JP3442911B2 - Resin package type semiconductor device and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a resin package type semiconductor device and a method of manufacturing the same, and more particularly to a resin package type semiconductor device of a type in which a metal heat dissipation plate is incorporated in a resin package and a method of manufacturing the same.

[0002]

2. Description of the Related Art For example, a power IC for a motor drive,
BACKGROUND ART Some resin package type semiconductor devices, such as a gate array and a VLSI, which generate a large amount of heat when driven, have a metal heat sink incorporated in a resin package to improve heat dissipation performance.

FIG. 14 shows an example of the structure of a conventional resin package type semiconductor device of this type. The peripheral edge of the upper surface of the metal heat dissipation plate 4 is connected to the lower surface of the tip of the inner lead 2 extending from the side surface of the resin package 1 via the insulating adhesive member 3.

The semiconductor chip 5 is directly bonded to the center of the upper surface of the metal heat dissipation plate 4, and the upper surface bonding pad of the semiconductor chip 5 and each corresponding internal lead are connected by wire bonding 6. ing.

[0005]

In the resin package type semiconductor device having the structure shown in FIG. 14, since the semiconductor chip 5 which is a heat source is directly bonded to the metal radiator plate 4, the heat generated in the semiconductor chip 5 is generated. Although it has an advantage that it is effectively transmitted to the metal heat dissipation plate 4, it has the following drawbacks.

First, since the metal heat sink 4 is supported only by the inner leads 2 formed on the lead frame in the stage before the resin package 1 is formed in the manufacturing process, a fine pitch is achieved. However, in the case of a so-called quad type resin package type semiconductor device in which the internal leads 2 have been miniaturized due to the above-mentioned progress, it was practically impossible to adopt the structure shown in FIG. That is, the metal heat dissipation plate 4 is supported with a support rigidity of a predetermined level or more so as to withstand an external force generated when the lead frame is transported in the manufacturing stage or a dynamic pressure of the injected resin in the molding process for forming the resin package. However, in the case where the fine pitch is advanced, the metal heat dissipation plate is not supported only by the internal lead and the structure as shown in FIG. 14 cannot meet the above requirements. is there.

Secondly, at the time of wire bonding in the manufacturing process, the inner lead 2 is connected to the metal radiator plate 4 which receives heat from the heat block through the insulating adhesive member 3 having poor heat transfer performance. The heat from the heat block is difficult to be transferred to the inner lead 2, and thus the second bonding of the wire to be thermocompression bonded to the upper surface of the inner lead 2 may not be properly and efficiently performed with the help of the heat from the heat block. is there.

The present invention was devised under such circumstances, and even if a so-called fine-pitch semiconductor device in which the pitch between leads is miniaturized, the heat from the semiconductor chip is generated. The object is to be able to properly incorporate a metal heat dissipation plate for dissipating the heat, and to be able to perform wire bonding between the semiconductor chip and the internal lead without trouble even in the manufacturing stage thereof. .

[0009]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention has adopted the following technical means.

According to the first aspect of the present invention, a new resin package type semiconductor device is provided, and the resin package type semiconductor device includes a semiconductor chip mounted on a die pad and bonding on the semiconductor chip. A plurality of internal leads electrically connected to the pad via wires, a resin package that encloses the semiconductor chip or the internal leads, and an external lead continuous to the internal leads to the outside of the resin package. What is claimed is: 1. A resin package type semiconductor device, comprising: a plurality of external leads that are output; and a metal radiator plate incorporated in the resin package to radiate heat generated from the semiconductor chip, wherein the metal radiator plate is , The lower surface of the die pad is overlapped, and the upper surface of the peripheral edge of the die pad overlaps the lower surface of the tip of each internal lead via a minute gap. It is disposed so that, and,
Each inner lead is more external than the wire connection
Are connected to each other by an insulating member which is affixed to the lower surface at the site that is recessed toward it said insulating member is partially or entirely is made heavy through the small gap in the peripheral portion of the upper surface of the said metal heat radiating plate Can be characterized.

