JP3908345B2 - Socket for electrical parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical component socket that detachably holds an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), and more particularly to an electrical component socket that can easily accommodate different types of electrical components.
[0002]
[Prior art]
Conventionally, as this type of “socket for electrical components”, there is an IC socket that detachably holds an IC package that is an “electrical component” (see Japanese Patent Laid-Open No. 4-215279).
[0003]
This is because an adapter is provided on the socket body, and an IC package is placed on the adapter. By moving the upper operation member up and down, the IC leads provided on the periphery of the IC package Contact pins are separated and connected.
[0004]
And, by preparing many kinds of adapters corresponding to many kinds of IC packages, selecting the adapter according to the IC package to be installed and placing it on the socket body, the socket body is common and it corresponds to many IC packages. It is possible to make it.
[0005]
[Problems to be solved by the invention]
However, in such a conventional type, since a plurality of adapters are prepared, the number of parts increases, and adapters that are not used must be managed, which increases the number of management steps. And the adapter may be lost.
[0006]
Accordingly, an object of the present invention is to provide an electrical component socket that can be made to correspond to a plurality of electrical components while suppressing an increase in the number of components and does not require component management.
[0007]
[Means for Solving the Problems]
In order to achieve this object, the invention according to claim 1 has a socket body on which an electrical component is placed, and a contact that contacts the terminal provided on the peripheral edge of the electrical component on the socket body. In the electrical component socket, in which the pin is provided, and the contact pin is displaced to be separated from the terminal of the electrical component, the socket body has a base portion, and a support member is disposed above the base portion. A mounting table is supported, and the mounting table is formed with mounting surfaces of different shapes on the upper and lower surfaces so that different types of the electric parts are mounted. The socket for electrical parts according to claim 2, wherein the height of the mounting table is made variable by setting the support member upside down by setting the support member so that it can be fitted to both the mounting table and the mounting table. Invention The socket body has a socket body on which an electrical component is placed, and the socket body is provided with a contact pin that comes in contact with a terminal provided on the peripheral edge of the electrical component, and the upper operating member moves up and down on the socket body. In an electrical component socket that is freely arranged and displaces and contacts the contact pin by moving the upper operation member up and down, the socket body has a base portion and the base A mounting table is supported on the upper side of the unit via a column member, and the mounting table is formed on the upper and lower surfaces with different types of mounting surfaces on which different types of electrical components are mounted, and the column member The upper and lower ends are set so that they can be fitted to both the base part and the mounting table, and the height of the mounting table is made variable by disposing the column member upside down. And characterized in that a socket for electrical parts.
[0008]
The invention according to claim 3 is that, in addition to the configuration according to claim 1 or 2, the upper and lower surfaces of the mounting table and the upper and lower surfaces of the support member are formed with different marks on the upper and lower surfaces, respectively. Features.
[0009]
According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, the strut member is moved from the upper side to the lower side to be fitted to the base portion, and the fitting is performed. A stand is provided on the base portion for guiding the vertical movement of the column member when the column member is pulled upward from the state, and for rotatably supporting the column member when the column member is turned upside down.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0011]
Embodiment 1 of the Invention
1 to 10 show a first embodiment of the present invention.
[0012]
First, the configuration will be described. Reference numeral 11 in FIG. 1 denotes an IC socket as an “electrical component socket”. This IC socket 11 is used to perform a performance test of the IC package 12 as an “electrical component”. The IC lead 12b as a “terminal” of the package 12 is electrically connected to a printed wiring board (not shown) of a measuring instrument (tester).
[0013]
As shown in FIGS. 1, 2, 3 and the like, the IC package 12 has a rectangular package body 12a and a large number of leads 12b from two opposite sides of the peripheral edge of the package body 12a to the side. It protrudes. As the types of the leads 12b, as shown in FIG. 1, the leads 12b are bent downward in a crank shape (hereinafter referred to as “positive bent leads 12b”), and as shown in FIG. 1 (hereinafter referred to as “reverse bent lead 12b”), and as shown in FIG. 3, it is horizontally extended (hereinafter referred to as “straight lead 12b”). 11 can place these three different types.
[0014]
That is, in the IC socket 11, a substantially plate-shaped mounting table 15 is supported on the base portion 13 a of the socket body 13 via the support member 14, and the IC package 12 is mounted on the mounting table 15. ing. Further, when the upper operating member 16 disposed in the socket body 13 is movable up and down, the contact pin 17 disposed in the socket body 13 is elastically deformed. The IC lead 12b of the package 12 is connected to and separated from the IC lead 12b.
