JP3937507B2 - Method for producing translucent electromagnetic shielding material - Google Patents

Description

[0001]
[Field of the Invention]
The present invention relates to a method for producing a light-transmitting electromagnetic wave shielding material that functions to shield electromagnetic waves and that can be seen through the opposite side of the material.
[0002]
[Prior art]
Electronic devices such as computers that use a large amount of ICs and LSIs easily generate electromagnetic waves, and this electromagnetic waves cause troubles such as malfunctioning of surrounding devices. In recent years, with the spread of devices related to electromagnetic interference, and the influence of electromagnetic waves on the human body has been discussed, the demand for electromagnetic shielding materials is increasing.
[0003]
Some electromagnetic wave shielding materials not only serve to shield electromagnetic waves, but also, for example, can be used as a front panel for a display or a microwave oven window, for example, behind the electromagnetic wave shielding material. There is a translucent one that can be seen. In particular, when a front panel such as a display is used, the display screen is viewed through an electromagnetic wave shielding material. Therefore, a display having excellent visibility of the display screen while maintaining the electromagnetic wave shielding property is desired.
[0004]
Therefore, the inventor of the present invention first invented a translucent electromagnetic shielding material having excellent electromagnetic shielding effect and visibility and a method for producing the same, and has applied for a patent (Japanese Patent Application No. 8-71149). That is, in some translucent electromagnetic wave shielding materials, a metal layer is laminated in a pattern on a transparent substrate, and a black resist layer that is in register with the metal layer is laminated on the metal layer.
[0005]
In addition, such a method for producing a translucent electromagnetic shielding material includes a step of providing a metal layer on the entire surface of the transparent substrate, a step of providing a black resist layer on the metal layer in a pattern, and a portion not covered with the black resist layer. It comprises a step of removing the metal layer by etching. In this invention, as a specific means for providing the black resist layer in a pattern on the metal layer, a roll coating method, a spin coating method, a whole surface printing method, and a black dye pigment contained in a photoresist material, An offset printing method or a gravure printing method is employed by using a solid material formed by a transfer method, exposing with a mask, developing, or using a printing resist material containing a black dye / pigment.
[0006]
[Problems to be solved by the invention]
Since the translucent electromagnetic shielding material according to the previous patent application (Japanese Patent Application No. 8-71149) has an excellent electromagnetic shielding effect and visibility, no new problems occur. However, the manufacturing method has the following problems. That is, in the above-described method for producing a light-transmitting electromagnetic wave shielding material, exposure, development and printing are performed. Therefore, when selecting a resist material, workability in a state in which these black dyes and pigments are contained must be considered. However, there is a problem that the range of use of the resist material becomes narrow, and there is a problem that the cost is increased in some cases.
[0007]
Accordingly, an object of the present invention is to provide a method for producing a light-transmitting electromagnetic wave shielding material, which can use a wide range of resist materials for the black resist layer 4.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the method for producing a translucent electromagnetic wave shielding material of the present invention includes a step of providing a metal layer on a transparent substrate, a step of providing a patterned release layer on the metal layer, a metal layer and a release The method comprises a step of providing a black resist layer on the layer, a step of removing the black resist layer by peeling the release layer, and a step of removing the metal layer of the portion from which the black resist layer has been removed by etching. .
[0009]
Also, a step of providing a metal layer on the transparent substrate, a step of providing a mask layer on a part of the metal layer, a step of providing a patterned release layer on at least the metal layer, a black resist layer on at least the metal layer and the release layer A step of removing the black resist layer by peeling off the peeling layer with a peeling solution, a step of removing a portion of the metal layer not covered with the black resist layer and the mask layer by etching, a mask layer You may comprise so that it may consist of the process which removes and the part which the metal layer exposed exposes to an earth part.
[0010]
Also, a step of providing a metal layer on the transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a mask layer on a part of the exposed metal layer, a black resist layer on at least the metal layer and the release layer A step of removing the black resist layer by peeling off the peeling layer with a peeling solution, a step of removing a portion of the metal layer not covered with the black resist layer and the mask layer by etching, a mask layer You may comprise so that it may consist of the process which removes and the part which the metal layer exposed exposes to an earth part.
[0011]
Also, a step of providing a metal layer on the transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a black resist layer on the metal layer and the release layer, and removing the release layer with a release liquid From the step of removing the upper black resist layer, the step of removing the portion of the metal layer from which the black resist layer has been removed by etching, and the step of removing a portion of the black resist layer and using the exposed portion of the metal layer as the ground portion You may comprise so that it may become.
