JP3888031B2 - Radiator - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention belongs to the field of radiators used in electronic equipment.
[0002]
[Prior art]
9 and 10 are a perspective view and a sectional view showing the structure of a conventional radiator. This shows an example of the mounting structure of the heat sink 12 used for heat dissipation of the IC 11 for the power amplifier of the in-vehicle radio.
In order to diffuse the heat generated from the IC 11 to the surrounding outside air, a heat sink 12 having an integral structure having a plurality of angle fins mainly made of aluminum is attached in close contact with the surface of the IC 11. The IC 11 and the heat radiating plate 12 are fixed by mainly fastening the IC 11 to the heat radiating plate 12 with two screws 14a and 14b via an iron fixing bracket 13.
[0003]
Next, the heat radiation operation will be described.
The heat generated from the IC 11 is gradually conducted to the inside of the heat radiating plate 12 that is in close contact with the surface of the IC 11, and the surface temperature of the heat radiating plate 12 gradually increases. When the surface temperature of the heat radiating plate 12 becomes higher than the ambient outside air temperature, the heat is diffused mainly from the surface of the mountain fin having a large surface area to the surrounding ambient air by radiation. Thereby, the amount of heat generated from the IC 11 and the amount of heat diffused from the heat radiating plate 12 to the surrounding outside air are kept in balance, thereby preventing the IC 11 from being heated to a predetermined temperature or higher.
[0004]
[Problems to be solved by the invention]
In such a conventional in-vehicle radio or the like, the IC 11 is not always arranged at the center of the heat radiating plate 12 due to restrictions in layout design such as a circuit board and an exterior, as shown in FIG. 9 or FIG. In addition, there are many cases where the heat radiating plate 12 is arranged near the end region.
In such a case, the heat generated from the IC 11 is not uniformly transmitted to the entire heat radiating plate 12, and a large difference occurs in the surface temperature at both ends of the heat radiating plate 12. That is, the surface temperature of the heat radiating plate 12 rapidly decreases as the distance from the IC 11 that is a heat source increases. For example, as shown in FIG. 9 or FIG. 10, the surface temperatures of the left end region near the IC 11 of the heat sink 12 and the right end region away from the IC 11 are Ta (° C.) and Tb (° C.), respectively. Then, the relationship between Ta and Tb is as follows.
Ta >> Tb
That is, as compared with the surface temperature Ta of the left end region near the IC 11 of the heat sink 12, the surface temperature Tb of the right end region far from the IC 11 is extremely low.
[0005]
As described above, when a large difference in the surface temperature occurs depending on the region of the heat radiating plate 12, a large amount of heat radiation to the surrounding outside air also occurs depending on the region. It does not function, and the heat dissipation efficiency of the heat sink 12 as a whole is very low.
[0006]
As described above, in the conventional radiator, when the mounting position of the IC 11 is not arranged at the center of the radiator plate 12, the temperature distribution on the surface of the radiator plate 12 becomes uneven, and the heat radiation efficiency is extremely reduced. There was a problem.
[0007]
The present invention has been made to solve the above problems, and to obtain a heat radiator having a uniform temperature distribution over the entire surface of the heat sink regardless of the mounting position of the heating element and having a high heat radiation efficiency. It is an object.
[0008]
[Means for Solving the Problems]
In the radiator according to the present invention, a heat dissipating means for diffusing the heat generated from the heating element in the region that is eccentric from the center to the periphery, mounted radiator means between a heat generating body and a heat radiating means into contact with the heat dissipating means of example Bei and heat conducting means comprising a material having high thermal conductivity than the material, the heat dissipating means in the vicinity of the center and the heat conducting means and is non-rectangular apart between the radiation means and the heat conduction means so as not to contact A contact region is formed .
[0009]
In the radiator according to the invention, mounted between a heat radiation means for diffusing the heat generated from the heating element in the region that is eccentric from the center to the periphery, a heat generating body and a heat radiating means into contact with the heat dissipating means Heat conduction means made of a material having a higher thermal conductivity than that of the heat radiation means, and the heat radiation means and the heat conduction means are separated from each other in the vicinity of the center so that the heat radiation means and the heat conduction means are not in contact with each other. A non-contact area having a shape is formed, and a contact area in which the heat dissipating means and the heat conducting means are in contact with each other is formed at a position symmetrical with respect to the vicinity of the center .
[0010]
In the heat radiator according to the present invention, the heat conducting means is provided with a fixing means for fixing the heating element in an integral structure.
[0011]
In the radiator according to the present invention, the heat radiating means is made of a material mainly composed of aluminum, and the heat conducting means is made of a material mainly composed of copper.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
1 and 2 are a perspective view and a sectional view showing Embodiment 1 of the present invention.