[0015]
Specifically, the socket body 13 is formed with a wall 13b in which a fitting hole 13b into which the support member 14 is fitted is formed in the base portion 13a and protruded upward at a position corresponding to the side surface of the mounting table 15 described above. A portion 13c is formed, and the tip portion of the IC lead 12b is placed on the upper surface portion of the wall portion 13c.
[0016]
Further, the mounting table 15 is formed with a positive bending mounting surface 15a on which the IC package 12 having the positive bending leads 12b is mounted on one surface side of the upper and lower surfaces, and on the other surface side, A reverse bending / straight mounting surface 15b on which the IC package 12 having the reverse bending lead 12b or the straight lead 12b is placed is formed. Positioning projections 15c for positioning the package body 12a are provided on the side edge side of the normal bending placement surface 15a, and the package body is also provided on the side edge side of the reverse bending / straight placement surface 15b. A positioning projection 15d for positioning 12a is formed. Further, as shown in FIG. 8, a marking 15 e as a “mark” consisting of a letter “L” is provided on the normal bending placement surface 15 a, and a reverse bending / straight placement surface 15 b is provided with “ An inscription 15f as a “mark” composed of the characters “D / S” is formed. In FIG. 8, the letter “L” must be accurately drawn as seen from the back side, but for the sake of easy understanding, “L” is the same as seen from the bottom. Is displayed. Further, the mounting table 15 is formed with a fitting hole 15g into which the support member 14 is fitted. The fitting hole 15g is formed in a stepped shape of a plurality of steps corresponding to the shape of the column member 14 described later in detail.
[0017]
Further, the column member 14 is set so that both upper and lower end portions can be fitted into any fitting hole 13b of the base portion 13a and the mounting table 15, and the column member 14 is arranged upside down. Thus, the height of the mounting table 15 is set to be variable. That is, as shown in FIG. 9, the column member 14 is formed with a first columnar portion 14a having the maximum diameter at the center in the vertical direction, and on the upper and lower sides of the columnar portion 14a, The second and third columnar portions 14b and 14c are further formed on the upper and lower sides of the columnar portions 14b and 14c by fourth and fifth columnar portions 14d and 14e having a smaller diameter than the columnar portions 14b and 14c. The second columnar portion 14b and the third columnar portion 14c are formed to have the same diameter, but the second columnar portion 14b is longer in the vertical direction than the third columnar portion 14c. Yes. Further, the fourth columnar portion 14d and the fifth columnar portion 14e are formed to have the same diameter, but the fifth columnar portion 14e is formed to have a longer vertical length than the fourth columnar portion 14d. ing. Then, an inscription 14f consisting of the letters “L / S” as a mark is formed on the end surface (lower surface in FIG. 9) of the fifth columnar portion 14e, and the end surface (upper surface in FIG. 9) of the fourth columnar portion 14d. ) Is formed with an inscription 14g consisting of a letter “D” as a “mark”. In FIG. 9, the letter “L / S” must be drawn in the state viewed from the back side, but for the sake of easy understanding, “L / S” is the same as the state viewed from the bottom side. S "is displayed.
[0018]
Further, the contact pin 17 disposed on the socket body 13 is made of a material having spring properties and excellent conductivity, and is press-fitted around the socket body 13 as shown in FIG. It is installed. A lead portion 17a projects downward from the contact pin 17, and the lead portion 17a is electrically connected to the printed wiring board. Further, a substantially C-shaped deformable portion 17b that can be elastically deformed is formed on a portion of the contact pin 17 protruding upward from the socket body 13, and an upper side of the deformed portion 17b is above the IC lead 12b. A contact portion 17c that touches and presses down from above, and a pressed portion 17d that is pressed by the upper operation member 16 are formed.
[0019]
Further, as shown in FIG. 4 and the like, the upper operation member 16 has a rectangular frame shape having an opening 16a large enough to allow the IC package 12 to be inserted, and the IC package 12 is inserted through the opening 16a. It is placed on the mounting table 15. The upper operation member 16 is disposed so as to be movable up and down with respect to the socket body 13 by a slide portion 16b, and is urged upward by a spring 18 shown in FIG. Further, the upper operation member 16 is formed with a cam portion 16c slidably contacting the pressed portion 17d of the contact pin 17, and the contact portion 17c of the contact pin 17 is displaced by moving the upper operation member 16 up and down. I try to let them.
