JP3714402B2 - Room temperature curable organopolysiloxane composition - Google Patents
Room temperature curable organopolysiloxane composition Download PDFInfo
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- JP3714402B2 JP3714402B2 JP2000312022A JP2000312022A JP3714402B2 JP 3714402 B2 JP3714402 B2 JP 3714402B2 JP 2000312022 A JP2000312022 A JP 2000312022A JP 2000312022 A JP2000312022 A JP 2000312022A JP 3714402 B2 JP3714402 B2 JP 3714402B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S528/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S528/901—Room temperature curable silicon-containing polymer
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Description
【0001】
【発明の属する技術分野】
本発明は建築用あるいは電気電子部品の接着・固定などに使用される熱水蒸気曝露時の接着性に優れた室温硬化性(RTV)オルガノポリシロキサン組成物に関する。
【0002】
【従来の技術】
湿気により架橋するRTV(室温硬化性)シリコーンゴムは、その取り扱いが容易な上に耐熱性、接着性、電気特性に優れるため、建材用のシーリング材、電気電子分野での接着剤など様々な分野で利用されている。電気電子部品、特には電子レンジ窓枠シール用途については、耐熱性及び接着性の観点から湿気により架橋するシリコーンゴムが多く使われている。本用途では、被着体であるガラス及び塗装鋼板に対する初期接着性、耐熱接着性に加え、硬化したゴムを熱水蒸気に曝した際の接着性が要求される。RTVシリコーンゴムヘの接着性付与にはケイ素化合物であるシランカップリング剤の添加が有効であるが、従来使用されてきたアミノプロピルトリエトキシシラン等の各種シランカップリング剤を含有するRTVシリコーンゴム組成物は、初期接着性、耐熱接着性には優れるものの、要求される熱水蒸気曝露時の接着性向上に有用なものはなかった。
【0003】
例えば、特開昭61−31461号公報や特開昭61−64753号公報にはメルカプトシランとイソシアネート化合物又はポリイソシアネート化合物との反応物を接着助剤として用いたRTVシリコーンゴム組成物が提案されているが、初期接着性は優れるものの熱水蒸気曝露時の接着性は不十分であった。
【0004】
【発明が解決しようとする課題】
そこで、本発明の目的は、熱水蒸気曝露時のガラス接着性に優れた室温硬化性シリコーンゴム組成物を提供することにある。
【0005】
【課題を解決するための手段及び発明の実施の形態】
本発明者は、上記目的を達成するため鋭意検討を行った結果、室温硬化性オルガノポリシロキサン組成物に下記一般式(3)で示される特定のシラン化合物を配合することにより、従来接着性維持が困難とされた熱水蒸気曝露時のガラス接着性が飛躍的に向上することを見出し、本発明をなすに至った。
【0006】
即ち、本発明は、
(A)下記一般式(1)
HO(SiR1 2O)nH (1)
(式中、R1は炭素数1〜10の置換又は非置換の一価の炭化水素基であり、nは10以上の整数である。)
で示されるオルガノポリシロキサン及び/又は下記一般式(2)
【化3】
(式中、R1及びnは上記の通りであり、R2は炭素数1〜6の置換又は非置換の一価の炭化水素基、mは独立に0又は1の整数である。)
で示されるオルガノポリシロキサン100重量部、
(B)ケイ素原子に結合した加水分解性基を1分子中に2個以上有し、かつケイ素原子に結合した残余の基がメチル基、エチル基、プロピル基、ビニル基及びフェニル基から選択される基であるシラン化合物及び/又はその部分加水分解物0.1〜30重量部、及び
(C)下記一般式(3)
【化4】
(式中、R1、R2は上記の通りであり、R3は炭素数1〜10の二価の炭化水素基、R4は芳香環を含む炭素数7〜10の二価の炭化水素基を示し、pは1〜3の整数を表す。但し、NH基及びNH2基の少なくとも一方はR4の芳香環に直結していない。)
で示される有機ケイ素化合物0.1〜10重量部
を含有してなることを特徴とする室温硬化性オルガノポリシロキサン組成物
を提供する。
【0007】
以下、本発明につき更に詳しく説明する。
[(A)成分]
本発明のオルガノポリシロキサン組成物の(A)成分は、下記一般式(1)及び/又は(2)で示されるものである。
【0008】
【化5】
【0009】
上記式中、R1は炭素数1〜10の置換又は非置換の一価の炭化水素基であり、例えばメチル基、エチル基、プロピル基などのアルキル基;シクロヘキシル基などのシクロアルキル基;ビニル基、アリル基などのアルケニル基;フェニル基、トリル基などのアリール基;及びこれらの基の水素結合が部分的にハロゲン原子などで置換された基、例えば3,3,3−トリフルオロプロピル基等である。これらの中では、特にメチル基が好ましい。一般式(1)、(2)中の複数のR1は同一の基であっても異種の基であってもよく、またnは10以上の整数であり、特にこのジオルガノポリシロキサンの25℃における粘度が25〜500,000cStの範囲、好ましくは500〜100,000cStの範囲となる整数である。
