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JP3548416B2 - Substrate processing equipment - Google Patents

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Publication number
JP3548416B2
JP3548416B2 JP7554098A JP7554098A JP3548416B2 JP 3548416 B2 JP3548416 B2 JP 3548416B2 JP 7554098 A JP7554098 A JP 7554098A JP 7554098 A JP7554098 A JP 7554098A JP 3548416 B2 JP3548416 B2 JP 3548416B2
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Prior art keywords
substrate
opening
exhaust
substrates
processing
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JP7554098A
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Japanese (ja)
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JPH11274271A (en
Inventor
公二 長谷川
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、半導体ウエハや液晶表示パネル用ガラス基板などの薄板状の基板に所定の処理を行う基板処理装置に関する。
【0002】
【従来の技術】
従来、半導体ウエハや液晶表示パネル用ガラス基板などを用いた精密電子基板の製造プロセスにおいては、基板を処理液に浸漬して種々の表面処理を施している。このような表面処理においては、エッチング液などの薬液を貯留した薬液槽とリンス液である純水を貯留した水洗槽とを有し、薬液槽さらに水洗槽に順次基板を浸漬して、薬液槽にて基板に薬液処理を施した後に、さらに、水洗槽にて基板に付着した薬液やパーティクルを洗い流すリンス処理を施している。
【0003】
図5は、従来の基板処理装置における要部の概略構成を示す模式図である。
【0004】
図5において、基板処理装置51は、複数の基板を一括して処理する装置であって、カセットに所定枚数がセットされた基板を装置外部との間で受渡しをする搬出入部(図示せず)と、この搬出入部(図示せず)から基板を受け取って搬送すると共に搬出入部(図示せず)に基板を受渡す搬送部52と、この搬送部52から基板を受け取って基板に所定の処理を施すと共に、その処理後の基板を搬送部52に受け渡す各処理ユニット53とを有している。
【0005】
この搬送部52は、上下の各搬送路にそれぞれ配設され各処理ユニット53の配設方向(X方向)にそれぞれ移動する2つの搬送ロボット52a,52bを備えている。これらの搬送ロボット52a,52bはそれぞれ、各処理ユニット53の配設方向(X方向)と図5の紙面に直交する方向(図7のY方向)に伸びる軸部材54a(図6)を介して取り付けられた保持板54をそれぞれ一対有し、これらの一対の保持板54の内側の保持用溝(図示せず)で、起立姿勢の複数の基板55がY方向に並べられた状態でそれらの両側端面を両側からそれぞれ挾み込んで各保持用溝で受けて保持するようになっている。
【0006】
また、各処理ユニット53は、エッチィング液などの薬液を貯留した薬液槽56と、この薬液槽56による処理済みの基板55に付いた薬液やパーティクルなどを水洗する水洗槽57と、薬液を貯留した薬液槽58と、この薬液槽58による処理済みの基板55に付いた薬液やパーティクルなどを水洗する水洗槽59と、この水洗槽59で水洗処理された基板55を乾燥する乾燥槽60とを有している。これらの薬液槽56、水洗槽57、薬液槽58さらに水洗槽59にわたって複数の基板55を一括して順次浸漬させることにより基板55に薬液処理や水洗処理などの一連の各種処理が施され、さらにその処理後の基板55を乾燥させるようになっている。
【0007】
さらに、これらの薬液槽56,58および水洗槽57,59の各処理槽にはそれぞれリフタ装置61が配設されており、各リフタ装置61はそれぞれ複数の基板55を載置可能であると共に処理槽内と基板受渡位置の間で上下移動自在に構成されている。また、これらの薬液槽56,58および水洗槽57,59の各処理槽にはそれぞれ外郭部材62がそれぞれ配設されており、これらの外郭部材62と乾燥槽60の上面部にはそれぞれ、各処理槽の上部開放口に対向するように基板導入口を開閉自在な開閉扉63が配設されている。これらの開閉扉63はそれぞれ通常は閉じており、リフタ装置61の処理槽内への下降に連動して両側に開くように構成されていると共に、処理槽内からの上昇に連動して両側に開くように構成されている。
【0008】
これらの各外郭部材62の適所にはそれぞれ排気ダクト64が開口しており、その排気ダクト64は流量調整バルブ65を介して排気ポンプ66に連通されている。これらの排気ダクト64、流量調整バルブ65および排気ポンプ66によって排気手段が構成されており、この排気手段による外郭部材62内の排気によって、外郭部材62の基板導入口の開閉扉63が開いても、この基板導入口から外部空気が流入することで、この基板導入口を介して薬液槽56,58からのヒューム(酸やアルカリなどが混ざった雰囲気)の外部への拡散を防止するようになっている。
【0009】
さらに、図6に示すように、リフタ装置61と例えば搬送ロボット52bとは、並んで配設(図6の紙面に垂直な図5のX方向)された複数の処理槽をそれらの幅方向に両側から挾んで対向した状態で配設されている。また同様に、リフタ装置61と例えば搬送ロボット52aについても、並んで配設(図6の紙面に垂直な図5のX方向)された複数の処理槽をそれらの幅方向に両側から挾んで対向した状態で配設されている。
【0010】
上記構成により、まず、搬送ロボット52bは、搬出入部(図示せず)から基板を受け取って各処理ユニット53の薬液槽56の上方の基板受渡位置までその配設方向(X方向)に沿って搬送する。このとき、図6に示すように、搬送ロボット52bの一対の保持板54は、それらの内側の複数の保持用溝で、起立姿勢の複数の基板55の両側端面を両側からそれぞれ挾み込んで受けて保持している。これに対して、薬液槽56のリフタ装置61が上昇してきて、その下方部に設けられた3つの保持アーム61a上側の複数の各保持溝で、搬送ロボット52bに保持されている複数の基板を下方から受ける。その後、搬送ロボット52bの一対の保持板54をそれぞれ実線で示すような垂直方向になるように回動させて、搬送ロボット52bの複数の基板55への保持を解除し、リフタ装置61への複数の基板55の受渡しを完了する。
【0011】
次に、リフタ装置61は複数の基板を3つの保持アーム61a上側の複数の各保持溝で保持した状態で薬液槽56内に向けて下降する。この下降に連動して外郭部材62の開閉扉63が仮想線のように両側に起立して開き、薬液槽56の上部開放口から複数の基板55を保持した保持アーム61aをその薬液中に浸漬させて所定時間放置することで複数の基板55に所定の薬液処理を施す。このとき、開閉扉63は閉じられており、この薬液槽56は外郭部材62で略密閉されている。また、外郭部材62内は排気ポンプ66によって排気ダクト64を介して排気されている。
【0012】
さらに、リフタ装置61は、所定時間後、薬液処理後の複数の基板55を上昇させ、それに連動するように開閉扉63が仮想線のように両側に起立して開き、薬液槽56の上部開放口から複数の基板55を保持した保持アーム61aを薬液槽56の上方の基板受渡位置まで上昇させる。その基板受渡位置では、搬送ロボット52bが一対の保持板54をそれぞれ垂直方向にした状態で待機しており、複数の基板55を保持した保持アーム61aを基板受渡位置に到着させた後に、一対の保持板54の下部側をそれぞれ内側に回動させて、複数の基板55の両側端面を両側からそれぞれ挾み込んで一対の保持板54の各保持用溝で受けて保持する。
【0013】
さらに、リフタ装置61を保持アーム61aと共に下方に退避させて一対の保持板54に基板55を移し代えた後に、搬送ロボット52bは複数の基板55を、薬液槽56の隣に位置している水洗槽57の上方の基板受渡位置までその配設方向(X方向)に沿って搬送する。このとき、搬送ロボット52bの一対の保持板54はそれぞれ、それらの内側の複数の保持用溝で、起立姿勢の複数の基板55の両側端面を両側からそれぞれ挾み込んで受けて保持している。これに対して、水洗槽57のリフタ装置61が上昇してきて、その下方部に設けられた3つの保持アーム61aの上側の複数の各保持溝で、搬送ロボット52bに保持されている複数の基板55を下方から受ける。その後、搬送ロボット52bの一対の保持板54をその長手方向が垂直方向になるようにそれぞれ回動させて、搬送ロボット52bの複数の基板55への保持を解除し、水洗槽57のリフタ装置61への複数の基板55の受渡しが完了する。
【0014】
さらに、水洗槽57のリフタ装置61は複数の基板55を3つの保持アーム61a上側の複数の各保持溝で保持した状態で水洗槽57内に向けて下降する。これと同時に、基板55の受渡し後の空状態の搬送ロボット52bは、搬出入部(図示せず)との基板受渡位置までその配設方向(X方向)に沿って移動し、その搬出入部から複数の基板55の受渡しに備える。
【0015】
このリフタ装置61の下降に連動して外郭部材62の開閉扉63が開き、水洗槽57の上部開放口から複数の基板55を保持した保持アーム61aをその純水中に浸漬させて複数の基板55を水洗処理する。この水洗処理時には、その開閉扉63は閉じられており、この水洗槽57の外郭部材62内が密閉されている。
【0016】
さらに、リフタ装置61は、所定時間後、水洗処理後の複数の基板55を上昇させ、それに連動するように開閉扉63が開き、水洗槽57の上部開放口から複数の基板55を保持した保持アーム61aを水洗槽57の上方の搬送ロボット52a用の上側の基板受渡位置まで上昇させる。その基板受渡位置では、搬送ロボット52aが一対の保持板54の長手方向を垂直方向にした状態で待機しており、複数の基板55を保持した保持アーム61aをその基板受渡位置に到着させた後に、一対の保持板54の下部側をそれぞれ内側に回動させて、複数の基板55の両側端面を両側からそれぞれ挾み込んで各保持用溝で受けて保持することで、複数の基板55の受渡しを行う。
【0017】
その後、搬送ロボット52aは、乾燥槽60へ複数の基板55を搬送して乾燥槽60で複数の基板55に乾燥処理を施す。また、搬送ロボット52bは、各処理槽のリフタ装置61との複数の基板55の受渡しを行いつつ、以上と同様の動作を繰り返して薬液槽56さらに水洗槽57による一連の処理を行うように複数の基板55を搬送する。
【0018】
さらに、乾燥処理後の複数の基板55を乾燥槽60のリフタ装置61から受け取った搬送ロボット52aは、搬出入部(図示せず)との基板受渡位置までその配設方向(X方向)に沿って複数の処理済みの複数の基板55を搬送して、搬出入部に複数の処理済みの複数の基板55を受け渡す。
【0019】
【発明が解決しようとする課題】
ところが、上記従来の構成では、各処理槽に対してリフタ装置61が複数の基板55を載置した状態で上昇または下降するときに、それに連動して外郭部材62の基板導入口の開閉扉63が開くが、このとき、基板導入口を介して薬液槽56,58からのヒュームが、搬送ロボット52a,52bとリフタ装置61との受渡位置を含む基板搬送ラインにまで拡散しないように、薬液槽56,58および水洗槽57,59をそれぞれ覆う各外郭部材62内の雰囲気をそれぞれ、基板導入口からヒュームが拡散しない程度の風速で空気が内部に入り込んでくるように排気する排気手段を設けている。この排気手段の排気能力は、かなり多量の排気量/時間が必要となって多くの駆動電力を必要とすると共に、排気手段自体も大型化して嵩ばるという問題を有していた。
【0020】
因みに、ヒュームが基板搬送ラインにまで拡散してしまうと、ヒュームによって水洗処理後の綺麗な基板も汚れ、これがデバイスのロット不良を引き起こすと共に、ヒュームによる腐食によって機械構造系の部品不良を引き起こしたり、クリーンルーム内の清浄な空気を汚したりしてしまう。
【0021】
本発明は、上記従来の問題を解決するもので、排気手段をより小型化して省電力で省スペースの基板処理装置を提供することを目的とする。
【0022】
【課題を解決するための手段】
本発明の基板処理装置は、一または複数の基板に対して所定の処理を行う基板処理装置において、所定方向に配列され、基板に対して薬液処理を行う薬液処理部と、この薬液処理部により薬液処理された基板に対して水洗処理を行う水洗処理部とを含む複数の処理部と、前記複数の処理部の少なくとも薬液処理部と水洗処理部との間で基板を搬送させるために、これら薬液処理部及び水洗処理部の上方に設置された搬送路と、前記搬送路において少なくとも薬液処理部と水洗処理部との間で基板を搬送させる搬送手段と、前記搬送路の空間とその上方の位置との間で雰囲気を分離するために、前記搬送路の上方に配設され、かつ前記上方の位置と前記搬送路との間における前記搬送手段の移動を許容するための開口が形成された分離部材と、前記搬送路内の雰囲気を排気する排気手段とを備え、前記分離部材の基板搬送用の開口は、前記分離部材における、前記水洗処理部の上方に対応した位置に形成されたものである。
【0023】
この構成により、薬液等からのヒュームが拡散してくる搬送路を分離部材で覆うと共に、その分離部材の開口から薬液のヒュームが外側に拡散し難いように、一の処理部に対応した位置にのみ開口を設けて、できる限り小さな開口としたので、排気手段の排気能力が大幅に小さくなっても、分離部材の外側へのヒュームの拡散が防止可能であることから、排気手段がより小型化可能で省電力で省スペース、しかも、より静音の基板処理装置となる。したがって、より排気能力の小さな排気手段で、ヒュームを分離部材外部に拡散させず、従来のように水洗処理後の綺麗な基板が汚染されるようなこともなく、デバイスのロット不良を引き起したり、ヒュームによる腐食によって機械構造系の部品不良を引き起こしたり、クリーンルーム内の清浄な空気を汚したりする不都合も解消される。
【0024】