[0012]
In addition, the release layer was formed of a printing resist material or a photoresist material. Moreover, the film thickness of the black resist layer was comprised by 0.1 micrometer-10 micrometers. The stripping solution was composed of water, an aqueous sodium hydroxide solution, an aqueous potassium hydroxide solution, acetone, and ethyl cellosolve acetate.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. FIG. 1 is a schematic view showing an embodiment of a process for producing a translucent electromagnetic wave shielding material of the present invention, FIGS. 2 to 5 are schematic views showing an embodiment of a pattern of a release layer, and FIGS. FIG. 10 is a schematic view showing an embodiment of a pattern, FIG. 10 is a schematic view showing an embodiment of a light-transmitting electromagnetic wave shielding material having a ground part, and FIGS. 11 to 13 are steps for producing the light-transmitting electromagnetic wave shielding material of the present invention. It is a schematic diagram which shows one Example. 1 is a transparent substrate, 2 is a metal layer, 3 is a release layer, 4 is a black resist layer, 5 is a ground portion, 6 is a translucent electromagnetic wave shield portion, and 7 is a mask layer.
[0014]
In the manufacturing process of the translucent electromagnetic wave shielding material shown in FIG. 1, first, the metal layer 2 is provided on the transparent substrate 1 (see FIG. 1a).
[0015]
The material of the transparent substrate 1 is glass, acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin, polysulfone resin, polyethersulfone resin, polyvinyl chloride, and the like. Any transparent material can be used. The transparent substrate 1 includes a plate and a film.
[0016]
As a material of the metal layer 2, for example, a material having a conductivity that can sufficiently shield electromagnetic waves, such as gold, silver, copper, iron, aluminum, nickel, and chromium, is used. Further, the metal layer 2 may not be a simple substance, but may be an alloy or a multilayer. Examples of the method for forming the metal layer 2 include a method of depositing from a gas phase such as vapor deposition, sputtering, and ion plating, a method of bonding a metal foil, and a method of electrolessly plating the surface of the transparent substrate 1. The thickness of the metal layer 2 is preferably 0.1 μm to 50 μm. If it exceeds 50 μm, it becomes difficult to finish the pattern with high accuracy, and if it is less than 0.1 μm, the minimum necessary conductivity for maintaining the electromagnetic wave shielding effect cannot be secured stably.
[0017]
Next, a patterned release layer 3 is provided on the metal layer 2 (see FIG. 1b). As a material for the release layer 3, a commercially available printing resist material or photoresist material is generally used. As a method for forming the release layer 3, a printing resist material is used to form a pattern on the metal layer 2 by a screen printing method or a roll coating method, a spin coating method, a dip coating method using a photoresist material, A solid print is formed on the metal layer 2 by a printing method, a transfer method, etc., exposure is performed using a mask, and development is performed to form a pattern. In this case, since black dye / pigment is not included, workability at the time of exposure / development and printing is not a problem. Examples of the pattern of the release layer 3 include a reverse lattice shape (see FIG. 2), a reverse honeycomb shape (see FIG. 3), a reverse ladder shape (see FIG. 4), and a polka dot shape (see FIG. 5).
[0018]
Next, a black resist layer 4 is provided on the metal layer 2 and the release layer 3 (see FIG. 1c). The black resist layer 4 is a layer for suppressing the reflection on the surface of the metal layer 2 and improving the visibility, and is used as an etching resist for patterning the metal layer 2 in the process of manufacturing the translucent electromagnetic wave shielding material. Is a layer. As a material of the black resist layer 4, for example, a resin such as polyester containing a black dye / pigment is used. Examples of the method for forming the black resist layer 4 include a roll coating method and dip coating. The thickness of the black resist layer 4 is preferably 0.1 μm to 10 μm. If it exceeds 10 μm, peeling of the release layer 3 becomes difficult, and if it is less than 0.1 μm, sufficient light-shielding properties cannot be maintained and reflection on the surface of the metal layer 2 is difficult to be suppressed.
[0019]
Further, the black resist layer 4 is removed by peeling the release layer 3 with a release liquid (see FIG. 1d). As a result, the black resist layer 4 becomes a pattern obtained by inverting the pattern of the release layer 3. For example, there are patterns such as a lattice shape (see FIG. 6), a honeycomb shape (see FIG. 7), a ladder shape (see FIG. 8), and an inverted polka dot shape (see FIG. 9). The stripping solution used in this step is of a different type depending on the material of the release layer 3. For example, if the peeling layer 3 is an alkali peeling type, a potassium hydroxide aqueous solution, a sodium hydroxide aqueous solution, or the like is used. If the release layer 3 is a water release type, water is used. If the release layer 3 is a solvent release type, ethyl cellosolve acetate, acetone or the like is used.
