JP3696518B2 - Semiconductor device test jig - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a test jig for a semiconductor device having a grounding electrode on the bottom surface of a plastic package.
[0002]
[Prior art]
In a final test of a semiconductor device (hereinafter referred to as a device) before shipping after packaging an IC chip, one of the causes for erroneously determining a non-defective device as a defective product is a contact failure. The most common cause of contact failure is the entry of dust and other debris into the test jig.
[0003]
The contamination of the test jig occurs as follows. That is, dust, such as burrs, adheres to the device during the packaging mold formation process, which is a process before the final test. In the final test, when the device is set on the test jig, the dust falls on the electrical connection electrode of the test jig.
[0004]
The test jig is generally configured to press using a spring or the like connected to a pressing member of the device in order to ensure electrical connection during test measurement. Therefore, when a device is set on the test jig, dust is sandwiched between the terminal of the device and the electrode of the test jig and is crimped to the electrical connection electrode. Debris such as burrs cannot be easily removed once they are crimped to the electrical connection electrode. In addition, since dust such as burrs is an electrically insulating material, even when another device is measured thereafter, the electrical connection becomes extremely unstable or the worst open state. For this reason, although the device itself is a non-defective product, it is determined as a defective product, and the defective rate in the first inspection of the final test becomes very bad. For example, the defective rate is 5 to 10%. turn into. However, if dust such as burrs is removed from the test jig and the final device is subjected to a final test once to several times, the defect rate will eventually be 1% or less. .
[0005]
Conventionally, various techniques have been proposed in order to solve the above problems. For example, Japanese Utility Model Laid-Open No. 4-68385 discloses a technique using a needle-like connection terminal as a structure for making it difficult for dust such as burrs to adhere to a test jig of a device.
[0006]
Further, in the test socket for semiconductor devices disclosed in Japanese Patent Application Laid-Open No. 2000-304806, when the device lead terminal comes into contact with the connection terminal of the test jig, a mechanism for sliding the connection terminal so that dust can be removed by rubbing. Is disclosed.
[0007]
Further, in the test socket pin and groove forming method disclosed in Japanese Patent Application Laid-Open No. 2000-228262, dust is attached to the terminal for connection with the lead terminal of the device by providing a lateral groove and a step and having elasticity at the tip. The structure which makes it contact in the next step even if dust adheres is disclosed.
[0008]
[Problems to be solved by the invention]
High-frequency semiconductor devices (hereinafter referred to as high-frequency devices) include power amplifiers, mixers, low-noise amplifiers, and the like that use a high-frequency transistor using Si or GaAs as a material and operate in a giga band (GHz). Among these high-frequency devices, in particular, high-frequency power amplifier ICs have a large-area ground electrode (hereinafter referred to as slug) formed on the bottom of the package in addition to the ground terminal. The slag is used for grounding and also serves for heat dissipation.
[0009]
Conventionally, a semiconductor device test jig (hereinafter referred to as a test jig) 110 shown in FIG. 17 is used during a final test of a high-frequency device. FIG. 17 is a top view and a front sectional view of a state in which a high-frequency device to be inspected is mounted on a conventional test jig. FIG. 18 is a front sectional view showing a state in which dust is sandwiched when a high-frequency device is mounted on a conventional test jig.
[0010]
The test jig 110 includes a ground pedestal 111 that contacts the slug of the high-frequency device, a connection portion 114 with a lead terminal of the high-frequency device, a pressing member 115 and a pressing spring 116 for pressing the high-frequency device. The connection portion 114 has a configuration in which a plurality of connection terminals 114a are formed on the insulating printed board 114b. The ground pedestal 111 has a flat surface that comes into contact with the slag of the high-frequency device. In addition, recesses 117a and 117b are provided between the ground pedestal 111 and the connection portion 114.
[0011]
The ground pedestal 111 and the plurality of connection terminals 114a are connected to an evaluation device (not shown). Further, the pressing member 115 and the spring 116 are not shown in the top view.
[0012]
The high-frequency device 12 includes a slug 13 that is a large-area grounding electrode (ground electrode) on the bottom surface (lower part) of the package, and a plurality of lead terminals 12a that protrude from the left and right side surfaces.
[0013]
When performing a final test of the high-frequency device 12 using the test jig 110, the high-frequency device 12 is placed so that the slug 13 of the high-frequency device 12 contacts the ground pedestal 111 as shown in FIG. Further, the lead terminal 12 a of the high-frequency device 12 is connected to the connection terminal 114 a of the test jig 110. Then, the package portion 12 b of the high-frequency device 12 is pressed by the pressing member 115 and fixed to the test jig 110.
