JP4172553B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus.
[0002]
[Prior art]
Such a substrate processing apparatus carries a substrate to be processed from the previous process in a state of being stored in a substrate transfer cassette, and stores the processed substrate in a substrate transfer cassette again and discharges it. A first interface unit having a mounting unit, a chemical processing unit such as a spin coater or a spin developer that performs chemical processing by supplying a chemical to the substrate, and a hot plate or a cool plate that performs heat processing by heating or cooling the substrate A heat treatment unit such as a chemical treatment unit and a substrate processed in the heat treatment unit are transported to an exposure apparatus connected to the substrate processing apparatus, and a substrate for which exposure has been completed by the exposure apparatus is carried in 2 interface section, first interface section, chemical processing unit, heat treatment And a transport unit that transports the substrate between the units and the second interface unit is performed the processing by sequentially conveying a chemical liquid treatment unit and the thermal processing unit of the substrate from the first or second interface unit.
[0003]
[Problems to be solved by the invention]
In such a substrate processing apparatus, when a substrate processing failure occurs due to an operation failure of the first or second interface unit, the chemical solution processing unit, the heat treatment unit, or the transfer unit, the substrate having the processing failure is generated. When the subsequent processing is continued as it is, there arises a problem that the chemical solution is wasted in the chemical solution processing unit, or more time is required for processing the substrate.
[0004]
More specifically, in a chemical processing unit such as a spin coater or a spin developer, a problem arises in the operation of the chemical processing unit such as a problem in the rotational coating operation of the substrate or a lack of the flow rate of the chemical to be applied to the substrate. Substrate processing defects may occur. In addition, after the substrate is transferred to the hot plate and the heat treatment is started, the substrate may not be ejected from the hot plate even after the set time has elapsed, resulting in a substrate processing failure due to a malfunction of the transfer unit or the like. is there. Further, there is a case where a substrate processing failure due to an operation failure of the transport unit or the like occurs such that the substrate cannot be transported to the cool plate within a predetermined time after the heating processing of the substrate by the hot plate.
[0005]
When such a substrate processing failure occurs, the substrate cannot be used for manufacturing a product. However, in the conventional substrate processing apparatus, the same processing as that of a normal substrate is performed even on a substrate on which a processing defect has occurred.
[0006]
For this reason, for example, in a chemical processing unit, a chemical is applied even to a substrate having a defective processing, and an expensive chemical is consumed wastefully. In this type of substrate processing apparatus, a buffer cassette is disposed in the second interface unit or the like in order to eliminate the difference in substrate processing speed from the subsequent exposure apparatus or the like. In the case where the substrate having the problem is stored, the substrate processing efficiency of the entire substrate processing apparatus is lowered. Furthermore, even when the substrate is transported to another apparatus such as an exposure apparatus for processing, the same processing as that for a normal substrate is performed on the substrate where the processing failure has occurred, and the entire substrate processing is performed. Efficiency will decrease.
[0007]
The present invention has been made to solve the above-described problems, and a substrate processing apparatus and a substrate processing method capable of efficiently processing a substrate by effectively collecting a substrate in which a processing defect has occurred. The purpose is to provide.
[0008]
[Means for Solving the Problems]
The invention according to claim 1 includes a plurality of interface units for carrying in the substrate from the previous process or discharging the substrate to the subsequent process, and a chemical processing unit for processing the chemical by supplying the chemical to the substrate. In the substrate processing apparatus having a processing unit and a transport unit for sequentially transporting a substrate carried into the interface unit to a plurality of processing units including the chemical processing unit, the interface for storing a substrate in which a processing defect has occurred A defective substrate collection cassette disposed in a section, a detecting means for detecting the occurrence of a processing failure of the substrate due to an operation failure of the interface section, each processing unit or the transport unit, and the occurrence of a processing failure by the detecting means. If detected, by controlling the transport unit, the substrate with the processing failure is transferred to the substrate. After passing through the respective processing units in a state that does not supply the liquid, characterized in that a control means for storing the defective substrate collection cassette.
