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JP4577941B2 - Chip mounting method and apparatus - Google Patents

Chip mounting method and apparatus Download PDF

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Publication number
JP4577941B2
JP4577941B2 JP2000103857A JP2000103857A JP4577941B2 JP 4577941 B2 JP4577941 B2 JP 4577941B2 JP 2000103857 A JP2000103857 A JP 2000103857A JP 2000103857 A JP2000103857 A JP 2000103857A JP 4577941 B2 JP4577941 B2 JP 4577941B2
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tool
holder
chip
support means
tool holder
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JP2000353725A (en
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朗 山内
義之 新井
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Priority to JP2000103857A priority Critical patent/JP4577941B2/en
Priority to PCT/JP2000/008734 priority patent/WO2002049094A1/en
Publication of JP2000353725A publication Critical patent/JP2000353725A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
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    • H01L2224/758—Means for moving parts
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    • H01L2924/14—Integrated circuits

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Liquid Crystal (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、液晶基板等の基板にチップを実装するチップ実装方法及びその装置に関するものである。
【０００２】
【従来の技術】
従来、周知のように、チップ実装は、チップを保持しているツールを、基板保持ステージに支持されている基板（例えば、液晶基板等）の上方から降下させて行うが、その際、基板に対するチップの加圧力（押付け圧力）を一定に保たなければならない。
【０００３】
その為、チップ実装装置は、ツールの高さ位置を制御する為のＺ軸送り装置と、基板に対するチップの加圧力を検出してＺ軸送り装置にフィードバックする加圧力検出手段とを備えている。
【０００４】
なお、Ｚ軸送り装置は、一般には、図１５において示されているように、ネジ軸送り型に設けられているが、同図において、チップ実装装置は、チップ１を保持しているツール２を、Ｚ軸送り装置３によって降下させて、基板保持ステージ４に支持されている基板５に実装するものであって、Ｚ軸送り装置３は、装置フレーム９に装着のサーボモータ６で送り機構７（例えば、ボールネジ）を回転させ、これに螺着せしめられているスライダー８を、装置フレーム９に装着のガイドレール１０で案内して昇降せしめる。
【０００５】
従って、スライダー８に装着されているブラケット１１に、加圧力検出手段のロードセル１２を介在させて装着されているツール２も一緒に昇降せしめられるが、その際、エンコーダ１３で高さ位置が検出されてサーボモータ６にフィードバックされる。よって、ツール２は、上方の待機位置から降下せしめられて所定高さに位置決めされる。
【０００６】
【発明が解決しようとする課題】
しかし、送り機構７が環境温度の影響を受けて熱膨張していると、ツール２が所定高さ位置と異なる位置に位置決めされてしまう為に、目標とする接地後のチップ高さ位置（チップが基板に接触せしめられた後のチップ高さ位置）が得られず、これではバンプの形状を所定に保つことができない。
【０００７】
また、加圧力の制御に関し、ロードセル１２で実際の加圧力を検出してサーボモータ６のトルク制御にフィードバックしているが、フィードバック時間が遅く、しかも、サーボトルク制御の精度が悪いこと等の為に、微小な加圧力の制御が難しかった。なお、送り機構７の熱膨張は、ヒートツールを装着している場合において顕著である。本発明は、このような欠点に鑑み、それらを解消すべく鋭意検討の結果得られたものである。
【０００８】
【課題を解決するための手段】
すなわち、本発明に係るチップ実装装置は、請求項１に記載するように、ホルダー支持手段を上下動せしめるＺ軸送り装置と、前記ホルダー支持手段に上下動し得るように装着されたツールホルダーと、前記ツールホルダーに装着されたツールとを備えたチップ実装装置において、ホルダー支持手段がエアーシリンダーからなるシリンダーチューブで構成されており、シリンダーチューブ内を上下移動するピストンにツールホルダーが装着されており、ホルダー支持手段に開口されたバランス圧ポートから供給される加圧エアーにより、ツールホルダーの自重を打ち消す加圧力で制御する機構と、ホルダー支持手段内を上下動するピストンの位置を検出する高さ検出手段とを備え、基板に対するチップの接地時に、ホルダー支持手段に対してツールが浮上させられたストローク分を前記高さ検出手段で測定し、チップのバンプがツールで加熱されて溶融し始める際に、ツールホルダーの自重を打ち消す加圧力でチップのバンプを加圧するとともに、前記ツールホルダーの熱膨張によって変動する高さ位置を検出して前記Ｚ軸送り装置の駆動制御手段にフィードバックする前記高さ検出手段を前記ホルダー支持手段に装着したことを特徴とするものである。
【０００９】
また、本発明に係るチップ実装方法は、請求項３に記載するように、基板保持ステージに支持されている基板の上方からチップを保持しているツールホルダーに装着されたツールを降下させて前記チップを熱圧着するチップ実装方法において、チップ実装装置が、Ｚ軸送り装置と、Ｚ軸送り装置により上下動するホルダー支持手段と、ホルダー支持手段の内部を上下移動するピストンと、ピストンに静圧空気軸受けを介して装着されたツールホルダーと、ツールホルダーの下端に装着されたツールと、ツールホルダの高さ位置を検出する高さ検出手段とを備え、前記ホルダー支持手段が、エアーシリンダーからなるシリンダーチューブで構成されており、ホルダー支持手段に設けられた加圧ポートとバランス圧ポートから供給される加圧エアー同士の差圧をもって、ツールホルダーの上下動を所定に制御する機構を備え、Ｚ軸送り装置を駆動し、ホルダー支持手段を下降させて、ツールホルダーの下端のツールに保持されたチップのバンプを、基板のパッドに接地させる工程と、前記接地後、Ｚ軸送り装置による下降を続行させてホルダー支持手段に対してツールホルダーを離別させる工程と、ツールホルダーの離別による高さ位置を高さ検出手段で検出し、所定の高さ位置に達したらＺ軸送り装置によるホルダー支持手段の下降を停止する工程と、ツールでバンプを加熱し溶融させる工程と、加圧ポートとバランス圧ポートとから供給される加圧エアーによりツールホルダーの自重を打ち消す加圧力をバンプに付与する工程と、Ｚ軸送り装置を駆動しホルダー支持手段を所定高さだけ上昇させる工程と、Ｚ軸送り装置を停止しバンプを冷却する工程と、を有し前記ツールの上昇制御を、チップと基板の熱膨張分を吸収し得るように行い、前記基板のバンプの形状矯正を行うことを特徴とするものである。
