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JP4036274B2 - Resistor manufacturing method - Google Patents

Resistor manufacturing method Download PDF

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Publication number
JP4036274B2
JP4036274B2 JP36421897A JP36421897A JP4036274B2 JP 4036274 B2 JP4036274 B2 JP 4036274B2 JP 36421897 A JP36421897 A JP 36421897A JP 36421897 A JP36421897 A JP 36421897A JP 4036274 B2 JP4036274 B2 JP 4036274B2
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JP
Japan
Prior art keywords
resistor
resin
mold
electrode terminal
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP36421897A
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Japanese (ja)
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JPH11186010A (en
Inventor
樹夫 松川
耕治 米島
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Hokuriku Electric Industry Co Ltd
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Hokuriku Electric Industry Co Ltd
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Priority to JP36421897A priority Critical patent/JP4036274B2/en
Publication of JPH11186010A publication Critical patent/JPH11186010A/en
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  • Non-Adjustable Resistors (AREA)

Description

【0001】
【発明の属する技術分野】
この発明は、抵抗体及び電極端子を樹脂により覆った抵抗器の製造方法に関する。
【0002】
【従来の技術】
従来、一般的な抵抗器の中でも低抵抗で耐熱性を必要とするチップ抵抗器は、電極及び抵抗体が樹脂中でインサート成形されていた。このチップ抵抗器の製造方法は、上型と下型からなる金型の所定の位置に抵抗体が接続された電極形成フレームをセットし、金型のゲートから樹脂を注入していた。この樹脂の注入は、抵抗体は抵抗値調整用の貫通孔を有することから、上型と下型からなる金型の一方の型であって、抵抗体の一方の面の側にゲートを設けて樹脂を注入していた。この樹脂は、抵抗値調整用の貫通孔から反対側へ流れて、金型内の空間部に充填される。
【0003】
【発明が解決しようとする課題】
上記従来の技術の場合、近年のチップ抵抗器の小型化のため、抵抗体の厚さが薄くなり抵抗値調整溝も狭くなり、また樹脂はある程度の粘度を有することから、樹脂が流れにくいものであった。このため抵抗体は樹脂の圧力により湾曲し、形成された樹脂表面に抵抗体の表面の一部が露出したり、抵抗値が変わってしまうという問題点を有していた。
【0004】
この発明は上記従来の技術の問題点に鑑みてなされたものであり、歩留が良く正確なインサート成形が可能な抵抗器の製造方法を提供することを目的とする。
【0005】
【課題を解決するための手段】
この発明の抵抗器は、導電性を有する帯状のリードフレーム用の金属板から電極端子を形成するもので、上記電極端子間に設けられ抵抗値調整溝を有する抵抗体を有し、この抵抗体の表裏両面に樹脂がインサート成形されて被覆され、この樹脂の側面には上記抵抗体の表裏両面側に同時に樹脂が注入されたゲートによるバリの跡を有する抵抗器である。
【0006】
この発明は、導電性を有する帯状のリードフレーム用の金属板から電極端子を形成し、連続的に抵抗器を製造するもので、抵抗値調整溝を有する抵抗体を上記電極端子間に接続し、この電極端子及び抵抗体を内部にインサート成形する上型と下型との間に、上記抵抗体及び電極端子を有した上記金属板を配置し、この上型と下型との合わせ面の一側面部から上記抵抗体の表裏両面側に平行な方向に同時に樹脂を流し込む抵抗器の製造方法である。
【0007】
さらに、上記上型と下型の一側面部の合わせ面に、上記抵抗体の表面側に樹脂を流し込むゲートが形成され、上記一側面部の上記下型に上記抵抗体の裏面側に樹脂を流し込むゲートを形成する凹部が形成され、この凹部に対面する上記上型の一側面部に上記凹部の一部を覆う凸部が形成されたものでも良い
【0008】
【発明の実施の形態】
以下、この発明の実施形態について図面に基づいて説明する。図1、図2はこの発明の第一実施形態のチップ抵抗器10を示す。この実施形態のチップ抵抗器10は、銅板からなり表面にハンダメッキが施された帯状の金属板を打ち抜いて電極端子12が形成され、電極端子12に、銅ニッケル合金やニッケルクロム合金等からなる抵抗体14が取り付けられている。さらに、抵抗体14と電極端子12の一部は、絶縁性の樹脂18によりインサート成形されている。抵抗体14には、抵抗値調整用の貫通した凹溝16が形成されている。そして、この抵抗体14とその両側の各電極端子12の一部の表裏面が、樹脂18中に埋設された状態にインサート成形されている。
【0009】
この実施形態のチップ抵抗器10の製造方法は、リードフレームを形成する帯状の金属板を所定の間隔で金型を用いて打ち抜き、電極端子12を形成し、一対の電極端子12間に抵抗体14を載置し溶接する。溶接はスポット溶接等により行い、電極端子12と抵抗体14を確実に溶接し固定する。また抵抗体14は、所定の抵抗値を有するようにパンチング等で予め貫通した凹溝16が形成されており、凹溝16は適宜の長さ及び本数形成される。
【0010】