さらに、本発明の基板処理装置における複数の処理部は、基板に対して薬液処理を行う薬液処理部と、基板に対して水洗処理を行う水洗処理部とを含み、分離部材の基板搬送用の開口は、分離部材における、水洗処理部の上方に対応した位置に形成される。
【0025】
この構成により、薬液の付いた基板が基板処理エリアから外側に取り出される薬液処理部の上方位置が最もヒューム濃度が濃く、そのヒューム濃度の濃い位置から離れた水洗処理部の上方の分離部材に開口があれば、薬液から出たヒュームが外側に拡散されにくく、排気能力のより小さい排気手段で済むことになる。
【0026】
また、好ましくは、本発明の基板処理装置において、分離部材の基板搬送用の開口に対して開閉可能なシャッタ手段を備える。
【0027】
この構成により、基板搬送用の開口が分離部材に必要となるが、この分離部材の開口を開閉するシャッタ手段を設ければ、排気能力がより小さい排気手段で、薬液から出たヒュームの分離部材外部への拡散が防止可能となる。
【0028】
さらに、好ましくは、本発明の基板処理装置における排気手段は、処理部のうち薬液処理部の近傍にその排気口を設ける。
【0029】
この構成により、薬液処理部の上方位置が最もヒューム濃度が濃く、薬液処理部の近傍に排気口を設けるようにすれば、排気手段で排気口からヒューム濃度の濃い雰囲気を効率よく排気することが可能となって、排気能力のより小さい排気手段でも、よりヒューム濃度を希薄にすることが可能となる。
【0030】
さらに、好ましくは、本発明の基板処理装置における排気手段は、分離部材の基板搬送用の開口に対して開閉可能なシャッタ手段の開位置と閉位置に応じて高排気出力と低排気出力に切り換え制御を行う制御手段を備える。
【0031】
この構成により、分離部材の開口がシャッタ手段によって開いているときには高排気出力で搬送路内のヒュームを排気し、分離部材の開口がシャッタ手段によって閉じているときには低排気出力で搬送路内のヒュームを排気するように切り換え可能にしたので、シャッタ手段の閉時には、省電力で小駆動音(静音)とすることが可能になると共に、シャッタ手段の開時にはヒュームの分離部材外部への拡散が大幅に抑制され得る。
【0032】
【発明の実施の形態】
以下、本発明に係る基板処理装置の実施形態について図面を参照して説明するが、本発明は以下に示す実施形態に限定されるものではない。
【0033】
図1は本発明の一実施形態の基板処理装置の概略要部構成を示す斜視図であり、図2は図1の基板処理装置のAA断面部分を背面から見た概略要部構成図である。
【0034】
図1において、基板処理装置1は、ウエハなどの複数の基板2を一括して処理する装置であって、カセット3に所定枚数がセットされた基板2を装置外部との間で受渡しをする搬出入部4と、この搬出入部4から処理前の基板2を受け取って搬送し、基板2に所定の処理を施すと共に、処理済みの基板2を搬送して搬出入部4に受渡す基板処理ユニット5とを有している。
【0035】
この搬出入部4は、搬入された(または搬出直前の)複数の基板2をカセット3にセットした状態で一時的に並べて載置しておくカセット載置台6と、カセット3の両上端つば部分3aを下方からそれぞれ受けて保持する片持ち状に2本突き出たカセット保持アーム7が、このカセット載置台6のカセット並び方向に移動自在であると共に、カセット保持アーム7でカセット3を取り込んで保持したりカセット3を載置したりするために上下方向に昇降自在で、かつその上下方向に平行な軸(カセット保持アーム7の取付部材を支持する支持軸)を中心に回動自在に構成されている移載ロボット8と、この移載ロボット8によってカセット載置台6から載置されたカセット3内の複数の基板2だけを突き上げて搬送機構9に受け渡す突上部10と、移載ロボット8によって突上部10から載置された空のカセット3を洗浄するカセット洗浄部11とを有している。この移載ロボット8は、カセット載置台6から突上部10の所定位置にカセット3を搬送して載置し、突上部10でカセット3から複数の基板2だけを突き上げて搬送機構9に受け渡した後の空のカセット3をカセット洗浄部11に移送すると共に、カセット洗浄部11で洗浄処理された空のカセット3を、処理済みの複数の基板2が搬送機構9から突上部10に受け渡されてカセット3内に回収されるべく、再び突上部10の位置決めされた所定位置に移送して待機させるようになっている。
【0036】
また、基板処理ユニット5には、図2に示すように、複数の処理槽12〜15をそれぞれ覆う各槽外郭部材16内(処理部内)の複数の基板処理エリア17と、これらの複数の基板処理エリア17の上方に設けられ各基板処理エリア17間を搬送する第2搬送路を有する2つの第2基板搬送エリア18,19と、これらの第2基板搬送エリア18,19に対してそれぞれ基板2を搬送する第1搬送路を有する第1基板搬送エリア20と、これらの第2基板搬送エリア18,19と第1基板搬送エリア20の間をそれぞれ仕切って分離する各分離部材(雰囲気遮断部材)としての各搬送エリア外郭部材21とが配設されている。この搬送エリア外郭部材21の、一の処理槽(本実施形態では水洗槽)の上部開放口に対応(対向)した上方位置には、第2基板搬送エリア18と第1基板搬送エリア20との間および、第2基板搬送エリア19と第1基板搬送エリア20との間を複数の基板2が搬送可能な各開口22がそれぞれ設けられている。また、各基板処理エリア17内および第2基板搬送エリア18,19内の雰囲気を共に排気する排気手段23が設けられている。このように、搬送エリア外郭部材21によって仕切られた外側のクリーンな第1基板搬送エリア20と、複数の基板2の薬液からの出し入れでヒュームが拡散する搬送エリア外郭部材21の内側の第2基板搬送エリア18,19と、実際に複数の基板2を処理する基板処理エリア17との3つのエリアに分けると共に、基板処理エリア17内および第2基板搬送エリア18,19内の雰囲気を排気手段23で排気することで、基板搬送ラインである第1基板搬送エリア20へのヒュームの拡散をより確実に防止するようになっている。
【0037】
つまり、本実施形態では、上記複数の処理槽12〜15は、エッチィング液などの薬液を貯留した薬液槽12と、この薬液槽12による処理済みの基板2に付いた薬液やパーティクルなどを洗い流す水洗槽13と、薬液を貯留した薬液槽14と、この薬液槽14による処理済みの基板2に付いた薬液やパーティクルなどを洗い流す水洗槽15とで構成されている。搬送エリア外郭部材21の一方は、薬液槽12を覆った槽外郭部材16と、水洗槽13を覆った槽外郭部材16とを覆うと共に、それらの各槽外郭部材16の間(各処理部間)を基板搬送可能な第2基板搬送エリア18をも覆うように構成されている。また、搬送エリア外郭部材21の他方は、薬液槽14を覆った槽外郭部材16と、水洗槽15を覆った槽外郭部材16とを覆うと共に、それらの各槽外郭部材16間を基板搬送可能な第2基板搬送エリア19をも覆うように構成されている。さらに、薬液槽12,14および水洗槽13,15の各上部開放口にそれぞれ対応(対向)した各槽外郭部材16の上面にはそれぞれ、複数の基板2を内部に導入可能な各基板導入口24がそれぞれ配設されている。これらの各基板導入口24のうち、水洗槽13,15側の各基板導入口24にそれぞれ対応(対向)する上方の各搬送エリア外郭部材21の上面だけに、複数の基板2を内部に導入可能な各開口22がそれぞれ設けられている。一方、薬液槽12,14の各上部開放口にそれぞれ対向するようにその各上方に基板導入口24をそれぞれ配設し、さらにその上方の各搬送エリア外郭部材21にそれぞれ開口をそれぞれ設けていない。これは、搬送エリア外郭部材21でエリア間を仕切るだけではなく、第2基板搬送エリア18,19と第1基板搬送エリア20との連通面積(開口面積)をより小さくして第1基板搬送エリア20へのヒュームの拡散を抑制すると共に、排気手段23によって第1基板搬送エリア20へのヒュームの拡散を防止する程度に、基板処理エリア17内および第2基板搬送エリア18,19内の雰囲気を排気することから、その排気量を従来とは大幅に削減可能にするためである。
【0038】
また、この水洗槽15の隣側には、水洗槽15で水洗処理された基板2を乾燥する乾燥槽25が配設されている。薬液槽12、水洗槽13等で複数の基板2を一括して順次各処理槽に浸漬させることにより、複数の基板2に薬液処理や水洗処理などの一連の各種処理が施され、その処理後の複数の基板2を乾燥槽25で乾燥させるようになっている。この乾燥槽25は、所定温度の乾燥用温風(ヒータなどで昇温されていてもよい)が供給される構成であってもよいし、IPA(イソプロピルアルコール)による減圧乾燥などであってもよい。
【0039】
さらに、各開口22をそれぞれスライドして開閉する板状の開口部開閉扉26と、この開口部開閉扉26を基板搬送に応じて開閉駆動させる開口部開閉駆動手段(図示せず)とが搬送エリア外郭部材21の上面部に配設されている。これらの開口部開閉扉26と開口部開閉駆動手段によってシャッタ手段が構成されており、基板搬送用の開口22に対して開閉可能である。また、各槽外郭部材16の基板導入口24をそれぞれ開閉する各導入口開閉扉27と、これらの各導入口開閉扉27を基板搬送に応じて開閉駆動させる導入口開閉駆動手段(図示せず)とが各槽外郭部材16の上面部に配設されている。これらの各槽外郭部材16に各導入口開閉扉27をそれぞれ設けているのは、単にヒュームの拡散防止のためだけではなく液中に含まれている揮発成分の蒸発をできるだけ抑えるためである。また、各開口部開閉扉26を設けているのは、高クリーン度が要求される第1基板搬送エリア20側に第2基板搬送エリア18,19側からヒュームが拡散するのをできるだけ防止するためである。この観点から、これらの各開口部開閉扉26および各導入口開閉扉27は、複数の基板2の物流時以外には閉じている。さらに、乾燥槽25の上面にも基板導入口を開閉する各導入口開閉扉28が配設されている。
【0040】
本実施形態では、この開口部開閉扉26は搬送エリア外郭部材21の上面に沿って所定距離だけスライドして水平移動することで開口22を開閉するようになっており、導入口開閉扉27は両開き状に両側で回動駆動して基板導入口24を開閉するようになっている。これらの開口部開閉駆動手段および導入口開閉駆動手段は例えばエアーシリンダ(図示せず)などで構成されていてもよい。この場合、開口部開閉扉26にエアーシリンダのロッド先端が取り付けられてロッドの所定ストロークの伸縮によって開口22を開閉する。また、導入口開閉扉27は2枚の扉で構成され、それぞれの扉に対して、アーム一端がそれぞれ固定され、アーム中央部でそれぞれ回動自在に軸支されたアーム(図示せず)の他端にエアーシリンダのロッド先端が取り付けられてロッドの所定ストロークの伸縮によって導入口開閉扉27をアーム(図示せず)を介して両開き状に両側で回動駆動させて基板導入口24を開閉するようになっている。このように、導入口開閉扉27を両開き用にしてそれぞれの扉を開閉する場合、それぞれの扉の駆動用にはエアーシリンダを2台設けるようにしてもよい。
【0041】
さらに、搬送機構9は搬送ロボットで構成されており、複数の処理槽12〜15の配設方向(X方向)に移動可能で複数の基板2を保持可能な一対の保持板29を有している。この一対の保持板29はそれぞれ、図2の紙面に直交する方向(図3のY方向)に伸びる各軸部材30(図3)にそれぞれ固定されており、これらの各軸部材30の軸芯をそれぞれ回動中心として互いに逆方向に回動自在に搬送機構本体9aに連結されている。また、この一対の保持板29にはそれぞれ、その対向した各内側に複数の基板2を所定間隔を空けてそれぞれ起立(垂直)姿勢で保持可能な保持用溝(図示せず)が複数形成されている。一対の保持板29の下端部を互いに内側に接近させて、複数の基板2をY方向に並べた状態でそれらの両側端面を両側からそれぞれ挾み込んで各保持用溝で受けて保持する。
【0042】
さらに、これらの薬液槽12および水洗槽13と、薬液槽14および水洗槽15のそれぞれに、複数の基板2を搬送する各リフタ装置31がそれぞれ配設されている。図3に示すように、これらの各リフタ装置31は、基板保持用溝32aが複数形成され複数の基板2を下方から各基板保持用溝32aでそれぞれ受けて起立姿勢で保持する3本の保持アーム32と、この3本の保持アーム32が下端部分でL字状に接続された可動保持板33と、この可動保持板33の上端部分裏面に固定され上下移動および水平動可能な可動部材34と、この可動部材34を上下動および水平動させる駆動手段(図示せず)とがそれぞれ配設されている。また、乾燥槽25にも、複数の基板2を搬送する各リフタ装置35が配設されており、このリフタ装置35はリフタ装置31と同様の構成をしている。
【0043】
これらの各リフタ装置31,35の駆動手段(図示せず)は、レールなどの案内部材(図示せず)に沿って可動部材34をレールなどの案内部材(図示せず)に沿って上下方向に移動させる垂直駆動ユニットを有しており、例えばワイヤやベルトなどを駆動するプーリやロールなどをモータで回転駆動させてワイヤやベルトなどに取り付けられた可動部材34を上下動させるようにしてもよい。また、ピニオンおよびラックをモータで駆動させて可動部材34を上下動させるようにしてもよく、ボールねじとモータによって可動部材34を上下動させるようにしてもよく、種々の駆動系が考えられる。さらに、この各リフタ装置31の駆動手段(図示せず)は、レールなどの案内部材(図示せず)に沿って可動部材34を上記垂直駆動ユニットと共に水平方向に移動させる水平駆動ユニットを有しており、上記と同様にボールねじなど種々の駆動系が考えられる。
【0044】
各リフタ装置31の処理槽内への下降に連動して導入口開閉扉27が開くように構成されていると共に、処理槽内からの上昇に連動して導入口開閉扉27が開くように構成されている。また、各リフタ装置31の第2基板搬送エリア18内または第2基板搬送エリア19内への下降に連動して開口部開閉扉26が開くように構成されていると共に、第2基板搬送エリア18内または第2基板搬送エリア19内からの上昇に連動して開口部開閉扉26が開くように構成されている。さらに、リフタ装置35の乾燥槽25内への下降に連動して導入口開閉扉28が開くように構成されていると共に、乾燥槽25内からの上昇に連動して導入口開閉扉28が開くように構成されている。つまり、これらの開口部開閉扉26および導入口開閉扉27,28はそれぞれ複数の基板2の通過時のみ開き、他は閉じているようになっている。
【0045】