【0010】
また、R2は炭素数1〜6の一価の炭化水素基であり、例えば、メチル基、エチル基、プロピル基などのアルキル基、シクロヘキシル基などのシクロアルキル基、ビニル基、アリル基、プロペニル基などのアルケニル基、フェニル基などが挙げられるが、メチル基が好ましい。mはそれぞれ独立に0又は1である。
【0011】
[(B)成分]
(B)成分は、ケイ素原子に結合した加水分解性基を1分子中に平均2個以上有し、かつケイ素原子に結合した残余の基がメチル基、エチル基、プロピル基、ビニル基及びフェニル基から選択される基であるシラン化合物及び/又はその部分加水分解物である。
【0012】
この場合、シラン化合物は、
R5 4-aSiXa
(R5はメチル基、エチル基、プロピル基、ビニル基、フェニル基から選択される基、Xは加水分解性基、aは2又は3である。)
で表すことができ、1種又は2種以上の混合物であってもよい。
【0013】
(B)成分のシラン化合物及びその部分加水分解物が有する加水分解性基としては、例えばケトオキシム基、アルコキシ基、アセトキシ基、イソプロペノキシ基等が挙げられ、ケトオキシム基、アルコキシ基、イソプロペノキシ基が好ましい。
【0014】
(B)成分の具体例としては、メチルトリス(ジメチルケトオキシム)シラン、メチルトリス(メチルエチルケトオキシム)シラン、エチルトリス(メチルエチルケトオキシム)シラン、メチルトリス(メチルイソブチルケトオキシム)シラン、ビニルトリス(メチルエチルケトオキシム)シラン、フェニルトリス(メチルエチルケトオキシム)シランなどのケトオキシムシラン及びメチルトリメトキシシラン、ジメチルジメトキシシラン、ビニルトリメトキシシラン、フェニルトリメトキシシラン、メチルトリエトキシシラン等のアルコキシシラン、メチルトリイソプロペノキシシラン、エチルトリイソプロペノキシシラン、ビニルトリイソプロペノキシシラン等のイソプロペノキシ基含有シラン、メチルトリアセトキシシラン、エチルトリアセトキシシラン、ビニルトリアセトキシシランなどのアセトキシシランの各種シラン、並びにこれらのシランの部分加水分解縮合物が挙げられる。
【0015】
(B)成分の配合量は、(A)成分100重量部に対して0.1〜30重量部、好ましくは0.5〜20重量部、特に好ましくは1〜15重量部の範囲で使用される。0.1重量部未満では十分な架橋が得られず、目的とするゴム弾性を有する組成物が得難く、30重量部を超えると得られる硬化物は機械特性が低下し易い。
【0016】
[(C)成分]
(C)成分の有機ケイ素化合物は、本発明の組成物において熱水蒸気曝露時の接着性を高める重要な作用を有する成分である。
【0017】
(C)成分の有機ケイ素化合物は、NH基(イミノ基)とNH2基(アミノ基)とを有し、NH基とNH2基との間に芳香環を含み、更にNH基とNH2基の少なくとも一方が芳香環に直結していないようなアルコキシシラン化合物であり、詳しくは特開平5−105689号公報に記載されている。この化合物は下記一般式(3)で示される。
【0018】
【化6】
(式中、R1、R2は上記の通りであり、R3は炭素数1〜10の二価の炭化水素基、R4は芳香環を含む炭素数7〜10の二価の炭化水素基を示し、pは1〜3の整数を表す。但し、NH基及びNH2基の少なくとも一方はR4の芳香環に直結していない。)
【0019】
この場合、式(3)において、R2はメチル基又はエチル基であることが好ましく、R3はメチレン基、エチレン基、プロピレン基、テトラメチレン基、ヘキサメチレン基、オクタメチレン基、デカメチレン基、2−メチルプロピレン基等のアルキレン基、フェニレン基等のアリーレン基、これらアルキレン基とアリーレン基とが結合した基などが挙げられるが、好ましくはメチレン基、エチレン基、プロピレン基等が挙げられ、特に好ましくはプロピレン基である。また、R4としては、フェニレン基とアルキレン基とが結合した基が好ましく、例えば下記式(4)〜(12)で示されるものが挙げられる。
−CH2−C6H4− (4)
−CH2−C6H4−CH2− (5)
−CH2−C6H4−CH2−CH2− (6)
−CH2−C6H4−CH2−CH2−CH2− (7)
−CH2−CH2−C6H4− (8)
−CH2−CH2−C6H4−CH2− (9)
−CH2−CH2−C6H4−CH2−CH2− (10)
−CH2−CH2−CH2−C6H4− (11)
−CH2−CH2−CH2−C6H4−CH2− (12)
これらの中で、特に好ましくは(5)である。
【0020】
この場合、フェニレン基の右側(式(3)においてNH2側)に結合するアルキレン基(アルキレン基がない場合は−NH2基となる)は、オルト位、メタ位、パラ位であってもよい。
【0021】
上記一般式(3)で示される有機ケイ素化合物としては、下記式(13)〜(123)のものが例示される。
【0022】
【化7】
【0023】
【化8】
【0024】
【化9】
【0025】
【化10】
【0026】
【化11】
【0027】
【化12】
【0028】
【化13】
【0029】
【化14】
【0030】
【化15】
【0031】
【化16】
【0032】
【化17】
【0033】
【化18】
【0034】
【化19】
【0035】
この(C)成分の有機ケイ素化合物は、(A)成分100重量部に対して0.1〜10重量部、好ましくは1〜5重量部使用される。
【0036】
[その他の成分]
また、本発明には、上記成分以外に一般に知られている充填剤、触媒などを配合することが好ましい。
【0037】
