JP3766881B2 - Substrate holding mechanism and cream solder printing apparatus using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate holding mechanism that holds a substrate , and more particularly, to a substrate holding mechanism that can ensure the level of a substrate even when a surface of an uneven substrate is supported, and a cream solder printing apparatus using the same .
[0002]
[Prior art]
Conventionally, as a means for holding a substrate when printing solder on the substrate with a cream solder printing apparatus, there is one disclosed in Japanese Patent Application Laid-Open No. 2001-62992 in which the substrate is held by a pair of horizontal clamp pieces. Specifically, in the cream solder printing apparatus disclosed in Japanese Patent Laid-Open No. 2001-62992, the conveyed substrate is received on a pin unit composed of a plurality of pins that can move up and down, and cooperates with the pressing means. After temporarily holding, the substrate is transferred to and held by a horizontal clamp piece. In addition, as another holding means, there is a method of holding from a lower surface of the substrate with a holding plate.
[0003]
[Problems to be solved by the invention]
Here, the detailed configuration of the pin unit is not disclosed in the above Japanese Patent Laid-Open No. 2001-62992. However, in the general conventional pin unit method, the pin is placed on a plate with a large number of holes serving as a base. A method is adopted in which the hole is inserted into the hole according to the substrate size.
[0004]
By the way, components to be mounted on a substrate are first mounted on a substrate coated with cream solder, and the cream solder is melted and fixed to the substrate. Here, there are boards that mount the components on only one side and boards that mount on both sides. For example, when mounting on both sides, after fixing a part to one side of the board, the board is turned over, and again put into the cream solder printing apparatus, and the cream solder is transferred to the opposite side. At that time, since there is a component fixed on the holding surface of the substrate, it is necessary to avoid the component for the substrate holding pin or the holding plate.
[0005]
From the above, when the board is held by the pins, the operator of the apparatus visually recognizes the parts fixed on the lower surface of the board and sets the pin arrangement so as to avoid the parts. However, in such a case, the operator must always set the position of the component on the lower surface and the position of the pin, and there is a problem that it takes a lot of time to set the pin. Also, when holding with a holding plate, it is necessary to make a plate that avoids the position of the parts. If there are many types of boards, prepare many types of plates, and replace the plates each time. There was an inconvenience that it was very difficult to deal with because it was necessary. In this case, since the wiring is also provided on the lower surface of the substrate, there is a disadvantage that the pin and the holding plate are in strong contact with the wiring and are damaged.
[0006]
The present invention improves the inconvenience of such a conventional example, and particularly provides a substrate holding mechanism that uses a plurality of substrate holding pins and can hold the substrate horizontally even if the substrate surface in contact with the substrate holding pins is uneven. When solder is printed on a printed circuit board with parts on both sides, when the board is delivered to a horizontal clamp piece that holds the board, it can be automatically delivered in a horizontal state and with high precision An object of the present invention is to provide a cream solder printing apparatus capable of printing solder.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, in the present invention, as a substrate holding mechanism for a substrate having a convex portion such as a component on the lower surface, a plurality of substrate holding pins that can be reciprocated independently, and the substrate holding pins are supported and reciprocated. And a pin drive mechanism to be operated. Here, the pin drive mechanism includes a cylinder having a sealed space therein, a piston that attaches a substrate holding pin and moves within the cylinder, and a first and a second that move the piston by supplying gas into the cylinder. Second gas supply means.
[0008]
Specifically, the first gas supply means is provided at one end of the cylinder and communicates with the sealed space, and the low pressure gas that supplies low-pressure gas into the cylinder from the first gas supply hole. A gas supply mechanism, and the second gas supply means is provided at the other end of the cylinder and communicates with the sealed space, and a high-pressure gas is introduced into the cylinder from the second gas supply hole. And a high pressure gas supply mechanism.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
One embodiment of the cream solder printing apparatus of the present invention will be described with reference to FIGS.
[0010]
First, the configuration of the cream solder printing apparatus of this embodiment will be described. As shown in FIG. 1, the cream solder printing apparatus includes a substrate carry-in unit 1 having a belt conveyor for carrying a printed circuit board (hereinafter referred to as “substrate”) 10, and a substrate 10 received from the substrate carry-in unit 1. It has the cream solder printing part 4 which prints cream solder, and the board | substrate carrying-out part 5 provided with the belt conveyor which discharges | emits the board | substrate 10 with which cream solder was printed.