[0014]
Since the contact area of the slag 13 of the high-frequency device 12 is larger than that of the other lead terminals 12a, there is a very high possibility that dust such as burrs will adhere to the ground pedestal 111 with which the slag 13 is contacted. Therefore, the probability of the defect rate increase at this location is very high. In particular, the slag of the high-frequency power amplifier IC is used as a terminal for electrically taking a reference potential of a direct current and a high-frequency signal, and a heat sink for releasing the heat generated in the high-frequency device as described above. Use as For this reason, in the high-frequency device 12 shown in FIG. 17, the slag 13 and the ground pedestal 111 of the test jig 110 need to be in close contact with each other.
[0015]
However, as shown in FIG. 18, dust 125 such as burrs is sandwiched between the ground pedestal 111 of the test jig 110 and the slag 13, so that the slag 13 of the high-frequency device 12 tilts and the ground pedestal 111 and When contacted, the contact area is reduced, and the characteristics of the device are deteriorated both electrically and thermally. In the worst case, it becomes completely open and it is impossible to draw out the original characteristics of the high-frequency device. As described above, even in the high-frequency device, there is a problem that due to dust such as burrs, a good result cannot be obtained in the final test and the defect rate is increased.
[0016]
Further, since the high-frequency device 12 is strongly pressed by the pressing member 115 from the upper surface during the final test, the dust that has been sandwiched is pressed against the ground base 111 of the test jig 110. Therefore, once dust is attached, there is almost no possibility of being removed from the jig during measurement.
[0017]
Generally, when dust such as burrs adheres to the test jig, it is necessary to clean it. However, cleaning should be done after measurement of a specific lot, for example, using a cotton swab dipped in an organic solvent or using tweezers. Remove the adhering dust. Thereafter, the high-frequency device determined to be defective in the lot is measured again. By repeating this operation once to several times, non-defective products that have been determined as defective products are picked up. As described above, one high-frequency device is measured a plurality of times, and there is a problem in that the processing capacity is lowered and the cost is increased.
[0018]
Unfortunately, the prior art disclosed in the above publication cannot be used as a test jig for high-frequency devices. That is, the IC mounting socket disclosed in Japanese Utility Model Laid-Open No. 4-68385 is for the lead terminal of the device, and since the contact area is small, the connection resistance is high, and the parasitic inductance component is caused by the needle shape. growing. In particular, since the parasitic inductance generated between the ground and the high frequency device adversely affects the high frequency device, not only the high frequency characteristics deteriorate, but also the amplifier oscillates. Moreover, the problem that the heat dissipation which becomes a problem especially with a high frequency device worsens generate | occur | produces.
[0019]
In addition, in the test socket for semiconductor devices disclosed in Japanese Patent Laid-Open No. 2000-304806 and the test socket pin and groove forming method disclosed in Japanese Patent Laid-Open No. 2000-228262, it can be used for connection with a slag of a high-frequency device, and stable low An electrical connection with a parasitic inductance component and good heat dissipation cannot be realized. Furthermore, since the mechanism of the test jig is complicated, the reliability is poor and the cost is increased. In particular, high-frequency power amplifiers are difficult to employ because the stability of the ground contact affects the characteristics very sensitively.
[0020]
Therefore, the present invention was created to solve the above problems, and its purpose is to improve the shape of the ground pedestal of the test jig so as to reduce electrical connection failures without reducing heat dissipation. Further, the present invention provides a test jig that improves the efficiency of inspection in the final test process by reducing the time and labor of jig cleaning.
[0021]
[Means for Solving the Problems]
The present invention has the following configuration as means for solving the above problems.
[0022]
  (1) Contact with the grounding electrode provided on the bottom of the package of the semiconductor deviceA surface with a curved surface or a cross-section with a trapezoidal shape.Number of convex parts or multiple concave partsFurther, a ground connection block having a through hole between the plurality of convex portions or at the bottom of the plurality of concave portions, and
  A base pedestal comprising a second through hole communicating with the through hole of the ground connection block, and the detachable base connection block;
  With pedestal composed byIt is characterized by that.
[0023]
  In this configuration, the semiconductor device test jigPedestal providedIs a contact surface with the grounding electrode provided on the bottom surface of the package of the semiconductor device, and has a plurality of convex portions or a plurality of concave portions.The plurality of convex portions or the plurality of concave portions are formed in a shape having a curved surface or a cross-section of which has a trapezoidal shape, and further has a through hole between the plurality of convex portions or at the bottom of the plurality of concave portions. And a base pedestal that includes a second through hole that communicates with the through hole of the ground connection block and to which the ground connection block can be attached and detached.ing. Therefore, by reducing the contact area of the contact surface of the pedestal, it is possible to reduce the probability that dust such as burrs will adhere.In addition, the contact area between the bottom surface of the semiconductor device package and the installation connection block can be secured appropriately, so that heat can be dissipated efficiently and parasitic inductance can be reduced.The In addition, it is possible to drop dust attached to the semiconductor device between the plurality of convex portions or the plurality of concave portions.Furthermore, since the dust that falls between the convex parts or the bottom surface of the concave part falls through the through hole and the second through hole, the garbage can be easily collected by installing a container below the second through hole. It becomes possible to do. Moreover, it becomes possible to reduce the frequency | count of cleaning of a base. In addition, even if the contact surface of the ground connection block has deteriorated due to wear or scratches, only the ground connection block need be replaced, and the entire semiconductor device test jig need not be recreated. The cost of the test jig can be reduced. Also, since the ground connection block can be removed for cleaning, even if cleaning is performed with air blow, dust can be easily removed from other parts of the test jig, and Efficiency can be improved.
