JP3901765B2 - Multi-temperature control system and reaction processing apparatus to which the system is applied - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a multi-temperature control system that controls the temperature of a plurality of locations by circulating a working fluid. The temperature control system of the present invention is suitable for, for example, an application for controlling the temperatures of various portions in a plurality of process chambers (reaction processing chambers) in a semiconductor processing apparatus, but is not limited to the semiconductor processing apparatus, and other various types. It can also be applied to the reaction processing apparatus.
[0002]
[Prior art]
A conventional semiconductor processing apparatus is configured as shown in FIG. 1, for example. That is, a plurality of process chambers 2 a, 2 b and 2 c are arranged around the transfer chamber 1. A wafer (not shown) to be processed is transferred from one process chamber to another process chamber via the transfer chamber 1 by a transfer robot (not shown) provided in the transfer chamber 1. In each of the process chambers 2a, 2b, and 2c, a unique reaction process is performed on the wafer.
[0003]
FIG. 2 shows the configuration of one process chamber. The process chamber includes a chamber wall 3, a chamber cover 4 that functions as an anode, and a wafer support 6 that functions as a cathode. Each of the chamber wall 3, the chamber cover 4, and the wafer support 6 has conduits 7a, 7b, and 7c through which a working fluid for temperature control flows. The temperatures of the chamber wall 3, the chamber cover 4, and the wafer support 6 are controlled to the target temperatures T1, T2, and T3 that are unique to the fluid by flowing through the pipes 7a, 7b, and 7c.
[0004]
As shown in FIG. 1, the temperature control system applied to this semiconductor processing apparatus includes three temperature controllers 8a, 8b, and 8c, and each temperature controller 8a, 8b, and 8c has a target temperature T1, T2, T3 is set. Each of the temperature controllers 8a, 8b, and 8c supplies a temperature-controlled working fluid to all the process chambers 2a, 2b, and 2c in the semiconductor processing apparatus. For example, the first temperature controller 8a supplies the working fluid to the chamber walls 3 of all the process chambers 2a, 2b, and 2c through the circulation flow paths 9a, 9b, 9a, 9b, 9a, and 9b. Similarly, the second temperature controller 8b applies to the chamber cover 4 of all the process chambers 2a, 2b, 2c, and the third temperature controller 8c applies to the wafer support 6 of all the process chambers 2a, 2b, 2c. On the other hand, a working fluid is supplied.
[0005]
For example, as shown in FIG. 3, each temperature controller includes a heat exchanger 11 for cooling the working fluid, a heating device 13 for heating, and circulating fluids 9a and 9b for the temperature-controlled working fluid. And a pump 14 for circulation. The heat exchanger 11 cools the working fluid with cooling water flowing through the cooling water pipe 10. The heating device 13 accumulates the working fluid in the tank 13a and heats the working fluid with the electric heater 12 in the tank 13a.
[0006]
[Problems to be solved by the invention]
As described above, in a conventional temperature control system for a semiconductor processing apparatus, one temperature controller is provided in common for a plurality of process chambers, and the one temperature controller is provided for a plurality of process chambers. Central temperature control of specific parts.
[0007]
For this reason, it is impossible in principle to vary the target temperature of the portion whose temperature is controlled in common for each process chamber. Conversely, it is also difficult to control the temperature of those portions of all process chambers exactly the same and accurately. This is because the shape and operating state of the chamber, the length of each circulation flow path, the pressure loss, etc. are slightly different for each chamber, and the temperature of the working fluid is slightly different for each chamber.
[0008]
If the above is to be realized, a method of controlling the flow rate of the working fluid for each chamber is conceivable. However, this makes the configuration considerably complicated and also causes interference in flow rate control between the chambers. Because of this, accurate temperature control is still difficult.
[0009]
In addition, since the conventional system performs centralized control, the location of the temperature controller is inevitably separated from the semiconductor processing apparatus as shown in FIG. As a result, the circulation flow path becomes longer and the amount of working fluid used increases. It is desirable to use an inert liquid such as Garten (registered trademark) or Florinart (registered trademark) as the working fluid, but these are quite expensive and are not suitable for mass use. Therefore, in the conventional system, unless there is a special circumstance, an inexpensive liquid such as ethylene glycol or water is used. However, since these inexpensive liquids generate ions that cause corrosion due to the influence of plasma in the process chamber, it is necessary to provide a separate deionization apparatus. This deionizer is quite large and costly.
