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JP4095825B2 - Circuit equipment - Google Patents

Circuit equipment Download PDF

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Publication number
JP4095825B2
JP4095825B2 JP2002132802A JP2002132802A JP4095825B2 JP 4095825 B2 JP4095825 B2 JP 4095825B2 JP 2002132802 A JP2002132802 A JP 2002132802A JP 2002132802 A JP2002132802 A JP 2002132802A JP 4095825 B2 JP4095825 B2 JP 4095825B2
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JP
Japan
Prior art keywords
connection
contact
substrate
circuit board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002132802A
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Japanese (ja)
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JP2003069261A (en
Inventor
ゲープル クリスチアン
トルスキー ヴェルナー
シュテーガー ユルゲン
ベッケダール ピーター
マウリック パウル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Elektronik GmbH and Co KG
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Semikron Elektronik GmbH and Co KG
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Publication date
Priority claimed from DE10127947A external-priority patent/DE10127947C1/en
Application filed by Semikron Elektronik GmbH and Co KG filed Critical Semikron Elektronik GmbH and Co KG
Publication of JP2003069261A publication Critical patent/JP2003069261A/en
Application granted granted Critical
Publication of JP4095825B2 publication Critical patent/JP4095825B2/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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Description

【０００１】
【発明の属する技術分野】
本発明は、基本ボディと、上面において陽極・導体通路、陰極・導体通路、交流・導体通路、並びに補助接続部を有する少なくとも１つの基板と、それらの導体通路と少なくとも部分的に接触されている例えばトランジスタ、サイリスタ、ダイオード、抵抗、集積回路、又はセンサのような構成部品と、陽極・直流接続部及び陰極・直流接続部を有する中間回路ボードと、陽極・直流接続部と陰極・直流接続部の間に接続されている少なくとも１つの電気的なコンデンサと、少なくとも１つの交流接続部とを有する回路装置に関する。
【０００２】
【従来の技術】
ドイツ特許出願第10037533.2号明細書では、電気絶縁性の基板と、この基板上にあり互いに電気的に絶縁されている金属性の導体通路と、これらの導体通路上に取り付けられているパワースイッチとを備えた、寄生インダクタンスの小さな回路装置が記載されている。そこではパワースイッチがパワートランジスタを有し、これらのパワートランジスタは有利にはMOSFET又はIGBTで形成されている。
【０００３】
この種の回路装置の稼動は、中間回路内、基板上、並びに交流接続要素において熱を発生させる。中間回路の冷却は従来技術により構成部品における熱対流を介して行われる。基板の熱は冷却体に対する直接的な接触を介して運び去られる。交流接続要素の熱は従来技術により同様に熱対流だけを介して運び去られる。交流接続要素の温度上昇は、そこでオーム抵抗を増加させ、それにより電流容量をより小さくする。更に少なくとも１つの交流接続要素上にはセンサが配設され得て、それらの機能は温度上昇により損なわれる。
【０００４】
【発明が解決しようとする課題】
本発明の基礎を成す課題は、製造手間即ち組立手間が僅かであり、傑出した耐振動性及び耐衝撃性を有し、冷却体に対する中間回路内及び／又は接続要素にて発生する熱の排出が改善される、寄生インダクタンスの小さな冒頭に掲げた形式の回路装置を創作することである。
【０００５】
【課題を解決するための手段】
前記課題は、冒頭に掲げた形式の回路装置において、本発明に従い、以下の構成要件のうちの少なくとも１つにより解決される：
・ 中間回路ボードが、少なくとも１つの基板の陽極・導体通路及び陰極・導体通路と直接的に低インダクタンスで接触するための第１及び第２接触要素を有し、中間回路ボード及び少なくとも１つの基板には、第３接触要素を有する付属の交流接続要素が付設されていて、中間回路ボートの第１及び第２接触要素及び少なくとも１つの交流接続要素の第３接触要素を少なくとも１つの基板の付属の導体通路と電気的に接触させるためのプレス装置が設けられていること。
・ 外部に電気的に接触するための少なくとも１つの接続ピンが、電気絶縁性で熱伝導性のボディを用いて冷却体と熱接触状態にもたらされること。
・ 少なくとも１つの電流接続部の内部の接続プレートが部分領域を有し、これらの部分領域を用いて接続プレートが熱伝導性で電気絶縁性のボディを介して冷却体との接続を形成すること。
・ 冷却すべき少なくとも１つのコンデンサを有する中間回路ボードが、少なくとも１つの基板の陽極・導体通路及び陰極・導体通路と直接的に接触するための接触要素を有すること。
【０００６】
本発明による回路装置では３相交流（Ｕ、Ｖ、Ｗ）のために有利には３つの基板が設けられている。この種の回路装置は３つの交流接続部を有する。
【０００７】
本発明による回路装置が通常はパワークラスの回路装置である以上、基本ボディが冷却体に配置されていると有利であり、少なくとも１つの基板がその底面を用いて冷却体と熱伝導式で接触されていると有利である。この目的のために少なくとも１つの基板の底面には金属被覆或いは金属層が設けられ得て、基板はこの金属被覆或いは金属層を用いて広い面に渡って基本ボディ或いは冷却体上に載置される。基本ボディは、付属の基板のための少なくとも一つの区画を有するように枠状に形成されている。
【０００８】
本発明により中間回路ボードが陽極・直流接続部を有する第１金属面要素及び陰極・直流接続部を有する第２金属面要素を有し、これらの金属面要素が互いに絶縁されていると、比較的簡単に且つ僅かな製造コストで実現可能である回路装置が達成され、この際、中間回路ボードの少なくとも１つのコンデンサの接続要素は夫々の付属の金属面要素と接触されていて、中間回路ボードの接触要素は少なくとも１つの基板の夫々の付属の金属面要素と一体式に形成されている。陽極・直流接続部のための金属面要素及び陰極・直流接続部のための金属面要素は、有利には、例えば銅から成り且つ打ち抜かれて対応的に曲げられている板金により形成され得る。このようにして簡単に且つ低コストで実現可能である中間回路ボードを有する回路装置が得られ、この際、これらの長所は、コンパクトで機械的に頑丈であり並びに低インダクタンスの構成を伴う。陽極・直流接続部の金属面要素と陰極・直流接続部の金属面要素の電気絶縁は、電気絶縁性の材料から成り且つ一重に形成される面要素により実現され得る。直流接続部及び交流接続部を外部に電気的に接続させるために、基本ボディ上には接続ピンが設けられ、対応する接続要素には穴が設けられている。