[0020]
Such an IC socket 11 can mount three types of IC packages 12, and a case where each package 12 is mounted will be described below.
[0021]
That is, first, when mounting the IC package 12 having the positive bending lead 12b, the fourth columnar portion 14d of the column member 14 is fitted to the base portion 13a of the socket body 13 as shown in FIG. The fitting hole 13b is fitted, and the fifth and third columnar portions 14e and 14c of the column member 14d are fitted into the fitting hole 15g of the mounting table 15 with the normal bending mounting surface 15a facing upward. .
[0022]
At this time, the support member 14 is fitted so that the “L / S” mark 14 f is on the upper side, and the mounting table 15 is fitted so that the “L” mark 15 e is on the upper side. By using the marks 14f and 15e as marks as described above, the support members 14 and the mounting table 15 can be easily arranged.
[0023]
When mounting the IC package 12 having the second and reverse bent leads 12b, as shown in FIG. 2, the fifth columnar portion 14e of the column member 14 is inserted into the fitting hole 13b of the base portion 13a of the socket body 13. And the fourth and second columnar portions 14d and 14b of the column member 14d are fitted into the fitting holes 15g of the mounting table 15 with the reverse bending / straight mounting surface 15b facing upward.
[0024]
At this time, the support member 14 is fitted so that the “D” mark 14 g is on the upper side, and the mounting table 15 is fitted so that the “D / S” mark 15 f is on the upper side.
[0025]
Third, when mounting the IC package 12 having the straight leads 12b, as shown in FIG. 3, the fourth columnar portion 14d of the column member 14 is connected to the fitting hole 13b of the base portion 13a of the socket body 13. And the fifth and third columnar portions 14e and 14c of the column member 14 are fitted into the fitting holes 15g of the mounting table 15 with the reverse bending / straight mounting surface 15b facing upward.
[0026]
At this time, the support member 14 is fitted so that the “L / S” mark 14 g is on the upper side, and the mounting table 15 is fitted so that the “D / S” mark 15 f is on the upper side. Let
[0027]
Next, the operation of the IC socket 11 will be described.
[0028]
First, the lead portions 17a of the contact pins 17 of the IC socket 11 are inserted into the insertion holes of the printed wiring board and soldered in advance, thereby arranging the plurality of IC sockets 11 on the printed wiring board.
[0029]
Then, the IC package 12 is set and electrically connected to the IC socket 11 by, for example, an automatic machine as follows.
[0030]
That is, the upper operation member 16 is lowered against the urging force of the spring 18 and the contact pin 17 while the IC package 12 is held by an automatic machine. Then, the pressed portion 17d of the contact pin 17 is pressed by the cam portion 16c of the upper operation member 16 and the deformed portion 17b is elastically deformed, so that the contact portion 17c of the contact pin 17 is shown in FIG. From the state shown in FIG. 7, it is opened to the maximum extent as shown in FIG.
[0031]
In this state, the IC package 12 is opened from the automatic machine, and is placed at a predetermined position on the mounting table 15 through the opening 16 a of the upper operation member 16. Thereafter, when the pressing force of the upper operation member 16 by the automatic machine is released, the upper operation member 16 is raised by the urging force of the spring 18 or the like, and the contact pin 17 is restored by its own elasticity. Thereby, the contact part 17c of the contact pin 17 contacts and is electrically connected to the IC lead 12b.
[0032]
[Embodiment 2 of the Invention]
11 and 12 show a second embodiment of the present invention.
[0033]
In the second embodiment, a penetrating member 14 is penetrated in the horizontal direction, a long through hole 14h is formed in the vertical direction (axial direction), and the stand 19 is inserted into the through hole 14h. The strut member 14 is supported by.
[0034]
As shown in FIG. 11, the stand 19 has a hat shape, and both end portions 19a are locked to locking portions 13d formed on the socket body base portion 13a, and are detachable in a standing state. It is arranged.
[0035]
The horizontal portion 19 b of the stand 19 is inserted into the through hole 14 h of the support column member 14.