次に抵抗体14を備えた帯状の金属板の互いに対向する一対の電極端子12に、トリミング用の接触子を接続し、抵抗値を測定しながら抵抗体14の表面をラバーディスクやレーザー等で削り抵抗値の微調整を行い、抵抗体14が所定の抵抗値を有するように調整する。
【0011】
次に抵抗体14と電極端子12の一部を、上型20と下型22からなる金型24の内部に設置する。金型24は図2に示すように、上型20は一方の側面の合わせ面に一体に凸部26を有し、下型22は上型20の凸部26が嵌合する凹部28と、同じ側の合わせ面に別の凹部32とを有する。また上型20の凸部26と下型22の凹部28間には、樹脂注入用のゲート30が形成され、このゲート30は金型24内に設置する抵抗体14の裏面側に連通し、また下型22の別の凹部32に設けられたゲート34は、抵抗体14の表面側に位置するように形成されている。樹脂材料はこれらのゲート30、34から抵抗体14の表裏面に流れ込むように注入され、抵抗体14を樹脂18により被覆する。
【0012】
樹脂18は、抵抗体14の発熱に対する耐熱性と絶縁性を有し、例えば、耐熱性の高い不飽和ポリエステル樹脂、エポキシ樹脂、ポリフェニレンサルファド樹脂(PPS)、シリコーン樹脂、ポリアミド樹脂、アクリル樹脂等を用い、またこれらを抵抗体14ともにインサート成形する方法として、射出成型法、トランスファ成形法等を用いる。
【0013】
金型24を取り外すと、ゲート30、34にはそれぞれバリ38が形成されており、このバリ38を切除し、電極端子12を所定の長さの箇所で帯状の金属板から切り離す。さらに電極端子12を樹脂18で成形した抵抗体14の下側面に折り曲げチップ抵抗器10を完成する。ここで電極端子12には、この成形後にハンダメッキ等を施してもよい。
【0014】
この実施形態のチップ抵抗器10に樹脂18を成形する際、抵抗体14の上下面に設けたゲート30、34から樹脂18が注入されるため、同等の圧力が抵抗体14の両面にかかるため抵抗体14が一方に湾曲することなく、薄型のチップ抵抗器を効率よく製造することが可能となる。
【0015】
次にこの発明の第二実施形態について図3、図4に基づいて説明する。ここで上記実施形態と同様の部材は同一の符号を付して説明を省略する。この実施形態のチップ抵抗器40は、第一実施形態と同様の方法で製造され、ここで使用する金型46の下型44は、合わせ面に凹部48を有し、樹脂注入用のゲート50を形成している。
【0016】
このゲート50は金型24内に設置する抵抗体14の厚さよりも、厚み方向に大きく、このため樹脂材料は抵抗体14の表裏両面に流れ込むように形成されている。これにより樹脂は、抵抗体14の両面側に同時に流入し、抵抗体18は樹脂18中に埋設される。
【0017】
成形後、金型46を開くと、ゲート50には1本のバリ52が形成されており、バリ50を切り取り、後の工程で電極端子12を所定の長さの箇所で帯状の金属板から切り離し、単体のチップ抵抗器とする。
【0018】
この実施形態のチップ抵抗器40に形成されるバリ52は1カ所であることから、切除が容易で、また注入される樹脂の圧力で抵抗体14が湾曲することを防ぐことができる。
【0019】
なお、この発明は、上述した実施形態に限定されるものではなく、チップ抵抗器以外の抵抗器にも適用可能であり、ジャンパ線として用いる低抵抗体にも適用される。ゲートの位置も、異なる側面に各々形成しても良く、適宜設定可能である。さらに、各部材の材料、製造順序、加工方法、また金型に設けたゲートの形状や配置等も適宜変更することができる。
【0020】
【発明の効果】
この発明の抵抗器の製造方法は、樹脂材料を抵抗体の表裏面に同時に注入させることで、樹脂の圧力による抵抗体の湾曲を防ぎ、抵抗器の品質と精度を向上させるものである。
【図面の簡単な説明】
【図1】この発明の第一実施形態の抵抗器を示す斜視図である。
【図2】この発明の第一実施形態の抵抗器の樹脂成形で用いる金型の正面図である。
【図3】この発明の第二実施形態の抵抗器を示す正面図である。
【図4】この発明の第二実施形態の抵抗器の樹脂成形で用いる金型の正面図である。
【符号の説明】
10 チップ抵抗器
12 電極端子
14 抵抗体
16 凹溝
18 樹脂
38 バリ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a resistor in which a resistor and electrode terminals are covered with a resin.
[0002]
[Prior art]
Conventionally, among general resistors, chip resistors that require low resistance and heat resistance have electrodes and resistors inserted in resin. In this method of manufacturing a chip resistor, an electrode forming frame in which a resistor is connected to a predetermined position of a mold composed of an upper mold and a lower mold is set, and resin is injected from the gate of the mold. This resin is injected because the resistor has a through-hole for adjusting the resistance value, so it is one of an upper die and a lower die, and a gate is provided on one side of the resistor. The resin was injected. This resin flows from the through hole for adjusting the resistance value to the opposite side, and fills the space in the mold.
[0003]
[Problems to be solved by the invention]