【０００９】
他の可能性として、例えば、陽極・直流接続部と接続されている金属コーティングを１つの主面に有し、陰極・直流接続部と接続されている金属コーティングを反対側の第２の主面に有する中間回路ボードを設けることも可能であり、この際、中間回路ボードの接触要素は接触フィンガーにより形成されていて、これらの接触フィンガーを用いて接触要素が中間回路ボードと適合して接触されている。対応的に少なくとも１つの交流接続部には接触要素が設けられ得て、これらの接触要素は同様に接触フィンガーにより形成されていて、接触要素を少なくとも１つの交流接続要素と接触させる。しかし、この種の差込接触は無視することのできない組立手間を必要とし、それゆえに、中間回路ボードの両方の直流接続部の接触要素を対応的な金属面要素を用いて一体式で形成すること、及び、少なくとも１つの交流接続要素の接触要素をこの交流接続要素を用いて一体式で形成することが有利である。
【００１０】
中間回路ボードの接続要素及び少なくとも１つの交流接続要素を少なくとも１つの基板の付属の導体通路と電気的に接触させることがプレス装置を用いて行われ、このプレス装置が、形状安定性のプレスボディと、このプレスボディに適合された面寸法を有する制限された可撓性のプレス要素とを有すると本発明による回路装置において有利であると示された。有利には金属から構成される形状安定性のプレスボディと、制限された可撓性のプレス要素との間には合目的には電気絶縁性の材料から成る中間ボディが設けられていて、この中間ボディの管状の貫通要素は形状安定性のプレスボディを通じて延びている。本発明による回路装置のプレス装置上にはドライバ回路が配設され得て、この際、プレス装置を貫いて接触ワイヤ要素が延びていて、これらの接触ワイヤ要素は少なくとも１つの基板の夫々の付属の導体通路及び補助接続部とプレス接触されている。
【００１１】
【発明の実施の形態】
他の詳細、特徴、長所は、図面に描かれている本発明の回路装置の実施形態に関する以下の説明から明らかである。
【００１２】
図１には、基本ボディ１２を有する回路装置１０の構成において主要部が示されている。枠状の基本ボディ１２は、冷却体に取り付けられていて、互いに離された３つの区画１４を有する。各区画１４は基板１６のために設けられている。この種の基板１６は図２に描かれていて後で詳細に説明される。
【００１３】
基本ボディ１２からピン１８が上方に向かって立ててあり、これらのピン１８は、夫々に付属する交流接続要素２０を正確に位置決めするために設けられている。この種の交流接続要素２０は図４に描かれていて後で詳細に説明される。
【００１４】
基本ボディ１２から更に２つのピン２２が上方に向かって立ててあり、これらのピン２２は中間回路ボード２４を正確に位置決めするために設けられている。この種の中間回路ボード２４は図３において付属の電気的なコンデンサを伴わない分解斜視図として描かれていて後で詳細に説明される。
【００１５】
基本ボディ１２から一体式でネジ付きスリーブ２６が上方に向かって立ててあり、これらのネジ付きスリーブ２６は図５に分解斜視図で示されているプレス装置２８を基本ボディ１２に固定するために用いられる。
【００１６】
基板１６又は夫々の基板１６は、その上面３０において、陽極・導体通路（陽極・導電トラック）３２、陰極・導体通路（陰極・導電トラック）３４、これらの通路間に設けられている交流・導体通路（交流・導電トラック）３６、並びに補助接続部３８及び４０を有する。例えばパワートランジスタ又はパワーダイオードのような構成部品４２は導体通路３２、３４、３６及び補助接続部３８と接触されている。この接触は例えばボンディングワイヤ４４を用いて行われる。
【００１７】
中間回路ボード２４の陽極・直流接続部４６は夫々の基板１６の陽極・導体通路３２と接触されている。中間回路ボード２４（図３も参照のこと）の陰極・直流接続部４８は夫々の基板１６の陰極・導体通路３４と接触されている。この目的のために中間回路ボード２４は、陽極・直流接続部４６を有する第１金属面要素５０、及び、陰極・直流接続部４８を有する第２金属面要素５２を有し、これらの間には、図３から見て取れるように、金属面要素５０及び５２に面として適合される絶縁要素５４が設けられている。
【００１８】
金属面要素５０及び金属面要素５２には、銅のような導電性の金属から成る打抜板金が夫々に用いられ、この場合、陽極・直流接続部４６のための金属面要素５０から一体式で第１接触要素５６が離れてゆくように立てられている。これらの第１接触要素５６は、縦長の金属面要素５０の横方向に方向付けられていて、金属面要素５０と直角を形成する。これらの第１接触要素５６はプレス装置２８を使って夫々の基板１６の陽極・導体通路３２に対して押し付けられる。
【００１９】
陰極・直流接続部４８の金属面要素５２から離れてゆくように第２接触要素５８が縦方向に方向付けられて垂直に立てられていて、これらの第２接触要素５８はプレス装置２８を使って夫々の基板１６の陰極・導体通路３４に対して押し付けられる。
【００２０】
陽極・直流接続部４６の金属面要素５０は、中間回路ボード２４の非図示のコンデンサにおける対応的な接続部に電気伝導式で接触するための接触穴６０を有するように形成されている。陰極・直流接続部４８の金属面要素５２には、中間回路ボード２４の非図示のコンデンサにおける陰極・接続要素のための接触穴６２が設けられている。絶縁要素５４は、中間回路ボード２４のコンデンサの接続要素のために前記の穴に適合された貫通穴６４を有するように形成されている。
【００２１】
直接的に配設されている第１及び第２接触要素５６、５８を有する金属面要素５０、５２と、絶縁要素５４と、冷却体上に直接的に設けられる基板１６とから形成されている中間回路ボード２４の密に隣接する配置により、冷却体と、中間回路ボード２４上に配設されるコンデンサとの間において極めて効果的な熱接触が達成される。このことは中間回路内に発生する熱の効率のよい排出を可能とする。
【００２２】
陽極・直流接続部４６は穴６６を有するように形成されていて、この穴６６を通じ、基本ボディ１２から上方に向かって立てられているピン２２が延在する。陰極・直流接続部４８は穴６８を有するように形成されていて、この穴６８を通じ、基本ボディ１２の他のピン２２が延在する。
【００２３】
図４では交流接続要素２０が斜視図として明確化されていて、この交流接続要素２０は、陽極・直流接続部４６のための金属面要素５０における第１接触要素５６と同様に、第３接触要素７０を有する打抜板金として形成されていて、接続プレート７２を有するように形成されている。夫々の交流接続要素２０の接続プレート７２は穴７４を有するように形成されていて、組み立てられた状態で基本ボディ１２の対応的なピン１８が穴７４を通じて延在する。接続プレート７２には電流センサ１１４（図１も参照）を受け入れるための他の穴１０４も設けられている。夫々の交流接続要素２０の第３接触要素７０は夫々の基板１６の交流・導体通路３６と接触されている。中間回路ボード２４の陽極・直流接続部４６及び陰極・直流接続部４８のための金属面要素５０及び５２における第１及び第２接触要素５６及び５８は、回路装置１０の夫々の基板１６の付属の導体通路３２及び３４と低インダクタンスで直接的に接触するために用いられる。
【００２４】
電流センサ１１４のための穴１０４のまわりにおける接続プレート７２の領域は効果的な熱除去を必要とし、その理由は、一方では高すぎる温度が電流センサの機能を低減し、他方では接続プレート７２の高すぎる温度がこの接続プレート７２のオーム抵抗を増加させ、電流の最大の流れを減少させ、従って直接的に回路装置の能率を減少させるためである。
【００２５】