[0020]
In the method of patterning the black resist layer 4 by peeling off the peeling layer 3 as described above, since the black resist layer 4 is simply formed in a solid form, there is no need to consider workability during exposure / development and printing. Thus, it is possible to obtain a translucent electromagnetic shielding material at a low cost.
[0021]
Finally, the metal layer 2 where the black resist layer 4 has been removed is removed by etching (see FIG. 1e). As a result, a translucent electromagnetic wave shielding material is obtained in which the metal layer 2 is laminated in a pattern on the transparent substrate 1 and the black resist layer 4 in register with the metal layer 2 is laminated on the metal layer 2. The translucent electromagnetic wave shielding material has translucency at the portion where the metal layer 2 is removed, and reflection on the surface of the metal layer 2 is suppressed by the black resist layer 4 that is in register with the metal layer 2. The etchant is selected according to the material of the metal layer 2. For example, if the material of the metal layer 2 is gold, use aqua regia, use silver for ferric nitrate aqueous solution, use copper for ferric chloride or cupric chloride aqueous solution, and use chromium for cerium nitrate aqueous solution, etc. Good.
[0022]
The translucent electromagnetic wave shielding material needs to be grounded, and there are various means, but it is easiest to expose a part of the metal layer 2 on the surface of the shielding material on which the black resist layer 4 is formed. That is, the translucent electromagnetic wave is formed such that the metal layer 2 is laminated in a pattern on the transparent substrate 1 and the black resist layer 4 that is in register with the metal layer 2 except for the ground portion 5 is laminated on the metal layer 2. Construct shield material. Examples of the ground portion 5 include a frame-shaped portion (see FIG. 10) surrounding the light-transmitting electromagnetic wave shield portion 6 and a rod-shaped portion adjacent to the end side of the light-transmitting electromagnetic wave shield portion 6.
[0023]
In order to manufacture the translucent electromagnetic wave shielding material having the ground portion 5, the steps shown in FIGS.
[0024]
In the manufacturing process of the translucent electromagnetic wave shielding material shown in FIG. 11, first, the metal layer 2 is provided on the transparent substrate 1 (see FIG. 11a).
[0025]
Next, a mask layer 7 is provided on a part of the metal layer 2 (see FIG. 11b). The mask layer 7 is a layer that protects the portion of the metal layer 2 that becomes the ground portion 5 from the etchant when the metal layer 2 is patterned, and is peeled off after the patterning is completed. For the mask layer 7, a commercially available printing resist or photoresist material is used. As a forming method of the mask layer 7, it is formed on a part of the metal layer 2 by a screen printing method using a printing resist material, or a roll coating method, a spin coating method, a whole surface printing method using a photoresist material. A solid layer is formed on the metal layer 2 by a transfer method or the like, exposed using a photomask, developed, and partially formed.
[0026]
Next, after providing a patterned release layer 3 on at least the metal layer 2 (see FIG. 11c), a black resist layer 4 is provided on at least the metal layer 2 and the release layer 3 (see FIG. 11d).
[0027]
Next, the black resist layer 4 is removed by peeling the release layer 3 with a release liquid (see FIG. 11e), and then the metal layer 2 that is not covered with the black resist layer 4 and the mask layer 7 is etched. (See FIG. 11f). At this time, even if there is a slight gap between the mask layer 7 and the black resist layer 4, the disconnection between the ground portion 5 and the translucent electromagnetic wave shield portion 6 occurs due to etching. It is preferable to form the release layer 3 so that the resist layer 4 partially overlaps the mask layer 7.
[0028]
Finally, the mask layer 7 is removed and the exposed portion of the metal layer 2 is used as the ground portion 5 (see FIG. 11g). As a result, the metal layer 2 is laminated in a pattern on the transparent substrate 1, and the black resist layer 4 that is in register with the metal layer 2 except for the ground portion 5 is laminated on the metal layer 2. A material is obtained. As a method for removing the mask layer 7, for example, there is a method of dissolving and removing with a stripping solution.