【００１０】
【発明の実施の形態】
図１において、Ｚ軸送り装置３は、上述の従来のそれと略同一に設けられている（図１５参照）。従って、これの詳述は省略するが、ホルダー支持手段１５は、スライダー８に装着されているホルダーブラッケット１６に装着されている。
また、ツールホルダー１７は、上下動し得るようにホルダー支持手段１５に装着されている。また、ツール２は、ツールホルダー１７の下端に装着されている。
【００１１】
なお、ホルダー支持手段１５は、エアーシリンダーのシリンダーチューブで構成されていると共にツールホルダー１７は、前記エアーシリンダーのピストンで構成されているが、かかるツールホルダー１７は、一般にエアーベアリングと呼ばれている静圧空気軸受１８を介してホルダー支持手段１５に装着されている。
【００１２】
その為、ホルダー支持手段１５に開口せしめられている加圧ポート１９及びバランス圧ポート２０から供給される加圧エアー同士の差圧をもってツールホルダー１７の上下動を所定に制御することができてツール２を所定レベルに位置決めせしめることができ、かつ、その際、微小圧で制御することができる。
【００１３】
すなわち、静圧空気軸受１８は、ホルダー支持手段１５に設けられている孔２１から供給される加圧エアーを多孔質体で均一に分散させてツールホルダー１７の下部を非接触状態に支持し得るので、その支持箇所の摩擦抵抗が無視することができる程度に極めて小さく、しかも、ツールホルダー１７のヘッド部分もホルダー支持手段１５に対して遊嵌せしめられているので、同様にその箇所の摩擦抵抗も無視することができる程度に極めて小さい為に、微小圧で制御することができる。
【００１４】
なお、静圧空気軸受１８は、ツールホルダー１７の上下動を許容するが回転させないように非接触状態に支持し得る為に静圧空気直進軸受とも呼ばれていると共に上述のようにエアーシリンダー型に設けることは従来、公知である（例えば、特開平１０−３４０９３１号公報において開示されている）。
【００１５】
しかし、本発明においては、ホルダー支持手段１５に対して、ツールホルダー１７の上端位置を検出してＺ軸送り装置３の駆動制御手段２２（例えば、サーボモータ）にフィードバックする高さ検出手段２３（例えば、渦電流式センサ等）を装着している。
【００１６】
その為、Ｚ軸送り装置３の送り機構７の熱膨張に影響されずにツール２の高さ位置制御を常時、高精度に行うことができ、しかも、基板保持ステージ４に保持されている基板５に対するチップ１の接地時に、ホルダー支持手段１５に対してツール２が浮上（相対的に上方へ移動）せしめられたストローク分を高さ検出手段２３で測定し、それに基づく制御信号をＺ軸送り装置３の駆動制御手段２２にフィードバックして所定に駆動制御することができ、従って、送り機構７が熱膨張していても接地高さ位置を正確に検出することができる。
【００１７】
また、加熱時、チップ１と基板５が熱膨張するが、ツールホルダー１７はその分、浮上されている為、チップ１のバンプ潰れよるショートが発生しない。更に、その浮上分を高さ検出手段２３で測定してＺ軸送りにフィードバックする為、冷却させてハンダを固着させるときに正確な高さ位置制御を行うことができ、従って、良好なバンプ形状に実装することができる。
【００１８】
すなわち、周知のように、バンプの実装においては、チップ１を基板５に接地せしめた後、ツール２を加熱し、かつ、冷却してハンダを固着させるが、その時、熱膨張によってバンプが押し潰される為、バンプ形状の矯正（チップ１を引き上げての矯正）が余儀なくされている。
【００１９】
ところが、その引き上げ制御に数μmの精度が要求される為、上述のような従来技術では、送り機構７の熱膨張の影響を受けて、そのような精度が得られなかったが、本発明によると、高精度にチップ高さを制御することができるので、チップ１のバンプを過度に押し潰すことなく良好に実装することができる。
【００２０】
図２から図１３において、バンプの実装におけるホルダー支持手段１５及びツールホルダー１７の一連の昇降（上下動）制御態様が示されているが、図２においては、実装を開始しようとする状態が示されていると共に図３においては、その時のバンプ１ａの形状が示されている。
【００２１】
次いで、図４においては、チップ１のハンダバンプ１ａが基板５のパッドに接地された状態が示されていると共に図５においては、その時のバンプ姿（点接触された姿）が示されている。
【００２２】
次いで、図示矢印方向への送り機構による送りが続行されてツールホルダー１７が浮上、すなわち、ホルダー支持手段１５に対してツールホルダー１７が離別され始めた状態が示されている。
【００２３】
次いで、図７においては、高さ検出手段２３が設定高さを検出し、ツールホルダー１７がホルダー支持手段１５と図示Ｘだけ離別せしめられて送り機構による送りが停止された状態が示されている。なお、この状態においては、バンプ高さのバラツキや基板の反り等の為に、基板５のパッドに対して全てのバンプ１ａが接触しておらず、その一部が接触しているにすぎない。
【００２４】
次いで、図８においては、バランス圧ポート２０からのエアー供給が停止される一方において加圧ポート１９からのエアー供給が行われてツールホルダー１７が下方へ移動せしめられた状態が示されている。なお、その際、少し高めに加圧することにより、全てのバンプ１ａを図９において示されているように基板５のパッドに対して面接触せしめることができ、そして、その後、バンプ１aがツール２で加熱されて溶融し始める。
【００２５】
そこで、図１０において示されているように、加圧ポート１９からのエアー供給が停止される一方においてバランス圧ポート２０からのエアー供給が行われるが、その際において、ツールホルダー２の自重を打ち消して数ｇの微小な加圧力で制御される為にバンプ形状を損わない。
【００２６】
次いで、図１１においては、図示矢印方向への送り機構による送りが開始されて高さ検出手段２３が高さゼロを検出、すなわち、ツールホルダー１７に対してホルダー支持手段１５が最大に上昇せしめられた状態が示されている。
【００２７】
更に、図１２においては、図示矢印方向への送り機構による送りが続行され、従って、チップ１が上方へ移動せしめられて（引き上げられて）バンプ１ａの形状が矯正される姿が示されているが、かかる引き上げストロークは必要に応じて適宜に選択され、かつ、その後、送り機構による送りが停止された状態においてバンプ１ａが冷却せしめられる。図１３においては、その時のバンプ１ａの形状が示されている。
【００２８】
以上、一実施形態について述べたが、本発明においては、図１４において示されているように設けてもよい。このチップ実装装置においては、ツール２が装着されているツールホルダー１７を、ホルダー支持手段１５に装着されている直進軸受２５で上下動し得るように支持していると共にホルダー支持手段１５を、スライダー８に装着されているホルダーブラッケット１６に装着している。
【００２９】
なお、直進軸受２５は、ツールホルダー１７のスライド（上下動）を許容するが回転させないように支持している。
【００３０】
また、ツールホルダー１７の高さ位置を検出してＺ軸送り装置３の駆動制御手段２２（例えば、サーボモータ）にフィードバックする高さ検出手段２３（例えば、渦電流式センサ等）をホルダー支持手段１５に装着していると共にツールホルダー１７の上端にロードセル１２を装着している。
【００３１】
更に、エアーシリンダー２６及び反力受け２７を装着しているが、エアーシリンダー２６はブラケット２８に装着され、かつ、このブラケット２８の図示されていない左端は、装置フレーム（図示されていない）に装着されているガイドレールにスライド自在に係合せしめられている。
