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JP3612174B2 - Liquid crystal display - Google Patents

Liquid crystal display Download PDF

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Publication number
JP3612174B2
JP3612174B2 JP18213097A JP18213097A JP3612174B2 JP 3612174 B2 JP3612174 B2 JP 3612174B2 JP 18213097 A JP18213097 A JP 18213097A JP 18213097 A JP18213097 A JP 18213097A JP 3612174 B2 JP3612174 B2 JP 3612174B2
Authority
JP
Japan
Prior art keywords
insulating substrate
liquid crystal
insulator
crystal display
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP18213097A
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Japanese (ja)
Other versions
JPH1124093A (en
Inventor
文彦 佐川
直樹 竹下
学 草野
泰蔵 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP18213097A priority Critical patent/JP3612174B2/en
Publication of JPH1124093A publication Critical patent/JPH1124093A/en
Application granted granted Critical
Publication of JP3612174B2 publication Critical patent/JP3612174B2/en
Anticipated expiration legal-status Critical
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Description

【0001】
【発明の属する技術分野】
本発明は、電気機器、自動車等においてデイスプレイとして用いられる液晶表示装置に関する。
【0002】
【従来の技術】
従来におけるこの種の液晶表示装置は、図5〜図7に示すように、液晶セル30は、二枚の矩形状のガラスから成る絶縁基板31と32との間に、液晶(図示せず)が封入され、また、前記絶縁基板31、32上にはそれぞれ偏光板33、34が貼着された構成となっている。
また、絶縁基板31、32の対向する面には、それぞれの絶縁基板31、32に、複数の対をなす導電体35a、35bが形成されている(図面では絶縁基板32側のみ示している)。
また、絶縁基板32に設けられた導電体35a、35bには、複数のICチップ36が接続されて、導電体35bを通して外部に導出されるものである。
【0003】
また、前記絶縁基板32の裏面には、引き出し用、及び接続用等の導電配線37が形成され、適宜電気部品(図示せず)を接続した絶縁板38が貼着されている。
また、フレキシブル基板39は、矩形状をなし、複数の導電配線(図示せず)が形成されていて、このフレキシブル基板39は、一端側の導電配線を絶縁基板32の導電体35bに接続し、また、他端側を絶縁基板32の裏面側に折り曲げて、他端側の導電配線を絶縁板38の導電配線37に接続した構成となっている。
【0004】
【発明が解決しようとする課題】
従来の液晶表示装置は、絶縁基板32の表面でICチップ36が接続された導電体35bと、裏面に配設された絶縁板38の導電配線37とをフレキシブル基板39で接続するため、フレキシブル基板39の外側への膨らみにより装置が大型となると言う問題がある。
【0005】
【課題を解決するための手段】
上記課題を解決するための第1の解決手段として、ガラスから成り、間に液晶を封入した二枚の絶縁基板と、前記二枚の絶縁基板の対向する面において、少なくとも一方の前記絶縁基板に形成された導電体と、導電体に接続された状態で前記一方の絶縁基板に固着されたICチップと、前記一方の絶縁基板の導電体形成面と反対面に配設された絶縁体と、該絶縁体の前記絶縁基板対向面と反対面に形成された導電配線とを備え、前記絶縁体に凹部を設け、該凹部に対向させて前記ICチップの一部を前記一方の絶縁基板の側縁から突出させ、この突出したICチップのバンプと前記絶縁体の前記絶縁基板対向面の反対面に形成された導電配線とをワイヤを着して接続すると共に、このワイヤ部分を前記絶縁体の凹部に位置させるとともに前記凹部に絶縁性の樹脂を設けることで前記ワイヤ部分を被覆した構成とした。
また、第2の解決手段として、前記ICチップにダミーバンプを設け、該ダミーバンプを前記絶縁基板の導電体に接続した構成とした。
【0006】
【発明の実施の形態】
本発明の液晶表示装置を図1〜図4に基づいて説明すると、図1は本発明の液晶表示装置の平面図、図2は本発明の液晶表示装置の裏面図、図3は本発明の液晶表示装置に係る絶縁体の平面図、図4は本発明の液晶表示装置の要部を断面した一部側面図である。
【0007】
本発明における液晶表示装置は、図1〜図4に示すように、液晶セル1は、二枚の矩形状のガラスから成る絶縁基板2と3との間に、液晶(図示せず)が封入され、また、前記絶縁基板2、3上にはそれぞれ偏光板4、5が貼着された構成となっている。
また、絶縁基板2、3の対向する面には、それぞれの絶縁基板2、3に、複数の導電体6が形成されている(図面では絶縁基板3側のみ示している)。
また、複数のそれぞれのICチップ7は、図4に示すように、その下面には接続用のバンプ7a、7bと、バンプ7aと7bとの間に設けられたダミーバンプ7cとを備えている。
そして、このICチップ7は、絶縁基板3の側縁3aから外方に一部を突出させてバンプ7bを位置させ、また、バンプ7aとダミーバンプ7cは、それぞれ絶縁基板3上面に位置して、導電体6に熱硬化型等の異方性導電体8により電気的に接続されると共に、1Cチップ7が絶縁基板3に固定されている。
【0008】
また、前記絶縁基板3の裏面には、引き出し用、及び接続用等の導電配線9が形成され、適宜電気部品(図示せず)を接続したフレキシブル、或いは硬質の絶縁体10が貼着されている。 そして、この絶縁体10は、その側部に複数の凹部10aを設け、この凹部10aが前記ICチップ7と対向した状態で配置されている。
そして、ICチップ7のバンプ7bと絶縁体10の導電配線9とが、ワイヤ11の溶着(ワイヤボンディング)によって電気的に接続され、且つ、このワイヤ11は絶縁体10の凹部10a内に位置した状態と成っている。
また、絶縁材から成り、UV(紫外線)硬化を行う樹脂12が、ワイヤ11の全周を覆うように凹部10aに設けられ、UVにより硬化した状態で形成されている。
即ち、導電体6は、ICチップ7のバンプ7a、7b、及びワイヤ11を介して導電配線9に導出されようになっている。
【0009】
【発明の効果】
本発明の液晶表示装置は、ICチップ7を、絶縁基板3の側縁7aから突出させ、この突出させたICチップ7のバンプ7bと絶縁体10の導電配線9とをワイヤ11を溶着して接続したため、絶縁基板3を小さくでき、小型の装置を提供できる。
また、ダミーバンプ7cを設けて接続用のバンプ7aと共に導電体6に接続するため、ICチップ7の取付が安定、確実となり、ワイヤ11溶着時の作業を確実に出来る。
更に、絶縁体10の凹部10aに位置させたワイヤ11を、凹部10aに樹脂12を設けて覆うようにしたため、樹脂12の掛かり止めが良好で、ワイヤ11の被覆が確実になる。
【図面の簡単な説明】
【図1】本発明の液晶表示装置の平面図。
【図2】本発明の液晶表示装置の裏面図。
【図3】本発明の液晶表示装置に係る絶縁体の平面図。
【図4】本発明の液晶表示装置の要部を断面した一部側面図。
【図5】従来の液晶表示装置の平面図。
【図6】従来の液晶表示装置の裏面図。
【図7】従来の液晶表示装置の一部側面図。
【符号の説明】
1 液晶セル
2、3 絶縁基板
4、5 偏光板
6 導電体
7 ICチップ
7a、7b バンプ
7c ダミーバンプ
8 異方性導電体
9 導電配線
10 絶縁体
10a 凹部
11 ワイヤ
12 樹脂