[0009]
The invention according to claim 2 includes a plurality of interface units for carrying in the substrate from the previous process or discharging the substrate to the subsequent process, and a chemical processing unit for processing the chemical by supplying the chemical to the substrate. A substrate processing apparatus having a processing unit and a transport unit that transports a substrate between the interface unit and a plurality of processing units including the chemical solution processing unit is used, and the substrate is sequentially transported from the interface unit to each processing unit. In the substrate processing method for performing the processing, the transport unit is controlled when the detection unit detects the occurrence of the processing failure of the substrate due to the operation failure of the interface unit, each processing unit or the transport unit. Each processing unit in a state where no chemical solution is supplied to the substrate. After passing, characterized in that housed in the defective substrate recovery cassette disposed in the interface unit.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a substrate processing apparatus according to the present invention.
[0011]
The substrate processing apparatus includes a first interface unit 12, a spin coater 13 and a spin developer 14 as chemical processing units, a hot plate 15 and a cool plate 16 as heat treatment units, a substrate transport unit 17, and a second interface. The unit 18 and a main controller 19 as control means.
[0012]
The first interface unit 12 carries in the substrate W to be processed from the previous process in a state of being stored in the substrate transport cassette 1, and stores the processed substrate W in the substrate transport cassette 1 again and discharges it. For this purpose, the substrate transport cassette 1 and the defective substrate recovery cassette 2 are placed on the placement unit 31 and the substrate W is taken out of the substrate transport cassette 1, or the substrate transport cassette 1 or the defective substrate recovery cassette is removed. 2 includes a substrate loading / unloading mechanism 33 having a transfer arm 32 for storing a substrate W, and an interface controller 21.
[0013]
The spin coater 13 is for performing resist coating processing by supplying a resist as a chemical solution to the substrate W transported from the previous process, while rotating the substrate W held in the horizontal direction around the vertical axis. A coating unit 34 for supplying and coating a resist on the substrate W and a spin coater controller 22 are provided.
[0014]
The spin developer 14 is for applying a developing solution as a chemical solution to the substrate W that has been exposed in an exposure apparatus (not shown) and developing the substrate W. The substrate W held in the horizontal direction is rotated around the vertical axis. A developing unit 35 that supplies a developing solution to the substrate W while being rotated, and a spin developer controller 23 are provided.
[0015]
The hot plate 15 and the cool plate 16 as the heat treatment unit are for heating and cooling the substrate W after the resist coating process or the substrate W before the development process, respectively. And a heat treatment unit controller 26 that collectively controls the hot plate 15 and the cool plate 16.
[0016]
The second interface unit 18 is used to carry the substrate W, which has been subjected to resist coating and heat treatment in the substrate processing apparatus, to an exposure apparatus (not shown) and to carry in a substrate that has been exposed by the exposure apparatus. A placement unit 36 for placing the substrate collection cassette 2 and the buffer cassette 3, an exposure feed table 37 for sending the substrate W to an exposure device (not shown), and a substrate W that is exposed by the exposure device. A transport arm for transporting the substrate toward the exposure return table 38 and the defective substrate collection cassette 2, the buffer cassette 3 or the exposure feed table 37 and for receiving the substrate W from the buffer cassette 3 or the exposure return table 38. The board | substrate carrying-in / out mechanism 41 which has 39, and the interface part controller 24 are provided. .
[0017]
The substrate transport unit 17 places the substrate W between the transport arm 32 of the first interface unit 12, the spin coater 13, the spin developer 14, the hot plate 15, the cool plate 16, and the transport arm 39 of the second interface unit 18. The transfer arm 42 is movable in the X, Y, Z, and θ directions, and the substrate transfer unit controller 25 is provided. The transport arm 42 in the substrate transport unit 17 is connected to the transport arm 32 of the first interface unit 12, the spin coater 13, the spin developer 14, the hot plate 15, the cool plate 16, and the transport arm 39 of the second interface unit 18. On the other hand, in order to simultaneously carry in and carry out the substrate W, it has a pair of arms arranged so as to overlap each other.
