JP4408690B2 - Semiconductor package test system and test method - Google Patents

Description

  The present invention relates to a semiconductor package test system and a test method.

  Generally, a semiconductor chip is sealed with a molding material and packaged, and then a test (inspection) is performed. This test mainly includes an inspection relating to the operation of the integrated circuit formed on the semiconductor chip and a burn-in test. The burn-in test is a test performed in order to improve the reliability of the product, and is executed by continuously operating in a high temperature state and a high voltage application state.

  FIG. 15 shows an example of a conventional semiconductor package (hereinafter simply referred to as a package) test system. First, the package 1 placed on the tray 106 is vacuum-sucked by the supply shuttle 107 and conveyed into the socket 103. As shown in the figure, the socket 103 is formed with a recess corresponding to the shape of the package 1, and an electrode is provided at a position corresponding to the ball electrode 11 of the package 1 at the bottom. The package 1 is placed so that the ball electrode 11 of the package 1 is in contact with each of the electrodes provided on the bottom surface of the concave portion of the socket 103. That is, the package 1 is placed in the recess of the socket 103 so that the ball electrode 11 side is positioned below. In such a state, the pusher 108 provided above the socket 103 moves downward and presses the upper surface of the package 1. This ensures the contact between the ball electrode 11 of the package 1 and the electrode of the recess of the socket 103.

  Patent Documents 1 and 2 are publicly known documents disclosing conventional semiconductor package test systems.

  A conventional burn-in system will be described with reference to FIG. First, a package 1 to be tested is inserted into a plurality of sockets 1091 provided on a burn-in test board (BT board) 109.

In the following description, “BT” is an abbreviation for burn-in test. The BT plate 109 includes a BT plate insertion portion 1092 that is an electrode. The burn-in apparatus 60 has a burn-in furnace 601, and a BT plate insertion port 602 is provided at the back of the burn-in furnace 601. A burn-in test is performed in a state where the BT plate insertion portion 1092 of the BT plate 109 is inserted into the BT plate insertion port 602.
JP-A-6-102311 Japanese Patent Laid-Open No. 11-3759

  In the conventional test system, as shown in FIG. 15, the supply shuttle 107 transports the package 1 into the recess of the socket 103. If the transport mechanism is not accurately adjusted, the ball electrode 11 and the like of the package 1 The package 1 collides with the side wall of the socket 103 or the like and is stored in an inclined state with respect to the concave portion of the socket 103, and a contact failure between the ball electrode 11 of the package 1 and the electrode of the socket 103 may occur. . Particularly in the case of testing an analog circuit, the contact failure directly affects the test characteristics.

  The burn-in test is performed with the package 1 inserted into the socket 1091 of the BT plate 109 as described above, but there is a problem that the number of packages 1 that can be tested at one time is small and the working efficiency is low.

  The present invention has been made to solve such a problem, and a first object thereof is to provide a test system and a test method capable of preventing contact failure. It is a second object of the present invention to provide a test system and a test method capable of performing a burn-in test with high work efficiency.

  A test system according to the present invention is a test system for a semiconductor package having an electrode surface on which an electrode is disposed on one surface, and a back surface facing the electrode surface is flat, wherein the plurality of semiconductor packages are connected to the electrode surface. And a test apparatus that is provided above the tray and that performs a test in contact with an electrode of the semiconductor package.

  The tray is preferably formed with a plurality of recesses for accommodating the plurality of semiconductor packages.

  In addition, it is preferable that the semiconductor package be accommodated in a space formed between the upper and lower trays when the tray is overlaid.

  The tray may have a receiving portion that prevents the electrodes of the semiconductor package from coming into contact with the tray provided on the electrode side of the semiconductor package in a state where the trays are stacked one above the other.

  Further, it is desirable that the tray is fixed to a stage via a positioning mechanism, and the stage is movable at least with respect to the test apparatus.

  The stage may include a temperature adjustment mechanism.

  Furthermore, the test apparatus preferably includes a package holding mechanism that holds the package.

  Furthermore, it is desirable that the tray has a groove portion that receives a part of the package holding mechanism.

