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JP4302721B2 - Curable organopolysiloxane composition, sealant for flat panel display containing the same, and flat panel display element - Google Patents

Curable organopolysiloxane composition, sealant for flat panel display containing the same, and flat panel display element Download PDF

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JP4302721B2
JP4302721B2 JP2006188847A JP2006188847A JP4302721B2 JP 4302721 B2 JP4302721 B2 JP 4302721B2 JP 2006188847 A JP2006188847 A JP 2006188847A JP 2006188847 A JP2006188847 A JP 2006188847A JP 4302721 B2 JP4302721 B2 JP 4302721B2
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JP2008013719A (en
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宜良 亀田
利之 小材
恒雄 木村
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
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    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

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  • Crystallography & Structural Chemistry (AREA)
  • Sealing Material Composition (AREA)
  • Silicon Polymers (AREA)
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Description

本発明は、室温および紫外線で硬化する硬化性オルガノポリシロキサン組成物に関し、特に、電気・電子部品及びそれらの回路のコーティング剤や、フラットパネルディスプレイ用シール剤の用途に好適な硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子に関する。   TECHNICAL FIELD The present invention relates to a curable organopolysiloxane composition that cures at room temperature and ultraviolet rays, and in particular, a curable organopolysiloxane suitable for use as a coating agent for electric and electronic parts and their circuits, and as a sealant for flat panel displays. The present invention relates to a composition, a sealant for a flat panel display including the composition, and a flat panel display element.

従来から、室温でゴム状弾性体を与える室温硬化性シリコーンゴム組成物(以下、「RTV」という)として種々のものが知られている。RTVから得られる硬化ゴムは、他の有機系ゴムに比較して優れた耐候性、耐久性、耐熱性、耐寒性等を具備することから種々の分野で使用され、特に建築分野において、ガラス同志の接着、金属とガラスとの接着、及びコンクリート目地のシール等の用途に多く用いられている。
また、電気・電子部品用の接着・コーティング剤として、エポキシ樹脂等の被着体に対する接着性等の点から脱アルコールタイプRTVが多用される傾向にある。近年、急速に増産されているフラットパネルディスプレイのシール剤としても、同様に脱アルコールタイプRTVが多用されている。
Conventionally, various types of room temperature curable silicone rubber compositions (hereinafter referred to as “RTV”) that give rubber-like elastic bodies at room temperature are known. Cured rubber obtained from RTV is used in various fields because it has excellent weather resistance, durability, heat resistance, cold resistance, etc. compared to other organic rubbers. It is often used for applications such as bonding of metal, bonding of metal and glass, and sealing of joint joints.
Also, as an adhesive / coating agent for electric / electronic parts, dealcohol-free RTV tends to be frequently used from the viewpoint of adhesion to an adherend such as epoxy resin. Similarly, dealcohol-free type RTV is also frequently used as a sealant for flat panel displays which have been rapidly increased in recent years.

ところで、電気、電子工業の生産ラインのスピード向上に伴い、これらのラインでシール剤等として使用される硬化性組成物について、硬化速度の向上が要求されている。そこで、従来からの縮合型、加熱硬化型、及び白金付加反応型等のシリコーンゴム硬化性組成物に比べ、硬化速度の速い紫外線硬化型のオルガノポリシロキサン組成物が開発されている。例えば、この紫外線硬化型の組成物として、アクリル基含有ポリシロキサンと増感剤とからなる組成物が提案されている(特許文献1参照)。
しかし、この組成物の場合、ゴム状弾性体の硬化物を得るため、ベースポリマーとして高分子量の線状ポリマーを用いる必要がある。このためオルガノポリシロキサンの末端に位置するアクリル基量が相対的に非常に少なくなり、硬化性が低下すると共に、組成物のうち空気と接している表面部分が酸素の硬化阻害によって殆ど硬化しないという欠点がある。従って、この種の光硬化型組成物としては、比較的アクリル基量の多いレジン状のものしか実用化されておらず、得られる硬化物は、引っ張り強さに劣り、また組成物自体も保存性に欠けるという問題があった。
By the way, with improvement in the speed of production lines in the electric and electronic industries, improvement in the curing rate is required for curable compositions used as sealing agents and the like in these lines. Therefore, an ultraviolet curable organopolysiloxane composition having a faster curing speed has been developed as compared with conventional silicone rubber curable compositions such as condensation type, heat curable type, and platinum addition reaction type. For example, as this ultraviolet curable composition, a composition comprising an acrylic group-containing polysiloxane and a sensitizer has been proposed (see Patent Document 1).
However, in the case of this composition, in order to obtain a cured product of a rubber-like elastic body, it is necessary to use a high molecular weight linear polymer as a base polymer. For this reason, the amount of acrylic groups located at the end of the organopolysiloxane is relatively very small, the curability is lowered, and the surface portion in contact with air in the composition is hardly cured due to inhibition of oxygen curing. There are drawbacks. Therefore, only a resin-like composition having a relatively large amount of acrylic groups has been put to practical use as this type of photocurable composition, and the resulting cured product is inferior in tensile strength and also preserves the composition itself. There was a problem of lack of sex.

この欠点を改善するため、本発明者等は先に、アルコキシ−α−シリルエステルという新規な化合物を、(メタ)アクリル官能性アルコキシシラン、2価の錫系化合物、光重合開始剤、及び硬化触媒と組合せた組成物を提案している(特許文献2参照)。   In order to remedy this drawback, the present inventors have first developed a novel compound called an alkoxy-α-silyl ester, a (meth) acryl-functional alkoxysilane, a divalent tin-based compound, a photopolymerization initiator, and curing. A composition combined with a catalyst has been proposed (see Patent Document 2).

特公昭53−36515号公報Japanese Patent Publication No.53-36515 特許第2639286号公報Japanese Patent No. 2639286

しかしながら、特許文献2記載の組成物の場合、実用可能なシリコーン弾性体を硬化物として与えるという利点はあるが、この硬化物のガラスや金属への密着性が不充分であるという問題があり、各種の接着用途やシール用途に適しているとはいえないことが判明した。
一方、近年、フラットパネルディスプレイパネルのガラス基板上の電極と該電極上に接続されるフィルム回路とを含む領域のシールにおいては、完成したパネルの修理や補修のため、シールに用いた硬化物をパネル基材から除去する必要があり、この際、基材表面から硬化物が界面剥離でき、表面に残存しないことが求められる。
しかしながら、従来の技術において、基材表面から界面剥離して表面に残存しない硬化物は開発されていない。例えば、特許文献2記載の組成物のガラスや金属への密着性を改善するため、アミノ基又はアクリル基を有する有機ケイ素化合物を添加することが想定されるが、このようにすると、組成物が基材に接着され、剥離時に基材表面に硬化物が残存する。
However, in the case of the composition described in Patent Document 2, there is an advantage of providing a practical silicone elastic body as a cured product, but there is a problem that the adhesion of the cured product to glass or metal is insufficient, It has been found that it is not suitable for various adhesive applications and seal applications.
On the other hand, in recent years, in the seal of the area including the electrode on the glass substrate of the flat panel display panel and the film circuit connected to the electrode, the cured product used for the seal is used for repair and repair of the completed panel. It is necessary to remove from the panel substrate, and at this time, it is required that the cured product can be peeled off from the substrate surface and does not remain on the surface.
However, in the prior art, a cured product that does not leave the surface after interfacial peeling from the substrate surface has not been developed. For example, in order to improve the adhesion of the composition described in Patent Document 2 to glass or metal, it is assumed that an organosilicon compound having an amino group or an acrylic group is added. It adheres to the base material, and the cured product remains on the base material surface at the time of peeling.

従って本発明の目的は、室温及び紫外線照射下で硬化し、保存安定性が良好であり、ガラス、金属、プラスチックなどに対して優れた密着性及び離型性を有する硬化物を形成し得る硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びラットパネルディスプレイ素子を提供することにある。   Therefore, an object of the present invention is to cure at room temperature and under ultraviolet irradiation, have good storage stability, and can form a cured product having excellent adhesion and releasability to glass, metal, plastic and the like. An organopolysiloxane composition, a flat panel display sealant containing the composition, and a rat panel display element.