さらに、各槽外郭部材16の上部側壁(図2の処理槽開放口の高さ位置)にはそれぞれ各排気ダクト37の排気口が処理槽幅方向に渡って長方形状にそれぞれ開口しており、それらの排気ダクト37の排気口は流量調整バルブ38を介して排気ポンプ39に連通されている。また、各第2基板搬送エリア18,19をそれぞれ覆っている各搬送エリア外郭部材21の側壁部にはそれぞれ、各排気ダクト37の排気口がリフタ装置31の幅方向に渡って長方形状にそれぞれ開口しており、それらの排気ダクト37の排気口も流量調整バルブ38を介して排気ポンプ39に連通されている。これらの各搬送エリア外郭部材21の排気口は、薬液槽12,14の上方近傍位置であって各第2基板搬送エリア18の最も奥側の側壁に配設されている。これらの排気ダクト37、流量調整バルブ38および排気ポンプ39によって排気手段23が構成されており、各槽外郭部材16内(基板処理エリア17)および各搬送エリア外郭部材21内(第2基板搬送エリア18内)の適所に設けられたこの排気手段23による排気口からの排気によって、各搬送エリア外郭部材21の開口部開閉扉26が開いたり、各外郭部材16の基板導入口開閉扉27が開いても、この開口22や基板導入口24から外部の空気が流入することで、この開口22や基板導入口24を介して薬液槽12,14や、薬液の付いた複数の基板2からのヒューム(酸やアルカリなどが混ざった雰囲気)の外部への拡散が防止されるようになっている。
【0046】
また、排気手段23は、分離部材としての各搬送エリア外郭部材21の基板搬送用の開口22に対して開閉可能なシャッタ手段を構成する開口部開閉扉26が開位置と閉位置に応じて排気ポンプ39の出力を高排気出力と低排気出力に切り換え制御を行う制御手段(図示せず)を有するようにしてもよい。つまり、この制御手段は、シャッタ手段が開口22を閉じている場合には、それをリミットスイッチ(図示せず)などで検出させて排気ポンプ39の出力を低排気出力とするように制御して省電力化し、基板搬送時などシャッタ手段が開口22を開けている場合には、それをリミットスイッチなどで検出させて排気ポンプ39の出力を高排気出力とするように制御してヒュームがクリーンな第1基板搬送エリア側に拡散しないように構成することもできる。
【0047】
さらに、図3〜図5に示すように、これらのリフタ装置31と搬送機構9とは、並んで配設された複数の処理槽12〜15,25に対して同一側にそれぞれ配設されている。この場合に、これらのリフタ装置31と搬送機構9とはそれぞれ基板保持部分(保持板29や3本の保持アーム32)が前方(搬送方向に直交する方向)に突き出た片持ち構造をしている。
【0048】
さらに、各搬送エリア外郭部材21の上方の第1基板搬送エリア20を覆う更なるヒューム拡散防止用の搬送エリア外郭部材40が設けられており、搬送エリア外郭部材40内において複数の処理槽12〜15,25の配列された方向(X方向)に複数の基板2を搬送させるための基板搬送ライン(第1搬送路)の空間部分を構成している。この搬送エリア外郭部材40の側壁には、搬送機構9の一対の保持板29と共にそれに保持された複数の基板2の移動を許容するための開口41が形成されており、この開口41を開閉するための開閉扉42がには、その搬送エリア外郭部材40の側壁に沿ってスライド自在に構成されている。この開閉扉42は、通常は閉状態であり、搬送機構9の開口41に対する通過時にのみ開状態となるように開閉駆動手段(図示せず)で開閉駆動されるようになっている。この開閉駆動手段は、例えば扉開閉用のシリンダと、搬送機構9を検出する検出手段と、この検出手段で搬送機構9を検出したときにシリンダを駆動させるように切り換える電磁弁とを有している。
【0049】
上記構成により、以下、その動作を説明する。
【0050】
まず、搬送機構9は、搬出入部(図示せず)から基板2を受け取って第1の処理ユニットのある第1基板搬送エリア18の開口22の上方の基板受渡位置まで第1基板搬送エリア20内の搬送路をその搬送路方向(X方向)に沿って搬送する。この基板受渡位置において、図2に示すように、搬送機構9の一対の保持板29はそれぞれ、それらの内側の複数の保持用溝で、起立姿勢の複数の基板2の両側端面を両側からそれぞれ挾み込んで受けて保持している。これに対して、リフタ装置31がその基板受渡位置まで上昇してきて、その下方部に設けられた3つの保持アーム32の上側の複数の各保持溝で、搬送機構9に保持されている複数の基板2を下方から受ける。その後、搬送機構9の一対の保持板29をそれぞれ垂直方向になるようにそれぞれ回動させて、搬送機構9による複数の基板2への保持を解除し、リフタ装置31の3つの保持アーム32上への複数の基板2の受渡しを完了する。
【0051】
次に、リフタ装置31は複数の基板2を3つの保持アーム32上の複数の各保持溝で保持した状態で下降し始めると、この下降に連動して搬送エリア外郭部材21の開口部開閉扉26が開き、その開口22を通して複数の基板2と共にリフタ装置31が第2基板搬送エリア18内に入る。この第2基板搬送エリア18内で、リフタ装置31は複数の基板2と共に、薬液処理部の上方位置まで横方向に水平移動した後に、薬液槽12のある薬液処理部内に向けて下降し始める。この下降に連動して槽外郭部材16の基板導入口開閉扉27が開き、その基板導入口24を通して複数の基板2を保持した3つの保持アーム32が基板処理エリア17内に入って、さらに、薬液槽12の上部開放口から基板2を保持した保持アーム32をその薬液中に浸漬させ、その状態で所定時間放置して複数の基板2の表面に所定の薬液処理を施す。
【0052】
これらの一連の第2基板搬送エリア18内の基板搬送時や薬液処理時には、搬送エリア外郭部材21の開口22は開口部開閉扉26によって閉じられていると共に、この薬液槽12および水洗槽13上の各槽外郭部材16の基板導入口24もそれぞれ、その基板処理エリア17内への基板導入時以外は各基板導入口開閉扉27によってそれぞれ閉じられている。また、排気手段23は、常に一定の排気能力で排気するようにしてもよいが、この場合には、その開口22および各基板導入口24の開放時(エリア間の基板搬送時)にも外部にヒューム拡散がないような高排気能力でなければならない。このため、開口22および各基板導入口24の開放時に高排気出力で排気ポンプ39を駆動してその内部雰囲気を排気し、開口22および各基板導入口24のうち何れか一方の開放時に、中排気出力で排気ポンプ39を駆動してその内部雰囲気を排気し、開口22および基板導入口24の閉止時(エリア内基板搬送時および基板処理時)には低排気出力で排気して排気ポンプ39を3段階の省電力駆動としてもよい。また、開口22および各基板導入口24のうち少なくとも何れかの開放時に、高排気出力で排気ポンプ39を駆動してその内部雰囲気を排気し、開口22および基板導入口24の閉止時(エリア内基板搬送時および基板処理時)には低排気出力で排気して排気ポンプ39を2段階の省電力駆動としてもよい。
【0053】
さらに、所定時間後の薬液処理後、リフタ装置31は、基板2を保持した保持アーム32を上昇させ、それに連動するように開閉扉27が仮想線で示すように両側に開き、薬液槽12の上部開放口から基板導入口24を通して基板2を保持した保持アーム32を薬液槽12の上方まで上昇させ、水洗槽13のある水洗処理部の上方位置まで横方向に水平移動させる。その後、リフタ装置31は、薬液処理を済ませて基板2の表面に薬液が付いた複数の基板2を保持アーム32と共に下降させ、この下降に連動して槽外郭部材16の基板導入口開閉扉27が開き、その基板導入口24を通して複数の基板2を保持した保持アーム32が水洗槽13の基板処理エリア17内に導入される。この基板処理エリア17内で、リフタ装置31は、水洗槽13の上部開放口から複数の基板2をその薬液中に浸漬させ、複数の基板2の表面に付着した薬液を洗い流す水洗処理を行う。
【0054】
これらの一連の第2基板搬送エリア18内の基板搬送時や水洗処理時には上記と同様に、搬送エリア外郭部材21の開口22は開口部開閉扉26によって閉じられていると共に、この薬液槽12および水洗槽13上の各槽外郭部材16の基板導入口24もそれぞれ、各基板処理エリア17内への基板導入時以外は各基板導入口開閉扉27によってそれぞれ閉じられているが、このような場合にも、薬液槽12からの一連の第2基板搬送エリア18内の基板搬送時には、薬液の付いた複数の基板2からのヒュームを排気するべく、高排気出力で排気ポンプ39を駆動してその内部雰囲気を排気するようにしてもよい。
【0055】
さらに、所定時間後の水洗処理後、リフタ装置31は、基板2を保持した保持アーム32を上昇させ、それに連動するように開閉扉27を両側に開き、水洗槽13の上部開放口から基板導入口24を通して基板2を保持した保持アーム32を上昇させ、さらに、その上昇に連動するように開口部開閉扉26を開き、搬送エリア外郭部材21の開口22を通して基板2を保持した保持アーム32を基板受渡位置まで上昇させる。
【0056】
この搬送エリア外郭部材21で覆われた第1の処理ユニットにおける基板受渡位置では、搬送機構9の一対の保持板29が垂直方向の姿勢で待機しており、基板2を保持した保持アーム32を一対の保持板29の間に到着させた後に、一対の保持板29の下部側をそれぞれ内側に回動させて、複数の基板2の両側端面を両側からそれぞれ挾み込んで各保持用溝でそれぞれ受けて保持する。
【0057】
さらに、リフタ装置31を保持アーム32と共に下方に退避させた後に、搬送機構9の一対の保持板29は複数の基板2を保持した状態で、次の第2の処理ユニットのある第2基板搬送エリア19の開口22の上方の基板受渡位置まで第1基板搬送エリア20内の搬送路をその搬送路方向(X方向)に沿って搬送する。このとき、搬送機構9の一対の保持板29は、それらの内側の複数の保持用溝で、起立姿勢の複数の基板2の両側端面を両側からそれぞれ挾み込んで受けて保持している。これに対して、第2の処理ユニットのリフタ装置31が上昇してきて、その下方部に設けられた3つの保持アーム32の上側の複数の各保持溝で、一対の保持板29に保持されている複数の基板2を下方から受ける。その後、一対の保持板29をそれぞれ垂直方向になるように回動させて、一対の保持板29の複数の基板2への保持を解除し、搬送機構9の一対の保持板29から第2の処理ユニットのリフタ装置31への複数の基板2の受渡しが完了する。
【0058】
さらに、第2の処理ユニットのリフタ装置31に受け渡された複数の基板2は、そのリフタ装置31によって第2基板搬送エリア19内に導入されることになる。また、一方、空の搬送機構9は、搬出入部に戻って基板2を受け取り、第1第1の処理ユニットの搬送エリア外郭部材21の開口22の上方の基板受渡位置まで複数の基板2を搬送して、第2基板搬送エリア19内に導入するべくリフタ装置31に複数の基板2の受渡しを行う。
【0059】
また、このように、第2基板搬送エリア18,19内にそれぞれ導入された複数の基板2はそれぞれ、その後の第1の処理ユニットおよび第2の処理ユニットにおける各基板搬送および扉開閉さらに排気などの各動作は、上記した第1の処理ユニットにおける薬液処理および水洗処理のための各動作と同様に行われる。
【0060】
さらに、第2の処理ユニットのリフタ装置31は、所定時間後の水洗処理後の複数の基板2を上昇させ、それに連動するように開閉扉27が開き、水洗槽15の上部開放口からその基板導入口24を通して基板2を保持した保持アーム32を上昇させ、その上昇に連動するように開口部開閉扉26を開き、搬送エリア外郭部材21の開口22を通して基板2を保持した保持アーム32を第2の処理ユニットの基板受渡位置まで上昇させる。その基板受渡位置では、搬送機構9が一対の保持板29をそれぞれ垂直方向の姿勢で待機しており、基板2を保持した保持アーム32を一対の保持板29の間の基板受渡位置に到着させた後に、一対の保持板29の下端側をそれぞれ内側に回動させて、複数の基板2の両側端面を両側からそれぞれ挾み込んで各保持用溝で受けて保持することで基板2の搬送機構9への受渡しを行う。
【0061】
その後、搬送機構9の一対の保持板29は、乾燥槽25のリフタ装置35に対して第2の処理ユニットの処理が終了した複数の基板2を受け渡す。また、第1の処理ユニットのリフタ装置31から一対の保持板29に対して第1の処理ユニットの処理が終了した複数の基板2を受け取ってその一対の保持板29から第2の処理ユニットのリフタ装置31に複数の基板2を受け渡す。さらに、第2の処理ユニットのリフタ装置31に受け渡された複数の基板2は第2基板搬送エリア19内に導入されると共に、搬送機構9は、搬出入部に戻って基板2を受け取り、第1の処理ユニットの開口22の上方の基板受渡位置まで基板2を搬送して、第1の処理ユニットのリフタ装置31に複数の基板2の受渡しを行う。一方、乾燥処理部のリフタ装置31によって複数の基板2を保持アーム32と共に下降させ、その下降に連動させて開閉扉28を開いて乾燥槽25内に複数の基板2が導入されて乾燥処理が行われる。
【0062】
このようにして、第2基板搬送エリア18,19、乾燥処理部内にそれぞれ導入された複数の基板2はそれぞれ、第1の処理ユニットおよび第2の処理ユニット、乾燥処理部における各基板搬送および扉開閉さらに排気などの各動作が行われる。
【0063】
さらに、リフタ装置35によって再び、乾燥槽25内からその上方の基板受渡位置まで乾燥処理後の複数の基板2を上昇させて搬送機構9の一対の保持板29間に受渡し、その搬送機構9によって乾燥処理後の複数の基板2を搬出入部(図示せず)との基板受渡位置まで各処理部の配設方向(X方向)に沿って複数の処理済みの基板2を搬送して、搬出入部にその複数の処理済みの基板2を受け渡す。
【0064】
このように、搬送機構9の一対の保持板29は、乾燥槽25のリフタ装置35に対して第2の処理ユニットの処理が終了した複数の基板2を受け渡すと共に、第1の処理ユニットのリフタ装置31から第1の処理ユニットの処理が終了した複数の基板2を受け取ってその一対の保持板29から第2の処理ユニットのリフタ装置31に複数の基板2を受け渡す。さらに、第2の処理ユニットのリフタ装置31に受け渡された複数の基板2は第2基板搬送エリア19内に導入されると共に、搬送機構9は、搬出入部に戻って複数の基板2を受け取り、第1の処理ユニットの開口22の上方の基板受渡位置まで基板2を搬送して、第1の処理ユニットのリフタ装置31に複数の基板2の受渡しを行う。以上の各動作が、上記したように順次繰り返されて複数の基板2に対して所定の処理が行われることになる。
【0065】