  The test apparatus in a preferred embodiment has a function of performing a burn-in test.

  In this case, it is desirable to surround at least the package under burn-in test and provide a temperature controlled furnace.

  A test method for a semiconductor package according to the present invention is a test method for a semiconductor package having an electrode surface on which an electrode is arranged on one surface, and a back surface facing the electrode surface is flat. Placing the electrode surface upward in the recess of the tray, moving the tray upward to bring the electrode of the semiconductor package into contact with the electrode of the test apparatus, and from the test apparatus to the semiconductor package And providing a signal to perform a test.

  Another test method according to the present invention is a test method for a semiconductor package having an electrode surface with an electrode disposed on one surface and a flat back surface facing the electrode surface. A step of performing a first test under a temperature environment and a step of performing a second test which is a burn-in test under a high temperature, wherein the step of performing the first test includes a plurality of semiconductor packages having electrode surfaces The tray placed upward is moved upward to bring the electrode of the semiconductor package into contact with the electrode of the test device, and a test is performed by supplying a signal from the test device to the semiconductor package. And performing the second test includes moving the tray used in the first test upward, Contacting the electrodes of the mounted semiconductor package with the electrodes of the burn-in test apparatus; and supplying a power source and a predetermined signal to at least the semiconductor package from the burn-in test apparatus to execute a burn-in test. Is.

  According to the present invention, it is possible to provide a test system and a test method capable of preventing contact failure. Furthermore, a burn-in test with high work efficiency can be performed.

Embodiment 1 of the Invention
FIG. 1 shows the configuration of a test system according to the first embodiment of the present invention. The package 1 to be tested (inspected) in the test system is a surface mount type package in which an electrode is formed on one surface and a surface facing the electrode surface is a flat surface. For example, it is a BGA (Ball Grid Array) type package in which spherical bumps (ball electrodes) made of solder or the like are arranged in an array. However, the electrodes do not need to be disposed over the entire electrode surface of the package 1, and only the peripheral portion may be disposed.

  The test system includes a test apparatus 2, a tray 3, and a stage 4.

  The test apparatus 2 is a means for testing an integrated circuit of a semiconductor chip (not shown) housed in the package 1 in contact with the electrode 11 of the package 1, and is fixed by a fixing means (not shown).

  The test apparatus 2 includes a tester 21, a test board 22, and an electrode unit 23. The tester 21 stores a circuit and control means for executing a test. The test board 22 includes a circuit and a control unit that are additionally attached in order to execute a test corresponding to the type of the package or the integrated circuit. Since the configuration of the tester 21 and the test board 22 is the same as the conventional configuration, detailed description thereof is omitted. The electrode portion 23 has an electrode surface 231 on the lower surface thereof, and directly makes electrical contact with the ball electrode 11 of the package 1 to make electrical connection between the tester 21 and the test board 22 and the integrated circuit of the package 1. It is realized. A plurality of electrodes are provided on the electrode surface 231 at positions corresponding to the arrangement of the ball electrodes 11 provided on the package 1.

  The test apparatus 2 according to the embodiment of the present invention includes a package hold arm 24. Since the package 1 is held by the package hold arm 24 and the movement of the package 1 is thereby restricted, electrical contact between the electrode portion 23 and the ball electrode 11 of the package 1 can be ensured.

  The tray 3 is fixed on the stage 4 by the tray positioning mechanism 31 and provided below the test apparatus 2. In this example, the tray positioning mechanism 31 is configured by a convex portion that protrudes from the lower surface of the tray 3, and fits with the concave portion on the upper surface of the stage 4. However, the tray positioning mechanism 31 is not limited to such a configuration, and may be a recess. In this case, it engages with the convex portion on the upper surface of the stage 4.

  The tray 3 is a portable means for fixing the package 1 during the test. In addition, the tray 3 includes a plurality of recesses that can fix a plurality of packages 1, and thus, for example, 200 packages 1 can be fixed. In a preferred embodiment, the tray 3 is used not only for a test using the test apparatus 2 but also for performing a burn-in test, and further for shipping.

