JP4279101B2 - Conveying apparatus, substrate processing apparatus, jig, and teaching method - Google Patents

Description

  The present invention relates to a transfer device for transferring a substrate such as a semiconductor wafer, a substrate processing apparatus including the transfer device, a jig used for teaching a transfer position where a substrate is to be transferred, and a teaching method.

  Conventionally, a substrate processing apparatus for processing a substrate such as a semiconductor wafer has been provided with a plurality of processing units, and each processing unit performs a different process on the substrate. Such a substrate processing apparatus is provided with a transport device for transporting a substrate between a plurality of processing units or for transporting a substrate within each processing unit.

  In such a transport apparatus, it is necessary to transport the substrate to an accurate position with respect to the substrate transfer section in each processing section. This is because if the substrate cannot be transported to an accurate position, processing unevenness may occur on the substrate, the substrate may fall off from the transfer section, and unnecessary particles may adhere to the substrate, which is not preferable.

  However, in reality, due to various errors such as processing errors of members constituting the arm that holds the substrate, mounting errors when mounting each member, and assembly errors when assembling the transporting device, The arm does not access the correct transfer position, and is displaced from the correct transfer position.

  In order to eliminate such misalignment due to an error or the like, a teaching operation is performed on the transport device prior to actually transporting the substrate.

  An example of a substrate processing apparatus provided with a transfer device is disclosed in Patent Document 1 below.

Japanese Patent Laid-Open No. 11-163083

  The teaching work of the transfer device in the conventional substrate processing apparatus as described above is actually very difficult because the operator actually places the substrate on the arm and manually adjusts the arm little by little. It was a cumbersome and time-consuming task. In addition, there is a large difference in accuracy depending on the experience and technical skill of the operator who performs the teaching work.

  In addition, if the processing unit to be taught is a processing unit that performs heat treatment, the surroundings are sealed so that a heat treatment atmosphere can be maintained, so the position where the substrate is put in must be visually observed. That work was very difficult.

  In this way, the teaching work is burdened by the operator, and it takes time for the teaching work and variations in accuracy are not preferable from the viewpoint of operating the substrate processing apparatus efficiently and accurately. .

  The present invention has been made in view of the above-described problem, and reduces the burden on the operator and can accurately and efficiently eliminate misalignment caused by assembly errors and the like, and the transport It is an object of the present invention to obtain a substrate processing apparatus including apparatuses, jigs used in these apparatuses, and a teaching method.

The transport apparatus according to claim 1 is capable of placing an arm unit having an arm and a substrate transported by the arm unit, and has an upper surface on which a first small hole for position identification is formed at a predetermined location. A first control unit that moves the arm in the horizontal direction in the vicinity of the mounting table in a state where the arm holds the mounting jig having the mounting table and the sensing jig having the first detecting unit; And a first setting means for setting a horizontal position at which the arm transports the substrate based on information on a position where the small hole is detected.

Conveying apparatus according to claim 2, in particular, the first detecting means in the conveying device according to claim 1 is an optical sensor Reflective to be detected the first small holes.

The transport apparatus according to claim 3 is the transport apparatus according to claim 1 or 2 , in particular, the sensing jig wirelessly transmits the first data related to the detection result by the first detection means. And a first setting unit includes a first receiving unit configured to receive the first data transmitted from the first transmitting unit.

The transport device according to claim 4 is the transport device according to any one of claims 1 to 3 , in particular, the sensing jig is a light that opposes each other along the horizontal direction as the second detection means. The conveyance device further includes a transmission type optical sensor having an irradiation unit and a light receiving unit, and the transport device has a target jig on which a protrusion, which is a detection target of the second detection means, is formed at a predetermined position. And a second control means for moving the arm in the height direction in the vicinity of the target jig in a state where the sensing jig is held by the arm, and the height of the boundary of whether or not the protrusion can be detected by the second detection means. And a second setting means for setting a position in the height direction in which the arm conveys the substrate.

The transport device according to claim 5 is the transport device according to claim 4 , in particular, the sensing jig further includes second transmission means for wirelessly transmitting the second data related to the detection result by the second detection means. The second setting means includes second receiving means for receiving the second data transmitted from the second transmitting means.

The transfer device according to claim 6 is the transfer device according to claim 4 or 5 , particularly, wherein the arm unit includes a first arm that holds a sensing jig during teaching and a target jig during teaching. The target jig is further formed with a second small hole for position identification at a predetermined location, and the transport device mounts the target jig on the second arm. A third control means for moving the first arm in the horizontal direction in the vicinity of the target jig in a state where the sensing jig is held by the first arm after being transported on the mounting table; The apparatus further includes third setting means for setting a horizontal position deviation between the first arm and the second arm based on the information on the position where the second small hole is detected.

The transfer device according to claim 7 is the transfer device according to any one of claims 1 to 6 , in particular, the arm unit is a separate arm from the arm that holds the substrate, and the sensing jig is Has a dedicated arm held.

The substrate processing apparatus according to claim 8, provided with a processing unit for performing predetermined processing on a substrate, a transport device for performing loading and unloading of the substrate to the processing section, any one of claims 1 to 7 one The conveyance apparatus described in one is provided.

The jig according to claim 9 is used when teaching the transport position in the horizontal direction on the mounting table, on which the substrate should be transported by the arm, in the transport apparatus according to any one of claims 1 to 7. A jig to be used, which includes a main body portion that can be held by an arm, and a limited reflection type optical sensor that is disposed at a predetermined position of the main body portion and has a first small hole as a detection target.

Teaching method of claim 1 0, for conveying device including an arm unit and a can be placed table the substrate transferred by said arm unit having an arm capable of holding the substrate, the substrate by an arm Is a method of teaching a horizontal transfer position on a mounting table, wherein (a) a step of holding a sensing jig having a detection means on an arm, and (b) a small hole for position identification is predetermined. A step of moving the arm holding the sensing jig in the horizontal direction in the vicinity of the mounting table having an upper surface formed at the position of (c), and (c) a step of acquiring information on a position where the detection means detects the small hole , (D) setting a transport position based on the position information.

According to the transport apparatus of the first aspect, it is possible to reduce the burden on the operator during teaching, and to eliminate the positional deviation in the horizontal direction due to the error accurately and efficiently in a short time. In addition, since the first small hole for position identification is formed in the mounting table itself, there is no need to mount a dedicated target jig on the mounting table, and the number of parts can be reduced and work efficiency can be improved. You can also. In addition, since the formation of the small holes is simple, the structure for position identification can be formed with high accuracy and ease.

According to the transport apparatus of the second aspect , by using the limited reflection type optical sensor, the cost can be reduced as compared with the case of using a laser displacement sensor or the like.