[0032]
  (2) The protrusion has a trapezoidal shape in which a cross-sectional shape has an upper base of a length a on a contact surface side with the ground electrode and a lower base of a length b (≧ a) on a bottom side. To do.
[0033]
  In this configuration, the convex portion on the contact surface of the pedestal has a cross-sectional shape such that the contact surface side with the grounding electrode is the upper base of the length a, and the bottom side is the lower base of the length b (≧ a). It is a trapezoid. Therefore, the contact area of the contact part of the baseButIt is possible to reduce the probability that dust such as burrs adheres, reduce parasitic inductance, and improve heat dissipation.
[0034]
  (3) The recess has a trapezoidal shape with a cross-sectional shape having an upper base of a length c on the contact surface side with the ground electrode and a lower base of a length d (≦ c) on the bottom side. To do.
[0035]
  In this configuration, the recess in the contact surface of the pedestal has a cross-sectional shape in which the contact surface side with the grounding electrode is the upper base of the length c and the bottom portion side is the lower base of the length d (≦ c). It is trapezoidal. Therefore, the contact area of the contact part of the baseButAs a result, the probability that dust such as burrs adheres can be reduced, and the parasitic inductance can be reduced. Moreover, heat dissipation can be improved.
[0036]
  (Four) The convex portion has a hemispherical shape or a semi-cylindrical shape.
[0037]
In this configuration, the convex portion on the contact surface of the pedestal has a hemispherical shape or a semi-cylindrical shape. Therefore, since the convex part of the pedestal has a curved surface, even if a test jig is used to test a plurality of high-frequency devices by pressing with a pressing member over a long period of time, The contact surface is hardly worn away, and since it has a plurality of convex portions, the contact area can be secured, while maintaining low parasitic inductance and heat dissipation in the semiconductor device, It is possible to realize a structure in which dust such as is difficult to adhere to the semiconductor device test jig.
[0038]
  (Five) SaidConvexPartIsMultiple semi-cylinderslatticeConditionIs the shape placed inIt is characterized by that.
[0039]
  In this configuration, the semiconductor device test jig includes a plurality of semi-cylinders.latticeConditionTo the shape placed inConvex is formedPleaseYes. Therefore, since the convex part of the pedestal has a curved surface, a contact area can be secured, and dust such as burrs is transferred to the semiconductor device test jig while maintaining low parasitic inductance and heat dissipation in the semiconductor device. A structure that is difficult to adhere can be realized.
[0040]
DETAILED DESCRIPTION OF THE INVENTION
  Figure 1HalfIt is front sectional drawing for demonstrating the ground electrode structure of a conductor apparatus test jig | tool.. HalfA conductor device test jig (hereinafter referred to as a test jig) 10 is an improvement of the structure of the ground pedestal 111 in the conventional test jig 110.
[0041]
The test jig 10 includes a ground pedestal 11 that abuts the slug of the high-frequency device, a connection portion 15 with a lead terminal of the high-frequency device, a pressing member 16 and a pressing spring 17 for pressing the high-frequency device. The connection portion 15 has a configuration in which a plurality of connection terminals 15a are formed on the insulating printed board 15b. Further, recesses 17 a and 17 b are provided between the ground pedestal 11 and the connection portion 15.
[0042]
The ground pedestal 11 has a flat surface in contact with the slag 13 of the high-frequency device 12 and has a shape in which a plurality of convex portions 14 are formed on the contact surface. The plurality of convex portions 14 are flat at the top, have the same height, and are arranged at predetermined intervals. The ground pedestal 11 and the plurality of connection terminals 15a are connected to an evaluation apparatus (not shown) as in the conventional test jig 110. The ground pedestal 21 is made of a conductive material such as brass or aluminum.
