second external terminal electrodes 11-3 and 11-4, respectively. As shown in FIG. 3B, the third internal electrodes 14-1 and 14-2 are electrically connected to the first external terminal electrodes 10-3 and 10-4, respectively. As shown in FIG. 3 (3), the fourth internal electrodes 15-1 and 15-2 are electrically connected to the second external terminal electrodes 11-1 and 11-2, respectively.

  As can be seen from these connection states, the first internal electrode 12 and the third internal electrode 14 located on the same interface between the ceramic layers 2 are commonly electrically connected to the first external terminal electrode. In addition, the second internal electrode 13 and the fourth internal electrode 15 located on the same interface are commonly electrically connected to the second external terminal electrode 11.

  Further, as shown in FIGS. 3 (1) and 3 (4), first and second same-polarity connection conductors 18 and 19 are formed inside the capacitor body 3, respectively. These same-polarity connection conductors 18 and 19 are preferably made of the same material as the internal electrodes 12 to 15 described above, and the thickness thereof is, for example, 0.8 to 1. It is about 2 μm.

  As shown in FIG. 3 (1), the first homopolar connection conductor 18 includes a main body portion 22 having a relatively large area and four lead portions 20 having a relatively small area drawn out from the main body portion 22. Have. In particular, in this embodiment, the width direction dimension A of the main body portion 22 is made larger than the width direction dimension B of the drawer portion 20. The four lead portions 20 are electrically connected to the four first external terminal electrodes 10, respectively, so that the first homopolar connection conductor 18 is connected to all the first external terminal electrodes 10. Electrically connected.

As shown in FIG. 3 (1), the first homopolar connection conductor 18 includes a main body portion 22 having a relatively large area and four lead portions 20 having a relatively small area drawn out from the main body portion 22. Have. In particular, in this embodiment, the width direction dimension A of the main body portion 22 is made larger than the width direction dimension B of the drawer portion 20. The four lead portions 20 are electrically connected to the four first external terminal electrodes 10, respectively, so that the first homopolar connection conductor 18 is connected to all the first external terminal electrodes 10. Electrically connected.
The following features can be read from FIG. 3A regarding the first same-polarity connection conductor 18 as described above. That is, when the ceramic layer 2 is viewed in a plane, a region defined by the side of the main body portion 22 and the two adjacent sides of the two adjacent drawing portions 20 drawn to the first side surface 6 is formed. The side of the main body portion 22 is disposed closer to the first side surface 6 of the first and second side surfaces 6 and 7.

  In this embodiment, only one first and second same-polarity connection conductors 18 and 19 are formed inside the capacitor body 3.

  As described above, the capacitor main body 3 is laminated in the order of lamination shown in FIGS. Therefore, the first homopolar connection conductors 18 and 19 are arranged so as to sandwich the capacitor parts 16 and 17. Note that a predetermined number of ceramic layers 2 on which neither the internal electrodes nor the same-polarity connection conductors are formed are laminated at both ends in the laminating direction of the capacitor body 3, although not particularly illustrated. Further, regarding the laminated structure of the capacitor body 3, the laminated portions shown in FIGS. 3 (2) and 3 (3) are laminated by being repeated a predetermined number of times as necessary.

  In this embodiment, the first homopolar connection conductor 18 is disposed so as to face the first and third internal electrodes 12 and 14 with the ceramic layer 2 interposed therebetween. Therefore, no capacitance is generated between the first homopolar connection conductor 18 and the first and third internal electrodes 12 and 14, and the capacitance due to the formation of the first homopolar connection conductor 18 is increased. Variation can be suppressed. Similarly, the second homopolar connection conductor 19 is disposed so as to face the second and fourth internal electrodes 13 and 15 with the ceramic layer 2 interposed therebetween. Therefore, no capacitance is generated between the second same-polarity connection conductor 19 and the second and fourth inner electrodes 13 and 15, and the capacitance variation due to the formation of the second same-polarity connection conductor 19 is not caused. Can be suppressed.

  Further, in this embodiment, as can be seen with reference to FIG. 3, the current directions of the currents flowing through the internal electrodes 12 to 15 are located on the same ceramic layer 2 and are opposite to each other between adjacent internal electrodes. Thus, the external terminal electrodes 10 and 11 are connected to an external circuit. Therefore, the magnetic field generated around the current flowing through each of the internal electrodes 12 to 15 is canceled and ESL can be reduced.