すなわち、上記の目的を達成するために、本発明の硬化性オルガノポリシロキサン組成物は、(A)下記(I)成分100質量部と(II)成分1〜200質量部との縮合反応生成物であるオルガノポリシロキサン100質量部、但し、(I)成分は、RSiO1/2単位(式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜6の1価炭化水素基を表わす)及びSiO4/2単位を繰り返し単位とし、Si04/2単位1モルに対するRSiO1/2単位の割合が0.5〜1.2モルであり、更に、Si04/2単位1モルに対し、RSiO2/2単位及びRSiO3/2単位(各式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜6の1価炭化水素基を表わす)のうち少なくとも1つを各単位がそれぞれ1.0モル以下で各単位の合計が1.0モル以下となるように有していてもよく、かつケイ素原子に結合したヒドロキシ基を0.1質量%以上6.0質量%未満有するオルガノポリシロキサンであり、(II)成分は、ヒドロキシ基、アルコキシ基、アルコキシアルコキシ基、アルケニルオキシ基、ケトオキシム基、アシロキシ基、及びアミノキシ基群から選ばれる官能基含有シリル基で分子鎖末端が封鎖されたジオルガノポリシロキサンであり、(B)下記一般式(1)
(式中、Rは水素原子又はメチル基、Rはアルキレン基、R及びRはそれぞれ同一又は異なる非置換の一価炭化水素基、aは0〜2の整数である)で示される(メタ)アクリル官能性アルコキシシラン1〜50質量部、(C)縮合反応用触媒0.01〜10質量部、及び(D)光開始剤 0.01〜10質量部を含む。
That is, in order to achieve the above-mentioned object, the curable organopolysiloxane composition of the present invention comprises a condensation reaction product of (A) 100 parts by mass of the following (I) component and (II) 1 to 200 parts by mass of the component. 100 parts by mass of the organopolysiloxane, wherein the component (I) is an R 3 SiO 1/2 unit (wherein each R is independently an unsubstituted or halogen atom-substituted monovalent carbon atom having 1 to 6 carbon atoms) And a SiO 4/2 unit as a repeating unit, and the ratio of R 3 SiO 1/2 unit to 1 mol of SiO 4/2 unit is 0.5 to 1.2 mol, and SiO 4 / 2 units per mole of R 2 SiO 2/2 units and RSiO 3/2 units (wherein each R is independently an unsubstituted or halogen atom-substituted monovalent hydrocarbon group having 1 to 6 carbon atoms) At least one of Each unit may have 1.0 mol or less and the total of each unit may be 1.0 mol or less, and the hydroxy group bonded to the silicon atom is 0.1% by mass or more and 6.0% by mass. (II) component is a functional group-containing silyl group selected from the group consisting of a hydroxy group, an alkoxy group, an alkoxyalkoxy group, an alkenyloxy group, a ketoxime group, an acyloxy group, and an aminoxy group. It is a diorganopolysiloxane whose chain ends are blocked, and (B) the following general formula (1)
Wherein R 1 is a hydrogen atom or a methyl group, R 2 is an alkylene group, R 3 and R 4 are the same or different unsubstituted monovalent hydrocarbon groups, and a is an integer of 0-2. 1 to 50 parts by mass of (meth) acryl-functional alkoxysilane, (C) 0.01 to 10 parts by mass of a catalyst for condensation reaction, and (D) 0.01 to 10 parts by mass of a photoinitiator.

前記(II)成分が下記一般式(2)
(式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜10の1価炭化水素基、Xはヒドロキシ基、アルコキシ基、アルコキシアルコキシ基、アルケニルオキシ基、ケトオキシム基、アシロキシ基、及びアミノキシ基群から選ばれるそれぞれ独立の官能基、aは1〜3の整数、nは10以上の整数である)で表わされるジオルガノポリシロキサンであることが好ましい。
The component (II) is represented by the following general formula (2)
(Wherein R 5 is each independently an unsubstituted or halogen atom-substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, X is a hydroxy group, an alkoxy group, an alkoxyalkoxy group, an alkenyloxy group, a ketoxime group, an acyloxy group) groups, and each independently functional groups selected from the group consisting of an aminoxy group, a is an integer of 1 to 3, n represents preferably a diorganopolysiloxane represented by 10 or more is an integer).

本発明のフラットパネルディスプレイ用シール剤は、前記硬化性オルガノポリシロキサン組成物を含む。   The sealing agent for flat panel displays of this invention contains the said curable organopolysiloxane composition.

本発明のフラットパネルディスプレイ素子は、前記フラットパネルディスプレイ用シール剤を、該ディスプレイのガラス基板上の電極と該電極上に接続されるフィルム回路とを含む領域のシールに用いたものである。   The flat panel display element of this invention uses the said sealing agent for flat panel displays for the sealing of the area | region containing the electrode on the glass substrate of this display, and the film circuit connected on this electrode.

本発明によれば、室温及び紫外線照射下で硬化し、保存安定性が良好であり、ガラス、金属、プラスチックなどに対して優れた密着性及び離型性を有する硬化物を形成し得る硬化性オルガノポリシロキサン組成物が得られる。本発明は、特に、電気・電子部品乃至回路のコーティング剤、フラットパネル用シール剤に好適である。   According to the present invention, it is cured at room temperature and under ultraviolet irradiation, has excellent storage stability, and can form a cured product having excellent adhesion and releasability to glass, metal, plastic and the like. An organopolysiloxane composition is obtained. The present invention is particularly suitable for coating agents for electric / electronic parts or circuits, and sealing agents for flat panels.

以下、本発明の実施形態に係る撥水剤組成物について説明する。本発明の撥水剤組成物は、以下の(A)〜(D)成分を必須として含む。   Hereinafter, the water repellent composition according to the embodiment of the present invention will be described. The water repellent composition of the present invention contains the following components (A) to (D) as essential components.

[(A)成分]
(A)成分は、被着体への密着性や硬化物の強度を向上させ、下記(I)成分100質量部と(II)成分1〜200質量部との縮合反応生成物であるオルガノポリシロキサンからなる。
(I)成分は、RSiO1/2単位(式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜6の1価炭化水素基を表わす)及びSiO4/2単位を繰り返し単位とする。
Rとしては、例えば、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソ−ブチル基、tert−ブチル基、ペンチル基、ヘキシル基等のアルキル基;シクロペンチル基、シクロヘキシル基等のシクロアルキル基;ビニル基、アリル基、イソプロペニル基、ブテニル基、ペンテニル基、ヘキセニル基等のアルケニル基;フェニル基等のアリール基;クロロメチル基、3−クロロプロピル基、1−クロロ−2−メチルプロピル基、3,3,3−トリフルオロプロピル基等のハロゲン化アルキル基等が挙げられ、特にメチル基、ビニル基、フェニル基が好ましく、メチル基が最も好ましい。Rはそれぞれ別の基でもよく、同一の基でもよい。
[(A) component]
The component (A) improves the adhesion to the adherend and the strength of the cured product, and is an organopolyester that is a condensation reaction product of 100 parts by mass of the following component (I) and 1 to 200 parts by mass of the component (II). Made of siloxane.
Component (I) consists of R 3 SiO 1/2 units (wherein R represents each independently an unsubstituted or halogen atom- substituted monovalent hydrocarbon group having 1 to 6 carbon atoms) and SiO 4/2 units. Is a repeating unit.
R is, for example, an alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an iso-butyl group, a tert-butyl group, a pentyl group, a hexyl group; a cyclopentyl group, a cyclohexyl group A cycloalkyl group such as a vinyl group, an allyl group, an isopropenyl group, a butenyl group, a pentenyl group and a hexenyl group; an aryl group such as a phenyl group; a chloromethyl group, a 3-chloropropyl group, and a 1-chloro- Examples thereof include halogenated alkyl groups such as 2-methylpropyl group and 3,3,3-trifluoropropyl group. Particularly, methyl group, vinyl group and phenyl group are preferable, and methyl group is most preferable. Each R may be a different group or the same group.