[0043]
  When performing a final test of the high-frequency device 12 using the test jig 10, as shown in FIG. 1, the high-frequency device is arranged such that the slugs 13 of the high-frequency device 12 abut on the upper surfaces of the plurality of convex portions 14 on the ground pedestal 11. 12 is placed. Also high frequency device12The lead terminal 12 a is connected to the connection terminal 15 a of the test jig 10. Then, the upper surface of the high-frequency device 12 is pressed with a pressing member (not shown) and fixed to the semiconductor device test jig 110.
[0044]
  [No.Type 1state〕
  nextFirst formA specific shape of the ground pedestal of the test jig 10 according to the state will be described. FIG. 2 is a perspective view of a ground pedestal having a plurality of prismatic convex portions. FIG. 3 is an enlarged front view of the abutting portion of the slag of the high-frequency device and the ground base of the test jig.
[0045]
  As shown in FIG.Type 1In this state, the vertical cross-sectional shape of the convex portion on the ground base of the test jig 10 is a trapezoid. And its specificExampleAs shown in FIG. 2, the ground base 21 shown in FIG. 2 is provided with a plurality of protrusions 22 by providing a plurality of grooves 23 on the contact surface with the slag 13 of the high-frequency device 12.
[0046]
The convex portion 22 is a prism having a vertical cross section that is trapezoidal with the contact surface side being the upper base of the length a and the bottom side being the lower base of the length b (≧ a). Further, the plurality of convex portions 22 are arranged in parallel at predetermined intervals.
[0047]
  By making the shape of the convex portion 22 as described above, the following effects are obtained. That is, the cross section is trapezoidal, and the length of the contact surface with the slag (the length a of the upper base) can be madeOnlyBy shortening and reducing the contact area of the contact surface of the ground pedestal, the probability that dust such as burrs will adhere can be reduced. In order to reduce parasitic inductance as much as possible and to improve heat dissipation, the convex portion 22 preferably has the above shape.
[0048]
As shown in FIG. 3, the groove 23 is provided for dropping dust 24 such as burrs attached to the high-frequency device during the final test.
[0049]
  Garbage 24 such as burrs brought into the high frequency device 12 from the process before the final test is transferred to the test jig 10.12At the time of mounting, most of them drop into a groove (concave portion) 23 between the convex portion 22 provided on the ground base 21 of the test jig 10 and another convex portion 22. Therefore, dust 24 is very less likely to be sandwiched between the contact surface of the ground pedestal 21 of the test jig 10 and the slag 13 of the high-frequency device 12, and the defect rate increases due to poor contact during testing. Can be solved.
[0050]
  Conventionally, the defect rate at the time of the first lot inspection was a high value of 5 to 10%.Type 1By applying the state to the final test, the final final defective rate was 1% or less in one inspection.
[0051]
In addition, since the dust that has fallen into the groove 23 is not pressure-bonded at the time of inspection, it can be easily removed and cleaned by air blow or the like, and a smooth transition can be made to the device test measurement in a new lot.
[0052]
Furthermore, since it is such a ground pedestal shape, it is possible to appropriately ensure the contact area between the slag surface of the high-frequency device and the contact surface of the jig ground pedestal, so that an electrically stable connection can be obtained, and Thus, the advantage that the heat transferred from the high-frequency device to the jig via the slag can be efficiently radiated can be maintained.
[0053]
  Next, other convex shape deformationExampleWill be described with reference to FIG. FIG. 4 is a perspective view of a ground pedestal having a plurality of protruding convex portions. The ground pedestal 31 shown in FIG. 4 has a shape in which a plurality of protruding protrusions 32 are formed by providing lattice-like grooves 33 on the contact surface with the slag of the high-frequency device.
[0054]
The convex portion 32 has a truncated quadrangular pyramid in which the shape of the bottom surface is a square with a side length b and the top surface (abutment surface) is a square with a side length a (≦ b). A pyramid). Therefore, the cross-sectional shape of the convex portion 32 is a trapezoid in which the contact surface side is the upper bottom of the length a and the bottom side is the lower bottom of the length b (≧ a). The plurality of convex portions 32 are provided at equal intervals with the lattice-like grooves 33 as described above.
[0055]
  Next, another modification of the convex shapeExampleWill be described with reference to FIG. FIG. 5 is a perspective view of a ground pedestal having grid-like convex portions. The ground pedestal 41 shown in FIG. 5 has a lattice-like convex portion 42 formed by providing a plurality of truncated quadrangular pyramid-shaped concave portions 43 on the contact surface with the slag of the high-frequency device.
[0056]
The concave portion 43 has a truncated quadrangular pyramid (pyramid) whose shape is parallel to a bottom surface that is a square with a side length d and a top surface (abutment surface) that is a square with a side length c (≧ d). Stand). Therefore, the cross-sectional shape of the recess 43 is a trapezoid in which the contact surface side is the upper bottom of the length c and the bottom side is the lower bottom of the length d (≦ c). As described above, the plurality of concave portions 43 are provided at equal intervals with the lattice-shaped convex portions 42 interposed therebetween.