[0029]
Moreover, the manufacturing process of the translucent electromagnetic wave shielding material which has the ground part 5 shown in FIG. 12 forms the peeling layer 3 before the mask layer 7. That is, after providing the metal layer 2 on the transparent substrate 1 (see FIG. 12a) and the patterned release layer 3 on the metal layer 2 (see FIG. 12b), a mask layer is formed on a part of the exposed metal layer 2. 7 (see FIG. 12c), a black resist layer 4 is provided on at least the metal layer 2 and the release layer 3 (see FIG. 12d), and the release layer 3 is peeled off with a release liquid to thereby remove the black resist layer 4 thereon. After the removal (see FIG. 12e), the metal layer 2 that is not covered with the black resist layer 4 and the mask layer 7 is removed by etching (see FIG. 12f), and the mask layer 7 is removed to expose the metal layer 2. This part is referred to as a ground part 5 (see FIG. 12g).
[0030]
Moreover, the manufacturing process of the translucent electromagnetic wave shielding material which has the ground part 5 shown in FIG. 13 forms the ground part 5 without using the mask layer 7. That is, the metal layer 2 is provided on the transparent substrate 1 (see FIG. 13a), the patterned release layer 3 is provided on the metal layer 2 (see FIG. 13b), and the black resist layer 4 is provided on the metal layer 2 and the release layer 3. (See FIG. 13c), the peeling layer 3 is peeled off with a peeling solution to remove the black resist layer 4 thereon (see FIG. 13d), and the portion of the metal layer 2 where the black resist layer 4 is further removed. Is removed by etching (see FIG. 13e), and a portion of the black resist layer 4 is removed to expose the exposed portion of the metal layer 2 as a ground portion 5 (see FIG. 13f). As a method for removing a part of the black resist layer 4, there are, for example, a method in which the black resist layer 4 is adhered to an adhesive tape and the like is peeled off, and a method in which the black resist layer 4 is mechanically scraped off.
[0031]
【Example】
Example 1
A 1 mm thick methacrylic sheet was used as the transparent substrate, and a copper layer having a thickness of 18 μm was bonded to the upper surface with an acrylic resin to provide a metal layer. Next, using a water-based printing resist ink, a release layer was provided on the metal layer by screen printing in a reciprocal lattice pattern having a lattice width of 10 μm and an eye size of 100 μm × 100 μm. Next, a black resist layer having a thickness of 1 μm was provided on the upper surface of the metal layer and the release layer by roll coating using black carbon ink. Next, water was used as a stripping solution, and the black resist layer was removed by stripping the stripping layer. Finally, the portion of the metal layer from which the black resist layer was removed was removed by etching with an aqueous ferric chloride solution.
[0032]
Example 2
A polycarbonate sheet having a thickness of 2 mm was used as the transparent substrate, and a metal layer having a thickness of 0.3 μm was provided on the upper surface by sputtering nickel. Next, an alkali development type photoresist material is roll-coated on a metal layer, pre-baked, exposed and developed using a photomask, and the release layer is formed in a reverse lattice shape with a lattice width of 10 μm and an eye size of 100 μm × 100 μm Provided in the pattern. Next, a black resist layer having a thickness of 1 μm was provided on the upper surface of the metal layer and the release layer by roll coating using black carbon ink. Next, an aqueous potassium hydroxide solution was used as a stripping solution, and the stripped layer was stripped to remove the black resist layer thereon. Finally, the portion of the metal layer from which the black resist layer was removed was etched away with an aqueous nitric acid solution.
[0033]
Example 3
An acrylic sheet with a thickness of 2 mm is used as a transparent substrate, and a transparent ink made of cellulose acetate propionate is roll-coated on the upper surface to form an anchor layer, followed by electroless copper plating and a metal layer with a thickness of 0.2 μm. Was provided. Next, using a water-based printing resist ink, a release layer was provided on the metal layer by screen printing in a reciprocal lattice pattern having a lattice width of 10 μm and an eye size of 100 μm × 100 μm. Next, a black resist layer having a thickness of 1 μm was provided on the upper surface of the metal layer and the release layer by roll coating using black carbon ink. Next, water was used as a stripping solution, and the black resist layer was removed by stripping the stripping layer. Finally, the portion of the metal layer from which the black resist layer was removed was removed by etching with an aqueous ferric chloride solution.
[0034]
Example 4
A 1 mm thick methacrylic sheet was used as the transparent substrate, and a copper layer having a thickness of 18 μm was bonded to the upper surface with an acrylic resin to provide a metal layer. Next, a printing resist MA830 (manufactured by Taiyo Ink Co., Ltd.) was printed on the metal layer in a strip shape having a width of 10 mm from the four ends of the film by screen printing, and dried at 70 ° C. for 30 minutes to form a mask layer.