  The tray 3 is made of a heat-resistant synthetic resin such as PP (polypropylene) resin, PS (polystyrene) resin, PPE (polyphenylene ether) resin, and the like, and has a recess in which the package 1 is accommodated. Therefore, the concave portion forms a space wider than the package 1. The package 1 is placed in the concave portion of the tray 3 so that the electrode surface provided with the ball electrode 11 faces upward. That is, when the package 1 is placed, the back surface facing the electrode surface contacts the bottom surface of the recess of the tray 3. The specific configuration of the tray 3 will be described in detail later.

  The stage 4 is fixed to the tray 3 and is movable by a stage moving mechanism (not shown) in a direction parallel to the main surface of the package 1. The stage moving mechanism includes, for example, a stepping motor and a linear motor. Further, the stage 4 can be moved in the upward direction, that is, the direction of the test apparatus 2 by the stage moving mechanism. The stage 4 includes a temperature adjustment mechanism (not shown). The temperature adjusting mechanism includes not only heating means such as an electric heater, but also cooling means such as a Peltier element, a refrigerant such as liquid nitrogen, or a cooler. Further, the temperature adjustment mechanism includes a temperature sensor, and the heating means and the cooling means can be feedback-controlled based on the temperature of the stage 4 detected by the temperature sensor.

  Here, the test method in Embodiment 1 of this invention is demonstrated using FIG. First, the package 1 is placed in the concave portion of the tray 3 by a conveying means (not shown). In Embodiment 1 of the present invention, the package 1 is arranged such that the electrode surface is located on the upper side and the flat back surface is in contact with the bottom surface of the recess of the tray 3. There is almost no possibility of colliding with a side wall or the like. Therefore, since the package 1 is hardly stored in the tray 3 in an inclined state, the package 1 can be accurately positioned with respect to the tray 3.

  Thereafter, the stage 4 fixed to the package 1 is moved below the test apparatus 2 by the stage moving mechanism. At this time, the package 1 is held by the package hold arm 24. Next, the stage 4 fixed to the package 1 is moved upward, that is, to the test apparatus 2 side by the stage moving mechanism. Such movement is performed until the ball electrode 11 of the package 1 comes into contact with the electrode of the electrode portion 23 of the test apparatus 2, and the movement stops after the contact.

  Next, various tests are performed in a state where the ball electrode 11 of the package 1 and the electrode of the electrode unit 23 of the test apparatus 2 are in contact with each other. Specifically, signals are supplied from the test apparatus 2 to the semiconductor package 1 according to various test patterns, and the test is performed by the test apparatus 2 detecting output signals for these signals. When the test is completed, the holding of the package 1 by the package hold arm 24 is released, and the stage 4 is moved downward, that is, away from the test apparatus 2 by the stage moving mechanism. Then, an index operation is performed, and another package 1 is tested in the same manner. The test is performed on all the packages 1 placed on the tray 3.

  The test apparatus 2 stores the test result for each package 1 in a storage unit such as a memory as defective MAP (map) information. In this defective MAP information, the position information of the package 1 in the tray 3 and the test result information of each package 1 are associated with each other. The test result information may include defect type information (defective content information). Since the package 1 is tested as it is without changing the position on the tray 3 and is disposed at the same position after the test, the position information of the package 1 remains the same before and after the test. Thereafter, it is possible to sort the packages 1 according to whether there is a defect or not, and it is also possible to sort finely according to the type of defect.

  When the test is completed for all of the packages 1 placed on the tray 3, the tray 3 fixed to the stage 4 is further transported to an apparatus for performing another process such as a burn-in test. Thereafter, the tray 3 on which a plurality of packages 1 are finally placed is shipped as it is.

  2 to 5 each show a part of the tray 3. 2 is a cross-sectional view of the tray 3, FIG. 3 is a top view of the tray 3, FIG. 4 is a bottom view of the tray 3, FIG. 5A is a perspective view seen from the top side of the tray 3, and FIG. 3 is a perspective view seen from the lower surface side of FIG. In the following description, in the state shown in FIG. 2, the upper side in the figure is the upper side of the tray 3, and the lower side in the figure is the lower side of the tray 3.

