JP3790388B2 - Parts supply device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component supply device that sucks components that are aligned in a chute by negative pressure generated in a cylinder as a piston rod moves and conveys the components to a component removal position.
[0002]
[Prior art]
A wide variety of chip components are mounted on the printed circuit board. At this time, an automatic chip component mounting device (chip component automatic mounting device) is used to transport and mount the chip components on the printed circuit board. in use. In order to supply the chip component to the chip component automatic mounting device, a component supply device is required.
[0003]
As this component supply device, the one described in JP-A-8-48419 is known. In the component supply apparatus described in this publication, a large number of chip components in a stacked state are aligned in a row, and then sent out to a predetermined position by a component conveying belt provided in a guide groove extending in the horizontal direction. . In this device, a stopper is provided at the front end of the guide groove, and when the tip part on the belt moves forward together with the belt, the stopper is brought into contact with the front end of the guide groove to stop the leading tip part at a predetermined position. When the leading chip component comes into contact with the stopper and the movement of the entire component stops, the leading chip component is adsorbed by the permanent magnet of the stopper while the second chip component is pressed against the inner wall by the component holding pin and held in that position. The leading chip component is taken out satisfactorily by moving it forward and forcibly forming a gap with the second chip component.
[0004]
[Problems to be solved by the invention]
The conventional component supply apparatus configured as described above has the following problems.
[0005]
First, it is difficult to maintain the flatness of the belt in the one described in Japanese Patent Application Laid-Open No. 8-48419 using a component conveying belt. For this reason, the height of the inner wall of the guide groove must be maintained precisely. Is difficult. As a result, there is a problem in that the chip parts cannot be accurately maintained in the guide grooves, and the parts stand up and the parts are likely to overlap. In particular, when transporting very thin chip parts such as ultra-small chip parts, for example, 1 mm (length) x 0.5 mm (width) x 0.35 mm (thickness) chip parts (commonly called 1005 size). Such a problem is likely to occur.
[0006]
In addition, dust, dust, solder residue, etc. are likely to adhere to the component conveying belt, so that the chip component cannot be stably conveyed, and there is a problem in terms of maintenance.
[0007]
In addition, when a delay occurs in the alignment speed of the chip parts in the guide groove, the parts conveyance belt moves at a predetermined constant speed, so that the delay in the alignment speed is recovered at a speed higher than the predetermined speed. I can't. For this reason, this type is not suitable for speeding up.
[0008]
For this reason, there has been considered a technique in which a part suction conduit is communicated with a cylinder and parts aligned with the chute are sucked and conveyed by the negative pressure generated in the cylinder. However, there is a risk that foreign matter such as solder residue will be sucked from the vacuum suction conduit communicating from the chute to the cylinder.
In view of the above, an object of the present invention is to cope with foreign matter sucked from a vacuum suction tube for sucking parts arranged in a chute.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, there is provided a component supply apparatus, wherein the piston rod moves and sucks the components aligned in the chute by the negative pressure generated in the cylinder, and conveys the components to the component extraction position. A vacuum suction check valve is connected to a vacuum suction conduit provided in communication with the cylinder so that the parts in the chute can be supplied to the part removal position by the negative pressure generated during the operation of the rod , and the vacuum of the vacuum suction conduit A filter is provided on the chute side of the suction check valve .
[0010]
Since it did in this way, even if small foreign materials, such as a solder residue, are attracted | sucked from a vacuum suction tube, it can supplement before reaching a cylinder and it becomes possible to protect a cylinder.