充填剤としては、粉砕シリカ、煙霧状シリカ、湿式シリカ、アセチレンブラック等の炭素系粉末、炭酸カルシウム、炭酸亜鉛、塩基性炭酸亜鉛、酸化亜鉛、酸化マグネシウムなどが挙げられる。これらの充填剤の配合量は、(A)成分100重量部に対して0〜500重量部、好ましくは2〜200重量部、特に好ましくは3〜100重量部である。
【0038】
触媒としては、有機錫エステル化合物、有機錫キレート化合物、アルコキシチタン化合物、チタンキレート化合物、グアニジル基を有するケイ素化合物などの公知の縮合反応用触媒が挙げられる。これらの触媒は、触媒量で用いられるが、通常(A)成分100重量部に対して10重量部以下、好ましくは0.001〜10重量部、特に好ましくは0.01〜5重量部とすることができる。
【0039】
また、必要に応じて各種特性を改良するために、例えば、チクソ性向上剤としてのポリエーテル、顔料、防かび剤、抗菌剤などの添加剤を添加してもよい。
【0040】
本発明の組成物は、上記(A)〜(C)成分を品川ミキサーやプラネタリーミキサー、フロージェットミキサー等の通常使用されている混練機を用いて、好ましくは無水の状態で混練りすることにより得ることができる。
【0041】
【実施例】
以下、実施例及び比較例を示し、本発明を具体的に説明するが、本発明は下記の実施例に制限されるものではない。
【0042】
[実施例1]
25℃における粘度が900cStで、末端がトリメトキシシリル基で封鎖されたポリジメチルシロキサン90重量部に、表面をジメチルジクロロシランで処理した煙霧状シリカ10重量部を加え、混合機で混合した後、ビニルトリメトキシシラン2重量部、ジオクチル錫ジラウレート0.1重量部を加え、減圧下で完全に混合し、更に下記一般式
(CH3O)3Si−C3H6−NH−CH2−C6H4−CH2−NH2
で示されるシラン化合物を2.0重量部加え、減圧下で完全に混合し、組成物1を得た。
【0043】
[実施例2]
25℃における粘度が700cStで末端がシラノール基で封鎖されたポリジメチルシロキサン90重量部に、アセチレンブラック10重量部を加え、混合機で混合した後、メチルトリブタノオキシムシラン6重量部、ジブチル錫ジオクテート0.1重量部を加え、減圧下で完全に混合し、更に下記一般式
(CH3O)3Si−C3H6−NH−C6H4−CH2−NH2
で示されるシラン化合物を2.0重量部加え、減圧下で完全に混合し、組成物2を得た。
【0044】
[実施例3]
25℃における粘度が700cStで末端がシラノール基で封鎖されたポリジメチルシロキサン90重量部に、アセチレンブラック10重量部を加え、混合機で混合した後、ビニルトリイソプロペノキシシラン6重量部、テトラメチルグアニジルプロピルトリメトキシシラン0.5重量部を加え、減圧下で完全に混合し、更に下記一般式
(CH3O)3Si−C3H6−NH−CH2−C6H4−C2H4−NH2
で示されるシラン化合物を2.0重量部加え、減圧下で完全に混合し、組成物3を得た。
【0045】
[比較例1]
25℃における粘度が700cStで末端がシラノール基で封鎖されたポリジメチルシロキサン90重量部に、アセチレンブラック10重量部を加え、混合機で混合した後、ビニルトリイソプロペノキシシラン6重量部、テトラメチルグアニジルプロピルトリメトキシシラン0.5重量部を加え、減圧下で完全に混合し、更に下記一般式
(CH3O)3Si−C3H6−NH2
で示されるシラン化合物を2.0重量部加え、減圧下で完全に混合し、組成物4を得た。
【0046】
[比較例2]
25℃における粘度が700cStで末端がシラノール基で封鎖されたポリジメチルシロキサン90重量部に、アセチレンブラック10重量部を加え、混合機で混合した後、ビニルトリイソプロペノキシシラン6重量部、テトラメチルグアニジルプロピルトリメトキシシラン0.5重量部を加え、減圧下で完全に混合し、更に下記一般式
(C2H5O)3Si−C3H6−NH2
で示されるシラン化合物を2.0重量部加え、減圧下で完全に混合し、組成物5を得た。
【0047】
[比較例3]
25℃における粘度が700cStで末端がシラノール基で封鎖されたポリジメチルシロキサン90重量部に、アセチレンブラック10重量部を加え、混合機で混合した後、ビニルトリイソプロペノキシシラン6重量部、テトラメチルグアニジルプロピルトリメトキシシラン0.5重量部を加えて、減圧下で完全に混合し、更に下記一般式
(CH3O)3Si−C3H6−NH−C2H4−NH2
で示されるシラン化合物を2.0重量部加え、減圧下で完全に混合し、組成物6を得た。
【0048】
被着体としてガラスを用意し、表面をトルエンで拭いた後に上記組成物1〜6を10mm幅で1mm厚に塗布し、23℃,50%RHにて3日間硬化させて試験体を調製した。試験体の一部にカッターで切込みを入れ、垂直方向に引き剥がしてその初期接着性を確認した。更に試験体を飽和水蒸気に15分間曝露させた後、水分を拭き取り、20℃,50%RHにて10分間放置後にゴムを引き剥がして劣化後接着性を確認した。
【0049】
【表1】
【0050】
【発明の効果】
本発明の室温硬化性オルガノポリシロキサン組成物によれば、熱水蒸気曝露時の接着性に優れたシリコーンゴムが得られる。このシリコーンゴムは、特に水回りに用いるシーリング材、水蒸気に曝される電気電子部品の接着・固定等に有用である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a room temperature curable (RTV) organopolysiloxane composition having excellent adhesion when exposed to hot water vapor, which is used for building or bonding / fixing electrical and electronic parts.