[0010]
In the conventional system, since the fluid circulation channel is long, heat loss in the circulation channel is large. Therefore, the heat capacity of each temperature controller needs to be large to some extent. For this reason, the temperature control system becomes quite large due to circumstances such as the above-described arrangement location.
[0011]
Accordingly, an object of the present invention is to provide a multi-temperature control system that controls the temperature of a plurality of locations by circulating the working fluid, that can accurately control the temperature of each location, is small, and requires a small amount of working fluid. It is to provide.
[0012]
[Means for Solving the Problems]
The multi-temperature control system according to the present invention controls the temperature at a plurality of locations by circulating a working fluid, and includes a plurality of temperature controllers respectively localized at each location. The temperature controller at each location has a dedicated working fluid circulation channel at each location, and individually controls the temperature of the working fluid in the dedicated circulation channel.
[0013]
According to this system, a temperature controller that circulates a working fluid dedicated to the location is localized at each location where the temperature is to be controlled. Inevitably, the circulation path of the working fluid may be short, and the amount of working fluid used is small. Therefore, it is possible to use a working fluid that is expensive but does not require a deionization device and has good performance, such as Garten and Fluorinert.
[0014]
In addition, each temperature controller individually controls the working fluid dedicated to each location, and the circulation path of the working fluid is short, heat loss is small, and the temperature control response is fast, so accurate temperature control is possible. is there.
[0015]
Furthermore, each temperature controller can be made small because its thermal capacity is small, power for circulation is small, and power consumption can be small. The small temperature controllers are distributed and arranged in a plurality of locations, the individual circulation channels are short, and it is easy to eliminate the deionization device, so the overall system size can be easily reduced. it can.
[0016]
When the temperature control device uses a coolant to cool the working fluid, a plurality of temperature control devices can share the same coolant source. By doing so, the configuration of the coolant system is simplified.
[0017]
A preferable configuration example of the temperature controller includes an inner container having an inner space for flowing a working fluid, a heater disposed in the inner space, and a cooling water flowing around the inner container so as to flow outside the inner container. And an outer container in which an outer space is formed. Such a temperature controller is relatively small because both the heating and cooling of the working fluid can be performed inside one container. More preferably, an infrared lamp is used for the heater. When an infrared lamp is used, a large amount of heat can be obtained even if it is small, and it is easy to make the temperature controller smaller. The small size of the temperature controller is advantageous for localizing each temperature controller at each location.
[0018]
The system of the present invention can be applied to a reaction processing apparatus having a plurality of process chambers such as a semiconductor processing apparatus. In that case, a dedicated temperature controller is disposed in the vicinity of each process chamber. In the case where one process chamber has a plurality of portions to be temperature controlled, it is desirable to arrange a plurality of dedicated temperature controllers in the plurality of portions in the vicinity of the one process chamber. In that case, it is more desirable that each temperature controller dedicated to each part is disposed at a position close to each part.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 4 shows the overall configuration of a multi-temperature control system according to an embodiment of the present invention applied to a semiconductor processing apparatus. Here, since the semiconductor processing apparatus itself has substantially the same configuration as that of the conventional apparatus shown in FIGS. 1 and 2, the same elements as those of the conventional apparatus are denoted by the same reference numerals, and redundant description is given. Is omitted.
[0020]
As shown in FIG. 4, three small temperature controllers 15a, 15b, 15c are provided for each of the process chambers 2a, 2b, 2c of the semiconductor processing apparatus. That is, three temperature controllers 15a, 15b, 15c are provided for the first process chamber 2a, and three temperature controllers 15a, 15b, 15c are also provided for the second process chamber 2b. The third process chamber 2c is also provided with three temperature controllers 15a, 15b, 15c.
[0021]
Each temperature controller 15a, 15b, 15c has a unique circulation channel (not shown in FIG. 4) independent of the other temperature controllers, and a working fluid such as florinate is supplied to each process chamber 2a, 2b and 2c are supplied independently. Each temperature controller 15a, 15b, 15c supplies the working fluid only to the process chamber in which it is provided and does not supply the other process chambers. Of the three temperature controllers 15a, 15b, 15c provided in one chamber, the first 15a goes to the conduit 7a of the chamber wall 3 shown in FIG. The working fluid is supplied to the conduit 7b, and the third fluid is supplied to the conduit 7c of the wafer support base 6. In short, one temperature controller is assigned exclusively to each temperature control target portion in the semiconductor processing apparatus.
