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JP3657814B2 - Speaker - Google Patents

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Publication number
JP3657814B2
JP3657814B2 JP15533099A JP15533099A JP3657814B2 JP 3657814 B2 JP3657814 B2 JP 3657814B2 JP 15533099 A JP15533099 A JP 15533099A JP 15533099 A JP15533099 A JP 15533099A JP 3657814 B2 JP3657814 B2 JP 3657814B2
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JP
Japan
Prior art keywords
magnetic circuit
speaker
diaphragm
opening
circuit cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP15533099A
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Japanese (ja)
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JP2000350287A (en
Inventor
直樹 島村
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Alpine Electronics Inc
Original Assignee
Alpine Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpine Electronics Inc filed Critical Alpine Electronics Inc
Priority to JP15533099A priority Critical patent/JP3657814B2/en
Publication of JP2000350287A publication Critical patent/JP2000350287A/en
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Description

【0001】
【発明の属する技術分野】
本発明は車載用スピーカ等のダイナミック型のスピーカに係り、特に、小型の磁気回路を採用した軽量化スピーカの放熱構造に関する。
【0002】
【従来の技術】
車載用スピーカなどにおいては、軽量化を図るために樹脂フレームを採用することが多いが、近年、さらなる軽量化を促進するために小型の磁気回路を採用したスピーカが普及しつつある。
【0003】
すなわち、マグネットとヨークを組み合わせて構成される磁気回路は、大型のものではかなりの重量物になってしまうので、この磁気回路を小型化するとスピーカ全体の重量が大幅に低減する。また、磁気回路が小さいと、磁気回路を収納・保持するアルミニウム等の非磁性材からなる磁気回路カバーも小さくできるので、スピーカの軽量化を促進するうえで極めて有利となる。
【0004】
【発明が解決しようとする課題】
ところで、前述したように、小型の磁気回路を採用して軽量化を図ったスピーカでは、磁気回路および磁気回路カバーの表面積が大幅に減少している。そのため、かかる従来の軽量化スピーカは、通電時にボイスコイルで発生して磁気回路へ伝わる熱が外部へ放出されにくく、スピーカの内部の温度が不所望に上昇しやすいという問題点があった。
【0005】
【課題を解決するための手段】
本発明は、振動板の振動時に発生する背圧を利用して、磁気回路カバーとフレームとの間を通ってスピーカの内外で空気が円滑に流通できるようにした。このようにすると、通電時には振動板の背圧により、スピーカの内外の空気が磁気回路カバーの外表面に沿ってよどみなく移動するので、この空気の流れが磁気回路から磁気回路カバーへと伝導される熱を次々と奪い取っていく。したがって、小型の磁気回路を採用しても、かかる空冷作用により放熱効果を高めることができ、スピーカの軽量化促進と温度上昇抑制とを両立させることが可能となる。
【0006】
【発明の実施の形態】
本発明のスピーカでは、ボイスコイルと、このボイスコイルが配置されるギャップを有する磁気回路と、この磁気回路を収納・保持する磁気回路カバーと、内周部が前記ボイスコイルに連結されて該ボイスコイルへの通電時に駆動される振動板と、前記磁気回路カバーと連結されて前記振動板の背面側を包囲し該振動板の外周部を支持するフレームと、前記振動板の内周部を支持するダンパとを備えたスピーカにおいて、前記磁気回路カバーと前記フレームとの接合部近傍に開口部を設け、この開口部と前記振動板の背面側空間とを連通させる構成とした。
【0007】
このように構成されるスピーカは、通電時に振動板が振動すると、その背面側空間に振動板の背圧が作用し、前記開口部を介してスピーカの内外の空気の流通が盛んに行われるので、磁気回路カバーの外表面は通電時に常に新鮮な空気にさらされることとなる。それゆえ、通電時にボイスコイルで発生し磁気回路を介して磁気回路カバーへ伝わる熱が、前記開口部を介して出入りする空気の空冷作用を受けて放出されやすくなり、高い放熱効果が期待できる。
【0008】
上記構成において、磁気回路カバーにフレームの内側でダンパの外周部を支持する大径部を突設し、この大径部とフレームの内壁面との間を前記開口部に連通する空気流通路となせば、この空気流通路が所謂オリフィスとして作用し、開口部と振動板の背面側空間との間で極めて円滑に空気を流通させることができると共に、磁気回路カバーの大径部が放熱部位となって放熱面積が増えるので、放熱効果をより一層高めることができる。
【0009】
【実施例】
実施例について図面を参照して説明すると、図1は本発明の一実施例に係るスピーカの背面図、図2は図1のA−O−B線に沿う断面図である。
【0010】
図1,2に示すスピーカは、小型の磁気回路を採用して軽量化を図った車載用スピーカである。このスピーカは、アルミニウム等の熱電導率の高い非磁性材からなる磁気回路カバー1と、ヨーク2a,2bおよびマグネット2cからなる磁気回路2と、ABS樹脂等からなる樹脂フレーム3と、コーン紙あるいは合成樹脂等からなる振動板4と、円筒状のボビン5の外周面に巻装されたボイスコイル6と、振動板4の内周部を振動を許容しつつ支持するダンパ7とによって概略構成されており、図示せぬリード線を介してボイスコイル6に音声電流が通電されるようになっている。
【0011】
磁気回路カバー1の上部に略円環状の大径部1aが突設してあり、この大径部1aにダンパ7の外周部が接合されている。この磁気回路カバー1は磁気回路2を収納・保持しており、磁気回路2に形成されているギャップG内にボイスコイル6が配置されている。樹脂フレーム3は振動板4を包囲するすり鉢形状の外観を呈し、その底部中央を磁気回路カバー1が貫通しており、樹脂フレーム3の背面に形成されている4本のリブ3aの後端部が磁気回路カバー1と連結されている。ただし、各リブ3aの後端部どうしの間には、磁気回路カバー1の外周面に沿って(外表面に接した状態で)4か所に開口部8が設けてあり、これらの開口部8は磁気回路カバー1と樹脂フレーム3との接合部近傍に位置している。振動板4は、その内周部がボビン5を介してボイスコイル6に連結されていると共に、外周部が変形接合部9を介して樹脂フレーム3に支持されている。また、図2に示すように、磁気回路カバー1の大径部1aと樹脂フレーム3の内壁面との間には空気流通路10が画成されており、この空気流通路10を介して各開口部8と振動板4の背面側空間とが連通されている。
【0012】
このように概略構成されたスピーカは、図示せぬリード線を介してボイスコイル6に音声電流が通電されると、電磁力によりボイスコイル6が振動するので、ボビン5を介して振動板4が駆動されて振動し、ラジオ音声やCD再生音声などの拡声が行えるようになっている。また、通電時に振動板4が図2における上下方向に振動すると、その背面側空間に振動板4の背圧が作用し、空気流通路10や開口部8を介してスピーカの内外の空気の流通が盛んに行われるので、通電時に磁気回路カバー1の外表面は常に新鮮な空気にさらされることとなる。そのため、このスピーカは、通電時にボイスコイル6で発生し磁気回路2を介して磁気回路カバー1へ伝わる熱(ジュール熱)が、開口部8を介して出入りする空気の空冷作用を受けて外部へ放出されやすくなっている。すなわち、軽量化を促進するため小型の磁気回路2を採用すると、放熱面積の減少によりスピーカ内部が高温になりやすいが、このスピーカでは振動板4の背圧を利用して空気流がよどみなく開口部8を通過するようにしてあるので、その空冷作用により磁気回路カバー1の外表面からの放熱量が増大する。
【0013】
しかも、このスピーカは、磁気回路カバー1に大径部1aを突設してダンパ7の外周部を接合する構成にしてあるので、この大径部1aと樹脂フレーム3の内壁面との間が自ずと空気流通路10になり、振動板4の背圧をダンパ7に遮蔽されることなく直接開口部8に向けて作用させやすい構造になっている。すなわち、空気流通路10および開口部8により所謂オリフィスが形成され、開口部8からスピーカ外部へ放出される空気の流速が加速されるため、磁気回路カバー1の外表面の冷却作用が一層向上されるものとなっている。また、このような大径部1aを設けたことにより、磁気回路カバー1の放熱面積も増大するので、このスピーカは内部の温度上昇を抑制する放熱効果が高く、それゆえ磁気回路2の小型軽量化を図りつつ高信頼性が確保されている。