【００３２】
なお、反力受け２７は、図示されていない左端が前記装置フレームに固着せしめられていると共に図示のように、両者に弾性体（引っ張りコイルバネ）２９が係止されている。
【００３３】
その為、このチップ実装装置においては、エアーシリンダー２６のピストンロッド２６aによってツールホルダー１７をホルダー支持手段１５の上端面に押し付けた状態のまま両者を一緒に上下動させることができる。
【００３４】
以上、代表的な二実施形態について述べたが、本発明おいていうチップ１とは、例えば、ＩＣチップ、半導体チップ、光素子、表面実装部品、ウエハなど、その種類や大きさに関係なく、基板５に対して接合せしめる方の対象物をいうと共に基板５とは、例えば、樹脂基板、ガラス基板、フィルム基板、ウエハ、チップなど、その種類や大きさに関係なく、チップ１が接合せしめられる方の対象物をいう。
【００３５】
また、基板保持ステージ４の上面に基板５を保持（又は支持）する手段は、吸気孔による吸着保持手段、静電気による静電保持手段、磁石や磁気などによる磁気保持手段、複数の可動爪によって基板を掴む機械的手段、単数又は複数の可動爪によって基板を押さえる機械的手段など、いかなる形態の保持手段であってもよい。
【００３６】
また、ツール２の先端の加圧面（又はツール２の先端にアタッチメントを装着した場合において、かかるアタッチメントの加圧面）にチップ１を保持する手段についても、吸気孔による吸着保持手段だけでなく、静電気による静電保持手段、磁石や磁気などによる磁気保持手段、複数の可動爪によってチップ１を掴む機械的手段、一つの可動爪によってチップ１を押さえる機械的手段など、いかなる形態の保持手段であってもよい。
【００３７】
また、基板保持ステージ４についても、必要に応じて、固定型、可動型のいずれに設けてもよく、かつ、可動型に設ける場合においては、平行移動制御、回転制御、昇降制御、平行移動制御と回転制御、平行移動制御と昇降制御、回転制御と昇降制御、平行移動と回転制御と昇降制御、等のように各種態様に制御し得るように設けてもよい。
【００３８】
また、チップ１に設けられたバンプ１ａとは、例えば、ハンダバンプ、スタッドバンプなど、基板５に設けられたパッド（例えば、電極、ダミー電極など）と接合せしめられる方の対象物であると共に基板に設けられたパッドとは、例えば、配線を伴った電極、配線につながっていないダミー電極など、チップ１に設けられているバンプ１ａ（例えば、ハンダバンプ、スタッドバンプなど）と接合せしめられる方の対象物をいう。
【００３９】
また、送り機構７及びＺ軸送り装置３についても、例えば、ボールネジ型やリニアモータ型等、スライダー８を移動させ得る限りにおいては、いかなる型式のものであってもよい。
【００４０】
また、本発明においていうチップ実装装置とは、チップを搭載するマウント装置やチップを接合するボンディング装置に加えて、例えば、基板とチップ、基板と接着材（ＡＣＦ、ＮＣＦなど）等、予め対象物同士が接触（搭載又は仮圧着など）されたものを加圧、加熱及び／又は振動手段（超音波、ピエゾ素子、磁歪素子、ボイスコイルなど）によって固着又は転写させる装置を包含する広い概念の装置をいう。
【００４１】
また、ツール２は、チップ１を保持し得るものに限定されず、保持し得ないものであってもよい。また、ヒータを備えた所謂、ヒートツールに限定されず、ヒータを備えていないものであってもよく、かつ、チップ１を保持し得るものにおけるその保持手段は、真空吸着保持する為の吸気孔を加圧面（ツール先端面）に開口せしめたもの、或いは、他の形態の保持手段であってもよい。
【００４２】
また、ツールホルダー１７の下端に直接、ツール２を装着することに限定されず、必要ならば、ロードセルを介在させて装着してもよい。また、図１４において示されているチップ実装装置においては、ツールホルダー１７の上端にロードセル１２（加圧検出手段）を装着しているが、これに代えて、ブラケット２８の上面に装着、すなわち、アタッチメント３０の装着に代えて、そこにロードセル１２を装着する一方において、ツールホルダー１７の上端にアタッチメント３０を装着してもよい。
【００４３】
また、高さ検出手段は、渦電流式センサのみに限定されず、他のセンサー（レーザや光センサー等）であってもよく、また、Ｚ軸送り装置は、ネジ軸送り型に限定されず、他の型式、例えば、リニアモータ型等であってもよいと共にその駆動制御手段についても、サーボモータ或いはその他の手段であってもよい。
【００４４】
更に、加圧力が高い場合には、バランス圧ポートを使用しないで、加圧ポートのみで制御してもよいと共に高さ検出手段は、ツールホルダーの高さ位置を検出することによってツールの高さ位置を測定（間接的にボンディングツールの高さ位置を検出）するように装着すること以外に、ツールの高さ位置を直接、検出し得るように装着してもよい。
【００４５】
【発明の効果】
上述のように、本発明によると、Ｚ軸送り装置のボールネジ軸等の送り機構の熱膨張に影響されずにツールの高さ位置制御を常時、高精度に行うことができる。その為、ツールがチップを保持している場合においては、チップ高さを高精度に制御することができてチップのバンプを過度に押し潰すことなく良好に実装することができると共にバンプ形状の矯正を行うことができるチップ実装方法及び装置を得ることができる。
【図面の簡単な説明】
【図１】本発明に係るチップ実装装置の正面図である。
【図２】実装開始時の姿を示す図である。
【図３】実装開始時におけるバンプの形状状態を示す図である。
【図４】バンプが基板のパッドに接地された状態を示す図である。
【図５】基板のパッドに対するバンプの接地当初状態（点接触状態）を示す図である。
【図６】バンプが基板のパッドに接地された後におけるツールホルダーの浮上状態を示す図である。
【図７】エアー供給及びＺ軸送りが共に停止された状態を示す図である。
【図８】バンプの全てを基板のパッドに接触させる為のエアー供給状態を示す図である。
【図９】基板のパッドに対してバンプが面接触せしめられた状態を示す図である。
【図１０】エアー供給の切り替えによって微小加圧力に制御する状態を示す図である。
【図１１】バンプの形状矯正を行う為にホルダー支持手段を図示矢印方向へ移動する姿を示す図である。
【図１２】バンプの形状矯正状態を示す図である。
【図１３】形状矯正時におけるバンプの形状を示す図である。
【図１４】本発明に係る他のチップ実装装置の正面図である。
【図１５】従来のチップ実装装置の正面図である。
【符号の説明】
１：チップ
１ａ：バンプ
２：ツール
３：Ｚ軸送り装置
４：基板保持ステージ
５：基板
７：送り機構
８：スライダー
１２：ロードセル
１５：ホルダー支持手段
１６：ホルダーブラケット
１７：ツールホルダー
１８：静圧空気軸受
２２：駆動制御手段
２３：高さ検出手段[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip mounting method and apparatus for mounting a chip on a substrate such as a liquid crystal substrate.
[0002]
[Prior art]
Conventionally, as is well known, chip mounting is performed by lowering a tool holding a chip from above a substrate (for example, a liquid crystal substrate) supported by a substrate holding stage. Tip pressure (pressing pressure) must be kept constant.
[0003]