[0002]
[Prior art]
RTV (room temperature curable) silicone rubber that crosslinks with moisture is easy to handle and has excellent heat resistance, adhesion, and electrical properties, so it can be used in various fields such as sealing materials for building materials and adhesives in the electrical and electronic fields. It is used in. For electrical and electronic parts, especially for microwave oven window frame seals, silicone rubber that is crosslinked by moisture is often used from the viewpoint of heat resistance and adhesiveness. In this application, in addition to the initial adhesiveness and heat-resistant adhesiveness to glass and coated steel plate as adherends, adhesiveness when the cured rubber is exposed to hot water vapor is required. The addition of a silane coupling agent, which is a silicon compound, is effective for imparting adhesion to an RTV silicone rubber, but an RTV silicone rubber composition containing various silane coupling agents such as aminopropyltriethoxysilane that has been conventionally used. Although the product was excellent in initial adhesiveness and heat-resistant adhesiveness, none was useful for improving the required adhesiveness when exposed to hot water vapor.
[0003]
For example, Japanese Patent Laid-Open Nos. 61-31461 and 61-64753 propose RTV silicone rubber compositions using a reaction product of mercaptosilane and an isocyanate compound or a polyisocyanate compound as an adhesion aid. However, the initial adhesiveness was excellent, but the adhesiveness when exposed to hot water vapor was insufficient.
[0004]
[Problems to be solved by the invention]
Then, the objective of this invention is providing the room temperature curable silicone rubber composition excellent in the glass adhesiveness at the time of thermal vapor exposure.
[0005]
Means for Solving the Problem and Embodiment of the Invention
As a result of intensive studies to achieve the above object, the present inventor has maintained conventional adhesiveness by blending a specific silane compound represented by the following general formula (3) into a room temperature curable organopolysiloxane composition. As a result, it was found that the glass adhesion at the time of exposure to hot water vapor, which was considered difficult, was drastically improved, and the present invention was made.
[0006]
That is, the present invention
(A) The following general formula (1)
HO (SiR 1 2 O) n H (1)
(In the formula, R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 10 or more.)
And / or the following general formula (2)
[Chemical 3]
(In the formula, R 1 and n are as described above, R 2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms, and m is an integer of 0 or 1 independently.)
100 parts by weight of an organopolysiloxane represented by
(B) The hydrolyzable group bonded to the silicon atom has two or more hydrolyzable groups in one molecule, and the remaining group bonded to the silicon atom is selected from a methyl group, an ethyl group, a propyl group, a vinyl group, and a phenyl group. 0.1 to 30 parts by weight of a silane compound and / or a partial hydrolyzate thereof, and (C) the following general formula (3)
[Formula 4]
Wherein R 1 and R 2 are as described above, R 3 is a divalent hydrocarbon group having 1 to 10 carbon atoms, and R 4 is a divalent hydrocarbon having 7 to 10 carbon atoms including an aromatic ring. And p represents an integer of 1 to 3, provided that at least one of the NH group and the NH 2 group is not directly connected to the aromatic ring of R 4. )
A room temperature-curable organopolysiloxane composition comprising 0.1 to 10 parts by weight of an organosilicon compound represented by the formula:
[0007]
Hereinafter, the present invention will be described in more detail.
[(A) component]
The component (A) of the organopolysiloxane composition of the present invention is represented by the following general formula (1) and / or (2).
[0008]
[Chemical formula 5]
[0009]
In the above formula, R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, such as an alkyl group such as a methyl group, an ethyl group or a propyl group; a cycloalkyl group such as a cyclohexyl group; Groups, alkenyl groups such as allyl groups; aryl groups such as phenyl groups and tolyl groups; and groups in which the hydrogen bonds of these groups are partially substituted with halogen atoms, such as 3,3,3-trifluoropropyl groups Etc. Among these, a methyl group is particularly preferable. A plurality of R 1 in the general formulas (1) and (2) may be the same group or different groups, and n is an integer of 10 or more, particularly 25 of this diorganopolysiloxane. It is an integer having a viscosity at 25 ° C. in the range of 25 to 500,000 cSt, preferably in the range of 500 to 100,000 cSt.
[0010]
R 2 is a monovalent hydrocarbon group having 1 to 6 carbon atoms, for example, an alkyl group such as a methyl group, an ethyl group or a propyl group, a cycloalkyl group such as a cyclohexyl group, a vinyl group, an allyl group, or a propenyl. Examples thereof include an alkenyl group such as a group, and a phenyl group, and a methyl group is preferable. Each m is independently 0 or 1.