【0014】
なお、上述した実施例では、磁気回路カバー1の大径部1aと樹脂フレーム3との間に設けた空気流通路10を介して、振動板4の背面側空間と開口部8とを連通させているが、本発明はこれに限定されるものではない。例えば、樹脂フレーム3の内壁に突設した環状支持部にダンパ7の外周部を接合する構成の場合、この環状支持部の複数箇所に透孔を設けておけば、これらの透孔を介して振動板4の背面側空間と開口部8とを連通させることができるので、同様の放熱効果が期待できる。
【0015】
【発明の効果】
本発明は以上説明したような形態で実施され、以下に記載されるような効果を奏する。
【0016】
磁気回路カバーとフレームとの接合部近傍に開口部を設け、この開口部と振動板の背面側空間とを連通させる構成としたので、通電時に振動板が振動すると、その背面側空間に振動板の背圧が作用し、前記開口部を介してスピーカの内外の空気の流通が盛んに行われる。したがって、磁気回路カバーの外表面は通電時に常に新鮮な空気にさらされることになり、通電時にボイスコイルで発生し磁気回路を介して磁気回路カバーへ伝わる熱が、前記開口部を介して出入りする空気の空冷作用を受けて放出されやすくなる。そのため、小型の磁気回路を採用しても、かかる空冷作用により放熱効果を高めることができて、スピーカの軽量化促進と温度上昇抑制とを両立させることができる。
【0017】
また、磁気回路カバーにダンパの外周部を支持する大径部を突設し、この大径部とフレームの内壁面との間を前記開口部に連通する空気流通路となせば、この開口部と振動板の背面側空間との間で極めて円滑に空気を流通させることができると共に、磁気回路カバーの大径部が放熱部位となって放熱面積が増えるので、放熱効果をより一層高めることができる。
【図面の簡単な説明】
【図1】本発明の一実施例に係るスピーカの背面図である。
【図2】図1のA−O−B線に沿う断面図である。
【符号の説明】
1 磁気回路カバー
1a 大径部
2 磁気回路
3 樹脂フレーム
3a リブ
4 振動板
5 ボビン
6 ボイスコイル
7 ダンパ
8 開口部
10 空気流通路
G ギャップ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a dynamic speaker such as a vehicle-mounted speaker, and more particularly to a heat dissipation structure for a lightweight speaker employing a small magnetic circuit.
[0002]
[Prior art]
In a vehicle-mounted speaker or the like, a resin frame is often used in order to reduce the weight, but in recent years, a speaker using a small magnetic circuit to promote further weight reduction is becoming widespread.
[0003]
That is, since a magnetic circuit configured by combining a magnet and a yoke becomes a heavy product when it is large, the weight of the entire speaker is greatly reduced when the magnetic circuit is downsized. In addition, if the magnetic circuit is small, the magnetic circuit cover made of a nonmagnetic material such as aluminum that houses and holds the magnetic circuit can also be made small, which is extremely advantageous in promoting weight reduction of the speaker.
[0004]
[Problems to be solved by the invention]
By the way, as described above, the surface area of the magnetic circuit and the magnetic circuit cover is greatly reduced in the speaker that employs a small magnetic circuit to reduce the weight. For this reason, the conventional lightweight speaker has a problem that the heat generated in the voice coil when it is energized and transmitted to the magnetic circuit is not easily released to the outside, and the temperature inside the speaker easily rises undesirably.
[0005]
[Means for Solving the Problems]
In the present invention, the back pressure generated when the diaphragm is vibrated is used so that air can smoothly flow between the magnetic circuit cover and the frame inside and outside the speaker. By doing so, the air inside and outside the speaker moves smoothly along the outer surface of the magnetic circuit cover due to the back pressure of the diaphragm when energized, and this air flow is conducted from the magnetic circuit to the magnetic circuit cover. Take away the heat. Therefore, even if a small magnetic circuit is adopted, the heat dissipation effect can be enhanced by the air cooling action, and it is possible to achieve both the promotion of weight reduction of the speaker and the suppression of the temperature rise.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
In the speaker of the present invention, a voice coil, a magnetic circuit having a gap in which the voice coil is disposed, a magnetic circuit cover for housing and holding the magnetic circuit, and an inner peripheral portion are connected to the voice coil, and the voice coil A diaphragm that is driven when the coil is energized, a frame that is connected to the magnetic circuit cover and surrounds the back side of the diaphragm and supports the outer periphery of the diaphragm, and supports the inner periphery of the diaphragm In the loudspeaker including the damper, an opening is provided in the vicinity of the joint between the magnetic circuit cover and the frame, and the opening and the back side space of the diaphragm are communicated.
[0007]