  In FIG. 1, the wiring board 24 is indicated by an imaginary line. The multilayer ceramic capacitor 1 is surface-mounted on the wiring board 24, for example, with the second main surface 5 of the capacitor body 3 being a surface facing the wiring board 24 side. A specific example of this mounting state will be described with reference to FIG.

  Conductor lines 25 are routed on the wiring board 24, and conductor lands 26 to 29 are formed on the conductor lines 25. In addition, conductor lands 30 to 33 are formed on the wiring board 24. Each of the conductor lands 30 to 33 is electrically connected to a circuit (not shown) inside the wiring board 24 via a via conductor. FIG. 4 shows via conductors 34, 35 and 36 which are electrically connected to conductor lands 31, 32 and 33, respectively.

  When the multilayer ceramic capacitor 1 is mounted on the wiring board 24, the first external terminal electrodes 10-1, 10-2, 10-3 and 10-4 are respectively connected to the conductor lands 30, 31, 32 and 33. The connection is fixed through the solder 37. On the other hand, the second external terminal electrodes 11-1, 11-2, 11-3, and 11-4 are connected and fixed to the conductor lands 26, 27, 28, and 29 via the solder 37, respectively.

  Thus, all of the first external terminal electrodes 10-1, 10-2, 10-3, and 10-4, and the second external terminal electrodes 11-1, 11-2, 11-3, and 11-4. Are respectively connected to corresponding ones of the conductor lands 26-33. At this time, the conductor lands 26 to 29 formed on the common conductor line 25 are at the same potential, and the conductor lands 30 to 33 are adjacent to each other because they have a different potential from the conductor lands 26 to 29. The potentials to be connected are different between the external terminal electrodes, that is, between the first external terminal electrode 10 and the second external terminal electrode 11.

  According to the multilayer ceramic capacitor 1 according to the first embodiment described above, all the first external terminal electrodes 10 are electrically connected by the first same-polarity connection conductor 18, and the second same-polarity is also provided. All the second external terminal electrodes 11 are electrically connected by the connection conductor 19. Therefore, the multilayer ceramic capacitor 1 is mounted on the wiring board 24 so that the conductor lands 26 to 33 on the wiring board 24 and each of the external terminal electrodes 10 and 11 are electrically connected via the solder 37. Even if the connection between any one of the external terminal electrodes 10 and 11 and the corresponding conductor land is cut off due to an accident such as a solder crack, the multilayer ceramic capacitor 1 has a desired Capacitance can be secured.

  Further, in the first embodiment, the same-polarity connection conductors 18 and 19 are respectively provided with a relatively large area main body portions 22 and 23 and a plurality of relatively small area drawers drawn from the main body portions 22 and 23. Since the parts 20 and 21 are included, the presence of the relatively large body parts 22 and 23 makes it easy to secure a current path, and more reliably exert the above-described backup effect at the time of disconnection. Can do. Note that the configuration for obtaining such an effect may be adopted only in the first homopolar connection conductor 18.

  Further, the capacitance of the multilayer ceramic capacitor 1 as a whole can be measured using any one of the first external terminal electrodes 10 and any one of the second external terminal electrodes 11. Therefore, the electrostatic capacity as a whole can be easily confirmed.

  Note that, according to this embodiment, all the first external terminal electrodes 10 can be electrically connected to each other only by the single first homopolar connection conductor 18. Although it is advantageous in reducing the height, if such an advantage is not desired, a plurality of first homopolar connection conductors 18 may be provided along the interface between the different ceramic layers 2. The same applies to the second homopolar connection conductor 19.

  Next, an example of a method for manufacturing the above-described multilayer ceramic capacitor 1 will be described.

  First, a ceramic green sheet to be the ceramic layer 2, a conductive paste for the internal electrodes 12 to 15, a conductive paste for the external terminal electrodes 10 and 11, and a conductive property for the homopolar connection conductors 18 and 19 Each paste is prepared. In the example described here, the same conductive paste as that for the internal electrodes 12 to 15 is used as the conductive paste for the same polarity connection conductors 18 and 19. Also, known ceramic green sheets and conductive pastes can be used, respectively.

  Next, a conductive paste is printed on the ceramic green sheet with a predetermined pattern by, for example, a screen printing method. As a result, a ceramic green sheet on which conductive paste films to be the internal electrodes 12 to 15 and the homopolar connection conductors 18 and 19 are formed is obtained.