(I)成分中のSi04/2単位1モルに対するRSiO1/2単位の割合は0.5〜1.2モルであることが必要であり、好ましくは0.65〜1.15モルの範囲である。RSiO1/2単位の割合が0.6モル未満であると、得られた硬化物の強度が不充分となり、1.2モルを超えると硬化物の透明性に劣ったものとなる。硬化物の透明性が劣ると、UV光が硬化物の深部まで到達し難くなり、深部硬化性が低下する。 The ratio of R 3 SiO 1/2 units to 1 mol of SiO 4/2 units in component (I) must be 0.5 to 1.2 mol, preferably 0.65 to 1.15 mol. Range. When the ratio of R 3 SiO 1/2 units is less than 0.6 mol, the strength of the obtained cured product is insufficient, and when it exceeds 1.2 mol, the transparency of the cured product is inferior. If the transparency of the cured product is inferior, it becomes difficult for UV light to reach the deep part of the cured product, and the deep part curability is lowered.

更に、(I)成分において、Si04/2単位1モルに対し、RSiO2/2単位及びRSiO3/2単位(各式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜6の1価炭化水素基を表わす)のうち少なくとも1つを各単位がそれぞれ1.0モル以下で各単位の合計が1.0モル以下となるように有していてもよい。さらに好ましくは、RSiO2/2単位及びRSiO3/2単位の各単位が0.2〜0.8モルで各単位の合計が1.0モル以下とする。
このような配合割合としては、Si04/2単位1モルに対し、RSiO2/2単位0.2モルとRSiO3/2単位0.7モルの組合せが例示される。
Furthermore, in the component (I), R 2 SiO 2/2 unit and RSiO 3/2 unit (wherein R is independently an unsubstituted or halogen atom- substituted carbon atom with respect to 1 mol of SiO 4/2 unit) At least one of each unit may be 1.0 mol or less, and the total of each unit may be 1.0 mol or less. More preferably, the R 2 SiO 2/2 unit and the RSiO 3/2 unit are 0.2 to 0.8 mol, and the total of the units is 1.0 mol or less.
As such a blending ratio, a combination of 0.2 mol of R 2 SiO 2/2 units and 0.7 mol of RSiO 3/2 units is exemplified with respect to 1 mol of SiO 4/2 units.

(I)成分において、RSiO2/2単位とRSiO3/2単位の少なくとも一方が含有されていないと、組成物が樹脂となって、硬化前に溶液状とならずに作業性が低下する傾向にある。一方、RSiO2/2単位とRSiO3/2単位の各単位の含有量が1.0モルを超えるか、又は各単位の合計量が1.0モルを超えると、組成物の透明性が劣る傾向にある。 In the component (I), when at least one of the R 2 SiO 2/2 unit and the RSiO 3/2 unit is not contained, the composition becomes a resin, and the workability is lowered without becoming a solution before curing. Tend to. On the other hand, when the content of each unit of R 2 SiO 2/2 unit and RSiO 3/2 unit exceeds 1.0 mol, or the total amount of each unit exceeds 1.0 mol, the transparency of the composition Tend to be inferior.

(I)成分において、上記各単位のケイ素原子に結合したヒドロキシ基を1.0質量%以上6.0質量%未満有する。ヒドロキシ基は、上記(I)成分を共加水分解・縮合反応により調製する際に生成されてケイ素原子に結合する。ヒドロキシ基は、(I)成分と以下の(II)成分との縮合反応のために必要であり、その下限は0.1重量%以上である。好ましくは、ヒドロキシ基の含有量は0.2〜3.0重量%である。ヒドロキシ基の含有量が6.0重量%以上であると、得られた硬化物の硬度が高くなりすぎて、密着性が低下する。また、含有量が0.1重量%未満であると、得られた硬化物の強度が不充分となる場合がある。 In the component (I), the hydroxy group bonded to the silicon atom of each unit is 1.0% by mass or more and less than 6.0% by mass. The hydroxy group is generated when the component (I) is prepared by a cohydrolysis / condensation reaction and bonded to a silicon atom. The hydroxy group is necessary for the condensation reaction between the component (I) and the following component (II), and the lower limit is 0.1% by weight or more . Preferably, the hydroxy group content is 0.2 to 3.0% by weight. When the content of the hydroxy group is 6.0% by weight or more, the hardness of the obtained cured product becomes too high and the adhesiveness is lowered. On the other hand, if the content is less than 0.1% by weight, the strength of the obtained cured product may be insufficient.

(I)成分は公知の方法により得ることができ、例えば、上記各単位に対応するアルコキシ基含有シラン化合物を有機溶媒中で共加水分解し縮合させて、実質的に揮発性分を含まないものとして得ることができる。
(I)成分を得るための具体的な方法としては、例えば、RSiOMeとSi(OMe)とを、所望によりRSi(OMe)及び/又はRSi(OMe)とともに、有機溶媒中で共加水分解し縮合させればよい(各式中、Rはそれぞれ独立に非置換又は置換の炭素原子数1〜6の1価炭化水素基を表わし、Meはメチル基を表わす)。
上記有機溶媒としては、共加水分解・縮合反応により生成するオルガノポリシロキサンを溶解することのできるものが好ましく、典型的にはトルエン、キシレン、塩化メチレン、ナフサミネラルスピリット等を挙げることができる。また、上記有機溶媒を使用せず、その代わりに、以下の(II)成分であって23℃における粘度が20〜2,000mm/sであるジオルガノポリシロキサンを用いてもよい。
The component (I) can be obtained by a known method. For example, the component (I) is substantially free of volatile components by co-hydrolyzing and condensing an alkoxy group-containing silane compound corresponding to each unit in an organic solvent. Can be obtained as
As a specific method for obtaining the component (I), for example, R 3 SiOMe and Si (OMe) 4 are optionally combined with R 2 Si (OMe) 2 and / or RSi (OMe) 3 as an organic solvent. It is only necessary to co-hydrolyze and condense therein (in each formula, R independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 6 carbon atoms, and Me represents a methyl group).
As said organic solvent, what can melt | dissolve the organopolysiloxane produced | generated by cohydrolysis and a condensation reaction is preferable, and toluene, xylene, a methylene chloride, a naphtha mineral spirit etc. can be mentioned typically. Instead of using the organic solvent, diorganopolysiloxane having the following component (II) and having a viscosity at 23 ° C. of 20 to 2,000 mm 2 / s may be used instead.

(I)成分に係る各単位の含有モル比については、例えば、各単位に対応するメトキシシラン化合物の仕込みモル比を調整することによって適宜設定することができる。
又、(I)成分における上記ヒドロキシ基の含有量は、共加水分解・縮合反応の条件を調整することにより変化させることができる。
About the content molar ratio of each unit which concerns on (I) component, it can set suitably by adjusting the preparation molar ratio of the methoxysilane compound corresponding to each unit, for example.
Moreover, content of the said hydroxy group in (I) component can be changed by adjusting the conditions of cohydrolysis and a condensation reaction.