According to the transport apparatus of the third aspect , the first data is transmitted and received wirelessly between the sensing jig and the first setting means. This eliminates the trouble of connecting the sensing jig and the first setting means using wiring or a connector during teaching, thus improving workability.

According to the conveying apparatus of the fourth aspect , teaching in the height direction can be executed by a relatively simple structure using the transmission type optical sensor and the target jig on which the protrusion is formed.

According to the transport apparatus of the fifth aspect , the second data is transmitted and received wirelessly between the sensing jig and the second setting means. This eliminates the trouble of connecting the sensing jig and the second setting means using wiring or a connector during teaching, thereby improving workability.

According to the transfer device of the sixth aspect , the positional deviation between the first arm and the second arm can be obtained, and more accurate teaching can be performed by considering the positional deviation.

According to the transfer device of the seventh aspect , since the labor of attaching the sensing jig to the arm during teaching can be saved, workability is improved.

According to the substrate processing apparatus of the eighth aspect , it is possible to reduce the burden on the operator during teaching and to eliminate the positional deviation due to the error accurately and efficiently in a short time.

According to the jig of the ninth aspect , by moving the arm in the horizontal direction in the vicinity of the mounting table in a state where the jig is held by the arm, information on the position at which the sensor has detected the first small hole is obtained. Based on this, it is possible to set a horizontal transfer position on the mounting table where the substrate should be transferred by the arm.

According to the teaching method of claim 1 0, it is possible to reduce the operator's burden during the teaching, it is possible to efficiently eliminate the horizontal position displacement accurately in a short time due to the error. Further, since a small hole for position identification is formed in the mounting table itself, there is no need to mount a dedicated target jig on the mounting table, and the number of parts can be reduced and the work efficiency can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  Hereinafter, a substrate processing apparatus will be described as an example in which an antireflection film or a photoresist film is applied and formed on a semiconductor wafer (substrate), and a chemical treatment such as a development process is performed on the exposed substrate. However, the substrate to be processed by the substrate processing apparatus according to the present invention is not limited to a semiconductor wafer, and may be a glass substrate for a flat display panel (for example, a liquid crystal panel). Further, the processing content of the substrate processing apparatus according to the present invention is not limited to coating formation and development processing, but may be etching processing, cleaning processing, and the like.

  FIG. 1 is a top view showing a configuration of a substrate processing apparatus 100 according to an embodiment of the present invention. In FIG. 1 and the subsequent drawings, an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane is appropriately attached as necessary to clarify the directional relationship.

  As shown in FIG. 1, the substrate processing apparatus 100 includes an indexer block 1 and three processing blocks (specifically, an antireflection film processing block 2 and a resist) that perform predetermined chemical processing on the substrate to be processed. A film processing block 3 and a development processing block 4) and an interface block 5 are provided, and these blocks are arranged side by side. The interface block 5 is provided with an exposure apparatus (stepper) STP which is an external apparatus separate from the substrate processing apparatus 100.

  The indexer block 1 is a part responsible for receiving an unprocessed substrate W from the outside of the substrate processing apparatus 100, and conversely, dispensing the processed substrate W to the outside. The indexer block 1 includes a cassette mounting table 6 on which a plurality of cassettes C (four in the example shown in FIG. 1) capable of storing a predetermined number of substrates W are arranged side by side, and an unprocessed substrate W from the cassette C. And an indexer transport mechanism 7 for receiving the processed substrate W and sequentially storing it in the cassette C again.

  The indexer transport mechanism 7 includes a movable table 7a that can move horizontally in the Y-axis direction along the cassette mounting table 6, a holding arm 7b that holds the substrate W in a horizontal posture on the movable table 7a, and a holding arm 7b. And a plurality of pins 7c (three in the example shown in FIG. 1) protruding inside the tip portion. The holding arm 7b is configured to be capable of moving up and down in the Z-axis direction, turning in a horizontal plane, and moving back and forth in the turning radius direction. The substrate W is held in a horizontal posture by the pins 7c.

  Further, a partition wall 13 is provided at the boundary between the indexer block 1 and the antireflection film processing block 2 adjacent to each other for the purpose of blocking each other's atmosphere. In order to transfer the substrate W between the indexer block 1 and the antireflection film processing block 2, the two substrate platforms PASS1 and PASS2 on which the substrate W is placed partially penetrate the partition wall 13. Thus, they are provided close to each other in the vertical direction.

  The delivery of the substrate W in the indexer block 1 will be outlined. First, the indexer transport mechanism 7 moves horizontally to a position facing a predetermined cassette C. Subsequently, when the holding arm 7b moves up and down and moves forward and backward, the unprocessed substrate W stored in the cassette C is taken out. With the substrate W held by the holding arm 7b, the indexer transport mechanism 7 moves horizontally to a position facing the substrate platforms PASS1, PASS2.

  Then, the substrate W on the holding arm 7b is placed on the upper substrate platform PASS1 for delivering the substrate. When the processed substrate W is placed on the lower substrate platform PASS2 for returning the substrate, the indexer transport mechanism 7 receives the processed substrate W on the holding arm 7b, The processed substrate W is stored in the cassette C. Thereafter, similarly, an operation of taking out the unprocessed substrate W from the cassette C and transporting it to the substrate platform PASS1 and receiving the processed substrate W from the substrate platform PASS2 and storing it in the cassette C is repeated.

  FIG. 2 is a front view showing the configuration of the substrate processing apparatus 100. FIG. 3 is a front view showing an arrangement configuration of the heat treatment part TP when viewed from the same direction as FIG. The antireflection film processing block 2 performs a process of forming an antireflection film for reducing standing waves and halation generated during exposure in the exposure apparatus STP under the photoresist film. Referring to FIGS. 1 to 3, the antireflection film processing block 2 includes a first coating processing unit 8 (having coating processing units 8 a to 8 c) that performs a process of coating the surface of the substrate W with an antireflection film, and coating. A first heat treatment unit 9 (having a plurality of heating plates HP, a cooling unit CP, and an adhesion processing unit AHL) that performs necessary heat treatment, and the first coating treatment unit 8 and the first heat treatment unit 9 And a first main transport mechanism 10A that performs delivery.

