JP4553180B2 - 電磁波吸収遮蔽材 - Google Patents
電磁波吸収遮蔽材 Download PDFInfo
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- JP4553180B2 JP4553180B2 JP2004025116A JP2004025116A JP4553180B2 JP 4553180 B2 JP4553180 B2 JP 4553180B2 JP 2004025116 A JP2004025116 A JP 2004025116A JP 2004025116 A JP2004025116 A JP 2004025116A JP 4553180 B2 JP4553180 B2 JP 4553180B2
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- Prior art keywords
- electromagnetic wave
- metal
- shielding material
- weight
- wave absorption
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- 238000010521 absorption reaction Methods 0.000 title claims description 19
- 239000000463 material Substances 0.000 title claims description 14
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 19
- 239000000843 powder Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 150000002736 metal compounds Chemical class 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 239000011859 microparticle Substances 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000002244 precipitate Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 229920003051 synthetic elastomer Polymers 0.000 claims 1
- 239000005061 synthetic rubber Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 239000002114 nanocomposite Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 238000005469 granulation Methods 0.000 description 4
- 230000003179 granulation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- SDGKUVSVPIIUCF-UHFFFAOYSA-N 2,6-dimethylpiperidine Chemical compound CC1CCCC(C)N1 SDGKUVSVPIIUCF-UHFFFAOYSA-N 0.000 description 1
- 229910001035 Soft ferrite Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- -1 etc. Polymers 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
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- Paints Or Removers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Description
実施例1の電磁波吸収遮蔽性和紙シート、TDK市販の電磁波吸収遮蔽性シートIFL1AB、及びNEC市販の電磁波吸収遮蔽性シートIRL02Aを電磁波吸収測定器アンリツ37247Cを使用して吸収測定を行った。実施例1の電磁波吸収遮蔽性和紙シートは、素材の厚さが0.2mmと薄いが、低周波から高周波まで吸収効果が確認できた。TDKの市販シートIFL1ABは、実施例1と同等の厚さで測定したところ、効果が認められなかった。NECの市販シートIRL02Aは、実施例1の6倍の厚さで測定したが、低周波には効果がなく、2GHzで僅かに効果を示しただけであった。
実施例2のプラスチック成型体(厚さ0.2mm)、裏表にニッケルメッキを施したプラスチック成型体(厚さ0.2mm)、及び無処理のプラスチック成型体(厚さ0.2mm)のそれぞれについて電磁波吸収測定器アンリツ37247Cを使用して吸収測定を行った。実施例2のプラスチック成型体は低周波域から高周波域まで吸収効果が確認できた。裏表にニッケルメッキを施したプラスチック成型体では、1GHzの処で僅かに効果が出ているが、測定不能であった。無処理のプラスチック成型体では全く効果が認められなかった。
2 蓋
3 ノズル
4 回転ディスク
5 回転ディスク支持機構
6 粒子排出管
7 電気炉
8 混合ガスタンク
9 配管
10 配管
11 弁
12 排気装置
13 弁
14 排気装置
15 自動フィルター
16 微粒子回収装置
Claims (4)
- 金属粉末を含有する電磁波吸収遮蔽材であって、
前記金属粉末は、溶融固化粒子からなり、
前記溶融固化粒子は、粒径が300nm〜100μmの範囲の球状多結晶であり、組成分として、50乃至99重量%のCuと、3乃至50重量%のFeと、8乃至20重量%のAlと、4乃至10重量%のNiとを含み、前記組成分のそれぞれの微小粒子が、前記溶融固化粒子の内部において、金属化合物又は金属析出物により相互に隔離されている、