[0057]
In addition, the shape of the contact surface in the ground base of the test jig 10 is not limited to the shape of the convex portion and the concave portion shown in FIGS. 2, 4, and 5, and various modifications can be considered. For example, the shape on the contact surface side of the recess shown in FIG. 5 may be a triangle, a hexagon, a circle, or the like.
[0058]
  [No.Type 2state〕
  next, Type 2The ground pedestal shape of the test jig according to the state will be described. FIG., Type 2It is front sectional drawing which showed the ground pedestal shape of the test jig which concerns on a state. FIG. 7 is a perspective view of a ground pedestal having a plurality of semi-cylindrical convex portions. FIG. 8 is a perspective view of a ground pedestal having a plurality of hemispherical convex portions. FIG. 9 is an enlarged front view of the abutting portion of the slag of the high-frequency device and the ground base of the test jig.
[0059]
  As shown in FIG.Type 2In this state, the vertical cross-sectional shape of the convex portion on the ground base of the test jig 10 is a semicircle. As a result,Type 1High-frequency devices by reducing the number of flat surfaces compared to the state12This makes it possible to further reduce the occurrence of problems caused by inserting dust such as burrs between the slag 13 and the ground pedestal.
[0060]
  Specific example of the convex portion shown in FIG.ExampleThe ground pedestal 61 shown in FIG. 7 is provided with a plurality of grooves 63 on the contact surface with the slag of the high-frequency device, so that the vertical cross section has a semicircular shape and the horizontal cross section has a bottom surface. A plurality of convex portions 62 that are semi-cylindrical are formed. In addition, since the part which is not the slag 13 in the bottom part of the high frequency device 12 contact | abuts at the both ends of the ground base 61, it is the structure which provides the square pillar 65 with a trapezoidal cross section, and hold | maintains the high frequency device 12.
[0061]
  Next, other than deforming the convex shapeExampleWill be described with reference to FIG. The ground pedestal 71 shown in FIG. 8 has a shape in which a plurality of hemispherical convex portions 72 having a bottom surface in cross section are formed by providing a lattice-like groove 73 on the contact surface with the slag of the high-frequency device. is there. In addition, since the part which is not the slag 13 in the bottom part of the high frequency device 12 contact | abuts at the both ends in the contact surface of the ground base 71, the vertical cross section of the trapezoidal prism 75 is provided, and the high frequency device 12 is hold | maintained It is a structure to do.
[0062]
  FirstType 2Also in stateType 1The same effect as the state can be obtained. That is, as shown in FIG. 9, dust 64 such as burrs brought into the high-frequency device 12 from the process before the final test is transferred to the test jig 10.12At the time of mounting, it falls into the groove 63 provided on the ground base 21 of the test jig 10. Therefore, dust 24 is very less likely to be sandwiched between the contact surface of the ground pedestal 21 of the test jig 10 and the slag 13 of the high-frequency device 12, and the defect rate increases due to poor contact during testing. Can be solved.
[0063]
Further, since the dust that has fallen into the groove 63 is not pressure-bonded at the time of inspection, it can be easily removed and cleaned by air blow or the like, and can be smoothly transferred to the device test measurement in a new lot.
[0064]
Furthermore, since the test jig 10 includes the ground pedestal having such a shape, the contact area between the slag 13 of the high-frequency device 12 and the contact surface of the ground pedestal in the test jig 10 can be appropriately secured. In addition to obtaining an electrically stable connection, as described above, it is also possible to maintain the advantage that heat transferred from the high-frequency device to the jig via the slag can be efficiently dissipated.
[0065]
  In addition, the secondType 2In the state, since the convex portion of the ground pedestal has a curved surface, even if the test jig 10 is subjected to a test by pressing a plurality of high-frequency devices 12 with a pressing member not shown in the drawing over a long period of time, Compared with the needle-like shape of the prior art, the contact surface of the high-frequency device 12 with the slag 13 is hardly worn away. Moreover, since a plurality of convex portions are provided, a contact area can be secured. Therefore, it is possible to realize a structure in which dust such as burrs is difficult to adhere while maintaining the most important low parasitic inductance and heat dissipation in the high-frequency device 12.
[0066]
In addition, the shape of the contact surface in the ground base of the test jig 10 is not limited to the shape of the convex portion shown in FIGS. 7 and 8, and various modifications can be considered. For example, although not shown in the figure, a convex shape in which the cross-sectional shape in the vertical direction of the grid-like convex portion shown in FIG.
[0067]
  The firstType 1State and numberType 2The ground pedestal shown in the state can be formed by machining or casting a metal block.