  Next, the ceramic green sheets on which the conductive paste film is formed as described above are stacked in a predetermined order, and a predetermined number of outer layer ceramic green sheets on which the conductive paste film is not formed are stacked. A mother laminate in a raw state is obtained. The raw mother laminate is pressure-bonded in the laminating direction by means such as an isostatic press as required.

  Next, the raw mother laminated body is cut into a predetermined size, whereby the raw capacitor body 3 is cut out.

  Next, the raw capacitor body 3 is fired. The firing temperature depends on the ceramic material contained in the ceramic green sheet and the metal material contained in the conductive paste film, but is selected from 900 to 1300 ° C., for example.

  Next, a conductive paste is printed in a predetermined pattern on the first and second side surfaces 6 and 7 of the sintered capacitor body 3 by applying a screen printing method or the like, and the external terminal electrodes 10 and 11 are printed. A conductive paste film for forming is formed. This conductive paste film is preferably formed so as to extend from each of side surfaces 6 and 7 to a part of each of main surfaces 4 and 5.

Next, the conductive paste film is baked, whereby external terminal electrodes 10 and 11 are formed. This baking temperature is selected from 700 to 900 ° C., for example. As the atmosphere during baking, depending on the type of metal contained in the conductive paste, air, N _2, atmosphere such as water vapor + N ₂ are selectively used.

  In this way, the multilayer ceramic capacitor 1 is completed. If necessary, the surfaces of the external terminal electrodes 10 and 11 may be plated.

  Hereinafter, another embodiment of the present invention will be described. The multilayer ceramic capacitor according to another embodiment described with reference to the drawings has the same appearance as the multilayer ceramic capacitor 1 according to the first embodiment described above. It is the same and has the same external appearance as shown in FIGS.

  FIG. 5 is for explaining the second embodiment of the present invention. This second embodiment gives a modification of the same-polarity connection conductors 18 and 19 in the first embodiment, and FIGS. 5 (1) and (2) are shown in FIGS. 3 (1) and (4), respectively. ). In FIG. 5, elements corresponding to those shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 5, in the second embodiment, the first and second homopolar connection conductors 18a and 19a are formed in a line shape having a predetermined width. Therefore, when viewed on a specific interface between the ceramic layers 2, the area occupied by the exposed portion of the ceramic layer 2 is made wider than the area occupied by each of the first and second homopolar connection conductors 18a and 19a. Is easy. As a result, according to the second embodiment, the bonding strength between the ceramic layers 2 can be increased.

  FIG. 6 is for explaining the third embodiment of the present invention. 6 (1) and (2) correspond to FIGS. 3 (1) and (4), respectively. In FIG. 6, elements corresponding to the elements shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

  In the third embodiment, first and second same-polarity connection conductors 18a and 19a having the same shape as in the second embodiment described above are formed. In the third embodiment, as shown in FIG. 6A, the first homopolar connection conductor 18a is not connected on the interface between the ceramic layers 2 where the first homopolar connection conductor 18a is formed. Is provided with a first dummy inner conductor 40 connected to the second external terminal electrode 11. Further, as shown in FIG. 6 (2), the second homopolar connection conductor 19a is not connected to the second homopolar connection conductor 19a on the interface between the ceramic layers 2 where the second homopolar connection conductor 19a is formed. A second dummy inner conductor 41 connected to the external terminal electrode 10 is provided. According to the first and second dummy inner conductors 40 and 41, the steps generated due to the presence or absence of the lead portions 20 and 21 of the first and second homopolar connection conductors 18a and 19a are advantageously absorbed. can do.

  It should be noted that the first and second dummy inner conductors 40 and 41 may be positioned close to each other without being connected to the second and first external terminal electrodes 11 and 10, respectively. The dummy inner conductors 40 and 41 may be applied in the first embodiment described above.