  FIG. 4 is a perspective view showing a simplified structure of the first main transport mechanism 10A. The first main transport mechanism 10A includes an arm unit 10e having holding arms 10a and 10b and a bracket 10d, and a Z-axis portion 10f having both ends fixed to the ceiling surface and the floor surface of the substrate processing apparatus 100. The holding arms 10a and 10b are disposed close to each other in the vertical direction, and can move forward and backward independently from the bracket 10d. The holding arms 10a and 10b have a substantially C-shaped tip portion, and a plurality of (for example, three) pins 10c protrude from the inside of the tip portion. By placing the substrate W on the plurality of pins 10c, the substrate W can be held in a horizontal posture. The arm unit 10e is pivoted in the horizontal plane around the Z-axis part 10f by the θ-axis drive part 62 (see FIG. 16), and the Z-axis part 10f by the Z-axis drive part 60 (see FIG. 16). Up and down movements can be made along each. Further, the holding arms 10a and 10b are configured such that the arm unit 10e can be moved back and forth in the turning radius direction by an X-axis drive unit 64 (see FIG. 16). Second to fourth main transport mechanisms 10B to 10D described later also have the same configuration as the first main transport mechanism 10A. Hereinafter, when the first to fourth main transport mechanisms 10A to 10D are not particularly distinguished, they are referred to as “main transport mechanism 10”.

  Referring to FIG. 1, a partition wall 13 is provided at a boundary portion between the antireflection film processing block 2 and the resist film processing block 3 adjacent to each other. Substrate placement parts PASS3 and PASS4 for placing the substrate W are provided in the partition wall 13 so as to partially pass through the partition wall 13 and close to each other in the vertical direction. The substrate platforms PASS3 and PASS4 are platforms for transferring the substrate W between the first main transport mechanism 10A of the antireflection film processing block 2 and the second main transport mechanism 10B of the resist film processing block 3. It is.

  The substrate W for which the processing for forming the antireflection film in the antireflection film processing block 2 has been completed is placed on the upper substrate platform PASS3 by the holding arm 10a of the first main transport mechanism 10A. Then, the substrate W placed on the substrate platform PASS3 is carried into the resist film processing block 3 by the second main transport mechanism 10B. Further, the substrate W that has been subjected to the exposure process, the post-exposure bake process, and the development process in the exposure apparatus STP and the development processing block 4 is placed on the lower substrate platform PASS4 by the second main transport mechanism 10B. Then, it is carried into the antireflection film processing block 2 by the holding arm 10b of the first main transport mechanism 10A. In other words, the antireflection film processing block 2 and the resist film processing block 3 deliver the substrate W through the substrate platforms PASS3 and PASS4.

  The resist film processing block 3 performs a process of forming a photoresist film on the substrate W on which the antireflection film is formed. Referring to FIGS. 1 to 3, resist film processing block 3 performs second coating processing section 15 (having coating processing units 15 a to 15 c) that performs processing for coating a photoresist film, and performs heat treatment necessary for coating. A second heat treatment unit 16 (having a plurality of heating units PHP and cooling units CP) and a second main transport mechanism 10B that delivers the substrate W to the second coating treatment unit 15 and the second heat treatment unit 16 are provided. ing.

  Referring to FIG. 1, a partition wall 13 is provided at the boundary between the resist film processing block 3 and the development processing block 4 adjacent to each other. Substrate placement parts PASS5 and PASS6 for placing the substrate W are provided in the partition wall 13 so as to partially pass through the partition wall 13 and close to each other in the vertical direction. The substrate platforms PASS5 and PASS6 are platforms for transferring the substrate W between the second main transport mechanism 10B of the resist film processing block 3 and the third main transport mechanism 10C of the development processing block 4. .

  The substrate W on which the photoresist film coating process is completed in the resist film processing block 3 is placed on the upper substrate platform PASS5 by the holding arm 10a of the second main transport mechanism 10B. Then, the substrate W placed on the substrate platform PASS5 is carried into the development processing block 4 by the third main transport mechanism 10C. Further, the substrate W that has been subjected to the exposure process, the post-exposure bake process, and the development process in the exposure apparatus STP and the development processing block 4 is placed on the lower substrate platform PASS6 by the third main transport mechanism 10C. Then, it is carried into the resist film processing block 3 by the holding arm 10b of the second main transport mechanism 10B. That is, the resist film processing block 3 and the development processing block 4 deliver the substrate W via the substrate platforms PASS5 and PASS6.

  The development processing block 4 is a mechanism for performing development processing on the substrate W on which a predetermined circuit pattern is exposed in the exposure apparatus STP. The development processing block 4 includes a development processing unit 30 that performs development processing with a developer, a third heat treatment unit 31 that performs heat treatment necessary for the development processing, and the development processing unit 30 and the third heat treatment unit 31. And a third main transport mechanism 10C that performs delivery.

  Referring to FIG. 2, the development processing unit 30 is configured by vertically stacking five development processing units 30a to 30e having the same configuration. Each of the development processing units 30a to 30e includes a spin chuck 32 that rotates while adsorbing and holding the substrate W in a horizontal posture, a nozzle 33 that supplies a developing solution onto the substrate W held on the spin chuck 32, and the like. .

  Referring to FIG. 3, the third heat treatment unit 31 includes a plurality of heating plates HP, a heating unit PHP with a temporary substrate placement unit, and a cooling plate CP for cooling the substrate W to room temperature with high accuracy. Including a heat treatment part, the heat treatment parts are stacked one above the other and arranged in parallel.

  FIG. 5 is a schematic diagram showing the configuration of the heating unit PHP. The heating unit PHP includes a heating plate HP that places and heat-treats the substrate W, a temporary substrate placement unit 19 that places the substrate W at an upper position away from the heating plate HP, and a heating plate HP and a temporary substrate placement unit. And a local transport mechanism 20 that transports the substrate W to and from 19. The heating plate HP is provided with a plurality of movable support pins 21 so as to be able to appear and retract on the plate surface. Above the heating plate HP, there is provided an upper lid 22 that can be raised and lowered to cover the substrate W during the heat treatment. The temporary substrate placement portion 19 is provided with a plurality of fixed support pins 23 that support the substrate W.

  The local transport mechanism 20 includes a holding plate 24 that holds the substrate W in a substantially horizontal posture. The holding plate 24 is moved up and down by a screw feed drive mechanism 25 and moved forward and backward by a belt drive mechanism 26. Has been. A plurality of slits 24 a are formed in the holding plate 24 so that the holding plate 24 does not interfere with the movable support pin 21 and the fixed support pin 23 when it moves above the heating plate HP and the temporary substrate placement portion 19. The local transport mechanism 20 includes a cooling unit that cools the substrate with water in the process of transporting the substrate W from the heating plate HP to the temporary substrate placement unit 19.

