Nothing Special   »   [go: up one dir, main page]

JP4015033B2 - Copper or copper alloy member coated with Sn and method for producing the same - Google Patents

Copper or copper alloy member coated with Sn and method for producing the same Download PDF

Info

Publication number
JP4015033B2
JP4015033B2 JP2003021396A JP2003021396A JP4015033B2 JP 4015033 B2 JP4015033 B2 JP 4015033B2 JP 2003021396 A JP2003021396 A JP 2003021396A JP 2003021396 A JP2003021396 A JP 2003021396A JP 4015033 B2 JP4015033 B2 JP 4015033B2
Authority
JP
Japan
Prior art keywords
copper
alloy member
copper alloy
containing layer
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003021396A
Other languages
Japanese (ja)
Other versions
JP2004232014A (en
Inventor
宏人 成枝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Holdings Co Ltd
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Holdings Co Ltd, Dowa Mining Co Ltd filed Critical Dowa Holdings Co Ltd
Priority to JP2003021396A priority Critical patent/JP4015033B2/en
Publication of JP2004232014A publication Critical patent/JP2004232014A/en
Application granted granted Critical
Publication of JP4015033B2 publication Critical patent/JP4015033B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、銅または銅合金部材がSn含有層で被覆されたSn被覆を施した銅または銅合金部材およびその製造方法に関し、特に、自動車用コネクタ端子、バスバー、電気電子部品の端子、リードフレームなどに使用され、一部にアルミニウム線またはアルミニウム板を接合可能なSn被覆を施した銅または銅合金部材およびその製造方法に関する。
【0002】
【従来の技術】
端子やバスバーなどの電気電子部品の材料として、電気伝導性に優れ且つコスト面でも優れた銅または銅合金部材が広く利用されている。また、端子材料の最表面には、電気的信頼性、耐食性、はんだ付け性、外観およびコストの観点から、Sn被覆が施されることが多い。このSn被覆には、耐ウイスカ性に優れた溶融加熱処理や溶融Sn浸漬処理が広く利用されている。
【0003】
また、最表層をSnで被覆した端子やバスバーに銅電線を接続する場合、加締めて接続する圧着、刃で銅電線の被覆を切って接続する圧接、はんだを用いて接続するはんだ付けが一般的である。
【0004】
また、近年の環境対策として、素材の軽量化が挙げられており、銅電線からアルミニウム電線への切替えが検討されている。しかし、アルミニウムは強固な酸化被膜を生成し易く、圧着や圧接による接続ではアルミニウムの酸化被膜が抵抗となるため、アルミニウム電線の実用化には問題がある。また、アルミニウムの酸化被膜は強固なため、はんだ付けによる接続も難しい。
【0005】
また、アルミニウムと銅または銅合金との接続方法として、互いを加圧し、超音波振動を加えることによって固相接合させる超音波接合が開発されている(例えば、特許文献1参照)。
【0006】
【特許文献1】
特開平8−252679号公報(段落番号0015−0019)
【0007】
【発明が解決しようとする課題】
しかし、アルミニウムとSnの超音波接合では、接合面に脆弱なアルミニウム−Sn合金層が形成され、接合強度が弱く、振動などにより容易に剥離するという問題が生じる。そのため、超音波接合によって、Sn被覆を施した銅または銅合金にアルミニウムを直接接合することはできなかった。