以上のように、薬液からのヒュームが拡散してくる各処理部側の第2基板搬送エリア18,19をそれぞれ分離部材としての搬送エリア外郭部材21でそれぞれ覆うと共に、各搬送エリア外郭部材21の開口22から薬液のヒュームが外側の第1基板搬送エリア20内に拡散し難いように、水洗槽13,14にそれぞれ対応した位置にのみ開口22を設けて、できる限り小さな開口22としたため、排気手段23の排気能力を大幅に小さく(例えば80パーセント小さく)しても、各搬送エリア外郭部材21の外側の第1基板搬送エリア20へのヒュームの拡散が防止可能であることから、排気手段23がより小型化可能で省電力で省スペース、しかも、より静音の基板処理装置とすることができる。
【0066】
また、各搬送エリア外郭部材21の基板搬送用の開口22を開閉するシャッタ手段を設けるようにしたため、排気能力がより小さい排気手段23であっても、薬液から出たヒュームの各搬送エリア外郭部材21の外部(第1基板搬送エリア20内)への拡散を防止することができる。
【0067】
さらに、薬液の付いた複数の基板2が基板処理エリア17から外側に取り出される第2基板搬送エリア18,19内の薬液処理部の上方位置が最もヒューム濃度が濃く、そのヒューム濃度の濃い位置から離れた水洗処理部の上方の各搬送エリア外郭部材21に開口22をそれぞれ設けるようにしたため、薬液から出たヒュームが外側の第1基板搬送エリア20内に拡散されにくく、排気能力のより小さい排気手段23で済ませることができる。
【0068】
さらに、第2基板搬送エリア18,19内の薬液処理部の上方位置が最もヒューム濃度が濃く、薬液処理部の近傍に排気手段23の排気口を設けるようにしたため、排気手段23で排気口からヒューム濃度の濃い雰囲気を効率よく排気することができて、排気能力のより小さい排気手段23でも、よりヒューム濃度を希薄にすることができる。
【0069】
さらに、搬送エリア外郭部材21の開口22がシャッタ手段によって開いているときには高排気出力で搬送エリア外郭部材21内(第2基板搬送エリア18,19)のヒュームを排気し、搬送エリア外郭部材21の開口22がシャッタ手段によって閉じているときには低排気出力で搬送エリア外郭部材21内(第2基板搬送エリア18,19)のヒュームを排気するように切り換え可能にしたため、シャッタ手段の閉時には、省電力で小駆動音(静音)とすることができると共に、シャッタ手段の開時にはヒュームの搬送エリア外郭部材21の外部の第1基板搬送エリア20内への拡散をさらに抑制することができる。
【0070】
なお、本実施形態では、基板処理エリア17および第2基板搬送エリア18,19内の雰囲気を排気手段23の排気ダクト37を介して排気するように構成し、排気手段23の排気ポンプ39の排気出力制御は、開口22および各基板導入口24の開閉に応じて行うと共に、薬液槽12,14から水洗槽13,15に至る一連の第2基板搬送エリア18,19内の基板搬送時に、薬液の付いた複数の基板2からのヒュームを排気するべく、排気出力を高めるように行ったが、これに限らず、薬液槽12,14と水洗槽13,15と第2基板搬送エリア18,19とでそれぞれ異なる排気手段を設け、それらの排気手段を上記のように排気出力制御してもよい。この場合に、薬液槽12,14と水洗槽13,15の基板処理エリア17内の排気出力制御ではヒューム自体が異なりそれに応じた排気出力制御(例えばヒューム濃度が薄ければ排気出力も低出力でよい)とするように、それぞれ異なる各排気手段を制御することができる。また、基板処理エリア17内や第2基板搬送エリア18,19内の排気出力制御では、開口部開閉扉26や基板導入口開閉扉27が開いたときに最も高い排気出力とし、その後は、ヒューム拡散がない程度に徐々に出力低下させるようにし、また、第2基板搬送エリア18,19での排気出力制御で、薬液槽12,14から第2基板搬送エリア18,19内に取り出されたときに最も高い排気出力とし、その後は、ヒューム拡散がない程度に徐々に出力低下させるように、それぞれ異なる各排気手段を制御することができる。
【0071】
また、本実施形態では、複数の基板2を一括して処理するバッチ式の基板処理装置に、各処理部側の基板搬送エリアを分離部材で覆い、その分離部材に、できる限り小さな開口を設ける本発明を適応した場合について説明したが、基板2を一枚づつ処理する枚様式の基板処理装置にも本発明は適用可能である。
【0072】
【発明の効果】
以上のように本発明の請求項1によれば、薬液等からのヒュームが拡散してくる各処理部側の基板搬送エリアを分離部材で覆うと共に、その分離部材の開口から薬液等のヒュームが外側に拡散し難いように、一の処理部に対応した位置にのみ開口を設けて、できる限り小さな開口としたため、排気手段の排気能力が大幅に小さくなっても、分離部材の外側へのヒュームの拡散が防止可能であることから、排気手段がより小型化可能で省電力で省スペース、しかも、より静音の基板処理装置とすることができる。
【0073】
さらに、薬液の付いた基板が基板処理エリアから外側に取り出される薬液処理部の上方位置が最もヒューム濃度が濃く、そのヒューム濃度の濃い位置から離れた水洗処理部の上方の分離部材に開口を設けるようにしたため、薬液から出たヒュームが外側に拡散されにくく、排気能力のより小さい排気手段で済ませることができる。
【0074】
また、本発明の請求項2によれば、分離部材の基板搬送用の開口を開閉するシャッタ手段を設けるようにしたため、排気能力がより小さい排気手段で、薬液等から出たヒュームの分離部材外部への拡散を防止することができる。
【0075】
さらに、本発明の請求項3によれば、薬液処理部の上方位置が最もヒューム濃度が濃く、薬液処理部の近傍に排気口を設けるようにしたため、排気手段で排気口からヒューム濃度の濃い雰囲気を効率よく排気することができて、排気能力のより小さい排気手段でも、よりヒューム濃度を希薄にすることができる。
【0076】
さらに、本発明の請求項4によれば、分離部材の開口がシャッタ手段によって開いているときには高排気出力で分離部材内のヒュームを排気し、分離部材の開口がシャッタ手段によって閉じているときには低排気出力で分離部材内のヒュームを排気するように切り換え可能にしたため、シャッタ手段の閉時には、省電力で小駆動音(静音)とすることができると共に、シャッタ手段の開時にはヒュームの分離部材外部への拡散をさらに抑制することができる。
【図面の簡単な説明】
【図1】本発明の一実施形態の基板処理装置の概略要部構成を示す斜視図である。
【図2】図1の基板処理装置のAA断面部分を背面から見た概略要部構成図である。
【図3】図2のリフタ装置と搬送機構との基板受渡し状態の概略構成を示す斜視図である。
【図4】図2のリフタ装置と搬送機構との基板受渡し状態の概略構成を示す側面図である。
【図5】従来の基板処理装置における要部の概略構成を示す模式図である。
【図6】図5のリフタ装置と搬送ロボットとの基板受渡し状態の概略構成を示す側面図である。
【符号の説明】
1 基板処理装置
2 基板
5 基板処理ユニット
9 搬送機構
12,14 薬液槽
13,15 水洗槽
16 槽外郭部材
17 基板処理エリア
18,19 第2基板搬送エリア
20 第1基板搬送エリア
21,40 搬送エリア外郭部材
22,41 開口
23 排気手段
24 基板導入口
25 乾燥槽
26 開口部開閉扉
27,28 導入口開閉扉
29 保持板
31,35 リフタ装置
32 保持アーム
37 排気ダクト
38 流量調整バルブ
39 排気ポンプ
42 開閉扉
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus that performs a predetermined process on a thin substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in a manufacturing process of a precision electronic substrate using a semiconductor wafer, a glass substrate for a liquid crystal display panel, or the like, various surface treatments are performed by immersing the substrate in a processing liquid. In such a surface treatment, a chemical solution tank storing a chemical solution such as an etching solution, and a washing tank storing pure water as a rinsing solution are provided. After the substrate is subjected to a chemical solution treatment, a rinsing process is further performed to wash away the chemical solution and particles attached to the substrate in a washing tank.
[0003]
FIG. 5 is a schematic diagram showing a schematic configuration of a main part in a conventional substrate processing apparatus.
[0004]
In FIG. 5, a substrate processing apparatus 51 is an apparatus for processing a plurality of substrates at a time, and is a loading / unloading section (not shown) for transferring a predetermined number of substrates set in a cassette to and from the outside of the apparatus. And a transfer unit 52 that receives and conveys the substrate from the carry-in / out unit (not shown) and transfers the substrate to the carry-in / out unit (not shown), and receives the substrate from the carry unit 52 and performs predetermined processing on the substrate. And a processing unit 53 for transferring the processed substrate to the transport unit 52.
[0005]
The transfer unit 52 includes two transfer robots 52a and 52b that are respectively provided in the upper and lower transfer paths and move in the direction in which the processing units 53 are provided (X direction). These transfer robots 52a and 52b are respectively provided via shaft members 54a (FIG. 6) extending in the direction (X direction) perpendicular to the paper surface of FIG. 5 (Y direction) of FIG. Each of the holding plates 54 has a pair of attached holding plates 54, and a plurality of substrates 55 in a standing posture are arranged in the Y direction by holding grooves (not shown) inside the pair of holding plates 54. Both end surfaces are sandwiched from both sides, and are received and held by the holding grooves.
[0006]
Further, each processing unit 53 includes a chemical solution tank 56 for storing a chemical solution such as an etching solution, a water washing tank 57 for washing the chemical solution or particles attached to the substrate 55 processed by the chemical solution tank 56, and a chemical solution tank for storing the chemical solution. A chemical tank 58, a washing tank 59 for washing a chemical or particles attached to the substrate 55 treated by the chemical tank 58, and a drying tank 60 for drying the substrate 55 washed in the washing tank 59. Have. By sequentially immersing a plurality of substrates 55 collectively in the chemical solution tank 56, the washing tank 57, the chemical solution tank 58, and the washing tank 59, a series of various processes such as a chemical solution process and a water washing process are performed on the substrate 55. The substrate 55 after the processing is dried.