In the speaker configured as described above, when the diaphragm vibrates when energized, the back pressure of the diaphragm acts on the back side space, and air circulation inside and outside the speaker is actively performed through the opening. The outer surface of the magnetic circuit cover is always exposed to fresh air when energized. Therefore, the heat generated by the voice coil when energized and transmitted to the magnetic circuit cover through the magnetic circuit is easily released by the air cooling action of the air entering and exiting through the opening, and a high heat dissipation effect can be expected.
[0008]
In the above configuration, the magnetic circuit cover has a large-diameter portion that supports the outer peripheral portion of the damper inside the frame, and an air flow passage that communicates between the large-diameter portion and the inner wall surface of the frame with the opening. If this is the case, this air flow passage acts as a so-called orifice, allowing air to flow extremely smoothly between the opening and the space on the back side of the diaphragm, and the large-diameter portion of the magnetic circuit cover to Since the heat dissipation area increases, the heat dissipation effect can be further enhanced.
[0009]
【Example】
The embodiment will be described with reference to the drawings. FIG. 1 is a rear view of a speaker according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A-O-B in FIG.
[0010]
The speaker shown in FIGS. 1 and 2 is a vehicle-mounted speaker that employs a small magnetic circuit to reduce the weight. This speaker includes a magnetic circuit cover 1 made of a nonmagnetic material having a high thermal conductivity such as aluminum, a magnetic circuit 2 made of yokes 2a, 2b and a magnet 2c, a resin frame 3 made of ABS resin, etc., and cone paper or A diaphragm 4 made of synthetic resin, a voice coil 6 wound around an outer peripheral surface of a cylindrical bobbin 5, and a damper 7 that supports the inner peripheral portion of the diaphragm 4 while allowing vibrations. A voice current is supplied to the voice coil 6 via a lead wire (not shown).
[0011]
A substantially annular large-diameter portion 1a projects from the top of the magnetic circuit cover 1, and the outer peripheral portion of the damper 7 is joined to the large-diameter portion 1a. The magnetic circuit cover 1 houses and holds a magnetic circuit 2, and a voice coil 6 is disposed in a gap G formed in the magnetic circuit 2. The resin frame 3 has a mortar-like appearance surrounding the diaphragm 4, the magnetic circuit cover 1 passes through the center of the bottom, and the rear ends of the four ribs 3 a formed on the back surface of the resin frame 3. Is connected to the magnetic circuit cover 1. However, openings 8 are provided at four positions along the outer peripheral surface of the magnetic circuit cover 1 (in contact with the outer surface) between the rear ends of the ribs 3a. 8 is located in the vicinity of the joint between the magnetic circuit cover 1 and the resin frame 3. The diaphragm 4 has an inner peripheral portion connected to the voice coil 6 via a bobbin 5, and an outer peripheral portion supported by the resin frame 3 via a deformed joint 9. As shown in FIG. 2, an air flow passage 10 is defined between the large-diameter portion 1 a of the magnetic circuit cover 1 and the inner wall surface of the resin frame 3. The opening 8 communicates with the space on the back side of the diaphragm 4.
[0012]
In the speaker schematically configured in this manner, when a voice current is applied to the voice coil 6 via a lead wire (not shown), the voice coil 6 vibrates due to electromagnetic force. Driven and vibrated, it is possible to perform loud sounds such as radio sound and CD playback sound. Further, when the diaphragm 4 vibrates in the vertical direction in FIG. 2 when energized, the back pressure of the diaphragm 4 acts on the back side space, and air flows inside and outside the speaker via the air flow passage 10 and the opening 8. Therefore, the outer surface of the magnetic circuit cover 1 is always exposed to fresh air when energized. Therefore, in this speaker, the heat (Joule heat) generated in the voice coil 6 when energized and transmitted to the magnetic circuit cover 1 via the magnetic circuit 2 is subjected to the air cooling action of the air that enters and exits through the opening portion 8 and goes outside. It is easy to be released. That is, if a small magnetic circuit 2 is used to promote weight reduction, the inside of the speaker tends to become hot due to a decrease in the heat dissipation area, but in this speaker, the air flow is opened without stagnation using the back pressure of the diaphragm 4. Since it passes through the portion 8, the amount of heat radiation from the outer surface of the magnetic circuit cover 1 increases due to the air cooling action.