【0008】
また、一つの端子やバスバー内でSn被覆部とSn非被覆部を共存させるためには、Sn被覆が必要な部分だけめっきする部分Snめっきや、マスキングテープを使用するストライプめっきが考えられる。しかし、溶融処理を行わないSn被覆方法は、ウイスカが発生し易く、短絡障害の原因となるため好ましくない。そのため、溶融処理を行ったSn被覆部と、素材の銅または銅合金が露出したSn非被覆部が共存する材料が求められていた。
【0009】
したがって、本発明は、このような従来の問題点に鑑み、アルミニウム部材と接合可能なSn被覆を施した銅または銅合金部材を提供することを目的とする。
【0010】
【課題を解決するための手段】
本発明者らは、上記課題を解決するために鋭意研究した結果、銅または銅合金部材の表面をSn含有層で被覆した後、Sn含有層の一部を切削または研削により除去するとともに、その切削または研削の際に、そのSn含有層の一部に被覆されていた銅または銅合金部材の部分を所定の厚さ分だけ除去することにより、アルミニウム部材と接合可能なSn被覆を施した銅または銅合金部材を提供することができることを見出し、本発明を完成するに至った。
【0011】
すなわち、本発明によるSn被覆を施した銅または銅合金部材の製造方法は、銅または銅合金部材の表面をSn含有層で被覆した後、Sn含有層の一部を切削または研削により除去するとともに、その切削または研削の際に、そのSn含有層の一部に被覆されていた銅または銅合金部材の部分を所定の厚さ分だけ除去することを特徴とする。
【0012】
このSn被覆を施した銅または銅合金部材の製造方法において、銅または銅合金部材の表面を下地層を介してSn含有層で被覆した場合は、Sn含有層の一部を切削または研削により除去する際に、Sn含有層の一部に被覆されていた下地層の部分も除去するのが好ましい。また、所定の厚さが0.01mm以上であり、Sn含有層の厚さが0.1〜20μmであるのが好ましい。Sn含有層は、Pb、Zn、Cu、NiおよびAgの1種以上を0〜20重量%含有してもよい。また、切削または研削により被覆を除去することによって露出した銅または銅合金部材の表面の中心線平均粗さRaが1μm以下であるのが好ましい。さらに、Sn含有層を、電気めっき後に加熱溶融処理を行う方法または溶融Sn浸漬処理方法により被覆するのが好ましい。
【0013】
また、本発明によるSn被覆を施した銅または銅合金部材は、銅または銅合金部材の表面がSn含有層で被覆され、Sn含有層の一部が切削または研削により除去されるとともに、その切削または研削の際に、そのSn含有層の一部に被覆されていた銅または銅合金部材の部分が所定の厚さ分だけ除去されて、銅または銅合金部材の露出面が形成されていることを特徴とする。
【0014】
このSn被覆を施した銅または銅合金部材において、銅または銅合金部材の表面が下地層を介してSn含有層で被覆され、Sn含有層の一部を切削または研削により除去する際には、Sn含有層の一部に被覆されていた下地層の部分も除去されているのが好ましい。また、所定の厚さが0.01mm以上であり、Sn含有層の厚さが0.1〜20μmであるのが好ましい。Sn含有層は、Pb、Zn、Cu、NiおよびAgの1種以上を0〜20重量%含有してもよい。さらに、露出面の中心線平均粗さRaが1μm以下であるのが好ましい。また、露出面は、アルミニウム線またはアルミニウム板を接合する面とすることができる。
【0015】
【発明の実施の形態】
以下、添付図面を参照して、本発明によるSn被覆を施した銅または銅合金部材およびその製造方法の実施の形態を説明する。
【0016】
図1(a)〜図1(d)に示すように、本発明によるSn被覆を施した銅または銅合金部材の製造方法の実施の形態では、銅または銅合金部材10を、めっき、蒸着、溶融金属浸漬などにより、必要に応じて単層または複層の下地層14の被覆を介して、厚さ0.1〜20μmのSn含有層12で被覆する。Sn被覆方法が溶融Sn浸漬処理方法以外の場合には、その後に加熱溶融処理を行い、Sn被覆を施した銅または銅合金部材を形成する。次いで、アルミニウム線またはアルミニウム板を接続するための銅または銅合金部材10の任意の部分を、表面からSn含有層12の厚さに0.01mm以上の厚さを加えた厚さ分D、下地層14を形成している場合は下地層14の厚さとSn含有層12の厚さに0.01mm以上の厚さを加えた厚さ分D’だけ、切削または研削により除去することによって、Sn被覆部と銅または銅合金が露出したSn非被覆部を共存させた材料を形成する。なお、Sn含有層は、Snの他に、Pb、Zn、Cu、NiおよびAgの1種以上を0〜20重量%含有してもよい。
【0017】
Sn含有層の厚さを0.1〜20μmとするのは、Sn被覆は電気的接続信頼性および耐食性を確保するために施されるものであり、Sn含有層の厚さが0.1μm未満ではその機能を保つことができず、20μmを超えると経済的に不利になるからである。