図５には、回路装置１０のプレス装置２８の構成が分解斜視図として明確化されている（図１も参照）。プレス装置２８は、制限された可撓性のプレス要素７６と、形状安定性のプレスボディ７８とを有する。制限された可撓性のプレス要素７６と、このプレス要素７６に底面として適合されている形状安定性のプレスボディ７８との間には電気絶縁性の材料から成る中間ボディ８０が設けられていて、この中間ボディ８０には絶縁スリーブ８２が中間ボディ８０から離れてゆくように立てられている。これらの絶縁スリーブ８２は、プレス装置２８が組み立てられた状態で、形状安定性のプレスボディ７８の対応的な穴８４を通じ、並びに、プレス要素７６の穴８６及び凹部８８内において延在する。形状安定性のプレスボディ７８は、例えば金属から構成され、例えば皿頭ネジのための皿穴９０を有するように形成されている。これらの皿穴９０は、基本ボディ１２から離れてゆくように立てられているネジ付きスリーブ２６と位置的に一致するように設けられていて、それにより前記の皿頭ネジを使ってプレス装置２８が基本ボディ１２に固定され、この際、プレス装置２８を使って同時に中間回路ボード２４が基板１６と適合するように接触される。
【００２６】
プレス装置２８の中間ボディ８０の絶縁スリーブ８２を通じて接触ワイヤ要素９２が延びていて、これらの接触ワイヤ要素９２には、絶縁スリーブ８２から僅かに出ている接触部分９４が上側に設けられ、絶縁スリーブ８２から下側に出ている下側のピン形状の端部分９６が設けられている。回路装置１０が組み立てられた状態で、接触ワイヤ要素９２の上側の接触部分９４は、プレス装置２８上に位置決めされている（非図示の）ドライバ回路における付属の接触箇所と接触する。この際、接触ワイヤ要素９２における下側のピン形状の端部分９６は、夫々の基板１６における付属の導体通路及び補助接続部と接触される。
【００２７】
図６には、接続プレート７２の領域からの熱除去を改善するための詳細部が示されている。そのために接続プレート７２の領域には基本ボディ１２内に凹部１１２が形成されている。これらの凹部１１２は、熱抵抗の小さな電気絶縁性のボディ１００（例えば、セラミック材料、雲母、酸化アルミニウムなど）を凹部１１２内に受容するために形成されている。また熱除去は２つの経路で達成され、これらの経路は、夫々が接続プレート７２の温度減少を自ずと達成するにもかかわらず、有利には両方とも使用される：
・ 接続プレート７２の対向する２つの側面において領域１０６が次のように折り曲げられる。即ち、これらの領域１０６が組立後にボディ１００と直接的な熱接触状態にあるようにである。また、ボディ１００は冷却体１０２と直接的な熱接触状態にある。
・ ピン１８が次のように形成されている。即ち、このピン１８が、有利にはネジ１０８を用いた接続領域と、フット１１０とから成り、この際、フット１１０は電気絶縁性のボディ１００に対する直接的な熱接触部を有し、ボディ１００の方は冷却体１０２と直接的な熱接触部を有する。接続ピン１８並びに接続プレート７２は、外部の交流接続を可能とするために、電気伝導式で接続されている。
【００２８】
図７には、非図示の冷却体の方から見た、交流接続部の分解図が示されている。凹部１１２は次のように形成されている。即ち、熱伝導性で電気絶縁性のボディ１００が、一方では接続ピン１８のフット１１０と折り曲げられている部分領域１０６（図４も参照）との間の熱接触部、他方では接続ピン１８のフット１１０と冷却体１２との間の熱接触部を形成するようにである。
【図面の簡単な説明】
【図１】 回路装置の主要部を立体的に示す図であり、この際、基本ボディは３相交流のための３つの基板を有し、ここで中間回路ボードは、基板が備え付けられている枠状の基本ボディから離されて示されている。
【図２】 図１による回路装置の基板を立体的に示す図である。
【図３】 図１による回路装置の中間回路ボードの立体的な分解図を示す図である。
【図４】 図１による回路装置の交流接続要素を立体的に示す図である。
【図５】 回路装置のプレス装置の立体的な分解図を示す図であり、この回路装置は図１ではプレス装置を伴わずに図示されている。
【図６】 本発明による構成の電流接続要素を有する回路装置の一部分の立体図、並びに本発明による構成の接続ピンを示す図である。
【図７】 基本ボディの一部分の立体図、並びに本発明による構成の接続ピンを示す図である。
【符号の説明】
１０ 回路装置
１２ 基本ボディ（１０より）
１４ 区画（１２より）
１６ 基板（１４内）
１８ ピン（１２において２０のため）
２０ 交流接続要素（１０より）
２２ ピン（１２において４６、４８のため）
２４ 中間回路ボード（１０より）
２６ ネジ付きスリーブ（１２において２８のため）
２８ プレス装置（１０より）
３０ 上面（１６より）
３２ 陽極・導体通路（３０における）
３４ 陰極・導体通路（３０における）
３６ 交流・導体通路（３０における）
３８ 補助接続部（３０における）
４０ 補助接続部（３０における）
４２ 構成部品（１６における）
４４ ボンディングワイヤ（４２における）
４６ 陽極・直流接続部（２４より）
４８ 陰極・直流接続部（２４より）
５０ 金属面要素（４６より）
５２ 金属面要素（４８より）
５４ 絶縁要素（５０と５２の間において２４より）
５６ 第１接触要素（５０における）
５８ 第２接触要素（５２における）
６０ 接触穴（５０内）
６２ 接触穴（５２内）
６４ 貫通穴（５４内）
６６ 穴（４６内）
６８ 穴（４８内）
７０ 第３接触要素（２０より）
７２ 接続プレート（２０より）
７４ 穴（７２内）
７６ 制限された可撓性のプレス要素（２８より）
７８ 形状安定性のプレスボディ（２８より）
８０ 中間ボディ（７６と７８の間において２８より）
８２ 絶縁スリーブ（８０より）
８４ 穴（７８内）
８６ 穴（７６内）
８８ 凹部（７６内）
９０ 皿穴（７８内）
９２ 接触ワイヤ要素（８２内）
９４ 接触部分（９２より）
９６ ピン形状の端部分（９２より）
１００ 絶縁ボディ
１０２ 冷却体
１０４ 穴（７２内）
１０６ 部分領域（接続プレート７２より）
１０８ ネジ（接続ピン１８より）
１１０ フット（接続ピン１８より）
１１２ 凹部（１２から）
１１４ 電流センサ[0001]
BACKGROUND OF THE INVENTION
The present invention is at least partially in contact with the basic body and at least one substrate having an anode / conductor passage, a cathode / conductor passage, an AC / conductor passage, and an auxiliary connection on the upper surface. For example, components such as transistors, thyristors, diodes, resistors, integrated circuits or sensors, an intermediate circuit board having an anode / DC connection and a cathode / DC connection, an anode / DC connection and a cathode / DC connection The present invention relates to a circuit device having at least one electric capacitor and at least one AC connection connected between each other.
[0002]
[Prior art]
In German Patent Application No. 10037533.2, an electrically insulating substrate, metallic conductor passages which are electrically insulated from each other on the substrate, and a power switch mounted on these conductor passages, A circuit device with a low parasitic inductance is provided. There, the power switch has power transistors, which are preferably formed of MOSFETs or IGBTs.