[0011]
[Component (B)]
Component (B) has an average of two or more hydrolyzable groups bonded to a silicon atom, and the remaining groups bonded to the silicon atom are methyl, ethyl, propyl, vinyl and phenyl. It is a silane compound and / or a partial hydrolyzate thereof, which is a group selected from groups.
[0012]
In this case, the silane compound is
R 5 4-a SiX a
(R 5 is a group selected from a methyl group, an ethyl group, a propyl group, a vinyl group, and a phenyl group, X is a hydrolyzable group, and a is 2 or 3.)
1 type or a mixture of two or more types.
[0013]
Examples of the hydrolyzable group possessed by the component (B) silane compound and its partial hydrolyzate include a ketoxime group, an alkoxy group, an acetoxy group, and an isopropenoxy group, and a ketoxime group, an alkoxy group, and an isopropenoxy group are preferable.
[0014]
Specific examples of the component (B) include methyltris (dimethylketoxime) silane, methyltris (methylethylketoxime) silane, ethyltris (methylethylketoxime) silane, methyltris (methylisobutylketoxime) silane, vinyltris (methylethylketoxime) silane, and phenyltris. (Methylethylketoxime) Ketoxime silanes such as silane and alkoxy silanes such as methyltrimethoxysilane, dimethyldimethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, methyltriisopropenoxysilane, ethyltriisopropeno Isopropenoxy group-containing silanes such as xyloxysilane and vinyltriisopropenoxysilane, methyltriacetoxysilane, Acetoxysilane, various silane acetoxy silanes such as vinyl triacetoxy silane, and partial hydrolytic condensates of these silanes.
[0015]
Component (B) is used in an amount of 0.1 to 30 parts by weight, preferably 0.5 to 20 parts by weight, particularly preferably 1 to 15 parts by weight per 100 parts by weight of component (A). The If the amount is less than 0.1 parts by weight, sufficient crosslinking cannot be obtained, and it is difficult to obtain a composition having the desired rubber elasticity. If the amount exceeds 30 parts by weight, the cured product tends to have poor mechanical properties.
[0016]
[Component (C)]
The organosilicon compound of component (C) is a component having an important function of enhancing the adhesiveness when exposed to thermal steam in the composition of the present invention.
[0017]
(C) an organosilicon compound of the component, and a NH group (imino group) and NH 2 group (amino group) include an aromatic ring between the NH group and NH 2 group, further NH group and NH 2 An alkoxysilane compound in which at least one of the groups is not directly bonded to an aromatic ring is described in detail in JP-A No. 5-105689. This compound is represented by the following general formula (3).
[0018]
[Chemical 6]
Wherein R 1 and R 2 are as described above, R 3 is a divalent hydrocarbon group having 1 to 10 carbon atoms, and R 4 is a divalent hydrocarbon having 7 to 10 carbon atoms including an aromatic ring. And p represents an integer of 1 to 3, provided that at least one of the NH group and the NH 2 group is not directly connected to the aromatic ring of R 4. )
[0019]
In this case, in Formula (3), R 2 is preferably a methyl group or an ethyl group, and R 3 is a methylene group, an ethylene group, a propylene group, a tetramethylene group, a hexamethylene group, an octamethylene group, a decamethylene group, An alkylene group such as a 2-methylpropylene group, an arylene group such as a phenylene group, a group in which these alkylene groups and an arylene group are bonded, and the like are preferable, and a methylene group, an ethylene group, a propylene group, and the like are preferable. A propylene group is preferred. R 4 is preferably a group in which a phenylene group and an alkylene group are bonded, and examples thereof include those represented by the following formulas (4) to (12).
—CH 2 —C 6 H 4 — (4)
—CH 2 —C 6 H 4 —CH 2 — (5)
—CH 2 —C 6 H 4 —CH 2 —CH 2 — (6)
—CH 2 —C 6 H 4 —CH 2 —CH 2 —CH 2 — (7)
—CH 2 —CH 2 —C 6 H 4 — (8)
—CH 2 —CH 2 —C 6 H 4 —CH 2 — (9)
—CH 2 —CH 2 —C 6 H 4 —CH 2 —CH 2 — (10)
—CH 2 —CH 2 —CH 2 —C 6 H 4 — (11)
—CH 2 —CH 2 —CH 2 —C 6 H 4 —CH 2 — (12)
Among these, (5) is particularly preferable.
[0020]
In this case, the alkylene group bonded to the right side of the phenylene group (NH 2 side in the formula (3)) (when there is no alkylene group, it becomes —NH 2 group) may be in the ortho, meta, or para position. Good.
[0021]
Examples of the organosilicon compound represented by the general formula (3) include those represented by the following formulas (13) to (123).
[0022]
[Chemical 7]
[0023]
[Chemical 8]
[0024]
[Chemical 9]
[0025]
[Chemical Formula 10]
[0026]
Embedded image
[0027]
Embedded image
[0028]
Embedded image
[0029]
Embedded image
[0030]
Embedded image
[0031]
Embedded image
[0032]
Embedded image
[0033]
Embedded image
[0034]
Embedded image
[0035]
The organosilicon compound of component (C) is used in an amount of 0.1 to 10 parts by weight, preferably 1 to 5 parts by weight, per 100 parts by weight of component (A).