【0018】
切削または研削により除去する厚さを(下地層14の厚さと)Sn含有層12の厚さに0.01mm以上を加えた厚さD(またはD’)とするのは、0.01mm未満では、被覆の厚さや表面の凹凸のばらつきなどにより、被覆した下地層14やSn含有層12を完全に除去することが難しいためである。
【0019】
下地層14は、Sn、Cu、Ni、Fe、Zn、Co、Au、Ag、PbまたはPの単体または合金からなる。下地層14の組合せおよび厚さは、要求特性により多様に選定できるが、製造条件およびコストの兼ね合いから、厚さは20μm以下であることが好ましい。
【0020】
また、切削または研削により被覆を除去することにより露出した表面の中心線平均粗さRaを1μm以下にするのが好ましい。1μmを超えると、アルミニウムと銅または銅合金の間の摩擦抵抗が高くなり、アルミニウムと銅または銅合金の間に超音波振動を与える効率が低下し、接合力も低下するからである。
【0021】
Sn被覆方法としては、耐ウイスカ性を向上させるため、電気めっき後に加熱溶融(リフロー)処理を行う方法または溶融Sn浸漬(ホットディップ)処理による方法を使用するのが好ましい。ただし、耐ウイスカ性を必要としない場合は、加熱溶融処理や溶融Sn浸漬処理を行わなくてもよい。
【0022】
本発明によるSn被覆を施した銅または銅合金部材の実施の形態は、図2に示すように、端子として形成し、切削または研削により露出した銅または銅合金部材10の表面にアルミニウム線またはアルミニウム板16を介して(図示しない)他の部位を接合することができるとともに、Sn含有層12で被覆された部分に(図示しない)他の端子を接続することができる。なお、図2に示す端子の形状は、オスタブの形状になっているが、箱形やベローズ型などの他の形状でもよい。
【0023】
【実施例】
以下、添付図面を参照して、本発明によるSn被覆を施した銅または銅合金部材およびその製造方法の実施例について詳細に説明する。
【0024】
[実施例]
図3(a)に示すように、素材として、銅中にFe、Sn、NiおよびPを合計0.1重量%含有し、ビッカース硬さ115、厚さ1.2mm、幅200mmの銅合金条100を用意した。この銅合金条100の表面を電解脱脂と酸洗により活性化した後、その上に硫酸塩浴を用いて電気めっきにより厚さ1μmのSn被覆層102を形成した。被覆方法として電気めっきを用いたのは、厚さの制御に優れ且つコスト的にも有利であるからである。電気めっきを行った後に溶融処理を行った。この溶融処理は、バーナー炉を使用して、還元雰囲気において炉内温度500℃、通板速度5m/minで行った。
【0025】
Sn被覆を施した銅合金条100を70mm幅に切断した後、切削加工によって端から幅20mm、深さ0.05mmの表面部分を除去することにより接続部を形成し、その中心線平均粗さRaが0.2μmになるように仕上げた。
【0026】
Sn被覆層102の厚さは、蛍光X線膜厚測定器により測定し、中心線平均粗さは3次元レーザー顕微鏡により測定した。
【0027】
他の端子との接続部の信頼性の評価の内容として、160℃の大気雰囲気中で120時間保持した後の接触抵抗値の測定と、亜硫酸ガス雰囲気中(SOガス濃度10ppm、温度40℃、相対湿度80%RH)に96時間保持した後の耐食性の評価を行った。接触抵抗値は、マイクロオームメータを使用し、開放電圧20mV、電流10mA、0.5φmmのU型金線プローブ、最大荷重100gf、摺動無しの条件において、試験数N=5回測定し、その平均値から求めた。耐食性は、表面をマイクロスコープで観察し、腐食の有無を確認することによって評価した。
【0028】
また、アルミニウムとの接続部の信頼性の評価の内容として、φ25μm、破断強度18gfのアルミニウム線をループ状に超音波接合でボンディングし、ループのプル強度を測定した。超音波接合は、超音波ウェッジワイヤボンダを用いて、接合時間40ms、接合荷重25gf、超音波出力0.6Wで行った。プル強度は、プルテスタを用いて試験数N=5回測定し、その平均値から求めた。なお、この評価では、φ25μmのアルミニウム線を使用したが、他の大きさのアルミニウム線またはアルミニウム板を使用してもよい。
【0029】
[比較例1]
図3(b)に示すように、Sn被覆層を形成せず、接続部の中心線平均粗さRaを0.10μmとした以外は、実施例と同様の方法により得られた銅合金部材について、実施例と同様の測定および評価を行った。
【0030】
[比較例2]
図3(c)に示すように、表面部分を除去せず、接続部の中心線平均粗さRaを0.04μmとした以外は、実施例と同様の方法により得られた銅合金部材について、実施例と同様の測定および評価を行った。
【0031】
実施例、比較例1および比較例2の結果を表1および表2に示す。
【表1】