(II)成分は、ヒドロキシ基、アルコキシ基、アルコキシアルコキシ基、アルケニルオキシ基、ケトオキシム基、アシロキシ基、及びアミノキシ基群から選ばれる官能基含有シリル基で分子鎖末端が封鎖されたジオルガノポリシロキサンであり、(II)成分は(I)成分と縮合反応する。
上記官能基としては、上記(I)成分のケイ素原子に結合したヒドロキシ基と縮合反応するものであれば、特に制限されないが、例えば、ヒドロキシ基;およびメトキシ基、エトキシ基、プロポキシ基、ブトキシ基等のアルコキシ基;メトキシエトキシ基、エトキシエトキシ基、メトキシプロポキシ基等のアルコキシアルコキシ基;ビニロキシ基、イソプロペニルオキシ基、イソブテニルオキシ基等のアルケニルオキシ基;ジメチルケトオキシム基、メチルエチルケトオキシム基、ジエチルケトオキシム基、シクロヘキサノキシム等のケトオキシム基;アセトキシ基、プロピオニルオキシ基、ブチリルオキシ基、オクタノイルオキシ基、ベンゾイルオキシ基等のアシロキシ基;N,N−ジメチルアミノキシ基、N,N−ジエチルアミノキシ基等のアミノキシ基の加水分解性基が挙げられ、好ましくはヒドロキシ基、アルコキシ基であり、特に好ましくはヒドロキシ基である。
The component (II) is a diorganopoly having a molecular chain end blocked with a functional group-containing silyl group selected from the group consisting of a hydroxy group, an alkoxy group, an alkoxyalkoxy group, an alkenyloxy group, a ketoxime group, an acyloxy group, and an aminoxy group. Siloxane, and the component (II) undergoes a condensation reaction with the component (I).
The functional group is not particularly limited as long as it undergoes a condensation reaction with the hydroxy group bonded to the silicon atom of the component (I). For example, a hydroxy group; and a methoxy group, an ethoxy group, a propoxy group, a butoxy group Alkoxy groups such as methoxyethoxy group, ethoxyethoxy group and methoxypropoxy group; alkenyloxy groups such as vinyloxy group, isopropenyloxy group and isobutenyloxy group; dimethyl ketoxime group, methylethyl ketoxime group, Ketooxime groups such as diethyl ketoxime group and cyclohexanoxime; Acyloxy groups such as acetoxy group, propionyloxy group, butyryloxy group, octanoyloxy group, benzoyloxy group; N, N-dimethylaminoxy group, N, N-diethylamino Xyl group It includes hydrolyzable groups such as aminoxy groups are preferably hydroxy group, an alkoxy group, particularly preferably a hydroxy group.

(II)成分が下記一般式(2)
(式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜10の1価炭化水素基、Xはヒドロキシ基、アルコキシ基、アルコキシアルコキシ基、アルケニルオキシ基、ケトオキシム基、アシロキシ基、及びアミノキシ基群から選ばれるそれぞれ独立の官能基、aは1〜3の整数、nは10以上の整数である)で表わされるジオルガノポリシロキサンであることが好ましい。
としては、例えば、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソ−ブチル基、tert−ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基等のアルキル基;シクロペンチル基、シクロヘキシル基等のシクロアルキル基;ビニル基、アリル基、イソプロペニル基、ブテニル基、ペンテニル基、ヘキセニル基等のアルケニル基;フェニル基、トリル基、キシリル基、ナフチル基等のアリール基;ベンジル基、フェネチル基、フェニルプロピル基等のアラルキル基;クロロメチル基、3−クロロプロピル基、1−クロロ−2−メチルプロピル基、3,3,3−トリフルオロプロピル基等のハロゲン化アルキル基等が挙げられ、これらの中でもメチル基が好ましい。
Xとしては、例えば上記した官能基を用いることができる。

(II) component is the following general formula (2)
(Wherein R 5 is each independently an unsubstituted or halogen atom-substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, X is a hydroxy group, an alkoxy group, an alkoxyalkoxy group, an alkenyloxy group, a ketoxime group, an acyloxy group) groups, and each independently functional groups selected from the group consisting of an aminoxy group, a is an integer of 1 to 3, n represents preferably a diorganopolysiloxane represented by 10 or more is an integer).
As R 5 , for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, iso-butyl group, tert-butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group Alkyl groups such as decyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group; alkenyl groups such as vinyl group, allyl group, isopropenyl group, butenyl group, pentenyl group and hexenyl group; phenyl group, tolyl group and xylyl group Aryl groups such as naphthyl group; aralkyl groups such as benzyl group, phenethyl group and phenylpropyl group; chloromethyl group, 3-chloropropyl group, 1-chloro-2-methylpropyl group, 3,3,3-trifluoro Examples include halogenated alkyl groups such as propyl group, and among these, methyl group is preferable.
As X, for example, the functional groups described above can be used.

式(2)中のnは10以上の整数であるが、上記ジオルガノポリシロキサン((II)成分)の23℃における粘度が300,000mm/s以下、好ましくは100〜100,000mm/sの範囲の流体となるような数であることが好ましい。 N in the formula (2) is an integer of 10 or more, but the viscosity of the diorganopolysiloxane (component (II)) at 23 ° C. is 300,000 mm 2 / s or less, preferably 100 to 100,000 mm 2 / The number is preferably such that the fluid is in the range of s.

上記一般式(2)で表されるジオルガノポリシロキサンの具体例としては、例えば、分子鎖両末端シラノール基封鎖ポリジメチルシロキサン、分子鎖両末端シラノール基封鎖ジメチルシロキサン・メチルフェニルシロキサン共重合体、分子鎖両末端トリメトキシシロキシ基封鎖ポリジメチルシロキサン、分子鎖両末端トリメトキシシロキシ基封鎖ジメチルシロキサン・メチルフェニルシロキサン共重合体、分子鎖両末端メチルジメトキシシロキシ基封鎖ポリジメチルシロキサン、分子鎖両末端トリエトキシシロキシ基封鎖ポリジメチルシロキサン等が挙げられる。これらは1種単独でも2種以上組み合わせて使用することもできる。   Specific examples of the diorganopolysiloxane represented by the general formula (2) include, for example, molecular chain both-end silanol group-blocked polydimethylsiloxane, molecular chain both-end silanol group-blocked dimethylsiloxane / methylphenylsiloxane copolymer, Molecular chain both ends trimethoxysiloxy group-blocked polydimethylsiloxane, Molecular chain both ends trimethoxysiloxy group-blocked dimethylsiloxane / methylphenylsiloxane copolymer, Molecular chain both ends methyldimethoxysiloxy group-blocked polydimethylsiloxane, Molecular chain both ends tri Examples thereof include ethoxysiloxy group-blocked polydimethylsiloxane. These can be used alone or in combination of two or more.

<(I)成分と(II)成分との縮合反応>
(A)成分は、(I)成分100質量部に対し、(II)成分を1〜200質量部、好ましくは(II)成分を5〜150質量部、特に好ましくは(II)成分を70〜120質量部配合し、縮合反応させることにより得ることができる。(II)成分の配合量が1質量部未満である場合、及び200質量部を超えた場合、得られた硬化物の密着性が損なわれる。
なお、上記したように、(I)成分を製造する際に有機溶媒を用いる代わりに上記(II)成分を用いた場合、(I)成分と(II)成分との縮合反応もその時に終了する。従って、この場合、(I)成分製造時の(II)成分の配合量が上記した範囲にあれば、製造後の(I)成分に別の(II)成分を加える必要はない。
<Condensation reaction between component (I) and component (II)>
(A) component is 1-200 mass parts of (II) component with respect to 100 mass parts of (I) component, Preferably 5-II-150 mass parts of (II) component, Most preferably, (II) component is 70- It can be obtained by blending 120 parts by mass and causing a condensation reaction. (II) When the compounding quantity of a component is less than 1 mass part, and when it exceeds 200 mass parts, the adhesiveness of the obtained hardened | cured material will be impaired.
As described above, when the component (II) is used instead of the organic solvent when the component (I) is produced, the condensation reaction between the component (I) and the component (II) is also terminated at that time. . Therefore, in this case, it is not necessary to add another component (II) to the component (I) after production as long as the blending amount of the component (II) at the time of manufacturing the component (I) is within the above range.

(I)成分と(II)成分との縮合反応においては、縮合反応触媒を用いることが好ましい。縮合反応触媒としては、チタン化合物、錫化合物、アミン化合物、アルカリ金属化合物等が挙げられるが、アミン化合物を用いることが好ましい。アミン化合物として具体的には、エチルアミン、プロピルアミン、イソプロピルアミン、ブチルアミン、ジエチルアミン、ジブチルアミン、トリエチルアミン、アンモニア水等が例示される。
縮合反応触媒の配合量は、触媒としての有効量とすればよく、特に制限されないが、(I)成分と(II)成分の合計100質量部に対して、通常、0.05〜3.0質量部程度とすればよい。
In the condensation reaction between component (I) and component (II), it is preferable to use a condensation reaction catalyst. Examples of the condensation reaction catalyst include titanium compounds, tin compounds, amine compounds, alkali metal compounds, and the like, but it is preferable to use amine compounds. Specific examples of the amine compound include ethylamine, propylamine, isopropylamine, butylamine, diethylamine, dibutylamine, triethylamine, and aqueous ammonia.
The blending amount of the condensation reaction catalyst may be an effective amount as a catalyst and is not particularly limited, but is usually 0.05 to 3.0 with respect to 100 parts by mass of the total of the components (I) and (II). What is necessary is just about a mass part.