  The tray 3 is formed with a recess for storing the package 1 as described above. The concave portion of the package 1 has a shape recessed into a quadrangular shape corresponding to the side surface of the package 1 when viewed from above. The depression is substantially the same as the thickness of the package 1. The concave portion of the package 1 is formed by forming a protruding portion 32 around the concave portion. In this example, four protrusions 32 are provided for one recess so as to guide the package 1 at the four corners of the package 1.

  The bottom surface 33 (the surface facing the electrode surface) of the package 1 is in contact with the bottom surface 33 of the recess. A cavity 34 is provided at the center of the bottom surface 33. The cavity 34 has a shape in which a quadrangle is cut out when viewed from above. The cavity 34 has a shape in which a quadrangle is cut out even when viewed from the lower surface, but is formed so that the cavity becomes narrower as it approaches the upper surface side of the package 1. In other words, the cavity 34 is formed such that the cavity becomes wider toward the lower side in a state where the package 1 is placed on the tray 3. The size of the cavity 34 is such that the ball electrode 11 provided on the electrode surface of the package 1 can be inserted from below.

  In the vicinity of the center of each of the four sides of the recess, a groove 36 having a surface 35 that is lower than the bottom surface 33 of the recess is formed. As shown in FIG. 3, the groove 36 is formed across adjacent concave portions. The tip of the package hold arm 24 of the test apparatus 2 is inserted into the groove 36. That is, the groove portion 36 is provided so that the tip end portion thereof does not contact the tray 3 when the package holding arm 24 performs the operation of holding the package 1. The distance between the adjacent groove portions 36 is shorter than the distance between the opposite side surfaces of the package 1. Thereby, the package hold arm 24 can reliably avoid contact with the tray 3 when holding the package 1.

  As shown in FIG. 5B, protrusions 38 are also provided on the lower surface 37 of the tray 3 at four locations near the center of the four sides so as to surround the cavity 34. This protrusion 38 is a quadrangular prism-shaped protrusion, and is fitted between adjacent protrusions 32 on the upper surface of the tray 3 positioned below in a state where the plurality of trays 3 are stacked, so that both trays 3 Are aligned.

  6 is a perspective view of a part of the tray 3 as viewed from the upper surface side, and FIG. 7 is a perspective view of a part of the tray 3 as viewed from the lower surface side. In the region shown in FIG. 6, six packages 1 can be mounted.

  FIG. 8 is a cross-sectional view showing a part of the tray 3 at the time of shipment. As shown in the figure, at the time of shipment, a plurality of trays 3 are stacked one above the other. When the plurality of trays 3 are stacked, the protrusions 32 come into contact with the surface 37 of the tray 3 located on the lower side, so that a space for accommodating the package 1 is formed. At this time, the protrusion 38 protruding from the surface 37 of the lower tray 3 is in contact with the surface 33 between the protrusions 32 protruding from the surface 33 of the upper tray 3. The package 1 is accommodated in a space formed between the upper and lower trays 3. At this time, the ball electrode 11 of the package 1 is inserted from the wide side of the cavity 34. At this time, the cavity 34 functions as a receiving portion for the ball electrode 11. Thus, since the ball electrode 11 is inserted into the cavity 34 of the tray 3 positioned on the lower side and is accommodated in a state where it does not contact the tray 3, the ball electrode 11 is not easily damaged. Thereby, the yield of products can be improved. Note that the cavity 34 does not necessarily pass through the upper surface and the lower surface of the tray 3, and may be anything that constitutes at least the receiving portion of the ball electrode 11. Therefore, a recess may be used instead of a penetrating cavity.

  Subsequently, the holding of the package 1 by the package hold arm 24 will be described. As shown in FIG. 1, the package hold arm 24 includes four rod-like members extending downward on the side of the tip portion of the electrode portion 23. The package 1 is held by the package hold arm 24.

  FIG. 9 is a top view of the tray 3. As shown in the figure, the four package hold arms 24 move in a groove 36 provided in the tray 3 to hold the package 1.