In order to diffuse the heat generated from the power amplifier IC 1 which is a heating element to the surrounding outside air, a heat radiating plate 2 as a heat radiating means having a plurality of angle fins mainly made of aluminum is provided. . Further, between the IC 1 and the heat radiating plate 2, a heat conducting plate 3 as a heat conducting means made of a material having a higher thermal conductivity than the material of the heat radiating plate 2 is in close contact with both surfaces of the IC 1 and the heat radiating plate 2. It is attached to. The IC 1 is fixed by being fastened to the heat radiating plate 2 with the heat conducting plate 3 sandwiched between two screws 5a and 5b mainly through an iron fixing bracket 4. The heat conductive plate 3 is further fastened and fixed to the heat radiating plate 2 by two screws 5c and 5d at another end, and the adhesion to the heat radiating plate 2 is enhanced.
[0013]
As the material of the heat conductive plate 3, for example, if the heat radiating plate 2 is a material mainly composed of aluminum, a material mainly composed of copper having a heat conductivity approximately 1.7 times higher than this is used. In such a combination of materials, a good heat dissipation effect can be obtained.
[0014]
Next, the heat radiation operation will be described.
The heat generated from the IC 1 is rapidly conducted to the inside of the heat conductive plate 3 that is in close contact with the surface of the IC 1 and has high thermal conductivity, and the entire surface temperature of the heat conductive plate 3 is rapidly increased. When the total surface temperature of the heat conducting plate 3 becomes higher than a predetermined temperature, the heat is gradually conducted to the inside of the heat radiating plate 2 that is in close contact with the heat conducting plate 3, and this time the total surface temperature of the heat radiating plate 2 gradually increases. It gets higher. When the surface temperature of the heat radiating plate 2 becomes higher than the ambient outside air temperature, the heat diffuses mainly from the surface of the angle fin having a large surface area to the surrounding ambient air by radiation. In this way, the amount of heat generated from the IC 1 and the amount of heat diffused from the heat radiating plate 2 are kept in balance, thereby preventing the IC 1 from reaching a predetermined high temperature.
[0015]
In FIG. 1 or FIG. 2, an example of the distribution state of the surface temperature of the heat sink 2 is as follows. Assuming that the surface temperatures of the left end region near the IC 1 of the heat sink 2 and the right end region away from the IC 1 are Ta (° C.) and Tb (° C.), the relationship between Ta and Tb is as follows: become.
Ta ≧ Tb
That is, as compared with the surface temperature Ta of the left end region near the IC 1 of the heat sink 2, the surface temperature Tb of the right end region far from the IC 1 is substantially equal or slightly lower. As described above, the surface temperature of the heat radiating plate 2 becomes almost uniformly distributed as compared with the case where the heat radiating plate 2 is directly attached to the IC 1, thereby improving the heat radiating efficiency.
[0016]
As described above, according to the first embodiment, the heat radiating plate 2 that diffuses the heat generated from the IC 1 in the region eccentric from the center to the periphery, and the material of the heat radiating plate 2 that is mounted between the IC 1 and the heat radiating plate 2 Since the heat conduction plate 3 made of a material having higher heat conductivity is provided, the temperature distribution on the surface of the heat radiating plate 2 is almost uniform over the entire surface regardless of the mounting position of the IC 1, and the heat radiating device has high heat radiating efficiency. Is obtained.
[0017]
Further, according to the first embodiment, when the IC 1 package is extremely small and the contact area is very small, the heat conduction to the heat radiating plate 2 is insufficient even if it is in direct contact with the heat radiating plate 2. However, since the heat generated by the IC 1 is smoothly conducted to the heat radiating plate 2 through the heat conducting plate 3 having high thermal conductivity, a good heat radiating effect can be obtained.
[0018]
Embodiment 2. FIG.
3 and 4 are a perspective view and a sectional view showing Embodiment 2 of the present invention. The main configuration is the same as that of the first embodiment, but here, the heat conducting plate 3 is not in close contact with the heat radiating plate 2 on its entire surface, but in contact with two regions divided by a non-contact region. An example is shown.
The heat conducting plate 3 is in close contact with the heat radiating plate 2 once in the left region where the IC 1 is mounted. Next, the non-contact area | region which does not contact with the heat sink 2 is formed by the rectangular shape which leaves | separates from the heat sink 2 in the center vicinity of the heat sink 2. FIG. Further, the heat sink 2 is mounted so as to be in close contact with the heat sink 2 again in a right region symmetrical to the left region with respect to the center of the heat sink 2.
[0019]
By providing the heat conducting plate 3 with such a structure, the heat generated from the IC 1 is conducted from the two regions where the heat conducting plate 3 contacts the heat radiating plate 2 to the inside of the heat radiating plate 2. Become. That is, heat is conducted simultaneously from two contact areas that are symmetrical with respect to the center of the heat sink 2. Thereby, the temperature distribution of the surface of the heat sink 2 becomes a more uniform state, and the heat dissipation efficiency of the heat sink 2 as a whole is further improved.