[0068]
  [No.Type 3state〕
  Next, the first of the present inventionType 3The ground pedestal structure of the test jig according to the state will be described. FIG., Third formIt is front sectional drawing which showed the ground pedestal structure of the test jig which concerns on a state. FIG.Type 3It is the perspective view and top view of a ground pedestal in the semiconductor test jig of a state.
[0069]
As shown in FIGS. 10 and 11, a plurality of holes or through holes 96 having a predetermined depth are provided on the bottom surface of the concave portion of the ground pedestal or the bottom surface of the groove provided between the plurality of convex portions. As a result, the dust that has fallen into the recesses (grooves) 94 can be further dropped into the through holes 96, so that accumulation of dust in the recesses can be suppressed. Further, by providing a cavity 97 inside the ground pedestal and installing a container or the like for collecting the dust in the cavity 97, it is possible to collect the dust from the lower part of the ground pedestal 93.
[0070]
  Note that the vertical sectional shape shown in FIG. 11 is not limited to a trapezoidal ground pedestal.Type 1State and numberType 2The shape illustrated in the state and other shapes are applicable.
[0071]
  In FIG. 11, a plurality of through holes 104 are provided on the bottom surface of the groove 103.ExampleHowever, the present invention is not limited to this, and for example, a through hole having an opening in a substantially entire bottom surface of the groove 103 may be provided.
[0072]
  [No.Type 4state〕
  next, 4th formThe shape of the ground pedestal of the test jig according to the state will be described. FIG.Type 4It is front sectional drawing for demonstrating the structure of the test jig of a state. FIG.Type 4It is the perspective view which showed the structure of the ground pedestal in the test jig of a state. FIG.Type 4It is the perspective view which showed the structure of another ground pedestal in the test jig of a state.
[0073]
As shown in FIG. 12, the ground pedestal 131 includes a base pedestal 132 and a block 133 which is a ground connection block.
[0074]
The base pedestal 132 has a flat upper portion, and the blocks 133 are detachably loaded thereon. The upper part of the block 133 is a contact surface with the slag 13 of the high-frequency device 12 and includes a plurality of convex portions 14 or a plurality of concave portions (grooves). The lower portion (bottom surface) of the block 133 is a plane whose area is substantially equal to the upper surface of the base pedestal 132, and is in close contact with the upper surface of the base pedestal 132 when the block 133 is mounted on the base pedestal.
[0075]
  On the ground pedestal 21 shown in FIG.Main formWhen the state is applied, as shown in FIG. 13, a configuration like a ground pedestal 141 composed of a base pedestal 142 and a block 143 is obtained. In addition, the ground pedestal 41 shown in FIG.Main formWhen the state is applied, as shown in FIG. 14, a configuration like a ground pedestal 151 including a base pedestal 152 and a block 153 is obtained.
[0076]
The block material may be a metal block made of a conductive material such as brass or aluminum. Further, in the case of the grid-like block 153 shown in FIG. 14, it can be easily formed by punching a metal sheet having a predetermined thickness, and the manufacturing cost can be reduced. In this case, the length a (upper bottom) on the upper surface side of the convex portion 154 and the length b (lower bottom) on the bottom surface side of the convex portion 154 are equal. However, since the contact area of the convex portion 154 with respect to the slag 13 is large, no problem occurs.
[0077]
  4th formIn state,Type 1State and numberType 2The same effect as the state can be obtained. In addition, even if a test is performed by pressing a plurality of high-frequency devices with a pressing member over a long period of time in the test jig 10, the slag of the high-frequency device 12 is compared with the conventional needle-like shape. Even if the contact surface with 13 deteriorates due to wear or scratches, the cost of the test jig 10 can be reduced because only the block needs to be replaced.
[0078]
Furthermore, when removing the dust that has fallen into the groove 23, the block can be removed and the cleaning can be performed. Therefore, even if cleaning is performed by air blow or the like, the dust may adhere to other parts of the test jig 10. It can be easily cleaned, and it can make a smooth transition to device test measurement in a new lot.
[0079]
  As the shape of the contact surface,Type 1State and numberType 2The shape described in the embodiment and other shapes are applicable.
[0080]
  [No.Type 5state〕
  next, Form 5The shape of the ground pedestal of the test jig according to the state will be described. FIG.Type 5It is front sectional drawing for demonstrating the structure of the test jig of a state. FIG.Type 5It is the perspective view which showed the external appearance of the ground pedestal in the test jig of a state.
[0081]
  FirstType 5The ground pedestal of the test jigType 4This is a configuration in which a through-hole into which dust is dropped is provided in the block and the base pedestal constituting the ground pedestal. As shown in FIG. 15, the ground pedestal 161 includes a base pedestal 162 and a block 163 that is a ground connection block.