[0003]
The operation of this type of circuit arrangement generates heat in the intermediate circuit, on the substrate and in the AC connection element. The cooling of the intermediate circuit is performed via thermal convection in the component according to the prior art. The heat of the substrate is carried away through direct contact with the cooling body. The heat of the AC connecting element is carried away only by thermal convection according to the prior art as well. The temperature increase of the AC connection element then increases the ohmic resistance and thereby reduces the current capacity. Furthermore, sensors can be arranged on the at least one AC connection element, whose function is impaired by the temperature rise.
[0004]
[Problems to be solved by the invention]
The problem underlying the present invention is that there is little manufacturing or assembly effort, outstanding vibration resistance and shock resistance, and the discharge of heat generated in the intermediate circuit and / or in the connecting element to the cooling body. Is to create a circuit device of the type listed at the beginning with low parasitic inductance.
[0005]
[Means for Solving the Problems]
According to the invention, the object is achieved according to the invention by at least one of the following components:
The intermediate circuit board has first and second contact elements for direct contact with the anode / conductor passage and the cathode / conductor passage of the at least one substrate with low inductance; the intermediate circuit board and the at least one substrate; Is provided with an attached AC connection element having a third contact element, the first and second contact elements of the intermediate circuit boat and the third contact element of the at least one AC connection element being attached to at least one substrate A pressing device is provided for making electrical contact with the conductor passages.
-At least one connecting pin for electrical contact with the outside is brought into thermal contact with the cooling body using an electrically insulating and thermally conductive body.
The connection plate inside the at least one current connection has partial areas, with which the connection plate forms a connection with the cooling body via a thermally conductive and electrically insulating body .
The intermediate circuit board with at least one capacitor to be cooled has contact elements for direct contact with the anode / conductor passage and the cathode / conductor passage of the at least one substrate;
[0006]
In the circuit arrangement according to the invention, three substrates are preferably provided for three-phase alternating current (U, V, W). This type of circuit device has three AC connections.
[0007]
As long as the circuit device according to the invention is usually a power class circuit device, it is advantageous if the basic body is arranged in the cooling body, and at least one substrate is contacted with the cooling body in a heat-conducting manner using its bottom surface. It is advantageous to have. For this purpose, the bottom surface of at least one substrate can be provided with a metal coating or a metal layer, and the substrate is placed on the basic body or the cooling body over a wide surface using this metal coating or metal layer. The The basic body is formed in a frame shape so as to have at least one section for an attached substrate.