[0013]
In addition, since this speaker has a structure in which the large-diameter portion 1a is protruded from the magnetic circuit cover 1 and the outer peripheral portion of the damper 7 is joined, the space between the large-diameter portion 1a and the inner wall surface of the resin frame 3 is between them. Naturally, the air flow passage 10 is formed, and the back pressure of the diaphragm 4 is easily shielded by the damper 7 and directly acts on the opening 8. That is, a so-called orifice is formed by the air flow passage 10 and the opening 8, and the flow rate of the air discharged from the opening 8 to the outside of the speaker is accelerated, so that the cooling action of the outer surface of the magnetic circuit cover 1 is further improved. Has become. Moreover, since the heat radiation area of the magnetic circuit cover 1 is increased by providing such a large diameter portion 1a, this speaker has a high heat radiation effect for suppressing an internal temperature rise, and hence the magnetic circuit 2 is small and light. High reliability is assured while achieving high reliability.
[0014]
In the embodiment described above, the space on the back side of the diaphragm 4 and the opening 8 are communicated with each other via the air flow passage 10 provided between the large diameter portion 1 a of the magnetic circuit cover 1 and the resin frame 3. However, the present invention is not limited to this. For example, in the case where the outer peripheral portion of the damper 7 is joined to the annular support portion protruding from the inner wall of the resin frame 3, if through holes are provided at a plurality of locations of the annular support portion, the through holes are provided through the through holes. Since the back side space of the diaphragm 4 and the opening 8 can be communicated, a similar heat dissipation effect can be expected.
[0015]
【The invention's effect】
The present invention is implemented in the form as described above, and has the effects described below.
[0016]
Since an opening is provided in the vicinity of the junction between the magnetic circuit cover and the frame, and the opening and the back side space of the diaphragm communicate with each other, when the diaphragm vibrates during energization, the diaphragm is placed in the back side space. The back pressure acts on the inside and outside of the speaker through the opening. Therefore, the outer surface of the magnetic circuit cover is always exposed to fresh air when energized, and the heat generated by the voice coil and transmitted to the magnetic circuit cover via the magnetic circuit when energized enters and exits through the opening. It becomes easy to be released by the air cooling effect of air. Therefore, even if a small magnetic circuit is adopted, the heat dissipation effect can be enhanced by the air cooling action, and both the promotion of weight reduction of the speaker and the suppression of the temperature rise can be achieved.
[0017]
Further, if the magnetic circuit cover is provided with a large-diameter portion that supports the outer periphery of the damper, and the air-flow passage that communicates between the large-diameter portion and the inner wall surface of the frame to the opening, the opening And the space on the back side of the diaphragm can flow air very smoothly, and the large diameter part of the magnetic circuit cover becomes a heat radiating part to increase the heat radiating area, further enhancing the heat radiating effect. it can.
[Brief description of the drawings]
FIG. 1 is a rear view of a speaker according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line AOB in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Magnetic circuit cover 1a Large diameter part 2 Magnetic circuit 3 Resin frame 3a Rib 4 Diaphragm 5 Bobbin 6 Voice coil 7 Damper 8 Opening part 10 Air flow path G Gap