For this reason, the chip mounting apparatus includes a Z-axis feeding device for controlling the height position of the tool, and a pressure detection means for detecting the pressure of the chip against the substrate and feeding it back to the Z-axis feeding device. .
[0004]
Note that the Z-axis feeding device is generally provided in a screw shaft feeding type as shown in FIG. 15, but in FIG. 15, the chip mounting device is a tool 2 holding a chip 1. Is lowered by the Z-axis feeding device 3 and mounted on the substrate 5 supported by the substrate holding stage 4. The Z-axis feeding device 3 is fed by a servo motor 6 mounted on the device frame 9. 7 (for example, a ball screw) is rotated, and the slider 8 screwed to the screw 7 is guided by a guide rail 10 attached to the apparatus frame 9 and moved up and down.
[0005]
Accordingly, the tool 2 mounted on the bracket 11 mounted on the slider 8 with the load cell 12 of the pressure detection means interposed therebetween can be lifted and lowered together. At that time, the encoder 13 detects the height position. And fed back to the servo motor 6. Therefore, the tool 2 is lowered from the upper standby position and positioned at a predetermined height.
[0006]
[Problems to be solved by the invention]
However, if the feed mechanism 7 is thermally expanded under the influence of the environmental temperature, the tool 2 is positioned at a position different from the predetermined height position. The chip height position after being brought into contact with the substrate is not obtained, and this makes it impossible to keep the shape of the bumps at a predetermined level.
[0007]
In addition, regarding the control of the applied pressure, the load cell 12 detects the actual applied pressure and feeds it back to the torque control of the servo motor 6. However, because the feedback time is slow and the accuracy of the servo torque control is poor. In addition, it was difficult to control minute pressures. The thermal expansion of the feed mechanism 7 is significant when a heat tool is attached. In view of such drawbacks, the present invention has been obtained as a result of intensive studies to eliminate them.
[0008]
[Means for Solving the Problems]
That is, the chip mounting apparatus according to the present invention includes a Z-axis feeding device that moves the holder support means up and down, and a tool holder that is mounted on the holder support means so as to move up and down. In the chip mounting apparatus provided with the tool mounted on the tool holder, the holder support means is composed of a cylinder tube made of an air cylinder, and the tool holder is mounted on a piston that moves up and down in the cylinder tube. , A mechanism that controls by the pressurizing air supplied from the balance pressure port opened to the holder support means, and a height that detects the position of the piston that moves up and down in the holder support means and a detection means, when the ground chip to the substrate, relative to the holder support means Measuring a stroke which Lumpur was floated by the height detecting means, when the tip of the bump begins to melt it is heated by the tool, with pressurized chip bump in pressure to cancel the weight of the tool holder , it is characterized in that mounted the height detecting means for feedback by detecting the height position varies according to the thermal expansion of the tool holder to the drive control means of the Z-axis feeding device to the holder support means .