  FIG. 7 is for explaining a fourth embodiment of the present invention. This fourth embodiment also provides a modification of the same-polarity connection conductors 18 and 19 in the first embodiment. FIGS. 7 (1) and (2) are shown in FIGS. This corresponds to 4). In FIG. 7, elements corresponding to those shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

  In the fourth embodiment, as shown in FIG. 7A, the first external terminal electrode 10 formed on the first side surface 6 among the first and second side surfaces 6 and 7 that face each other. -1 and 10-2 are electrically connected to only the first homopolar connection conductor 44, and only the first external terminal electrodes 10-3 and 10-4 formed on the second side surface 7 are electrically connected to each other. And second external terminal electrodes 11-1 and 11- formed on the first side face 6 as shown in FIG. 7 (2). 2 and the second same-polarity connection conductor 46 that is electrically connected only to the second external terminal electrodes 11-3 and 11-4 formed on the second side surface 7. A second homopolar connection conductor 47 is provided. Further, these homopolar connection conductors 44 to 47 are formed in a line shape having a predetermined width.

  FIG. 8 is a view corresponding to FIG. 3 for explaining the multilayer ceramic capacitor 1a according to the fifth embodiment of the present invention. The fifth embodiment provides a modification of the capacitor portions 16 and 17 in the first embodiment. In FIG. 8, elements corresponding to those shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

  In the fifth embodiment, simply speaking, as shown in FIGS. 8 (2) and (3), the plurality of internal electrodes located on the same ceramic layer 2 are all drawn out to the same side. It is characterized by that.

  More specifically, the first internal electrode 12 and the fourth internal electrode 15 are formed on the ceramic layer 2 shown in FIG. The first internal electrodes 12-1 and 12-2 are electrically connected to the first external terminal electrodes 10-1 and 10-2, respectively, and the fourth internal electrodes 15-1 and 15-2 are respectively connected. Are electrically connected to the second external terminal electrodes 11-1 and 11-2, respectively.

  On the other hand, the second internal electrode 13 and the third internal electrode 14 are formed on the ceramic layer 2 shown in FIG. The second internal electrodes 13-1 and 13-2 are electrically connected to the second external terminal electrodes 11-3 and 11-4, respectively, and the third internal electrodes 14-1 and 14-2 are respectively connected. Are electrically connected to the first external terminal electrodes 10-3 and 10-4, respectively.

  Thus, the first and fourth internal electrodes 12 and 15 formed on the ceramic layer 2 shown in FIG. 8 (2) are alternately arranged to be connected to different potentials. As for the second and third internal electrodes 13 and 14 formed on the ceramic layer 2 shown in 8 (3), those connected to different potentials are alternately arranged. In the fifth embodiment as well, when viewed in the current direction of the current flowing through each of the internal electrodes 12 to 15, the adjacent internal electrodes located on the same ceramic layer 2 are in the opposite direction.

  In the fifth embodiment, the first homopolar connection conductor 18 faces the fourth internal electrode 15 with the ceramic layer 2 interposed therebetween. Therefore, the first homopolar connection conductor 18 and the fourth homopolar connection conductor 18 The generation of a minute capacitance between the internal electrode 15 is allowed. In addition, the second homopolar connection conductor 19 faces the third internal electrode 14 with the ceramic layer 2 interposed therebetween. Therefore, a minute amount is provided between the second homopolar connection conductor 19 and the third internal electrode 14. Allow the generation of capacity. Although not shown, the first homopolar connection conductor 18 and the second internal electrode 13 are opposed to each other, and the second homopolar connection conductor 19 and the first internal electrode 12 are opposed to each other. The same minute capacity is generated.

  As described above, even when a minute capacitance is generated, when the multilayer ceramic capacitor 1a is mounted on the wiring board 24 as shown in FIG. Regardless of which of 4 and 5 is directed to the wiring board 24 side, in the multilayer ceramic capacitor 1a, there are many current paths in the portion near the wiring board 24 side where the loop inductance is the smallest, that is, the number of lead-out portions is large. Since the pole connection conductor 18 or 19 is disposed, ESL can be reduced.

  In the fifth embodiment described above, the same-polarity connection conductors 18 and 19 as those in the first embodiment are used as shown in FIGS. 8 (1) and (4). The same-polarity connection conductors 18a and 19a or 44 to 47 according to the second to fourth embodiments shown in FIGS. 5 to 7 may be used. Use of the same-polarity connection conductors 18a and 19a or 44 to 47 is preferable from the viewpoint of capacity design because the above-described minute capacity can be further reduced.

  FIG. 9 is a view corresponding to FIG. 3 for illustrating a multilayer ceramic capacitor 1b according to a sixth embodiment of the present invention. In FIG. 9, elements corresponding to those shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

  In brief, the sixth embodiment is characterized in that two capacitor portions are formed, and each internal electrode has two lead-out portions.

