JP3948315B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for transferring and mounting an electronic component on a substrate by a transfer head.
[0002]
[Prior art]
A mounting apparatus for mounting electronic components on a board is provided with a component supply unit in which a number of parts feeders such as tape feeders for storing electronic components are arranged in parallel, and electronic components are transferred from these parts feeders by a transfer head. The mounting operation of picking up and transferring onto the substrate is repeated. In order to improve the efficiency of the mounting operation, a multiple transfer head in which a plurality of unit transfer heads each having a suction nozzle for holding an electronic component are arranged is often used.
[0003]
[Problems to be solved by the invention]
In such a multiple transfer head, the outer size of the transfer head increases as the number of unit transfer heads arranged in one transfer head increases. It is required to be as small as possible. However, if this arrangement pitch is reduced, it is necessary to consider the interference between the electronic components held by the unit transfer heads in the mounting turn in which the transfer head takes out the electronic components from the component supply unit and transfers them to the substrate. For this reason, there are restrictions on the shape and size of electronic components that can be picked up simultaneously. For this reason, in the electronic component mounting apparatus provided with the conventional multiple transfer head, there is a problem that the types of electronic components that can be mounted are limited.
[0004]
Accordingly, an object of the present invention is to provide an electronic component mounting method capable of mounting various types of electronic components with a compact transfer head.
[0005]
[Means for Solving the Problems]
The electronic component mounting method according to claim 1 is an electronic component mounting method in which an electronic component is taken out from a component supply unit by a multiple transfer head having a plurality of unit transfer heads, and is transferred and mounted on a substrate. A pick-up step for sucking and holding electronic components by suction nozzles of a plurality of unit transfer heads, a head moving step for moving a transfer head holding electronic components to each unit transfer head to the substrate, and the transfer head Rotating the suction nozzles around the axis during the movement process of the nozzle, the nozzle rotation process for aligning the rotation position of the electronic components sucked and held by each suction nozzle in the θ direction, and mounting the electronic components after the rotation alignment on the substrate The transfer head performs a part of the work operation including the rotation operation and / or the raising / lowering operation of each suction nozzle in the nozzle rotation step. Based on an operation pattern set in advance for a combination of electronic components held by the plurality of unit transfer heads in one mounting turn in which the electronic component is taken out from the feeding unit and mounted on the substrate, the operation pattern is : combination of electronic components to be held before Symbol plurality of unit transfer heads, the thickness of the electronic component held by the one unit transfer head of the plurality of unit transfer head is large, the thickness Is a component combination that interferes with the reflection plate of the adjacent unit transfer head in the θ rotation, and the height of the suction nozzle of the adjacent unit transfer head was changed for this component combination. A combination of an operation pattern in which the rotation operations are performed simultaneously at once and an electronic component held by the plurality of unit transfer heads is combined with the plurality of unit transfer units. The thickness dimension of the electronic component held by one unit transfer head of the relays is large, the electronic component having the large thickness dimension interferes with the reflector of the adjacent unit transfer head in the θ rotation, and the thickness This is a component combination that causes mutual interference between the electronic components having large dimensions and the adjacent electronic components due to the matching of the diagonal directions, and the adjoining unit transfer head is adsorbed with respect to this component combination. After the nozzle height is changed, any one of the operation patterns in which the rotation operation is performed without making the diagonal directions of the adjacent electronic components coincide with each other by providing an order for the θ rotation.
[0006]
According to the present invention, the operation operation including the rotation operation and / or the raising / lowering operation of each suction nozzle in the nozzle rotation process performed in the head movement process of moving the transfer head holding the electronic component to each unit transfer head is transferred. By performing a combination of electronic components held by a plurality of unit transfer heads in one mounting turn in which the mounting head takes out the electronic components from the component supply unit and transfers and mounts them on the substrate, based on a preset operation pattern, Interference between electronic components and between the electronic component and the reflecting plate can be eliminated as much as possible, and the range of electronic components to be simultaneously mounted can be expanded.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a front view of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. The block diagram which shows the structure of the control system of the electronic component mounting apparatus of the form of FIG. 4, FIG.4, FIG.5, FIG.6, FIG.7 is explanatory drawing of the nozzle operation pattern in the electronic component mounting method of one embodiment of this invention, FIG. FIG. 8 is an explanatory view of nozzle height change in the electronic component mounting method according to the embodiment of the present invention.