In the case of the above prior art, due to the recent miniaturization of chip resistors, the thickness of the resistor is reduced, the resistance value adjustment groove is also narrowed, and the resin has a certain viscosity, so that the resin does not flow easily Met. For this reason, the resistor is bent by the pressure of the resin, and there is a problem that a part of the surface of the resistor is exposed to the formed resin surface or the resistance value is changed.
[0004]
The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to provide a method for manufacturing a resistor capable of high-yield and accurate insert molding.
[0005]
[Means for Solving the Problems]
The resistor according to the present invention comprises an electrode terminal formed from a conductive strip-shaped metal plate for a lead frame, and has a resistor having a resistance value adjusting groove provided between the electrode terminals. Resin is insert-molded and coated on both front and back surfaces of this resistor, and the side surface of this resin is a resistor having traces of burrs due to gates in which resin is simultaneously injected on both front and back surfaces of the resistor.
[0006]
In this invention , electrode terminals are formed from a conductive strip-shaped metal plate for a lead frame, and a resistor is continuously manufactured. A resistor having a resistance adjustment groove is connected between the electrode terminals. The metal plate having the resistor and the electrode terminal is disposed between the upper mold and the lower mold in which the electrode terminal and the resistor are insert-molded, and the mating surface of the upper mold and the lower mold is arranged. This is a method of manufacturing a resistor in which a resin is poured simultaneously from one side surface portion in a direction parallel to the front and back side surfaces of the resistor.
[0007]
Furthermore, a gate for pouring resin into the front surface side of the resistor is formed on the mating surface of the one side surface portion of the upper die and the lower die, and the resin on the back surface side of the resistor body is formed on the lower die of the one side surface portion. a recess forming a gate pouring is formed, may be one protrusion covering part of the recess formed on one side surface of the upper mold facing the recess.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show a chip resistor 10 according to a first embodiment of the present invention. The chip resistor 10 of this embodiment is formed by punching a strip-like metal plate made of a copper plate and solder-plated on the surface thereof to form an electrode terminal 12, and the electrode terminal 12 is made of a copper nickel alloy, a nickel chromium alloy, or the like. A resistor 14 is attached. Further, a part of the resistor 14 and the electrode terminal 12 is insert-molded with an insulating resin 18. The resistor 14 is formed with a through groove 16 for adjusting a resistance value. The resistor 14 and part of the front and back surfaces of the electrode terminals 12 on both sides thereof are insert-molded so as to be embedded in the resin 18.