[0008]
According to the present invention, an intermediate circuit board has a first metal surface element having an anode / DC connection and a second metal surface element having a cathode / DC connection, and these metal surface elements are insulated from each other. A circuit arrangement is achieved which is simple and can be realized at low manufacturing costs, wherein the connection elements of at least one capacitor of the intermediate circuit board are in contact with the respective attached metal surface elements, The contact elements are integrally formed with respective attached metal surface elements of at least one substrate. The metal surface element for the anode-DC connection and the metal surface element for the cathode-DC connection can advantageously be formed by sheet metal, for example made of copper and stamped and correspondingly bent. In this way, a circuit device is obtained having an intermediate circuit board that can be realized simply and at low cost, with these advantages being compact, mechanically robust and with a low inductance configuration. The electrical insulation between the metal surface element of the anode / DC connection portion and the metal surface element of the cathode / DC connection portion can be realized by a surface element made of an electrically insulating material and formed in a single layer. In order to electrically connect the DC connection part and the AC connection part to the outside, a connection pin is provided on the basic body, and a corresponding connection element is provided with a hole.
[0009]
Another possibility is, for example, having a metal coating connected to the anode / DC connection on one main surface and a metal coating connected to the cathode / DC connection on the second main surface on the opposite side. It is also possible to provide an intermediate circuit board with which the contact elements of the intermediate circuit board are formed by contact fingers, which are used to contact the contact elements in conformity with the intermediate circuit board. ing. Correspondingly, contact elements can be provided on the at least one AC connection, which contact elements are likewise formed by contact fingers and bring the contact element into contact with the at least one AC connection element. However, this type of plug-in contact requires a non-negligible assembly effort and therefore forms the contact elements of both DC connections of the intermediate circuit board in one piece with corresponding metal surface elements It is advantageous that the contact element of the at least one AC connection element is formed integrally with the AC connection element.
[0010]
Electrical contact of the connecting element of the intermediate circuit board and the at least one alternating current connecting element with the attached conductor passage of the at least one substrate is carried out using a pressing device, the pressing device comprising a shape-stable press body And a limited flexible press element having a surface dimension adapted to the press body has been shown to be advantageous in the circuit arrangement according to the invention. Between the form-stable press body, preferably made of metal, and the limited flexible press element, an intermediate body made of electrically insulating material is provided for the purpose. The tubular body penetrating element extends through a shape-stable press body. A driver circuit can be arranged on the pressing device of the circuit device according to the invention, with contact wire elements extending through the pressing device, the contact wire elements being attached to each of the at least one substrate. The conductor passage and the auxiliary connection part are in press contact.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Other details, features and advantages will be apparent from the following description of the circuit device embodiments of the present invention depicted in the drawings.
[0012]
FIG. 1 shows a main part of the configuration of the circuit device 10 having the basic body 12. The frame-shaped basic body 12 is attached to the cooling body and has three compartments 14 separated from each other. Each compartment 14 is provided for a substrate 16. Such a substrate 16 is depicted in FIG. 2 and will be described in detail later.
[0013]
Pins 18 stand upward from the basic body 12, and these pins 18 are provided for accurately positioning the AC connecting elements 20 attached to each. Such an AC connecting element 20 is depicted in FIG. 4 and will be described in detail later.
[0014]
Two more pins 22 stand up from the base body 12 and are provided to accurately position the intermediate circuit board 24. This type of intermediate circuit board 24 is depicted in FIG. 3 as an exploded perspective view without an associated electrical capacitor and will be described in detail later.
[0015]
An integral threaded sleeve 26 stands up from the base body 12 and these threaded sleeves 26 are used to fix the pressing device 28 shown in an exploded perspective view in FIG. Used.
[0016]
The substrate 16 or each substrate 16 has an anode / conductor passage (anode / conductive track) 32, a cathode / conductor passage (cathode / conductive track) 34, and an AC / conductor provided between these passages on the upper surface 30. A passage (AC / conductive track) 36 and auxiliary connections 38 and 40 are provided. A component 42 such as a power transistor or power diode is in contact with the conductor passages 32, 34, 36 and the auxiliary connection 38. This contact is performed using, for example, the bonding wire 44.
[0017]
The anode / DC connection 46 of the intermediate circuit board 24 is in contact with the anode / conductor passage 32 of each substrate 16. The cathode / DC connection 48 of the intermediate circuit board 24 (see also FIG. 3) is in contact with the cathode / conductor passage 34 of each substrate 16. For this purpose, the intermediate circuit board 24 has a first metal surface element 50 having an anode / DC connection 46 and a second metal surface element 52 having a cathode / DC connection 48 between them. As can be seen from FIG. 3, an insulating element 54 is provided which is adapted as a surface to the metal surface elements 50 and 52.
[0018]
For the metal surface element 50 and the metal surface element 52, a stamped sheet metal made of a conductive metal such as copper is used, respectively. In this case, the metal surface element 50 for the anode / DC connection 46 is integrated with the metal surface element 50. Thus, the first contact element 56 is erected away. These first contact elements 56 are oriented laterally of the elongated metal surface element 50 and form a right angle with the metal surface element 50. These first contact elements 56 are pressed against the anode / conductor passages 32 of the respective substrates 16 using a pressing device 28.
[0019]
The second contact elements 58 are vertically oriented so as to move away from the metal surface element 52 of the cathode / DC connection 48, and these second contact elements 58 use the press device 28. And pressed against the cathode / conductor passage 34 of each substrate 16.
[0020]
The metal surface element 50 of the anode / DC connection 46 is formed to have a contact hole 60 for making electrical contact with a corresponding connection in a capacitor (not shown) of the intermediate circuit board 24. The metal surface element 52 of the cathode / DC connecting portion 48 is provided with a contact hole 62 for a cathode / connecting element in a capacitor (not shown) of the intermediate circuit board 24. The insulating element 54 is formed with a through hole 64 adapted to the hole for the capacitor connecting element of the intermediate circuit board 24.
[0021]
It is formed from metal surface elements 50, 52 having first and second contact elements 56, 58 arranged directly, an insulating element 54, and a substrate 16 provided directly on the cooling body. Due to the closely adjacent arrangement of the intermediate circuit board 24, a very effective thermal contact is achieved between the cooling body and the capacitors arranged on the intermediate circuit board 24. This allows efficient discharge of heat generated in the intermediate circuit.