Claims (2)

ボイスコイルと、このボイスコイルが配置されるギャップを有する磁気回路と、この磁気回路を収納・保持する磁気回路カバーと、内周部が前記ボイスコイルに連結されて該ボイスコイルへの通電時に駆動される振動板と、前記磁気回路カバーと連結されて前記振動板の背面側を包囲し該振動板の外周部を支持するフレームと、前記振動板の内周部を支持するダンパとを備えたスピーカにおいて、
前記磁気回路カバーと前記フレームとの接合部近傍に開口部を設け、この開口部と前記振動板の背面側空間とを連通させたことを特徴とするスピーカ。
A voice coil, a magnetic circuit having a gap in which the voice coil is disposed, a magnetic circuit cover for housing and holding the magnetic circuit, and an inner peripheral portion connected to the voice coil and driven when the voice coil is energized. A diaphragm that is connected to the magnetic circuit cover and surrounds the back side of the diaphragm and supports the outer peripheral portion of the diaphragm; and a damper that supports the inner peripheral portion of the diaphragm. In the speaker,
An speaker, wherein an opening is provided in the vicinity of a joint between the magnetic circuit cover and the frame, and the opening and the back side space of the diaphragm are communicated.
請求項1の記載において、前記磁気回路カバーに前記フレームの内側で前記ダンパの外周部を支持する大径部を突設し、この大径部と前記フレームの内壁面との間を前記開口部に連通する空気流通路となしたことを特徴とするスピーカ。2. The magnetic circuit cover according to claim 1, wherein a large-diameter portion that supports an outer peripheral portion of the damper is provided on the inner side of the frame, and the opening is provided between the large-diameter portion and the inner wall surface of the frame. The speaker is characterized by an air flow passage communicating with the speaker.
JP15533099A 1999-06-02 1999-06-02 Speaker Expired - Fee Related JP3657814B2 (en)