[0018]
The main controller 19 is for controlling the entire substrate processing apparatus, and includes a ROM that stores an operation program necessary for controlling the entire substrate processing apparatus, and a RAM that temporarily stores data during control. And a CPU that executes logical operations.
[0019]
The main controller 19 includes the first and second interface units 12 and 18, the spin coater 13, the spin developer 14, the hot plate 15, the cool plate 16, and the substrate transport unit 17 (hereinafter referred to as “each unit”). Are connected to the above-described interface controller 21, 24, spin coater controller 22, spin developer controller 23, substrate transport unit controller 25, and heat treatment controller 26. Further, as shown in FIG. 2, the main controller 19 is also connected to a CRT 43 as display means and a keyboard 44 as input means.
[0020]
The main controller 19 is connected to the interface controllers 21 and 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, and the heat treatment unit controller 26 for individually controlling each unit of the substrate processing apparatus. Thus, ID data used to identify each substrate W to be processed is exchanged. As shown in FIG. 3, the ID data includes a cassette number, a cassette groove number, a recipe number, and flag information for identifying a substrate W on which a processing failure described later has occurred.
[0021]
In such a substrate processing apparatus, the substrate W carried into the first interface unit 12 while being stored in the substrate transport cassette 1 is transported to the hot plate 15 by the substrate transport unit 17 and heated by the hot plate 15. After being dehydrated and baked, it is cooled by the cool plate 16. The substrate W is coated with a resist in the spin coater 13. Thereafter, the substrate W is heated by the hot plate 15 and prebaked, then cooled by the cool plate 16 and conveyed to the exposure apparatus (not shown) via the second interface unit 18. At this time, the substrate W is temporarily stored in the buffer cassette 3 as necessary in order to eliminate the difference in processing speed between the substrate processing apparatus and the exposure apparatus.
[0022]
On the other hand, the substrate W that has been exposed in the exposure apparatus is transferred from the second interface unit 18 to the hot plate 15 by the substrate transfer unit 17 and heated by the hot plate 15 to be subjected to post-exposure baking (PEB). Cooled by the cool plate 16. Then, the substrate W is developed by the spin developer 14. Thereafter, the substrate W is heated by the hot plate 15 and post-baked, then cooled by the cool plate 16, and conveyed toward the subsequent processing step via the first interface unit 12.
[0023]
Next, in the substrate processing apparatus, a configuration for dealing with a processing failure of the substrate W caused by an operation failure of each unit will be described.
[0024]
The interface controllers 21 and 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, and the heat treatment unit controller 26 for individually controlling each unit of the substrate processing apparatus described above are included in each unit in the substrate processing apparatus. When a processing failure occurs on the substrate W due to an operation failure, it also functions as a detection unit that detects the occurrence of the processing failure.
[0025]
That is, each unit of the substrate processing apparatus is provided with various detectors for monitoring whether or not each unit is operating normally, and includes interface controllers 21 and 24, a spin coater controller 22 and a spin coater controller 22. The developer controller 23, the substrate transport unit controller 25, and the heat treatment unit controller 26 receive signals from these detectors, thereby detecting the occurrence of a processing failure of the substrate W due to an operation failure in each unit. When the interface unit controllers 21 and 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, and the heat treatment unit controller 26 detect the occurrence of the substrate W processing defect, the substrate W shown in FIG. A flag is set in the ID data, and the ID data is transferred to the main controller 19.
[0026]
The operation for detecting the processing failure will be specifically described by taking the spin coater 13 as an example among the units in the substrate processing apparatus. FIG. 2 is an explanatory diagram showing an outline of a processing failure detection mechanism in the spin coater 13 as one of the units described above.