Next, using a water-based printing resist ink, a release layer was provided on at least a metal layer by screen printing in a reciprocal lattice pattern having a lattice width of 10 μm and an eye size of 100 μm × 100 μm. Next, a black resist layer having a thickness of 1 μm was provided on the upper surface of the metal layer and the release layer by roll coating using black carbon ink. Next, water was used as a stripping solution, and the black resist layer was removed by stripping the stripping layer. Finally, the portion of the metal layer from which the black resist layer was removed was removed by etching with an aqueous ferric chloride solution. Next, the mask layer was dissolved and removed with butyl cellosolve to form an earth portion with an exposed metal layer at the end.
[0035]
【The invention's effect】
Since the manufacturing method of the translucent electromagnetic wave shielding material of this invention has the above structures, it has the following effects.
[0036]
That is, since the black resist layer is patterned by peeling off the peeling layer after the solid black resist layer is formed, it is not necessary to select a resist material suitable for printing, exposure and development, and the range of use of the resist material is widened. Therefore, it is possible to obtain a translucent electromagnetic wave shielding material always at a low cost.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic view showing one embodiment of a process for producing a translucent electromagnetic shielding material of the present invention.
FIG. 2 is a schematic view showing an example of a pattern of a release layer.
FIG. 3 is a schematic view showing an example of a peeling layer pattern.
FIG. 4 is a schematic view showing an example of a peeling layer pattern.
FIG. 5 is a schematic view showing an example of a peeling layer pattern.
FIG. 6 is a schematic view showing an example of a metal layer pattern.
FIG. 7 is a schematic view showing an example of a metal layer pattern.
FIG. 8 is a schematic view showing an example of a metal layer pattern.
FIG. 9 is a schematic view showing an example of a metal layer pattern.
FIG. 10 is a schematic view showing an example of a translucent electromagnetic wave shielding material having a ground part.
FIG. 11 is a schematic view showing one embodiment of a process for producing a translucent electromagnetic wave shielding material of the present invention.
FIG. 12 is a schematic view showing one embodiment of a process for producing a translucent electromagnetic shielding material of the present invention.
FIG. 13 is a schematic view showing one embodiment of a process for producing a translucent electromagnetic wave shielding material of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Transparent base | substrate 2 Metal layer 3 Peeling layer 4 Black resist layer 5 Ground part 6 Translucent electromagnetic wave shield part 7 Mask layer

Claims (7)

A step of providing a metal layer on the transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a black resist layer on the metal layer and the release layer, and removing the release layer with a release liquid thereon A method for producing a light-transmitting electromagnetic wave shielding material, comprising: a step of removing a black resist layer; and a step of removing a portion of the metal layer from which the black resist layer has been removed by etching. A step of providing a metal layer on the transparent substrate, a step of providing a mask layer on a part of the metal layer, a step of providing a patterned release layer on at least the metal layer, and a black resist layer on at least the metal layer and the release layer Removing the black resist layer by peeling the peeling layer with a peeling solution, removing the black resist layer and the portion of the metal layer not covered with the mask layer by etching, removing the mask layer And a method for producing a translucent electromagnetic wave shielding material, comprising the step of using the exposed portion of the metal layer as a ground portion. Providing a metal layer on the transparent substrate, providing a patterned release layer on the metal layer, providing a mask layer on a part of the exposed metal layer, and providing a black resist layer on at least the metal layer and the release layer. Removing the black resist layer by peeling the peeling layer with a peeling solution, removing the black resist layer and the portion of the metal layer not covered with the mask layer by etching, removing the mask layer And a method for producing a translucent electromagnetic wave shielding material, comprising the step of using the exposed portion of the metal layer as a ground portion. A step of providing a metal layer on the transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a black resist layer on the metal layer and the release layer, and removing the release layer with a release liquid thereon A step of removing the black resist layer, a step of removing a portion of the metal layer from which the black resist layer has been removed by etching, and a step of removing a portion of the black resist layer to form an exposed portion of the metal layer as a ground portion. A method for producing a translucent electromagnetic wave shielding material characterized by the above. The manufacturing method of the translucent electromagnetic wave shielding material in any one of Claims 1-4 in which a peeling layer consists of printing resist material and a photoresist material. The method for producing a translucent electromagnetic wave shielding material according to claim 1, wherein the black resist layer has a thickness of 0.1 μm to 10 μm. The method for producing a translucent electromagnetic wave shielding material according to any one of claims 1 to 6, wherein the peeling solution is water, an aqueous sodium hydroxide solution, an aqueous potassium hydroxide solution, acetone, or ethyl cellosolve acetate.

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