JP4146286B2 - Electronic circuit board housing case - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a housing case for an electronic circuit board, and more particularly, among electronic parts mounted on the electronic circuit board, an electronic part that needs to be radiated is disposed in a region filled with resin and radiated through the resin. The present invention relates to a storage case for an electronic circuit board.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in order to improve heat dissipation of electronic components mounted on an electronic circuit board and the strength of solder connection portions, it has been widely performed to fill a resin in a housing case of the electronic circuit board.
[0003]
However, some electronic components do not require active heat dissipation, and filling the entire housing case with resin is not always efficient from the viewpoint of the amount of filled resin.
[0004]
Thus, for example, in the techniques described in Patent Document 1 and Patent Document 2, a space in which the electronic circuit board is accommodated is divided into a resin-filled region filled with resin, and a non-resin-filled region not filled with the resin. In addition to the electronic components mounted on the electronic circuit board, the electronic components that need to be dissipated are placed in the resin-filled area and molded with resin to ensure heat dissipation of the electronic components that require heat dissipation. However, it is proposed to reduce the amount of filled resin.
[0005]
[Patent Document 1]
Utility Model Registration No. 2602612 (paragraphs 0007 to 0010, FIG. 2 etc.)
[Patent Document 2]
JP 2001-326306 A (paragraphs 0012 to 0014, FIG. 1, FIG. 2, etc.)
[0006]
[Problems to be solved by the invention]
However, in the techniques described in Patent Document 1 and Patent Document 2 described above, only the electronic component is resin-molded. Therefore, when the electronic circuit board vibrates, the substrate and the resin-molded electronic component Differences in amplitude and period occur between the components, and stress concentrates on the solder connection portion of the resin-molded electronic component, which may damage the solder connection portion (generate a crack or the like).
[0007]
Furthermore, since the electronic component is pressed in the direction of the board due to the thermal expansion of the resin, the stress is concentrated on the solder connection portion, and if the electronic component is a discrete component, for example, the lead may be removed. There was a risk of damaging the connection.
[0008]
Accordingly, the object of the present invention is to solve the above-described problems, and partition the space in which the electronic circuit board is accommodated into a resin-filled region and a non-resin-filled region to reduce the amount of filled resin, An object of the present invention is to provide a storage case for an electronic circuit board that does not cause damage to a solder connection portion of an electronic component even if thermal expansion occurs.
[0009]
Moreover, in the technique described in Patent Document 1 and Patent Document 2 described above, only an electronic component mounted on one surface of an electronic circuit board can be resin-molded, and the other surface (back surface) can be formed. Regarding the mounted electronic components, there was a problem that heat dissipation could not be improved.
[0010]
Accordingly, a further object of the present invention is to provide an electronic component mounted on both sides of the electronic circuit board while partitioning the space in which the electronic circuit board is accommodated into a resin-filled area and a non-resin-filled area to reduce the amount of filled resin Another object of the present invention is to provide a housing case for an electronic circuit board in which the resin mold is used to improve the heat dissipation.
[0011]
[Means for Solving the Problems]
In order to solve the above-described problem, in claim 1, the space in which the electronic circuit board is accommodated is divided into a resin-filled region filled with resin and a non-resin-filled region not filled with the resin, Among the electronic components mounted on one surface of the electronic circuit board, in an electronic circuit board housing case in which an electronic component that requires heat dissipation is placed in the resin-filled region and resin-molded, the electronic circuit board A through-hole is formed in a portion in contact with the resin-filled region, and when the electronic circuit board is accommodated in the housing case, the resin filled in the resin-filled region passes through the through-hole. as well as arranged to flow out to the other surface, said an electronic circuit outflow resin flowing out to the other surface of the substrate, the electronic component of the resin model that requires onboard radiated to the other surface It was configured to field.
[0012]
Thus, according to claim 1, the space in which the electronic circuit board is accommodated is divided into a resin-filled region filled with resin and a non-resin-filled region not filled with the resin, and the electronic circuit Among the electronic components mounted on one surface of the substrate, an electronic component that requires heat dissipation is placed in the resin-filled region and resin-molded, and a through-hole is formed in a portion that contacts the resin-filled region of the electronic circuit board When the electronic circuit board is housed in the housing case, the resin filled in the resin filling region flows out to the other surface of the electronic circuit board through the through hole. Because it is configured, the resin component can be integrally molded with the electronic component while reducing the amount of filled resin, so stress can concentrate on the solder connection part of the electronic component even if the substrate vibrates or the resin thermally expands. Not Damage to the solder connection portion can be prevented Te.