[0022]
These temperature controllers 15a, 15b, and 15c are attached to, for example, the outer wall surface of the process chamber. However, the temperature controllers 15a, 15b, and 15c are not necessarily outer wall surfaces. In short, the circulation flow path is sufficiently short as close as possible to the process chamber. What is necessary is just to arrange | position in such a position. From the same point of view, it is preferable that the individual temperature controllers 15a, 15b, 15c are arranged at locations where they can be connected as close as possible to the pipes 7a, 7b, 7c of the portions assigned to them.
[0023]
These nine temperature controllers 15a, 15b, 15c are connected to a common coolant source 30 via individual coolant circulation channels 10, 10. For example, water is used as the cooling liquid, but other substances may be used.
[0024]
All the temperature controllers 15a, 15b, 15c have substantially the same configuration. As shown in FIG. 5, each temperature controller has a working fluid heating / cooling device 16 and a pump 14 that circulates the working fluid in the circulation passages 9 a and 9 b. The heating / cooling device 16 includes a cooling unit 16a that cools the working fluid with cooling water, and a heating unit 16b that heats the working fluid. When ethylene glycol or water is used as the working fluid, a deionizer 17 is connected between the supply pipe 9a and the return pipe 9b of the circulation channel. However, the deionizer 17 is not necessary when used for a working fluid of an inactive substance such as florinate.
[0025]
6 and 7 show a specific configuration example of the heating / cooling device 16 shown in FIG. 6 is a longitudinal sectional view of the heating / cooling device, and FIG. 7 is a transverse sectional view taken along line AA of FIG.
[0026]
As shown in these drawings, the heating / cooling device has two cylindrical containers 20 and 22 which are large and small and are arranged coaxially. The inner container 20 has a space 21 on the inner side and has both end faces closed. The outer container 22 also has closed end faces, and surrounds the inner container 20 and has a space 23 outside the inner container 20. The inner container 20 has an inlet 20a for the working fluid at a location near one end of the peripheral wall, and operates at a location near the other end of the peripheral wall and symmetrical with respect to the central axis. It has a fluid outlet 20b. The outer container 22 has a coolant inlet 22a at a location near one end of the peripheral wall, and a location near the other end of the peripheral wall that is symmetrical with respect to the central axis. And a coolant outlet 22b.
[0027]
The inner container 20 is made of a material having good thermal conductivity, corrosion resistance and formability, such as aluminum, copper, stainless steel and the like. The outer container 22 may be made of the same material, or may be made of another material having good corrosion resistance and moldability but not high thermal conductivity, such as plastic, vinyl chloride, and ceramics. The joint between the inner container 20 and the outer container 22 is sealed so as not to leak liquid by welding, brazing, or other suitable methods.
[0028]
A transparent cylinder 24 is disposed in the inner space 21 of the inner container 20 along the central axis. The transparent cylinder 24 penetrates the walls 26 and 26 at both ends of the inner container 20. A heating lamp 25 is inserted into the transparent tube 24. The transparent cylinder 24 is made of a heat-resistant material with extremely high light transmittance such as quartz glass. The heating lamp 25 preferably emits a large amount of infrared light, and for example, a halogen lamp for a heater is used. The lamp 25 is supported at the central axis position in the transparent tube 24 so as not to contact the transparent tube 24 by the bush 29.
[0029]
The walls 26 and 26 at both ends of the inner container 20 are made of a material having appropriate elasticity and sufficient heat resistance, such as hard rubber, plastic, and metal. In order to seal the gap between the end walls 26 and 26 and the inner container 20 and the transparent tube 24, the outer peripheral surface and the inner peripheral surface of the end walls 26 and 26 are fitted with seal rings 27 such as O-rings, respectively. It is rare.