  More specifically, the first and third internal electrodes 12 and 14 are formed on the ceramic layer 2 shown in FIG. 9B, and the first internal electrode 12 is the first external terminal electrode. The third internal electrode 14 is electrically connected to the first external terminal electrodes 10-2 and 10-4.

  On the other hand, on the ceramic layer 2 shown in FIG. 9 (3), second and fourth internal electrodes 13 and 15 are formed, and the second internal electrode 13 includes the second external terminal electrode 11-1 and the second external terminal electrode 11-1. The third internal electrode 15 is electrically connected to the second external terminal electrodes 11-2 and 11-4.

  In this way, in the capacitor main body 3, the first internal electrode 12 and the second internal electrode 13 are arranged with the specific ceramic layer 2 interposed therebetween, so that the first first electrode in which the capacitance is formed. The capacitor unit 16 is configured. Further, the third internal electrode 14 and the fourth internal electrode 15 are arranged with the specific ceramic layer 2 interposed therebetween, so that one second capacitor portion 17 in which a capacitance is formed is configured. These first and second capacitor portions 16 and 17 are arranged side by side along the plane direction of the ceramic layer 2 as in the case of the other embodiments.

  Further, the first and second homopolar connection conductors 18 and 19 shown in FIGS. 9 (1) and (4), respectively, are the same as in the other embodiments, the first capacitor portion 16 and the second capacitor. It is formed so as to straddle the portion 17.

  Also in the sixth embodiment, the current directions of the currents flowing through the internal electrodes 12 to 15 are the internal electrodes located on the same ceramic layer 2 and adjacent to each other, that is, the first internal electrode 12 and the third internal electrode. The second internal electrode 13 and the second internal electrode 15 and the fourth internal electrode 15 are in opposite directions at least between the portions facing each other, contributing to the reduction of ESL. ing.

FIG. 10 is for explaining the first reference example of the present invention. This first reference example gives a modification of the same-polarity connection conductors 18 and 19 in the sixth embodiment described above, and FIGS. 10 (1) and (2) are shown in FIGS. Corresponds to (4). 10, elements corresponding to those shown in FIG. 9 are denoted by the same reference numerals, and redundant description is omitted.

In the first reference example , as shown in FIG. 10 (1), the first same polarity connecting conductor 50 connects only between the first external terminal electrodes 10-2 and 10-3, and the second same polarity connecting conductor 50 is connected. The pole connecting conductor 51 is formed so as to connect only the second external terminal electrodes 11-1 and 11-4 as shown in FIG. 10 (2). These first and second same-polarity connection conductors 50 and 51 are intended to secure a connection path for the minimum necessary backup, but a lead-out portion that is led out from the main body portion to the first side surface 6 is provided. Only one is outside the scope of this invention.

FIG. 11 is for explaining a second reference example of the present invention. As in the case of the first reference example described above, this second reference example gives a modification of the same-polarity connection conductors 18 and 19 in the sixth embodiment, and FIGS. 11 (1) and (2). Correspond to FIGS. 9 (1) and (4), respectively. In FIG. 11, elements corresponding to the elements shown in FIG. 9 are denoted by the same reference numerals, and redundant description is omitted.

In the second reference example , as shown in FIG. 11 (1), the first homopolar connection conductor 54 is formed so as to connect the first external terminal electrodes 10-1 and 10-4, and As shown in FIG. 11 (2), the second homopolar connection conductor 55 is formed so as to connect the second external terminal electrodes 11-2 and 11-3. The first and second same-polarity connection conductors 54 and 55 are also intended to secure a connection path for the minimum necessary backup, but are drawn out from the main body portion to the first side surface 6. This is outside the scope of the present invention in that there is only one.

FIG. 12 is a view corresponding to FIG. 3 for illustrating a multilayer ceramic capacitor 1c according to a seventh embodiment of the present invention. 12, elements corresponding to the elements shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

The numbers (1) to (6) in FIG. 12 also indicate the stacking order. In the seventh embodiment, a plurality of first homopolar connection conductors 18 are continuously arranged in the stacking direction inside the capacitor body 3, and a plurality of second homopolar connection conductors 19 are continuously arranged. It is characterized by being arranged in the stacking direction.