縮合反応温度は、特に限定されるものではないが、通常、1〜120℃、好ましくは10〜80℃の範囲とすればよい。反応時間も特に限定されないが、0.5〜12時間程度である。
縮合反応終了後は、必要に応じて、溶媒及び/または未反応のオルガノポリシロキサン、ジオルガノポリシロキサン、縮合反応触媒等を留去しても差し支えない。更に、縮合反応生成物の粘度を調整するために、末端がトリメチルシロキシ基やビニル基等で封鎖されたオルガノポリシロキサン又はオクタメチルシクロテトラシロキサン等の低分子環状シロキサン;脂肪族炭化水素;芳香族炭化水素;流動パラフィン;イソパラフィン;アクリル酸エステル等の光反応性希釈剤等を添加してもよい。このような粘度調整成分としては、23℃における粘度が5〜1,000mm/s程度のものを使用することが有効である。
The condensation reaction temperature is not particularly limited, but is usually 1 to 120 ° C, preferably 10 to 80 ° C. The reaction time is not particularly limited, but is about 0.5 to 12 hours.
After completion of the condensation reaction, the solvent and / or unreacted organopolysiloxane, diorganopolysiloxane, condensation reaction catalyst, etc. may be distilled off as necessary. Furthermore, in order to adjust the viscosity of the condensation reaction product, a low molecular cyclic siloxane such as an organopolysiloxane or an octamethylcyclotetrasiloxane whose end is blocked with a trimethylsiloxy group or a vinyl group; an aliphatic hydrocarbon; an aromatic Hydrocarbon; liquid paraffin; isoparaffin; a photoreactive diluent such as an acrylate ester may be added. As such a viscosity adjusting component, it is effective to use a component having a viscosity at 23 ° C. of about 5 to 1,000 mm 2 / s.

[(B)成分]
(B)成分は、本発明の組成物に紫外線硬化性を付与するものであり、例えば縮合反応によりベースとなるオルガノポリシロキサン中に組み込まれ、安定した紫外線硬化性を与える。
(B)成分は、下記一般式(1)
(式中、Rは水素原子又はメチル基、Rアルキレン基、R及びRはそれぞれ同一又は異なる非置換一価炭化水素基、aは0〜2の整数である)で示される(メタ)アクリル官能性アルコキシシランである。
[Component (B)]
The component (B) imparts ultraviolet curability to the composition of the present invention, and is incorporated into the base organopolysiloxane by, for example, a condensation reaction to give stable ultraviolet curability.
The component (B) has the following general formula (1)
Shown (wherein, R 1 represents a hydrogen atom or a methyl group, R 2 is an alkylene group, R 3 and R 4 are the same or different unsubstituted monovalent hydrocarbon radical, a is an integer of 0 to 2) in (Meth) acrylic functional alkoxysilane.

としては、例えばアルキレン基を例示することができ、特に炭素原子数1〜6のアルキレン基が好適である。またR及びRの具体例としては、メチル基、エチル基、プロピル基、ブチル基等のアルキル基;フェニル基等のアリール基を挙げることができ、これらの基のうち炭素原子数が1〜8のものが好適である。又、Rは必須の基ではない。
(B)成分の具体的な例としては、以下の各式
で示される化合物を例示することができるが、これに限定されるものではない。
なお、(B)成分は式(1)に該当するものであれば、1種単独でも2種以上を組み合わせて使用してもよい。
Examples of R 2 include an alkylene group, and an alkylene group having 1 to 6 carbon atoms is particularly preferable. Specific examples of R 3 and R 4 include alkyl groups such as methyl group, ethyl group, propyl group, and butyl group; aryl groups such as phenyl group. Among these groups, the number of carbon atoms is 1 ~ 8 are preferred. R 3 is not an essential group.
Specific examples of the component (B) include the following formulas:
The compound shown by can be illustrated, However, It is not limited to this.
In addition, as long as a component (B) corresponds to Formula (1), you may use it individually by 1 type or in combination of 2 or more types.

本発明の組成物における(B)成分の配合割合は、(A)成分100質量部当たり、1〜50質量部とし、5〜30質量部とすることが望ましい。(B)成分の配合割合が1質量部未満であると組成物の紫外線硬化性が低下し、50質量部を超えると(B)成分のみ硬化し、密着性が損なわれる等の不都合を生じる。   The blending ratio of the component (B) in the composition of the present invention is 1 to 50 parts by mass and preferably 5 to 30 parts by mass per 100 parts by mass of the component (A). When the blending ratio of the component (B) is less than 1 part by mass, the ultraviolet curability of the composition is lowered, and when it exceeds 50 parts by mass, only the component (B) is cured, resulting in inconvenience such as impaired adhesion.

[(C)成分]
(C)成分は、(A)成分のシラノールと(B)成分のアルコキシ基との縮合反応を選択的に進行させる縮合反応用触媒である。
(C)成分としては、有機錫エステル化合物、有機錫キレート化合物、アルコキシチタン化合物、チタンキレート化合物、有機アルミニウム化合物、有機ジルコニウム化合物、グアニジル基を有するケイ素化合物、アミン化合物などの公知の触媒が挙げられる。
(C)成分の具体的な例としては、錫オクトエート、ジメチル錫ジバーサテート、ジメチル錫ジオクトエート、ジブチル錫ジオクトエート、ジブチル錫ジラウレート、ジオクチル錫ジオクトエート、ジオクチル錫ジラウレートテトラブチルチタネート、テトライソプロピルチタネート、ジイソプロポキシキシビス(アセチルアセトナート)チタン、ジイソプロポキシビス(エチルアセトアセテート)チタン、アルミニウムトリス(アセチルアセトナート)、アルミニウムトリス(エチルアセトアセテート)、ジルコニウムテトラ(アセチルアセトナート)、ジルコニウムテトラブチレート、ヘキシルアミン、燐酸ドデシルアミン、テトラメチルグアニジンプロピルトリメトキシシランを例示することができるが、これに限定されるものではない。
なお、(C)成分は1種単独でも2種以上を組み合わせて使用してもよい。
[Component (C)]
The component (C) is a condensation reaction catalyst that selectively advances the condensation reaction between the silanol of the component (A) and the alkoxy group of the component (B).
Examples of the component (C) include known catalysts such as organotin ester compounds, organotin chelate compounds, alkoxy titanium compounds, titanium chelate compounds, organoaluminum compounds, organozirconium compounds, silicon compounds having a guanidyl group, and amine compounds. .
Specific examples of the component (C) include tin octoate, dimethyltin diversate, dimethyltin dioctoate, dibutyltin dioctoate, dibutyltin dilaurate, dioctyltin dioctoate, dioctyltin dilaurate tetrabutyltitanate, tetraisopropyl titanate, diisopropoxyxoxy Bis (acetylacetonate) titanium, diisopropoxybis (ethylacetoacetate) titanium, aluminum tris (acetylacetonate), aluminum tris (ethylacetoacetate), zirconium tetra (acetylacetonate), zirconium tetrabutyrate, hexylamine Examples thereof include, but are not limited to, dodecylamine phosphate and tetramethylguanidinepropyltrimethoxysilane. .
In addition, (C) component may be used individually by 1 type or in combination of 2 or more types.