[0007]
Further, a lifter device 61 is disposed in each of the processing tanks of the chemical solution tanks 56 and 58 and the washing tanks 57 and 59. Each lifter device 61 can mount a plurality of substrates 55 and process the same. It is configured to be vertically movable between the inside of the tank and the substrate delivery position. An outer member 62 is provided in each of the processing tanks of the chemical solution tanks 56 and 58 and the washing tanks 57 and 59, and upper surfaces of the outer member 62 and the drying tank 60 are respectively provided. An opening / closing door 63 that can open and close the substrate introduction port is provided so as to face the upper opening port of the processing tank. Each of these opening / closing doors 63 is normally closed, and is configured to open on both sides in conjunction with the lowering of the lifter device 61 into the processing tank. It is configured to open.
[0008]
An exhaust duct 64 is opened at an appropriate position of each of the outer shell members 62, and the exhaust duct 64 is connected to an exhaust pump 66 via a flow control valve 65. The exhaust duct 64, the flow control valve 65, and the exhaust pump 66 constitute an exhaust unit. The exhaust of the outer member 62 by the exhaust unit causes the opening / closing door 63 of the substrate introduction port of the outer member 62 to open. When the external air flows in from the substrate introduction port, the diffusion of fumes (atmosphere containing an acid or an alkali) from the chemical solution tanks 56 and 58 to the outside through the substrate introduction port is prevented. ing.
[0009]
Further, as shown in FIG. 6, the lifter device 61 and, for example, the transfer robot 52b move a plurality of processing tanks arranged side by side (in the X direction in FIG. 5 perpendicular to the plane of FIG. 6) in their width direction. They are arranged facing each other across both sides. Similarly, the lifter device 61 and, for example, the transfer robot 52a are opposed to each other by sandwiching a plurality of processing tanks arranged side by side (in the X direction in FIG. 5 perpendicular to the plane of FIG. 6) from both sides in the width direction thereof. It is arranged in the state where it did.
[0010]
With the above configuration, first, the transport robot 52b receives the substrate from the loading / unloading section (not shown) and transports the substrate to the substrate delivery position above the chemical solution tank 56 of each processing unit 53 along the disposition direction (X direction). I do. At this time, as shown in FIG. 6, the pair of holding plates 54 of the transfer robot 52b sandwich the both side end surfaces of the plurality of substrates 55 in the upright posture from both sides by the plurality of holding grooves inside them. We hold and hold. On the other hand, the lifter device 61 of the chemical solution tank 56 rises, and the plurality of substrates held by the transfer robot 52b are transferred to the plurality of holding grooves provided above the three holding arms 61a provided below the lifter device 61. Receive from below. Thereafter, the pair of holding plates 54 of the transfer robot 52b are rotated so as to be in the vertical directions as indicated by solid lines, respectively, to release the holding of the transfer robot 52b on the plurality of substrates 55, and the plurality of plates on the lifter device 61 are released. The delivery of the substrate 55 is completed.
[0011]
Next, the lifter device 61 is lowered toward the inside of the chemical solution tank 56 with the plurality of substrates held by the plurality of holding grooves above the three holding arms 61a. In conjunction with this lowering, the opening / closing door 63 of the outer member 62 rises and opens on both sides as shown by phantom lines, and the holding arm 61 a holding the plurality of substrates 55 is immersed in the chemical from the upper opening of the chemical tank 56. The plurality of substrates 55 are subjected to a predetermined chemical solution treatment by being left for a predetermined time. At this time, the opening / closing door 63 is closed, and the chemical solution tank 56 is substantially sealed by the outer shell member 62. The inside of the outer shell member 62 is exhausted by an exhaust pump 66 via an exhaust duct 64.
[0012]
Further, after a predetermined time, the lifter device 61 raises the plurality of substrates 55 after the chemical treatment, and the opening / closing door 63 stands up and opens on both sides as shown by phantom lines so as to interlock with the substrates, and opens the upper portion of the chemical solution tank 56. The holding arm 61 a holding the plurality of substrates 55 is raised from the mouth to the substrate delivery position above the chemical solution tank 56. At the substrate transfer position, the transfer robot 52b is on standby with the pair of holding plates 54 arranged vertically, and after the holding arm 61a holding the plurality of substrates 55 arrives at the substrate transfer position, a pair of By rotating the lower sides of the holding plates 54 inward, the both end surfaces of the plurality of substrates 55 are sandwiched from both sides, respectively, and received and held by the holding grooves of the pair of holding plates 54.
[0013]
Further, after the lifter device 61 is retracted downward together with the holding arm 61a to transfer the substrate 55 to the pair of holding plates 54, the transfer robot 52b cleans the plurality of substrates 55 with the water cleaning solution positioned next to the chemical solution tank 56. The substrate is conveyed along the disposition direction (X direction) to the substrate transfer position above the tank 57. At this time, the pair of holding plates 54 of the transfer robot 52b respectively hold and hold the both side end surfaces of the plurality of substrates 55 in the standing posture from the both sides by the plurality of holding grooves inside them. . On the other hand, the lifter device 61 of the washing tank 57 rises, and the plurality of substrates held by the transfer robot 52b are held by the plurality of holding grooves above three holding arms 61a provided below the lifter device 61. 55 is received from below. Thereafter, the pair of holding plates 54 of the transfer robot 52b are rotated so that their longitudinal directions are vertical, and the holding of the transfer robot 52b on the plurality of substrates 55 is released, and the lifter device 61 of the washing tank 57 is released. The delivery of the plurality of substrates 55 to is completed.
[0014]
Further, the lifter device 61 of the washing tank 57 descends into the washing tank 57 with the plurality of substrates 55 held by the plurality of holding grooves above the three holding arms 61a. At the same time, the transfer robot 52b in an empty state after the transfer of the substrate 55 moves along the disposition direction (X direction) to the substrate transfer position with respect to the carry-in / out section (not shown). In preparation for delivery of the substrate 55.
[0015]
The opening / closing door 63 of the outer member 62 is opened in conjunction with the lowering of the lifter device 61, and the holding arm 61 a holding the plurality of substrates 55 is immersed in the pure water from the upper opening of the washing tank 57 so that the plurality of substrates 55 is washed with water. During this washing process, the opening / closing door 63 is closed, and the inside of the outer member 62 of the washing tank 57 is sealed.
[0016]
Further, after a predetermined time, the lifter device 61 raises the plurality of substrates 55 after the rinsing process, opens the opening / closing door 63 in conjunction therewith, and holds the plurality of substrates 55 from the upper opening of the rinsing tank 57. The arm 61a is raised to the upper substrate transfer position for the transfer robot 52a above the washing tank 57. At the board transfer position, the transfer robot 52a is on standby with the longitudinal direction of the pair of holding plates 54 set to the vertical direction, and after the holding arm 61a holding the plurality of boards 55 arrives at the board transfer position. By rotating the lower sides of the pair of holding plates 54 inward, the two end surfaces of the plurality of substrates 55 are sandwiched from both sides and received and held in the respective holding grooves, thereby holding the plurality of substrates 55. Perform delivery.
[0017]
Thereafter, the transport robot 52a transports the plurality of substrates 55 to the drying tank 60 and performs a drying process on the plurality of substrates 55 in the drying tank 60. Further, the transfer robot 52b repeats the same operation as above while delivering the plurality of substrates 55 to and from the lifter device 61 of each processing tank, and performs a series of processing by the chemical liquid tank 56 and the washing tank 57. Is transported.
[0018]
Further, the transfer robot 52a, which has received the plurality of substrates 55 after the drying process from the lifter device 61 of the drying tank 60, moves along the direction of disposition (X direction) to a substrate transfer position with respect to a carry-in / out section (not shown). The plurality of processed substrates 55 are transported, and the plurality of processed substrates 55 are delivered to the loading / unloading section.
[0019]
[Problems to be solved by the invention]
However, in the above-described conventional configuration, when the lifter device 61 moves up or down in a state where the plurality of substrates 55 are placed on the respective processing tanks, the opening and closing door 63 of the substrate introduction port of the outer member 62 interlocks therewith. At this time, the fumes from the chemical solution tanks 56 and 58 are prevented from diffusing to the substrate transport line including the transfer positions of the transfer robots 52a and 52b and the lifter device 61 through the substrate introduction ports. Exhaust means is provided for exhausting the atmosphere in each of the outer members 62 that respectively cover the 56 and 58 and the washing tanks 57 and 59 so that air enters the inside at a wind speed that does not allow fumes to diffuse from the substrate introduction port. I have. The exhaust capability of the exhaust means requires a considerably large amount of exhaust air / time, requires a large amount of driving power, and has a problem that the exhaust means itself becomes large and bulky.
[0020]
By the way, if the fumes spread to the substrate transfer line, the fumes will also clean the clean substrate after the rinsing process, which will cause a lot defect of the device and cause corrosion of the fumes to cause parts failure of the mechanical structure, It pollutes the clean air in the clean room.
[0021]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problem and to provide a power-saving and space-saving substrate processing apparatus by further reducing the size of an exhaust unit.
[0022]
[Means for Solving the Problems]
A substrate processing apparatus of the present invention is a substrate processing apparatus that performs a predetermined process on one or a plurality of substrates, a chemical processing unit that is arranged in a predetermined direction and performs a chemical process on the substrate, and a chemical processing unit. A plurality of processing units including a rinsing processing unit that performs rinsing processing on the substrate that has been subjected to the chemical liquid processing, and a substrate for transporting the substrate between at least the chemical processing unit and the rinsing processing unit of the plurality of processing units. A transport path installed above the chemical processing section and the rinsing section, transport means for transporting the substrate between at least the chemical processing section and the rinsing section in the transport path, and a space in the transport path and above the transport path; An opening is provided above the transport path to separate the atmosphere from the position, and an opening is formed to allow movement of the transport unit between the upper position and the transport path. A separating member; And an exhaust means for exhausting the atmosphere in serial in the transport path, the opening of the substrate conveying of the separating member, the in the separation member, and is formed at a position corresponding to the upper portion of the washing section.
[0023]
With this configuration, the transport path through which fumes from the chemical solution diffuse is covered with the separating member, and at a position corresponding to one processing unit so that the fumes of the chemical solution are not easily diffused outward from the opening of the separating member. Since only the opening is provided and the opening is made as small as possible, even if the exhaust capacity of the exhaust means is significantly reduced, the diffusion of fumes to the outside of the separation member can be prevented, so the exhaust means is made more compact. A possible, power-saving, space-saving, and quieter substrate processing apparatus is provided. Therefore, the fumes are not diffused to the outside of the separating member by the exhaust means having a smaller exhaust capacity, and the clean substrate after the water washing process is not contaminated as in the conventional case, and causes a device lot defect. Inconveniences such as causing a mechanical component failure due to fume corrosion and polluting clean air in a clean room are also eliminated.
[0024]
Further, the plurality of processing units in the substrate processing apparatus of the present invention include a chemical processing unit that performs a chemical processing on the substrate, and a rinsing processing unit that performs a rinsing process on the substrate. The opening is formed in the separation member at a position corresponding to the upper side of the washing section.
[0025]
With this configuration, the fume concentration is highest at the upper position of the chemical processing unit where the substrate with the chemical is taken out of the substrate processing area, and the opening is formed at the separation member above the washing unit that is far from the position where the fume concentration is high. In this case, the fumes coming out of the chemical solution are not easily diffused to the outside, and the exhaust means having a smaller exhaust capacity can be used.
[0026]
Preferably, the substrate processing apparatus of the present invention further includes a shutter unit that can be opened and closed with respect to the opening for transporting the substrate of the separation member.
[0027]
According to this configuration, an opening for transporting the substrate is required for the separating member. However, if a shutter means for opening and closing the opening of the separating member is provided, the separating means for separating fumes coming out of the chemical solution by an exhausting means having a smaller exhausting capacity. Spreading to the outside can be prevented.
[0028]
More preferably, the exhaust means in the substrate processing apparatus of the present invention is provided with an exhaust port near the chemical processing section in the processing section.
[0029]
With this configuration, if the fume concentration is highest at the position above the chemical processing section and an exhaust port is provided near the chemical processing section, the exhaust means can efficiently exhaust an atmosphere with a high fume concentration from the exhaust port. As a result, it is possible to further reduce the fume concentration even with an exhaust means having a smaller exhaust capacity.
[0030]
Further, preferably, the exhaust means in the substrate processing apparatus of the present invention switches between a high exhaust output and a low exhaust output in accordance with an open position and a closed position of a shutter means which can be opened and closed with respect to the substrate transfer opening of the separation member. A control unit for performing control is provided.
[0031]
With this configuration, when the opening of the separation member is opened by the shutter means, the fumes in the conveyance path are exhausted at a high exhaust output, and when the opening of the separation member is closed by the shutter means, the fumes in the conveyance path are exhausted at a low exhaust output. Can be switched so as to exhaust air, so that when the shutter means is closed, power consumption can be reduced and a small driving sound (quiet sound) can be obtained, and when the shutter means is opened, fumes diffuse to the outside of the separating member significantly. Can be suppressed.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a substrate processing apparatus according to the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments described below.