[0027]
As described above, the spin coater 13 includes the coating unit 34 for supplying and applying a resist to the substrate W and the spin coater controller 22. The coating unit 34 holds the substrate W by driving the motor 51 and rotates the spin chuck 52, a resist discharge nozzle 53 for discharging resist toward the substrate W, and the resist discharge nozzle 53 by driving the motor 54. A nozzle moving mechanism 55 for moving the resist between the resist supply position facing the substrate W and the standby position, and a pump 57 for feeding the resist stored in the resist storage tank 56 toward the resist discharge nozzle 53. Have.
[0028]
The rotation status of the motor 51 is monitored by the rotary encoder 61, and the rotation status of the motor 54 is monitored by the rotary encoder 62. Further, the flow rate of the resist fed by the pump 57 toward the resist discharge nozzle 53 is monitored by a flow meter 63. The rotary encoders 61 and 62 and the flow meter 63 are connected to the spin coater controller 22.
[0029]
Therefore, when an abnormality occurs in the operation of the motors 51 and 54 or the pump 57, the spin coater controller 22 receives signals from the rotary encoders 61 and 62 or the flow meter 63, so that the spin coater 13 operates. It is detected that a processing failure of the substrate W due to the failure has occurred. Then, the spin coater controller 22 sets a flag on the ID data of the substrate W shown in FIG. 3 and transfers this ID data to the main controller 19.
[0030]
On the other hand, the main controller 19 displays the occurrence of processing failure on the CRT 43, and the ID data of the substrate W on which processing failure has occurred is transferred to the interface controllers 21, 24, the spin developer controller 23, the substrate transport unit controller 25, and the heat treatment unit. Transfer to the controller 26. Then, as will be described later, the transfer arm 42 is controlled via the substrate transfer unit controller 25 of the substrate transfer unit 17, and the substrate W in which the processing failure has occurred is stored in the substrate transfer cassette 1 or the defective substrate collection cassette 2.
[0031]
The interface controllers 21, 24, the spin developer controller 23, the substrate transport unit controller 25, and the heat treatment controller 26 also process the substrate W caused by the malfunction of each unit by various detectors, like the spin coater controller 22. By detecting the occurrence of a defect, a flag is set on the ID data of the substrate W, and this ID data is transferred to the main controller 19.
[0032]
Next, in this substrate processing apparatus, a processing operation according to the first embodiment when a processing failure of the substrate W due to an operation failure of each unit occurs will be described.
[0033]
In FIG. 4, the main controller 19 receives ID data of the substrate W on which a processing failure has occurred from the interface controllers 21 and 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, or the heat treatment unit controller 26. It is a flowchart which shows the processing operation after.
[0034]
As described above, any of the interface unit controllers 21 and 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, and the heat treatment unit controller 26 causes malfunction of each unit by various detectors. By detecting the occurrence of a processing defect on the substrate W due to the above, a flag is set on the ID data of the substrate W, and if this ID data is transferred to the main controller 19, the main controller 19 is connected to the interface controller 21, 24, This ID data is transferred to the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, and the heat treatment unit controller 26 (hereinafter referred to as “each controller” if necessary). Step S11).
[0035]
Further, the main controller 19 controls the transport arm 42 via the substrate transport unit controller 25 of the substrate transport unit 17, and the substrate W on which the processing failure has occurred is placed on the placement unit 31 of the first interface unit 12. After being stored in the defective substrate collection cassette 2 (step S12), the occurrence of processing failure is displayed on the CRT 43 (step S13). The defective substrate W stored in the defective substrate recovery cassette 2 is sent to the substrate regeneration process.
[0036]
Next, in this substrate processing apparatus, a processing operation according to the second embodiment when a processing failure of the substrate W due to an operation failure of each unit occurs will be described.