  FIG. 10 shows a detailed configuration of the package hold arm 24. FIG. 4A is a top view of the package hold arm 24. FIG. The package hold arm 24 includes a moving mechanism (not shown) that moves in the direction of the arrow shown in the drawing, that is, inward. FIG. 4B is a side view of the package hold arm 24. As shown in the figure, the tip is processed at an acute angle.

  The operation of the package hold arm 24 will be described with reference to FIG. As shown in FIG. 5A, in the state where the package 1 is placed on the tray 3 (not shown) and the stage 4 is moved upward by the stage moving mechanism, the package holding arm is sandwiched so as to sandwich the package 1. 24 moves inward. As shown in FIG. 4B, the stage 4 is further moved upward in a state where the package 1 is held by the package hold arm 24 from four directions. The stage 4 is moved upward until the ball electrode 11 of the package 1 comes into contact with the electrode of the electrode portion 23 (not shown). When the stage 4 is moved upward, the package 1 slides on the inner side surface of the package hold arm 24 and the electrodes are connected in a position-restricted state. For this reason, electrode connection can be performed with high accuracy, and contact failure can be prevented in advance.

  As described above, in the test system according to the first embodiment of the present invention, the package 1 is fixed on the tray 3 so that the back surface facing the electrode surface is in contact with the package 1, and can be fixed stably. Further, since it is not necessary to carry out every package 1 at the time of the test, there is no problem of electrode contact due to so-called oblique entry. As a result, the possibility of occurrence of electrode contact defects can be reduced, and the test can be performed stably.

  In addition, the test system eliminates the need to develop a socket, and is therefore versatile and effective in reducing costs. Further, since the contact between the electrodes is realized while the package 1 is held by the package hold arm 24, the positioning accuracy of the package 1 with respect to the tray 3 may not be so high. For this reason, since the molding accuracy of the tray 3 does not have to be very high, the tray 3 can be manufactured at low cost, and the cost can be reduced.

  In addition, since the test is executed with the package 1 placed on the tray 3, the index time, which is the time from the end of the test of the package 1 to the start of the test of the next package 1, can be shortened. .

  Furthermore, if the test result is managed by the defect map as described above, the package 1 can be classified for each defect type, and the defect analysis can be easily performed. In addition, by sorting the defective packages in parallel during other tray tests, only the index operation can be performed during the test, and the transport process from the tray to the socket is not required, improving work efficiency. It becomes.

Embodiment 2 of the Invention
The test system according to the second embodiment of the present invention executes a burn-in test that is a weather resistance test for evaluating the performance of a semiconductor. For example, in the burn-in test, a voltage is applied to the package 1 at a high temperature (125 ° C.) for 8 to 40 hours. Thereby, it is possible to detect an initial failure of the integrated circuit in the package 1. FIG. 12 shows the configuration of the test system. Since the tray 3 and the stage 4 used in this test system are the same as the configuration of the tray 3 and the stage 4 described in the first embodiment of the invention, description thereof is omitted.

  A burn-in device 5 is provided above the tray 3. The burn-in device 5 is a means for performing a burn-in test on a semiconductor chip (not shown) housed in the package 1 in contact with the electrode 11 of the package 1, and is fixed by a fixing means (not shown). Here, the burn-in test means that a high voltage is applied to the package 1 at a high temperature for a predetermined time, and a test for confirming whether the package 1 operates normally is a test system other than the test system shown in FIG. Executed by the system.

  Specifically, the burn-in device 5 includes a device main body 51, a burn-in plate (BT plate) 52, and an electrode portion 53. The apparatus main body 51 stores a circuit and control means for executing a burn-in test. The BT board 52 includes a circuit and a control unit that are additionally attached in order to execute a test corresponding to the type of the package or the integrated circuit. The electrode portion 53 has an electrode surface 531 on the lower surface thereof, and directly makes electrical contact with the ball electrode 11 of the package 1 to electrically connect the device main body 51 and the BT plate 52 to the integrated circuit of the package 1. Is realized. A plurality of electrodes are provided on the electrode surface 531 at positions corresponding to the arrangement of the ball electrodes 11 provided on the package 1. The electrodes on the electrode surface 531 do not have to be provided corresponding to all the ball electrodes 11. For example, in the case of a dynamic burn-in test, only the electrodes corresponding to the clock signal terminal, input signal terminal, power supply signal terminal, and ground terminal need be provided. For example, it is not necessary to provide an electrode corresponding to the output signal terminal.