[0033]
FIG. 1 is a perspective view showing a schematic configuration of a main part of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic configuration view of a main part of the substrate processing apparatus of FIG. .
[0034]
In FIG. 1, a substrate processing apparatus 1 is an apparatus that collectively processes a plurality of substrates 2 such as wafers, and carries out unloading by transferring a predetermined number of substrates 2 set in a cassette 3 to and from the outside of the apparatus. A loading section 4 and a substrate processing unit 5 which receives and transports the unprocessed substrate 2 from the loading / unloading section 4, performs predetermined processing on the substrate 2, transports the processed substrate 2 and delivers it to the loading / unloading section 4; have.
[0035]
The loading / unloading unit 4 includes a cassette mounting table 6 on which a plurality of substrates 2 loaded (or immediately before unloading) are temporarily arranged and placed in a state where the substrates 2 are set in the cassette 3, and both upper end brim portions 3 a of the cassette 3. The two cassette holding arms 7 protruding in a cantilever shape, which respectively receive and hold the cassette 3 from below, are movable in the cassette arrangement direction of the cassette mounting table 6, and take in and hold the cassette 3 with the cassette holding arm 7. The cassette 3 is configured to be movable up and down in order to mount the cassette 3 thereon, and to be rotatable around an axis parallel to the vertical direction (a support shaft for supporting the mounting member of the cassette holding arm 7). Transfer robot 8, and a protrusion 1 that pushes up only a plurality of substrates 2 in the cassette 3 placed from the cassette mounting table 6 by the transfer robot 8 and transfers it to the transport mechanism 9. When, and a cassette cleaning unit 11 for cleaning the empty cassette 3 placed from the push-up unit 10 by the transfer robot 8. The transfer robot 8 transports and places the cassette 3 from the cassette mounting table 6 to a predetermined position of the protrusion 10, and pushes up only the plurality of substrates 2 from the cassette 3 at the protrusion 10 and transfers it to the transfer mechanism 9. The subsequent empty cassette 3 is transferred to the cassette cleaning unit 11, and the plurality of processed substrates 2 are transferred from the transport mechanism 9 to the protruding portion 10 of the empty cassette 3 cleaned by the cassette cleaning unit 11. In order to be collected in the cassette 3, it is transported again to a predetermined position where the protruding portion 10 is positioned and made to stand by.
[0036]
Further, as shown in FIG. 2, the substrate processing unit 5 includes a plurality of substrate processing areas 17 in each tank outer member 16 (inside the processing unit) covering the plurality of processing tanks 12 to 15, and a plurality of these substrate processing areas 17. Two second substrate transfer areas 18 and 19 provided above the processing area 17 and having a second transfer path for transferring between the substrate processing areas 17, and a substrate is provided for each of the second substrate transfer areas 18 and 19. The first substrate transport area 20 having a first transport path for transporting the second substrate transport area 2, and separating members (atmosphere blocking members) for separating and separating the second substrate transport areas 18, 19 and the first substrate transport area 20, respectively. ) Is provided with each transport area outer member 21. At the upper position of the transfer area outer member 21 corresponding to (opposing to) the upper opening of one processing tank (in this embodiment, the washing tank), the second substrate transfer area 18 and the first substrate transfer area 20 are located. Each opening 22 capable of transporting a plurality of substrates 2 between the second substrate transport area 19 and the first substrate transport area 20 is provided. Further, an exhaust unit 23 is provided for exhausting the atmosphere in each of the substrate processing areas 17 and the second substrate transfer areas 18 and 19. As described above, the outer first clean substrate transfer area 20 partitioned by the transfer area outer member 21 and the second substrate inside the transfer area outer member 21 in which fumes are diffused by taking the plurality of substrates 2 in and out of the chemical solution. The transfer areas 18 and 19 and the substrate processing area 17 for actually processing a plurality of substrates 2 are divided into three areas, and the atmosphere in the substrate processing area 17 and the second substrate transfer areas 18 and 19 is evacuated by an exhaust unit 23. , The diffusion of fumes into the first substrate transfer area 20, which is a substrate transfer line, is more reliably prevented.
[0037]
That is, in the present embodiment, the plurality of processing tanks 12 to 15 wash out the chemical liquid tank 12 storing the chemical liquid such as an etching liquid and the chemical liquid and particles attached to the substrate 2 which has been processed by the chemical liquid tank 12. It comprises a washing tank 13, a chemical tank 14 in which a chemical solution is stored, and a washing tank 15 for washing away the chemical solution, particles, and the like attached to the substrate 2 processed by the chemical solution tank 14. One of the transfer area outer members 21 covers the tank outer member 16 covering the chemical solution tank 12 and the tank outer member 16 covering the washing tank 13 and between the respective tank outer members 16 (between the processing units). ) Is also configured to cover the second substrate transfer area 18 where the substrate can be transferred. The other of the transfer area outer members 21 covers the tank outer member 16 that covers the chemical solution tank 14 and the tank outer member 16 that covers the washing tank 15, and the substrate can be transferred between the respective tank outer members 16. The second substrate transfer area 19 is also covered. Furthermore, on the upper surface of each tank outer member 16 corresponding to (opposing to) each upper opening of the chemical solution tanks 12 and 14 and the washing tanks 13 and 15, each substrate introduction port through which a plurality of substrates 2 can be introduced. 24 are provided respectively. A plurality of substrates 2 are introduced into only the upper surface of each transfer area outer member 21 corresponding (facing) to each of the substrate introduction ports 24 on the washing tanks 13 and 15 side of these substrate introduction ports 24. Each possible opening 22 is provided. On the other hand, the substrate introduction ports 24 are respectively disposed above the upper open ports of the chemical solution tanks 12 and 14 so as to oppose the respective upper open ports, and further, the respective transport area outer members 21 above the above are not provided with the respective apertures. . This is because not only the transfer area outer member 21 separates the areas, but also the communication area (opening area) between the second substrate transfer areas 18 and 19 and the first substrate transfer area 20 is made smaller, and the first substrate transfer area is reduced. The atmosphere in the substrate processing area 17 and the second substrate transport areas 18 and 19 is reduced to such an extent that the diffusion of the fumes into the first substrate transport area 20 is prevented while the fumes are prevented from diffusing into the first substrate transport area 20. This is because the exhaust is performed, and the amount of exhaust can be significantly reduced as compared with the related art.
[0038]
Further, a drying tank 25 for drying the substrate 2 having been subjected to the water washing treatment in the water washing tank 15 is provided adjacent to the water washing tank 15. A plurality of substrates 2 are collectively immersed sequentially in each processing tank in the chemical solution tank 12, the washing tank 13, and the like, so that a plurality of various processes such as a chemical solution treatment and a water washing process are performed on the plurality of substrates 2, and after the treatment, The plurality of substrates 2 are dried in a drying tank 25. The drying tank 25 may be configured to be supplied with hot air for drying at a predetermined temperature (which may be heated by a heater or the like) or may be dried under reduced pressure using IPA (isopropyl alcohol). Good.
[0039]
Further, a plate-shaped opening / closing door 26 which slides each opening 22 to open and close, and an opening / closing drive means (not shown) for driving the opening / closing door 26 to open and close according to the substrate transfer, are transported. It is provided on the upper surface of the area outer member 21. The opening / closing door 26 and the opening / closing drive means constitute shutter means, and can be opened and closed with respect to the substrate transfer opening 22. In addition, each inlet opening / closing door 27 that opens and closes the substrate inlet 24 of each tank outer member 16 and an inlet opening / closing drive unit (not shown) that drives these inlet opening / closing doors 27 to open and close according to the substrate conveyance. ) And are disposed on the upper surface of each tank outer member 16. The reason why each inlet / outlet door 27 is provided in each of the outer shell members 16 is not only to prevent fume diffusion but also to suppress evaporation of volatile components contained in the liquid as much as possible. The opening / closing door 26 is provided to prevent fumes from diffusing from the second substrate transfer areas 18 and 19 to the first substrate transfer area 20 where high cleanliness is required. It is. From this point of view, each of the opening / closing doors 26 and each of the introduction opening / closing doors 27 are closed except when the plurality of substrates 2 are distributed. Further, an inlet opening / closing door 28 for opening and closing the substrate inlet is also provided on the upper surface of the drying tank 25.
[0040]
In this embodiment, the opening / closing door 26 slides a predetermined distance along the upper surface of the transport area outer member 21 and horizontally moves to open and close the opening 22. The substrate introduction port 24 is opened and closed by being rotationally driven on both sides in a double-opening manner. These opening / closing drive means and introduction port opening / closing drive means may be constituted by, for example, an air cylinder (not shown). In this case, the tip of the rod of the air cylinder is attached to the opening / closing door 26, and the opening 22 is opened and closed by the expansion and contraction of the rod by a predetermined stroke. The inlet opening / closing door 27 is composed of two doors. One end of each arm is fixed to each of the doors, and each arm (not shown) is rotatably supported at the center of the arm. At the other end, the rod end of the air cylinder is attached, and the inlet opening / closing door 27 is opened and closed by opening / closing the inlet opening / closing door 27 on both sides via an arm (not shown) by expansion and contraction of the rod by a predetermined stroke. It is supposed to. As described above, when the inlet opening / closing door 27 is opened for both sides to open and close each door, two air cylinders may be provided for driving each door.
[0041]
Further, the transfer mechanism 9 is configured by a transfer robot, and has a pair of holding plates 29 that can move in the direction in which the plurality of processing tanks 12 to 15 are arranged (X direction) and can hold the plurality of substrates 2. I have. The pair of holding plates 29 are respectively fixed to respective shaft members 30 (FIG. 3) extending in a direction (Y direction in FIG. 3) orthogonal to the paper surface of FIG. Are connected to the transport mechanism main body 9a so as to be rotatable in opposite directions about the respective rotation centers. Further, a plurality of holding grooves (not shown) capable of holding the plurality of substrates 2 in an upright (vertical) posture at predetermined intervals are formed in the opposed inner sides of the pair of holding plates 29, respectively. ing. With the lower end portions of the pair of holding plates 29 approaching each other in the inside, a plurality of substrates 2 are arranged in the Y direction, and their both end surfaces are sandwiched from both sides, respectively, and received and held by the holding grooves.
[0042]
Further, lifter devices 31 for transporting a plurality of substrates 2 are provided in the chemical solution tank 12 and the washing tank 13 and in the chemical solution tank 14 and the washing tank 15, respectively. As shown in FIG. 3, each of the lifter devices 31 has three holding grooves 32a, each holding a plurality of substrates 2 from below in each of the holding grooves 32a, and holding the substrates 2 in an upright posture. An arm 32, a movable holding plate 33 in which the three holding arms 32 are connected in an L-shape at a lower end portion, and a movable member 34 fixed to the back surface of the upper end portion of the movable holding plate 33 and capable of moving up and down and moving horizontally. And a driving means (not shown) for moving the movable member 34 up and down and horizontally. Each of the drying tanks 25 is also provided with a lifter device 35 for transporting a plurality of substrates 2. The lifter device 35 has the same configuration as the lifter device 31.
[0043]
The drive means (not shown) of each of these lifter devices 31 and 35 moves the movable member 34 along a guide member (not shown) such as a rail in the vertical direction along a guide member (not shown) such as a rail. And a vertical drive unit for moving the movable member 34 attached to the wire or belt by driving a pulley or a roll for driving a wire or belt with a motor. Good. Further, the pinion and the rack may be driven by a motor to move the movable member 34 up and down, or the ball screw and the motor may be used to move the movable member 34 up and down. Various driving systems are conceivable. Further, the driving means (not shown) of each lifter device 31 has a horizontal drive unit for moving the movable member 34 in a horizontal direction together with the vertical drive unit along a guide member (not shown) such as a rail. Various drive systems such as a ball screw can be considered in the same manner as described above.
[0044]
The inlet opening / closing door 27 is configured to open in conjunction with the lowering of each lifter device 31 into the processing tank, and the inlet opening / closing door 27 is configured to open in conjunction with the ascent from the processing tank. Have been. The opening / closing door 26 is configured to open in conjunction with the lowering of each lifter device 31 into the second substrate transfer area 18 or the second substrate transfer area 19, and the second substrate transfer area 18 is opened. The opening / closing door 26 is configured to open in conjunction with a rise from the inside or the second substrate transfer area 19. Further, the inlet opening / closing door 28 is configured to open in conjunction with the lowering of the lifter device 35 into the drying tank 25, and the inlet opening / closing door 28 is opened in conjunction with the ascent from the drying tank 25. It is configured as follows. That is, the opening / closing door 26 and the inlet / outlet opening / closing doors 27 and 28 are opened only when the plurality of substrates 2 pass, and the others are closed.