[0008]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is arranged in the X direction at the center of the base. The conveyance path 2 conveys the board 3 and positions it at the mounting position of the electronic component. On both sides of the conveyance path 2, component supply units 4 are arranged, and each component supply unit 4 has a large number of tape feeders 5 arranged in parallel. The tape feeder 5 accommodates electronic components held on the tape, and supplies the electronic components by pitch feeding the tape.
[0009]
Y-axis tables 6A and 6B are disposed on both ends of the upper surface of the base, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. The X-axis tables 7A and 7B are equipped with a transfer head 8 and a camera 11 that moves integrally with the transfer head 8, respectively.
[0010]
When the Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B are driven in combination, the transfer head 8 moves horizontally, and electronic components are picked up from the respective component supply units 4 by suction nozzles 10. (Refer to FIG. 2) and picked up and mounted on the substrate 3 positioned in the conveyance path 2. The camera 11 that has moved onto the substrate 3 captures and recognizes the substrate 3. A line camera 12 is disposed along the path from the component supply unit 4 to the conveyance path 2. The line camera 12 images the electronic components held by each transfer head 8 from below.
[0011]
Next, the transfer head 8 will be described with reference to FIG. As shown in FIG. 2, the transfer head is multi-type and has a configuration in which three unit transfer heads 9A, 9B, and 9C as component holding means are arranged in parallel at an arrangement pitch np. A suction nozzle 10 that sucks and holds an electronic component is detachably mounted on a nozzle mounting portion 9 a provided at the lower end of the unit transfer head 9.
[0012]
These unit transfer heads 9 are individually controlled. By individually driving the unit transfer heads 9A, 9B, and 9C, the suction nozzle 10 can be individually rotated by θ around the axis, and can be moved up and down. It has become. Note that the unit transfer head is indicated by a symbol (9A, 9B, 9C) with a suffix when it is necessary to distinguish, and is simply denoted by symbol 9 when it is not necessary to distinguish.
[0013]
The suction nozzle 10 includes a shaft portion 10a provided with a suction hole for sucking an electronic component at a lower end portion, and a bowl-shaped reflector 10b provided on the upper portion of the shaft portion 10a. The reflection plate 10 b reflects the illumination light irradiated from below when the electronic component held by the suction nozzle 10 by the line camera 12 is imaged, and makes the line camera 12 incident.
[0014]
Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 3, a CPU 20 is an arithmetic unit, and executes various programs stored in the program storage unit 21, thereby controlling the following units to execute operation control such as mounting operation and arithmetic processing. In executing this program, various data stored in the data storage unit 22 are referred to. The program storage unit 21 stores a component combination data creation program 21a in addition to a mounting operation sequence program.
[0015]
In addition to the mounting data 22a, the data storage unit 22 stores component combination data 22b and operation pattern data 22c. The component combination data 22b and the operation pattern data 22c will be described later. The recognition processing unit 23 recognizes the position of the substrate 3 by recognizing the imaging result of the camera 11, and recognizes the imaging result of the line camera 12, thereby holding the electronic component held by the transfer head 8. Recognize
[0016]
The mechanism drive unit 24 drives mechanism units such as the X-axis tables 7A and 7B, the Y-axis tables 6A and 6B, and the transfer head 8. The operation input unit 25 is an input means such as a keyboard or a mouse, and inputs various data such as operation command input and tape feed speed pattern data. The display unit 26 is a display device and performs display such as guidance screen display at the time of operation input.
[0017]
Next, the component combination data 22b and the operation pattern data 22c will be described. The component combination data 22b includes a plurality of unit transfer heads 9 in one mounting turn in which the transfer head 8 including the three unit transfer heads 9 takes out an electronic component from the component supply unit 4 and transfers and mounts it on the substrate 3. Is a data showing a combination of electronic components held by. The combination of the electronic components and the configuration of the transfer head 8 have a relationship as described below.