[0036]
In this state, since the through-hole 14 is long in the axial direction of the column member 14, when the column member 14 is fitted to the base portion 13a by moving it downward from above, it is pulled out upward from the fitted state. Sometimes, the support member 14 is guided to move in the vertical direction. In addition, when the column member 14 is turned upside down, the column member 14 is rotatable about the horizontal portion 19 b of the stand 19.
[0037]
In order to turn the column member 14 upside down from the state where the column member 14 is fitted to the base portion 13a, first, the column member 14 is fitted as shown by the arrow (1) in FIG. It pulls out upward from the joint hole 13b, and makes it the state spaced apart upward from the base part 13a. At this time, the horizontal portion 19b of the stand 19 in the through hole 14h is located near the lower end of the through hole 14h. From this state, the column member 14 is tilted about the horizontal portion 19b of the stand 19 as shown by an arrow (2) in FIG. 12, while the column member 14 is placed on the stand as shown by an arrow (3) in FIG. The 19 horizontal portions 19b are moved while sliding in the axial direction along the through holes 14h. When the horizontal portion 19b of the stand 19 reaches the other end side of the through hole 14h, the support member 14 is brought into an original state by bringing the support member 14 upright as indicated by an arrow (4) in FIG. It will be in an inverted state. From this state, the column member 14 is lowered vertically along the through hole 14h with respect to the horizontal portion 19b of the stand 19 as shown by the arrow (5) in FIG. Thus, the replacement work of the support member 14 is completed.
[0038]
In this way, even when the support member 14 is pulled out, reversed, or refitted in correspondence with the various IC packages 12, the use of the stand 19 provides good workability. There is no risk of dropping or losing the support member 14. Since this column member 14 is small, it is particularly effective to provide a stand 19 that prevents loss.
[0039]
Other configurations and operations are the same as those in the first embodiment.
[0040]
Embodiment 3 of the Invention
FIG. 13 shows a third embodiment of the present invention.
[0041]
In the third embodiment, the present invention is applied to an IC socket 31 in which the type of the IC socket 11 is different from those of the first and second embodiments.
[0042]
That is, in this IC socket 31, a cover 33 is rotatably attached to the socket main body 32 by a shaft 34, and a lock member 35 is locked to a locked portion 33a formed at the tip of the cover 33. In this way, the closed state is maintained.
[0043]
The socket body 32 is provided with a base portion 32a that can move up and down, and the contact pin 36 is inserted into the loose insertion hole 32d of the base portion 32a so that the base portion 32a is supported by the contact pin 36. Yes. The base portion 32 a is formed with a fitting hole 32 b, and the lower end portion of the support member 37 is fitted into the fitting hole 32 b, and the upper end portion of the support member 37 is the fitting hole 38 a of the mounting table 38. The mounting table 38 is supported via the support member 37.
[0044]
The IC package 42 is placed on the mounting table 38. The IC package 42 is provided with an IC lead 42b called a so-called J lead on the side surface.
[0045]
The mounting table 38 is formed with mounting surfaces of different shapes so that different types of IC packages 42 are mounted on both the upper and lower surfaces, and the column member 37 is fitted with the base portion 32a at both upper and lower ends. It can be fitted into either the hole 32b or the fitting hole 38a of the mounting table 38, and the support member 37 can be placed upside down to change the height of the mounting table 38. ing.
[0046]
In such a case, when the cover 33 is closed, the IC package 42, the mounting table 38, and the base portion 32a are lowered integrally by pressing the upper surface of the IC package 42 with the cover 33. . As a result, as shown in FIG. 13, the contact pin 36 is elastically deformed inward by the pressing portion 32c of the base portion 32a, and the contact portion 36a of the contact pin 36 contacts the IC lead 42b.
[0047]
Even in such a case, the thickness of the IC package 42 is different by turning the column member 37 upside down or turning the mounting table 38 upside down as in the first and second embodiments. It is possible to deal with different types of items.
[0048]
In the above embodiments, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices. In the first and second embodiments, three types of IC packages can be placed. By forming a plurality of different types of fitting holes in the base portion and the mounting table, the support member can be mounted. In addition to turning upside down, more types of electrical components can be placed by changing the mounting position in the fitting hole.
[0049]
【The invention's effect】
As described above, according to the first or second aspect of the present invention, the support member can be turned upside down or the mounting table can be turned upside down without preparing a plurality of adapters as in the prior art. In addition, it is possible to cope with a plurality of electric parts while suppressing an increase in the number of parts, and there is no need for parts management.