Figure 0004015033
【0032】
表1に示すように、比較例1では他の端子との接続部の信頼性に欠け、比較例2ではアルミニウムとの接続部の信頼性に欠ける。比較例1において接触抵抗値が大きい理由は、表面の銅が高温放置されて厚い酸化物が形成されたためであり、変色・腐食が発生した理由は、銅が亜硫酸ガスと容易に反応するためである。また、比較例2においてプル強度が低いのは、超音波接合時に脆弱なアルミニウム−Sn化合物を形成したためである。一方、実施例では、他の端子との接続部の信頼性に優れ、アルミニウムとの接続部の信頼性にも優れている。
【0033】
【発明の効果】
上述したように、本発明によるSn被覆を施した銅または銅合金部材は、他の端子との接続部の信頼性に優れ、アルミニウムとの接続部の信頼性にも優れているため、自動車用のコネクタ端子、バスバー、産業機械および民生機器などのコネクタ端子や、リードフレームなどの中で、アルミニウムとの接合箇所を有し且つSn被覆による電気的信頼性も要求される電気電子部品用材料として優れている。
【図面の簡単な説明】
【図1】本発明によるSn被覆を施した銅または銅合金部材の実施の形態の例を概略的に示す断面図。
【図2】本発明によるSn被覆を施した銅または銅合金部材の実施の形態を端子に応用した場合の斜視図。
【図3】実施例および比較例におけるSn被覆を施した銅または銅合金部材を概略的に示す断面図であり、図3(a)は実施例、図3(b)は比較例1、図3(c)は比較例2を示す。
【符号の説明】
10 銅または銅合金部材
12 Sn含有層
14 下地層
16 アルミニウム線またはアルミニウム板
100 銅または銅合金条
102 Sn被覆層[0001]
BACKGROUND OF THE INVENTION
TECHNICAL FIELD The present invention relates to a copper or copper alloy member coated with Sn, in which a copper or copper alloy member is coated with a Sn-containing layer, and a method for manufacturing the same, and more particularly to an automobile connector terminal, a bus bar, a terminal of an electric / electronic component, and a lead frame. In particular, the present invention relates to a copper or copper alloy member coated with Sn that can be joined to an aluminum wire or an aluminum plate, and a method for manufacturing the same.
[0002]
[Prior art]
As materials for electric and electronic parts such as terminals and bus bars, copper or copper alloy members having excellent electrical conductivity and excellent cost are widely used. Further, the outermost surface of the terminal material is often coated with Sn from the viewpoint of electrical reliability, corrosion resistance, solderability, appearance, and cost. For this Sn coating, a melt heat treatment or a melted Sn immersion treatment excellent in whisker resistance is widely used.
[0003]
Also, when connecting a copper wire to a terminal or bus bar whose outermost layer is coated with Sn, crimping to be connected by crimping, pressure welding to cut and connect the copper wire with a blade, or soldering to connect using a solder is common. Is.
[0004]
Moreover, weight reduction of the material is mentioned as environmental measures in recent years, and switching from a copper electric wire to an aluminum electric wire is examined. However, aluminum tends to form a strong oxide film, and the aluminum oxide film becomes a resistance in connection by pressure bonding or pressure welding. Further, since the aluminum oxide film is strong, it is difficult to connect by soldering.
[0005]
As a method for connecting aluminum and copper or a copper alloy, ultrasonic bonding has been developed in which solid-phase bonding is performed by applying pressure to each other and applying ultrasonic vibration (see, for example, Patent Document 1).
[0006]
[Patent Document 1]
JP-A-8-252679 (paragraph number 0015-0019)
[0007]
[Problems to be solved by the invention]
However, in the ultrasonic bonding of aluminum and Sn, a fragile aluminum-Sn alloy layer is formed on the bonding surface, the bonding strength is weak, and there is a problem that peeling easily due to vibration or the like occurs. Therefore, it was not possible to directly join aluminum to copper or copper alloy coated with Sn by ultrasonic bonding.
[0008]
In order to allow the Sn covering portion and the Sn non-covering portion to coexist in one terminal or bus bar, partial Sn plating for plating only a portion requiring Sn coating or stripe plating using a masking tape can be considered. However, an Sn coating method that does not perform the melting treatment is not preferable because whiskers are likely to occur and cause a short circuit failure. Therefore, there has been a demand for a material in which the Sn coating portion subjected to the melting treatment and the Sn non-covering portion where the raw copper or copper alloy is exposed coexist.
[0009]
Therefore, in view of such a conventional problem, an object of the present invention is to provide a copper or copper alloy member with Sn coating that can be joined to an aluminum member.
[0010]
[Means for Solving the Problems]
As a result of intensive studies to solve the above problems, the present inventors have coated the surface of a copper or copper alloy member with a Sn-containing layer, and then removed a part of the Sn-containing layer by cutting or grinding, When cutting or grinding, the copper or copper alloy member coated on a part of the Sn-containing layer is removed by a predetermined thickness so that the Sn-coated copper that can be joined to the aluminum member is applied. Or it discovered that a copper alloy member could be provided and came to complete this invention.
[0011]
That is, in the method for producing a copper or copper alloy member coated with Sn according to the present invention, after the surface of the copper or copper alloy member is coated with the Sn-containing layer, a part of the Sn-containing layer is removed by cutting or grinding. In the cutting or grinding, the portion of the copper or copper alloy member coated on a part of the Sn-containing layer is removed by a predetermined thickness.
[0012]
In this method of manufacturing a copper or copper alloy member coated with Sn, when the surface of the copper or copper alloy member is coated with a Sn-containing layer through an underlayer, a part of the Sn-containing layer is removed by cutting or grinding In this case, it is preferable to remove the portion of the underlayer that was covered with a part of the Sn-containing layer. Moreover, it is preferable that predetermined thickness is 0.01 mm or more, and the thickness of Sn content layer is 0.1-20 micrometers. The Sn-containing layer may contain 0 to 20% by weight of one or more of Pb, Zn, Cu, Ni, and Ag. Moreover, it is preferable that the center line average roughness Ra of the surface of the copper or copper alloy member exposed by removing the coating by cutting or grinding is 1 μm or less. Furthermore, it is preferable to coat the Sn-containing layer by a method of performing heat-melting treatment after electroplating or a molten Sn immersion treatment method.