本発明の組成物における(C)成分の配合割合は、(A)成分100質量部当たり、0.01〜10質量部とし、好ましくは0.1〜5質量部である。(C)成分の配合割合が0.01質量部未満であると、触媒としての能力が十分に発揮されず、10質量部を超えると、組成物の保存安定性が悪くなる等の不都合を生じる。   The blending ratio of the component (C) in the composition of the present invention is 0.01 to 10 parts by mass, preferably 0.1 to 5 parts by mass, per 100 parts by mass of the component (A). When the blending ratio of the component (C) is less than 0.01 parts by mass, the ability as a catalyst is not sufficiently exhibited, and when it exceeds 10 parts by mass, the storage stability of the composition is deteriorated. .

[(D)成分]
(D)成分は、組成物を紫外線硬化させるために必要な光開始剤である。(D)成分としては、例えば、ベンゾイン及びその誘導体、ベンゾインアクリルエーテル等のベンゾインエーテル類、ベンジル及びその誘導体、芳香族ジアゾニウム塩、アントラキノン及びその誘導体、アセトフェノン及びその誘導体、ジフェニルジスルフィド等の硫黄化合物、ベンゾフェノン及びその誘導体が挙げられるが、これらに限定されるものではない。
なお、(C)成分は1種単独でも2種以上を組み合わせて使用してもよい。
本発明の組成物における(D)成分の配合割合は、(A)成分100質量部当たり、0.01〜10質量部とし、好ましくは0.1〜5質量部である。(D)成分の配合割合が0.01質量部未満であると、光開始剤としての能力が十分に発揮されず、10質量部を超えると、組成物の密着性が低下する等の不都合を生じる。
[(D) component]
(D) A component is a photoinitiator required in order to make an ultraviolet cure of a composition. Examples of the component (D) include benzoin and its derivatives, benzoin ethers such as benzoin acrylic ether, benzyl and its derivatives, aromatic diazonium salts, anthraquinone and its derivatives, acetophenone and its derivatives, sulfur compounds such as diphenyl disulfide, Examples include, but are not limited to, benzophenone and its derivatives.
In addition, (C) component may be used individually by 1 type or in combination of 2 or more types.
The blending ratio of the component (D) in the composition of the present invention is 0.01 to 10 parts by mass, preferably 0.1 to 5 parts by mass, per 100 parts by mass of the component (A). When the blending ratio of the component (D) is less than 0.01 parts by mass, the ability as a photoinitiator is not sufficiently exhibited, and when it exceeds 10 parts by mass, the adhesiveness of the composition is lowered. Arise.

[その他の成分]
本発明の組成物には、上記(A)〜(D)成分以外に、必要に応じ、一般に公知の充填剤、添加剤等を配合してもよい。充填剤としては、粉砕シリカ、煙霧状シリカ、炭酸カルシウム、炭酸亜鉛、湿式シリカなどが挙げられる。その他、ポリエーテル類等のチクソ性向上剤、防かび剤、抗菌剤等を配合してもよい。
[Other ingredients]
In addition to the above components (A) to (D), generally known fillers, additives and the like may be blended with the composition of the present invention as necessary. Examples of the filler include pulverized silica, fumed silica, calcium carbonate, zinc carbonate, and wet silica. In addition, thixotropic improvers such as polyethers, fungicides, antibacterial agents and the like may be blended.

[組成物の調製]
本発明の組成物は、上記(A)成分を調整後、(B)〜(D)成分を添加し、好ましくは無水の状態でこれらを混合して調製することが出来る。
[Preparation of composition]
The composition of the present invention can be prepared by adjusting the component (A) and then adding the components (B) to (D), preferably mixing them in an anhydrous state.

<本発明の組成物の適用>
本発明の組成物は、フラットパネルディスプレイ用シール剤として好適に用いることができ、特に、図1に示すようなフラットパネルディスプレイ素子のシールに用いることが好ましい。
図1において、フラットパネルディスプレイ素子は、ガラス基板2とフィルム回路(TCP:Tape Carrier Package)8とを異方導電性接着剤(ACF)10で接着して構成されている。ガラス基板2の一方の面の中央部には表示画像部(例えば液晶ディスプレイの場合は液晶の画素)6が形成され、表示画像部6からガラス基板の端に向かって短冊状に電極4が延びている。電極4は通常、ITO(インジウム錫オキサイド)等の透明電極からなり、駆動回路の制御によって各画素に電圧を負荷して各画素をオンオフさせる。ガラス基板としては無アルカリガラスや石英ガラスを好適に用いることができる。
フィルム回路8は、透明電極4と図示しない駆動回路や外部電源とを接続し、例えば、銅箔回路やICをポリイミドフィルムや他の樹脂で覆ったフレキシブル回路である。
<Application of the composition of the present invention>
The composition of the present invention can be suitably used as a sealing agent for flat panel displays, and is particularly preferably used for sealing flat panel display elements as shown in FIG.
In FIG. 1, the flat panel display element is configured by bonding a glass substrate 2 and a film circuit (TCP: Tape Carrier Package) 8 with an anisotropic conductive adhesive (ACF) 10. A display image portion (for example, a liquid crystal pixel in the case of a liquid crystal display) 6 is formed at the center of one surface of the glass substrate 2, and the electrode 4 extends in a strip shape from the display image portion 6 toward the edge of the glass substrate. ing. The electrode 4 is usually made of a transparent electrode such as ITO (indium tin oxide), and a voltage is applied to each pixel under the control of the drive circuit to turn on / off each pixel. As the glass substrate, alkali-free glass or quartz glass can be preferably used.
The film circuit 8 is a flexible circuit in which the transparent electrode 4 is connected to a drive circuit (not shown) or an external power source, and for example, a copper foil circuit or IC is covered with a polyimide film or other resin.

本発明のフラットパネルディスプレイ用シール剤は、上記のようなガラス基板2、(透明電極)4、及びフィルム回路8をシール領域20とする部分を有効にシールすることができ、これらの素材(ガラス、(透明)電極、及びフィルム回路のフィルム)に対して密着性と離型性に共に優れる。   The sealing agent for flat panel displays of the present invention can effectively seal the glass substrate 2, the (transparent electrode) 4, and the film circuit 8 as the sealing region 20 as described above. , (Transparent) electrode, and film circuit film) are both excellent in adhesion and releasability.

<実施例>
以下に本発明を実施例を挙げて説明するが、本発明はこれらの例に限定されるものではない。又、実施例において示す「部」及び「%」は特に明示しない限り、質量部及び質量%を示す。
<Example>
EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Further, “parts” and “%” shown in the examples represent parts by mass and mass% unless otherwise specified.

(A)成分の調製:温度計、撹拌棒、還流冷却管及び窒素導入管を備えた四口セパラブルフラスコを窒素置換した。次いで、(I)成分として、(CHSiO1/2単位およびSiO4/2単位からなり、{(CHSiO1/2単位/SiO4/2単位}で表されるモル比が0.74であり、ケイ素原子に結合したヒドロキシ基含有量が1.62重量%であるオルガノポリシロキサンを用意した。(I)成分の固形分が50重量%となるようにトルエンに溶解した。(I)成分100部(トルエン溶液全体として100部であり、トルエン中の(I)成分単独は50部)に対し、(II)成分として23℃における粘度が20000mm2/sの両末端シラノール基封鎖ジメチルポリシロキサンを50部加え、均一に撹拌混合した後、アンモニア水0.5部を滴下して20℃で3時間縮合反応を行った。次いで、このものを120℃に加熱しながらトルエンおよび低分子量副生成物を除去し、固形分が50重量%となるように調整し、(A)成分を得た。
組成物の調製:上記(A)成分150部に対し、(B)成分(メタクリルオキシプロピルトリメトキシシラン )20部、(C)成分(錫オクトエート)0.5部、(D)成分(ジエトキシアセトフェノン )2部を配合して組成物を調製した。
Preparation of component (A): A four-necked separable flask equipped with a thermometer, a stirring rod, a reflux condenser, and a nitrogen inlet tube was purged with nitrogen. Then, the molar represented by a component (I), (CH 3) consists 3 SiO 1/2 units and SiO 4/2 units, {(CH 3) 3 SiO 1/2 units / SiO 4/2 units} An organopolysiloxane having a ratio of 0.74 and a hydroxy group content bonded to silicon atoms of 1.62% by weight was prepared. (I) It melt | dissolved in toluene so that the solid content of a component might be 50 weight%. (I) 100 parts of the component (100 parts as a whole in toluene solution, 50 parts of component (I) alone in toluene), as a component (II) Silanol groups at both ends having a viscosity at 23 ° C. of 20000 mm 2 / s After 50 parts of blocked dimethylpolysiloxane was added and uniformly stirred and mixed, 0.5 part of aqueous ammonia was added dropwise to conduct a condensation reaction at 20 ° C. for 3 hours. Subsequently, while heating this to 120 degreeC, toluene and a low molecular-weight by-product were removed, and it adjusted so that solid content might be 50 weight%, and obtained (A) component.
Preparation of composition: 150 parts of component (A) above, 20 parts of component (B) (methacryloxypropyltrimethoxysilane), 0.5 part of component (C) (tin octoate), component (D) (diethoxy) Acetophenone) 2 parts was blended to prepare a composition.