[0037]
In FIG. 5, as in FIG. 4, the main controller 19 receives interface defects from the interface controllers 21 and 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, or the heat treatment unit controller 26. It is a flowchart which shows the processing operation after ID data is transferred.
[0038]
Various types of detectors allow any one of the interface unit controllers 21, 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, or the heat treatment unit controller 26 to cause the substrate W caused by the malfunction of each unit. By detecting the occurrence of the processing failure, a flag is set on the ID data of the substrate W, and when this ID data is transferred to the main controller 19, the main controller 19 transfers this ID data to each controller ( Step S21).
[0039]
Further, the main controller 19 determines whether the substrate W on which the processing failure has occurred is before being transferred to the exposure apparatus or whether exposure has already been completed by the exposure apparatus (step S22).
[0040]
Then, the substrate W in which the processing failure has occurred is sequentially passed through each unit in the same process as that of the normal substrate W, and is mounted on the interface unit that passes next among the first interface unit 12 and the second interface unit 18. The defective substrate collection cassette 2 is stored. More specifically, when the substrate W on which a processing defect has occurred is a pre-exposure substrate, the substrate W is mounted on the mounting unit 36 of the second interface unit 18 by the substrate transport unit 17. The substrate is stored in the substrate recovery cassette 2 (step S24). Further, when the substrate W on which the processing defect has occurred is after exposure, the defective substrate collection cassette 2 on which the substrate W is mounted on the mounting unit 31 of the first interface unit 12 by the substrate transport unit 17. (Step S23).
[0041]
Then, the occurrence of processing failure is displayed on the CRT 43 (step S25). The defective substrate W stored in the defective substrate recovery cassette 2 is sent to the substrate regeneration process.
[0042]
In the process of sequentially transporting the substrate W in which the above-described processing failure has occurred to each unit in the same process as the normal substrate W, the spin coater 13 or the spin developer 14 is based on the ID data transferred from the main controller 19. Only the operation of simply passing through the substrate W is executed. That is, in the spin coater 13 and the spin developer 14, the substrate W is placed on the coating unit 34 and the developing unit 35, but no resist or developer is supplied to the substrate W. For this reason, it can prevent that an expensive chemical | medical solution is consumed wastefully.
[0043]
Next, in this substrate processing apparatus, a processing operation according to the third embodiment when a processing failure of the substrate W due to an operation failure of each unit occurs will be described.
[0044]
In FIG. 6, as in FIG. 4, the main controller 19 receives interface defects from the interface controllers 21 and 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, or the heat treatment unit controller 26. It is a flowchart which shows the processing operation after ID data is transferred.
[0045]
Various types of detectors allow any one of the interface unit controllers 21, 24, the spin coater controller 22, the spin developer controller 23, the substrate transport unit controller 25, or the heat treatment unit controller 26 to cause the substrate W caused by the malfunction of each unit. By detecting the occurrence of the processing failure, a flag is set on the ID data of the substrate W, and if this ID data is transferred to the main controller 19, this ID data is transferred to each controller (step S31).
[0046]
Further, the main controller 19 controls the transport arm 42 via the substrate transport unit controller 25 of the substrate transport unit 17, and the substrate W on which the processing failure has occurred is placed on the placement unit 31 of the first interface unit 12. After being stored in the substrate transport cassette 1 (step S32), the occurrence of processing failure is displayed on the CRT 43 (step S33).
[0047]
At this time, the substrate W on which the processing failure has occurred is quickly taken out from the substrate transport cassette 1 by the operator and sent to the substrate regeneration process. However, in order to cope with the case where the substrate W in which the processing failure has occurred is not quickly taken out from the substrate transport cassette 1, the substrate W in which the processing failure has occurred is the position where the substrate W should originally be stored in the substrate transport cassette 1. It is stored in.