[0036]
[Other ingredients]
Moreover, it is preferable to mix | blend a filler, a catalyst, etc. generally known in this invention other than the said component.
[0037]
Examples of the filler include carbon-based powders such as pulverized silica, fumed silica, wet silica, and acetylene black, calcium carbonate, zinc carbonate, basic zinc carbonate, zinc oxide, and magnesium oxide. The blending amount of these fillers is 0 to 500 parts by weight, preferably 2 to 200 parts by weight, particularly preferably 3 to 100 parts by weight with respect to 100 parts by weight of component (A).
[0038]
Examples of the catalyst include known condensation reaction catalysts such as an organic tin ester compound, an organic tin chelate compound, an alkoxy titanium compound, a titanium chelate compound, and a silicon compound having a guanidyl group. These catalysts are used in a catalytic amount, and are usually 10 parts by weight or less, preferably 0.001 to 10 parts by weight, particularly preferably 0.01 to 5 parts by weight with respect to 100 parts by weight of component (A). be able to.
[0039]
Moreover, in order to improve various characteristics as needed, you may add additives, such as a polyether, a pigment, a fungicide, an antibacterial agent, as a thixotropy improver, for example.
[0040]
In the composition of the present invention, the above components (A) to (C) are kneaded, preferably in an anhydrous state, using a commonly used kneader such as a Shinagawa mixer, a planetary mixer, or a flow jet mixer. Can be obtained.
[0041]
【Example】
EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example.
[0042]
[Example 1]
After adding 10 parts by weight of fumed silica having a surface treated with dimethyldichlorosilane to 90 parts by weight of polydimethylsiloxane having a viscosity at 25 ° C. of 900 cSt and terminally blocked with a trimethoxysilyl group, and mixing with a mixer, Add 2 parts by weight of vinyltrimethoxysilane and 0.1 part by weight of dioctyltin dilaurate, and mix thoroughly under reduced pressure. Further, the following general formula (CH 3 O) 3 Si—C 3 H 6 —NH—CH 2 —C 6 H 4 —CH 2 —NH 2
2.0 parts by weight of the silane compound represented by the formula (1) was added and thoroughly mixed under reduced pressure to obtain Composition 1.
[0043]
[Example 2]
10 parts by weight of acetylene black was added to 90 parts by weight of polydimethylsiloxane having a viscosity at 25 ° C. of 700 cSt and the ends blocked with silanol groups, mixed with a mixer, and then 6 parts by weight of methyltributanooxime silane and dibutyltin dioctate. Add 0.1 part by weight, mix thoroughly under reduced pressure, and further, the following general formula (CH 3 O) 3 Si—C 3 H 6 —NH—C 6 H 4 —CH 2 —NH 2
2.0 parts by weight of the silane compound represented by the formula (2) was added and thoroughly mixed under reduced pressure to obtain Composition 2.
[0044]
[Example 3]
10 parts by weight of acetylene black was added to 90 parts by weight of polydimethylsiloxane having a viscosity at 25 ° C. of 700 cSt and the ends blocked with silanol groups, mixed with a mixer, 6 parts by weight of vinyltriisopropenoxysilane, tetramethyl Add 0.5 parts by weight of guanidylpropyltrimethoxysilane, mix thoroughly under reduced pressure, and further add the following general formula (CH 3 O) 3 Si—C 3 H 6 —NH—CH 2 —C 6 H 4 — C 2 H 4 -NH 2
2.0 parts by weight of the silane compound represented by the above was added and mixed thoroughly under reduced pressure to obtain Composition 3.
[0045]
[Comparative Example 1]
10 parts by weight of acetylene black was added to 90 parts by weight of polydimethylsiloxane having a viscosity at 25 ° C. of 700 cSt and the ends blocked with silanol groups, mixed with a mixer, 6 parts by weight of vinyltriisopropenoxysilane, tetramethyl Add 0.5 parts by weight of guanidylpropyltrimethoxysilane, mix thoroughly under reduced pressure, and further add the following general formula (CH 3 O) 3 Si—C 3 H 6 —NH 2
2.0 parts by weight of the silane compound represented by the above was added, and thoroughly mixed under reduced pressure to obtain Composition 4.
[0046]
[Comparative Example 2]
10 parts by weight of acetylene black was added to 90 parts by weight of polydimethylsiloxane having a viscosity at 25 ° C. of 700 cSt and the ends blocked with silanol groups, mixed with a mixer, 6 parts by weight of vinyltriisopropenoxysilane, tetramethyl Add 0.5 parts by weight of guanidylpropyltrimethoxysilane, mix thoroughly under reduced pressure, and further add the following general formula (C 2 H 5 O) 3 Si—C 3 H 6 —NH 2
2.0 parts by weight of the silane compound represented by the above was added, and thoroughly mixed under reduced pressure to obtain Composition 5.
[0047]
[Comparative Example 3]
10 parts by weight of acetylene black was added to 90 parts by weight of polydimethylsiloxane having a viscosity at 25 ° C. of 700 cSt and the ends blocked with silanol groups, mixed with a mixer, 6 parts by weight of vinyltriisopropenoxysilane, tetramethyl Add 0.5 parts by weight of guanidylpropyltrimethoxysilane, mix thoroughly under reduced pressure, and further add the following general formula (CH 3 O) 3 Si—C 3 H 6 —NH—C 2 H 4 —NH 2
2.0 parts by weight of the silane compound represented by the above was added and thoroughly mixed under reduced pressure to obtain Composition 6.