In a resin package type semiconductor device according to a preferred embodiment, the internal leads extend radially from the die pad or a semiconductor chip mounted on the die pad, and the resin package has a rectangular shape in plan view. The external leads extend from the four sides of this resin package. That is, the resin package type semiconductor device according to this embodiment is formed in a so-called quad type.

In the resin package type semiconductor device according to a preferred embodiment, the metal heat dissipation plate is joined to the die pad in a limited area at the center of the lower surface thereof.

In the resin package type semiconductor device of the present invention having the above structure, the metal heat dissipation plate is superposed on and connected to the lower surface of the die pad. That is, the metal heat dissipation plate is not supported on the tip portions of the inner leads as in the conventional example shown in FIG. 14, but is usually joined to the die pad connected to the lead frame body portion by suspension leads. There is. Therefore, the metal radiator plate is supported with a predetermined supporting rigidity in the lead frame state. As a result, according to the present invention, even in a fine pitch semiconductor device in which the internal leads are miniaturized, it is possible to actually incorporate a metal heat sink having a sufficient heat dissipation capability.

Further, in the resin package type semiconductor device of the present invention, an insulating member for connecting and fixing the internal leads to each other is attached not to the upper surface of the internal leads but to the lower surface side of the internal leads. The relationship with the heat dissipation plate is such that the lower surface of the insulating member overlaps the upper surface of the peripheral edge of the metal heat dissipation plate. As a result, during the handling of the lead frame or during the resin molding process for forming the resin package, the metal heat dissipation plate is displaced due to external force or the dynamic pressure of the molten resin injected into the cavity. In addition, it is possible to effectively avoid the situation where the metal heat dissipation plate comes into contact with the internal leads to cause a short circuit failure. Therefore, the metal heat sink has to be relatively heavy, and the suspension leads for supporting the die pad or the lead frame have been thinned to meet the demand for finer pitch. In both cases, the metal heat dissipation plate can be incorporated into the resin package without causing a short circuit failure as described above.

Further, a metal heat sink is attached to the die pad,
By joining in a limited area in the center of the lower surface, it is possible to reduce the thermal stress generated between the die pad and the metal heat dissipation plate when the temperature of the semiconductor chip is raised, and the semiconductor chip can be heated and cooled. Even if it is repeated, it is possible to avoid the situation that the die pad, the metal radiator plate, or the joint portion between them is damaged by thermal stress, and as a result, the life of the resin package type semiconductor device can be extended.

According to the second aspect of the present invention, a method of manufacturing a resin package type semiconductor device using a lead frame provided with a die pad and a plurality of internal leads having tip portions arranged at the periphery of the die pad. The method comprises the steps of attaching a strip-shaped insulating member to the lower surface of the inner lead and connecting and fixing each adjacent inner lead to each other, the lower surface of the die pad having a peripheral edge upper surface of the lower surface of the strip-shaped insulating member. as heavy made through a minute gap, the step of bonding the metal radiator plate, the step of bonding the semiconductor chip to the top surface of the die pad, the strip of inner leads corresponding thereto and the bonding pads on the top surface of the semiconductor chip It's the part where the insulating material is attached
And a step of forming a resin package that encloses the die pad, the semiconductor chip, the metal heat dissipation plate, or the wire bonding portion.

In a preferred embodiment, the step of attaching the strip-shaped insulating member to the lower surface of the inner lead and connecting and fixing the adjacent inner leads to each other includes the step of attaching the strip-shaped insulating member to the tip portion of each inner lead. It is performed by attaching it to the lower surface of each internal lead at a position retracted by a predetermined distance from.

Also in a preferred embodiment, the step of bonding a metal heat sink to the lower surface of the die pad comprises:
For the limited area of the bottom center of the die pad,
This is performed by joining the metal heat dissipation plate by ultrasonic joining.