電磁波吸収遮蔽材。 - 金属粉末を有機溶媒に含有させた塗料を、シートに塗布してなる電磁波吸収遮蔽性シートであって、
前記金属粉末は、溶融固化粒子からなり、
前記溶融固化粒子は、粒径が300nm〜100μmの範囲の球状多結晶であり、組成分として、50乃至99重量%のCuと、3乃至50重量%のFeと、8乃至20重量%のAlと、4乃至10重量%のNiとを含み、前記組成分のそれぞれの微小粒子が、前記溶融固化粒子の内部において、金属化合物又は金属析出物により相互に隔離されている、
電磁波吸収遮蔽性シート。 - 請求項1に記載の電磁波吸収遮蔽材を3重量%以上含有していることを特徴とする合成樹脂又はゴム。
- 請求項1に記載の電磁波吸収遮蔽材を3重量%以上含有していることを特徴とする合成樹脂塗料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004025116A JP4553180B2 (ja) | 2004-02-02 | 2004-02-02 | 電磁波吸収遮蔽材 |
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---|---|---|---|
JP2004025116A JP4553180B2 (ja) | 2004-02-02 | 2004-02-02 | 電磁波吸収遮蔽材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005216791A JP2005216791A (ja) | 2005-08-11 |
JP4553180B2 true JP4553180B2 (ja) | 2010-09-29 |
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JP2004025116A Expired - Fee Related JP4553180B2 (ja) | 2004-02-02 | 2004-02-02 | 電磁波吸収遮蔽材 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5975604B2 (ja) * | 2011-03-29 | 2016-08-23 | 株式会社神戸製鋼所 | 電磁波シールド材用銅合金の製造方法 |
JP2015214742A (ja) * | 2014-05-13 | 2015-12-03 | 有限会社 ナプラ | 多結晶金属粒子、及び、導電性ペースト |
CN105002393A (zh) * | 2015-07-06 | 2015-10-28 | 刘实 | 一种铁铜复合金属材料的制作方法、铁铜复合金属材料及应用 |
KR20210134372A (ko) * | 2019-03-03 | 2021-11-09 | 고쿠리츠다이가쿠호진 도호쿠다이가쿠 | 전자파 차폐재 |
CN113369481B (zh) * | 2020-03-10 | 2022-11-04 | 武汉理工大学 | 一种耐高温氧化片状纳米晶微波吸收剂及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6213502A (ja) * | 1985-07-10 | 1987-01-22 | Reiko Co Ltd | 広帯域電磁波遮蔽用金属粉 |
JPH06264196A (ja) * | 1993-03-15 | 1994-09-20 | Toshiba Corp | 電磁波・磁気遮蔽材 |
JPH1040738A (ja) * | 1996-07-18 | 1998-02-13 | Asahi Chem Ind Co Ltd | 導電性ペースト |
JPH11265715A (ja) * | 1999-01-18 | 1999-09-28 | Dowa Mining Co Ltd | ガス発生量の少ないアルカリ電池用亜鉛合金粉末 |
JP2000353427A (ja) * | 1999-06-11 | 2000-12-19 | Dainippon Ink & Chem Inc | 導電性フィルム |
JP2002158482A (ja) * | 2000-11-16 | 2002-05-31 | Kitagawa Ind Co Ltd | 電磁波吸収体用金属粉末,電磁波吸収体,及び塗料 |
-
2004
- 2004-02-02 JP JP2004025116A patent/JP4553180B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6213502A (ja) * | 1985-07-10 | 1987-01-22 | Reiko Co Ltd | 広帯域電磁波遮蔽用金属粉 |
JPH06264196A (ja) * | 1993-03-15 | 1994-09-20 | Toshiba Corp | 電磁波・磁気遮蔽材 |
JPH1040738A (ja) * | 1996-07-18 | 1998-02-13 | Asahi Chem Ind Co Ltd | 導電性ペースト |
JPH11265715A (ja) * | 1999-01-18 | 1999-09-28 | Dowa Mining Co Ltd | ガス発生量の少ないアルカリ電池用亜鉛合金粉末 |
JP2000353427A (ja) * | 1999-06-11 | 2000-12-19 | Dainippon Ink & Chem Inc | 導電性フィルム |
JP2002158482A (ja) * | 2000-11-16 | 2002-05-31 | Kitagawa Ind Co Ltd | 電磁波吸収体用金属粉末,電磁波吸収体,及び塗料 |
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JP2005216791A (ja) | 2005-08-11 |
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