JP4330950B2 - Electrical circuit composite module - Google Patents

Description

  The present invention relates to an electric circuit composite module such as a wiring board to which a solid-state imaging device is electrically bonded, and is intended to reduce the size and thickness of the module and save labor in the manufacturing process.

  In recent years, as described in Non-Patent Document 1, electronic devices such as mobile phones are required to have a low volume as the number of functional modules increases with the increase in functionality, and a camera as a multimedia image input device. The mounting of has been in the limelight. This type of camera is required to be thinner because a large number of cameras are required to be mounted on one device because of the devices to be mounted.

  A conventional electric circuit composite module will be described below with reference to the drawings. FIG. 9 is a perspective view showing an example of a conventional electric circuit composite module, and shows an electric circuit composite module on which two solid-state imaging devices are mounted.

In FIG. 9, 1 is a solid-state imaging device, 2 is a wiring board made of a flexible printed circuit board and the like, and 9 is an electric circuit board. First, the solid-state imaging device 1 is mounted on the wiring board 2. In the case of this example, two pairs of wiring boards 2 on which the solid-state imaging device 1 is mounted are manufactured, and then the orientation of the solid-state imaging device 1 is reversed with respect to the electric circuit board 9. Thus, it is electrically joined. In addition, when it is necessary to bend the wiring board 2, the bending operation in the assembly process is usually performed manually or by a robot.
Nikkei Electronics, December 16, 2002, No. 837, p. 57-64

  However, such a configuration has a problem that the number of parts constituting the electric circuit composite module is large, and the individually configured modules are further electrically joined, so that the assembly process becomes complicated. It was. In addition, in the assembly process, when the bending process is performed, equipment and people are required, and there is a problem that the assembly cost increases.

  The present invention solves the above-mentioned conventional problems, and provides an electric circuit composite module capable of mounting a plurality of systems of solid-state imaging devices easily and inexpensively with a small number of parts and a small number of assembly steps. For the purpose.

The electric circuit composite module of the present invention is configured such that at least two systems of solid-state imaging devices and electronic circuit blocks thereof are electrically connected and arranged on a common wiring board at intervals, and the wiring board can be bent . The wiring board is bent by a regulating component joined to the bending shaft .

  According to the present invention, it is possible to realize an electric circuit composite module that can easily and inexpensively mount a plurality of solid-state imaging devices with a small number of parts and a small number of assembly steps.

  As described above, according to the present invention, various solid-state imaging device arrangements and combinations can be realized by simply mounting a plurality of solid-state imaging devices on one side of a wiring board and bending the wiring board. Equipped with a restriction part at the position where the wiring board is bent into a predetermined form, the equal folding work process that makes it possible to bend the wiring board in any order in any direction in the heating process after mounting electronic components The advantageous effect that it can be reduced is obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol shall be used about the same part as the said conventional thing.

(Embodiment 1)
FIG. 1 is a perspective view showing a basic configuration of a main part in a reference example of Embodiment 1 of an electric circuit composite module according to the present invention, and FIG. 2 is a perspective view showing respective bending forms of the electric circuit composite module shown in FIG. It is.

  1 and 2, reference numeral 1 denotes a solid-state imaging device, 2 denotes a wiring board made of a flexible printed circuit board or the like, and two solid-state imaging devices 1 of different systems are related to one side of the wiring board 2 with an interval. It is the structure mounted with the electronic circuit block.

  The subsequent processing mode of the electric circuit composite module configured as described above will be described below.

  First, if the wiring board 2 is bent as shown in FIG. 2A, a processing mode in which the solid-state imaging device 1 is mounted on a device with the direction opposite to the same axial direction is possible. As shown in FIG. 2 (b), the wiring board 2 is bent, the direction of the solid-state imaging device 1 is reversed, and the central axis of the solid-state imaging device 1 is shifted in parallel. A processing form capable of mounting two solid-state image sensors at a height of one is obtained, and furthermore, as shown in FIG. 2C, the wiring board 2 is bent so that the direction of the solid-state image sensor 1 is reversed. Further, in the same manner as that shown in FIG. 2B in which the central axis of the solid-state image pickup device 1 is shifted in parallel, other solid-state image pickup devices 1 can be mounted at the height of one solid-state image pickup device 1. The solid-state imaging device 1 is in a considerable range with a small number of parts, such as a processing form. There can be processed into a form that there is a degree of freedom.