[0013]
In addition, the copper or copper alloy member coated with Sn according to the present invention is coated with the Sn-containing layer on the surface of the copper or copper alloy member, and a part of the Sn-containing layer is removed by cutting or grinding. Alternatively, when grinding, the copper or copper alloy member portion covered by a part of the Sn-containing layer is removed by a predetermined thickness to form an exposed surface of the copper or copper alloy member. It is characterized by.
[0014]
In the copper or copper alloy member subjected to this Sn coating, the surface of the copper or copper alloy member is coated with the Sn-containing layer through the underlayer, and when part of the Sn-containing layer is removed by cutting or grinding, It is preferable that the part of the underlayer that has been coated on a part of the Sn-containing layer is also removed. Moreover, it is preferable that predetermined thickness is 0.01 mm or more, and the thickness of Sn content layer is 0.1-20 micrometers. The Sn-containing layer may contain 0 to 20% by weight of one or more of Pb, Zn, Cu, Ni, and Ag. Furthermore, the center line average roughness Ra of the exposed surface is preferably 1 μm or less. The exposed surface can be a surface to which an aluminum wire or an aluminum plate is joined.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a copper or copper alloy member coated with Sn according to the present invention and a method for manufacturing the same will be described with reference to the accompanying drawings.
[0016]
As shown in FIGS. 1 (a) to 1 (d), in the embodiment of the method for producing a copper or copper alloy member coated with Sn according to the present invention, the copper or copper alloy member 10 is plated, vapor-deposited, By immersion of molten metal or the like, the Sn-containing layer 12 having a thickness of 0.1 to 20 μm is coated with a single layer or multiple layers of the underlayer 14 as necessary. When the Sn coating method is other than the melted Sn dipping method, a heat melting process is performed thereafter to form a copper or copper alloy member coated with Sn. Next, an arbitrary portion of the copper or copper alloy member 10 for connecting the aluminum wire or the aluminum plate is formed by adding a thickness D of 0.01 mm or more to the thickness of the Sn-containing layer 12 from the surface. When the base layer 14 is formed, Sn is removed by cutting or grinding by a thickness D ′ obtained by adding a thickness of 0.01 mm or more to the thickness of the base layer 14 and the thickness of the Sn-containing layer 12. A material in which the covering portion and the Sn non-covering portion where the copper or copper alloy is exposed coexists is formed. In addition, Sn content layer may contain 0-20 weight% of 1 or more types of Pb, Zn, Cu, Ni, and Ag other than Sn.
[0017]
The thickness of the Sn-containing layer is 0.1 to 20 μm because the Sn coating is applied to ensure electrical connection reliability and corrosion resistance, and the thickness of the Sn-containing layer is less than 0.1 μm. Then, the function cannot be maintained, and if it exceeds 20 μm, it becomes economically disadvantageous.
[0018]
The thickness to be removed by cutting or grinding (and the thickness of the base layer 14) is set to a thickness D (or D ′) obtained by adding 0.01 mm or more to the thickness of the Sn-containing layer 12 below 0.01 mm. This is because it is difficult to completely remove the coated underlayer 14 and the Sn-containing layer 12 due to variations in the thickness of the coating and unevenness of the surface.
[0019]
The underlayer 14 is made of Sn, Cu, Ni, Fe, Zn, Co, Au, Ag, Pb or P alone or an alloy. The combination and thickness of the underlayer 14 can be variously selected according to required characteristics, but the thickness is preferably 20 μm or less in view of manufacturing conditions and cost.
[0020]
Moreover, it is preferable that the centerline average roughness Ra of the surface exposed by removing the coating by cutting or grinding is 1 μm or less. If the thickness exceeds 1 μm, the frictional resistance between aluminum and copper or a copper alloy increases, the efficiency of applying ultrasonic vibration between the aluminum and copper or copper alloy decreases, and the bonding force also decreases.
[0021]
As the Sn coating method, in order to improve the whisker resistance, it is preferable to use a method of performing heat melting (reflow) treatment after electroplating or a method of melting Sn immersion (hot dip) treatment. However, when the whisker resistance is not required, the heat-melting process or the molten Sn immersion process may not be performed.
[0022]
As shown in FIG. 2, the embodiment of the copper or copper alloy member coated with Sn according to the present invention is formed as a terminal and exposed to aluminum or wire on the surface of the copper or copper alloy member 10 exposed by cutting or grinding. Other parts (not shown) can be joined via the plate 16, and other terminals (not shown) can be connected to the portions covered with the Sn-containing layer 12. In addition, although the shape of the terminal shown in FIG. 2 is a male tab shape, other shapes such as a box shape or a bellows shape may be used.
[0023]
【Example】