[0030]
A plurality of inner fins 28a extending in parallel to the central axis of the container 20 are fixed to the inner peripheral surface of the inner container 20, and a plurality of outer fins 28b extending in parallel to the central axis are also provided on the outer peripheral surface. It is fixed. The inner fin 28 a stands straight in the radial direction of the inner space 21, that is, in the direction of infrared radiation from the lamp 25. Similarly, the outer fins 28b are radially upright in the radial direction, but this is not necessarily so. Both the inner fins 28a and the outer fins 28b are arranged distributed over substantially the entire area of the inner space 21 and the outer space 23 and have a substantially uniform density (that is, substantially uniform throughout the entire area). Are arranged at intervals). These fins 28a and 28b are made of a material such as aluminum, copper, and stainless steel, which has high thermal conductivity and good corrosion resistance and moldability. Furthermore, it is desirable that the material has a good infrared absorption rate.
[0031]
There is a slight gap between the tip of the inner fin 28 a and the outer peripheral surface of the transparent tube 24. There is also a slight gap between the tip of the outer fin 28 b and the inner peripheral surface of the outer container 22.
[0032]
In the heating / cooling device configured as described above, the working fluid flows into the inner space 21 from the inlet 20a, and flows out of the outlet 20b through the inner space 21. Further, the coolant flows into the outer space 23 from the inlet 22a, flows out of the outlet 22b through the outer space 23.
[0033]
When the target temperature is higher (for example, 100 ° C.) than the temperature (for example, 25 ° C.) at the working fluid inlet 20a, the lamp 25 is turned on. In this case, the flow of the coolant is stopped in principle. The infrared rays emitted from the lamp 25 pass through the transparent tube 24 and enter the inner space 21. If the working fluid is a substance having a very low light absorption (for example, fluorinate), most of infrared rays are absorbed by the fins 28a, and the generated radiant heat is transferred from the fins 28a to the fluid, so that the working fluid is Heated. If the working fluid is a substance with moderate light absorption (for example, water, ethylene glycol, etc.), infrared rays are absorbed directly not only by the fin 28a but also by the working fluid itself, and the temperature of the fluid rises due to the radiant heat. To do.
[0034]
The heating amount is controlled by adjusting the duty ratio of the lighting time of the lamp 25 and the light emission amount by a temperature sensor and a controller (both not shown) arranged at the outlet 20b. For example, the power supplied to the lamp 25 is feedback-controlled so that the outlet temperature matches the target temperature. If the outlet temperature of the fluid exceeds the target temperature due to overheating or an external cause, the lamp 25 is turned off. In addition, when it is not sufficient to turn off the lamp alone, a coolant is flowed.
[0035]
Further, when the target temperature is lower (for example, 30 ° C.) than the inlet temperature (for example, 80 ° C.) of the working fluid, the cooling liquid is flowed and the lamp 25 is normally turned off. The heat retained by the working fluid is transferred to the coolant through the inner fins 28a, the inner container 20, and the outer fins 28b, and the fluid is cooled. The above-described controller adjusts the flow rate of the coolant to make the outlet temperature of the fluid coincide with the target temperature. When the outlet temperature of the fluid falls below the target temperature due to overcooling, the lamp 25 is turned on or the flow rate of the coolant is reduced.
[0036]
As described above, the controller controls the lighting of the lamp 25 and the flow rate of the coolant, and uses the heating and cooling separately or in combination, thereby controlling the temperature of the working fluid to the target temperature.
[0037]
As can be seen from the above description, the heating is mainly performed by infrared radiant heat. Due to its inherent nature, radiant heat is evenly supplied to the light absorbing material at any location within the inner space 21 regardless of the distance from the lamp 25. In addition, since the fins 28a stand in the direction of the infrared radiation from the lamp 25 in the inner space 21, the infrared rays can be evenly incident on all locations of the inner space 21 without being blocked by the fins 28a. . As a result, if the fluid is a substance that absorbs light moderately, such as water, the fluid receives radiant heat substantially uniformly at all locations in the inner space 21 and the temperature rises uniformly. In addition, when the fluid is a substance that hardly absorbs light, such as florinate, a large number of fins 28a existing in a substantially uniform density in the entire area of the inner space 21 emit radiant heat evenly at all the locations. Since it receives and transmits it to the fluid, the fluid is also heated in a nearly uniform manner.
[0038]
As described above, most of the output of the lamp 25 is supplied as radiant heat almost evenly to the entire working fluid in the inner space 21, so that heat does not concentrate in a specific local area. In addition, since there is a gap between the lamp 25 and the transparent tube 24, only the fluid passing through the transparent tube 24 and its vicinity does not reach a particularly high temperature due to heat conduction. As a result, the output heat amount of the lamp 25 can be considerably increased. As a result, even if the size is small, a large heating capacity can be exhibited.
