JP4123190B2 - Floor heating panel - Google Patents

Description

  The present invention relates to a floor heating panel in which a hot water pipe is disposed inside a floor material.

  Conventionally, various types of floor heating panels in which hot water pipes are arranged inside the flooring material are known. For example, as disclosed in JP-A-8-128658, an opening is provided on the back surface of the flooring material. In some cases, the downward groove portion is recessed, a hot water pipe is disposed in the downward groove portion, and a soaking plate is disposed over the outermost surface of the flooring. Such a floor heating panel typically has a structure as illustrated in FIG. 3, and is advantageous in that it has excellent temperature rise performance of the floor surface 8 because the floor material 1 above the hot water pipe 4 is thin. However, there is also a problem that temperature unevenness of the floor surface 8 is likely to occur.

That is, in order to improve such a problem, for example, as shown in FIG. 3, in the floor heating panel A-0 according to the conventional example, the heat equalizing plate 5 is provided, while the bottom surface 9 of the downward groove 3 and the hot water pipe are provided. Measures such as forming the space 7 between the two and the hot water pipe 4 and the heat equalizing plate 5 directly are taken, but still the above problems are not solved completely. Not reached. In particular, as an unsolved problem left here, the heat absorption efficiency of the radiant heat from the lower side surface 16 of the hot water pipe 4 is low because the heat absorption rate of aluminum that is normally used as the soaking plate 5 is small. The radiant heat from the lower surface 16 of the hot water pipe 4 is difficult to be efficiently transmitted to the soaking plate 5.
JP-A-8-128658

  This invention is invented in view of the said background art, The subject is providing the floor heating panel which can achieve more efficiently the heat transfer from a warm water pipe to a heat equalizing board.

In order to solve the above-mentioned problem, in the floor heating panel of the invention according to claim 1, the downward groove portion opened in the back surface of the flooring is recessed, the hot water pipe is disposed in the downward groove portion, and In the floor heating panel formed by covering and arranging the soaking plate over the back surface of the floor material, a floor heating panel in which a heat radiation layer is interposed between the back surface of the floor material and the soaking plate , Covering all or part of the upper surface of the hot water pipe with a second heat equalizing plate formed by adhering a second heat radiation layer to the back side surface, and the end of the second heat equalizing plate Connected to the soaking plate in contact with the lower surface of the hot water pipe, conducts heat from the upper surface of the hot water pipe to the soaking plate, and radiates heat from the lower surface of the hot water pipe to the vertical of the second heat radiation layer. To the soaking plate via the heat sink and the second soaking plate on the back side It is characterized in that those cormorants configured.

  In the floor heating panel of the present invention, a downward groove portion opened on the back surface of the floor material is recessed, a hot water pipe is disposed in the downward groove portion, and a soaking plate is disposed over the back surface of the floor material. In the floor heating panel formed, a heat radiation layer is interposed between the back surface of the flooring and the soaking plate, so that heat transfer from the hot water pipe to the soaking plate can be achieved more efficiently, and as a result, The temperature unevenness on the floor will be alleviated.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the floor heating panel of this invention is not limited only to the following embodiment, Of course, it can add various changes within the range which does not deviate from the summary of this invention.

[ Reference example ]
FIG. 1 schematically shows an outline of a main part of a floor heating panel which is a reference example of the present invention, in which (a) is a cross-sectional view and (b) is an enlarged cross-sectional view thereof. That is, in the floor heating panel A-1 of the present reference example , the downward groove 3 opened on the back surface 2 of the floor material 1 is recessed, the hot water pipe 4 is disposed in the downward groove 3, and the floor material 1 A soaking plate 5 is placed over the back surface. Here, the flooring 1 is made of plywood having a thickness of 12 mm, the hot water pipe 4 is made of cross-linked polyethylene having an outer diameter of 7.2 mm, the soaking plate 5 is made of aluminum foil having a thickness of 150 μm, Similar to the floor heating panel A-0 according to the conventional example shown in FIG. 3, a space 7 is provided between the bottom surface 9 of the downward groove 3 and the hot water pipe 4, and the upper floor material is locally disposed. By avoiding heating, it can contribute to alleviating uneven temperature on the floor.

Furthermore, in the floor heating panel A-1 of the present reference example , a heat radiation layer 6 is interposed between the back surface 2 of the flooring 1 and the soaking plate 5. That is, if the aluminum soaking plate 5 having a small radiant heat absorption rate is exposed, the heat absorbing efficiency of the radiant heat from the lower surface 16 of the hot water pipe 4 in the soaking plate 5 is low, and the soaking plate 5 has a hot water pipe. 4 is solved by interposing the heat radiation layer 6 having a high radiant heat absorption rate, and the heat absorption efficiency of the radiant heat soaking plate 5 is reduced. It is intended to substantially improve the above.

Specifically, the heat radiation layer 6 is formed by adding and dispersing a material having a high radiant heat absorption rate such as carbon in a hot melt resin, and applying the material on a predetermined surface of the soaking plate 5;
Alternatively, it can be achieved by a method of applying a resin material having a high radiant heat absorption rate, for example, a film (thickness: about 10 to 15 μm, for example) made of PET (polyethylene terephthalate).