[0012]
Further, even if a small foreign matter such as solder residue is sucked from the vacuum suction tube, it can be supplemented before reaching the vacuum suction check valve, and the check valve can be protected.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
As shown in FIGS. 1 and 2, reference numeral 1 denotes a component supply apparatus according to an embodiment of the present invention, and the component supply apparatus 1 includes a housing 2. Above the interior of the housing 2, a first component storage chamber 4 for storing the chip components 5 in a stacked state in a three-dimensional space is formed. An opening is formed on the upper end side of the first component storage chamber 4, and this opening is closed by a lid 6. In the first component storage chamber 4, a large number (generally several thousand to several tens of thousands) of chip-shaped electronic components 5 from a component storage case (not shown) are stored in advance by opening the lid 6. Here, the chip component 5 is generally a rectangular parallelepiped component. For example, a chip capacitor or a chip resistor (for example, length L × width W × thickness T = 1.0 mm × 0.5 mm × 0.35 mm) )
[0015]
A second component storage that stores a large number of chip components 5 in a two-dimensional space below the first component storage chamber 4 and along the front side of the housing 2 in a state where the components do not overlap each other in the component thickness direction. A chamber 8 is formed. Further, the chip components 5 are moved in a line along the front side of the housing 2 below the second component storage chamber 8 and aligned in a row in a space formed so as to match the cross-sectional shape of the components. A chute 10 is formed. A chute 12 for moving the chip component 5 in the horizontal direction to a predetermined position is connected to the lower end portion of the chute 10.
[0016]
Further, the bottom surface portion 14 of the first component storage chamber 4 forming the three-dimensional component arrangement space is formed so as to be inclined so that the chip component 5 can slide down by its own weight.
[0017]
An alignment plate that reciprocates vertically in a space formed along a surface that communicates with the first component storage chamber 4, the second component storage chamber 8, and the chute 10 and that is orthogonal to the feed direction of the chip component 5. 16 is provided.
[0018]
Here, as shown in FIG. 2, the chute 10 is mounted in the housing 2, moves the posture of the chip component 5 downward by its own weight without being twisted along the chip component delivery direction, and guides it to the chute 12. It is like that.
[0019]
Further, the chute 12 is formed by an upper block 56 and a lower block 58. At the time of vacuum suction described later, it is sealed so that air does not leak outside.
[0020]
Here, as shown in FIG. 2, a chip component automatic mounting device (automatic mounting device) 74 is arranged on the supply side of the chip component 5 of the component supply device 1. A nozzle 76 for receiving the chip component 5 is provided at the lower part of the main body of the automatic mounting device 74. An actuator arm 78 is provided at the lower part of the main body of the chip component automatic mounting device 74. The actuator arm 78 is for driving the alignment plate 16 and the vacuum suction mechanism 60 described later in synchronization with the operation of the automatic chip component mounting device 74.
[0021]
As shown in FIG. 2, an air cylinder lever 80, which will be described later, is provided below the actuator arm 78. Further, below the air cylinder lever 80, alignment is performed for moving the alignment plate 16 up and down. A plate lever 160 is provided. The alignment plate lever 160 rotates around a fulcrum 162. The right end of the alignment plate lever 160 is connected to the lower end of a slide guide 164 that moves up and down. The upper end portion of the slide guide 164 is connected to the alignment plate 16.
[0022]
In this way, the actuator arm 78 also moves up and down in synchronization with the vertical movement of the nozzle 76 for receiving the chip component 5, and the alignment plate lever 160 rotates via the air cylinder lever 80 from the vertical movement of the actuator arm 78. As a result, the slide guide 164 moves up and down, and as a result, the alignment plate 16 moves up and down.
[0023]
Next, a vacuum suction mechanism 60 that sends the chip component 5 from the chute 12 to the component removal position by vacuum suction force will be described with reference to FIGS. 1 and 2.
[0024]
The vacuum suction mechanism 60 includes an air cylinder 62. The air cylinder 62 includes a piston head 64, a piston rod 66 coupled to the piston head 64, a rod side cylinder chamber 68 partitioned by the piston head 64, a head side cylinder chamber 70, and a piston rod 66. And a spring 72 that is biased so as to extend outward. The piston rod 66 has a tip portion 66a at the tip that is in the direction opposite to the head side.
[0025]
Next, a substantially T-shaped air cylinder lever 80 is attached to the housing 2 via a fulcrum 82 below the actuator arm 78, and can be rotated around the fulcrum 82. A spring 84 is attached to the lower side of the air cylinder lever 80 and urges it clockwise. Reference numeral 86 denotes a stopper. The stopper 86 prevents the air cylinder lever 80 from rotating more than a predetermined position by the urging force of the spring 84.