[0014]
Further , since the resin component that has flowed out to the other surface of the electronic circuit board is molded with the resin component mounted on the other surface, the heat dissipation of the electronic component mounted on both surfaces of the electronic circuit board Can be improved.
[0015]
In the second aspect of the present invention, heat receiving fins are formed in the resin filling region.
[0016]
Thus, in claim 2 , since the heat receiving fin is formed in the resin filling region, in addition to the above effect, the heat quantity of the resin is efficiently transmitted to the housing case through the heat receiving fin. The heat dissipation effect of the electronic component resin-molded in the resin-filled region can be further improved.
[0017]
According to a third aspect of the present invention, the heat receiving fin is protruded from the other surface of the electronic circuit board through an insertion hole formed in the electronic circuit board, and is resin-molded by the outflow resin. It was configured as follows.
[0018]
Thus, according to the third aspect , the heat receiving fin is caused to protrude from the other surface of the electronic circuit board through the insertion hole formed in the electronic circuit board, and the outflow that has flowed out to the other surface. Since it is configured to be resin-molded with resin, in addition to the above-described effects, the amount of heat of the spilled resin can be efficiently transmitted to the housing case, and thus the heat dissipation effect of the resin-molded electronic component on the other surface can be achieved. It can be improved further.
[0019]
According to a fourth aspect of the present invention, a portion corresponding to the bottom surface of the resin filling region is formed in a concave shape on the bottom surface of the housing case.
[0020]
Thus, according to the fourth aspect , since the portion corresponding to the bottom surface of the resin filling region is formed in a concave shape on the bottom surface of the housing case, in addition to the above-described effects, the amount of the filling resin is further increased. Can be reduced.
[0021]
Further, in the 5 claims, the portion of the concave and configured to form a heat radiating fin that projects outward of the housing case.
[0022]
Thus, in Claim 5 , since it comprised so that the radiation fin which protrudes toward the outward of a storage case may be formed in the concave part applicable to the bottom face of a resin filling area | region, the above-mentioned effect In addition, since the amount of heat of the resin and the outflow resin filled in the resin filling region can be effectively released to the outside air, the heat dissipation effect of each resin-molded electronic component can be further improved. In addition, it can prevent that the external shape of a storage case becomes large by setting the height of a radiation fin to the same value as the depth of the said recessed part, or less than that.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an electronic circuit board housing case according to an embodiment of the present invention will be described with reference to the accompanying drawings.
[0024]
FIG. 1 is a perspective view showing an electronic circuit board housing case according to this embodiment. 2 is an enlarged partial sectional view taken along line II-II in FIG.
[0025]
1 and 2, reference numeral 10 indicates a storage case (hereinafter simply referred to as “storage case”) of an electronic circuit board. The housing case 10 is formed from a metal having high thermal conductivity such as aluminum.
[0026]
A plurality of placement portions 14 on which electronic circuit boards 12 (hereinafter simply referred to as “substrates”) are to be placed are formed at positions adjacent to the side surface 10S of the housing case 10. In addition, a partition wall 16 having the same height as the mounting portion 14 is formed in the storage case 10, and an internal space (a space in which the substrate 12 is stored) of the storage case 10 is filled with a resin. And a non-resin filled region 22 that is not filled with resin. In this embodiment, a plurality of resin-filled regions 20 having a rectangular shape in a top view, specifically two locations, are formed.
[0027]
Further, in the bottom surface 10B of the housing case 10, a portion 24 corresponding to the bottom surface of the resin filling region 20 is formed in a concave shape as shown in FIG. Hereinafter, the portion 24 corresponding to the bottom surface of the resin filling region 20 is referred to as “resin filling region bottom surface”.
[0028]
A plurality of heat receiving fins 26 protruding toward the resin filling region 20 are formed on the resin filling region bottom surface 24. Specifically, the heat receiving fin 26 includes a first heat receiving fin 26 a set at a height lower than the partition wall 16 and a second heat receiving fin 26 b set at a height higher than the partition wall 16. Become.