[0048]
Also in the case of the third embodiment, as in the case of the second embodiment described above, after the substrate W in which the processing failure has occurred is sequentially passed through each unit in the same process as the normal substrate W, the substrate is You may make it accommodate in the conveyance cassette 1. FIG.
[0049]
Each of the spin coater 13 and spin developer 14 as the chemical solution processing unit and the hot plate 15 and the cool plate 16 as the heat treatment unit in the embodiment of the invention corresponds to each processing unit in the claims.
[0050]
Moreover, although the case where the chemical solution processing unit is a spin coater and a spin developer has been described in the embodiment of the present invention, the present invention is not limited thereto, and includes a case where the substrate is a unit for cleaning a substrate using a cleaning solution.
[0051]
【The invention's effect】
According to the invention described in claim 1 or claim 2, since the substrate in which the processing failure has occurred is allowed to pass through each processing unit without supplying the chemical solution to the substrate, and then stored in the defective substrate recovery cassette. It is possible to solve the problem that the chemical solution is wasted in the chemical solution processing unit. Further, even when the substrate is transferred to another apparatus such as an exposure apparatus for processing, the defective substrate is not processed, so that the overall efficiency of the substrate processing can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view of a substrate processing apparatus according to the present invention.
FIG. 2 is an explanatory diagram showing an outline of a processing failure detection mechanism in a spin coater 13;
FIG. 3 is an explanatory diagram of ID data.
FIG. 4 is a flowchart showing a processing operation after the main controller 19 has transferred ID data of a substrate W on which a processing failure has occurred from each controller.
FIG. 5 is a flowchart showing a processing operation after the main controller 19 has transferred ID data of a substrate W on which a processing failure has occurred from each controller.
FIG. 6 is a flowchart showing a processing operation after the main controller 19 has transferred ID data of a substrate W on which a processing failure has occurred from each controller.
[Explanation of symbols]
1 Substrate transport cassette
2 defective substrate collection cassette
12 First interface section
13 Spin coater
14 Spin Developer
15 Hot plate
16 Cool plate
17 Substrate transport unit
18 Second interface section
19 Main controller
21 Interface controller
22 Spin coater controller
23 Spin Developer Controller
24 Interface controller
25 Board transfer unit controller
26 Heat treatment section controller
31 Placement section
33 Board loading / unloading mechanism
36 Placement section
41 Board loading / unloading mechanism
42 Substrate transfer arm

Claims (2)

Loading the substrate from the previous process or discharging the substrate to the subsequent process, a plurality of processing units including a chemical processing unit for processing a chemical by supplying a chemical to the substrate, and loading into the interface In a substrate processing apparatus having a transport unit that sequentially transports the processed substrate to a plurality of processing units including the chemical processing unit,
A defective substrate collection cassette disposed in the interface unit for storing substrates with processing defects;
Detecting means for detecting the occurrence of a processing failure of the substrate due to an operation failure of the interface unit, each processing unit or the transport unit;
When the processing means detects the occurrence of a processing failure, the processing unit controls the substrate so that the processing failure is caused to pass through each processing unit without supplying a chemical solution to the substrate. Control means for storing in the substrate recovery cassette;
A substrate processing apparatus comprising: A plurality of processing units including an interface unit for carrying a substrate from a previous process or discharging a substrate to a subsequent process, a chemical processing unit for processing a chemical by supplying a chemical to the substrate, the interface unit, Substrate processing that uses a substrate processing apparatus having a transport unit that transports a substrate to and from a plurality of processing units including a chemical processing unit, and performs processing by sequentially transporting the substrate from the interface unit to each processing unit. In the method
When the detection unit detects the occurrence of a processing failure of the substrate due to the operation failure of the interface unit, each processing unit or the transport unit, the substrate in which the processing failure has occurred is controlled on the substrate by controlling the transport unit. A substrate processing method comprising: passing each processing unit without supplying a chemical solution; and then storing the processing unit in a defective substrate recovery cassette disposed in the interface unit.

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