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a liquid crystal display device used as a display in electrical equipment, automobiles and the like.
[0002]
[Prior art]
In this type of conventional liquid crystal display device, as shown in FIGS. 5 to 7, a liquid crystal cell 30 includes a liquid crystal (not shown) between two insulating substrates 31 and 32 made of rectangular glass. And polarizing plates 33 and 34 are adhered to the insulating substrates 31 and 32, respectively.
Also, a plurality of pairs of conductors 35a and 35b are formed on the opposing surfaces of the insulating substrates 31 and 32 (only the insulating substrate 32 side is shown in the drawing). .
A plurality of IC chips 36 are connected to the conductors 35a and 35b provided on the insulating substrate 32, and are led out to the outside through the conductor 35b.
[0003]
Conductive wiring 37 for drawing out and connecting is formed on the back surface of the insulating substrate 32, and an insulating plate 38 to which electrical components (not shown) are appropriately connected is attached.
The flexible substrate 39 has a rectangular shape, and a plurality of conductive wirings (not shown) are formed. The flexible substrate 39 connects the conductive wiring on one end side to the conductor 35b of the insulating substrate 32, and Further, the other end side is bent to the back side of the insulating substrate 32, and the conductive wiring on the other end side is connected to the conductive wiring 37 of the insulating plate 38.
[0004]
[Problems to be solved by the invention]
In the conventional liquid crystal display device, the flexible substrate 39 connects the conductor 35b to which the IC chip 36 is connected on the surface of the insulating substrate 32 and the conductive wiring 37 of the insulating plate 38 disposed on the back surface. There is a problem that the apparatus becomes large due to the outward swelling of 39.
[0005]
[Means for Solving the Problems]
As a first means for solving the above problems, two insulating substrates made of glass and enclosing a liquid crystal between them, and at least one of the insulating substrates on the opposing surfaces of the two insulating substrates, and formed conductor, an IC chip is fixed on the one insulating substrate in a state of being connected to the conductor, the disposed surface opposite to the one of the insulated electrical conductor forming surface of the substrate and the insulator A conductive wiring formed on a surface opposite to the surface facing the insulating substrate of the insulator, and a recess is provided in the insulator, and a part of the IC chip is disposed on the one insulating substrate so as to face the recess . protrudes from the side edge, the bumps and the insulating material of the insulating substrate facing the opposite surface to the formed conductive wire surface of the projecting IC chip with connecting wires soluble wear to the insulation the wire portion While positioning it in the body's recess It has a structure obtained by coating the wire portion by providing an insulating resin to serial recess.
As a second solution, a dummy bump is provided on the IC chip, and the dummy bump is connected to a conductor of the insulating substrate.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The liquid crystal display device of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a plan view of the liquid crystal display device of the present invention, FIG. 2 is a back view of the liquid crystal display device of the present invention, and FIG. The top view of the insulator which concerns on a liquid crystal display device, FIG. 4 is the partial side view which carried out the cross section of the principal part of the liquid crystal display device of this invention.
[0007]