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JP15533099A JP3657814B2 (en) 1999-06-02 1999-06-02 Speaker

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JP3657814B2 true JP3657814B2 (en) 2005-06-08

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Cited By (4)

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US10681466B2 (en) 2018-04-06 2020-06-09 Alpine Electronics, Inc. Loudspeaker with dual plate structure
US10694279B1 (en) 2018-12-21 2020-06-23 Alpine Electronics, Inc. Compact coaxial loudspeaker
USD904354S1 (en) 2017-12-22 2020-12-08 Alpine Electronics, Inc. Speaker component retainer bridge
USD904353S1 (en) 2017-12-21 2020-12-08 Alpine Electronics, Inc. Speaker component retainer

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JP2002218588A (en) * 2001-01-18 2002-08-02 Kenwood Corp Heat radiation structure for inner core speaker
JP2006229520A (en) * 2005-02-17 2006-08-31 Pioneer Electronic Corp Frame for speaker device and speaker device
US7684585B2 (en) 2006-01-31 2010-03-23 Alpine Electronics, Inc. Thermal management system for speaker system having vented frame for establishing air passages
JP4866204B2 (en) * 2006-10-18 2012-02-01 パイオニア株式会社 Speaker driving device and speaker device
JP6433172B2 (en) * 2014-06-25 2018-12-05 アルパイン株式会社 Speaker device

Cited By (4)

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Publication number Priority date Publication date Assignee Title
USD904353S1 (en) 2017-12-21 2020-12-08 Alpine Electronics, Inc. Speaker component retainer
USD904354S1 (en) 2017-12-22 2020-12-08 Alpine Electronics, Inc. Speaker component retainer bridge
US10681466B2 (en) 2018-04-06 2020-06-09 Alpine Electronics, Inc. Loudspeaker with dual plate structure
US10694279B1 (en) 2018-12-21 2020-06-23 Alpine Electronics, Inc. Compact coaxial loudspeaker

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