According to the method of the present invention, since the inner leads are connected to each other by the strip-shaped insulating member attached to the lower surface thereof, when the inner leads are made finer, the inner leads are not prepared. Transformed into
It is possible to prevent defects in wire bonding. Further, since the strip-shaped insulating member is attached to the lower surface of the inner lead, and the strip-shaped insulating member is overlapped with the upper surface of the peripheral edge portion of the metal heat-dissipating plate, which is superposed and joined to the lower surface of the die pad, the metal heat-dissipating plate. Even if the metal plate is displaced, the metal heat radiation plate will not come into contact with the internal leads to cause a short circuit failure. Such a displacement of the metal heat sink is subject to the dynamic pressure of the molten resin injected into the cavity during the lead frame transportation process before the resin package is formed or during the resin molding process for forming the resin package. However, according to the method of the present invention, even if such displacement of the metal radiator plate occurs,
It is possible to avoid causing a short circuit between the internal leads.

Further, by disposing the strip-shaped insulating member at a position retracted outward from the tip end portion of each inner lead by a predetermined distance, the portion to be wire-bonded at the tip end of each inner lead is elastically lowered. Can bend. Then, in the case of performing second bonding in which the other end of the wire whose one end is bonded to the upper surface of the semiconductor chip is thermocompression bonded to the upper surface of the internal lead by the bonding tool,
A tool for pressing the ends of the wires can cause the inner leads to bend downward and press against the top surface of the metal heat sink. Therefore, the heat from the heat block can be effectively transmitted to the internal leads via the metal heat dissipation plate, and the second bonding of the wire can be properly and reliably performed.

Further, when the metal heat sink is bonded to a limited area in the center of the lower surface of the die pad, the heat of the metal heat sink contacting the heat block during wire bonding is transferred from the area limited to the center to the die pad or the lead. Can be transmitted to the frame. Therefore, it is possible to obtain a state in which the peripheral portion of the upper surface of the metal heat sink is evenly heated. Then, the tip of the inner lead is bent by the bonding tool and pressed against the upper surface of the metal heat sink to perform the above-mentioned second operation. The bonding can be made to have an average bonded state by a uniform heating state, and the quality of wire bonding, especially second bonding, can be improved.

As described above, according to the present invention, particularly in a fine-pitch resin package type semiconductor device in which the internal leads have a narrow pitch and are miniaturized, the heat generated from the semiconductor chip is generated in the resin package. It becomes possible to properly incorporate a metal radiator plate capable of effectively radiating heat.

Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an enlarged sectional view of an embodiment of a resin package type semiconductor device 10 of the present invention.

FIG. 1 shows an example in which the present invention is applied to a so-called quad type semiconductor device 10. Inside the resin package 11 formed of epoxy resin or the like and having a rectangular shape in a plan view, the semiconductor chip 13 bonded on the die pad 12 is bonded at the center of the lower surface of the die pad 12, and a predetermined planar shape is formed. The metal heat dissipation plate 14 has is incorporated. The die pad 12 has a rectangular shape in plan view, and the suspension leads 15 remaining in the resin package 11 extend from the four corners thereof. The joining of the die pad 12 and the metal radiating plate 14 is preferably so-called ultrasonic joining, as described later, but is not limited to this, and spot welding can also be employed, for example. As a material for the metal heat dissipation plate 14, copper or a copper-based alloy having excellent heat dissipation is preferably used.

A plurality of inner leads 16 whose inner ends are arranged on the four circumferences of the die pad 12 or the semiconductor chip 13 mounted on the die pad with a constant gap are extended outward in the horizontal direction, The external leads 17 protruding from the four side surfaces of the resin package 11 are connected to each other. Each inner lead 16 is connected between adjacent inner leads by a strip-shaped insulating member 18 attached to the lower surface at a portion retracted outward from the tip end portion by a predetermined distance L. As the strip-shaped insulating member 18, for example, a so-called polyimide adhesive tape in which an adhesive adhesive is applied to one surface of a polyimide film can be used. Wire bonding 19 connects between the bonding pad on the upper surface of the semiconductor chip 13 and the upper surface of the tip of each internal lead 16. The metal heat sink 14
Is a metal plate that is larger than the die pad 12 and has a rectangular shape in plan view, and the peripheral edge of the upper surface thereof is the internal lead 16
Or, it is arranged so as to vertically overlap with the lower surface of the band-shaped insulating member 18 attached to the lower surface thereof with a minute gap 20. Since the resin enters the minute gap 20, the insulation between the inner lead 16 and the metal heat dissipation plate 14 is maintained.