[0082]
The base pedestal 152 has a flat upper portion, and the block 163 can be placed thereon. The upper portion of the block 163 is a contact surface with the slag 13 of the high-frequency device 12 and includes a plurality of convex portions 14 or a plurality of concave portions (grooves). The lower portion (bottom surface) of the block 163 is a plane whose outer circumference is substantially equal to the outer circumference of the upper surface of the base pedestal 162. When the block 163 is mounted on the base pedestal, the upper surface of the base pedestal 162 is In close contact. Further, the block 163 includes a plurality of through holes 166 on the bottom surface of the recess or groove 164.
[0083]
Further, the base pedestal 152 includes one or more through holes on the upper surface. For example, when the upper surface of the base pedestal 152 is at the position indicated by A-A ′ in FIG. 15, the base pedestal 152 includes a plurality of through holes 168 on the upper surface and a cavity 167 on the inner side. When the block 163 is placed on the base pedestal 162, the lower surface side openings of the plurality of through holes 168 provided in the block 163 and the upper surface side openings of the plurality of through holes 168 provided in the base pedestal 162 are respectively coincident. The through hole 166 and the through hole 168 communicate with each other.
[0084]
In addition, when the upper surface of the base pedestal 152 is at the position indicated by B-B ′ in FIG. 15, the base pedestal 152 includes a cavity 167 that is a through hole having one opening on the upper surface side. When the block 163 is placed on the base pedestal 162, the upper surface opening of the base pedestal 162 does not seal the lower surface side opening of each through hole 166 of the block 163, and communicates with each opening.
[0085]
  Accordingly, the dust that has fallen into the recess (groove) 164 passes through the through hole 166 or through the through hole 166 and the through hole 168 and falls into the cavity 167. By installing in 167, the ground pedestal161It becomes possible to collect trash from the lower part.
[0086]
  In the ground pedestal 141 shown in FIG.Main formWhen the state is applied, as shown in FIG. 16, a configuration like a ground base 171 including a base base 172 and a block 173 is obtained.
[0087]
  FirstType 5In stateType 3In addition to the effects obtained in theType 4The effect obtained in the state can be obtained.
[0088]
  In addition,Main formThe shape of the contact surface of the block in the state isType 1State and numberType 2The shape described in the embodiment and other shapes are applicable.
[0089]
15 shows a configuration in which both the base pedestal 162 and the block 163 are provided with through-holes. However, only a bottom surface of a concave portion in the block 163 or a bottom surface of a groove provided between a plurality of convex portions is shown. A structure having a plurality of holes having a depth of may be used. In this case, dust can be accumulated in a hole having a predetermined depth, and the number of cleanings in the test jig 10 can be reduced. Further, the block 163 can be removed and easily cleaned using an air blow or the like, and the cleaning efficiency is improved.
[0090]
  By performing the final test of the high-frequency device using the test jig having the ground pedestal structure described above, it is sandwiched between the device and the structure by dropping burrs and other dust attached to the high-frequency device into the recess. Is greatly reduced. Therefore, an increase in the defect rate during the final test can be avoided, and the number of high-frequency devices that need to be remeasured can be reduced. In addition, by reducing the frequency of cleaning the test jig and simplifying the cleaning work, the time and cost for the final test can be greatly reduced. further,Explained aboveSince a test jig incorporating a ground pedestal structure is easy and the structure is simple, it is possible to provide a low-cost and highly reliable test jig and improve test efficiency.
[0091]
【The invention's effect】
According to the present invention, the following effects can be obtained.
[0092]
  (1) Semiconductor device test jig, StandBy reducing the contact area of the contact surface of the seat, the probability that dust such as burrs will adhere can be reduced.Since the contact area between the bottom surface of the semiconductor device package and the installation connection block can be appropriately secured, heat can be efficiently dissipated and parasitic inductance can be reduced.The Further, dust attached to the semiconductor device can be dropped between the plurality of convex portions or between the plurality of concave portions.Furthermore, since the dust that falls between the convex parts or the bottom surface of the concave part falls through the through hole and the second through hole, the garbage can be easily collected by installing a container below the second through hole. can do. Moreover, the frequency | count of cleaning of a base can be reduced. In addition, even if the contact surface of the ground connection block deteriorates due to wear or scratches, only the ground connection block needs to be replaced, and the entire semiconductor device test jig does not have to be created again. Test jig costs can be reduced. Also, since the ground connection block can be removed for cleaning, even if cleaning is performed with air blow, dust can be easily removed from other parts of the test jig, and Efficiency can be improved.
[0097]
  (2) The convex part on the contact surface of the pedestal has a trapezoidal cross-sectional shape with the contact surface side with the grounding electrode being the upper base of the length a and the bottom side being the lower base of the length b (≧ a). Therefore, the contact area of the contact part of the baseButIt is possible to reduce the probability that dust such as burrs adheres, reduce parasitic inductance, and improve heat dissipation.