[0022]
The anode / DC connecting portion 46 is formed to have a hole 66, and the pin 22 erected upward from the basic body 12 extends through the hole 66. The cathode / DC connecting portion 48 is formed to have a hole 68 through which the other pins 22 of the basic body 12 extend.
[0023]
In FIG. 4, the AC connection element 20 is clarified as a perspective view, and this AC connection element 20 has a third contact, similar to the first contact element 56 in the metal surface element 50 for the anode / DC connection 46. It is formed as a stamped sheet metal having an element 70 and is formed to have a connection plate 72. The connection plate 72 of each AC connection element 20 is formed with a hole 74 so that the corresponding pin 18 of the basic body 12 extends through the hole 74 in the assembled state. The connection plate 72 is also provided with another hole 104 for receiving a current sensor 114 (see also FIG. 1). The third contact element 70 of each AC connecting element 20 is in contact with the AC / conductor passage 36 of each substrate 16. The first and second contact elements 56 and 58 in the metal surface elements 50 and 52 for the anode-DC connection 46 and the cathode-DC connection 48 of the intermediate circuit board 24 are attached to the respective substrates 16 of the circuit device 10. Used to make direct contact with the conductor passages 32 and 34 with low inductance.
[0024]
The area of the connection plate 72 around the hole 104 for the current sensor 114 requires effective heat removal, because too high a temperature reduces the function of the current sensor on the one hand, and on the other hand the connection plate 72's function. This is because an excessively high temperature increases the ohmic resistance of this connection plate 72 and reduces the maximum flow of current, thus directly reducing the efficiency of the circuit arrangement.
[0025]
In FIG. 5, the configuration of the pressing device 28 of the circuit device 10 is clarified as an exploded perspective view (see also FIG. 1). The pressing device 28 has a limited flexible pressing element 76 and a shape-stable pressing body 78. An intermediate body 80 made of an electrically insulating material is provided between the limited flexible press element 76 and a shape-stable press body 78 adapted as a bottom surface to the press element 76. The intermediate body 80 is provided with an insulating sleeve 82 so as to move away from the intermediate body 80. These insulating sleeves 82 extend through corresponding holes 84 in the shape-stable press body 78 and in the holes 86 and recesses 88 of the press element 76 with the press device 28 assembled. The shape-stable press body 78 is made of, for example, metal and is formed to have a countersunk hole 90 for a countersunk head screw, for example. These countersunk holes 90 are provided so as to coincide with the threaded sleeve 26 standing away from the basic body 12, thereby using the countersunk head screw to press the machine 28. Is fixed to the basic body 12 while the intermediate circuit board 24 is brought into contact with the substrate 16 at the same time using the pressing device 28.
[0026]
Contact wire elements 92 extend through insulating sleeves 82 of the intermediate body 80 of the pressing device 28, and these contact wire elements 92 are provided with contact portions 94 slightly protruding from the insulating sleeves 82 on the upper side. A lower pin-shaped end portion 96 protruding downward from 82 is provided. With the circuit device 10 assembled, the upper contact portion 94 of the contact wire element 92 contacts an associated contact location in a driver circuit (not shown) positioned on the press device 28. At this time, the lower pin-shaped end portions 96 of the contact wire elements 92 are brought into contact with the associated conductor passages and auxiliary connections in the respective substrates 16.
[0027]
FIG. 6 shows details for improving heat removal from the area of the connection plate 72. For this purpose, a recess 112 is formed in the basic body 12 in the region of the connection plate 72. These recesses 112 are formed to receive in the recesses 112 an electrically insulating body 100 (for example, ceramic material, mica, aluminum oxide, etc.) having a low thermal resistance. Heat removal is also achieved in two paths, which are advantageously used both, although each naturally achieves a temperature reduction of the connecting plate 72:
The region 106 is bent at the two opposite side surfaces of the connection plate 72 as follows. That is, these regions 106 are in direct thermal contact with the body 100 after assembly. The body 100 is in direct thermal contact with the cooling body 102.
The pin 18 is formed as follows. That is, the pin 18 preferably comprises a connection area using screws 108 and a foot 110, where the foot 110 has a direct thermal contact with the electrically insulating body 100. This has a direct thermal contact with the cooling body 102. The connection pins 18 and the connection plate 72 are electrically connected to enable external AC connection.
[0028]
FIG. 7 shows an exploded view of the AC connection portion viewed from a cooling body (not shown). The recess 112 is formed as follows. That is, the thermally conductive and electrically insulating body 100 is on the one hand the thermal contact between the foot 110 of the connection pin 18 and the bent partial area 106 (see also FIG. 4), on the other hand the connection pin 18 It seems to form a thermal contact between the foot 110 and the cooling body 12.
[Brief description of the drawings]
FIG. 1 is a diagram three-dimensionally showing the main part of a circuit device, wherein the basic body has three substrates for three-phase alternating current, where the intermediate circuit board is equipped with a substrate Shown away from the frame-shaped basic body.
2 is a diagram three-dimensionally showing a substrate of the circuit device according to FIG. 1;
FIG. 3 shows a three-dimensional exploded view of the intermediate circuit board of the circuit device according to FIG. 1;
4 is a diagram three-dimensionally showing the AC connection element of the circuit device according to FIG. 1;
FIG. 5 is a diagram showing a three-dimensional exploded view of a pressing device of a circuit device, and this circuit device is shown without a pressing device in FIG. 1;
FIG. 6 shows a three-dimensional view of a part of a circuit device having a current connection element configured according to the present invention, as well as a connection pin configured according to the invention.
FIG. 7 shows a three-dimensional view of a part of a basic body and a connection pin with a configuration according to the invention.