In the embodiment shown in FIG. 1, the metal heat dissipation plate 14 and the die pad 12 are bonded to each other in a limited region 21 at the center of both. However, since the metal heat sink 14 can be kept in contact with the entire lower surface of the die pad 12 as a whole, the heat generated from the semiconductor chip 13 during the operation of the semiconductor device is effectively transferred to the metal heat sink 14. Can radiate heat to the outside. At this time, even if there is a difference in the coefficient of thermal expansion between the die pad 12 and the metal heat sink 14, or there is a time lag in the heat transfer from the semiconductor chip 13, the peripheral edge of the die pad 12 and the metal heat sink 1 will be different.
No thermal stress is generated between the peripheral edge portion of No. 4 and the peripheral edge portion of No. 4. As a result, even if the semiconductor chip 13 is repeatedly heated and cooled,
It is possible to avoid damage to the internal structure due to thermal stress and extend the life of this semiconductor device.

Next, a method of manufacturing the above resin package type semiconductor device 10 will be described. FIG. 2 is a partial plan view showing a planar configuration of the lead frame 22 used for manufacturing the semiconductor device 10. In the rectangular region 25 surrounded by the side frame portions 23, 23 on both sides in the width direction and the cross frames 24, 24 formed so as to span the side frames at equal intervals in the longitudinal direction, the semiconductor device 10 is configured. The lead or die pad 12 and the like to be formed are punched out. A quadrilateral frame-shaped tie bar 26 is formed so that its four corners are connected to the side frame 23 and the cross frame 24 by the support leads 27. This quadrilateral frame-shaped tie bar 26
The rectangular die pad 12 is supported by the suspension leads 15 extending inward from the four corners. The quadrilateral frame-shaped tie bar 2 partitioned by the adjacent suspension leads 15, 15.
In each trapezoidal region within 6, a plurality of internal leads 16 are formed, the base ends of which are connected to the tie bars 26 and which extend toward one side of the die pad 12. On the outer side of the tie bar 26, a plurality of outer leads 17 that extend continuously to the inner leads 16 are formed. The outer end of each outer lead 17 is connected to the side frame 23 or the cross frame 24 via a support lead 28. As can be seen from FIG. 2, each inner lead 16 is generally formed in a direction that extends radially from the center of the die pad 12.
In the lead frame shown in FIG. 2, in the resin molding process described later, the tie bar 26 is not introduced to introduce the molten resin from the gate to the upper surface side and the lower surface side of the lead frame without obstructing the flow thereof. A continuous portion 29 or an opening 30 continuous with the continuous portion 29 is provided.

The die pad 12 is the lead frame 2
2, the other part, namely the inner lead 16 for example.
Instead of being located on the same plane as, for example, as shown in FIG. This downset amount Z is, for example, 200
Or 400 μm.

Next, as shown in FIGS. 3 and 4, each inner lead 16 has a strip-shaped insulating member 1 attached to its lower surface.
8 are connected to each other. In the embodiment shown in the figure, the strip-shaped insulating member 18 is formed into a quadrilateral frame shape, and
The internal leads 16 are connected, including the suspension leads 15 of the book. By doing so, not only the distance between the adjacent inner leads 16 is regulated, but also the inner leads 1 for the suspension leads and thus the entire frame are provided.
6 positions are defined.