  The local transport mechanism 20 is installed so as to face a surface 19f (see FIG. 5B) adjacent to the surface 19e facing the fourth main transport mechanism 10D of the interface block 5. An opening 19a that allows the fourth main transport mechanism 10D to enter the surface 19e is formed on the upper portion of the housing 27 that covers the heating plate HP and the substrate temporary placement unit 19, that is, the portion that covers the substrate temporary placement unit 19. Openings 19b that allow the local transport mechanism 20 to enter are provided on the surface 19f. In addition, a lower surface of the casing 27, that is, a portion covering the heating plate HP, has a surface 19e closed, and an opening 19c that allows the local transport mechanism 20 to enter is provided on the surface 19f.

  The substrate W is taken in and out of the heating unit PHP as described above. First, the third main transport mechanism 10 </ b> C holds the substrate W and places the substrate W on the fixed support pins 23 of the temporary substrate placement unit 19. Subsequently, the substrate W is received from the fixed support pins 23 by raising the holding plate 24 of the local transport mechanism 20 slightly after entering the lower side of the substrate W. The holding plate 24 holding the substrate W is withdrawn from the housing 27 and lowered to a position facing the heating plate HP. At this time, the movable support pin 21 of the heating plate HP is lowered to the heating position where the lower surface of the substrate W and the upper surface of the holding plate 24 are in contact with each other, and the upper lid 22 is raised. The holding plate 24 holding the substrate W advances above the heating plate HP. After the movable support pin 21 is raised and the substrate W is received at the receiving position, the holding plate 24 is retracted. Subsequently, the movable support pin 21 is lowered to place the substrate W on the heating plate HP, and the upper lid 22 is lowered to cover the substrate W. In this state, the substrate W is heated. When the heat treatment is finished, the upper lid 22 rises and the movable support pin 21 rises to lift the substrate W. Subsequently, after the holding plate 24 advances below the substrate W, the movable support pin 21 is lowered, so that the substrate W is delivered to the holding plate 24. The holding plate 24 holding the substrate W is withdrawn and further lifted to transport the substrate W to the temporary substrate placement unit 19. The substrate W supported by the holding plate 24 in the temporary substrate placement unit 19 is cooled by the cooling function possessed by the holding plate 24. The holding plate 24 moves the cooled substrate W (returned to room temperature) onto the fixed support pins 23 of the temporary substrate placement unit 19. The third main transport mechanism 10C takes out and transports the substrate W.

  Referring to FIG. 3, the third main transport mechanism 10 </ b> C of the development processing block 4 and the interface block 5 are arranged in a row of heat treatment units on the right side (side adjacent to the interface block 5) of the third heat treatment unit 31. Two substrate platforms PASS7 and PASS8 for transferring the substrate W to and from the fourth main transport mechanism 10D are provided close to each other in the vertical direction.

  Referring to FIGS. 1 and 3, the substrate W carried into the development processing block 4 from the resist film processing block 3 is placed on the upper substrate platform PASS7 by the holding arm 10a of the third main transport mechanism 10C. The Then, the substrate W placed on the substrate platform PASS7 is carried into the interface block 5 by the fourth main transport mechanism 10D. The substrate W that has been subjected to the exposure processing in the exposure apparatus STP is placed on the lower substrate platform PASS8 by the fourth main transport mechanism 10D. Then, it is carried into the resist film processing block 3 by the holding arm 10b of the third main transport mechanism 10C. That is, the development processing block 4 and the interface block 5 transfer the substrate W through the substrate platforms PASS7 and PASS8.

  The interface block 5 is a mechanism that delivers the substrate W to the exposure apparatus STP that is an external apparatus separate from the substrate processing apparatus 100. The interface block 5 includes two edge exposure units for exposing the peripheral portion of the substrate W coated with the photoresist, in addition to the interface transport mechanism 35 for transferring the substrate W to and from the exposure apparatus STP. EEW, a heating unit PHP with a temporary substrate placement unit disposed in the development processing block 4, and a fourth main transport mechanism 10D that delivers the substrate W to the edge exposure unit EEW are provided.

  As shown in FIG. 2, the edge exposure unit EEW includes a spin chuck 36 that rotates by attracting and holding the substrate W in a horizontal posture, and a light irradiator that exposes a peripheral portion of the substrate W held on the spin chuck 36. 37 etc. The two edge exposure units EEW are stacked one above the other at the center of the interface block 5.

  FIG. 6 is a side view showing the configuration of the interface block 5. A return buffer RBF for returning the substrate is provided below the two edge exposure units EEW, and two substrate platforms PASS9 and PASS10 are stacked below the return buffer RBF. When the development processing block 4 cannot perform the development processing of the substrate W due to a failure or the like, the buffer RBF for returning the substrate is subjected to the heat treatment after exposure by the heating unit PHP of the development processing block 4. The substrate W is temporarily stored and stored. The buffer RBF is composed of a storage shelf that can store a plurality of substrates W in multiple stages. The substrate platforms PASS9 and PASS10 are used for transferring the substrate W between the fourth main transport mechanism 10D and the interface transport mechanism 35, and the upper side is for substrate feeding and the lower side is for substrate return. ing.

  As shown in FIGS. 1 and 6, the interface transport mechanism 35 includes a movable table 35a that can move horizontally in the Y direction, and a holding arm 35b that holds the substrate W is mounted on the movable table 35a. . The holding arm 35b is configured to be able to move up and down, turn and advance and retract in the turning radius direction. One end of the transport path of the interface transport mechanism 35 (position P1 shown in FIG. 6) extends to below the stacked substrate platforms PASS9 and PASS10, and between this position P1 and the exposure apparatus STP. Deliver the substrate W. At the other end position P2 of the transport path, the substrate W is delivered to the substrate platforms PASS9 and PASS10, and the substrate W is stored and taken out from the sending buffer SBF. The sending buffer SBF temporarily stores and stores the substrate W before the exposure processing when the exposure apparatus STP cannot accept the substrate W, and includes a storage shelf that can store a plurality of substrates W in multiple stages. ing.

  FIG. 7 is a top view schematically showing the configuration of the substrate platform PASS1, and FIG. 8 is a cross-sectional view of the position along the line VIII-VIII shown in FIG. The substrate platform PASS1 includes a platform 40 on which the substrate W transported by the main transport mechanism 10 can be placed, and functions as an identification structure for position identification at the central portion of the upper surface of the platform 40. A substantially circular small hole 41 is formed. The size of the small hole 41 is a size that does not affect the performance as the substrate mounting portion. For example, the diameter is 2 mm and the depth is 2 mm or more. The above-described substrate platforms PASS2 to PASS10 have the same configuration as the substrate platform PASS1. Hereinafter, the substrate platforms PASS1 to PASS10 will be referred to as “substrate platforms PASS” unless they are particularly distinguished.