[Explanation of symbols]
10 Circuit device 12 Basic body (from 10)
14 divisions (from 12)
16 Substrate (within 14)
18 pins (for 20 in 12)
20 AC connection element (from 10)
22 pins (for 46, 48 in 12)
24 Intermediate circuit board (from 10)
26 Threaded sleeve (for 28 in 12)
28 Press machine (from 10)
30 Top (from 16)
32 Anode / conductor passage (in 30)
34 Cathode / conductor passage (in 30)
36 AC / conductor path (in 30)
38 Auxiliary connections (in 30)
40 Auxiliary connection (in 30)
42 components (in 16)
44 Bonding wire (at 42)
46 Anode / DC connection (from 24)
48 Cathode / DC connection (From 24)
50 metal surface elements (from 46)
52 Metal surface elements (from 48)
54 Insulating element (between 24 and 50 and 52)
56 first contact element (in 50)
58 second contact element (at 52)
60 Contact hole (inside 50)
62 Contact hole (inside 52)
64 Through hole (within 54)
66 holes (inside 46)
68 holes (within 48)
70 third contact element (from 20)
72 Connection plate (from 20)
74 holes (in 72)
76 Limited flexible press element (from 28)
78 Shape-stable press body (from 28)
80 intermediate body (between 76 and 78 from 28)
82 Insulation sleeve (from 80)
84 holes (in 78)
86 holes (in 76)
88 recess (in 76)
90 countersink (within 78)
92 Contact wire element (in 82)
94 Contact part (from 92)
96 Pin-shaped end (from 92)
100 Insulating body 102 Cooling body 104 Hole (in 72)
106 Partial area (from connection plate 72)
108 screw (from connection pin 18)
110 feet (from connection pin 18)
112 Recess (from 12)
114 Current sensor

Claims (16)

基本ボディ（１２）と、この基本ボディ（１２）内に配設され且つ上面（３０）において陽極・導体通路（３２）、陰極・導体通路（３４）、交流・導体通路（３６）、並びに補助接続部（３８、４０）を有する少なくとも１つの基板（１６）と、それらの導体通路（３２、３４、３６）及び補助接続部（３８、４０）と少なくとも部分的に接触されている構成部品（４２）と、基板（１６）上に配設され、陽極・直流接続部（４６）及び陰極・直流接続部（４８）を有し、これらの陽極・直流接続部（４６）と陰極・直流接続部（４８）の間に接続されている少なくとも１つの電気的なコンデンサを有する中間回路ボード（２４）と、少なくとも１つの交流接続要素（２０）とを有する回路装置において、
中間回路ボード（２４）の陽極・直流接続部（４６）が、基板（１６）の陽極・導体通路（３２）と直接的に低インダクタンスで接触するための第１接触要素（５６）を有し、中間回路ボード（２４）の陰極・直流接続部（４８）が、基板（１６）の陰極・導体通路（３４）と直接的に低インダクタンスで接触するための第２接触要素（５８）を有すること、
中間回路ボード（２４）及び少なくとも１つの基板（１６）には、基板（１６）の交流・導体通路（３６）と接触するための第３接触要素（７０）を有する交流接続要素（２０）が付設されていること、及び、
基本ボディ（１２）には接続ピン（１８、２２）が設けられていて、交流接続要素（２０）の接続プレート（７２）の穴（７４）を通じて付属の接続ピン（１８）が延在し、中間回路ボード（２４）の陽極・直流接続部（４６）の穴（６６）を通じて付属の接続ピン（２２）が延在し、中間回路ボード（２４）の陰極・直流接続部（４８）の穴（６８）を通じて付属の接続ピン（２２）が延在していること
を特徴とする回路装置。A basic body (12) and an anode / conductor passage (32), a cathode / conductor passage (34), an AC / conductor passage (36), and an auxiliary member disposed in the basic body (12) and on the upper surface (30) At least one substrate (16) with connections (38, 40) and components (at least partially in contact with their conductor passages (32, 34, 36) and auxiliary connections (38, 40)) and 42), disposed on the substrate (16), possess an anode-DC connection (46) and the cathode-DC connection (48), a cathode-DC connections these anode-DC connection (46) In a circuit arrangement comprising an intermediate circuit board (24) having at least one electrical capacitor connected between the parts (48) and at least one AC connection element (20),
The anode and the DC connection of the intermediate circuit board (24) (46), have a positive-conductor passages (32) directly with the first contact element for contacting with a low-inductance of the substrate (16) (56) The intermediate circuit board (24) has a second contact element (58) for direct contact with the cathode / conductor passage (34) of the substrate (16) with low inductance. To do,
The circuit board between the middle (24) and at least one substrate (16), exchanges connecting element having a third contact element (70) for contacting the exchange and conductor paths of the substrate (16) (36) (20 ) Is attached , and
The basic body (12) is provided with connection pins (18, 22), and the attached connection pins (18) extend through holes (74) in the connection plate (72) of the AC connection element (20). The attached connection pin (22) extends through the hole (66) of the anode / DC connection (46) of the intermediate circuit board (24), and the hole of the cathode / DC connection (48) of the intermediate circuit board (24). A circuit arrangement characterized in that the attached connection pin (22) extends through (68) . 少なくとも１つの接続ピン（１８、２２）がフット（１１０）を有し、フット（１１０）が電気絶縁性で熱伝導性のボディ（１００）を介して冷却体（１０２）上に配設されていることを特徴とする、請求項１に記載の回路装置。Even without least have one connecting pin (18, 22) of the foot (110), arranged on the cooling body (102) via a foot (110) body (100) of the thermal conductivity in the electrically insulating characterized in that it is, the circuit device according to claim 1. 少なくとも１つの接続プレート（７２）が部分領域（１０６）を有し、これらの部分領域（１０６）が電気絶縁性で熱伝導性のボディ（１００）を介して冷却体（１０２）に対して熱的に接触していることを特徴とする、請求項１又は２に記載の回路装置。At least one connecting plate (72) has partial areas (106), which are heated against the cooling body (102) via an electrically insulating and thermally conductive body (100). The circuit device according to claim 1, wherein the circuit device is in contact with each other. ３相交流（Ｕ、Ｖ、Ｗ）のために３つの基板（１６）が設けられていることを特徴とする、請求項１に記載の回路装置。The circuit arrangement according to claim 1, characterized in that three substrates (16) are provided for three-phase alternating current (U, V, W). 基本ボディ（１２）が冷却体に取り付けられていること、及び、少なくとも１つの基板（１６）がその底面を用いて基本ボディ（１２）と熱伝導式で接触されていることを特徴とする、請求項１に記載の回路装置。