JP3605934B2 - Taping method for electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for taping an electronic component, in which a top tape is thermocompressed and welded to a carrier tape containing the electronic component.
[0002]
[Prior art]
A conventional taping method for electronic components will be described with reference to the drawings, taking a chip-type aluminum electrolytic capacitor (hereinafter, referred to as a capacitor) as an example.
[0003]
FIG. 2 is a front view of a capacitor as an example of an electronic component, FIG. 3 is a perspective view of a state in which the top tape of the carrier tape after the taping has been peeled off, FIGS. 4A and 4B are plan views of FIG. FIGS. 5A and 5B are a plan view and a front view of a main part of a manufacturing apparatus used in a conventional taping method, and FIG. 6 is a cross-sectional view of a main part showing a defective state in the guide part. .
[0004]
2 to 4, reference numeral 21 denotes a capacitor; 22, a pair of lead wires drawn from the capacitor 21; 23, an insulating terminal plate that holds the bent and cut lead wire 22 and the capacitor 21; I have.
[0005]
Reference numeral 24 denotes a carrier tape, which is made of a film-like thermoplastic resin or the like, and has an embossed space 26 in the center and a feed hole 27 for conveyance at one end in the longitudinal direction at regular intervals. Reference numeral 25 denotes a top tape, which is made of a film-like resin material or the like and seals the capacitor 21 in the embossed space 26 of the carrier tape 24.
[0006]
Numerals 28 and 28a are welded portions of the carrier tape 24 and the top tape 25 which are alternately arranged at regular intervals by thermocompression bonding.
[0007]
In FIG. 5, the capacitor 21 is inserted into the embossed space 26 of the carrier tape 24 (insertion portion), and the carrier roller 24 is conveyed at a constant pitch by one pitch by rotating the drive roller 41 in the direction of the arrow.
[0008]
The carrier tape 24 is wound around the carrier tape 24 by a curved fixed guide plate 28 and a dancer roller side guide 29 for preventing the capacitor 21 from jumping out during transportation. The upper and lower guide plates 31 and the dancer portion composed of a curved fixed guide plate 32 for preventing the pair of capacitors 21 from jumping out of the fixed guide plate 28 and the dancer roller 30 to insert the capacitor 21 (single feed). And the difference in the amount of transport of the carrier tape 24 in the taping section (a plurality of, for example, eight pieces are simultaneously fed) of the capacitor 21 in the next step is adjusted.
[0009]
Then, the welding unit 36 is transferred to the taping unit via the driven roller 33, supplies the top tape 25 along the peripheral surface of the guide block 34, and has a vertical sliding mechanism driven by the air cylinder 35. On the connecting plate 38 in which heaters 37 installed at the lower ends of both shafts are embedded, a plurality of lower ends having a length of, for example, 8 pitches are alternately welded points 28, 28a at regular intervals shown in FIG. A heat seal head 39 having a heat seal head 39a is mounted, and a lowering operation is performed by the welding unit 36 so that the tip chip 39a abuts on a predetermined position on the upper surface of the top tape 25, and the top tape 25 is thermocompressed to the carrier tape 24. A plurality of pieces are simultaneously welded, for example, at eight places and subjected to taping.
[0010]
Thereafter, a plurality of, for example, eight processed carrier tapes 24a, which have been subjected to taping by the drive roller 40, are simultaneously conveyed to a take-up reel (not shown). The part where the capacitor 21 is inserted into the embossed space 26 is not shown and is omitted.
[0011]
[Problems to be solved by the invention]
However, in the configuration of the conventional manufacturing apparatus and the taping method, a dancer section is provided to compensate for and adjust the difference in the transport amount of the carrier tape 24 between the insertion section (single feed) and the taping section (eight simultaneous feed). However, when the carrier tape 24 is conveyed, the capacitor jumps due to vibrations or the like, and the fixed guide plate 28, the upper and lower guide plates 31, and the fixed guide plate 32 for preventing the capacitor 21 from jumping out. (Marking surface) is rubbed, and there is a problem that stamping disappears and scratches occur to lower the yield.
[0012]
In addition, the transport of the carrier tape 24 in the taping section is carried out simultaneously because a plurality of, for example, eight tapes are simultaneously transported, so that the acceleration is increased and the wear of each guide is large, and the dancer roller 30 and the upper and lower guide plates 31 follow the transport operation. The gap between the dancer roller 30, the upper and lower guide plates 31 and the carrier tape 24 is generated due to the capacitor 21 bounding, and the capacitor 21 jumps out, and the fixed guide plate 32 and the upper and lower guide plates 31 As shown in FIG. 6, a phenomenon occurs in which the carrier tape 24 breaks and is damaged during the transport operation of the carrier tape 24, thereby lowering the yield.
[0013]
An object of the present invention is to provide a taping method for an electronic component capable of performing high-speed operation with a simple structure, with less deformation and wear of members, easy maintenance, high yield, and a simple structure. The purpose is.
[0014]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a taping method for an electronic component according to the present invention supplies and laminates a top tape on a carrier tape in which the electronic component is inserted into an embossed space, and the carrier tape is provided one pitch (one unit) at a time. Each time it is transported, the swinging lever with the length dimension for a plurality of pitches and the same number of tip chips installed on the lower surface is mounted on the lower surface, and the swinging lever with the heating heater embedded is lowered once. In this method, the laminated top tape and the carrier tape are sequentially subjected to thermocompression bonding at predetermined welding locations the number of times equal to the number of the tip chips to perform taping.
[0015]
According to the present invention, deformation and wear of the members are small with a simple configuration, maintenance is easy, the yield is high, and high-speed operation is possible.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