In the liquid crystal display device according to the present invention, as shown in FIGS. 1 to 4, the liquid crystal cell 1 includes a liquid crystal (not shown) enclosed between two insulating substrates 2 and 3 made of rectangular glass. In addition, polarizing plates 4 and 5 are attached on the insulating substrates 2 and 3, respectively.
A plurality of conductors 6 are formed on the opposing surfaces of the insulating substrates 2 and 3 on the respective insulating substrates 2 and 3 (only the insulating substrate 3 side is shown in the drawing).
Further, as shown in FIG. 4, each of the plurality of IC chips 7 includes connection bumps 7a and 7b and dummy bumps 7c provided between the bumps 7a and 7b on the lower surface thereof.
The IC chip 7 has a bump 7b located partly protruding outward from the side edge 3a of the insulating substrate 3, and the bump 7a and the dummy bump 7c are positioned on the upper surface of the insulating substrate 3, respectively. The 1C chip 7 is fixed to the insulating substrate 3 while being electrically connected to the conductor 6 by a thermosetting anisotropic conductor 8 or the like.
[0008]
Conductive wirings 9 for drawing out and connecting are formed on the back surface of the insulating substrate 3, and a flexible or hard insulator 10 to which electrical components (not shown) are appropriately connected is attached. Yes. The insulator 10 is provided with a plurality of concave portions 10 a on the side portions thereof, and the concave portions 10 a are arranged in a state of facing the IC chip 7.
The bump 7 b of the IC chip 7 and the conductive wiring 9 of the insulator 10 are electrically connected by welding (wire bonding) of the wire 11, and the wire 11 is located in the recess 10 a of the insulator 10. It consists of a state.
Also, a resin 12 made of an insulating material and performing UV (ultraviolet) curing is provided in the recess 10a so as to cover the entire circumference of the wire 11, and is formed in a state cured by UV.
That is, the conductor 6 is led out to the conductive wiring 9 via the bumps 7 a and 7 b of the IC chip 7 and the wire 11.
[0009]
【The invention's effect】
In the liquid crystal display device of the present invention, the IC chip 7 is projected from the side edge 7a of the insulating substrate 3, and the bumps 7b of the projected IC chip 7 and the conductive wiring 9 of the insulator 10 are welded to the wire 11. Since the connection is made, the insulating substrate 3 can be made small, and a small device can be provided.
Further, since the dummy bump 7c is provided and connected to the conductor 6 together with the connection bump 7a, the attachment of the IC chip 7 becomes stable and reliable, and the work at the time of welding the wire 11 can be ensured.
Further, since the wire 11 positioned in the recess 10a of the insulator 10 is covered with the resin 12 provided in the recess 10a, the resin 12 is satisfactorily retained and the wire 11 is reliably covered.
[Brief description of the drawings]
FIG. 1 is a plan view of a liquid crystal display device of the present invention.
FIG. 2 is a back view of the liquid crystal display device of the present invention.
FIG. 3 is a plan view of an insulator according to the liquid crystal display device of the present invention.
FIG. 4 is a partial side view showing a cross section of a main part of the liquid crystal display device of the present invention.
FIG. 5 is a plan view of a conventional liquid crystal display device.
FIG. 6 is a rear view of a conventional liquid crystal display device.
FIG. 7 is a partial side view of a conventional liquid crystal display device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal cell 2, 3 Insulating substrate 4, 5 Polarizing plate 6 Conductor 7 IC chip 7a, 7b Bump 7c Dummy bump 8 Anisotropic conductor 9 Conductive wiring 10 Insulator 10a Recess 11 Wire 12 Resin