The basic body (12) is attached to the cooling body, and at least one substrate (16) is in thermal contact with the basic body (12) using its bottom surface, The circuit device according to claim 1. 中間回路ボード（２４）が、陽極・直流接続部（４６）を有する第１金属面要素（５０）及び陰極・直流接続部（４８）を有する第２金属面要素（５２）を有し、これらの金属面要素が互いに電気絶縁されていて、少なくとも１つのコンデンサの接続要素が中間回路ボード（２４）の夫々付属の第１或いは第２金属面要素（５０、５２）と接触されていて、中間回路ボード（２４）の第１接触要素（５６）が第１金属面要素（５０）と一体式に形成されていて、中間回路ボード（２４）の第２接触要素（５８）が第２金属面要素（５２）と一体式に形成されていることを特徴とする、請求項１に記載の回路装置。The intermediate circuit board (24) has a first metal surface element (50) having an anode / DC connection (46) and a second metal surface element (52) having a cathode / DC connection (48). the metal surface elements have been electrically insulated from each other, have been contacted with at least one first or second metal surface element of the connecting element of the capacitor with each genus of the intermediate circuit board (24) (50, 52), The first contact element (56 ) of the intermediate circuit board (24) is integrally formed with the first metal surface element (50 ), and the second contact element (58) of the intermediate circuit board (24) is the second metal. characterized Rukoto surface element (52) are formed integrally, the circuit device according to claim 1. 少なくとも１つの交流接続要素（２０）が第３接触要素（７０）と一体式に形成されていることを特徴とする、請求項１に記載の回路装置。2. A circuit arrangement according to claim 1, characterized in that at least one AC connection element (20) is formed integrally with the third contact element (70). 構成部品（４２）が、パワーダイオード、パワーサイリスタ、パワートランジスタ、センサ、抵抗、及び／又は、集積回路であることを特徴とする、請求項１に記載の回路装置。2. A circuit arrangement according to claim 1, characterized in that the component (42) is a power diode, a power thyristor, a power transistor, a sensor, a resistor and / or an integrated circuit. 第１、第２、第３接触要素（５６、５８、７０）を少なくとも１つの基板（１６）の前記の導体通路（３２、３４、３６）と電気的に接触させるためのプレス装置（２８）が設けられていることを特徴とする、請求項１に記載の回路装置。Press device (28) for making first, second and third contact elements (56, 58, 70) in electrical contact with said conductor passages (32, 34, 36) of at least one substrate (16) The circuit device according to claim 1, wherein the circuit device is provided. プレス装置（２８）が、形状安定性のプレスボディ（７８）と、プレスボディ（７８）に適合された面寸法を有する制限された可撓性のプレス要素（７６）とを有することを特徴とする、請求項９に記載の回路装置。The press device (28) has a shape-stable press body (78) and a limited flexible press element (76) having a surface dimension adapted to the press body (78). The circuit device according to claim 9 . プレス装置（２８）上にはドライバ回路が配設されていて、プレス装置（２８）を貫いて接触ワイヤ要素（９２）が延びていて、これらの接触ワイヤ要素が、ドライバ回路と、及び、少なくとも１つの基板（１６）の付属の前記の導体通路（３２、３４、３６）及び補助接続部（３８、４０）とプレス接触されていることを特徴とする、請求項９に記載の回路装置。A driver circuit is disposed on the pressing device (28), and a contact wire element (92) extends through the pressing device (28), the contact wire element including the driver circuit and at least 10. A circuit arrangement according to claim 9 , characterized in that it is in press contact with the attached conductor passages (32, 34, 36 ) and auxiliary connections (38, 40 ) of one substrate (16). 熱伝導性で電気絶縁性のボディ（１００）がセラミック材料から構成されていることを特徴とする、請求項２又は３に記載の回路装置。 4. A circuit arrangement according to claim 2 or 3 , characterized in that the thermally conductive and electrically insulating body (100) is made of a ceramic material. 接続ピン（１８）がそのフット（１１０）の反対側の部分にネジ（１０８）を有することを特徴とする、請求項２に記載の回路装置。3. A circuit arrangement according to claim 2, characterized in that the connecting pin (18) has a screw (108) on the part opposite its foot (110). 接続プレート（７２）の部分領域（１０６）が接続プレート（７２）自体の折り曲げられた領域により形成されることを特徴とする、請求項３に記載の回路装置。4. A circuit arrangement according to claim 3 , characterized in that the partial region (106) of the connection plate (72) is formed by a folded region of the connection plate (72) itself. 接続ピン（１８）が、基本ボディ（１２）に埋設されていて、接続プレート（７２）と熱伝導式及び電気伝導式で接続されていることを特徴とする、請求項１に記載の回路装置。Connecting pins (18), have been embedded in the basic body (12), connecting plate (72) and characterized in that it is connected by thermal conduction and electrical conduction, circuit device according to claim 1 . 基板（１６）、第１及び第２接触要素（５６、５８）、第１及び第２金属面要素（５０、５２）が、密に隣接して配設されていて、少なくとも１つのコンデンサを冷却するために、少なくとも１つのコンデンサと、基本ボディ（１２）に取り付けられた冷却体との間において熱伝導式で電気絶縁式の短い接続経路を形成することを特徴とする、請求項６に記載の回路装置。 Board (16), first and second contact elements (56, 58), first and second metal surface element (50, 52) is, they are disposed in close adjacent at least one capacitor to cool, and forming at least one capacitor, a short connecting path electrically insulating type in heat conduction between the cooling body which is attached to the basic body (12), in claim 6 The circuit device described .
JP2002132802A 2001-06-08 2002-05-08 Circuit equipment Expired - Lifetime JP4095825B2 (en)

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DE10127947A DE10127947C1 (en) 2001-08-22 2001-06-08 Circuit device for power semiconductor module has intermediate circuit board with DC and AC terminals coupled to conductor paths of substrate incorporated in base body
DE10141114A DE10141114C1 (en) 2001-06-08 2001-08-22 Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink
DE10141114.6 2001-08-22

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CN1391279A (en) 2003-01-15
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US20020186543A1 (en) 2002-12-12
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