(C)成分として、錫オクトエートの代わりにジオクチル錫ジラウレート0.1部を配合したこと以外は、実施例1とまったく同様にして組成物を得た。   As the component (C), a composition was obtained in the same manner as in Example 1 except that 0.1 part of dioctyltin dilaurate was blended instead of tin octoate.

(A)成分の調製:(II)成分として23℃における粘度が700mm2/sの両末端シラノール基封鎖ジメチルポリシロキサンを50部加えたこと以外は、実施例1とまったく同様にして(A)成分を得た。
組成物の調製:この(A)成分を用い、又、(B)成分として、メタクリルオキシプロピルトリメトキシシランの代わりにアクリルオキシプロピルトリメトキシシラン20部を配合したこと以外は、実施例1とまったく同様にして組成物を得た。
Preparation of component (A): (A) Except that 50 parts of (II) component-end silanol-blocked dimethylpolysiloxane having a viscosity at 23 ° C. of 700 mm 2 / s was added (A) Ingredients were obtained.
Preparation of composition: Except that this component (A) was used and, as component (B), 20 parts of acryloxypropyltrimethoxysilane was blended instead of methacryloxypropyltrimethoxysilane. A composition was obtained in the same manner.

(A)成分の調製:(I)成分の配合量を60部に変更し、(II)成分の配合量を70部に変更したこと以外は、実施例1とまったく同様にして(A)成分を得た。
組成物の調製:実施例1の(A)成分の代わりに、この(A)成分を130部配合したこと以外は、実施例1とまったく同様に(B)〜(D)成分を配合して組成物を得た。
Preparation of component (A): Component (A) was the same as Example 1 except that the amount of component (I) was changed to 60 parts and the amount of component (II) was changed to 70 parts. Got.
Preparation of composition: In place of component (A) of Example 1, component (B) to component (D) were blended in the same manner as in Example 1 except that 130 parts of component (A) were blended. A composition was obtained.

(B)成分(メタクリルオキシプロピルトリメトキシシラン )の配合量を10部に変更し、(C)成分として錫オクトエートの代わりに、ジオクチル錫ジラウレート0.3部及びテトライソプロピルチタネート3部の組合せを配合したこと以外は、実施例1とまったく同様にして組成物を得た。   (B) The amount of component (methacryloxypropyltrimethoxysilane) was changed to 10 parts, and a combination of 0.3 parts of dioctyltin dilaurate and 3 parts of tetraisopropyl titanate was used instead of tin octoate as component (C). Except for this, a composition was obtained exactly as in Example 1.

<比較例1>
(A)成分の調製:(I)成分を配合せず、(II)成分の配合量を100部に変更し、アンモニア水を滴下しなかったこと以外は、実施例1とまったく同様にして(A)成分を得た。
組成物の調製:実施例1の(A)成分の代わりに、この(A)成分を100部配合したこと以外は、実施例1とまったく同様に(B)〜(D)成分を配合して組成物を得た。
<Comparative Example 1>
Preparation of component (A): Except for not adding component (I), changing the amount of component (II) to 100 parts, and not dropping ammonia water in exactly the same way as in Example 1 ( A) component was obtained.
Preparation of composition: Components (B) to (D) were blended in the same manner as in Example 1, except that 100 parts of component (A) were blended instead of component (A) in Example 1. A composition was obtained.

<比較例2>
(A)成分の調製:(I)成分と(II)成分を均一攪拌混合した後、アンモニア水を滴下せず、120℃に加熱してトルエンを除去したこと以外は、実施例1とまったく同様にして(A)成分を得た。実施例1の(A)成分の代わりに、この(A)成分を150部配合したこの(A)成分を用いたこと以外は、実施例1とまったく同様に(B)〜(D)成分を配合して組成物を得た。
<Comparative Example 2>
Preparation of component (A): Exactly the same as in Example 1 except that components (I) and (II) were uniformly stirred and mixed, then ammonia water was not added dropwise, and the toluene was removed by heating to 120 ° C. Thus, component (A) was obtained. In place of the component (A) in Example 1, the components (B) to (D) were added in the same manner as in Example 1 except that the component (A) containing 150 parts of the component (A) was used. The composition was obtained by blending.

<比較例3>
(C)成分を配合しなかったこと以外は、実施例1とまったく同様にして組成物を得た。
<Comparative Example 3>
A composition was obtained in the same manner as in Example 1 except that the component (C) was not blended.

<比較例4>
(A)成分の調製:(I)成分を配合せず、(II)成分の配合量を100部に変更し、アンモニア水を滴下しなかったこと以外は、実施例1とまったく同様にして(A)成分を得た。
組成物の調製:実施例1の(A)成分の代わりに、この(A)成分100部と、3−グリシドキシプロピルトリメトキシシラン1部(接着助剤)を用いたこと以外は、実施例1とまったく同様に(B)〜(D)成分を配合して組成物を得た。
<Comparative Example 4>
Preparation of component (A): Except for not adding component (I), changing the amount of component (II) to 100 parts, and not dropping ammonia water in exactly the same way as in Example 1 ( A) component was obtained.
Preparation of composition: Implemented except that 100 parts of this component (A) and 1 part of 3-glycidoxypropyltrimethoxysilane (adhesion aid) were used instead of the component (A) of Example 1. In the same manner as in Example 1, the components (B) to (D) were blended to obtain a composition.

<評価>
得られた各組成物を3mm厚のシートに成形し、23±2℃で50±5%RHの環境下で1日硬化させ、その後、UV照射装置(日本電池社製コンベアタイプ)により、高圧水銀灯(80W/cm)を距離10cm、速度1m/minで3回紫外線照射し、硬化させた。このもののゴム物性(硬さ及び引っ張り強さ)を測定した。
又、これとは別に、得られた各組成物をガラス上に1mm厚で塗布し、上記と同様な条件で硬化させたもののガラスに対する離型性及び密着性を評価した。
(1)硬さ
JISK-6253に準拠して硬化物のデュロメータ硬度A(Duro.A)を測定した。
(2)引っ張り強さ
JISK-6251に準拠して硬化物の引張り強さ(MPa)を測定した。
(3)離型性及び密着性
以下の基準で判定した。
密着性あり:ガラスから硬化物を簡単に剥がすことができないもの
密着性なし:ガラスから硬化物を簡単に剥がすことができるもの
離型性あり:ガラス表面に硬化物が残らないもの
離型性なし:ガラス表面に硬化物が残るもの
<Evaluation>
Each composition obtained was molded into a sheet of 3 mm thickness, cured at 23 ± 2 ° C. in an environment of 50 ± 5% RH for 1 day, and then subjected to high pressure by a UV irradiation device (conveyor type manufactured by Nihon Battery Co.). A mercury lamp (80 W / cm) was irradiated with ultraviolet rays three times at a distance of 10 cm and a speed of 1 m / min to be cured. The rubber physical properties (hardness and tensile strength) of this product were measured.
Separately from this, each composition obtained was applied on glass at a thickness of 1 mm, and cured under the same conditions as described above, the release properties and adhesion to glass were evaluated.
(1) Hardness
The durometer hardness A (Duro. A) of the cured product was measured according to JISK-6253.
(2) Tensile strength
Based on JISK-6251, the tensile strength (MPa) of the cured product was measured.
(3) Releasability and adhesion The determination was made according to the following criteria.
Adhesion: Hardened material cannot be easily peeled off from glass No adhesion: Hardened material can be easily peeled off from glass Releasable: Hardened material does not remain on glass surface No releasability : Hardened material remains on the glass surface

得られた結果を表1に示す。   The obtained results are shown in Table 1.