As described above, according to the reference example , on the same wiring board, a plurality of systems of solid-state image sensors electrically connected thereto are arranged at a predetermined interval and their photographing directions are directed in the same direction. By bending the wiring board into a predetermined form with a small number of parts, the processing form in which the solid-state imaging device faces the same direction, the processing form in which the solid-state image sensor faces in the opposite direction, and further thinning is achieved. Such a processing form can be easily processed into a form having flexibility in a considerable range.

In the first embodiment is an important point bending of the wiring board in its practice, is obtained by adding a configuration for obtaining aims to facilitate the folding of this.

FIG. 3 is a perspective view showing the basic configuration of the main part of the first embodiment of the electric circuit composite module according to the present invention, FIG. 4 is a perspective view showing a form after bending of the electric circuit composite module shown in FIG. These are explanatory drawings which show an example of the control components which control the bending angle etc. which are used for the electric circuit composite module shown in FIG. 3, FIG. 5 (a) is a perspective view which shows the structure, FIG.5 (b) is FIG. 5A is a perspective view showing a state in which the restriction component of FIG. 5A is mounted on the wiring board, FIG. 5C and FIG. 5D are explanatory diagrams of the restriction operation, and FIG. 6 shows the restriction part shown in FIG. FIG. 7 is an explanatory view showing another example of the restriction component used in the electric circuit composite module shown in FIG. 3, and FIG. FIG. 7B is a perspective view showing the configuration, and FIG. 7 (c) and 7 (d) are explanatory diagrams of the regulating operation, and FIG. 8 is a configuration example when the regulating component shown in FIG. 7 is mounted on another wiring board and its regulating operation. FIG.

3 and 4, reference numeral 1 denotes a solid-state imaging device, 2 denotes a wiring board made of a flexible printed circuit board or the like, and the difference from the reference example is that a regulating component 3 described later is provided at a bending position of the wiring board 2. Is a point.

  Hereinafter, the configuration of the restriction component 3 will be described.

In FIG. 5A, 4 is a shape memory alloy, 5 is an adhesive, and the restriction component 3 is constituted by these. The regulatory component 3 mounted on shown in FIG. 5 (b) circuit board 2 as shown in, after fixing with an adhesive 5, the shape memory alloy 4 by applying heat to the entire substrate in FIG. 5 (c) As shown in FIG. 5D, the wiring board 2 can be bent from the state shown in FIG. Therefore, by arranging the regulating component 3 on the bending axis of the substrate, it can be bent at a predetermined angle in an arbitrary direction.

  If this function is applied, for example, the regulating component 3 is mounted at the bending axis position of the wiring board 2 having a shape as shown in FIG. 6A, and then the entire board is heated in an inclined manner as will be described later. Accordingly, the wiring board 2 is first folded in the direction of the arrow X as shown in FIG. 6B, and then folded in the direction of the arrow Y as shown in FIG. 6C. That is, the shape memory alloy 4 is sequentially deformed into an arbitrary shape depending on the temperature at which the deformation starts, and the wiring board 2 can be bent at an arbitrary angle in an arbitrary order. As described above, heat is applied to each shape memory alloy 4 in an inclined manner. However, if the temperature difference between the temperatures at which each shape memory alloy 4 starts to be deformed is set to be successively higher (lower), for example, about 20 ° C. The bending is performed smoothly. In the above description, the number of restriction parts 3 is two, but a plurality of restriction parts 3 may be mounted.

  Various modifications can be conceived as the restriction component 3, but another example will be described with reference to FIGS. 7 and 8.

  In FIG. 7A, 6 is a heat shrinkable layer, which is made of a material that shrinks by heat, preferably nylon or polyolefin. Reference numeral 7 denotes a non-heat-shrinkable layer surrounded by the heat-shrinkable layer 6, preferably ceramics. Ceramics is preferable because it has a low coefficient of thermal expansion and can accurately regulate the bending radius. Reference numeral 8 denotes an adhesive layer. By disposing the mounting position of the restriction component 3 configured in this way on the bending axis, it can be bent at a predetermined angle in an arbitrary direction. That is, as shown in FIG. 7B, after the regulation component 3 is mounted on the wiring board 2 and bonded and fixed by the adhesive layer 8, the regulation component 3 is heated as shown in FIG. 7 (d), the heat-shrinkable layer 6 and the non-heat-shrinkable layer 7 are contracted and expanded by their respective temperatures and deformed to a predetermined angle, whereby the wiring board 2 can be bent. . Therefore, by arranging the mounting position of the restriction component 3 at the bending axis position of the wiring board 2, it can be bent at a predetermined angle in an arbitrary direction.