[0029]
Furthermore, a plurality of radiating fins 30 projecting outward from the housing case 10 are formed on the resin-filled region bottom surface 24. Specifically, the radiating fin 30 is formed to have the same height as the depth of the resin-filled region bottom surface 24 formed in a concave shape (distance d from the surface of the housing case 10 to the resin-filled region bottom surface 24). .
[0030]
In the substrate 12, an electronic component that is placed on the resin-filled region 20 and is resin-molded on the surface 12 a (the one surface described above, hereinafter referred to as “substrate bottom surface”) on the side to be placed on the placement portion 14. 34 (electronic components that need to be radiated through resin; hereinafter referred to as “bottom-side heat radiation requirement electronic components”) and a plurality of electronic components 36 that should be placed in the non-resin filled region 22 (do not generate heat) Alternatively, a plurality of electronic components that do not need to actively dissipate heat (hereinafter referred to as “bottom-side non-heat-dissipating electronic components”) are mounted.
[0031]
Further, in the substrate 12, an insertion hole 38 through which the above-described second heat receiving fin 26 b is to be inserted is formed in a portion that comes into contact with the resin filling region 20 when accommodated in the accommodation case 10, and the resin A plurality of through holes 40 to be the flow paths are formed.
[0032]
Furthermore, an electronic component 44 (hereinafter referred to as “rear surface 12b”, hereinafter referred to as “substrate upper surface”) that needs to dissipate heat through the resin in the vicinity of the insertion hole 38 and the through hole 40. A plurality of electronic components 46 (hereinafter referred to as “upper surface side heat radiation requirement electronic components”) that do not generate heat or do not need to actively dissipate at positions spaced apart from the insertion hole 38 and the through hole 40 by a predetermined distance. A plurality of “upper surface side non-heat-dissipating electronic components” are mounted.
[0033]
FIG. 3 is a perspective view showing the housing case 10 that houses the substrate 12. 4 is an enlarged partial sectional view taken along line IV-IV in FIG.
[0034]
As shown in FIGS. 3 and 4, the substrate 12 is filled with a resin (for example, a silicon-based resin, indicated by reference numeral 48) in the resin filling region 20 of the housing case 10 up to substantially the upper end of the partition wall 16, and then inserted through 38, the second heat receiving fins 26b are inserted therethrough and placed on the placing portion 14 and the partition wall 16 formed at the same height as the placing portion 14, thereby being housed in the space of the housing case 10.
[0035]
At this time, the bottom-side heat dissipation requirement electronic component 34 mounted on the substrate bottom surface 12a is disposed (embedded) in the resin filling region 20 and resin molded. Further, an amount of the resin 48 corresponding to the volume of the bottom-side heat radiation requirement electronic component 34 embedded in the resin filling region 20 flows out to the substrate upper surface 12 b of the substrate 12 through the through hole 40 formed in the substrate 12. (The resin that flows out to the substrate upper surface 12b (indicated by reference numeral 50) is hereinafter referred to as “outflow resin”). Thereby, the bottom surface side heat radiation requirement electronic component 34 and the substrate 12 are integrally resin-molded, and the top surface side heat radiation requirement electronic component 44 mounted on the substrate top surface 12b and the substrate top surface 12b through the insertion hole 38. The second heat receiving fins 26b protruding in the shape are resin-molded.
[0036]
As described above, in this embodiment, the bottom surface side heat radiation requirement electronic component 34 and the substrate 12 arranged in the resin filling region 20 are integrally resin-molded, and thus the substrate 12 is vibrated. Even in such a case, since the amplitude and cycle of the bottom surface side heat dissipation requirement electronic component 34 and the substrate 12 are not different, stress is not concentrated on the solder connection portion of the bottom surface side heat dissipation requirement electronic component 34, and therefore the solder connection portion Damage can be prevented. Further, even when the resin 48 is thermally expanded, the expanded resin 48 can escape to the upper surface 12b of the substrate through the through hole 40, so that stress is concentrated on the solder connection portion of the bottom surface side heat radiation requesting electronic component 34. This can be avoided and damage to the solder connection portion can be prevented.
[0037]
Further, not only the bottom surface side heat dissipation requirement electronic component 34 mounted on the substrate bottom surface 12a but also the top surface side heat dissipation requirement electronic component 44 mounted on the substrate top surface 12b can be resin-molded. The heat dissipation of the electronic component can be improved.