[0045]
Further, the exhaust port of each exhaust duct 37 is opened in a rectangular shape in the width direction of the processing tank on the upper side wall (the height position of the processing tank opening port in FIG. 2) of each tank outer member 16. The exhaust ports of the exhaust ducts 37 are connected to an exhaust pump 39 via a flow control valve 38. Further, the exhaust ports of the exhaust ducts 37 are formed in the side walls of the transfer area outer members 21 respectively covering the second substrate transfer areas 18 and 19 in a rectangular shape over the width direction of the lifter device 31. The exhaust ports of the exhaust ducts 37 are open, and the exhaust ports of the exhaust ducts 37 are also connected to an exhaust pump 39 via a flow control valve 38. The exhaust port of each of the transfer area outer members 21 is disposed on the innermost side wall of each of the second substrate transfer areas 18 at a position near and above the chemical solution tanks 12 and 14. The exhaust unit 23 is configured by the exhaust duct 37, the flow control valve 38, and the exhaust pump 39, and inside each tank outer member 16 (substrate processing area 17) and inside each transport area outer member 21 (second substrate transport area). 18), the opening / closing door 26 of each transport area outer member 21 is opened, and the substrate introduction port opening / closing door 27 of each outer member 16 is opened by exhaustion from the exhaust port provided by the exhaust means 23 provided at an appropriate position (18). However, when external air flows in through the opening 22 and the substrate introduction port 24, the fumes from the chemical solution tanks 12 and 14 and the plurality of substrates 2 with the chemical solution pass through the opening 22 and the substrate introduction port 24. (Atmosphere in which an acid or an alkali is mixed) is prevented from diffusing to the outside.
[0046]
In addition, the exhaust unit 23 exhausts the opening / closing door 26 that constitutes a shutter unit that can be opened / closed with respect to the substrate transport opening 22 of each transport area outer member 21 as a separating member according to the open position and the closed position. Control means (not shown) for switching the output of the pump 39 between the high exhaust output and the low exhaust output may be provided. That is, when the shutter means closes the opening 22, the control means controls the output of the exhaust pump 39 to a low exhaust output by detecting the opening with a limit switch (not shown) or the like. When the shutter means opens the opening 22 such as when transferring a substrate, such as when transferring a substrate, the opening is detected by a limit switch or the like, and the output of the exhaust pump 39 is controlled to a high exhaust output so that fumes are cleaned. It is also possible to configure so as not to diffuse to the first substrate transfer area side.
[0047]
Further, as shown in FIGS. 3 to 5, the lifter device 31 and the transport mechanism 9 are disposed on the same side with respect to a plurality of processing tanks 12 to 15, 25 arranged side by side. I have. In this case, each of the lifter device 31 and the transfer mechanism 9 has a cantilever structure in which a substrate holding portion (a holding plate 29 and three holding arms 32) protrudes forward (in a direction orthogonal to the transfer direction). I have.
[0048]
Further, a transfer area outer member 40 for preventing fume diffusion that covers the first substrate transfer area 20 above each transfer area outer member 21 is provided. A space portion of a substrate transfer line (first transfer path) for transferring a plurality of substrates 2 in the direction (X direction) in which the substrates 15 and 25 are arranged is configured. An opening 41 is formed on the side wall of the transfer area outer member 40 to allow the movement of the plurality of substrates 2 held by the pair of holding plates 29 of the transfer mechanism 9 and the opening and closing of the opening 41. Opening and closing door 42 is configured to be slidable along the side wall of the transfer area outer member 40. The opening / closing door 42 is normally closed, and is opened / closed by opening / closing drive means (not shown) so as to be opened only when the transport mechanism 9 passes through the opening 41. The opening / closing drive unit includes, for example, a door opening / closing cylinder, a detection unit that detects the transport mechanism 9, and an electromagnetic valve that switches to drive the cylinder when the transport mechanism 9 is detected by the detection unit. I have.
[0049]
The operation of the above configuration will be described below.
[0050]
First, the transport mechanism 9 receives the substrate 2 from the loading / unloading unit (not shown) and moves the substrate 2 to the substrate transfer position above the opening 22 of the first substrate transport area 18 where the first processing unit is located. Is transported along the transport path direction (X direction). At this board transfer position, as shown in FIG. 2, the pair of holding plates 29 of the transport mechanism 9 are respectively provided with a plurality of holding grooves on their inner sides to respectively hold both end surfaces of the plurality of boards 2 in the standing posture from both sides. It is sandwiched and received and held. On the other hand, the lifter device 31 is raised to the substrate transfer position, and the plurality of holding grooves on the upper side of the three holding arms 32 provided below the lifter device 31 are held by the transfer mechanism 9. The substrate 2 is received from below. Thereafter, the pair of holding plates 29 of the transport mechanism 9 are respectively rotated so as to be in the vertical directions, and the holding of the transport mechanism 9 on the plurality of substrates 2 is released. The delivery of the plurality of substrates 2 to is completed.
[0051]
Next, when the lifter device 31 starts to descend while the plurality of substrates 2 are held by the plurality of holding grooves on the three holding arms 32, the opening / closing door of the transport area outer member 21 interlocks with the lowering. 26 is opened, and the lifter device 31 enters the second substrate transfer area 18 together with the plurality of substrates 2 through the opening 22. In the second substrate transport area 18, the lifter device 31, together with the plurality of substrates 2, horizontally moves to a position above the chemical processing section, and then starts descending into the chemical processing section having the chemical tank 12. In conjunction with this lowering, the substrate introduction port opening / closing door 27 of the tank outer member 16 opens, and three holding arms 32 holding a plurality of substrates 2 enter the substrate processing area 17 through the substrate introduction port 24, and further, The holding arm 32 holding the substrate 2 is immersed in the chemical solution from the upper opening of the chemical solution tank 12 and left for a predetermined time in that state to perform a predetermined chemical treatment on the surface of the plurality of substrates 2.
[0052]
During the transfer of the substrate in the series of second substrate transfer areas 18 and the processing of the chemical solution, the opening 22 of the transfer area outer member 21 is closed by the opening / closing door 26, and the chemical solution tank 12 and the washing tank 13 The substrate introduction port 24 of each of the tank outer shell members 16 is also closed by the substrate introduction port opening / closing door 27 except when the substrate is introduced into the substrate processing area 17. In addition, the exhaust means 23 may always exhaust air with a constant exhaust capacity. In this case, the exhaust means 23 is also externally opened when the opening 22 and the substrate introduction ports 24 are opened (when the substrate is transported between the areas). Must have high exhaust capacity without fume diffusion. Therefore, when the opening 22 and each of the substrate introduction ports 24 are opened, the exhaust pump 39 is driven at a high exhaust output to exhaust the internal atmosphere, and when one of the opening 22 and each of the substrate introduction ports 24 is opened, the medium is discharged. The exhaust pump 39 is driven by the exhaust output to exhaust the internal atmosphere. When the opening 22 and the substrate introduction port 24 are closed (when transferring the substrate in the area and processing the substrate), the exhaust pump 39 is exhausted with a low exhaust output. May be a three-stage power-saving drive. When at least one of the opening 22 and each of the substrate introduction ports 24 is opened, the exhaust pump 39 is driven with a high exhaust output to exhaust the internal atmosphere, and when the opening 22 and the substrate introduction port 24 are closed (in the area). At the time of substrate transfer and substrate processing), exhaust may be performed at a low exhaust output, and the exhaust pump 39 may be driven in two stages of power saving.
[0053]
Further, after the chemical solution treatment after a predetermined time, the lifter device 31 raises the holding arm 32 holding the substrate 2, and the opening / closing door 27 opens on both sides as shown by the phantom line so as to interlock with the lift arm 32. The holding arm 32 holding the substrate 2 is lifted from the upper opening through the substrate introduction port 24 to above the chemical solution tank 12, and is horizontally moved horizontally to a position above the washing processing section having the washing tank 13. Thereafter, the lifter device 31 lowers the plurality of substrates 2 having the chemical solution on the surface of the substrate 2 together with the holding arm 32 after the chemical solution treatment, and interlocks with this lowering to the substrate introduction opening / closing door 27 of the tank outer member 16. Is opened, and the holding arm 32 holding the plurality of substrates 2 is introduced into the substrate processing area 17 of the washing tank 13 through the substrate introduction port 24. In the substrate processing area 17, the lifter device 31 performs a water washing process in which the plurality of substrates 2 are immersed in the chemical solution from the upper open port of the washing tank 13 to wash out the chemical solution attached to the surfaces of the plurality of substrates 2.
[0054]
As described above, during the transfer of the substrate in the second substrate transfer area 18 or during the washing process, the opening 22 of the transfer area outer member 21 is closed by the opening / closing door 26, and the chemical tank 12 and The substrate introduction ports 24 of the respective tank outer members 16 on the washing tank 13 are also closed by the respective substrate introduction port opening / closing doors 27 except when the substrates are introduced into the respective substrate processing areas 17. In addition, during the transfer of the substrate in the series of second substrate transfer areas 18 from the chemical solution tank 12, the exhaust pump 39 is driven at a high exhaust output so as to exhaust fumes from the plurality of substrates 2 with the chemical solution. The internal atmosphere may be exhausted.
[0055]
Further, after the rinsing process after a predetermined time, the lifter device 31 raises the holding arm 32 holding the substrate 2, opens the opening / closing door 27 on both sides in conjunction with the lifting arm 32, and introduces the substrate from the upper opening of the rinsing tank 13. The holding arm 32 holding the substrate 2 is raised through the opening 24, and further, the opening / closing door 26 is opened so as to interlock with the rise, and the holding arm 32 holding the substrate 2 through the opening 22 of the transfer area outer member 21 is moved. Raise to the board delivery position.
[0056]
At the substrate transfer position in the first processing unit covered by the transfer area outer member 21, the pair of holding plates 29 of the transfer mechanism 9 are standing by in a vertical position, and the holding arm 32 holding the substrate 2 is moved. After arriving between the pair of holding plates 29, the lower sides of the pair of holding plates 29 are rotated inward, respectively, so that both end surfaces of the plurality of substrates 2 are sandwiched from both sides, and each holding groove is held by each holding groove. Receive and hold each.
[0057]
Further, after the lifter device 31 is retracted downward together with the holding arm 32, the pair of holding plates 29 of the transfer mechanism 9 hold the plurality of substrates 2 and transfer the second substrate transfer unit having the next second processing unit. The transfer path in the first substrate transfer area 20 is transferred along the transfer path direction (X direction) to the substrate transfer position above the opening 22 of the area 19. At this time, the pair of holding plates 29 of the transport mechanism 9 hold and hold the both side end faces of the plurality of substrates 2 in the standing posture from both sides by the plurality of holding grooves inside them. On the other hand, the lifter device 31 of the second processing unit ascends and is held by the pair of holding plates 29 in the plurality of holding grooves on the upper side of the three holding arms 32 provided below. The plurality of substrates 2 are received from below. Thereafter, the pair of holding plates 29 are rotated so as to be vertical, respectively, to release the holding of the pair of holding plates 29 on the plurality of substrates 2, and the second holding plate 29 of the transport mechanism 9 is moved from the pair of holding plates 29 Delivery of the plurality of substrates 2 to the lifter device 31 of the processing unit is completed.
[0058]
Further, the plurality of substrates 2 transferred to the lifter device 31 of the second processing unit are introduced into the second substrate transfer area 19 by the lifter device 31. On the other hand, the empty transport mechanism 9 returns to the loading / unloading section, receives the substrate 2, and transports the plurality of substrates 2 to the substrate transfer position above the opening 22 of the transport area outer member 21 of the first first processing unit. Then, the plurality of substrates 2 are transferred to the lifter device 31 so as to be introduced into the second substrate transfer area 19.
[0059]
Further, as described above, the plurality of substrates 2 introduced into the second substrate transfer areas 18 and 19 respectively transfer the respective substrates in the first processing unit and the second processing unit, open and close the door, and exhaust the air. Are performed in the same manner as the above-described operations for the chemical solution treatment and the water washing process in the first processing unit.
[0060]
Further, the lifter device 31 of the second processing unit raises the plurality of substrates 2 after the rinsing process after a predetermined time, opens the opening / closing door 27 in conjunction therewith, and opens the substrate from the upper opening of the rinsing tank 15. The holding arm 32 holding the substrate 2 is raised through the introduction port 24, the opening / closing door 26 is opened so as to interlock with the rise, and the holding arm 32 holding the substrate 2 through the opening 22 of the transfer area outer member 21 is moved to the second position. 2 to the substrate delivery position of the processing unit. At the board transfer position, the transport mechanism 9 waits for the pair of holding plates 29 in the vertical posture, and causes the holding arm 32 holding the substrate 2 to arrive at the board transfer position between the pair of holding plates 29. Then, the lower ends of the pair of holding plates 29 are rotated inward, and the both end surfaces of the plurality of substrates 2 are sandwiched from both sides and received and held by the respective holding grooves to transfer the substrates 2. Delivery to the mechanism 9 is performed.
[0061]
Thereafter, the pair of holding plates 29 of the transport mechanism 9 deliver the plurality of substrates 2 having been processed by the second processing unit to the lifter device 35 of the drying tank 25. Further, a plurality of substrates 2 on which the processing of the first processing unit has been completed are received from the lifter device 31 of the first processing unit to the pair of holding plates 29 and the pair of holding plates 29 are used to receive the second processing unit. The plurality of substrates 2 are delivered to the lifter device 31. Further, the plurality of substrates 2 delivered to the lifter device 31 of the second processing unit are introduced into the second substrate transport area 19, and the transport mechanism 9 returns to the loading / unloading unit to receive the substrate 2, and The substrate 2 is transported to the substrate transfer position above the opening 22 of the first processing unit, and the plurality of substrates 2 are transferred to the lifter device 31 of the first processing unit. On the other hand, the plurality of substrates 2 are lowered together with the holding arm 32 by the lifter device 31 of the drying processing unit, and in conjunction with the lowering, the opening / closing door 28 is opened, and the plurality of substrates 2 are introduced into the drying tank 25 to perform the drying process. Done.