[0009]
Further, according to the chip mounting method of the present invention, the tool mounted on the tool holder holding the chip is lowered from above the substrate supported by the substrate holding stage. In a chip mounting method for thermocompression bonding a chip, the chip mounting device includes a Z-axis feeding device, a holder supporting means that moves up and down by the Z-axis feeding device, a piston that moves up and down in the holder supporting means, and a static pressure on the piston A tool holder mounted via an air bearing; a tool mounted on the lower end of the tool holder; and a height detecting means for detecting the height position of the tool holder, wherein the holder supporting means is an air cylinder. Pressurized air that consists of a cylinder tube and is supplied from the pressurization port and balance pressure port provided in the holder support means A mechanism for controlling the vertical movement of the tool holder with a differential pressure between them is provided, the Z-axis feeding device is driven, the holder support means is lowered, and the bumps of the chip held by the tool at the lower end of the tool holder , The step of grounding to the pad of the substrate, the step of continuing the descent by the Z-axis feeding device after the grounding and separating the tool holder from the holder support means, and the height detection by the separation of the tool holder Detecting by means and stopping the descent of the holder support means by the Z-axis feeding device when reaching a predetermined height position, supplying the bump from the pressure port and the balance pressure port, heating the bump with the tool, and melting A step of applying pressure to the bumps to cancel the weight of the tool holder with the pressurized air, and driving the Z-axis feeding device to raise the holder support means to a predetermined height Only a step of raising, cooling the stop Z-axis feeder bumps, the increase control of the tool has performed so as to absorb the thermal expansion amount of the chip and the substrate, the bump of the substrate It is characterized by performing shape correction.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
In FIG. 1, the Z-axis feeding device 3 is provided in substantially the same manner as the conventional one described above (see FIG. 15). Therefore, although detailed description thereof is omitted, the holder support means 15 is attached to a holder bracket 16 attached to the slider 8.
The tool holder 17 is attached to the holder support means 15 so that it can move up and down. The tool 2 is attached to the lower end of the tool holder 17.
[0011]
The holder support means 15 is composed of a cylinder tube of an air cylinder and the tool holder 17 is composed of a piston of the air cylinder. The tool holder 17 is generally called an air bearing. The holder support means 15 is mounted via a hydrostatic air bearing 18.
[0012]
Therefore, the vertical movement of the tool holder 17 can be controlled in a predetermined manner by the differential pressure between the pressurized air supplied from the pressurization port 19 and the balance pressure port 20 opened in the holder support means 15. 2 can be positioned at a predetermined level and can be controlled with a very small pressure.
[0013]
That is, the static pressure air bearing 18 can support the lower part of the tool holder 17 in a non-contact state by uniformly dispersing the pressurized air supplied from the holes 21 provided in the holder support means 15 with the porous body. Therefore, the frictional resistance of the supporting portion is extremely small so as to be negligible, and the head portion of the tool holder 17 is also loosely fitted to the holder supporting means 15, so that the frictional resistance of that portion is also the same. Since it is so small that it can be ignored, it can be controlled with a minute pressure.
[0014]
The hydrostatic air bearing 18 is also called a hydrostatic air linear bearing because it can be supported in a non-contact state so as to allow the tool holder 17 to move up and down but not rotate. Conventionally, it is known (for example, disclosed in JP-A-10-340931).
[0015]
However, in the present invention, the height detection means 23 (for detecting the upper end position of the tool holder 17 with respect to the holder support means 15 and feeding back to the drive control means 22 (for example, servo motor) of the Z-axis feeding device 3. For example, an eddy current sensor or the like is attached.
[0016]
Therefore, the height position control of the tool 2 can always be performed with high accuracy without being influenced by the thermal expansion of the feed mechanism 7 of the Z-axis feed device 3, and the substrate held on the substrate holding stage 4. When the tip 1 is grounded with respect to 5, the height detection means 23 measures the stroke of the tool 2 that has floated (moved upward relative to the holder support means 15), and a control signal based on that is sent to the Z-axis. It is possible to feed back to the drive control means 22 of the apparatus 3 and perform predetermined drive control. Therefore, even if the feed mechanism 7 is thermally expanded, the ground contact height position can be accurately detected.
[0017]
Further, during heating, the chip 1 and the substrate 5 are thermally expanded. However, since the tool holder 17 is floated as much, a short circuit due to the bump collapse of the chip 1 does not occur. Further, since the flying height is measured by the height detecting means 23 and fed back to the Z-axis feed, accurate height position control can be performed when the solder is fixed by cooling, so that a good bump shape is obtained. Can be implemented.
[0018]
That is, as is well known, in bump mounting, after the chip 1 is grounded to the substrate 5, the tool 2 is heated and cooled to fix the solder. At that time, the bump is crushed by thermal expansion. Therefore, correction of the bump shape (correction by raising the chip 1) is unavoidable.
[0019]
However, since accuracy of several μm is required for the pulling control, the above-described conventional technology cannot obtain such accuracy under the influence of the thermal expansion of the feed mechanism 7, but according to the present invention. Since the chip height can be controlled with high accuracy, it can be mounted well without excessively crushing the bumps of the chip 1.
[0020]
2 to 13 show a series of control modes for raising / lowering (vertical movement) of the holder support means 15 and the tool holder 17 in mounting the bumps. FIG. 2 shows a state in which mounting is to be started. FIG. 3 shows the shape of the bump 1a at that time.
[0021]
Next, FIG. 4 shows a state in which the solder bump 1a of the chip 1 is grounded to the pad of the substrate 5, and FIG. 5 shows a bump form at that time (point contact state).
[0022]
Next, the state in which the feeding by the feeding mechanism in the direction of the illustrated arrow is continued and the tool holder 17 is floated, that is, the tool holder 17 starts to be separated from the holder supporting means 15 is shown.
[0023]
Next, FIG. 7 shows a state in which the height detection means 23 detects the set height, the tool holder 17 is separated from the holder support means 15 by X in the figure, and feeding by the feeding mechanism is stopped. . In this state, all bumps 1a are not in contact with the pads on the substrate 5, and only a part of them are in contact with each other due to variations in bump height, warpage of the substrate, and the like. .
[0024]
Next, FIG. 8 shows a state where the air supply from the balance pressure port 20 is stopped and the air supply from the pressure port 19 is performed and the tool holder 17 is moved downward. At this time, by slightly applying pressure, all the bumps 1a can be brought into surface contact with the pads of the substrate 5 as shown in FIG. It begins to melt when heated.