  As a result, heat transfer from the hot water pipe 4 to the soaking plate 5 is achieved more efficiently, and temperature unevenness on the floor surface 8 is alleviated. It should be noted that the material configuration, material, thickness, formation method, and the like of the heat radiation layer 6 are not limited to these, and it goes without saying that there are no restrictions as long as it contributes to the solution of the above problems.

First Embodiment
On the other hand, FIG. 2 schematically shows the outline of the main part of the floor heating panel according to the first embodiment of the present invention different from the above, (a) is a cross-sectional view, and (b) is an enlarged view thereof. It is sectional drawing. That is, in the floor heating panel A-2 of the present embodiment, the downward groove 3 opened in the back surface 2 of the flooring 1 is recessed, as in the floor heating panel A-1 of the first embodiment. A hot water pipe 4 is disposed in the groove 3 and a soaking plate 5 is disposed over the outermost back surface of the flooring 1. Further, the back surface 2 of the flooring 1 and a soaking plate are provided. 5 has a heat radiation layer 6 interposed therebetween.

  In addition to this, the floor heating panel A-2 of the present embodiment includes a second heat equalizing plate 10, which covers all or part of the upper side surface 11 of the hot water pipe 4, The end 12 of the soaking plate 10 is connected to the soaking plate 5. Similarly to the soaking plate 5, the second soaking plate 10 is also made of aluminum or the like having a low heat radiation efficiency (that is, a low radiant heat absorption rate), and the upper side surface 11 of the hot water pipe 4. Therefore, the heat radiation to the bottom surface 9 and the side surface 13 of the downward groove 3 can be suppressed, and local heating of the upper floor material can be avoided to contribute to the relief of temperature unevenness on the floor surface. On the other hand, the upper side surface 11 of the hot water pipe 4 is covered with an aluminum second heat equalizing plate 10 having excellent heat conductivity and high heat equalizing effect, and the end of the second heat equalizing plate 10 is also covered. Since the part 12 is connected to the soaking plate 5, the heat from the upper side surface 11 of the hot water pipe 4 is effectively conducted to the soaking plate 5.

  Furthermore, in the floor heating panel A-2 of the present embodiment, a second heat radiation layer 15 that is in close contact with the back side surface 14 of the second heat equalizing plate 10 is formed. The second heat radiation layer 15 can also be formed in the same manner using the same material as that of the heat radiation layer 6. As a result, the radiant heat from the lower surface 16 of the hot water pipe 4 is routed through the vertical portion 17 of the second heat radiation layer 15 and the second heat equalizing plate 10 on the back side or through the heat radiation layer 6. Thus, the heat can be efficiently led to the soaking plate 5. As a result, heat transfer from the hot water pipe 4 to the soaking plate 5 is achieved more efficiently, and the temperature unevenness on the floor surface 8 is more efficiently mitigated.

BRIEF DESCRIPTION OF THE DRAWINGS The outline of the principal part of the floor heating panel which is a reference example of this invention is shown typically, (a) is sectional drawing, (b) is the expanded sectional view. BRIEF DESCRIPTION OF THE DRAWINGS The outline of the principal part of the floor heating panel which is the 1st Embodiment of this invention is shown typically, (a) is sectional drawing, (b) is the expanded sectional view. The outline of the principal part of the floor heating panel which concerns on a prior art example is shown typically, (a) is sectional drawing, (b) is the expanded sectional view.

Explanation of symbols

1 flooring 2 back side (flooring 1)
3 Downward groove (Back 2)
4 Hot water pipe 5 Heat equalizing plate 6 Thermal radiation layer 7 Space 8 Floor surface 9 Bottom surface (downward groove 3)
10 Second soaking plate 11 Upper surface (hot water pipe 4)
12 end (second soaking plate 10)
13 Side (downward groove 3)
14 Back side (second soaking plate 10)
15 Second heat radiation layer 16 Lower side surface (hot water pipe 4)
17 Vertical portion (second heat radiation layer 15)
18 Hot melt A Floor heating panel A-0 Floor heating panel (conventional example)
A-1 Floor heating panel A-2 Floor heating panel

Claims (1)

In the floor heating panel formed by recessing a downward groove opening on the back surface of the flooring, arranging a hot water pipe in the downward groove, and covering and arranging a soaking plate over the backmost surface of the flooring, It is a floor heating panel in which a heat radiation layer is interposed between the back surface of the flooring and the heat equalizing plate, and a second heat equalizing plate in which a second heat radiation layer is formed in close contact with the back side surface. Covering all or part of the upper surface of the hot water pipe and connecting the end of the second heat equalizing plate to the heat equalizing plate in contact with the lower surface of the hot water pipe, Heat is conducted to the heat equalizing plate, and radiant heat from the lower surface of the hot water pipe is routed through the vertical portion of the second heat radiating layer and the second heat equalizing plate on the back side, or through the heat radiating layer. The floor heating panel is configured to be transmitted to a soaking plate .

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