[0026]
One end of a vacuum suction conduit 20 at the time of forward movement is connected to the rod side cylinder chamber 68 of the air cylinder 62, and the other end of the vacuum suction conduit 20 at the time of forward movement is provided in the vicinity of the part extraction position of the chute 12. The suction port 21 communicates with a component suction conduit 22 connected to the chute 12.
[0027]
Further, the vacuum suction conduit 20 at the time of forward movement is branched in the middle to become an air release conduit 24. A vacuum suction check valve 26 is provided on the side of the chute 12 from this branch of the vacuum suction conduit 20 during forward movement so that air flows from the chute 12 to the rod side cylinder chamber 68 and prevents air from flowing back to the chute 12. It has been. The atmosphere release conduit 24 is provided with an atmosphere release check valve 27 for discharging air from the rod side cylinder chamber 68 to the atmosphere side so as not to flow in the opposite direction. Further, the backward suction vacuum suction conduit 30 is connected to the head side cylinder chamber 70, and air is introduced into the head side cylinder chamber 70 through this conduit 98 and exhausted to the atmosphere side. Yes. The other end of the vacuum suction conduit 29 at the time of backward movement also communicates with the component suction conduit 22 connected to the chute 12 through a suction port 21 provided in the vicinity of the component extraction position of the chute 12.
[0028]
Further, the vacuum suction conduit 29 at the time of backward movement is branched in the middle to become an air release conduit 31. A vacuum suction check valve 33 is provided on the side of the chute 12 from this branch of the vacuum suction conduit 29 at the time of reverse movement so that air flows from the chute 12 to the head side cylinder chamber 70 and does not flow back to the chute 12. It has been. The atmosphere release conduit 31 is provided with an atmosphere release check valve 34 for discharging air from the head side cylinder chamber 70 to the atmosphere side so as not to flow in the opposite direction.
[0029]
Further, a filter 36 is replaceably attached to the part suction conduit 22. The filter 36 captures fine foreign matters such as solder dregs and chip pieces that are sucked from the chute 12 side of the component suction conduit 22 as a vacuum suction conduit. 29, and the check valves 26, 33 and the like are protected. The filter 36 is provided so that a cavity larger than the diameter of the suction conduit 22 is provided in the middle of the component suction conduit 22 so as to be fitted into the cavity, and many small holes or gaps are open. That is, the filter 36 attaches foreign matter to the surface and allows only air to pass through, and is formed of felt, resin, or the like. The component suction conduit 22 is detachably connected at the hollow portion, and the filter 36 can be replaced by being divided. In the present embodiment, as shown in FIG. 1, the filter 36 is a component suction conduit that serves as a common passage for air when either the forward vacuum suction conduit 20 or the backward vacuum suction conduit 29 is used. However, it may be provided in each of the forward vacuum suction conduit 20 and the backward vacuum suction conduit 29. However, if it is provided in the component suction conduit 22, it is not necessary to provide the vacuum suction conduit 20 in the forward movement and the vacuum suction conduit 29 in the backward movement.
[0030]
Next, the operation of the present embodiment configured as described above will be described.
[0031]
As the actuator arm 78 moves up and down, the alignment plate 16 moves up and down via the alignment plate lever 160 and the slide guide, aligns the chip components 5 and moves them from the first component storage chamber 4 to the chute 10.
[0032]
Next, the chip component 5 guided to the chute 10 falls inside the chute 10 due to its own weight and is transferred to the chute 12.
[0033]
On the other hand, the vacuum suction mechanism 60 operates as follows.