Hereinafter, embodiments of a copper or copper alloy member coated with Sn according to the present invention and a manufacturing method thereof will be described in detail with reference to the accompanying drawings.
[0024]
[Example]
As shown in FIG. 3 (a), a copper alloy strip containing 0.1% by weight of Fe, Sn, Ni and P in copper as a material, having a Vickers hardness of 115, a thickness of 1.2 mm, and a width of 200 mm. 100 was prepared. The surface of the copper alloy strip 100 was activated by electrolytic degreasing and pickling, and then a 1 μm thick Sn coating layer 102 was formed thereon by electroplating using a sulfate bath. The reason for using electroplating as the coating method is that it is excellent in thickness control and advantageous in terms of cost. After electroplating, a melting treatment was performed. This melting process was performed using a burner furnace in a reducing atmosphere at a furnace temperature of 500 ° C. and a sheet feeding speed of 5 m / min.
[0025]
After cutting the Sn-coated copper alloy strip 100 to a width of 70 mm, a connecting portion is formed by removing a surface portion having a width of 20 mm and a depth of 0.05 mm from the end by cutting, and the center line average roughness Ra was finished to 0.2 μm.
[0026]
The thickness of the Sn coating layer 102 was measured with a fluorescent X-ray film thickness measuring instrument, and the center line average roughness was measured with a three-dimensional laser microscope.
[0027]
As the contents of the evaluation of the reliability of the connection part with other terminals, the measurement of the contact resistance value after holding for 120 hours in an air atmosphere at 160 ° C., and the sulfurous acid gas atmosphere (SO 2 gas concentration 10 ppm, temperature 40 ° C.) The corrosion resistance was evaluated after maintaining for 96 hours at a relative humidity of 80% RH. The contact resistance value was measured using a micro-ohmmeter, with an open voltage of 20 mV, a current of 10 mA, a 0.5-mm U-shaped gold wire probe, a maximum load of 100 gf, and no sliding. Obtained from the average value. Corrosion resistance was evaluated by observing the surface with a microscope and confirming the presence or absence of corrosion.
[0028]
In addition, as a content of evaluation of reliability of a connection portion with aluminum, an aluminum wire having a diameter of 25 μm and a breaking strength of 18 gf was bonded in a loop shape by ultrasonic bonding, and the pull strength of the loop was measured. The ultrasonic bonding was performed using an ultrasonic wedge wire bonder with a bonding time of 40 ms, a bonding load of 25 gf, and an ultrasonic output of 0.6 W. The pull strength was determined from the average value obtained by measuring the number of tests N = 5 times using a pull tester. In this evaluation, an aluminum wire having a diameter of 25 μm was used, but an aluminum wire or an aluminum plate having another size may be used.
[0029]
[Comparative Example 1]
As shown in FIG.3 (b), about the copper alloy member obtained by the method similar to an Example except not forming Sn coating layer and setting centerline average roughness Ra of the connection part to 0.10 micrometer. The same measurement and evaluation as in the examples were performed.
[0030]
[Comparative Example 2]
As shown in FIG.3 (c), about the copper alloy member obtained by the method similar to an Example except not removing a surface part and setting centerline average roughness Ra of a connection part to 0.04 micrometer, Measurements and evaluations similar to those in the examples were performed.
[0031]
The results of Examples, Comparative Examples 1 and 2 are shown in Tables 1 and 2.
[Table 1]
Figure 0004015033
[0032]
As shown in Table 1, Comparative Example 1 lacks the reliability of the connection with other terminals, and Comparative Example 2 lacks the reliability of the connection with aluminum. The reason why the contact resistance value is large in Comparative Example 1 is that the surface copper is left at high temperature to form a thick oxide, and the reason why discoloration / corrosion occurs is because copper easily reacts with sulfurous acid gas. is there. In Comparative Example 2, the pull strength is low because a fragile aluminum-Sn compound is formed during ultrasonic bonding. On the other hand, in an Example, it is excellent in the reliability of the connection part with another terminal, and is excellent also in the reliability of the connection part with aluminum.
[0033]
【The invention's effect】
As described above, the copper or copper alloy member coated with Sn according to the present invention is excellent in reliability of a connection portion with other terminals and excellent in reliability of a connection portion with aluminum. As a material for electrical and electronic parts that have joints with aluminum in connector terminals, busbars, industrial machinery and consumer equipment, lead frames, etc. and that require electrical reliability by Sn coating Are better.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view schematically showing an example of an embodiment of a copper or copper alloy member coated with Sn according to the present invention.
FIG. 2 is a perspective view when an embodiment of a copper or copper alloy member coated with Sn according to the present invention is applied to a terminal.
3 is a cross-sectional view schematically showing a copper or copper alloy member coated with Sn in Examples and Comparative Examples, in which FIG. 3 (a) is an example, FIG. 3 (b) is a comparative example 1, FIG. 3 (c) shows Comparative Example 2.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Copper or copper alloy member 12 Sn containing layer 14 Underlayer 16 Aluminum wire or aluminum plate 100 Copper or copper alloy strip 102 Sn coating layer