[0098]
  (3) The recess in the contact surface of the base has a trapezoidal cross-sectional shape with the contact surface side with the grounding electrode being the upper base of the length c and the bottom side being the lower base of the length d (≦ c). , Contact area of pedestal contact partButAs a result, the probability that dust such as burrs adheres can be reduced, and the parasitic inductance can be reduced. Moreover, heat dissipation can be improved.
[0099]
  (Four) Since the convex portion on the contact surface of the pedestal has a hemispherical shape or a semi-cylindrical shape, the convex portion of the pedestal has a curved surface. Even when a test is performed by pressing a high-frequency device with a pressing member, the contact surface with the grounding electrode of the semiconductor device is hardly worn out and has a plurality of convex portions. A contact area can be ensured, and a structure in which dust such as burrs is difficult to adhere to the semiconductor device test jig while maintaining low parasitic inductance and heat dissipation in the semiconductor device can be realized.
[0100]
  (Five) For semiconductor device test jigs, multiple semi-cylinders are used.latticeConditionTo the shape placed inConvex is formedPleaseTherefore, the convex part of the pedestal has a curved surface, a contact area can be ensured, and dust such as burrs is transferred to the semiconductor device test jig while maintaining low parasitic inductance and heat dissipation in the semiconductor device. A structure that is difficult to adhere can be realized.
[Brief description of the drawings]
[Figure 1]HalfIt is front sectional drawing for demonstrating the ground electrode structure of a conductor apparatus test jig | tool.
FIG. 2 is a perspective view of a ground pedestal having a plurality of prismatic convex portions.
FIG. 3 is an enlarged front view of a contact portion of a slag of a high-frequency device and a ground base of a test jig.
FIG. 4 is a perspective view of a ground pedestal having a plurality of protruding convex portions.
FIG. 5 is a perspective view of a ground pedestal having grid-like convex portions.
[Fig. 6]Second formIt is front sectional drawing which showed the ground pedestal shape of the test jig which concerns on a state.
FIG. 7 is a perspective view of a ground pedestal having a plurality of semi-cylindrical convex portions.
FIG. 8 is a perspective view of a ground pedestal having a plurality of hemispherical convex portions.
FIG. 9 is an enlarged front view of a contact portion of a slag of a high-frequency device and a ground base of a test jig.
FIG. 10Third formIt is front sectional drawing which showed the ground pedestal structure of the test jig which concerns on a state.
FIG. 11Type 3It is the perspective view and top view of a ground pedestal in the semiconductor test jig of a state.
FIG. 12Type 4It is front sectional drawing for demonstrating the structure of the test jig of a state.
FIG. 13Type 4It is the perspective view which showed the structure of the ground pedestal in the test jig of a state.
FIG. 14Type 4It is the perspective view which showed the structure of another ground pedestal in the test jig of a state.
FIG. 15Type 5It is front sectional drawing for demonstrating the structure of the test jig of a state.
FIG. 16Type 5It is the perspective view which showed the external appearance of the ground pedestal in the test jig of a state.
FIGS. 17A and 17B are a top view and a front sectional view showing a state in which a high-frequency device to be inspected is mounted on a conventional test jig. FIGS.
FIG. 18 is a front sectional view showing a state in which dust is sandwiched when a high-frequency device is mounted on a conventional test jig.
[Explanation of symbols]
10-Semiconductor device test jig
12-Semiconductor device
13-Electrode for grounding (slag)
14-recess
131-pedestal
132-Base pedestal
133-Block for ground connection

Claims (5)

The contact surface between the ground electrode provided on the bottom of the package of the semiconductor device, the convex portions or a plurality of recesses of multiple shape or cross section is trapezoidal having a curved surface is formed, further, the plurality of convex A block for ground connection provided with a through hole between the portions or at the bottom of the plurality of recesses;
A base pedestal comprising a second through hole communicating with the through hole of the ground connection block, and the detachable base connection block;
A semiconductor device test jig , comprising: a pedestal configured by: The convex portion has a trapezoidal shape in which a cross-sectional shape has an upper base of a length a on a contact surface side with the ground electrode and a lower base of a length b (≧ a) on a bottom side. The semiconductor device test jig according to claim 1 . The recess has a trapezoidal shape with a cross-sectional shape having an upper base of a length c on the contact surface side with the ground electrode and a lower base of a length d (≦ c) on the bottom side. The semiconductor device test jig according to claim 1 . The semiconductor device test jig according to claim 1 , wherein the convex portion has a hemispherical shape or a semi-cylindrical shape. The semiconductor device test jig according to claim 1 , wherein the convex portion has a shape in which a plurality of semi-cylindrical columns are arranged in a lattice shape.

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