[0050]
According to the third aspect of the invention, in addition to the above effect, the upper and lower surfaces of the mounting table and the upper and lower surfaces of the support member are formed with different marks on the upper and lower surfaces, respectively, so as to correspond to each electrical component. Thus, workability can be improved when the mounting table or the column member is turned over.
[0051]
According to the invention described in claim 4, in addition to the above-described effect, when the column member is moved to the base portion from below to be fitted, and when the column member is pulled upward from the fitted state, In addition to guiding the movement in the up and down direction and providing a stand on the base portion that can freely rotate when the support member is turned upside down, the reversing workability (replacement workability) of the support member can be improved. It has a practically beneficial effect that there is no possibility of dropping or losing the support member.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an essential part of an IC socket according to Embodiment 1 of the present invention when an IC package having a positive bending lead is placed thereon.
FIG. 2 is a cross-sectional view showing an essential part of the IC socket according to the first embodiment when an IC package having reverse bending leads is placed.
FIG. 3 is a cross-sectional view showing the main part of the IC socket according to the first embodiment when an IC package having straight leads is placed.
4 is a front view showing a half of the IC socket according to Embodiment 1. FIG.
FIG. 5 is a plan view of the IC socket according to the first embodiment.
FIG. 6 is a cross-sectional view of the IC socket according to the first embodiment.
FIG. 7 is a cross-sectional view showing the IC socket according to Embodiment 1 in a state where the opening of the contact pin is completed.
FIG. 8 is a perspective view showing a part of the mounting table according to the first embodiment.
FIG. 9 is a perspective view of a column member according to the first embodiment.
10 is a perspective view showing a state in which a column member is fitted to the mounting table according to Embodiment 1. FIG.
FIG. 11 is a cross-sectional view corresponding to FIG. 1, showing an IC socket according to a second embodiment of the present invention.
FIG. 12 is a perspective view showing a support member according to the second embodiment.
FIG. 13 is a sectional view of an IC socket according to a third embodiment of the present invention.
[Explanation of symbols]
11,31 IC socket (Socket for electrical parts)
12,42 IC package (electrical parts)
12b, 42b IC lead (terminal)
13,32 Socket body
13a, 32a Base part
13b, 32b Mating hole
14,37 Prop member
14f, 14g stamp (mark)
15,38 mounting table
15a Mounting surface for forward bending
15b Reverse / straight mounting surface
15e, 15f stamp (mark)
15g, 32b Mating hole
16 Upper control member
17,36 Contact pin
17c, 36a Contact part
19 Stand
19b Horizontal section

Claims (4)

The socket has a socket body on which the electrical component is placed, and the socket body is provided with a contact pin that is separated from and connected to a terminal provided at a peripheral portion of the electrical component, and the contact pin is displaced to dispose the terminal of the electrical component In the socket for electrical parts separated from the
The socket body has a base portion, and a mounting table is supported on the upper side of the base portion via a support member.
In the mounting table, mounting surfaces of different shapes on which different types of the electrical components are mounted are formed on the upper and lower surfaces.
The support member is set so that both upper and lower end parts can be fitted to both the base part and the mounting table, and the support member is arranged upside down to increase the height of the mounting table. Socket for electrical parts characterized by being variable. The socket body has a socket body on which an electrical component is placed, and the socket body is provided with a contact pin that comes into contact with a terminal provided on a peripheral portion of the electrical component, and the upper operating member moves up and down on the socket body. In the electrical component socket that is freely arranged and displaces the contact pin from the terminal of the electrical component by vertically moving the upper operation member,
The socket body has a base portion, and a mounting table is supported on the upper side of the base portion via a support member.
In the mounting table, mounting surfaces of different shapes on which different types of the electrical components are mounted are formed on the upper and lower surfaces.
The support member is set so that both upper and lower end parts can be fitted to both the base part and the mounting table, and the support member is arranged upside down to increase the height of the mounting table. Socket for electrical parts characterized by being variable. The electrical component socket according to claim 1 or 2, wherein different marks are formed on the upper and lower surfaces of the mounting table and the upper and lower surfaces of the support member, respectively. When the column member is moved and fitted to the base portion from below, and when the column member is pulled upward from the fitted state, the column member is guided to move in the vertical direction, and the column member is The electrical component socket according to any one of claims 1 to 3, wherein a stand that is rotatably supported when being turned upside down is provided on the base portion.

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