[0025]
Therefore, as shown in FIG. 10, the air supply from the pressure port 19 is stopped, while the air supply from the balance pressure port 20 is performed. At this time, the weight of the tool holder 2 is canceled out. Therefore, the bump shape is not damaged because the pressure is controlled by a small pressure of several g.
[0026]
Next, in FIG. 11, feeding by the feeding mechanism in the direction of the arrow is started and the height detecting means 23 detects zero height, that is, the holder supporting means 15 is raised to the maximum with respect to the tool holder 17. The state is shown.
[0027]
Further, FIG. 12 shows a state in which the feeding by the feeding mechanism in the direction of the arrow is continued, and therefore the chip 1 is moved upward (pulled up) to correct the shape of the bump 1a. However, such a lifting stroke is appropriately selected as necessary, and thereafter, the bump 1a is cooled in a state where feeding by the feeding mechanism is stopped. FIG. 13 shows the shape of the bump 1a at that time.
[0028]
Although one embodiment has been described above, the present invention may be provided as shown in FIG. In this chip mounting apparatus, the tool holder 17 on which the tool 2 is mounted is supported so that it can be moved up and down by a linear bearing 25 mounted on the holder support means 15, and the holder support means 15 is moved to the slider. It is attached to the holder bracket 16 attached to the motor 8.
[0029]
The rectilinear bearing 25 supports the tool holder 17 so as to allow sliding (up and down movement) but not to rotate.
[0030]
Further, a height detection means 23 (for example, an eddy current sensor) that detects the height position of the tool holder 17 and feeds back to the drive control means 22 (for example, a servo motor) of the Z-axis feeding device 3 is provided as a holder support means. 15 and the load cell 12 is attached to the upper end of the tool holder 17.
[0031]
Further, the air cylinder 26 and the reaction force receiver 27 are mounted. The air cylinder 26 is mounted on a bracket 28, and the left end (not shown) of the bracket 28 is mounted on a device frame (not shown). The guide rail is slidably engaged with the guide rail.
[0032]
The reaction force receiver 27 has a left end (not shown) fixed to the apparatus frame, and an elastic body (tensile coil spring) 29 is locked to both as shown.
[0033]
Therefore, in this chip mounting apparatus, both can be moved up and down together while the tool holder 17 is pressed against the upper end surface of the holder support means 15 by the piston rod 26a of the air cylinder 26.
[0034]
As described above, two typical embodiments have been described. The chip 1 referred to in the present invention is, for example, an IC chip, a semiconductor chip, an optical element, a surface mount component, a wafer, or the like regardless of the type or size thereof. In addition to the object to be bonded to 5, the substrate 5 refers to a substrate to which the chip 1 can be bonded regardless of its type and size, such as a resin substrate, a glass substrate, a film substrate, a wafer, and a chip. Refers to the object.
[0035]
Means for holding (or supporting) the substrate 5 on the upper surface of the substrate holding stage 4 includes suction holding means by suction holes, electrostatic holding means by static electricity, magnetic holding means by magnets or magnetism, and a plurality of movable claws. It may be any form of holding means, such as mechanical means for gripping the substrate or mechanical means for holding the substrate by one or more movable claws.
[0036]
In addition, the means for holding the chip 1 on the pressure surface at the tip of the tool 2 (or the pressure surface of the attachment when an attachment is attached to the tip of the tool 2) is not limited to the suction holding means by the intake holes, Holding means in any form, such as electrostatic holding means by means, magnetic holding means by magnets or magnetism, mechanical means for holding the chip 1 by a plurality of movable claws, mechanical means for holding the chip 1 by one movable claw Also good.
[0037]
Further, the substrate holding stage 4 may be provided in either a fixed type or a movable type as required, and in the case of being provided in the movable type, parallel movement control, rotation control, elevation control, parallel movement control. And rotation control, parallel movement control and elevation control, rotation control and elevation control, parallel movement and rotation control and elevation control, and the like.
[0038]
The bump 1a provided on the chip 1 is an object to be bonded to a pad (for example, an electrode, a dummy electrode, etc.) provided on the substrate 5, such as a solder bump or a stud bump. The provided pad is an object to be bonded to a bump 1a (for example, a solder bump, a stud bump, etc.) provided on the chip 1, such as an electrode with wiring or a dummy electrode not connected to the wiring. Say.
[0039]
The feed mechanism 7 and the Z-axis feed device 3 may be of any type as long as the slider 8 can be moved, such as a ball screw type or a linear motor type.
[0040]
In addition, the chip mounting apparatus in the present invention refers to, in addition to a mounting apparatus for mounting a chip and a bonding apparatus for bonding a chip, for example, an object such as a substrate and a chip, a substrate and an adhesive (ACF, NCF, etc.) in advance. A device with a broad concept including a device for fixing or transferring objects that are in contact with each other (mounted or provisional pressure bonding, etc.) by pressurization, heating and / or vibration means (ultrasonic wave, piezo element, magnetostrictive element, voice coil, etc.) Say.
[0041]
Moreover, the tool 2 is not limited to what can hold | maintain the chip | tip 1, The thing which cannot hold | maintain may be sufficient. Further, the holding means in the case where the chip 1 can be held is not limited to a so-called heat tool having a heater, and the holding means in the one that can hold the chip 1 is an intake hole for holding by vacuum suction. May be a holding surface of a pressure surface (tool tip surface) or another form of holding means.
[0042]
Moreover, it is not limited to attaching the tool 2 directly to the lower end of the tool holder 17, and if necessary, it may be attached via a load cell. Further, in the chip mounting apparatus shown in FIG. 14, the load cell 12 (pressure detecting means) is mounted on the upper end of the tool holder 17, but instead, it is mounted on the upper surface of the bracket 28, that is, Instead of attaching the attachment 30, the load cell 12 may be attached thereto, while the attachment 30 may be attached to the upper end of the tool holder 17.
[0043]
Further, the height detecting means is not limited to the eddy current type sensor, but may be other sensors (laser, optical sensor, etc.), and the Z-axis feeding device is not limited to the screw-axis feeding type. Other types such as a linear motor type may be used, and the drive control means may be a servo motor or other means.