  Further, the burn-in device 5 in the embodiment of the present invention includes a package hold arm 54. The package hold arm 54 is elastically supported by the BT plate 52 or the apparatus main body 51 via a cushion spring 55 that is an elastic body. For this reason, when an external force is applied to the package hold arm 54, a predetermined elastic behavior is exhibited. The package hold arm 54 restricts the movement of the package 1, thereby ensuring electrical contact between the electrode portion 23 and the ball electrode 11 of the package 1.

  In order to execute the burn-in test, it is necessary to control the temperature of the package 1. As one of means for performing such temperature control, there is a method in which a temperature adjusting mechanism 41 is provided on the stage 4 that fixes the tray 3. The temperature adjustment mechanism 41 is a heating means such as an electric heater. Furthermore, the temperature adjustment mechanism 41 includes a temperature sensor, and can feedback control the heating means based on the temperature of the stage 4 detected by the temperature sensor. When the stage 4 is maintained at a predetermined temperature by the temperature adjustment mechanism 41, the tray 3 in contact with the stage 4 can be maintained at substantially the same temperature. This makes it possible to accurately set the temperature conditions during the test without adversely affecting the test accuracy. In particular, the second embodiment of the present invention has a configuration in which the back surface of the package 1 is in contact with the tray 3, so that the heat transfer efficiency from the tray 3 to the package 1 is high, so that the temperature condition can be set more accurately.

  Furthermore, you may provide the BT furnace which consists of a box-shaped housing | casing which accommodates the burn-in apparatus 5 and the tray 3 at least. By setting the inside of the BT furnace to a predetermined temperature, the temperature of the package 1 can be controlled. FIG. 13 shows the configuration of a burn-in test (BT) system 6 having a BT furnace. As shown in the figure, an apparatus main body 51, a BT plate 52, an electrode portion 53, a tray 3, and a stage 4 are accommodated in a BT furnace 61. Further, a door (not shown) is provided on the front surface of the BT furnace 61 to form a sealed space. With such a configuration, more accurate temperature control is possible.

  Further, as shown in FIG. 14, a plurality of BT systems 6A, 6B, 6C are installed side by side adjacent to each other, and a tray 3 on which a large number of packages 1 are placed by a loader 7 serving as a conveying means is connected to each BT system 6A, The burn-in test may be executed in parallel by transporting to 6B and 6C. This further increases efficiency.

  Here, a burn-in test method according to the second embodiment of the present invention will be described with reference to FIG. First, the package 1 is placed in the concave portion of the tray 3 by a conveying means (not shown).

  In the second embodiment of the present invention, the package 1 is arranged such that the electrode surface is located on the upper side and the flat back surface is in contact with the bottom surface of the recess of the tray 3. There is almost no possibility of colliding with a side wall or the like. Therefore, since the package 1 is hardly stored in the tray 3 in an inclined state, the package 1 can be accurately positioned with respect to the tray 3.

  Thereafter, the stage 4 is moved below the burn-in device 5 by the stage moving mechanism. Further, the stage 4 is moved upward, that is, toward the burn-in device 5 by the stage moving mechanism. At this time, the movement of the package 1 is restricted by the package hold arm 54. Such movement is performed until the ball electrode 11 of the package 1 comes into contact with the electrode of the electrode portion 53 of the burn-in device 5, and the movement stops after the contact.

  Next, a burn-in test is performed in a state where the ball electrode 11 of the package 1 and the electrode of the electrode part 23 of the burn-in device 5 are in contact with each other. In a state where such a burn-in test is performed, the package 1 is subjected to predetermined temperature control. When the burn-in test is completed, the stage 4 is moved downward, that is, in a direction away from the burn-in device 5 by the stage moving mechanism. Furthermore, the tray 3 is conveyed to an apparatus for performing another process. For example, the operation test of the package 1 to which a high voltage is applied for a predetermined time at a high temperature is performed, and the package 1 is transported to a device for selecting defective products. Thereafter, the tray 3 on which a plurality of packages 1 are finally placed is shipped as it is.