In a quad-type semiconductor device with a fine pitch, the distance between the tips of the internal leads 16 is 2.
An extremely fine inner lead having a width of about 00 μm and a width of the inner lead 16 itself of about 80 to 120 μm may be employed, and such a fine inner lead does not cause a short circuit defect due to deformation. Therefore, it is effective to connect and fix the belt-shaped insulating member 18 as described above. As described above, as the band-shaped insulating member 18, a polyimide film having one surface coated with an adhesive adhesive can be preferably used. In this case, the thickness of the insulating adhesive member is 30 to 7
It becomes 0 μm.

Next, as shown in FIGS. 5 and 6, a metal heat dissipation plate 14 is bonded to the lower surface of the die pad 12.
As described above, the metal heat radiating plate 14 has a planar size such that at least the upper surface of the peripheral edge portion can overlap the band-shaped insulating member 18 in the vertical direction. As shown in FIG. 6, the downset amount Z of the die pad 12 is 2
Since the band-shaped insulating member 18 has a thickness of 30 to 70 μm, a minute gap 20 is formed between the insulating member 18 and the upper surface of the peripheral edge of the metal heat dissipation plate 14.

Further, in the embodiment shown in the figure, the metal heat dissipation plate 14 is bonded to the die pad 12 in a limited area 21 at the center of the lower surface thereof. The reason for limiting the position and size of the bonding portion in this way is that the die pad 1
The purpose of this is to eliminate or reduce the occurrence of thermal stress between the metal plate 2 and the metal heat dissipation plate 14, especially in the peripheral portion, and the size of the joint portion selected to meet such purpose is selected.

As the above-mentioned joining method, so-called ultrasonic joining is preferable. That is, as shown in FIG. 7, the die pad 12 of the lead frame 22 is superposed on the upper surface of the metal heat dissipation plate 14 placed on the support table 31, and the pressing tool 33 connected to the ultrasonic horn 32 is attached to the center of the upper surface of the die pad 12. Then, ultrasonic vibration is supplied to the pressing tool 33 by pressing it against the portion.
The area of the lower end of the pressing tool 33 should correspond to the formation of the joint portion 21 in the limited area of the central portion of the die pad 12. 20 from the pressing tool 33
Ultrasonic vibration having a horizontal component with an amplitude of about μm is applied to the die pad 12, and friction heat generated on the contact surface between the die pad 12 and the metal radiator plate 14 and the pressing force of the tool 33 cause the die pad 12 and the metal radiator plate to move. 14 are joined to each other with the joint portion 21 in a limited area.

Next, as shown in FIGS. 8 and 9, the semiconductor chip 13 is bonded to the upper surface of the die pad 12, and then, as shown in FIGS. 10 and 11,
The bonding pads on the upper surface of the semiconductor chip 13 and the corresponding upper surfaces of the tip portions of the internal leads 16 are connected by wire bonding 19. By the way, the wire bonding is performed with the lead frame 22 placed on the heat block 34. In the case of the form shown in the figure, as shown in FIG. 12, the metal heat dissipation plate 14 directly contacts the heat block 34. That is, the metal plate 14
Since the central portion of the upper surface thereof is substantially bonded to the die pad 12, the heat from the heat block 34 is transferred from the limited area of the central portion of the upper surface of the metal heat dissipation plate 14 to the die pad 12 or the entire lead frame 22. To be done. Therefore, the peripheral portion of the upper surface of the metal heat dissipation plate 14 is uniformly heated. The second bonding of the wire 19 whose one end is bonded to the bonding pad of the semiconductor chip 13 to the internal lead 16 is performed by pressing the wire 19 onto the upper surface of the internal lead 16 by a bonding tool 35 as shown in FIG. Done by

In the case of the embodiment shown in FIG. 12, in the natural state, each inner lead 16 is slightly heated by the minute gap 2 with respect to the peripheral portion of the upper surface of the metal radiator plate 14 heated uniformly as described above.
The strip-shaped insulating member 18 that is overlapped upwardly with 0s and is attached to the lower surface of each inner lead 16 for connecting the inner leads 16 to each other is retracted outward from the tip of each inner lead 16 by a predetermined distance. Since it is arranged at the position, the tip of the inner lead 16 is elastically bent by the pressing force of the bonding tool 35 and brought into contact with the upper surface of the metal heat dissipation plate 14. At this time, the sufficient and uniform heat transmitted from the metal heat dissipation plate 14 allows the wires to be properly thermocompression bonded to the inner leads 16.