[0044]
Furthermore, when the applied pressure is high, the balance pressure port may not be used but the pressure may be controlled only by the pressure port, and the height detection means detects the height of the tool holder by detecting the height position of the tool holder. In addition to mounting so as to measure the position (indirectly detecting the height position of the bonding tool), the tool may be mounted so that the height position of the tool can be detected directly.
[0045]
【The invention's effect】
As described above, according to the present invention, the height position control of the tool can always be performed with high accuracy without being affected by the thermal expansion of the feed mechanism such as the ball screw shaft of the Z-axis feed device. Therefore, when the tool holds the chip, the chip height can be controlled with high precision, and the chip bump can be mounted well without excessive crushing, and the bump shape can be corrected. It is possible to obtain a chip mounting method and apparatus capable of performing the above.
[Brief description of the drawings]
FIG. 1 is a front view of a chip mounting apparatus according to the present invention.
FIG. 2 is a diagram showing an appearance at the start of mounting.
FIG. 3 is a diagram illustrating a shape state of a bump at the start of mounting.
FIG. 4 is a diagram illustrating a state in which bumps are grounded to pads on a substrate.
FIG. 5 is a diagram showing an initial grounding state (point contact state) of bumps with respect to pads on a substrate.
FIG. 6 is a diagram showing a floating state of the tool holder after the bump is grounded to the pad of the substrate.
FIG. 7 is a diagram showing a state where both air supply and Z-axis feed are stopped.
FIG. 8 is a diagram showing an air supply state for bringing all of the bumps into contact with the pads of the substrate.
FIG. 9 is a view showing a state where bumps are brought into surface contact with pads of a substrate.
FIG. 10 is a diagram showing a state in which the minute pressurizing force is controlled by switching the air supply.
FIG. 11 is a view showing a state in which the holder support means is moved in the direction of the arrow in order to correct the shape of the bump.
FIG. 12 is a diagram showing a bump shape correction state;
FIG. 13 is a diagram showing a shape of a bump during shape correction.
FIG. 14 is a front view of another chip mounting apparatus according to the present invention.
FIG. 15 is a front view of a conventional chip mounting apparatus.
[Explanation of symbols]
1: Chip 1a: Bump 2: Tool 3: Z-axis feed device 4: Substrate holding stage 5: Substrate 7: Feed mechanism 8: Slider 12: Load cell 15: Holder support means 16: Holder bracket 17: Tool holder 18: Static pressure Air bearing 22: Drive control means 23: Height detection means

Claims (4)

ホルダー支持手段を上下動せしめるＺ軸送り装置と、前記ホルダー支持手段に上下動し得るように装着されたツールホルダーと、前記ツールホルダーに装着されたツールとを備えたチップ実装装置において、
ホルダー支持手段がエアーシリンダーからなるシリンダーチューブで構成されており、
シリンダーチューブ内を上下移動するピストンにツールホルダーが装着されており、
ホルダー支持手段に開口されたバランス圧ポートから供給される加圧エアーにより、ツールホルダーの自重を打ち消す加圧力で制御する機構と、
ホルダー支持手段内を上下動するピストンの位置を検出する高さ検出手段とを備え、
基板に対するチップの接地時に、ホルダー支持手段に対してツールが浮上させられたストローク分を前記高さ検出手段で測定し、
チップのバンプがツールで加熱されて溶融し始める際に、ツールホルダーの自重を打ち消す加圧力でチップのバンプを加圧するとともに、
前記ツールホルダーの熱膨張によって変動する高さ位置を検出して前記Ｚ軸送り装置の駆動制御手段にフィードバックする前記高さ検出手段を前記ホルダー支持手段に装着したことを特徴とするチップ実装装置。In a chip mounting apparatus comprising: a Z-axis feeding device that moves the holder support means up and down; a tool holder that is mounted so as to be able to move up and down on the holder support means; and a tool that is mounted on the tool holder.
The holder support means consists of a cylinder tube consisting of an air cylinder,
A tool holder is attached to the piston that moves up and down in the cylinder tube.
A mechanism for controlling with a pressurizing air supplied from a balance pressure port opened to the holder support means with a pressurizing force that cancels the weight of the tool holder ;
A height detection means for detecting the position of the piston moving up and down in the holder support means,
When the ground chip to the substrate to measure the stroke of the tool has been floated against the holder support means in said height detecting means,
When the chip bumps are heated by the tool and begin to melt , the chip bumps are pressed with a pressure that cancels the weight of the tool holder,
A chip mounting apparatus, wherein the height detecting means for detecting a height position fluctuating due to thermal expansion of the tool holder and feeding back to the drive control means of the Z-axis feeding device is mounted on the holder supporting means. 前記ツールホルダーの自重を打ち消す加圧力が、ホルダー支持手段に開口された加圧ポート及びバランス圧ポートから供給される加圧エアー同士の差圧で制御されている、請求項１に記載のチップ実装装置。  2. The chip mounting according to claim 1, wherein the applied pressure for canceling the weight of the tool holder is controlled by a pressure difference between pressurized air supplied from a pressure port and a balance pressure port opened in the holder support means. apparatus. 基板保持ステージに支持されている基板の上方からチップを保持しているツールを降下させて前記チップを熱圧着するチップ実装方法において、
チップ実装装置が、Ｚ軸送り装置と、Ｚ軸送り装置により上下動するホルダー支持手段と、ホルダー支持手段の内部を上下移動するピストンと、ピストンに静圧空気軸受けを介して装着されたツールホルダーと、ツールホルダーの下端に装着されたツールと、ツールホルダの高さ位置を検出する高さ検出手段とを備え、
前記ホルダー支持手段が、エアーシリンダーからなるシリンダーチューブで構成されており、
ホルダー支持手段に設けられた加圧ポートとバランス圧ポートから供給される加圧エアー同士の差圧をもって、ツールホルダーの上下動を所定に制御する機構を備え、
Ｚ軸送り装置を駆動し、ホルダー支持手段を下降させて、ツールホルダーの下端のツールに保持されたチップのバンプを、基板のパッドに接地させる工程と、
前記接地後、Ｚ軸送り装置による下降を続行させてホルダー支持手段に対してツールホルダーを離別させる工程と、
ツールホルダーの離別による高さ位置を高さ検出手段で検出し、所定の高さ位置に達したらＺ軸送り装置によるホルダー支持手段の下降を停止する工程と、
ツールでバンプを加熱し溶融させる工程と、