[0020]
In FIG. 3 or FIG. 4, an example of the distribution state of the surface temperature of the heat sink 2 is as follows. Assuming that the surface temperatures of the left end region near the IC 1 of the heat sink 2 and the right end region away from the IC 1 are Ta (° C.) and Tb (° C.), the relationship between Ta and Tb is as follows: become.
Ta ≒ Tb
That is, the surface temperature Ta of the leftmost region near the IC1 of the heat sink 2 is substantially equal to the surface temperature Tb of the rightmost region away from the IC1.
Thus, compared with the case where the heat conductive plate 3 is in close contact with the heat radiating plate 2 over the entire surface, the surface temperature of the heat radiating plate 2 is more uniformly distributed, thereby further improving the heat radiating efficiency.
[0021]
As described above, according to the second embodiment, the heat conducting plate 3 is provided with the non-contact region in the contact region with the heat radiating plate 2, so that the IC 1 is shifted to the end region of the heat radiating plate 2. Even in the case of being arranged, the heat generated from the IC 1 is uniformly distributed to the heat radiating plate 2 through a plurality of contact regions divided by the non-contact region of the heat conducting plate 3. The temperature distribution on the entire surface becomes more uniform, further improving the heat dissipation efficiency.
[0022]
In the second embodiment, an example in which there are two contact regions divided by the non-contact region between the heat conducting plate 3 and the heat radiating plate 2 is shown. However, depending on the mounting position of the IC 1 and the shape of the heat radiating plate 2 Thus, the shape of the heat conductive plate 3 may be changed so as to have more contact areas such as three or four, and the same effect can be obtained even in this case.
[0023]
Embodiment 3 FIG.
5 and 6 are a perspective view and a sectional view showing Embodiment 3 of the present invention. The main configuration is the same as that of the second embodiment, but here, an example is shown in which the shape of the heat sink 2 is divided due to restrictions in layout design.
The heat radiating plate 2 has a monolithic shape, but the shape area of the chevron fins is not formed uniformly, but is divided at both ends. The heat conducting plate 3 is mounted so as to be in close contact with the heat radiating plate 2 in two regions divided by the non-contact region corresponding to the divided chevron fin shape region, and the heat generated from the IC 1 is Conduction is conducted from the two regions to the heat sink 2.
[0024]
In FIG. 5 or FIG. 6, an example of the distribution state of the surface temperature of the heat sink 2 is as follows. Assuming that the surface temperatures of the left end region near the IC 1 of the heat sink 2 and the right end region away from the IC 1 are Ta (° C.) and Tb (° C.), the relationship between Ta and Tb is as follows: become.
Ta ≒ Tb
That is, the surface temperature Ta of the leftmost region near the IC1 of the heat sink 2 is substantially equal to the surface temperature Tb of the rightmost region away from the IC1.
Thus, even when the shape of the heat radiating plate 2 is divided, the surface temperature of the heat radiating plate 2 is in a uniformly distributed state, thereby improving the heat radiating efficiency.
[0025]
As described above, according to the third embodiment, even when the shape of the heat radiating plate 2 is not uniform or divided, the heat generated from the IC 1 is caused by the non-contact region of the heat conducting plate 3. Since the heat is uniformly distributed to the heat sink 2 through the plurality of divided contact areas, the temperature distribution on the entire surface of the heat sink 2 is uniform, and the heat dissipation efficiency is improved.
[0026]
In the third embodiment, the example in which the shape area of the angle fin is divided into two as the heat sink 2 is shown. However, in the case of the shape divided into more areas such as three divisions or four divisions. However, the same effect can be obtained by providing the heat conducting plate 3 with a rectangular shape that forms a plurality of contact regions divided by non-contact regions corresponding to the divided regions.
[0027]
Embodiment 4 FIG.
7 and 8 are a perspective view and a sectional view showing Embodiment 4 of the present invention. Here, an example is shown in which the heat conducting plate 3 is provided with a fixing means for fixing the IC 1 in an integrated structure.
In the first to third embodiments, as a method for fixing the IC 1, the heat conduction plate 3 is sandwiched between the two screws 5 a and 5 b via the fixing bracket 4 and fastened to the heat radiating plate 2. In the fourth embodiment, a protrusion fixing portion as a fixing means for sandwiching the IC 1 is integrally formed on the heat conducting plate 3, and the IC 1 is connected to the heat conducting plate 3 with two screws 5a and 5b via the protrusion fixing portion. In addition, the heat radiating plate 2 is fastened and fixed.
[0028]
As described above, according to the fourth embodiment, the heat conducting plate 3 is provided with a fixing means for fixing the IC 1 in an integrated structure, so that a separate bracket such as the fixing bracket 4 for fixing the IC 1 is not required. , Component parts can be reduced, and material costs can be reduced.