Of course, the second bonding is performed in a state where the inner lead 16 is not bent by the bonding tool 35 but is elastically deformed by another pressing member so as to contact the upper surface of the metal heat dissipation plate 14. You may go. When such a second bonding is completed and the bonding tool 35 is retracted upward, each inner lead 16 is moved against the upper surface of the metal heat dissipation plate 14 by its elastic restoring force or the elastic force of the band-shaped insulating member 18. It returns to the natural state in which it is separated via the minute gap 20.

Next, as shown in FIG. 13, a resin package 11 is formed by a transfer molding method using a thermosetting resin such as an epoxy resin so as to enclose the semiconductor chip 13 and the wire bonding portion 19. To be done. That is, as shown in FIG. 13, the upper and lower molds 36 having cavities formed on their respective mating surfaces,
The lead frame 22 that has undergone the above-described wire bonding process is sandwiched between 37, and in the mold clamped state, a thermosetting resin in a molten state that is pressure-fed from a plunger pot (not shown) is injected into the cavity space. The resin is cured by the heat applied to the molds 36 and 37.

At this time, molten resin may flow into the cavity space from the gates provided in the molds 36 and 37, and the dynamic pressure of the inflowing resin may elastically displace the die pad 12 or the metal radiator plate 14 joined thereto. However, since the insulating member 18 is attached to the lower surface of the inner lead 16 as described above, the displaced metal heat dissipation plate 14 contacts the inner lead 16 even if it contacts the insulating member 18. You can avoid doing it. As a result, even if the resin is cured while the metal heat sink 14 is displaced so as to come into contact with the insulating member 18, the metal heat sink 1 still remains.
Insulation between the inner lead 16 and the inner lead 16 is maintained.

As described above, according to the method of the present invention, the metal radiator plate 1 is attached to the die pad 12 supported by the lead frame.
Since 4 is joined to the metal heat sink 14, a metal heat sink 14 having a certain weight and good heat dissipation performance can be incorporated. Even if the die pad or the metal heat sink 14 does not have so much support rigidity, The heat sink 14
It can be installed properly without causing a short circuit defect with respect to the internal leads.

Thereafter, the unit semiconductor device as shown in FIG. 1 is obtained through steps such as solder plating on the lead frame 22, marking on the resin package 11, tie bar cutting, lead cutting, and lead forming.

The scope of the invention is not limited to the form shown in the figures and described above. In the embodiment shown in the figure, the metal heat sink 14 is entirely made up of the resin package 1.
Although it is configured to be enclosed in 1, the bottom surface of the metal heat dissipation plate 14 is installed so as to be exposed at the lower surface of the resin package 11, and the lower surface of the metal heat dissipation plate 14 directly contacts the outside air or an external object for heat dissipation. The case of further enhancing the performance is of course included in the scope of the present invention.

Further, although the present invention is applied to the so-called quad-type semiconductor device in the form shown in the drawing, it can also be applied to a so-called dual-in-line type or other package type semiconductor device. Similarly, the present invention can be applied.

[Brief description of drawings]

FIG. 1 is a sectional view showing a structure of a resin semiconductor device according to an embodiment of the present invention.

FIG. 2 is a partial plan view of an example of a lead frame used for manufacturing the resin package type semiconductor device shown in FIG.

FIG. 3 is a partial plan view of a lead frame in which internal leads are connected to each other by a band-shaped insulating member attached to the lower surface thereof.

FIG. 4 is a sectional view taken along line IV-IV in FIG.

FIG. 5 is a partial plan view of the lead frame in which a metal radiator plate is joined to the lower surface of the die pad.

6 is a sectional view taken along line VI-VI in FIG.