[0034]
That is, when the actuator arm 78 of the automatic chip component mounting device 74 is lowered from the position shown in FIG. 2, the lower end portion of the actuator arm 78 comes into contact with the upper end of the air cylinder lever 80 and is pushed downward. 80 rotates counterclockwise, and the lower end of the lever 80 pushes the tip 66a of the piston rod 66. As a result, the piston rod 66 moves to the right in FIG. 2 against the spring 72. At this time, the air in the head-side cylinder chamber 70 is discharged from the conduit 29 to the atmosphere side via the check valve 34 for opening the conduit 31 to the atmosphere. As the volume of the rod side cylinder chamber 68 increases, the inside thereof becomes a vacuum (negative pressure), whereby the air in the chute 12 is sucked through the suction port 21, and the component suction conduit 22, the check valve 26, and It is introduced into the rod side cylinder chamber 68 through the vacuum suction conduit 20 at the time of forward movement. At this time, even if foreign matter such as solder residue is sucked, it is not captured by the filter 36 and taken into the check valve 26 and the air cylinder 62. Thus, when the air in the chute 12 is sucked, it flows into this air, and the chip component 5 in the chute 12 is sent out to the vicinity of the take-out position. Thereafter, when the actuator arm 78 is raised, the air cylinder lever 80 is rotated clockwise by the urging force of the spring 84 and stopped at a predetermined position by the stopper 86. When the lever 80 rotates in the clockwise direction and returns, the piston rod 66 moves to the left by the urging force of the spring 72. At this time, the air in the rod side cylinder chamber 68 is pressed by the piston head 64 and discharged to the atmosphere side through the check valve 27 and the conduit 24. On the other hand, as the volume of the head side cylinder chamber 70 increases, the inside thereof becomes a vacuum (negative pressure), whereby the air in the chute 12 is sucked through the suction port 21, and the component suction conduit 22, check valve 33 and the vacuum suction conduit 29 at the time of backward movement are introduced into the head side cylinder chamber 70. At this time, even if foreign matter such as solder residue is sucked, it is not captured by the filter 36 and sucked into the check valve 33 and the air cylinder 62. In this way, when the air in the chute 12 is sucked, the chip component 5 in the chute 12 is sent out to the vicinity of the take-out position by the flow of this air.
[0035]
That is, while the air cylinder lever 80 swings counterclockwise by the vertical movement of the actuator arm 78 and further swings clockwise to a position regulated by the stopper 86, the chip aligned in the chute 12 is aligned. The component 5 is continuously sucked.
[0036]
In this way, when the actuator arm 78 of the automatic chip component mounting device 74 moves up and down, the chip component 5 in the chute 12 is continuously sent out to the vicinity of the take-out position by the vacuum suction mechanism 60.
[0037]
Therefore, compared to the case where the parts 5 are conveyed by vacuum suction using only the vacuum suction conduit 20 at the time of forward movement, it is possible to carry the parts twice as long, and it is possible to cope with suction of the large parts 5. Alternatively, if the suction is performed for the same time, the volumes of the cylinder chambers 68 and 70 can be reduced.
[0038]
Next, the tip chip component 5 conveyed to the component extraction position is extracted by the lowering of the nozzle 76, and the component 5 is mounted at a desired position on a printed board (not shown).
[0039]
Further, when the operation time of the apparatus has passed to some extent and the filter 36 is clogged with foreign matter captured, the component suction conduit 22 is divided and the filter 36 is replaced with a new one.
[0040]
【The invention's effect】
As described above, according to the chip supply device of the present invention, even if a small foreign matter such as solder residue is sucked from the vacuum suction tube by the negative pressure generated in the cylinder, it is supplemented by the filter before reaching the cylinder and the check valve. The check valve and cylinder can be protected.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a vacuum suction mechanism of a component supply apparatus to which the present invention is applied.
FIG. 2 is a front view showing a component supply apparatus to which the present invention is applied.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Parts supply apparatus 10 Chute | shoot 12 Chute | shoot 20 Vacuum suction conduit 22 at the time of forward movement Parts suction conduit (vacuum suction conduit)
26 Vacuum Suction Check Valve 29 Backward Vacuum Suction Conduit 33 Vacuum Suction Check Valve 36 Filter 62 Air Cylinder

Claims (1)

In the component supply device that sucks the components aligned in the chute by the negative pressure generated in the cylinder as the piston rod moves and conveys it to the component extraction position,
A vacuum suction check valve is connected to a vacuum suction conduit provided in communication with the cylinder so that the parts in the chute can be supplied to the part removal position by the negative pressure generated during the operation of the piston rod, and the vacuum suction is performed. A component supply device comprising a filter on a chute side of a check valve for vacuum suction of a conduit .

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