[0018]
In configuring the transfer head 8 with a plurality of unit transfer heads 9, the arrangement pitch np of the unit transfer heads 9 should be as small as possible from the demand for compactness. On the other hand, in order to widen the range of electronic components that can be mounted, it is preferable that the arrangement pitch np is large so that the electronic components including large-sized electronic components can be targeted. Thus, since the requirement for compactness in design and the expansion of the target part range are generally contradictory conditions, the arrangement pitch np is determined in consideration of the above two in the device design.
[0019]
When the arrangement pitch np is determined and the dimensions of each part of the suction nozzle 10 are further determined, the range of types of electronic components that can be naturally mounted is limited. This range is limited not only to the shape and size of the electronic component as a single unit, but also to the electronic component that can be simultaneously held and mounted on the substrate 3 by the transfer head 8 having a plurality of unit transfer heads 9. The combination of is also included.
[0020]
That is, in order to make the multiple-type transfer head 8 function efficiently, each unit transfer head 9 holds electronic components in each mounting turn, and maximizes the mounting capability of the transfer head 8. However, in the mounting operation for electronic parts having various shapes and dimensions, the suction nozzle 10 of the adjacent unit transfer head 9 is normally held due to the restriction caused by the arrangement pitch np. The combination of electronic components that can be mounted is limited.
[0021]
In the conventional electronic component mounting apparatus, the combination range of electronic components that can be simultaneously held by the unit transfer heads 9 of the transfer head 8 is limited due to such restrictions, and the electronic components are limited in size. In many cases, the adjacent suction nozzles must be emptied, and this is a factor that reduces the mounting capability of the transfer head 8.
[0022]
In view of such a problem, in the electronic component mounting method of the present embodiment, for the types of electronic components necessary for mounting the board, combinations of electronic components in each mounting turn by the transfer head 8, that is, A combination of electronic components that the unit transfer head 9 simultaneously holds and can be mounted on the substrate 3 is created in advance as component combination data 22b.
[0023]
In the present embodiment, the operation pattern of the work operation including the rotation operation and the raising / lowering operation of the suction nozzle 10 is set in advance corresponding to each component combination described above. That is, in the moving process in which the transfer head 8 that picks up the electronic component from the component supply unit 4 moves onto the substrate 3, the electronic component sucked and held by each suction nozzle 10 by rotating the suction nozzle 10 about the axis θ. The nozzle rotation is performed so that the rotation position in the θ direction is aligned. The operation pattern of the work operation of each suction nozzle 10 in this nozzle rotation process is made to correspond to each of the component combinations indicated by the component combination data 22b described above. These are stored as operation pattern data 22c.
[0024]
By setting such an operation pattern in advance, as shown in the specific examples to be described later, components that were originally unable to be mounted simultaneously in the same mounting turn due to size and shape restrictions Combinations can be targeted for simultaneous implementation. That is, the interference between the electronic components held by the adjacent suction nozzles 10 and the interference between the electronic components and the reflecting plate 10b of the adjacent suction nozzle 10 are ordered by the θ rotation of each suction nozzle 10. This is avoided by combining the up / down motion with the θ rotation, and the range to be simultaneously mounted is expanded as much as possible.
[0025]
The component combination data and the operation pattern data are created by the component combination data creation program 21 a stored in the program storage unit 21 based on the mounting data 22 a and stored in the data storage unit 22. Of course, data creation processing may be performed in advance by an external data arithmetic device, and only the created data may be stored.
[0026]
Hereinafter, examples of component combinations and operation patterns will be described with reference to FIGS. Here, the four most basic examples will be described. First, the component combination shown in FIG. 4 shows an example in which the electronic components picked up by the three unit transfer heads 9A, 9B, and 9C are all small electronic components Pa. In this case, since the electronic component size is small with respect to the nozzle arrangement pitch np, the interference between the electronic components and the interference between the electronic component and the reflecting plate do not occur.
[0027]
In this case, the θ rotation operation of the suction nozzle 10 is performed simultaneously for the three unit transfer heads 9 as shown in FIG. That is, this example is the simplest operation pattern in which there is no operation restriction. Although FIG. 4 shows an example in which the same type of electronic component Pa is picked up by each unit transfer head 9, the interference between the electronic components and the interference between the electronic component and the reflecting plate are not caused. In this case, this operation pattern is applied even to a component combination in which electronic components of different sizes and shapes are mixedly mounted.