[0011]
Here, the said cream solder printing part 4 is explained in full detail. The cream solder printing unit 4 conveys the substrate 10 received from the substrate carry-in unit 1 to the lower side of the mask 3 and conveys the substrate 10 to the substrate carry-out unit 5, and a conveyance belt 6 such as a belt conveyor. 6 includes a printing table unit 2 that holds the substrate 10 that has been transported in 6, a mask holding mechanism 9 that holds the mask 3, and a cream solder applicator (not shown) disposed above the mask 3.
[0012]
The printing table unit 2 is provided with a substrate holding mechanism 7 having a table that is movable in the vertical direction, front-rear direction, left-right direction and horizontal direction. The substrate holding mechanism 7 is provided on the uppermost table and has a substrate holding pin portion provided with a plurality of substrate holding pins 8 for holding the substrate 10 from the lower side, and the substrate holding pin portion is lifted to hold the substrate 10. A substrate lifting mechanism 36 that can be moved up and down, a pair of substrate holders 60a and 60b that can move in the direction of a semicircular arrow with respect to the upper surface of the substrate for regulating the position of the upper surface of the substrate, and a surface of the substrate It has a pair of side clamps 11a and 11b shown in FIG. 5B, which are substrate holding members that move in parallel and hold the outer peripheral portion of the substrate.
[0013]
Here, the substrate holding pin portion of the substrate holding mechanism 7 will be described in detail. The substrate holding pin portion includes the plurality of substrate holding pins 8 and a pin driving mechanism shown in FIG. 3 that supports and moves the substrate holding pins 8 up and down. In the board holding pin portion, as shown in FIGS. 2 (a) and 2 (b), each board holding pin 8 has a plurality of through holes formed in the vertical and horizontal directions of the pin insertion intermediate plate 7U. It is inserted so that it can move up and down independently. Further, as shown in FIG. 1, each of the substrate holding pins 8 is disposed between the two conveying pulleys 6P that drive the conveying belt 6 described above.
[0014]
Next, an example of the pin driving mechanism will be described with reference to FIG. 3A shows a state in which the substrate holding pin 8 is raised, and FIG. 3B shows a state in which the substrate holding pin 8 is in contact with wiring and components (not shown in the figure) on the lower surface of the substrate. It is a sectional view showing the state and seen from the side in the state of being disposed in the apparatus.
[0015]
The pin driving mechanism of the substrate holding pin 8 of the present embodiment includes an air cylinder chamber 40 having a sealed space therein, a piston 41 that slides in the air cylinder chamber 40 in the vertical direction, and a lower portion of the side surface of the air cylinder chamber 40. From the first gas supply hole 42 communicating with the sealed space formed on the side, the second gas supply hole 43 communicating with the sealed space formed on the upper side of the side surface of the air cylinder chamber 40, and the first gas supply hole 42 A first pipe for supplying a first gas (low pressure gas) into the air cylinder chamber 40; a second pipe for supplying a second gas (high pressure gas) into the air cylinder chamber 40 from the second gas supply hole 43; Consists of. In such a pin driving mechanism, the substrate holding pin 8 is slidably inserted on the upper surface of the air cylinder chamber 40 while ensuring the airtightness of the internal space of the air cylinder chamber 40, and is fixed to the piston 41. That is, the substrate holding pins 8 cooperate with the vertical movement of the piston 41. Moreover, although not shown in figure, the 1st gas supply apparatus which sends out 1st gas is arrange | positioned by 1st piping, and the 2nd gas supply apparatus which sends out 2nd gas is arrange | positioned by 2nd piping. Here, as will be described later, the first gas, that is, the low-pressure gas, is pushed back by the substrate holding pins 8 that are in contact with the wiring on the lower surface of the substrate or the convex portions of the component 15 (as shown in FIG. 3B). It will be in a state).
[0016]
In addition, the lower portion of the air cylinder chamber 40 is compared with its internal space so that when the low-pressure compressed gas is sent from the first gas supply hole 42, pressure is applied to the lower surface of the piston 41 substantially evenly. A small space (air chamber) 44 is formed. Furthermore, the second gas supply hole 43 is formed at a position where the distance between at least the upper end of the second gas supply hole 43 and the upper surface in the air cylinder chamber 40 is shorter than the height of the protrusions such as the wiring on the lower surface of the substrate and the component 15. In the air cylinder chamber 40, it is assumed that compressed gas is not supplied in the initial state, and the piston 41 is located at the lower end in the air cylinder chamber 40.
[0017]
Next, the operation of the cream solder printing apparatus of this embodiment will be described. Here, an operation and a printing process for horizontally positioning the upper surface (planar surface) of the substrate 10 in which the components are mounted only on the rear surface (lower surface) and the unevenness is formed will be described.