[0048]
A glass was prepared as an adherend, and after wiping the surface with toluene, the above compositions 1 to 6 were applied to a thickness of 1 mm with a width of 10 mm and cured at 23 ° C. and 50% RH for 3 days to prepare a test specimen. . A part of the test body was cut with a cutter and peeled off in the vertical direction to confirm its initial adhesion. Furthermore, after exposing the test body to saturated water vapor for 15 minutes, the moisture was wiped off, the rubber was peeled off after standing at 20 ° C. and 50% RH for 10 minutes, and the adhesiveness after deterioration was confirmed.
[0049]
[Table 1]
[0050]
【The invention's effect】
According to the room temperature curable organopolysiloxane composition of the present invention, a silicone rubber excellent in adhesiveness when exposed to hot water vapor can be obtained. This silicone rubber is particularly useful for sealing materials used around water, and for bonding and fixing electrical and electronic parts exposed to water vapor.
Claims (4)
HO(SiR1 2O)nH (1)
(式中、R1は炭素数1〜10の置換又は非置換の一価の炭化水素基であり、nは10以上の整数である。)
で示されるオルガノポリシロキサン及び/又は下記一般式(2)
で示されるオルガノポリシロキサン100重量部、
(B)ケイ素原子に結合した加水分解性基を1分子中に2個以上有し、かつケイ素原子に結合した残余の基がメチル基、エチル基、プロピル基、ビニル基及びフェニル基から選択される基であるシラン化合物及び/又はその部分加水分解物0.1〜30重量部、及び
(C)下記一般式(3)
で示される有機ケイ素化合物0.1〜10重量部
を含有してなることを特徴とする室温硬化性オルガノポリシロキサン組成物。(A) The following general formula (1)
HO (SiR 1 2 O) n H (1)
(In the formula, R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 10 or more.)
And / or the following general formula (2)
100 parts by weight of an organopolysiloxane represented by
(B) The hydrolyzable group bonded to the silicon atom has two or more hydrolyzable groups in one molecule, and the remaining group bonded to the silicon atom is selected from a methyl group, an ethyl group, a propyl group, a vinyl group, and a phenyl group. 0.1 to 30 parts by weight of a silane compound and / or a partial hydrolyzate thereof, and (C) the following general formula (3)
A room temperature-curable organopolysiloxane composition comprising 0.1 to 10 parts by weight of an organosilicon compound represented by the formula:
−CH2−C6H4− (4)
−CH2−C6H4−CH2− (5)
−CH2−C6H4−CH2−CH2− (6)
−CH2−C6H4−CH2−CH2−CH2− (7)
−CH2−CH2−C6H4− (8)
−CH2−CH2−C6H4−CH2− (9)
−CH2−CH2−C6H4−CH2−CH2− (10)
−CH2−CH2−CH2−C6H4− (11)
−CH2−CH2−CH2−C6H4−CH2− (12)The composition according to any one of claims 1 to 3, wherein R 4 of the organosilicon compound represented by the component (C) is selected from the following structures.
—CH 2 —C 6 H 4 — (4)
—CH 2 —C 6 H 4 —CH 2 — (5)
—CH 2 —C 6 H 4 —CH 2 —CH 2 — (6)
—CH 2 —C 6 H 4 —CH 2 —CH 2 —CH 2 — (7)
—CH 2 —CH 2 —C 6 H 4 — (8)
—CH 2 —CH 2 —C 6 H 4 —CH 2 — (9)
—CH 2 —CH 2 —C 6 H 4 —CH 2 —CH 2 — (10)
—CH 2 —CH 2 —CH 2 —C 6 H 4 — (11)
—CH 2 —CH 2 —CH 2 —C 6 H 4 —CH 2 — (12)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000312022A JP3714402B2 (en) | 2000-10-12 | 2000-10-12 | Room temperature curable organopolysiloxane composition |
DE60119468T DE60119468T2 (en) | 2000-10-12 | 2001-10-10 | Room temperature curable silicone compositions |
EP01308654A EP1197525B1 (en) | 2000-10-12 | 2001-10-10 | Room temperature curable organopolysiloxane compositions |
US09/974,843 US20020091220A1 (en) | 2000-10-12 | 2001-10-12 | Room temperature curable organopolysiloxane compositions |
US10/694,186 US7026426B2 (en) | 2000-10-12 | 2003-10-28 | Room temperature curable organopolysiloxane compositions |
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JP2000312022A JP3714402B2 (en) | 2000-10-12 | 2000-10-12 | Room temperature curable organopolysiloxane composition |
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JP3714402B2 true JP3714402B2 (en) | 2005-11-09 |
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US (2) | US20020091220A1 (en) |
EP (1) | EP1197525B1 (en) |
JP (1) | JP3714402B2 (en) |
DE (1) | DE60119468T2 (en) |
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JP4081278B2 (en) * | 2002-02-05 | 2008-04-23 | 株式会社スリーボンド | One-component room temperature curing sealant composition for automobiles |
DE102004014216A1 (en) * | 2004-03-23 | 2005-10-13 | Wacker-Chemie Gmbh | Crosslinkable compositions based on organosilicon compounds |
JP2006265485A (en) * | 2005-03-25 | 2006-10-05 | Shin Etsu Chem Co Ltd | Room-temperature-curable organopolysiloxane composition |