[0028]
Next, FIG. 5 shows an example of combination of components when the planar size of the electronic component is larger than the example shown in FIG. 4 and the electronic components interfere with each other during θ rotation. In this case, if the three electronic components Pb are simultaneously rotated by θ, the diagonal direction of each electronic component coincides with the arrangement pitch direction in the rotation process, so the diagonal dimension is larger than the arrangement pitch. The corners of adjacent electronic components interfere with each other, and normal θ rotation cannot be performed.
[0029]
For this reason, in such a component combination, as shown in FIG. 5 (b), an order is set for the θ rotation, and first, two electronic components held by the suction nozzles 10 of the unit transfer heads 9A and 9C at both ends. Pb is first rotated by θ. At this time, since the electronic component Pb located in the middle is stopped, the diagonal directions of the adjacent electronic components do not coincide with each other, and the two electronic components Pb can be rotated by θ while ensuring the clearance. it can.
[0030]
Thereafter, as shown in FIG. 5C, the electronic component Pb held by the unit transfer head 9B located at the center is rotated by θ. As a result, even if component combinations that cause mutual interference between components when θ rotation is performed at the same time, by setting the order for θ rotation, component combinations that can be mounted with the same mounting turn Can be adopted. In this example as well, the types of electronic components may be different, and this operation pattern is applied as long as the above-described interference conditions are met.
[0031]
Next, FIG. 6 shows a combination of components in the case where electronic components of a type having a large thickness dimension as well as a planar size are included in three target electronic components. In such a case, for example, when the diagonal direction coincides with the arrangement pitch direction as in the electronic component Pc held by the unit transfer head 9A, the reflector 10b and the electronic component Pc of the adjacent unit transfer head 9B. May interfere with other corners.
[0032]
In order to avoid such interference, in such a component combination, as shown in FIG. 5B, the suction nozzle 10 holding the electronic component Pd adjacent to the electronic component Pc having a large thickness as well as the planar size is provided as Hb1. The height of the reflector 10b is changed by raising the height of the reflector 10b, and the reflector 10b is retracted from a height position where interference with the electronic component Pc occurs.
[0033]
Thereafter, as shown in FIG. 5C, the three electronic components Pc, Pd, and Pe are simultaneously rotated by θ. As a result, when the electronic component is rotated by θ at the height position where the electronic component is removed from the pickup position of the tape feeder 5, interference between any electronic component and the reflecting plate of the suction nozzle adjacent to the electronic component may occur. Even a combination of parts can be adopted as a combination of parts that can be mounted by the same mounting turn by changing the height during θ rotation.
[0034]
In addition, in the example shown in FIG. 6, although the interference example of the reflecting plate which made object the adsorption nozzle 10 of two unit transfer heads 9A and 9B adjacent to each other is shown, in addition to the unit transfer heads 9A and 9B, Even when similar interference occurs in the unit transfer heads 9B and 9C, this operation pattern is applied as long as the above-described interference conditions are satisfied.
[0035]
Next, FIG. 7 shows a combination of components such that the interference example shown in FIG. 5 and the interference example shown in FIG. 6 occur together. That is, in this example, the target three electronic components include the electronic component Pc of a type having a large thickness as well as a planar size as in FIG. 6, and the interference between the electronic component Pc and the reflecting plate of the adjacent suction nozzle In addition, the electronic component Pc and the adjacent electronic component Pf are component combinations that cause mutual interference between the electronic components.
[0036]
In order to avoid such interference, as shown in FIG. 7B, the height of the suction nozzle 10 holding the electronic component Pf adjacent to the electronic component Pc is raised by Hb2 to change the height. Then, the reflector 10b is retracted from the height position where the interference with the electronic component Pc occurs.
[0037]
As shown in FIG. 7C, in this state, among the three electronic components Pc, Pf, and Pg, first, the two electronic components Pc held by the suction nozzles 10 of the unit transfer heads 9A and 9C at both ends. , Pg are rotated by θ, and then, as shown in FIG. 7D, the electronic component Pf held by the unit transfer head 9B located at the center is rotated by θ.
[0038]
As a result, even if the component combination is such that the interference between the electronic component and the reflector, and also the mutual interference between the electronic components, the same mounting is achieved by setting the height adjustment and operation delay during θ rotation. It can be adopted as a combination of components that can be mounted by turns.