[0018]
First, the substrate 10 conveyed from the substrate carry-in unit 1 stops at a predetermined position on the conveyance belt 6 of the cream solder printing unit 4. Next, the substrate holders 60a and 60b shown in FIG. 5B provided on both sides of the conveyor belt 6 are moved in the direction of a semicircular arrow. At this time, one end of the substrate holders 60a and 60b is applied to the side clamps 11a and 11b so that the surfaces of the substrate holders 60a and 60b that are in contact with the substrate 10 are the same height as the upper surfaces of the side clamps 11a and 11b. To do.
[0019]
Subsequently, low pressure gas is supplied from the first gas supply hole 42 into the air cylinder chamber 40 to apply pressure to the lower portion of the piston 41, and the piston 41 of each substrate holding pin 8 is moved to the uppermost end in the air cylinder chamber 40. Move. In this state, the substrate holding mechanism 36 is used to raise the substrate holding pin portion together with the pin insertion intermediate plate 7U by a predetermined amount (to a position where the substrate holding pin 8 contacts the lower surface of the substrate 10). At that time, the board holding pins 8 that come into contact with the convex portions of the wiring, the component 15 and the like provided on the lower surface of the substrate 10 stop rising at the positions in contact with the convex portions. In such a state, the piston 41 that fixes the substrate holding pin 8 that abuts on the convex portion has an inside of the air cylinder chamber 40 so that the second gas supply hole 43 and the inside of the air cylinder chamber 40 communicate with each other. Stops at a position below the top edge.
[0020]
Next, when the high-pressure gas is supplied from the second gas supply hole 43 at the position of the piston 41 as described above and the supply of the low-pressure gas from the first gas supply hole 42 is stopped, it first comes into contact with the lower surface of the substrate 10. In the substrate holding pin 8, the high-pressure gas hits the side of the piston 41, and the movement of the piston 41 is blocked by the pressure (that is, the position of the substrate holding pin 8 is fixed). Further, in the substrate holding pin 8 that is in contact with the convex portion, the high-pressure gas flows above the piston 41, so that the piston 41 is lowered by the pressure and further separated from the lower surface of the substrate 10. The piston 41 finally descends to the lower end in the air cylinder chamber 40.
[0021]
In this way, the substrate holding pin 8 that contacts the substrate 10 stops at that position, and the substrate holding pin 8 that contacts the convex portion is lowered, that is, among the plurality of substrate holding pins 8. Since either one is brought into contact with only the lower surface of the substrate 10, it is possible to avoid contact with the convex portion of the component 15 or the like.
[0022]
Next, by actuating the substrate lifting mechanism 36, the substrate 10 is lifted by the substrate holding pins 8 that are in contact with the lower surface of the substrate 10 and separated from the transport belt 6. When both ends of the upper surface of the substrate 10 are in contact with the lower surfaces of the substrate holders 60a and 60b as shown in FIG. Subsequently, the side clamps 11a and 11b are horizontally moved to the substrate 10 side to fix the substrate 10 sandwiched from both ends.
[0023]
Next, the position of the mask 3 held by the substrate 10 and the mask holding mechanism 9 is measured by a position measuring mechanism such as a camera (not shown), and based on the measurement result, the position of both is corrected by driving the printing table. . When the alignment between the substrate 10 and the mask 3 is completed, the substrate 10 is raised to a position where the substrate 10 comes into contact with the mask 3 or a printable position by using a lifting mechanism of the printing table. In this state, the cream solder is printed on the substrate surface from the upper surface of the mask 3 using a cream solder application machine.
[0024]
After the printing is finished, the substrate 10 on which the cream solder is printed is lowered to a predetermined position by using the lifting mechanism of the printing table, the side clamps 11a and 11b are released, and the substrate holding pins 8 are transported by using the substrate lifting mechanism 36. The belt 6 is lowered to a position below the conveying surface of the belt 6. Thereby, the substrate 10 is placed on the transport surface of the transport belt 6. And the board | substrate 10 drives the conveyance belt 6, is sent to the board | substrate carrying-out part 5, and is carried to the next process from there.
[0025]
If the substrate on which the cream solder is printed next to the substrate 10 is a substrate having the same protrusions as the substrate 10 (that is, having the same component arrangement), the pin driving of the substrate holding pins 8 from the above state The substrate may be moved up and down by operating the substrate lifting mechanism 36 without operating the mechanism. Thus, the substrate holding pins 8 can be raised to the printing position without being brought into contact with the components on the lower surface of the substrate without moving the substrate holding pins 8 up and down.