[0038]
Furthermore, the heat receiving fins 26 are formed in the resin filling region 20 filled with the resin 48, and the second heat receiving fins 26b protruding from the substrate upper surface 12b are resin-molded by the outflow resin 50. it is possible to efficiently transmit the heat of the effluent resin 50 in the accommodating case 10, it is possible to further improve the heat dissipation effect of each heat dissipation requirements electronic components 34, 44 mounted on both sides of the substrate 1 2.
[0039]
Further, since the heat radiation fins 30 are formed on the resin-filled region bottom surface 24, since the heat amounts of the resin 48 and the spilled resin 50 transmitted to the housing case 10 can be efficiently discharged to the outside air, each heat radiation request The heat dissipation effect of the electronic components 34 and 44 can be further improved. In addition, since the radiation fin 30 is formed to have the same height as the depth of the resin-filled region bottom surface 24 formed in a concave shape (the distance from the bottom surface 10B of the housing case 10 to the resin-filled region bottom surface 24), The outer shape of the storage case 10 does not increase.
[0040]
As described above, in one embodiment of the present invention, the space in which the electronic circuit board (substrate 12) is accommodated is divided into the resin-filled region (20) filled with the resin (48) and the resin. (48) is divided into non-resin-filled regions (22) that are not filled, and electronic components (the bottom-side heat dissipation requirement electronic component 34 and the electronic circuit board (12)) mounted on one surface (substrate bottom surface 12a) of the electronic circuit board (12). Of the bottom-side non-heat-dissipation requesting electronic component 36), an electronic circuit board housing case in which an electronic component that requires heat dissipation (bottom-side heat dissipation requirement electronic component 34) is placed in the resin-filled region (20) and resin-molded ( 10), a through hole (40) is formed in a portion of the electronic circuit board (12) in contact with the resin-filled region (20), and the electronic circuit board (12) is accommodated in the accommodation case (10). When Together with the resin filling region (20) to the filled resin (48) is configured to flow out the the other surface of the via holes (40) electronic circuit board (12) (substrate upper surface 12b) The electronic component mounted on the other surface (12b) by the spilled resin (50) flowing out to the other surface (12b) of the electronic circuit board (12) (the upper surface side heat dissipation required electronic component) 44) was configured to be resin-molded .
[0042]
The heat receiving fin (26) is formed in the resin filling region (20).
[0043]
The heat receiving fins (specifically, the second heat receiving fins 26b) are connected to the electronic circuit board (12) through the insertion holes (38) formed in the electronic circuit board (12). While projecting on the other surface (12b), the resin was molded with the spilled resin (50).
[0044]
Moreover, it comprised so that the site | part (resin filling area | region bottom face 24) applicable to the bottom face of the said resin filling area | region (20) may be formed in a concave shape in the bottom face (10B) of the said storage case (10).
[0045]
Moreover, it was comprised so that the radiation fin (30) which protrudes toward the outward of the said storage case (10) may be formed in the said recessed part (24).
[0046]
In addition, in the above, although the resin filling area | region 20 was formed in two places, one place may be sufficient and three places or more may be sufficient. Further, the shape is not limited to a rectangular shape in top view, and may be any shape.
[0047]
Further, the heat receiving fins 26 are composed of the first heat receiving fins 26a having a height lower than that of the partition wall 16 and the second heat receiving fins 26b having a height higher than that of the partition wall 16, but the second heat receiving fins 26b. You may make it consist only of. Also, the number of them is not limited to the above or illustrated. Furthermore, it goes without saying that the number of electronic components is not limited to the above or illustrated.
[0048]
【The invention's effect】
In claim 1, a space in which the electronic circuit board is accommodated is divided into a resin-filled area filled with resin and a non-resin-filled area not filled with resin, and one of the electronic circuit boards Of the electronic components mounted on the surface, an electronic component that requires heat dissipation is placed in the resin-filled region and resin-molded, and a through-hole is formed in a portion of the electronic circuit board that contacts the resin-filled region. Thereby, when the electronic circuit board is accommodated in the accommodation case, the resin filled in the resin filling region is configured to flow out to the other surface of the electronic circuit board through the through hole. Since the electronic component and the substrate can be integrally molded while reducing the amount of filled resin, stress does not concentrate on the solder connection part of the electronic component even if the vibration of the substrate or the thermal expansion of the resin occurs. Connection It is possible to prevent the damage.