  As described above, in the test system according to the second embodiment of the present invention, since the test can be executed on the tray 3, no socket is necessary. This makes it possible to reduce costs.

  Moreover, the electrode part 53 of the burn-in apparatus 5 should just be positioned with respect to the tray 3, can align with the package 1, and can make the structure of the electrode surface 531 small. For this reason, the test can be performed in a small space.

  Further, by increasing the accuracy of the shape of the tray 3, the ball electrode 11 of the package 1 and the electrode of the electrode portion 53 of the burn-in device 5 can be aligned only by alignment with the tray 3.

  Moreover, since the same thing can be used for the tray 3 even if it is the package 1 which has a different electrode structure if the package size is the same, it can be used universally.

Other Embodiments of the Invention
In the above example, the package 1 has been described as being shipped by the tray 3, but it may be shipped by being transferred to another inexpensive tray.

It is a figure which shows the structure of the test system concerning this invention. It is a partial cross section figure of the tray used in the test system concerning the present invention. It is a partial top view of the tray used in the test system concerning the present invention. It is a partial bottom view of the tray used in the test system concerning the present invention. It is a partial perspective view of the tray used in the test system concerning the present invention. It is a partial perspective view of the tray used in the test system concerning the present invention. It is a partial perspective view of the tray used in the test system concerning the present invention. It is sectional drawing which shows the shipment state of the tray used in the test system concerning this invention. It is a partial cross section figure of the tray used in the test system concerning the present invention. It is a figure which shows the structure of the package hold arm used in the test system concerning this invention. It is a figure which shows the hold operation | movement of the package hold arm used in the test system concerning this invention. It is a figure which shows the structure of the burn-in test system concerning this invention. It is a figure which shows the structure of the burn-in test system concerning this invention. It is a figure which shows the structure of the burn-in test system concerning this invention. It is a figure which shows the structure of the conventional test system. It is a figure which shows the structure of the conventional burn-in test system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Package 2 Test apparatus 3 Tray 4 Stage 5 Burn-in apparatus 6 Tray 7 Supply shuttle 8 Pusher 11 Ball electrode 21 Tester 22 Test board 23 Electrode part 24 Package hold arm 41 Temperature control mechanism

Claims (9)

A test system for a semiconductor package having an electrode surface on which electrodes are arranged, and a back surface facing the electrode surface is flat,
A tray for placing the plurality of semiconductor packages with the electrode surface facing upward;
A test device provided above the tray and performing a test in contact with the electrodes of the semiconductor package;
The tray Rutotomoni space for accommodating the semiconductor package in superimposed state vertically is formed between the upper and lower trays, extending from the periphery of the bottom surface in contact with the back of one of the semiconductor package the test system groove to reach the inside of the bottom surface that are formed. The tray, the plurality of semiconductor packages plurality of recesses are formed for accommodating the Rutotomoni, the groove, the back surface from the inside of the bottom surface of the other one of the contact of the one formed in the recess one the semiconductor package The test system according to claim 1, wherein the test system is formed in a recess and extends to the inside of a bottom surface with which the back surface of the other semiconductor package contacts . The tray, have a receiving portion which is the semiconductor package of the electrodes in a state of being vertically stacked prevented from contacting the tray provided on the electrode side of the semiconductor package, by forming an opening of the receiving portion test system according to claim 1, wherein the four sides of successive there are characterized Rukoto support the electrode surface of one of said semiconductor package.   The test system according to claim 1, wherein the tray is fixed to a stage via a positioning mechanism, and the stage is movable at least with respect to the test apparatus.   The test system according to claim 4, wherein the stage includes a temperature adjustment mechanism.   The test system according to claim 1, wherein the test apparatus includes a package holding mechanism that holds the package.   The test system according to claim 6, wherein the tray has a groove portion that receives a part of the package holding mechanism.   The test system according to claim 1, wherein the test apparatus has a function of performing a burn-in test.   9. The test system according to claim 8, further comprising a temperature-controlled furnace surrounding at least the package under burn-in test.

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