[0026]
As described above, by using the cream solder printing apparatus of the present embodiment, setting of the board holding pins 8 that avoids the component mounting position on the lower surface of the board, which is conventionally performed manually when the cream solder is printed on the board 10. Can be done automatically. In addition, since the pin where the component is located on the back side has been pulled out by a person with some margin in the past, if the location where the component is large with respect to the substrate surface is large, the support location of the substrate 10 is reduced. When printing pressure is applied from above, there is a possibility that the substrate 10 bends at the portion (portion where there is no pin). However, by providing a pin driving mechanism for the substrate holding pins 8 as in this embodiment, only the substrate holding pins 8 that contact the components can be reliably separated from the substrate 10, so that the substrate holding pins that support the substrate 10. 8 can be avoided from being extremely reduced, and the substrate 10 can be supported with high accuracy.
Further, by devising the formation positions of the gas supply holes 42 and 43, the pressing force of the substrate holding pin 8 that contacts the component can be made smaller than the pressing force of the substrate holding pin 8 that contacts the substrate 10. It is also possible to support the substrate 10 without damaging the components. Furthermore, since the substrate 10 can be effectively held without providing various holding plates as in the conventional example, there is no need to change the holding plate in accordance with the substrate 10, and workability is improved. be able to.
[0027]
Next, a modification of the pin driving mechanism of the substrate holding pin 8 of the first embodiment described above will be described. The difference between this pin drive mechanism and the pin drive mechanism of the first embodiment is that a concave portion 46 indicated by a broken line in FIG. 3 is provided on the side surface (circumferential surface) of the piston 41. The recess 46 is formed to face the second gas supply hole 43 when the piston 41 is located at the upper end in the air cylinder chamber 40. Thereby, in addition to the effect of 1st embodiment mentioned above, there can exist the following effects. That is, in the substrate holding pin 8 that contacts the lower surface of the substrate 10 as shown in the first embodiment, when the high-pressure gas is supplied from the second gas supply hole 43, the high-pressure gas passes through the surface of the recess 46. It is possible to suppress the movement of the piston 41 more effectively. As a result, the substrate 10 can be more reliably supported.
[0028]
Next, another modification of the pin driving mechanism of the substrate holding pin 8 of the first embodiment described above will be described. The difference between this pin drive mechanism and the pin drive mechanism of the first embodiment is that, as shown in FIGS. 4A and 4B, the piston 41 is provided with a conduction hole 45 communicating from the side surface to the lower surface. In the point. Here, the piston side surface side of the conduction hole 45 is provided at a position facing the second gas supply hole 43 when the piston 41 is located at the upper end in the air cylinder chamber 40. For this reason, the conduction hole 45 forms a flow path for the high-pressure gas supplied from the second gas supply hole 43.
[0029]
By providing such a piston 41 having the conduction hole 45, a high-pressure gas is supplied from the second gas supply hole 43 as in the first embodiment, and a low-pressure gas is supplied from the first gas supply hole 42. First, in the substrate holding pin 8 that is in contact with the lower surface of the substrate 10, the high-pressure gas flows into the low-pressure gas chamber below the piston 41 through the conduction hole 45 and further increases the piston 41. Work. For this reason, even if the supply of the low-pressure gas from the first gas supply hole 42 is stopped in this state, the piston 41 (substrate holding pin 8) can be held at that position.
[0030]
Moreover, in the board | substrate holding pin 8 contact | abutted to a convex part, since the side surface of piston 41 has obstruct | occluded the 2nd gas supply hole 43, by stopping supply of low pressure gas, for example, piston 41 grade | etc., It descends under its own weight. Then, as it descends, a space communicating with the second gas supply hole 43 is formed above the piston 41, so that high-pressure gas flows into the space from the second gas supply hole 43, and the piston 41 is moved to the innermost position in the cylinder 40. Press down to the lower end position and hold this position. Thereby, each board | substrate holding pin 8 which contacted the convex part will be in the state which does not contact the board | substrate 10 completely.
[0031]
【The invention's effect】
The board holding mechanism and the cream solder printing apparatus using the board holding mechanism according to the present invention hold the board according to the mounting position of the component when the board holding pin holds the board on which the board is mounted with the board holding pin. the need to configure the pin is not able to save much time and effort for the worker, it is possible to improve workability setup of the apparatus at the time of solder paste printing on the substrate, excellent substrate holding unprecedented that It becomes possible to obtain a mechanism and a cream solder printing apparatus using the mechanism .
[Brief description of the drawings]
FIG. 1 is a side view showing a schematic configuration of a first embodiment of a cream solder printing apparatus according to the present invention.