  FIG. 9 is a top view showing the configuration of the Z-axis target jig 48 in a simplified manner, and FIG. 10 is a cross-sectional view regarding the position along the line XX shown in FIG. As will be described later, the Z-axis target jig 48 is placed on the substrate platform PASS when teaching about the Z-axis. The Z-axis target jig 48 can be held by the holding arm 10 b and has a thin plate-like main body 45 having substantially the same shape as the substrate W, and a protruding detection pin 46 provided at a substantially central position on the upper surface of the main body 45. And. For example, when the substrate W has a disk shape with a diameter of 300 mm, the main body portion 45 also has a disk shape with a diameter of 300 mm. The height H from the bottom surface of the main body 45 to the upper end of the detection pin 46 is set to a predetermined value.

  FIG. 11 is a bottom view showing the configuration of the sensing jig 49 in a simplified manner. As will be described later, the sensing jig 49 is held by the holding arm 10a when teaching about the X axis and the θ axis. The sensing jig 49 can be held by the holding arm 10a, and is a thin plate-like main body portion 42 having substantially the same shape as the substrate W, a limited reflection type optical sensor 43 provided at the center of the bottom surface of the main body portion 42, A transmissive optical sensor 44 (reference numerals 44a and 44b in FIG. 11) provided at a substantially central portion of the bottom surface of the main body 42 is provided. For example, when the substrate W has a disk shape with a diameter of 300 mm, the main body portion 42 also has a disk shape with a diameter of 300 mm. The detection target of the sensor 43 is the small hole 41 shown in FIGS. The sensor 44 has a light irradiating unit 44a and a light receiving unit 44b facing each other along the horizontal direction (in-plane direction of the XY plane), and the detection target of the sensor 44 is the detection shown in FIGS. Pin 46.

  12 and 13 are cross-sectional views schematically showing a situation in which the detection pin 46 is detected by the sensor 44. FIG. The Z-axis target jig 48 is mounted on the mounting table 40. The sensing jig 49 is held by a holding arm 10a (not shown in FIGS. 12 and 13) so that the detection pin 46 is positioned between the light emitting unit 44a and the light receiving unit 44b in the horizontal direction.

  Referring to FIG. 12, when the sensing jig 49 and the mounting table 40 are sufficiently separated in the Z direction, the light irradiated from the light irradiation unit 44 a is not blocked by the detection pin 46 and is received by the light receiving unit 44 b. To reach. From this state, the sensing jig 49 is gradually lowered in a direction in which the sensing jig 49 and the mounting table 40 approach each other.

  Referring to FIG. 13, when sensing jig 49 and mounting table 40 come close to a predetermined distance, specifically, sensing jig 49 until the distance from the upper surface of mounting table 40 to sensor 43 becomes H1 (for example, 6 mm). Is lowered, the light irradiated from the light irradiation unit 44a is blocked by the detection pin 46 and does not reach the light receiving unit 44b. Therefore, it is possible to detect that the sensing jig 49 and the mounting table 40 are close to the predetermined distance because the light receiving unit 44b stops receiving light. When teaching about the Z axis, the actual height position of the mounting table 40 is obtained by referring to the height position (Z coordinate) of the holding arm 10a when the light receiving unit 44b stops receiving light. (Z coordinate) can be obtained.

  14 and 15 are cross-sectional views schematically showing a situation in which the small hole 41 is detected by the sensor 43. The Z-axis target jig 48 is withdrawn from the mounting table 40, and the sensing jig 49 is held by a holding arm 10a (not shown in FIGS. 14 and 15). Further, the distance from the upper surface of the mounting table 40 to the sensor 43 is kept at the above-described distance H1.

  The sensor 43 includes a light irradiation unit that emits light and a light receiving unit that can detect the amount of reflected light received. And when the distance regarding the Z direction from the sensor 43 to a reflective target object is said distance H1 (6 mm), it sets so that a reflected light quantity may become a peak value.

  Referring to FIG. 14, when the sensor 43 is not located directly above the small hole 41, the sensor 43 receives reflected light having a peak light amount. A threshold value slightly smaller than the peak value is set, and the sensor 43 receives reflected light having a light amount larger than the threshold value, so that the sensor 43 is positioned directly above the small hole 41. It can be detected that it is not.

  Referring to FIG. 15, when the sensor 43 is positioned directly above the small hole 41, the sensor 43 receives reflected light having a light amount smaller than the peak value. It is possible to detect that the sensor 43 is positioned directly above the small hole 41 when the sensor 43 receives reflected light whose light amount is equal to or less than the threshold value.

  FIG. 16 is a block diagram illustrating a configuration of a control mechanism for performing teaching. FIG. 16 shows a block diagram when the sensing jig 49 is held by the holding arm 10a.

  As shown in FIG. 16, the control unit 50a includes a CPU 51 that issues a drive command to the holding arms 10a and 10b, a ROM 52 in which a program is written in advance, a RAM 53 in which a user program and position information are stored, and an interface 54. And a servo control unit 55. The ROM 52, RAM 53, interface 54, and servo control unit 55 are all connected to the CPU 51.

  The interface 54 is connected to the sensors 43 and 44 of the sensing jig 49 via the connector 58.

  The servo control unit 55 is connected to the Z-axis drive unit 60, the θ-axis drive unit 62, the X-axis drive unit 64, and the encoders 61, 63, and 65. Here, the encoder 61 has a function of detecting the driving amount of the Z-axis driving unit 60, the encoder 63 has a function of detecting the driving amount of the θ-axis driving unit 62, and the encoder 65 has a function of detecting the driving amount of the X-axis driving unit 64. Yes. Therefore, by acquiring the outputs of the encoders 61, 63, and 65 via the servo control unit 55, the CPU 51 can detect the amount of displacement by which the main transport mechanism 10 has been operated, whereby the holding arms 10a, Position information 10b can be obtained. Further, the CPU 51 can control the driving of the main transport mechanism 10 by outputting the driving amounts of the Z axis, the θ axis, and the X axis to the servo control unit 55.

  Also connected to the CPU 51 are an output device (for example, a display display) 57 for displaying various information to the operator and an input device (for example, a keyboard) 56 for the operator to input processing commands and the like. Has been.

  Hereinafter, the teaching flow will be described. Hereinafter, a case where the base values Z0, X0, θ0 are set on the basis of the upper holding arm 10a will be described as an example. Here, the base values Z0, X0, θ0 are design coordinates when the main transport mechanism 10 accesses the substrate platform PASS, and are stored in the RAM 53 in advance for each main transport mechanism 10.