  When such a configuration is adopted, the connection reliability between the first homopolar connection conductor 18 and the first external terminal electrode 10 and the connection between the second homopolar connection conductor 19 and the second external terminal electrode 11 are improved. Both the connection reliability can be improved and the effect of backup at the time of disconnection can be further ensured. Each of the plurality of first and second same-polarity connection conductors 18 and 19 is preferably arranged continuously in the stacking direction, for example, over about 3 to 10 layers.

FIG. 13 is a view corresponding to FIG. 3 for illustrating a multilayer ceramic capacitor 1d according to an eighth embodiment of the present invention. In FIG. 13, elements corresponding to the elements shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

In brief, the eighth embodiment is characterized in that the same-polarity connection conductors 18 and 19 are arranged in the vicinity of the center of the capacitor body 3 in the stacking direction.

  More specifically, as shown in FIGS. 13 (1) and (2), and FIGS. 13 (7) and (8), internal electrodes 12 to 15 are arranged at each end of the capacitor body 3 in the stacking direction. In the vicinity of the center in the stacking direction, as shown in FIGS. 13 (3) to (6), a buffer region in which no internal electrode is formed is formed, and the first and second identical buffer regions are formed in this buffer region. Pole connection conductors 18 and 19 are arranged.

  When a ceramic material having a high dielectric constant is used as the ceramic layer 2, the capacitor body 3 expands and contracts due to the electrostrictive effect of the dielectric, and the capacitor body 3 may crack due to the stress caused thereby. . The buffer region described above relieves this stress and suppresses the generation of cracks. If the buffer region is composed only of the ceramic layer 2, the flexural strength is lowered. Therefore, as described above, the homopolar connection conductors 18 and 19 are disposed in the buffer region. Therefore, the same-polarity connection conductors 18 and 19 not only provide backup at the time of disconnection but also improve the strength.

In the eighth embodiment, as in the case of the seventh embodiment, a plurality of first homopolar connection conductors 18 are continuously arranged in the stacking direction, and a plurality of second homopolar connection conductors are provided. 19 are continuously arranged in the stacking direction. In this case, the first and second homopolar connection conductors 18 and 19 are laminated together in order to minimize the undesired capacitance formed between them. The second homopolar connection conductors 19 are preferably stacked together.

As a modification of the eighth embodiment, a homopolar connection conductor other than the illustrated homopolar connection conductors 18 and 19 may be further disposed on the outer layer side of the portion where the internal electrodes 12 to 15 are disposed. Good.

FIG. 14 is a view corresponding to FIG. 3 for illustrating a multilayer ceramic capacitor 1e according to a ninth embodiment of the present invention. In FIG. 14, elements corresponding to those shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.

The numbers (1) to (6) in FIG. 14 also indicate the stacking order. In the ninth embodiment, the first homopolar connection conductor 18 shown in FIG. 14 (2) is connected to the first and third internal electrodes 12 shown in FIG. 14 (3) via the ceramic layer 2. 14 on the opposite side to the side where the first and third internal electrodes 12 and 14 are located, and the second layer shown in FIG. Including those disposed so as to face the same-polarity connection conductor 19.

  Similarly, the second homopolar connection conductor 19 shown in FIG. 14 (5) faces the second and fourth internal electrodes 13 and 15 shown in FIG. 14 (4) through the ceramic layer 2. 14 and the first same-polarity connecting conductor shown in FIG. 14 (6) through the ceramic layer 2 on the side opposite to the side where the second and fourth internal electrodes 13 and 15 are located. It is characterized by including what is arrange | positioned so that 18 may be opposed.

  When such a configuration is adopted, no capacitance is generated between the first homopolar connection conductor 18 and the first and third internal electrodes 12 and 14, and the second homopolar connection conductor 19 is provided. Is not generated between the second and fourth internal electrodes 13 and 15, but the second homopolar connection conductor 19 shown in FIG. 14 (1) and the first same electrode shown in FIG. 14 (2). Capacitance is generated between the same-polarity connection conductor 18 and between the second same-polarity connection conductor 19 shown in FIG. 14 (5) and the first same-polarity connection conductor 18 shown in FIG. 14 (6). To do. Therefore, by adjusting the capacitance generated between the first and second homopolar connection conductors 18 and 19, it is possible to finely adjust the capacitance of the entire multilayer ceramic capacitor 1e.