  If this function is applied, like the one shown in FIG. 5, for example, the regulating component 3 is mounted at the bending axis position of the wiring board 2 having the shape shown in FIG. By applying heat to the wiring board 2, the wiring board 2 is folded in the direction of arrow X as shown in FIG. 8B, and then folded in the direction of arrow Y as shown in FIG. 8C. That is, the heat-shrinkable layer 6 and the non-heat-shrinkable layer 7 shrink and expand at their respective predetermined temperatures, and are deformed into any desired shape by the deformation start temperature based on this, and the wiring board 2 is formed in any order and at any angle Can be folded. If the temperature difference when the heat is applied in an inclined manner is set so as to be successively higher (lower), for example, by about 20 ° C. for each regulating component 3, the bending is performed smoothly. In the above description, the number of restriction parts 3 is two, but a plurality of restriction parts 3 may be mounted.

As described above, according to the present embodiment, in addition to the configuration of the reference example , the solid-state imaging device is oriented in the same direction by mounting the restriction component at a position where the wiring board is bent into a predetermined form. It can be processed very easily into a form with a large degree of freedom, such as a form, a working form facing in the opposite direction, and a working form that becomes thin, and the number of bending processes can be greatly reduced.

  The electric circuit composite module according to the present invention can realize various arrangements and combinations of solid-state image sensors by simply mounting a plurality of solid-state image sensors on one side of a wiring board and bending the wiring board. By mounting the restriction part at the position where the wiring board is bent into a predetermined form, it is possible to greatly reduce the equal folding work process that enables the wiring board to be bent in any order in the heating process after mounting the electronic component. It is useful as an electric circuit composite module such as a wiring board to which a solid-state imaging device is electrically joined.

The perspective view which shows the basic composition of the principal part in the reference example of Embodiment 1 of the electric circuit composite module of this invention. The perspective view which shows each bending process form of the electric circuit composite module shown in FIG. The perspective view which shows the basic composition of the principal part in Embodiment 1 of the electric circuit composite module of this invention. The perspective view which shows the form after the bending process of the electric circuit composite module shown in FIG. Explanatory drawing which shows an example of the control components which control the bending angle etc. which are used for the electric circuit composite module shown in FIG. FIG. 5 is a perspective view showing a configuration example and its regulating operation when the regulating component shown in FIG. 5 is mounted on another wiring board. Explanatory drawing which shows the other example of the control components used for the electric circuit composite module shown in FIG. FIG. 7 is a perspective view showing a configuration example and its regulating operation when the regulating component shown in FIG. 7 is mounted on another wiring board. A perspective view showing an example of a conventional electric circuit composite module

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solid-state image sensor 2 Wiring board 3 Control component 4 Shape memory alloy 5 Adhesive material 6 Heat shrink layer 7 Non heat shrink layer 8 Adhesive layer 9 Electric circuit board

Claims (3)

  At least two or more systems of solid-state imaging devices and their electronic circuit blocks are electrically connected and arranged on a common wiring board at intervals, and the wiring board is configured to be bendable and bonded to the folding shaft. The regulating part that regulates the bending is configured to surround a material having no heat shrinkability by a material having heat shrinkability, and a part of the material having heat shrinkability is provided on the wiring board. An electric circuit composite module characterized in that when the heat-shrinkable material is bonded, the wiring board is bent along with the heat-shrinkable material.   At least two or more systems of solid-state imaging devices and electronic circuit blocks thereof are electrically connected and arranged on a common wiring board at intervals, and the wiring board has at least two foldable portions, and is bent. Restricting parts for restricting the bending of the shaft are joined to the bendable portions, respectively, and the temperature difference at which each of the restricting parts is deformed is set to 20 ° C. or more. module. 3. The electric circuit composite according to claim 2 , wherein the regulating component is a shape memory material that can be deformed into an arbitrary shape at an arbitrary temperature, and the wiring board is bent by the shape deformation caused by heating. module.

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