WO2006117766A2 (en) * | 2005-04-29 | 2006-11-09 | Zerusa Limited | An interventional medical closure device |
JP4569765B2 (en) * | 2005-05-13 | 2010-10-27 | 信越化学工業株式会社 | Room temperature curable silicone rubber composition for protecting electrical and electronic components, mounting circuit board, silver electrode and silver chip resistor |
JP4743511B2 (en) * | 2005-12-27 | 2011-08-10 | 信越化学工業株式会社 | Method for curing thermosetting organopolysiloxane composition |
JP2007321122A (en) * | 2006-06-05 | 2007-12-13 | Shin Etsu Chem Co Ltd | Room temperature-curable organopolysiloxane composition |
WO2008152617A2 (en) * | 2007-06-15 | 2008-12-18 | Zerusa Limited | A closure device |
JP4984086B2 (en) * | 2008-05-14 | 2012-07-25 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
DE102010042712A1 (en) * | 2010-10-20 | 2012-04-26 | Wacker Chemie Ag | Self-adhesive hardener composition |
JP6039894B2 (en) | 2011-10-20 | 2016-12-07 | 東レ・ダウコーニング株式会社 | Multi-component room temperature curable silicone elastomer composition |
KR20170106404A (en) * | 2015-01-21 | 2017-09-20 | 신에쓰 가가꾸 고교 가부시끼가이샤 | The room temperature curable organopolysiloxane composition |
CN105349034B (en) * | 2015-11-30 | 2017-06-20 | 苏州太湖电工新材料股份有限公司 | A kind of low viscosity, fire resistant Inverter fed motor environmental protection insulated paint and preparation method thereof |
CN105348534B (en) * | 2015-11-30 | 2017-02-08 | 苏州太湖电工新材料股份有限公司 | Nanometer silicon dioxide hybrid vinyl phenyl silicon intermediate material and preparing method and application thereof |
WO2018037682A1 (en) * | 2016-08-26 | 2018-03-01 | 信越化学工業株式会社 | Dealcoholization room-temperature curable organopolysiloxane composition, and article sealed by cured product of same |
WO2024162022A1 (en) * | 2023-01-31 | 2024-08-08 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Room-temperature-curable silicone composition |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1238093A (en) * | 1969-04-11 | 1971-07-07 | ||
JPS6131461A (en) * | 1984-07-24 | 1986-02-13 | Shin Etsu Chem Co Ltd | Room temperature curing organosiloxane composition |
JPS6165891A (en) | 1984-09-06 | 1986-04-04 | Asahi Shiyueebell Kk | Novel silane and its production |
JPS6164753A (en) | 1984-09-06 | 1986-04-03 | Shin Etsu Chem Co Ltd | Room temperature-curable organosiloxane compositon |
JPS62232459A (en) * | 1986-04-02 | 1987-10-12 | Shin Etsu Chem Co Ltd | Room temperature-curable organopolysiloxane composition |
JPH04359058A (en) * | 1991-06-03 | 1992-12-11 | Shin Etsu Chem Co Ltd | Room temperature curing organopolysiloxane composition and its production |
JP2538152B2 (en) * | 1991-10-15 | 1996-09-25 | 信越化学工業株式会社 | Organic silicon compounds |
US5300611A (en) * | 1991-10-21 | 1994-04-05 | Shin-Etsu Chemical Co., Ltd. | Room temperature curable organopolysiloxane compositions |
WO1995020019A1 (en) * | 1994-01-21 | 1995-07-27 | Toshiba Silicone Co., Ltd. | Adhesive composition and method of curing the same |
JP3295287B2 (en) * | 1995-10-26 | 2002-06-24 | 信越化学工業株式会社 | Organopolysiloxane composition for automatic transmission oil seal |
JP3714861B2 (en) * | 2000-09-20 | 2005-11-09 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
US6833407B1 (en) * | 2003-10-16 | 2004-12-21 | Csl Silicones Inc. | Solvent free silicone coating composition |
-
2000
- 2000-10-12 JP JP2000312022A patent/JP3714402B2/en not_active Expired - Fee Related
-
2001
- 2001-10-10 EP EP01308654A patent/EP1197525B1/en not_active Expired - Lifetime
- 2001-10-10 DE DE60119468T patent/DE60119468T2/en not_active Expired - Lifetime
- 2001-10-12 US US09/974,843 patent/US20020091220A1/en not_active Abandoned
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2003
- 2003-10-28 US US10/694,186 patent/US7026426B2/en not_active Expired - Lifetime
Also Published As
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DE60119468D1 (en) | 2006-06-14 |
DE60119468T2 (en) | 2007-05-03 |
JP2002121385A (en) | 2002-04-23 |
EP1197525B1 (en) | 2006-05-10 |
US20020091220A1 (en) | 2002-07-11 |
US7026426B2 (en) | 2006-04-11 |
US20040092694A1 (en) | 2004-05-13 |
EP1197525A2 (en) | 2002-04-17 |
EP1197525A3 (en) | 2003-03-12 |
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