  First, the sensing jig 49 is set in a predetermined direction on the holding arm 10a by the operator, and the Z-axis target jig 48 is set in a predetermined direction on the holding arm 10b. The operator uses the input device 56 to input that the setting of the sensing jig 49 and the Z-axis target jig 48 has been completed.

  Next, the CPU 51 sends a command to the servo control unit 55 so as to drive the arm unit 10e in the + Z direction. The servo control unit 55 drives the Z-axis drive unit 60 to move the arm unit 10e along the Z-axis unit 10f so that the Z coordinate of the holding arm 10a matches the base value Z0.

  Next, the CPU 51 sends a command to the servo control unit 55, and the servo control unit 55 drives the X-axis drive unit 64 and the θ-axis drive unit 62 so that the X coordinate and the θ coordinate of the holding arm 10b are set. The holding arm 10b is moved so as to match the base values X0 and θ0, respectively. Then, after the Z-axis target jig 48 held by the holding arm 10b is placed on the placing table 40, the holding arm 10b is accommodated again in the bracket 10d.

  Next, the CPU 51 sends a command to the servo control unit 55, and the servo control unit 55 drives the X-axis drive unit 64 so that the X coordinate of the holding arm 10a matches the base value X0. The holding arm 10b is moved in the + X direction. As a result, the sensing jig 49 is conveyed directly above the Z-axis target jig 48 placed on the placing table 40. The sensing jig 49 is held by the holding arm 10a so that the detection pin 46 is positioned between the light emitting unit 44a and the light receiving unit 44b in the horizontal direction.

  Next, the CPU 51 sends a command to the servo control unit 55 so as to drive the arm unit 10e in the −Z direction. The servo control unit 55 drives the Z-axis drive unit 60 to gradually lower the arm unit 10e so that the sensing jig 49 and the mounting table 40 approach each other. The CPU 51 monitors the output of the sensor 44, and stops the lowering of the arm unit 10e when the output of the sensor 44 is turned off, that is, when the light receiving unit 44b stops receiving light (see FIG. 13). A command is sent to the servo controller 55. In response to this command, the servo control unit 55 stops driving the Z-axis drive unit 60. The CPU 51 acquires the current Z-axis position (Z coordinate ZR) obtained from the encoder 61 via the servo control unit 55, and the proper Z-axis when the holding arm 10a transports the substrate W to the substrate platform PASS. The position value is stored in the RAM 53. This completes teaching about the Z-axis.

  Next, the CPU 51 sends a command to the servo control unit 55 so as to drive the holding arm 10b in the −X direction. The servo control unit 55 drives the X-axis drive unit 64 to move the holding arm 10b so that the X coordinate of the holding arm 10b matches the base value X0. Then, after holding the Z-axis target jig 48 mounted on the mounting table 40 by the holding arm 10b, the holding arms 10a and 10b are stored again in the bracket 10d. Thereby, the Z-axis target jig 48 is collected, and the upper surface of the mounting table 40 in which the small holes 41 are formed is exposed.

  Next, the CPU 51 sends a command to the servo control unit 55 so as to drive the holding arm 10a in the + X direction. The servo control unit 55 drives the X-axis drive unit 64 to move the holding arm 10b again so that the X coordinate of the holding arm 10a matches the base value X0. FIG. 17 is a conceptual diagram for explaining teaching concerning the X axis and the θ axis, and corresponds to a top view in the vicinity where the small hole 41 is formed. As shown in FIG. 11, the sensor 43 is disposed at the center of the bottom surface of the main body 42. Therefore, as shown in FIG. 17, at this time, the sensor 43 is located at the point P0 where the X coordinate and the θ coordinate are both base values (x0, θ0).

  Next, the CPU 51 sends a command to the servo control unit 55, and the servo control unit 55 detects the edge of the small hole 41 by the sensor 43 until the X-axis drive unit 64 (and θ as necessary). The holding arm 10a is driven to scan by driving the shaft driving unit 62). Specifically, the CPU 51 monitors the output of the sensor 43, and instructs the servo controller 55 to stop the scanning drive of the holding arm 10a when the output of the sensor 43 falls below a threshold value. Is sent out. In response to this command, the servo control unit 55 stops driving the X-axis drive unit 64 and the θ-axis drive unit 62. In the present embodiment, it is assumed that the edge of the small hole 41 is detected at the point P1.

  Next, the CPU 1 sends a command to the servo control unit 55 so as to drive the holding arm 10a in the θ-axis direction, and the servo control unit 55 drives the θ-axis drive unit 62 to thereby move the small hole 41. The holding arm 10a is moved in the + θ direction (left direction in FIG. 17) by a distance L equal to or larger than the diameter L, and then the holding arm 10a is moved again in the −θ direction (right direction in FIG. 17). When the edge of the small hole 41 is detected, the movement of the holding arm 10a in the −θ direction is stopped, and the CPU 51 acquires the current position of the θ axis obtained from the encoder 63 through the servo control unit 55 at that time. The coordinates are stored in the RAM 53. In the present embodiment, the θ coordinate θ0 of the point P1 is stored in the RAM 53.

  Next, the CPU 1 sends a command to the servo control unit 55 so as to drive the holding arm 10a in the θ-axis direction, and the servo control unit 55 drives the θ-axis drive unit 62 so that only the distance L is obtained. After the holding arm 10a is moved in the −θ direction, it is moved again in the + θ direction. When the edge of the small hole 41 is detected, the movement of the holding arm 10a in the + θ direction is stopped, and the CPU 51 acquires the current position of the θ axis obtained from the encoder 63 at that time via the servo control unit 55, The coordinates are stored in the RAM 53. In the present embodiment, the θ coordinate θ1 of the point P2 is stored in the RAM 53.

  Next, the CPU 1 reads the θ coordinates θ0 and θ1 from the RAM 53, calculates an average value (θ coordinate θ2), and an appropriate θ axis when the holding arm 10a transports the substrate W to the substrate platform PASS. The position value is stored in the RAM 53. This completes teaching about the θ axis. Further, the CPU 1 sends a command to the servo control unit 55 so as to drive the holding arm 10a in the θ-axis direction, and the servo control unit 55 drives the θ-axis drive unit 62 to thereby coordinate (x1, x The holding arm 10a is moved to the point θ2).

  Next, the CPU 1 sends a command to the servo control unit 55 so as to drive the holding arm 10a in the X-axis direction, and the servo control unit 55 drives the X-axis drive unit 64 so that only the distance L is obtained. After the holding arm 10a is moved in the −X direction, it is moved again in the + X direction. When the edge of the small hole 41 is detected, the movement of the holding arm 10a in the + X direction is stopped, and the CPU 51 acquires the current position of the X axis obtained from the encoder 65 at that time via the servo control unit 55, The coordinates are stored in the RAM 53. In the present embodiment, the X coordinate x2 of the point P3 is stored in the RAM 53.