  In the illustrated embodiment, the configuration for acquiring the capacitance between the first and second same-polarity connection conductors 18 and 19 is adopted in two places, but even if only one place is adopted, three or more places are adopted. May be employed.

  While the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.

  For example, each of the first and second homopolar connection conductors may be formed by mixing different patterns in one capacitor body instead of forming one pattern.

  Further, in each of the illustrated embodiments, the second homopolar connection conductor is formed, but it should be understood that embodiments without the second homopolar connection conductor are also within the scope of the present invention. is there.

1 is a perspective view showing an appearance of a multilayer ceramic capacitor 1 according to a first embodiment of the present invention. It is a top view which shows the external appearance of the multilayer ceramic capacitor 1 shown in FIG. FIG. 2 is a plan view showing the internal structure of the multilayer ceramic capacitor 1 shown in FIG. 1 with several cross sections. It is a perspective view which shows the mounting state of the multilayer ceramic capacitor 1 shown in FIG. It is a figure corresponding to Drawing 3 (1) and (4) for explaining a 2nd embodiment of this invention. It is a figure corresponding to Drawing 3 (1) and (4) for explaining a 3rd embodiment of this invention. It is a figure corresponding to Drawing 3 (1) and (4) for explaining a 4th embodiment of this invention. It is a figure corresponding to FIG. 3 which shows the multilayer ceramic capacitor 1a by 5th Embodiment of this invention. It is a figure corresponding to FIG. 3 which shows the multilayer ceramic capacitor 1b by 6th Embodiment of this invention. It is a figure corresponding to FIG. 9 (1) and (4) for demonstrating the 1st reference example of this invention. It is a figure corresponding to Drawing 9 (1) and (4) for explaining the 2nd reference example of this invention. It is a figure corresponding to FIG. 3 which shows the multilayer ceramic capacitor 1c by 7th Embodiment of this invention. It is a figure corresponding to FIG. 3 which shows the laminated ceramic capacitor 1d by 8th Embodiment of this invention. It is a figure corresponding to FIG. 3 which shows the multilayer ceramic capacitor 1e by 9th Embodiment of this invention.

Explanation of symbols

1, 1a, 1b, 1c, 1d, 1e Multilayer ceramic capacitor 2 Ceramic layer 3 Capacitor body 4 First main surface 5 Second main surface 6 First side surface 7 Second side surface 8 Third side surface 9 Fourth Side surface 10 First external terminal electrode 11 Second external terminal electrode 12 First internal electrode 13 Second internal electrode 14 Third internal electrode 15 Fourth internal electrode 16 First capacitor portion 17 Second Capacitor section 18, 18a, 44, 45, 50, 54 First homopolar connection conductor 19, 19a, 46, 47, 51, 55 Second homopolar connection conductor 20, 21 Lead section 22, 23 Main body section 40 First dummy inner conductor 41 Second dummy inner conductor

Claims (18)