According to the first aspect of the present invention, a top tape made of a film-like insulating material is supplied and laminated on one surface of a carrier tape made of an insulating material on a film in which electronic components are inserted into an embossed space, and the carrier tape is Each time one pitch is conveyed, a swinging lever with a length dimension for a plurality of pitches and a heat seal head with the same number of tip chips installed on the lower surface mounted on the lower surface and a heater for heating embedded is installed. This is a simple configuration in which the top tape and the carrier tape laminated by the tip are moved down once and the predetermined welding locations are successively thermocompressed and welded by the number of times of the tip to weld and taping. Accordingly, high speed operation is possible without wear, deformation and damage of the members.
[0017]
Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking a capacitor as an example.
[0018]
FIG. 1 is a conceptual view of a manufacturing apparatus for explaining a capacitor taping method according to the embodiment. In FIG. 1, reference numeral 1 denotes a capacitor, 4 denotes a carrier tape, and 5 denotes a top tape.
[0019]
Reference numeral 2 denotes a driven roller which rotates in the direction of the arrow to convey the carrier tape 4, and 3 denotes a drive roller which rotates in the direction of the arrow to form an embossed space portion of the carrier tape 4 (the same as in FIG. 3 described above). For this reason, the processed carrier tape 12 in which the capacitor 1 inserted in the not-shown capacitor (not shown) is sealed and taped with the top tape 5 is conveyed to a take-up reel (not shown).
[0020]
Reference numeral 6 denotes a heat seal head made of a heat-resistant metal material or the like, which is installed on the upper surface of the laminated portion of the carrier tape 4 and the top tape 5 between the driving roller 3 and the driven roller 2. 4 is a length dimension corresponding to a plurality of (for example, eight) pitches at which the welding portions shown in FIG. 4 are welded by thermocompression bonding, and the tip chips 11 made of a heat resistant hard metal material or the like are alternately arranged at regular intervals. Individually provided on the lower surface.
[0021]
The heat seal head 6 is swingably mounted on a fulcrum shaft 9 and is mounted on the lower surface of a swing lever 7 made of a heat-resistant and heat conductive metal or ceramic material having a heater 8 embedded therein. The tip 11 comes into contact with the above-mentioned welding point by the lowering of the swing operation of the swing lever 7.
[0022]
Reference numeral 10 denotes a guide block made of a metal material, a ceramic material, or the like, which is installed adjacent to the tip of the swing lever 7 and regulates and guides the top tape 5.
[0023]
Next, the operation will be described.
First, the condenser 1 is sequentially inserted into an embossed space (not shown) of the carrier tape 4 by various insertion machines (not shown), and the carrier tape 4 is conveyed one pitch at a time by the driving roller 3 and the driven roller 2.
[0024]
Then, the top tape 5 is supplied to and stacked on the upper surface of the carrier tape 4 along the guide block 10, and the carrier tape 4 on which the top tape 5 is stacked is transported by one pitch (corresponding to one capacitor 1). Each time the swing lever 7 swings and moves downward, the tip 11 of the heat seal head 6 attached to the lower surface of the swing lever 7 comes into contact with a predetermined welding position on the upper surface of the top tape 5. Then, the top tape 5 is welded to the carrier tape 4 by thermocompression bonding and taped.
[0025]
After a predetermined time, the rocking lever 7 is rocked to move upward, and the tip chip 11 of the heat sealing head 6 is separated from a predetermined welding position on the upper surface of the top tape 5. Then, the process returns to the step of inserting the first capacitor 1 by transporting 4 for one pitch, and the one-step operation ends.
[0026]
The welding is performed by continuously repeating the following operation, and the welding locations are at every pitch as described above, so that the number of the tip chips 11 (for example, eight if eight) is used. The press bonding is repeated to obtain a predetermined welding time, that is, a welding strength.
[0027]
As described above, the embodiment of the present invention has described an example in which a capacitor has eight tip chips. However, the present invention can be used for various chip-type electronic components such as coils, resistors, semiconductors, and mechanical components. It goes without saying that the number is not limited to eight and can be set to an optimum number.
[0028]
【The invention's effect】
As described above, the taping method of an electronic component according to the present invention does not require a dancer roller, eliminates imprinting or scratches, improves the yield without causing breakage of the carrier tape, and eliminates the need for a prevention guide. Therefore, there is no need for maintenance due to abrasion of the guide, and there are many effects that the cost of members is low with a simple configuration, the size of the device can be reduced, the occupied area is reduced, and high-speed operation is possible.
[Brief description of the drawings]
FIG. 1 is a conceptual diagram of a taping method for a capacitor according to an embodiment of the present invention. FIG. 2 is a front view of a capacitor as an example of an electronic component. FIG. FIG. 4 (a) is a plan view of FIG. 3 (b), and a front sectional view thereof FIG. 5 (a) is a plan view of a main part of a manufacturing apparatus used in a conventional taping method, and FIG. FIG. 6 is a sectional view of a main part showing a malfunction state in the guide portion.
DESCRIPTION OF SYMBOLS 1 Condenser 2 Follower roller 3 Drive roller 4 Carrier tape 5 Top tape 6 Heat seal head 7 Swing lever 8 Heater 9 Support shaft 10 Guide block 11 Tip 12 Processed carrier tape

Claims (1)

A top tape made of a film-shaped insulating material is supplied and laminated on one side of a carrier tape made of a film-shaped insulating material in which electronic components are inserted into the embossed spaces. A heat seal head having the same length as the pitch and having the same number of tips mounted on the lower surface is attached to the lower surface, and the swing lever with the embedded heater for heating is moved down once, and stacked by the tips. A taping method for an electronic component in which a top tape and a carrier tape are sequentially welded by thermocompression bonding at a predetermined number of times corresponding to the number of tip chips, and the tape is welded and taped.

Images