  Next, the CPU 1 sends a command to the servo control unit 55 so as to drive the holding arm 10a in the X-axis direction, and the servo control unit 55 drives the X-axis drive unit 64 so that only the distance L is obtained. After the holding arm 10a is moved in the + X direction, it is moved again in the -X direction. When the edge of the small hole 41 is detected, the movement of the holding arm 10a in the −X direction is stopped, and the CPU 51 acquires the current position of the X axis obtained from the encoder 65 via the servo control unit 55 at that time. The coordinates are stored in the RAM 53. In the present embodiment, the X coordinate x3 of the point P4 is stored in the RAM 53.

  Next, the CPU 1 reads out the X coordinates x2, x3 from the RAM 53, calculates an average value (X coordinate x4), and an appropriate X axis when the holding arm 10a transports the substrate W to the substrate platform PASS. The position value is stored in the RAM 53. Thus, teaching about the X axis is completed, and the movement to the next unit position is performed in the same manner.

  When teaching of the instructed position is completed, the teaching operation is completed by finally removing the sensing jig 49 and the Z-axis target jig 48 from the holding arms 10a and 10b. In this embodiment, the X-axis position value is obtained after obtaining the θ-axis position value. However, if the mounting table 40 and the Z-axis part 10f are sufficiently separated, the θ-axis position value is obtained after obtaining the X-axis position value. An axis position value may be obtained.

  As described above, according to the transport device according to the present embodiment, it is possible to reduce the burden on the operator during teaching, and to eliminate the positional deviation caused by assembly errors and the like accurately and efficiently in a short time. For teaching about the X-axis and the θ-axis, since the small hole 41 for position identification is formed in the mounting table 40 itself, there is no need to mount a dedicated target jig on the mounting table 40, and the number of parts Can be reduced and work efficiency can be improved.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above examples, and various modifications are possible.

<Modification 1>
In the above description, the transport device having the drive mechanism in each direction of the X axis, the θ axis, and the Z axis has been described, but the present invention can also be applied to a transport device further having a drive mechanism in the Y axis direction.

<Modification 2>
The sensing jig 49 is provided with a limited reflection type optical sensor 43 and a transmission type optical sensor 44. Instead of these sensors 43 and 44, a laser displacement sensor is provided. Also good. 18 is a bottom view showing a configuration of a sensing jig 49 according to the second modification, and FIG. 19 is a cross-sectional view regarding a position along the line XIX-XIX shown in FIG. A laser displacement sensor 70 is disposed at the center of the bottom surface of the main body 42. The laser displacement sensor 70 includes an irradiation unit that irradiates a laser beam and a detection unit that detects a reflected beam, and can detect the distance of the laser beam to the reflection target. Therefore, when the laser displacement sensor 70 is used, the Z-axis target jig 48 is not necessary. When the laser displacement sensor 70 is used, position detection can be performed with higher accuracy than when the optical sensors 43 and 44 are used.

<Modification 3>
In the above description, an example in which the small hole 41 is formed in the mounting table 40 as an identification structure for position identification has been described. However, any structure (such as a structure that can identify a specific portion of the mounting table 40 ( For example, it may be a two-dimensional mark. For example, instead of forming the small holes 41, foreign substances such as magnets may be embedded in the upper surface of the mounting table 40. In this case, a magnetic sensor is used instead of the optical sensor 43.

<Modification 4>
In the above description, an example in which the sensing jig 49 is connected to the control unit 50a via the connector 58 at the time of teaching has been described. However, as a configuration in which position information is exchanged by wireless transmission and reception such as radio wave communication and optical communication. Also good. FIG. 20 is a side view showing a configuration of a sensing jig 49 according to Modification 4. FIG. 21 is a block diagram showing a configuration of a control mechanism according to Modification 4. Referring to FIG. 20, sensor 43 and light irradiating unit 44 a and light receiving unit 44 b of sensor 44 are connected to transmitting unit 71. The transmission unit 71 wirelessly transmits each detection data obtained by the sensors 43 and 44. With reference to FIG. 21, the control unit 50 b includes a receiving unit 72, and the CPU 51 is connected to the receiving unit 72. The receiving unit 72 receives the detection data transmitted from the transmitting unit 71.

  The sensing jig 49 according to the modified example 4 is stored in a predetermined storage position in the substrate processing apparatus when teaching is not performed, and when the instruction for starting teaching is received, the main transport mechanism 10 moves to the storage position. And the sensing jig 49 may be set on the holding arm 10a. Further, a battery for supplying power can be mounted on the sensing jig 49, and the battery can be charged when the sensing jig 49 is waiting at the storage position.

  According to the transport apparatus according to the modified example 4, since the operator can save the trouble of connecting the sensing jig 49 and the control unit 50b by using a wiring or a connector at the time of teaching, workability is improved.

<Modification 5>
FIG. 22 is a side view illustrating the configuration of the transport device according to the fifth modification. 4 shows an arm unit 10e including two holding arms 10a and 10b. However, as shown in FIG. 22, the arm unit 1e according to the modified example 5 has holding arms 10a and 10b that hold the substrate W. As a separate arm, there is provided a holding arm 10g in which the sensing jig 49 is always held exclusively. The holding arm 10g may be disposed above the holding arm 10a, or may be disposed between the holding arm 10a and the holding arm 10b. However, since clean air is supplied in a downflow state inside the substrate processing apparatus, the substrate W is prevented from being contaminated by particles attached to the holding arm 10g and the sensing jig 49. Therefore, it is desirable that the holding arm 10g is disposed below the holding arms 10a and 10b.

  According to the transport device according to the modified example 5, since the operator can save the trouble of attaching the sensing jig 49 to the holding arm 10a during teaching, workability is improved.

<Modification 6>
In the above description, the sensing jig 49 is held by the holding arm 10a. In this state, after the acquisition of the coordinates (x4, θ2) of the center point P5 of the small hole 41 is completed, the sensing jig 49 is attached to the holding arm 10b. In other words, the coordinates of the center point P5 of the small hole 41 may be acquired in the same manner as described above. If an error occurs in the coordinates of the center point P5 before and after the sensing jig 49 is replaced, the error is a positional deviation between the holding arm 10a and the holding arm 10b. X-axis position value and θ-axis position value are set.