A capacitor body comprising a plurality of laminated ceramic layers and having first and second main surfaces opposite to each other and a side surface connecting the first and second main surfaces;
A plurality of first external terminal electrodes formed on the side surface of the capacitor body and connected to a first potential;
A plurality of second external terminal electrodes formed on the side surface of the capacitor body and connected to a second potential;
A first internal electrode formed inside the capacitor body and electrically connected to the first external terminal electrode;
A second internal electrode formed inside the capacitor body and electrically connected to the second external terminal electrode;
A third internal electrode formed inside the capacitor body and electrically connected to the first external terminal electrode;
A fourth internal electrode formed inside the capacitor body and electrically connected to the second external terminal electrode;
One or more first capacitor portions in which a capacitance is formed by disposing the first internal electrode and the second internal electrode with the specific ceramic layer sandwiched inside the capacitor body. When,
Inside the capacitor body, it is arranged alongside the first capacitor portion along the planar direction of the ceramic layer, and the third internal electrode and the fourth internal electrode sandwich the specific ceramic layer. One or more second capacitor parts, in which a capacitance is formed by being arranged at
Of the plurality of first external terminal electrodes, the capacitor body is formed inside the capacitor body and spans two or more capacitor parts selected from the first capacitor part and the second capacitor part. A first homopolar connection conductor electrically connected to two or more ,
The side surfaces have first and second side surfaces facing each other,
The first same-polarity connection conductor has a main body portion and a plurality of lead portions drawn from the main body portion to at least the first side surface,
When the ceramic layer is viewed in a plane, a region defined by the side of the main body part and two adjacent sides of the two adjacent drawing parts drawn to the first side surface is formed,
A side of the main body is a multilayer ceramic capacitor that is disposed closer to the first side surface of the first and second side surfaces .   The direction of the current flowing through each of the internal electrodes is connected to an external circuit so that the current direction of each of the internal electrodes located on the same ceramic layer is opposite between at least the portions facing each other. Item 3. A multilayer ceramic capacitor according to Item 2.   The first internal electrode is electrically connected to one of the first external terminal electrodes, the second internal electrode is electrically connected to one of the second external terminal electrodes, and the first 3. The third internal electrode is electrically connected to one of the first external terminal electrodes, and the fourth internal electrode is electrically connected to one of the second external terminal electrodes. Or the multilayer ceramic capacitor of 2.   The first internal electrode is electrically connected to the plurality of first external terminal electrodes, the second internal electrode is electrically connected to the plurality of second external terminal electrodes, and The third internal electrode is electrically connected to the plurality of first external terminal electrodes, and the fourth internal electrode is electrically connected to the plurality of second external terminal electrodes. Or the multilayer ceramic capacitor of 2.   5. The multilayer ceramic capacitor according to claim 1, wherein the first same-polarity connection conductor is electrically connected to all the first external terminal electrodes. 6. Before SL first same-polarity connection conductor, said the only shall be electrically connected to the first the first external terminal electrodes formed on side surfaces of the formed on the second side The multilayer ceramic capacitor according to any one of claims 1 to 5, including one that is electrically connected only to the first external terminal electrode. Before SL first same-polarity connection conductor, both electrical of the first said formed on a side surface of the first external terminal electrode and the second of said formed on the side surface the first external terminal electrodes The multilayer ceramic capacitor according to claim 1, wherein the multilayer ceramic capacitor includes one that is connected electrically.   The multilayer ceramic capacitor according to claim 1, wherein only one of the first same-polarity connection conductors is formed inside the capacitor body.   The multilayer ceramic capacitor according to claim 1, wherein a plurality of the first same-polarity connection conductors are continuously arranged in the stacking direction inside the capacitor body. Said first same-polarity connection conductor, relatively said body portion having a large area, of the relatively small area are electrically connected withdrawn from the body portion and a plurality of the first external terminal electrodes The multilayer ceramic capacitor according to claim 1, further comprising a plurality of the lead portions.   The multilayer ceramic capacitor according to claim 1, wherein the first same-polarity connection conductor is formed in a line shape having a predetermined width.   The multilayer ceramic capacitor according to claim 11, wherein an area occupied by the exposed portion of the ceramic layer is wider than an area occupied by the first same-polarity connecting conductor when viewed on a specific interface between the ceramic layers.   On the interface between the ceramic layers where the first homopolar connection conductor is formed, it is not connected to the first homopolar connection conductor, but is connected to or close to the second external terminal electrode. The multilayer ceramic capacitor according to claim 1, further comprising a first dummy inner conductor.   14. The multilayer ceramic according to claim 1, wherein the first same-polarity connection conductor includes a conductor disposed so as to face the first and third internal electrodes with the ceramic layer interposed therebetween. Capacitor.   The first same-polarity connection conductor is disposed in proximity to at least one of the first and second main surfaces, and faces the second and / or fourth internal electrodes via the ceramic layer. The multilayer ceramic capacitor according to claim 1, wherein the multilayer ceramic capacitor includes what is arranged as described above.   A buffer region where none of the first to fourth internal electrodes is formed is formed near the center of the capacitor body in the stacking direction, and the first homopolar connection conductor is disposed in the buffer region. The multilayer ceramic capacitor according to claim 1, comprising:   Of the plurality of second external terminal electrodes, formed in the capacitor body and straddling two or more capacitor portions selected from the first capacitor portion and the second capacitor portion. The multilayer ceramic capacitor according to claim 1, further comprising a second homopolar connection conductor electrically connected to two or more.   The first same-polarity connection conductor is disposed so as to face the first and third internal electrodes with the ceramic layer interposed therebetween, and the side on which the first and third internal electrodes are located The multilayer ceramic capacitor according to claim 17, including one disposed on the opposite side so as to face the second same-polarity connection conductor with the ceramic layer interposed therebetween.

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