FIG. 7 is a cross-sectional view showing a state in which a metal heat dissipation plate is bonded to the lower surface of the die pad by an ultrasonic bonding method.

FIG. 8 is a partial plan view of a lead frame in which a semiconductor chip is bonded to the upper surface of a die pad.

9 is a sectional view taken along line IX-IX in FIG.

FIG. 10 is a partial plan view of the lead frame in a state where the bonding pads on the upper surface of the semiconductor chip and the upper surfaces of the tip portions of the internal leads are connected by wire bonding.

11 is a sectional view taken along line XI-XI of FIG.

FIG. 12 is a side sectional view showing a state in which wire bonding is performed between the upper surface of the semiconductor chip and the internal lead.

13 is a cross-sectional view showing a state where a resin package is formed on the lead frame shown in FIG.

FIG. 14 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

10 Semiconductor device 11 resin package 12 die pad 13 Semiconductor chips 14 Metal heat sink 16 internal leads 17 External lead 18 Band insulation member 19 wire bonding 20 minute gap

Claims (7)

(57) [Claims] 1. A semiconductor chip mounted on a die pad, a plurality of internal leads electrically connected to a bonding pad on the semiconductor chip via wires, the semiconductor chip or each of the internal leads. A resin package that encloses the leads, a plurality of external leads that extend to the outside of the resin package in succession to each of the internal leads, and is incorporated in the resin package to radiate heat generated from the semiconductor chip. And a metal heat dissipation plate, wherein the metal heat dissipation plate is superposed on the lower surface of the die pad, and the upper surface of the peripheral edge portion overlaps the lower surface of the tip of each internal lead with a minute gap. And each inner lead is located on the outer lead side of the wire connecting part.
Are connected to each other by an insulating member which is affixed to the lower surface in the saved region, the insulating member, through part or all of the small gap in the peripheral portion of the upper surface of the said metal heat radiating plate
Characterized in that it is heavy and a resin packaged semiconductor device. 2. The inner leads extend radially from the die pad or a semiconductor chip mounted on the die pad, the resin package has a rectangular shape in a plan view, and the outer leads extend from four sides of the resin package. The resin package type semiconductor device according to claim 1, which is extended. 3. The resin package type semiconductor device according to claim 1, wherein the metal heat dissipation plate is bonded to the die pad in a limited area at the center of the lower surface thereof. 4. A method of manufacturing a resin package type semiconductor device using a lead frame comprising a die pad and a plurality of internal leads having tip portions arranged around the die pad, wherein the bottom surface of the internal leads is a method. between inner leads adjacent each by impregnating the belt-shaped insulating member to each other the step of connecting fixed to the lower surface of the die pad peripheral portion upper surface so as to become heavy through the small gap on a lower surface of the strip-shaped insulating member, A step of bonding a metal heat sink, a step of bonding a semiconductor chip to the upper surface of the die pad, a bonding pad on the upper surface of the semiconductor chip and the strip-shaped insulating member corresponding to the inner lead attached thereto.
Characterized in that it comprises the step of connecting, the die pad, the semiconductor chip, the metal heat dissipating plate, or forming a resin package enclosing the wire bonding portion, the through between the wire bonding between the tip side than the portion, the resin Manufacturing method of package type semiconductor device. 5. The step of attaching a strip-shaped insulating member to the lower surface of the inner lead and connecting and fixing the adjacent inner leads to each other is carried out by moving the strip-shaped insulating member to a predetermined distance from the tip of each inner lead. The method for manufacturing a resin package type semiconductor device according to claim 4, which is carried out by attaching the inner leads to the lower surfaces of the respective inner leads at the positions retracted to. 6. The step of bonding a metal heat dissipation plate to the lower surface of the die pad is performed by bonding the metal heat dissipation plate to a limited area of the central portion of the lower surface of the die pad by ultrasonic bonding. 4. The method for manufacturing a resin package type semiconductor device according to item 4. 7. A resin package type semiconductor device manufactured by the method according to claim 4.