[0049]
Also, electrodeposition by sub-circuit outflow resin flowing out to the other surface of the substrate, since the electronic component mounted on the other surface configured so as to resin molding the electronic components of the heat radiation mounted on both sides of the electronic circuit board Can be improved.
[0050]
Further, in the second aspect , since the heat receiving fin is formed in the resin filling region, in addition to the above effect, the heat amount of the resin can be efficiently transmitted to the housing case through the heat receiving fin. The heat dissipation effect of the electronic component resin-molded in the resin-filled region can be further improved.
[0051]
Further, according to claim 3 , the heat receiving fin is caused to protrude from the other surface of the electronic circuit board through the insertion hole formed in the electronic circuit board, and the spilled resin that has flowed out to the other surface. Since it is configured to be resin-molded, in addition to the above-described effects, the amount of heat of the spilled resin can be efficiently transmitted to the housing case, and thus the heat dissipation effect of the electronic parts resin-molded on the other surface is further improved. Can be made.
[0052]
According to the fourth aspect of the present invention, since the portion corresponding to the bottom surface of the resin filling region is formed in a concave shape on the bottom surface of the housing case, in addition to the above-described effects, the amount of filled resin is further reduced. be able to.
[0053]
Further, in the 5 claims, the concave portion corresponding to the bottom surface of the resin filling region, since it is configured to form a heat radiating fin that projects outward of the housing case, in addition to the effects mentioned above Since the heat quantity of the resin and the outflow resin filled in the resin filling region can be effectively released to the outside air, the heat dissipation effect of each resin-molded electronic component can be further improved. In addition, it can prevent that the external shape of a storage case becomes large by setting the height of a radiation fin to the same value as the depth of the said concave part, or less than that.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a housing case for an electronic circuit board according to one embodiment of the present invention.
2 is an enlarged partial sectional view taken along line II-II in FIG.
FIG. 3 is a perspective view of a housing case that houses the substrate shown in FIG. 1;
4 is an enlarged partial sectional view taken along line IV-IV in FIG. 3;
[Explanation of symbols]
10 Housing case (Electronic circuit board housing case)
10B Bottom surface of housing case 12 Substrate (electronic circuit board)
12a Substrate bottom (one side)
12b Upper surface of substrate (the other surface)
20 Resin filling region 22 Non-resin filling region 24 Resin filling region bottom (concave part)
26 heat receiving fin 26b second heat receiving fin 30 heat radiating fin 34 bottom surface side heat radiation requesting electronic component 36 bottom surface side non heat radiation requesting electronic component 38 insertion hole 40 through hole 44 top surface side heat radiation requesting electronic component 48 resin 50 spilled resin

Claims (5)

A space in which the electronic circuit board is accommodated is divided into a resin-filled area filled with resin and a non-resin-filled area not filled with the resin, and an electronic component mounted on one surface of the electronic circuit board Among them, in an electronic circuit board housing case in which an electronic component that requires heat dissipation is placed in the resin-filled region and resin-molded, a through hole is formed in a portion that contacts the resin-filled region of the electronic circuit board, When the electronic circuit board is accommodated in the accommodation case, the resin filled in the resin filling region flows out to the other surface of the electronic circuit board through the through hole, and the electronic circuit the outflow resin flowing out to the other surface of the substrate, housing case and an electronic circuit board, characterized in that for a resin molding the electronic parts requiring mounted on heat dissipation to the other surface . Claim 1 Kouki mounting of the electronic circuit board housing case, characterized in that the formation of the heat-receiving fins on the resin filling region. Said heat receiving fins, with protruded on the other surface of the electronic circuit board via the electronic circuit board drilled through holes, according to claim 2 wherein wherein the to the resin mold by the outflow resin Electronic circuit board housing case. In the bottom of the housing case, the electronic circuit board housing case according to any one of 3 claims 1 to wherein, characterized in that the portion corresponding to the bottom surface of the resin-filled region is formed in a concave shape. 5. A housing case for an electronic circuit board according to claim 4 , wherein a radiating fin projecting outward of the housing case is formed in the concave portion.

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