Claims (14)

銅または銅合金部材の表面をSn含有層で被覆した後、Sn含有層の一部を切削または研削により除去するとともに、その切削または研削の際に、そのSn含有層の一部に被覆されていた銅または銅合金部材の部分を所定の厚さ分だけ除去することを特徴とする、Sn被覆を施した銅または銅合金部材の製造方法。After the surface of the copper or copper alloy member is coated with the Sn-containing layer, a part of the Sn-containing layer is removed by cutting or grinding, and the part of the Sn-containing layer is coated during the cutting or grinding. A method for producing an Sn-coated copper or copper alloy member, wherein a portion of the copper or copper alloy member is removed by a predetermined thickness. 前記銅または銅合金部材の表面を下地層を介して前記Sn含有層で被覆し、前記Sn含有層の一部を切削または研削により除去する際に、前記Sn含有層の一部に被覆されていた下地層の部分を除去することを特徴とする、請求項1に記載のSn被覆を施した銅または銅合金部材の製造方法。When the surface of the copper or copper alloy member is covered with the Sn-containing layer through an underlayer, and part of the Sn-containing layer is removed by cutting or grinding, the Sn-containing layer is covered with a part of the Sn-containing layer. The method for producing a copper or copper alloy member coated with Sn according to claim 1, wherein a portion of the underlying layer is removed. 前記所定の厚さが0.01mm以上であることを特徴とする、請求項1または2に記載のSn被覆を施した銅または銅合金部材の製造方法。The method for producing a copper or copper alloy member coated with Sn according to claim 1 or 2, wherein the predetermined thickness is 0.01 mm or more. 前記Sn含有層の厚さが0.1〜20μmであることを特徴とする、請求項1乃至3のいずれかに記載のSn被覆を施した銅または銅合金部材の製造方法。The method for producing a copper or copper alloy member coated with Sn according to any one of claims 1 to 3, wherein the Sn-containing layer has a thickness of 0.1 to 20 µm. 前記Sn含有層が、Pb、Zn、Cu、NiおよびAgの1種以上を0〜20重量%含有することを特徴とする、請求項1乃至4のいずれかに記載のSn被覆を施した銅または銅合金部材の製造方法。5. The Sn-coated copper according to claim 1, wherein the Sn-containing layer contains 0 to 20 wt% of one or more of Pb, Zn, Cu, Ni, and Ag. Or the manufacturing method of a copper alloy member. 前記切削または研削により被覆を除去することによって露出した前記銅または銅合金部材の表面の中心線平均粗さRaが1μm以下であることを特徴とする、請求項1乃至5のいずれかに記載のSn被覆を施した銅または銅合金部材の製造方法。6. The center line average roughness Ra of the surface of the copper or copper alloy member exposed by removing the coating by the cutting or grinding is 1 μm or less. 6. The manufacturing method of the copper or copper alloy member which gave Sn coating | cover. 前記Sn含有層を、電気めっき後に加熱溶融処理を行う方法または溶融Sn浸漬処理方法により被覆することを特徴とする、請求項1乃至6のいずれかに記載のSn被覆を施した銅または銅合金部材の製造方法。The Sn-coated copper or copper alloy according to any one of claims 1 to 6, wherein the Sn-containing layer is coated by a method of performing a heat-melting treatment after electroplating or a method of immersing Sn by melting. Manufacturing method of member. 銅または銅合金部材の表面がSn含有層で被覆され、Sn含有層の一部が切削または研削により除去されるとともに、その切削または研削の際に、そのSn含有層の一部に被覆されていた銅または銅合金部材の部分が所定の厚さ分だけ除去されて、銅または銅合金部材の露出面が形成されていることを特徴とする、Sn被覆を施した銅または銅合金部材。The surface of the copper or copper alloy member is covered with a Sn-containing layer, and a part of the Sn-containing layer is removed by cutting or grinding, and at the time of the cutting or grinding, a part of the Sn-containing layer is covered. A copper or copper alloy member coated with Sn, wherein an exposed surface of the copper or copper alloy member is formed by removing a portion of the copper or copper alloy member by a predetermined thickness. 前記銅または銅合金部材の表面が下地層を介して前記Sn含有層で被覆され、前記Sn含有層の一部を切削または研削により除去する際に、前記Sn含有層の一部に被覆されていた下地層の部分が除去されていることを特徴とする、請求項8に記載のSn被覆を施した銅または銅合金部材。The surface of the copper or copper alloy member is covered with the Sn-containing layer via a base layer, and when the part of the Sn-containing layer is removed by cutting or grinding, the surface of the Sn-containing layer is covered. The copper or copper alloy member coated with Sn according to claim 8, wherein a portion of the underlying layer is removed. 前記所定の厚さが0.01mm以上であることを特徴とする、請求項8または9に記載のSn被覆を施した銅または銅合金部材。The copper or copper alloy member coated with Sn according to claim 8 or 9, wherein the predetermined thickness is 0.01 mm or more. 前記Sn含有層の厚さが0.1〜20μmであることを特徴とする、請求項8乃至10のいずれかに記載のSn被覆を施した銅または銅合金部材。The copper or copper alloy member coated with Sn according to any one of claims 8 to 10, wherein the Sn-containing layer has a thickness of 0.1 to 20 µm. 前記Sn含有層が、Pb、Zn、Cu、NiおよびAgの1種以上を0〜20重量%含有することを特徴とする、請求項8乃至11のいずれかに記載のSn被覆を施した銅または銅合金部材。The Sn-coated copper according to any one of claims 8 to 11, wherein the Sn-containing layer contains 0 to 20 wt% of one or more of Pb, Zn, Cu, Ni, and Ag. Or a copper alloy member. 前記露出面の中心線平均粗さRaが1μm以下であることを特徴とする、請求項8乃至12のいずれかに記載のSn被覆を施した銅または銅合金部材。The copper or copper alloy member coated with Sn according to any one of claims 8 to 12, wherein a center line average roughness Ra of the exposed surface is 1 µm or less. 前記露出面がアルミニウム線またはアルミニウム板を接合する面であることを特徴とする、請求項8乃至13のいずれかに記載のSn被覆を施した銅または銅合金部材。The copper or copper alloy member coated with Sn according to any one of claims 8 to 13, wherein the exposed surface is a surface to which an aluminum wire or an aluminum plate is joined.
JP2003021396A 2003-01-30 2003-01-30 Copper or copper alloy member coated with Sn and method for producing the same Expired - Lifetime JP4015033B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003021396A JP4015033B2 (en) 2003-01-30 2003-01-30 Copper or copper alloy member coated with Sn and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003021396A JP4015033B2 (en) 2003-01-30 2003-01-30 Copper or copper alloy member coated with Sn and method for producing the same