[0039]
Further, since there is a gap between the outer fin 28b and the outer container 22, the radiant heat in the inner container 20 does not escape directly from the outer fin 28b to the outer container 22 during heating. This is preferable from the viewpoint of heating efficiency. From the same viewpoint, it is also preferable that the outer container 22 is made of a material having poor thermal conductivity such as ceramics or plastic. However, if there is no particular problem in heating efficiency, the outer fin 28b and the outer container 22 are in contact with each other, or the outer container 22 is made of a material having high thermal conductivity (for example, the same material as the inner container 20). It does not matter.
[0040]
Cooling is performed using heat conduction through the fins 28a and 28b. Since the fins 28a and 28b are distributed in a substantially uniform density over the entire area of the inner and outer spaces 21 and 23, the cooling efficiency is good and the temperature unevenness due to the use of heat conduction is small. The presence of a gap between the outer fin 28b and the outer container 22 is preferable from the viewpoint of cooling efficiency because the outer fin 28b is hardly affected by the outside air temperature.
[0041]
When the heating / cooling device 16 is assembled, the transparent tube 24 is inserted into the inner space 21. Moreover, the transparent cylinder 24 is pulled out from the inner space 21 or inserted again during maintenance. In this insertion / drawing operation, the clearance between the transparent tube 24 and the inner fin 28a becomes a clearance, and this operation is performed smoothly. Of course, the inner fin 28a and the transparent tube 24 may be in contact with each other as long as there is no trouble in the work.
[0042]
As can be seen from the above description, the heating / cooling device 16 can exhibit a large heating and cooling capacity for its size. Therefore, the size can be made quite small. In addition, since the working fluid can be uniformly set to the target temperature without temperature unevenness, the accuracy of temperature control is high. As a result, the temperature controllers 15a, 15b, and 15c are also considerably reduced in size, and the temperature control accuracy is high. Such small temperature controllers 15a, 15b, and 15c can be easily attached to the individual process chambers 2a, 2b, and 2c as shown in FIG.
[0043]
Various variations other than the above can be adopted for the specific configuration of the heating / cooling device 16. For example, as the fins 28a and 28b, various well-known fins other than those described above, such as those in which a large number of elongated pins are erected and those in which a thin plate is bent into a corrugated shape, can be employed. However, fins that shield infrared rays, such as fins that are formed by bending thin plates into corrugations, should be used only when working fluids with extremely low light absorption properties, such as Fluorinert, are used. In the case of using a working fluid having a certain level of absorption, fins that allow the infrared rays to spread throughout the inner space 21 without much blocking the infrared rays, such as the fins that are provided with the fins and pins shown in FIGS. Should be adopted. If there is no problem even if the heating efficiency is somewhat low, an electric heater can be used instead of the heating lamp.
[0044]
FIG. 8 shows one mode in which each temperature controller 15a, 15b, 15c is attached to each process chamber 2a, 2b, 2c.
[0045]
As shown in the figure, each temperature controller 15a, 15b, 15c is fixed to the outer surface of the side wall of the process chamber, and the circulation passages 9a, 9b for the fluid exiting from each temperature controller 15a, 15b, 15c are provided in the process chamber. Are connected to the pipes 7a, 7b and 7c shown in FIG.
[0046]
Also, a coolant circulation channel 10 is provided from each temperature controller 15a, 15b, 15c, and a pair of coolant circulation channels 10 for each temperature controller is provided for each chamber as shown in FIG. After being integrated into the coolant circulation channel 10, the coolant is connected to the common coolant source 30. Note that the coolant circulation channel 10 for each temperature controller may be directly connected to the common coolant source 30. Alternatively, for example, if the target temperatures of the three temperature controllers 15a, 15b, 15c are different in the process chamber 2a, the cooling water from the coolant source 30 is first flowed to the temperature controller having the lowest target temperature, and then The cooling water that has passed through this is passed to a temperature controller having an intermediate target temperature, and finally, the cooling water that has passed through this is supplied to the temperature controller having the highest target temperature and returned to the cooling water source. It is also possible to connect the coolant circulation 10 of the temperature controllers 15a, 15b, and 15c in series so that the coolant flows in order.