<Modification 7>
FIG. 23 is a bottom view showing the configuration of the Z-axis target jig 48a according to Modification 7. FIG. 24 is a cross-sectional view regarding the position along line XXIV-XXIV shown in FIG. In the Z-axis target jig 48 a according to the modified example 7, a small hole 46 having the same shape as the small hole 41 formed in the mounting table 40 is formed at the central portion of the upper surface of the main body 45. Similarly to the above, the Z-axis target jig 48a is mounted on the mounting table 40 by the holding arm 10b with the base value (x0, θ0) as a target. Next, the holding arm 10b is accommodated in the bracket 10d. Next, with the base value (x0, θ0) as a target, the holding arm 10a holding the sensing jig 49 is sent out, and the coordinates of the center point of the small hole 80 are obtained by the sensor 43. When an error occurs between the obtained coordinates of the center point and the base value (x0, θ0), the error is a positional deviation between the holding arm 10a and the holding arm 10b. Thus, the X-axis position value and the θ-axis position value related to the holding arm 10b are set.

  According to the transport device according to the modified example 7, the positional deviation between the holding arm 10a and the holding arm 10b can be obtained, and more accurate teaching can be performed by considering the positional deviation.

It is a top view which shows the structure of the substrate processing apparatus which concerns on embodiment of this invention. It is a front view which shows the structure of a substrate processing apparatus. It is a front view which shows the arrangement configuration of a heat processing part. It is a perspective view which simplifies and shows the structure of the 1st main conveyance mechanism. It is a schematic diagram which shows the structure of a heating part. It is a side view which shows the structure of an interface block. It is a top view which simplifies and shows the structure of a board | substrate mounting part. It is sectional drawing regarding the position along line VIII-VIII shown in FIG. It is a top view which simplifies and shows the structure of a Z-axis target jig. It is sectional drawing regarding the position along line XX shown in FIG. It is a bottom view which simplifies and shows the structure of a sensing jig. It is sectional drawing which shows typically the condition which detects a detection pin with a sensor. It is sectional drawing which shows typically the condition which detects a detection pin with a sensor. It is sectional drawing which shows typically the condition which detects a small hole with a sensor. It is sectional drawing which shows typically the condition which detects a small hole with a sensor. It is a block diagram which shows the structure of a control mechanism. It is a top view which shows typically the condition which is searching for a small hole with a sensor. It is a bottom view which shows the structure of the sensing jig which concerns on the modification 2. It is sectional drawing regarding the position along line XIX-XIX shown in FIG. It is a side view which shows the structure of the sensing jig which concerns on the modification 4. It is a block diagram which shows the structure of the control mechanism which concerns on the modification 4. It is a side view which shows the structure of the conveying apparatus which concerns on the modification 5. It is a bottom view which shows the structure of the Z-axis target jig which concerns on the modification 7. FIG. FIG. 24 is a cross-sectional view regarding a position along line XXIV-XXIV shown in FIG. 23.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Indexer block 2 Antireflection film processing block 3 Resist film processing block 4 Development processing block 5 Interface block 10A 1st main transport mechanism 10B 2nd main transport mechanism 10C 3rd main transport mechanism 10D 4th main transport mechanism 10a, 10b, 10g Holding arm 40 Mounting table 41, 80 Small hole 42, 45 Main body 43 Sensor 44a Light irradiation unit 44b Light receiving unit 46 Detection pin 48, 48a Z-axis target jig 50a, 50b Control unit 51 CPU
71 Transmitter 72 Receiver W Substrate

Claims (10)

An arm unit having an arm;
A mounting table capable of mounting the substrate transported by the arm unit and having an upper surface in which a first small hole for position identification is formed at a predetermined position;
First control means for moving the arm in the horizontal direction in the vicinity of the mounting table in a state where a sensing jig having first detection means is held by the arm;
A transport apparatus, comprising: a first setting unit configured to set a horizontal position at which the arm transports the substrate based on information on a position at which the first detection unit detects the first small hole . The transport apparatus according to claim 1, wherein the first detection unit is a limited reflection optical sensor that detects the first small hole . The sensing jig further includes first transmission means for wirelessly transmitting first data related to a detection result by the first detection means,
Said first setting means that having a first receiving means for receiving said first data transmitted from said first transmitting means, the transport apparatus according to claim 1 or claim 2. The sensing jig further includes a transmissive optical sensor having a light irradiation unit and a light receiving unit facing each other along the horizontal direction as a second detection unit ,
The transfer device
In the state where the target jig on which the projections to be detected by the second detection means are formed at predetermined positions is placed on the mounting table and the sensing jig is held by the arm, the vicinity of the target jig And a second control means for moving the arm in the height direction,
Second setting means for setting a position in a height direction in which the arm conveys the substrate based on a height of a boundary of whether or not the protrusion can be detected by the second detection means;
Further Ru comprising a conveying device according to any one of claims 1 to 3. The sensing jig further has a second transmission unit for the second data wirelessly transmits to the detection result by the second detection means,
It said second setting means that having a second receiving means for receiving the second data transmitted from said second transmission means, the conveying device according to 請 Motomeko 4. The arm unit includes a first arm that holds the sensing jig during teaching, and a second arm that holds the target jig during teaching .
The target jig is further formed with a second small hole for position identification at a predetermined location,
The transfer device
After the target jig is transported onto the mounting table by the second arm, the first arm is moved in the horizontal direction in the vicinity of the target jig with the sensing jig held by the first arm. 3rd control means to move to,
Third setting means for setting a horizontal position deviation between the first arm and the second arm based on information on a position where the first detection means detects the second small hole;
Further Ru comprising a conveying device according to claim 4 or claim 5. The arm unit is, as the arms separate from the arm that can hold the substrate, that having a dedicated arm sensing jig is held, transported according to any one of claims 1 to claim 6 apparatus. A processing unit that performs predetermined processing on the substrate is provided,
A substrate processing apparatus comprising the transfer device according to claim 1 as a transfer device that carries the substrate in and out of the processing unit. 8. The jig according to claim 1, wherein the jig is used when teaching the horizontal transfer position on the mounting table, on which the substrate is to be transferred by the arm. And
A main body that can be held by the arm;
A limited reflection type optical sensor disposed at a predetermined location of the main body and having the first small hole as a detection target;
Jig with . On the mounting table described above, the transfer unit includes an arm unit having an arm capable of holding a substrate and a mounting table on which the substrate transferred by the arm unit can be mounted. Teaching the horizontal transport position of
(A) holding a sensing jig having detection means on the arm;
(B) a step of moving the arm holding the sensing jig in the horizontal direction in the vicinity of the mounting table having an upper surface in which a small hole for position identification is formed at a predetermined location;
(C) obtaining information on a position where the detection means detects the small hole;
(D) A teaching method comprising: setting the transport position based on the position information .

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