2A and 2B are views showing the arrangement of substrate holding pins according to the present embodiment, in which FIG. 2A is a perspective view thereof, and FIG. 2B is a side view thereof.
3 is a cross-sectional view of the configuration of the pin driving mechanism of the present embodiment as viewed from the side, and FIG. 3 (a) is a diagram showing a state in which the substrate holding pins are raised, and FIG. It is a figure which shows the state which the board | substrate holding pin contacted the convex part of the board | substrate lower surface.
FIG. 4 is a cross-sectional view of a configuration of another modified example of the pin drive mechanism of the present embodiment as viewed from the side.
5A and 5B are operation explanatory views of the substrate holding mechanism of the present embodiment, in which FIG. 5A is a side view seen from the side, and FIG. 5B is a view seen from the moving direction side of the substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate carrying-in part 2 Print table part 3 Mask 4 Cream solder printing part 5 Substrate carrying-out part 6 Conveyor belt 7 Substrate holding mechanism 8 Substrate holding pin 9 Mask holding mechanism 10 Substrate 11a, 11b Side clamp 40 Cylinder 41 Piston 42 First gas supply Hole 43 Second gas supply hole 45 Conduction hole

Claims (4)

In the substrate holding mechanism for holding the supplied substrate at its working position,
A plurality of substrate holding pins for holding the substrate, a cylinder having a sealed space inside each of the substrate holding pins, a piston moving in the cylinder, and a first gas supplying low pressure gas to one end of the cylinder A gas supply hole, and a second gas supply hole for supplying a high-pressure gas to the other end of the cylinder,
When the piston is driven to move to the other end of the cylinder by driving the piston, a concave groove to which high-pressure gas from the second gas supply hole is supplied is provided,
A substrate holding mechanism, wherein the substrate holding pin is fixed to the piston and is raised by supplying a low-pressure gas from the first gas supply hole. In the substrate holding mechanism for holding the supplied substrate at its working position,
A plurality of substrate holding pins for holding the substrate, a cylinder having a sealed space inside each of the substrate holding pins, a piston moving in the cylinder, and a first gas supplying low pressure gas to one end of the cylinder A gas supply hole, and a second gas supply hole for supplying a high-pressure gas to the other end of the cylinder,
The piston, when moved to the located on the other end of the cylinder by driving the piston, provided with a guide hole communicating between the said first gas supply hole second gas supply hole,
A substrate holding mechanism, wherein the substrate holding pin is fixed to the piston and is raised by supplying a low-pressure gas from the first gas supply hole. Cream solder comprising a transport belt for transporting a substrate to be printed to a printing unit, a substrate holding mechanism for holding the substrate at a predetermined height, and a mask holding mechanism for holding a mask for applying cream solder In the printing device,
As the substrate holding mechanism, a plurality of substrate holding pins, a pin driving mechanism for reciprocating the substrate holding pins, and a substrate holding member for holding the outer peripheral portion of the substrate are provided.
The pin driving mechanism includes: a cylinder having a sealed space therein; a piston that attaches the substrate holding pin and moves within the cylinder; and a gas that supplies gas into the cylinder and moves the piston. A second gas supply means,
The first gas supply means includes a first gas supply hole provided at one end of the cylinder and communicating with a sealed space formed between the lower portion of the piston and the cylinder, and a low pressure from the first gas supply hole. A low-pressure gas supply mechanism for supplying a gas of
The second gas supply means includes a second gas supply hole provided at the other end of the cylinder and communicating with a sealed space formed between the upper portion of the piston and the cylinder, and the second gas supply hole from the second gas supply hole. It consists of a high-pressure gas supply mechanism that supplies high-pressure gas that is higher than low pressure,
The piston has a concave groove that holds the position of the piston by supplying the high-pressure gas from the second gas supply hole when the piston is driven to move to the other end of the cylinder. And
By supplying low pressure gas from the first gas supply means to the sealed space between the lower part of the piston and the cylinder through the first gas supply hole, the piston and the substrate holding pin attached to the piston are provided. Abut against the substrate or the convex part of the substrate,
Next, a high pressure gas is supplied from the second gas supply means through the second gas supply hole to the sealed space formed between the piston and the cylinder formed by the convex portion, and a downward force is applied to the piston. This is a cream solder printing device. The piston, when moved to the located on the other end of the cylinder by driving the piston, provided with a guide hole communicating between the said first gas supply hole second gas supply hole, the second gas The cream solder printing apparatus according to claim 3, wherein the piston position is maintained by supplying high-pressure gas from the supply hole to the communication hole.

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