表1から明らかなように、各実施例の場合、組成物を硬化したもののゴム物性(硬さ及び引っ張り強さ)、離型性並びに密着性がいずれも優れていた。   As is clear from Table 1, in each case, the rubber properties (hardness and tensile strength), releasability, and adhesion of the cured composition were all excellent.

一方、(A)成分において(I)成分を配合しなかった比較例1の場合、硬化物の硬さ、引っ張り強さ、及び密着性がいずれも劣った。
(A)成分において(I)成分と(II)成分を縮合させずに単に混合した比較例2の場合、硬化物の硬さは高いものの、引っ張り強さ、及び密着性がいずれも劣った。
(C)成分を配合しなかった比較例3の場合、組成物中の各成分が縮合せず、硬化物の硬さ、引っ張り強さ、及び密着性がいずれも劣った。
シール剤として接着剤を用いた比較例4の場合、硬化物の硬さ、引っ張り強さ、及び離型性がいずれも劣った。
On the other hand, in the case of the comparative example 1 which did not mix | blend (I) component in (A) component, all of hardness, tensile strength, and adhesiveness of hardened | cured material were inferior.
In the case of Comparative Example 2 in which the (I) component and the (II) component were simply mixed in the component (A), the cured product was high in hardness, but the tensile strength and adhesion were both inferior.
In the case of the comparative example 3 which did not mix | blend (C) component, each component in a composition did not condense and the hardness, tensile strength, and adhesiveness of hardened | cured material were all inferior.
In the case of Comparative Example 4 using an adhesive as the sealant, the hardness, tensile strength, and mold release property of the cured product were all inferior.

図1に示す液晶ディスプレイの実際の製品に対し、実施例1の組成物をシール領域20にシールし、硬化させた。その後、上記と同様な方法で離型性及び密着性を評価したところ、いずれも優れていた。   For the actual product of the liquid crystal display shown in FIG. 1, the composition of Example 1 was sealed in the seal region 20 and cured. Then, when the mold release property and adhesiveness were evaluated by the same method as described above, both were excellent.

本発明のフラットパネルディスプレイ用シール剤をフラットパネルディスプレイ素子に用いる態様を例示する図である。It is a figure which illustrates the aspect which uses the sealing compound for flat panel displays of this invention for a flat panel display element.

符号の説明Explanation of symbols

2 ガラス基板
4 電極
8 フィルム回路
20 シール領域
2 Glass substrate 4 Electrode 8 Film circuit 20 Sealing area

Claims (4)

(A)下記(I)成分100質量部と(II)成分1〜200質量部との縮合反応生成物であるオルガノポリシロキサン100質量部、但し、
(I)成分は、RSiO1/2単位(式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜6の1価炭化水素基を表わす)及びSiO4/2単位を繰り返し単位とし、Si04/2単位1モルに対するRSiO1/2単位の割合が0.5〜1.2モルであり、更に、Si04/2単位1モルに対し、RSiO2/2単位及びRSiO3/2単位(各式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜6の1価炭化水素基を表わす)のうち少なくとも1つを各単位がそれぞれ1.0モル以下で各単位の合計が1.0モル以下となるように有していてもよく、かつケイ素原子に結合したヒドロキシ基を0.1質量%以上6.0質量%未満有するオルガノポリシロキサンであり、
(II)成分は、ヒドロキシ基、アルコキシ基、アルコキシアルコキシ基、アルケニルオキシ基、ケトオキシム基、アシロキシ基、及びアミノキシ基群から選ばれる官能基含有シリル基で分子鎖末端が封鎖されたジオルガノポリシロキサンであり、
(B)下記一般式(1)
(式中、Rは水素原子又はメチル基、Rはアルキレン基、R及びRはそれぞれ同一又は異なる非置換の一価炭化水素基、aは0〜2の整数である)で示される(メタ)アクリル官能性アルコキシシラン1〜50質量部、
(C)縮合反応用触媒0.01〜10質量部、及び
(D)光開始剤 0.01〜10質量部
を含む硬化性オルガノポリシロキサン組成物。
(A) 100 parts by mass of an organopolysiloxane that is a condensation reaction product of 100 parts by mass of the following component (I) and 1 to 200 parts by mass of the component (II),
Component (I) consists of R 3 SiO 1/2 units (wherein R represents each independently an unsubstituted or halogen atom-substituted monovalent hydrocarbon group having 1 to 6 carbon atoms) and SiO 4/2 units. Is a repeating unit, and the ratio of R 3 SiO 1/2 unit to 1 mol of SiO 4/2 units is 0.5 to 1.2 mol, and further, R 2 SiO 2 to 1 mol of SiO 4/2 units. / 2 units and RSiO 3/2 units (wherein each R independently represents an unsubstituted or halogen atom-substituted monovalent hydrocarbon group having 1 to 6 carbon atoms) Each of the units may be 1.0 mol or less and the total of each unit may be 1.0 mol or less, and the hydroxy group bonded to the silicon atom is 0.1% by mass or more and less than 6.0% by mass. An organopolysiloxane,
The component (II) is a diorganopoly having a molecular chain end blocked with a functional group-containing silyl group selected from the group consisting of a hydroxy group, an alkoxy group, an alkoxyalkoxy group, an alkenyloxy group, a ketoxime group, an acyloxy group, and an aminoxy group. Siloxane,
(B) The following general formula (1)
(Wherein R 1 is a hydrogen atom or a methyl group, R 2 is an alkylene group, R 3 and R 4 are the same or different unsubstituted monovalent hydrocarbon groups, and a is an integer of 0 to 2) 1 to 50 parts by weight of (meth) acrylic functional alkoxysilane,
A curable organopolysiloxane composition comprising (C) 0.01 to 10 parts by mass of a catalyst for condensation reaction and (D) 0.01 to 10 parts by mass of a photoinitiator.
前記(II)成分が下記一般式(2)
(式中、Rはそれぞれ独立に非置換又はハロゲン原子置換の炭素原子数1〜10の1価炭化水素基、Xはヒドロキシ基、アルコキシ基、アルコキシアルコキシ基、アルケニルオキシ基、ケトオキシム基、アシロキシ基、及びアミノキシ基群から選ばれるそれぞれ独立の官能基、aは1〜3の整数、nは10以上の整数である)で表わされるジオルガノポリシロキサンである請求項1に記載の硬化性オルガノポリシロキサン組成物。
The component (II) is represented by the following general formula (2)
(Wherein R 5 is each independently an unsubstituted or halogen atom-substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, X is a hydroxy group, an alkoxy group, an alkoxyalkoxy group, an alkenyloxy group, a ketoxime group, an acyloxy group) groups, and each independently functional groups selected from the group consisting of an aminoxy group, curability of claim 1 a is a diorganopolysiloxane represented by the integer of 1 to 3, n represents an integer of 10 or more) Organopolysiloxane composition.
請求項1又は2に記載の硬化性オルガノポリシロキサン組成物を含むフラットパネルディスプレイ用シール剤。 The sealing compound for flat panel displays containing the curable organopolysiloxane composition of Claim 1 or 2. 請求項3に記載のフラットパネルディスプレイ用シール剤を、該ディスプレイのガラス基板上の電極と該電極上に接続されるフィルム回路とを含む領域のシールに用いたフラットパネルディスプレイ素子。 The flat panel display element which used the sealing compound for flat panel displays of Claim 3 for the seal | sticker of the area | region containing the electrode on the glass substrate of this display, and the film circuit connected on this electrode.
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TW096124928A TWI406904B (en) 2006-07-10 2007-07-09 A hardened organopolysiloxane composition, a flat surface display sealant and a flat panel display element
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