[0047]
As described above, even if the cooling liquid is shared by the plurality of temperature controllers 15a, 15b, and 15c, the temperature fluctuation of the cooling liquid is small and the temperature of the cooling liquid slightly varies unless the flow speed of the cooling liquid is too slow. However, since the controller performs optimal control for each of the temperature controllers 15a, 15b, and 15c accordingly, the temperature of the working fluid can be accurately controlled.
[0048]
Note that the temperature controller 15a, 15b, 15c is not limited to be attached to the side wall of the process chamber. In short, the fluid circulation flow path can be sufficiently shortened under the bottom wall, the ceiling wall, or the nearby floor. Any suitable location near the chamber may be used.
[0049]
In the above-described embodiment, the temperature of all the parts of all the process chambers is controlled by the circulation of the working fluid. However, this is not always necessary, and the temperature according to another principle that does not partially use the working fluid. Control can also be implemented. For example, when there is a chamber or part that is controlled to a high temperature such as 100 ° C. or higher, an infrared lamp is provided in the chamber or part instead of the temperature controller, and the chamber or part is directly heated by the infrared lamp. You may make it do.
[0050]
The above description of the embodiments is for the understanding of the present invention, and is not intended to limit the scope of the present invention to these embodiments alone. The present invention can be implemented in other various forms in which changes, corrections, improvements, and the like are added to the above-described embodiments without departing from the scope of the invention.
[Brief description of the drawings]
FIG. 1 is a plan view showing a semiconductor processing apparatus using a conventional temperature control system.
FIG. 2 is a cross-sectional view showing a schematic configuration of a process chamber.
FIG. 3 is a circuit diagram of a conventional temperature controller.
FIG. 4 is a plan view showing a semiconductor processing apparatus using a temperature control system according to an embodiment of the present invention.
FIG. 5 is a circuit diagram of a temperature controller used in the embodiment.
6 is a longitudinal sectional view of a heating / cooling device used in the temperature control device of FIG.
7 is a cross-sectional arrow view taken along the line AA in FIG. 6;
FIG. 8 is a perspective view showing an attachment mode of the temperature controller in the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Transfer chamber 2a, 2b, 2c Process chamber 3 Chamber wall 4 Chamber cover 5 Wafer 6 Wafer support 7a, 7b, 7c Pipe line 9a, 9b Fluid circulation channel 10 Coolant circulation channel 15a, 15b, 15c Temperature Controller 16 Heating / cooling device 20 Inner vessel 21 Inner space 22 Outer vessel 25 Heating lamp 24 Transparent tube 28a Inner fin 28b Outer fin

Claims (9)

In a multi-temperature control system that controls the temperature of multiple locations by circulating a working fluid,
A plurality of temperature controllers located in each of a plurality of chamber portions in each of a plurality of process chambers of the reaction processing apparatus ;
Each temperature controller has a dedicated working fluid circulation channel in each chamber portion of each of the plurality of process chambers, and individually controls the temperature of the working fluid in the dedicated circulation channel. Features a multi-temperature control system. The system of claim 1, wherein
The multi-temperature control system further comprising a common coolant source shared by the plurality of temperature controllers. The system of claim 1, wherein
Each temperature controller
An inner container having an inner space for flowing a working fluid;
A heater disposed in the inner space;
A multi-temperature control system comprising: an outer container that surrounds the inner container and forms an outer space for allowing cooling water to flow outside the inner container. The system of claim 3, wherein
The multi-temperature control system, wherein the heater is a lamp that emits infrared rays. The system of claim 3 , wherein
The multi-temperature control system , wherein each temperature controller includes a plurality of fins that have the heater on the central axis of the inner space and are arranged radially around the heater . The system of claim 5 , wherein
The multi-temperature control system, wherein the plurality of fins are arranged at a substantially uniform density . The system of claim 5, wherein
The multi-temperature control system , wherein the plurality of fins are arranged in both the inner space and the outer space . The system of claim 1 , wherein
A multi-temperature control system, wherein each temperature controller is arranged in the vicinity of an individual chamber portion. In a reaction processing apparatus comprising a plurality of process chambers, each process chamber having a plurality of chamber portions to be temperature controlled,
A plurality of temperature controllers localized in each process chamber,
Each temperature controller has a dedicated working fluid circulation channel in each chamber portion of each of the plurality of process chambers , and individually controls the temperature of the working fluid in the dedicated circulation channel. A reaction processing apparatus to which the characteristic multi-temperature control system is applied.

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