[0009]
In the manufacturing method of the chip resistor 10 of this embodiment, a strip-shaped metal plate forming a lead frame is punched with a mold at a predetermined interval to form an electrode terminal 12, and a resistor is formed between the pair of electrode terminals 12. 14 is placed and welded. Welding is performed by spot welding or the like, and the electrode terminal 12 and the resistor 14 are securely welded and fixed. In addition, the resistor 14 is provided with a recessed groove 16 penetrating in advance by punching or the like so as to have a predetermined resistance value, and the recessed groove 16 is formed with an appropriate length and number.
[0010]
Next, a contact for trimming is connected to a pair of opposing electrode terminals 12 of a strip-shaped metal plate provided with a resistor 14, and the surface of the resistor 14 is measured with a rubber disk or laser while measuring the resistance value. Fine adjustment of the shaving resistance value is performed so that the resistor 14 has a predetermined resistance value.
[0011]
Next, a part of the resistor 14 and the electrode terminal 12 is installed inside a mold 24 including an upper mold 20 and a lower mold 22. As shown in FIG. 2, the upper die 20 has a convex portion 26 integrally on the mating surface of one side surface, and the lower die 22 has a concave portion 28 into which the convex portion 26 of the upper die 20 is fitted, as shown in FIG. Another concave portion 32 is provided on the mating surface on the same side. Further, a resin injection gate 30 is formed between the convex portion 26 of the upper mold 20 and the concave portion 28 of the lower mold 22, and this gate 30 communicates with the back side of the resistor 14 installed in the mold 24. The gate 34 provided in the other concave portion 32 of the lower mold 22 is formed so as to be positioned on the surface side of the resistor 14. The resin material is injected so as to flow into the front and back surfaces of the resistor 14 from these gates 30 and 34, and the resistor 14 is covered with the resin 18.
[0012]
The resin 18 has heat resistance and insulation against the heat generated by the resistor 14, and includes, for example, unsaturated polyester resin, epoxy resin, polyphenylene sulfide resin (PPS), silicone resin, polyamide resin, acrylic resin, etc. having high heat resistance. In addition, as a method of insert molding these together with the resistor 14, an injection molding method, a transfer molding method, or the like is used.
[0013]
When the mold 24 is removed, burrs 38 are formed on the gates 30 and 34, respectively, and the burrs 38 are cut off, and the electrode terminals 12 are separated from the band-shaped metal plate at a predetermined length. Further, the chip resistor 10 is completed by bending the electrode terminal 12 on the lower surface of the resistor 14 formed of the resin 18. Here, the electrode terminal 12 may be subjected to solder plating or the like after the molding.
[0014]
When the resin 18 is molded into the chip resistor 10 of this embodiment, the resin 18 is injected from the gates 30 and 34 provided on the upper and lower surfaces of the resistor 14, so that equivalent pressure is applied to both surfaces of the resistor 14. A thin chip resistor can be efficiently manufactured without the resistor 14 being bent in one direction.
[0015]
Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted. The chip resistor 40 of this embodiment is manufactured by the same method as that of the first embodiment. The lower mold 44 of the mold 46 used here has a recess 48 on the mating surface, and a gate 50 for resin injection. Is forming.
[0016]
The gate 50 is larger in the thickness direction than the thickness of the resistor 14 installed in the mold 24, and therefore, the resin material is formed so as to flow into both the front and back surfaces of the resistor 14. As a result, the resin flows into both sides of the resistor 14 simultaneously, and the resistor 18 is embedded in the resin 18.
[0017]
After molding, when the mold 46 is opened, a single burr 52 is formed on the gate 50. The burr 50 is cut off, and the electrode terminal 12 is removed from the band-shaped metal plate at a predetermined length in a later process. Separate and use a single chip resistor.