加圧ポートとバランス圧ポートとから供給される加圧エアーによりツールホルダーの自重を打ち消す加圧力をバンプに付与する工程と、
Ｚ軸送り装置を駆動しホルダー支持手段を所定高さだけ上昇させる工程と、
Ｚ軸送り装置を停止しバンプを冷却する工程と、を有し
前記ツールの上昇制御を、チップと基板の熱膨張分を吸収し得るように行い、
前記基板のバンプの形状矯正を行うことを特徴とするチップ実装方法。In a chip mounting method for thermocompression bonding the chip by lowering the tool holding the chip from above the substrate supported by the substrate holding stage,
The chip mounting device includes a Z-axis feeding device, a holder supporting means that moves up and down by the Z-axis feeding device, a piston that moves up and down in the holder supporting means, and a tool holder that is attached to the piston via a hydrostatic air bearing And a tool mounted on the lower end of the tool holder, and a height detection means for detecting the height position of the tool holder,
The holder support means is composed of a cylinder tube composed of an air cylinder,
A mechanism for controlling the vertical movement of the tool holder in a predetermined manner with a differential pressure between pressurized air supplied from a pressure port and a balance pressure port provided in the holder support means,
Driving the Z-axis feeding device, lowering the holder support means, and grounding the chip bump held by the tool at the lower end of the tool holder to the pad of the substrate;
A step of separating the tool holder from the holder support means by continuing the descent by the Z-axis feeding device after the ground contact;
Detecting the height position by the separation of the tool holder with the height detection means, and stopping the lowering of the holder support means by the Z-axis feeding device when reaching a predetermined height position;
A process of heating and melting the bump with a tool,
A step of applying pressure to the bumps to counteract the weight of the tool holder with pressurized air supplied from the pressure port and the balance pressure port;
Driving the Z-axis feed device to raise the holder support means by a predetermined height;
A step of stopping the Z-axis feeding device and cooling the bump, and performing the ascent control of the tool so as to absorb the thermal expansion of the chip and the substrate,
A chip mounting method comprising correcting the shape of a bump on the substrate. チップの接地時に一時的に加圧力を高めると共にバンプの加熱溶融後において加圧力を低下せしめることを特徴とする請求項３に記載のチップ実装方法。  4. The chip mounting method according to claim 3, wherein the pressing force is temporarily increased when the chip is grounded, and the pressing force is lowered after the bump is heated and melted.
JP2000103857A 1999-04-05 2000-04-05 Chip mounting method and apparatus Expired - Lifetime JP4577941B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100352115C (en) * 2003-06-02 2007-11-28 罗姆股份有限公司 Mold type semiconductor laser

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100709614B1 (en) * 1999-11-30 2007-04-20 토레 엔지니어링 가부시키가이샤 Chip bonding device
JP3825737B2 (en) * 2002-10-24 2006-09-27 住友重機械工業株式会社 Precision positioning device and processing machine using the same
AT414079B (en) * 2002-12-20 2006-08-15 Datacon Semiconductor Equip DEVICE FOR POSITIONING
EP1452618B1 (en) 2003-02-25 2014-04-16 A.L.M.T. Corp. Coated refractory metal plate having oxide surface layer, and setter during sintering using the same
US7661593B2 (en) * 2005-11-30 2010-02-16 Bio-Rad Laboratories, Inc. Moving coil actuator with expandable range of motion
JP5014151B2 (en) * 2005-12-06 2012-08-29 東レエンジニアリング株式会社 Chip mounting apparatus and chip mounting method
KR100787837B1 (en) * 2006-02-08 2007-12-27 박웅기 Chip's Compression Bonding Method and Apparatus for Producing a Plate Type Display Module
JP4879828B2 (en) * 2007-06-26 2012-02-22 新光電気工業株式会社 Flip chip bonding method and flip chip bonding apparatus
JP6083041B2 (en) * 2012-02-28 2017-02-22 ボンドテック株式会社 Bonding method, bonding system, and semiconductor device manufacturing method
US9165902B2 (en) * 2013-12-17 2015-10-20 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
KR101970794B1 (en) * 2014-04-07 2019-04-22 한화정밀기계 주식회사 Method for controlling operation of component mounter
JP6325053B2 (en) * 2016-11-01 2018-05-16 ボンドテック株式会社 Bonding system, bonding method, and semiconductor device manufacturing method
CN111406449B (en) * 2018-01-10 2022-02-11 株式会社富士 Grounding detection device and electronic component mounting machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062708U (en) * 1992-06-10 1994-01-14 日本電気株式会社 High speed bonding head

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153522A (en) * 1995-11-30 1997-06-10 Toshiba Corp Bonder and bonding method
JPH09153525A (en) * 1995-11-30 1997-06-10 Toshiba Corp Bonder and bonding method
JPH09321097A (en) * 1996-06-03 1997-12-12 Matsushita Electric Ind Co Ltd Depressing equipment of work provided with bumps
JP3561089B2 (en) * 1996-07-15 2004-09-02 株式会社東芝 Semiconductor chip mounting method and device
JP3399261B2 (en) * 1996-11-28 2003-04-21 松下電器産業株式会社 Flip chip bonding equipment
JPH10340931A (en) * 1997-06-05 1998-12-22 Toray Eng Co Ltd Chip bonding tool
JP3478072B2 (en) * 1997-07-18 2003-12-10 セイコーエプソン株式会社 Circuit component mounting heating device and circuit component mounting method
JP3878322B2 (en) * 1998-04-03 2007-02-07 シーケーディ株式会社 Air bearing cylinder and semiconductor manufacturing apparatus
JP3475776B2 (en) * 1998-04-07 2003-12-08 三菱電機株式会社 Flip chip bonding apparatus and flip chip bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062708U (en) * 1992-06-10 1994-01-14 日本電気株式会社 High speed bonding head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100352115C (en) * 2003-06-02 2007-11-28 罗姆股份有限公司 Mold type semiconductor laser

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