[0039]
The above four examples shown in FIGS. 4 to 7 are basic examples of component combinations and operation patterns based on these basic examples. Many other component combinations and operation patterns can be set. That is, it is a combination of electronic components of a quantity within the range of the number of unit transfer heads 9 provided in the transfer head 8, and the arrangement pitch np and nozzle dimensions of the suction nozzles 10 mounted on the unit transfer head 9. As long as the electronic components have a size allowed by the above-described combination, an operation pattern of a work operation in which the θ rotation operation and the lifting operation of the suction nozzle 10 are combined is set in advance for each combination.
[0040]
This electronic component mounting apparatus is configured as described above. Next, an electronic component mounting method will be described. First, in FIG. 1, the transfer head 8 is moved above the component supply unit 4, and the electronic components are sucked and held by the suction nozzles 10 of the three unit transfer heads 9 (pickup process). At this time, in the same mounting turn by the transfer head 8, a combination of components that can be mounted is registered in the component combination data 22b in advance, and when taking out an electronic component according to the mounting data 22a, this combination of components is used. The electronic component to be taken out in the same mounting turn is determined with reference to the data.
[0041]
Thereafter, the transfer head 8 holding the electronic component in each unit transfer head 9 is moved toward the substrate 3 positioned in the transport path 2 (head moving step). In the moving process of the transfer head 8, the electronic component held by the suction nozzle 10 is imaged by the line camera 12 from below (imaging process). And the position of an electronic component is detected by carrying out recognition processing of this imaging result (position detection process).
[0042]
When the position of the electronic component is detected, the suction nozzle 10 is rotated by θ around the axis, thereby aligning the θ rotation position of the electronic component sucked and held by each suction nozzle 10 (nozzle rotation step). Thereafter, the transfer head 8 arrives on the substrate 3 and sequentially mounts the plurality of electronic components after rotational alignment on the substrate 3 based on the position detection result (mounting process).
[0043]
In the nozzle rotation process described above, based on the operation pattern corresponding to the combination of components in the mounting turn, θ rotation of each suction nozzle 10 for θ alignment of electronic components, and height adjustment if necessary The suction nozzle 10 is moved up and down.
[0044]
Next, the calculation of the height change amount in the above-described height change will be described with reference to FIG. As described above, the height change is performed in order to prevent interference between the electronic component and the reflecting plate of the adjacent suction nozzle. Here, a condition in which interference between the electronic component and the reflection plate does not occur for the two adjacent suction nozzles 10 is considered.
[0045]
As shown in FIG. 8A, the height difference X12 between the lower surface of the reflecting plate 10b of the suction nozzle 10 (1) and the upper edge of the electronic component P2 held by the adjacent suction nozzle 10 (2), and Any height difference X21 between the lower surface of the reflecting plate 10b of the suction nozzle 10 (2) and the upper edge of the electronic component P1 held by the suction nozzle 10 (1) is set as an allowable gap that does not cause interference. The minimum height difference Xm is an interference avoidance condition for preventing interference between the reflecting plate and the electronic component in two adjacent suction nozzles. Here, X21 and X12 are the dimension values a1 and b1 of the electronic component P1, the shaft length length c1 of the suction nozzle 10 (1), the dimension values a2 and b2 of the electronic component P2, and the shaft length of the suction nozzle 10 (2). It is calculated from the length dimension c2.
[0046]
FIG. 8B shows a height change amount H2 for satisfying the above-mentioned interference avoidance condition when the suction nozzle 10 (2) is moved up and down relative to the suction nozzle 10 (1) (FIG. 8C). ))). That is, the height change amount H2 is a minimum height change amount Hmin. Determined by the condition that the electronic component P1 and the reflector 10b of the suction nozzle 10 (2) do not interfere with each other. And the maximum height change amount Hmax. Determined by the condition that the electronic component P2 and the reflecting plate 10b of the suction nozzle 10 (1) do not interfere with each other. The interference avoidance condition is satisfied. Therefore, if H2 that satisfies this condition and minimizes the absolute value is obtained, the object of interference prevention can be achieved with as little height change amount as possible.