[0062]
In this manner, the plurality of substrates 2 introduced into the second substrate transfer areas 18 and 19 and the drying processing unit respectively include the first processing unit and the second processing unit, and the substrate transfer and door in the drying processing unit. Each operation such as opening / closing and exhaust is performed.
[0063]
Further, the plurality of substrates 2 after the drying process are raised again from the inside of the drying tank 25 to the substrate transfer position above the drying tank 25 by the lifter device 35 and transferred between the pair of holding plates 29 of the transfer mechanism 9. The plurality of substrates 2 after the drying process are transported along the disposition direction (X direction) of each processing unit to the substrate delivery position with respect to the loading / unloading unit (not shown). The plurality of processed substrates 2 are delivered.
[0064]
As described above, the pair of holding plates 29 of the transport mechanism 9 deliver the plurality of substrates 2 that have been processed by the second processing unit to the lifter device 35 of the drying tank 25, and also transfer the plurality of substrates 2 of the first processing unit. The plurality of substrates 2 that have been processed by the first processing unit are received from the lifter device 31 and the plurality of substrates 2 are transferred from the pair of holding plates 29 to the lifter device 31 of the second processing unit. Further, the plurality of substrates 2 delivered to the lifter device 31 of the second processing unit are introduced into the second substrate transport area 19, and the transport mechanism 9 returns to the loading / unloading section to receive the plurality of substrates 2. The substrate 2 is transferred to the substrate transfer position above the opening 22 of the first processing unit, and the plurality of substrates 2 are transferred to the lifter device 31 of the first processing unit. The above operations are sequentially repeated as described above, and a predetermined process is performed on the plurality of substrates 2.
[0065]
As described above, the second substrate transfer areas 18 and 19 on each processing unit side where the fume from the chemical solution diffuses are respectively covered with the transfer area outer members 21 as separating members, and the transfer area outer members 21 The openings 22 are provided only at positions corresponding to the washing tanks 13 and 14, respectively, so that the fumes of the chemical do not easily diffuse into the outer first substrate transfer area 20 from the openings 22. Even if the exhaust capacity of the means 23 is significantly reduced (for example, reduced by 80%), diffusion of fumes into the first substrate transport area 20 outside each transport area outer member 21 can be prevented. However, it is possible to make the substrate processing apparatus more compact, power-saving, space-saving, and quieter.
[0066]
In addition, since the shutter means for opening and closing the substrate transfer opening 22 of each transfer area outer member 21 is provided, even if the exhaust means 23 has a smaller exhaust capacity, each transfer area outer member of the fume discharged from the chemical solution is provided. 21 can be prevented from spreading outside (in the first substrate transfer area 20).
[0067]
Further, the fume density is highest at a position above the chemical processing section in the second substrate transfer areas 18 and 19 from which the plurality of substrates 2 with the chemicals are taken out of the substrate processing area 17, and from the position where the fume density is high. Since the opening 22 is provided in each of the transfer area outer members 21 above the remote washing section, the fumes coming out of the chemical liquid are less likely to be diffused into the outer first substrate transfer area 20 and the exhaust capacity is smaller. It can be done by means 23.
[0068]
Further, the fume concentration is highest at the position above the chemical processing section in the second substrate transfer areas 18 and 19, and the exhaust port of the exhaust means 23 is provided near the chemical processing section. An atmosphere having a high fume concentration can be efficiently exhausted, and the exhaust means 23 having a smaller exhaust capacity can further reduce the fume concentration.
[0069]
Further, when the opening 22 of the transfer area outer member 21 is opened by the shutter means, the fumes in the transfer area outer member 21 (the second substrate transfer areas 18 and 19) are exhausted with a high exhaust output, and the transfer area outer member 21 is discharged. When the opening 22 is closed by the shutter means, it is possible to switch so as to exhaust the fumes in the transfer area outer member 21 (the second substrate transfer areas 18 and 19) with a low exhaust output. This makes it possible to reduce the driving noise (silent sound), and further suppress the diffusion of fumes into the first substrate transfer area 20 outside the transfer area outer member 21 when the shutter means is opened.
[0070]
In this embodiment, the atmosphere in the substrate processing area 17 and the second substrate transfer areas 18 and 19 is configured to be exhausted through the exhaust duct 37 of the exhaust unit 23, and the exhaust pump 39 of the exhaust unit 23 exhausts the atmosphere. The output control is performed in accordance with the opening and closing of the opening 22 and each of the substrate introduction ports 24, and when the substrate is transported in the series of second substrate transport areas 18 and 19 from the chemical baths 12 and 14 to the washing baths 13 and 15, In order to exhaust the fumes from the plurality of substrates 2 provided with a mark, the exhaust output was increased. However, the present invention is not limited to this, and the chemical liquid tanks 12 and 14, the washing tanks 13 and 15, the second substrate transfer areas 18 and 19 For example, different exhaust means may be provided, and the exhaust means may be subjected to exhaust output control as described above. In this case, the fumes themselves are different in the exhaust output control in the substrate processing areas 17 of the chemical solution tanks 12 and 14 and the washing tanks 13 and 15, and the exhaust output control corresponding thereto (for example, the exhaust output is low when the fume concentration is low). Good), it is possible to control different exhaust means. In the exhaust output control in the substrate processing area 17 and the second substrate transfer areas 18 and 19, the highest exhaust output is obtained when the opening / closing door 26 and the substrate introduction opening / closing door 27 are opened. The output is gradually reduced to the extent that there is no diffusion, and when the gas is taken out of the chemical baths 12 and 14 into the second substrate transport areas 18 and 19 by the exhaust output control in the second substrate transport areas 18 and 19. Each of the different exhaust means can be controlled so that the exhaust output is set to be the highest, and thereafter the output is gradually reduced to such an extent that there is no fume diffusion.
[0071]
Further, in the present embodiment, in a batch type substrate processing apparatus that processes a plurality of substrates 2 at a time, the substrate transfer area on each processing unit side is covered with a separating member, and the separating member is provided with an opening as small as possible. Although the case where the present invention is applied has been described, the present invention is also applicable to a substrate processing apparatus of a single plate type for processing the substrates 2 one by one.
[0072]
【The invention's effect】
As described above, according to the first aspect of the present invention, the substrate transport area on each processing unit side where the fumes from the chemical solution or the like are diffused is covered with the separating member, and the fumes such as the chemical solution are removed from the opening of the separating member. An opening is provided only at a position corresponding to one processing unit so that it is difficult to diffuse to the outside, and the opening is made as small as possible. Since the diffusion of the gas can be prevented, the size of the exhaust means can be reduced, the power consumption can be reduced, the space can be saved, and the substrate processing apparatus can be made quieter.
[0073]
Further, the fume concentration is highest at a position above the chemical processing unit where the substrate with the chemical is taken out from the substrate processing area, and an opening is provided in the separation member above the washing unit apart from the position where the fume concentration is high. With this configuration, the fumes discharged from the chemical liquid are not easily diffused to the outside, so that the exhaust means having a smaller exhaust capacity can be used.
[0074]
Further, according to the second aspect of the present invention, since the shutter means for opening and closing the opening for transporting the substrate of the separation member is provided, the exhaust means having a smaller exhaust capacity can separate the fumes coming out of the chemical solution or the like from the separation member. Can be prevented.
[0075]
Further, according to the third aspect of the present invention, since the fume density is highest at the position above the chemical processing section and the exhaust port is provided near the chemical processing section, the atmosphere with the high fume density from the exhaust port by the exhaust means. Can be efficiently exhausted, and the fume concentration can be further reduced even with an exhausting means having a smaller exhausting ability.
[0076]
Further, according to the fourth aspect of the present invention, when the opening of the separation member is opened by the shutter means, the fume inside the separation member is exhausted with a high exhaust output, and when the opening of the separation member is closed by the shutter means, the fume is low. Since the fumes in the separation member can be switched to be exhausted by the exhaust output, when the shutter is closed, power can be saved and a small driving noise (silent) can be obtained. Diffusion can be further suppressed.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a schematic main configuration of a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic main part configuration diagram of a section AA of the substrate processing apparatus of FIG.
FIG. 3 is a perspective view illustrating a schematic configuration of a substrate delivery state between the lifter device and a transport mechanism in FIG. 2;
FIG. 4 is a side view illustrating a schematic configuration of a substrate delivery state between the lifter device and a transport mechanism in FIG. 2;
FIG. 5 is a schematic diagram showing a schematic configuration of a main part in a conventional substrate processing apparatus.
FIG. 6 is a side view showing a schematic configuration of a substrate transfer state between the lifter device and the transfer robot in FIG. 5;
[Explanation of symbols]
1 Substrate processing equipment
2 substrate
5 Substrate processing unit
9 Transport mechanism
12,14 Chemical bath
13,15 Rinse tank
16 Outer shell member
17 Substrate processing area
18, 19 Second board transfer area
20 First substrate transfer area
21,40 Conveyor area outer member
22, 41 opening
23 Exhaust means
24 Substrate inlet
25 Drying tank
26 Opening door
27, 28 Inlet opening / closing door
29 Holding plate
31, 35 Lifter device
32 Holding arm
37 Exhaust duct
38 Flow control valve
39 Exhaust pump
42 Door

Claims (4)

一または複数の基板に対して所定の処理を行う基板処理装置において、
所定方向に配列され、基板に対して薬液処理を行う薬液処理部と、この薬液処理部により薬液処理された基板に対して水洗処理を行う水洗処理部とを含む複数の処理部と、
前記複数の処理部の少なくとも薬液処理部と水洗処理部との間で基板を搬送させるために、これら薬液処理部及び水洗処理部の上方に設置された搬送路と、
前記搬送路において少なくとも薬液処理部と水洗処理部との間で基板を搬送させる搬送手段と、
前記搬送路の空間とその上方の位置との間で雰囲気を分離するために、前記搬送路の上方に配設され、かつ前記上方の位置と前記搬送路との間における前記搬送手段の移動を許容するための開口が形成された分離部材と、
前記搬送路内の雰囲気を排気する排気手段と、を備え、
前記分離部材の基板搬送用の開口は、前記分離部材における、前記水洗処理部の上方に対応した位置に形成されたことを特徴とする基板処理装置。
In a substrate processing apparatus that performs a predetermined process on one or a plurality of substrates,
Arranged in a predetermined direction, a plurality of processing units including a chemical processing unit that performs a chemical processing on the substrate, and a washing processing unit that performs a washing process on the substrate that has been subjected to the chemical processing by the chemical processing unit,
In order to transport the substrate between at least the chemical processing section and the rinsing processing section of the plurality of processing sections, a transport path installed above the chemical processing section and the rinsing processing section ,
Transport means for transporting the substrate between at least the chemical processing section and the rinsing processing section in the transport path,
In order to separate the atmosphere between the space of the transport path and a position above the transport path, the transport unit is disposed above the transport path, and moves the transport unit between the upper position and the transport path. A separating member formed with an opening to allow,
Exhaust means for exhausting the atmosphere in the transport path ,
The substrate processing apparatus according to claim 1, wherein an opening for transporting the substrate of the separating member is formed at a position of the separating member corresponding to a position above the washing section .
前記分離部材の基板搬送用の開口に対して開閉可能なシャッタ手段を備えたことを特徴とする請求項1に記載の基板処理装置。2. The substrate processing apparatus according to claim 1, further comprising shutter means that can be opened and closed with respect to the substrate transport opening of the separation member. 請求項1または2に記載の基板処理装置であって、
前記排気手段は、前記処理部のうち薬液処理部の近傍にその排気口が設けられたことを特徴とする基板処理装置。
The substrate processing apparatus according to claim 1, wherein:
The substrate processing apparatus , wherein the exhaust unit is provided with an exhaust port near a chemical solution processing unit in the processing unit.
請求項1〜3の何れかに記載の基板処理装置であって、
前記排気手段は、前記分離部材の基板搬送用の開口に対して開閉可能なシャッタ手段の開位置と閉位置に応じて高排気出力と低排気出力に切り換え制御を行う制御手段を備えたことを特徴とする基板処理装置。
The substrate processing apparatus according to claim 1,
The exhaust means includes control means for performing switching control between high exhaust output and low exhaust output in accordance with an open position and a closed position of a shutter means capable of opening and closing with respect to the substrate transfer opening of the separation member. Characteristic substrate processing equipment.
JP7554098A 1998-03-24 1998-03-24 Substrate processing equipment Expired - Lifetime JP3548416B2 (en)

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KR100801660B1 (en) 2006-09-12 2008-02-05 세메스 주식회사 System and method for controlling pressure balance of equipment
JP4668350B1 (en) * 2010-05-28 2011-04-13 イーティーシステムエンジニアリング株式会社 Semiconductor wafer separator
JP5952007B2 (en) * 2012-01-27 2016-07-13 株式会社Screenホールディングス Substrate processing apparatus and substrate processing method
JP7467611B2 (en) * 2020-05-01 2024-04-15 東京エレクトロン株式会社 Processing System

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