[0029]
The shape of the protrusion fixing portion as the fixing means provided in the heat conduction plate 3 shown in the fourth embodiment is an example, and may be another shape that can be integrally formed. In this case, the same effect can be obtained. can get.
[0030]
In the first to fourth embodiments, an example of so-called air cooling in which heat generated from the IC 1 is radiated from the heat radiating plate 2 to the surrounding outside air has been described. However, when other heat radiating methods such as water cooling using a radiating pipe are used. In this case, the same effect can be obtained.
[0031]
【The invention's effect】
Since the present invention is configured as described above, the following effects are obtained.
[0032]
According to the radiator according to the present invention, it is mounted the heat generated by the heating element in an eccentric region from the center and radiating means for diffusing the surrounding, between a heat generating body and a heat radiating means into contact with the heat radiating means radiating e Bei a heat conducting means comprising a material having high thermal conductivity than the material of the unit, rectangular and the radiating unit and the heat conducting means near the center away between the radiation means and the heat conduction means so as not to contact Since the non-contact area is formed , the heat generated from the heating element is uniformly distributed to the heat dissipation means through the contact area, the temperature distribution on the entire surface of the heat dissipation means becomes uniform, and the heat dissipation efficiency is improved. effective.
[0033]
Further, according to the heat radiator according to the present invention, the heat radiating means for diffusing heat generated from the heat generating element in the region eccentric from the center to the periphery, and between the heat generating element and the heat radiating means so as to come into contact with the heat radiating means. A heat conduction means made of a material having a higher thermal conductivity than the material of the heat dissipation means, and the heat dissipation means and the heat conduction means are separated from each other so that the heat dissipation means and the heat conduction means do not contact each other near the center. A rectangular non-contact area is formed, and a contact area in which the heat dissipating means and the heat conducting means are in contact with each other is formed symmetrically with respect to the vicinity of the center. The heat is uniformly distributed to the heat radiating means through the contact region, and the temperature distribution on the entire surface of the heat radiating means becomes uniform, and the heat radiating efficiency is improved.
[0034]
Further, according to the radiator according to the present invention, the heat conducting means is provided with a fixing means for fixing the heating element in an integral structure, so that a separate bracket for fixing the heating element becomes unnecessary, and the number of components is reduced. The material cost can be reduced.
[0035]
Further, according to the radiator according to the present invention, the heat dissipation means is made of a material mainly composed of aluminum, and the heat conduction means is made of a material mainly composed of copper. There is an effect that a radiator is obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing Embodiment 1 of the present invention.
FIG. 2 is a cross-sectional view showing Embodiment 1 of the present invention.
FIG. 3 is a perspective view showing Embodiment 2 of the present invention.
FIG. 4 is a cross-sectional view showing a second embodiment of the present invention.
FIG. 5 is a perspective view showing Embodiment 3 of the present invention.
FIG. 6 is a cross-sectional view showing a third embodiment of the present invention.
FIG. 7 is a perspective view showing Embodiment 4 of the present invention.
FIG. 8 is a cross-sectional view showing a fourth embodiment of the present invention.
FIG. 9 is a perspective view showing the structure of a conventional radiator.
FIG. 10 is a cross-sectional view showing the structure of a conventional radiator.
[Explanation of symbols]
1 IC, 2 heat sink, 3 heat conduction plate, 4 fixing bracket, 5a, 5b, 5c, 5d screw, 11 IC, 12 heat sink, 13 fixing bracket, 14a, 14b screw, Ta, Tb surface temperature (° C)

Claims (4)

A radiating means for diffusing the heat generated from the heating element in an eccentric region from the center to the periphery, the heat than the material of said heat dissipating means is mounted between said heat dissipating means and the heating element into contact with the heat dissipating means e Bei a heat conducting means comprising a high conductivity material, the vicinity of the center in the heat dissipating means and rectangular non-away between the heat conducting means and the radiation means such that said heat conduction means are not in contact with A radiator having a contact area . A heat dissipating means for diffusing heat generated from a heat generating element located in a region eccentric from the center to the periphery, and mounted between the heat generating element and the heat dissipating means so as to be in contact with the heat dissipating means. Heat conduction means made of a material having high conductivity, and the heat radiation means and the heat conduction means are spaced apart from each other in the vicinity of the center so that the heat radiation means and the heat conduction means are not in contact with each other. A radiator in which a contact region is formed, and a contact region in which the heat dissipating means and the heat conducting means are in contact with each other is formed at a location symmetrical to the vicinity of the center . The heat radiator according to claim 1 or 2, wherein the heat conducting means includes a fixing means for fixing the heating element in an integral structure. Radiating means comprises aluminum from a material whose main component, the heat transfer means, the radiator according to any one of claims 1 to 3, characterized by comprising a material containing copper as a main component.

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