[0047]
If the height change amount H2 is obtained in this way, the next two adjacent adsorbing nozzles 10 (2) and 10 (3) are similarly subjected to the interference avoidance condition. The calculation for obtaining the change amount is performed. Here, first, a height change amount H3 ′ when the relative height of the suction nozzle 10 (3) is changed with respect to the suction nozzle 10 (2) is obtained. The height change amount H3 ′ is converted into a height change amount H3 based on the electronic component P1 of the suction nozzle 10 (1).
[0048]
In this manner, by using the first suction nozzle 10 (1) as a reference nozzle, the height change amount between two adjacent suction nozzles 10 is sequentially obtained, so that a plurality of electronic components can be simultaneously obtained by a plurality of suction nozzles. Even in the case of holding, the height change amount for preventing interference between the reflector and the electronic component can be obtained reasonably and efficiently.
[0049]
【The invention's effect】
According to the present invention, the nozzle rotation process performed in the head moving process of moving the transfer head holding the electronic component on each unit transfer head, and the rotation operation and / or the lifting operation of each suction nozzle in the component imaging process are included. The work operation is based on an operation pattern set in advance for a combination of electronic components held by a plurality of unit transfer heads in one mounting turn in which the transfer head takes out the electronic components from the component supply unit and transfers and mounts them on the substrate. Therefore, the range of electronic components to be simultaneously mounted can be expanded by eliminating interference between electronic components and between the electronic component and the reflector as much as possible.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a front view of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment. FIG. 4 is an explanatory diagram of a nozzle operation pattern in the electronic component mounting method according to the embodiment of the invention. FIG. 6 is an explanatory diagram of a nozzle operation pattern in the electronic component mounting method according to the embodiment. FIG. 6 is an explanatory diagram of the nozzle operation pattern in the electronic component mounting method according to the embodiment of the invention. FIG. 8 is an explanatory diagram of a nozzle operation pattern in the mounting method. FIG. 8 is an explanatory diagram of nozzle height change in the electronic component mounting method according to the embodiment of the present invention.
3 Substrate 4 Component supply unit 8 Transfer head 9, 9A, 9B, 9C Unit transfer head 10 Suction nozzle 10a Shaft 10b Reflector 22b Component combination data 22c Operation pattern data

Claims (1)

An electronic component mounting method in which an electronic component is taken out from a component supply unit by a multiple-type transfer head having a plurality of unit transfer heads, and is transferred and mounted on a substrate. A pick-up process for sucking and holding electronic components, a head moving process for moving a transfer head holding electronic components to each unit transfer head to the substrate, and the suction nozzle around the axis in the movement process of the transfer head a nozzle rotation step for aligning the rotation position in the θ direction of the electronic component sucked and held by each suction nozzle by rotating θ, and a step of mounting the electronic component after the rotation position on the substrate, in the nozzle rotation step The transfer head performs a work operation including a rotation operation and / or an elevating operation of each suction nozzle, and the electronic component is taken out from the component supply unit onto the substrate. Based on a preset operation pattern for a combination of electronic components held by the plurality of unit transfer heads in one mounting turn for transfer mounting,
The operation pattern is a combination of electronic components to be held before Symbol plurality of unit transfer heads, the thickness of the electronic component held by the one unit transfer head of the plurality of unit transfer heads The large electronic component having a large thickness dimension is a component combination that interferes with the reflection plate of the adjacent unit transfer head in the θ rotation. For this component combination, the height of the suction nozzle of the adjacent unit transfer head is high. An operation pattern in which the rotation operation is performed simultaneously at the same time after the change is made, and
The combination of the electronic components held by the plurality of unit transfer heads is such that the thickness dimension of the electronic component held by one unit transfer head among the plurality of unit transfer heads is large, A large electronic component interferes with the reflection plate of the adjacent unit transfer head in the θ rotation, and the diagonal direction between the electronic component having a large thickness and the adjacent electronic component matches each other. This is a combination of components that cause interference. After changing the height of the suction nozzle of the adjacent unit transfer head for this combination of components, a diagonal is formed between adjacent electronic components by providing an order for the θ rotation. An electronic component mounting method characterized by being one of operation patterns in which the rotation operation is performed without matching directions.

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