[0018]
Since the burr 52 formed in the chip resistor 40 of this embodiment is one place, the cutting can be easily performed, and the resistor 14 can be prevented from being bent by the pressure of the injected resin.
[0019]
In addition, this invention is not limited to embodiment mentioned above, It can apply also to resistors other than a chip resistor, and is applied also to the low resistance body used as a jumper line. The position of the gate may also be formed on different side surfaces, and can be set as appropriate. Furthermore, the material of each member, the manufacturing order, the processing method, and the shape and arrangement of the gate provided in the mold can be changed as appropriate.
[0020]
【The invention's effect】
In the method for manufacturing a resistor according to the present invention, the resin material is simultaneously injected into the front and back surfaces of the resistor, thereby preventing the resistor from being bent by the pressure of the resin and improving the quality and accuracy of the resistor.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a resistor according to a first embodiment of the present invention.
FIG. 2 is a front view of a mold used for resin molding of the resistor according to the first embodiment of the present invention.
FIG. 3 is a front view showing a resistor according to a second embodiment of the present invention.
FIG. 4 is a front view of a mold used for resin molding of a resistor according to a second embodiment of the present invention.
[Explanation of symbols]
10 Chip Resistor 12 Electrode Terminal 14 Resistor 16 Groove 18 Resin 38 Burr

Claims (2)

導電性を有する帯状の金属板から電極端子を形成し、連続的に抵抗器を製造する抵抗器の製造方法において、抵抗値調整溝を有する抵抗体を上記電極端子間に接続し、この電極端子及び抵抗体を内部にインサート成形する上型と下型との間に上記抵抗体及び電極端子を配置し、この上型と下型の一側面の合わせ面の所定部位に一対の凹部を形成して各々独立した一対のゲートを設け、一方の上記凹部による上記ゲートを介して上記抵抗体の表面側に成形用の樹脂を流し込み、裏面側にも他方の上記凹部による上記ゲートを介して上記樹脂を流し込み、上記抵抗体の表裏面に平行な方向に同時に各々樹脂を流し込むことを特徴とする抵抗器の製造方法。In a method for manufacturing a resistor, in which an electrode terminal is formed from a strip-shaped metal plate having conductivity and a resistor is continuously manufactured, a resistor having a resistance adjustment groove is connected between the electrode terminals, and the electrode terminal And the resistor and the electrode terminal are disposed between the upper mold and the lower mold in which the resistor is insert-molded, and a pair of recesses are formed in a predetermined portion of the mating surface of one side of the upper mold and the lower mold. A pair of independent gates is provided, a molding resin is poured into the front surface side of the resistor through the gate formed by one of the recesses, and the resin is formed on the back surface through the gate formed by the other recess. And a resin is simultaneously poured in a direction parallel to the front and back surfaces of the resistor. 上記上型と下型の一側面部の合わせ面に、上記抵抗体の表面側に樹脂を流し込む上記一方の凹部が形成され、上記一側面部の上記下型には上記抵抗体の裏面側に樹脂を流し込む上記他方の凹部が形成され、この他方の凹部に対面する上記上型の一側面部に上記他方の凹部の一部を覆う凸部が形成され、上記各凹部による各ゲートを介して上記抵抗体の表裏面同時に各々樹脂を流し込むことを特徴とする請求項1記載の抵抗器の製造方法。 The one concave portion for pouring resin into the front surface side of the resistor is formed on the mating surface of the one side surface portion of the upper die and the lower die, and the lower die of the one side surface portion is formed on the back surface side of the resistor. The other recess into which the resin is poured is formed, and a convex portion that covers a part of the other recess is formed on one side surface of the upper mold that faces the other recess. 2. The method of manufacturing a resistor according to claim 1, wherein a resin is poured into each of the front and back surfaces of the resistor simultaneously .
JP36421897A 1997-12-16 1997-12-16 Resistor manufacturing method Expired - Fee Related JP4036274B2 (en)

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JP4036274B2 true JP4036274B2 (en) 2008-01-23

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