Publications (2)

Publication Number Publication Date
JP2004232014A JP2004232014A (en) 2004-08-19
JP4015033B2 true JP4015033B2 (en) 2007-11-28

Family

ID=32950739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003021396A Expired - Lifetime JP4015033B2 (en) 2003-01-30 2003-01-30 Copper or copper alloy member coated with Sn and method for producing the same

Country Status (1)

Country Link
JP (1) JP4015033B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100870334B1 (en) * 2004-09-10 2008-11-25 가부시키가이샤 고베 세이코쇼 Conductive material for connecting part and method for manufacturing the conductive material
JP4570948B2 (en) * 2004-12-10 2010-10-27 日鉱金属株式会社 Sn-plated strip of Cu-Zn alloy with reduced whisker generation and method for producing the same
WO2013038621A1 (en) * 2011-09-12 2013-03-21 パナソニック株式会社 Electrical connection structure, electrical equipment provided therewith, and method of manufacturing electrical connection structure

Also Published As

Publication number Publication date
JP2004232014A (en) 2004-08-19

Similar Documents

Publication Publication Date Title
JP4771970B2 (en) Conductive material for connecting parts
US8445057B2 (en) Conductive material for connecting part and method for manufacturing the conductive material
JP5025387B2 (en) Conductive material for connecting parts and method for manufacturing the same
US4441118A (en) Composite copper nickel alloys with improved solderability shelf life
JPH11350188A (en) Material for electric and electronic parts, its production, and electric and electronic parts lising the same
JPH11179586A (en) Lead-free soldered structure, and electronic unit
JPH11350189A (en) Material for electrical and electronic parts, its production and electrical and electronic parts using the material
JPH0978287A (en) Material for electric contact and electric contact part
JPH11229178A (en) Metallic coating member
JP2004300524A (en) Sn-COATED COPPER OR COPPER ALLOY MEMBER AND ITS MANUFACTURING METHOD
JP4015033B2 (en) Copper or copper alloy member coated with Sn and method for producing the same
JP2002161396A (en) Method for manufacturing tin - silver alloy plated film, and tin - silver alloy plated film, and lead frame for electronic component therewith
JPH1022434A (en) Lead frame for integrated circuit and manufacture thereof
JP2000054189A (en) MATERIAL FOR ELECTRIC AND ELECTRONIC PARTS USED BY BONDING WITH Sn-Bi-BASED SOLDER, ELECTRIC AND ELECTRONIC PARTS USING IT, ELECTRIC AND ELECTRONIC PARTS-MOUNTED SUBSTRATE, AND SOLDER BONDING, OR MOUNTING METHOD USING IT
JP3779864B2 (en) Electronic component lead wire, method for manufacturing the same, and electronic component using the lead wire
JPH01262092A (en) Solder and soldering commodity using said solder and soldering method
JP2000045039A (en) Contact material and its production
WO2016098669A1 (en) Solder alloy for plating and electronic component
JP2000030558A (en) Electric contact material and its manufacture
JP2004311950A (en) Tab terminal for electrolytic capacitor
JP3551168B2 (en) Pb-free solder connection structure and electronic equipment
JP2001200323A (en) Lead material for electronic parts and electronic parts using same lead material
JP2668569B2 (en) Brazing material
JP3810205B2 (en) Pin terminal for wire bonding
JPH1084065A (en) Conductive material for electronic component

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051226

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070831

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070911

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070912

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100921

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4015033

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100921

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110921

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120921

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130921

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term