Claims (2)

ガラスから成り、間に液晶を封入した二枚の絶縁基板と、前記二枚の絶縁基板の対向する面において、少なくとも一方の前記絶縁基板に形成された導電体と、導電体に接続された状態で前記一方の絶縁基板に固着されたICチップと、前記一方の絶縁基板の導電体形成面と反対面に配設された絶縁体と、該絶縁体の前記絶縁基板対向面と反対面に形成された導電配線とを備え、前記絶縁体に凹部を設け、該凹部に対向させて前記ICチップの一部を前記一方の絶縁基板の側縁から突出させ、この突出したICチップのバンプと前記絶縁体の前記絶縁基板対向面の反対面に形成された導電配線とをワイヤを着して接続すると共に、このワイヤ部分を前記絶縁体の凹部に位置させるとともに前記凹部に絶縁性の樹脂を設けることで前記ワイヤ部分を被覆したことを特徴とする液晶表示装置。Made of glass, and two insulating substrates in which liquid crystals are sealed between, the opposed faces of the two insulating substrates, conductive and body which is formed on at least one of the insulating substrate, which is connected to the conductor An IC chip fixed to the one insulating substrate in the state, an insulator disposed on a surface opposite to the conductor forming surface of the one insulating substrate, and a surface opposite to the insulating substrate facing surface of the insulator A conductive wiring formed, a recess is provided in the insulator, and a part of the IC chip protrudes from a side edge of the one insulating substrate so as to face the recess, and a bump of the protruding IC chip and wherein together with said insulating substrate opposing conductive formed on the opposite surface of the surface wiring of the insulator to connect the wire soluble wear to an insulating resin into the recess together to position the wire part into the recess of the insulator By providing the wire The liquid crystal display device characterized by coating the minute. 前記ICチップにダミーバンプを設け、該ダミーバンプを前記絶縁基板の導電体に接続したことを特徴とする請求項1記載の液晶表示装置。The liquid crystal display device according to claim 1, wherein dummy bumps are provided on the IC chip, and the dummy bumps are connected to a conductor of the insulating substrate.
JP18213097A 1997-07-08 1997-07-08 Liquid crystal display Expired - Fee Related JP3612174B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18213097A JP3612174B2 (en) 1997-07-08 1997-07-08 Liquid crystal display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18213097A JP3612174B2 (en) 1997-07-08 1997-07-08 Liquid crystal display

Publications (2)

Publication Number Publication Date
JPH1124093A JPH1124093A (en) 1999-01-29
JP3612174B2 true JP3612174B2 (en) 2005-01-19

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JP18213097A Expired - Fee Related JP3612174B2 (en) 1997-07-08 1997-07-08 Liquid crystal display

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6392676B2 (en) * 2015-01-30 2018-09-19 シチズンファインデバイス株式会社 Wire connection structure for electronic components
CN112014987A (en) * 2020-09-03 2020-12-01 Tcl华星光电技术有限公司 Array substrate, preparation method thereof, display panel and spliced display

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