JP3318299B2 - Pb-free low-temperature firing type conductive paint - Google Patents
Pb-free low-temperature firing type conductive paintInfo
- Publication number
- JP3318299B2 JP3318299B2 JP34968799A JP34968799A JP3318299B2 JP 3318299 B2 JP3318299 B2 JP 3318299B2 JP 34968799 A JP34968799 A JP 34968799A JP 34968799 A JP34968799 A JP 34968799A JP 3318299 B2 JP3318299 B2 JP 3318299B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive paint
- glass frit
- temperature firing
- free low
- type conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Paints Or Removers (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、セラミック電子部
品の電極に使用する為の導電塗料に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paint for use in electrodes of ceramic electronic components.
【０００２】[0002]
【従来の技術】従来からセラミック電子部品（コンデン
サ、サーミスタ、バリスタ等々）の電極として金属粉
（金、銀、白金、パラジウム、銅、ニッケル等の単体も
しくは混合又は合金）とガラスフリットを有機ビヒクル
に均一分散したものをスクリーン印刷等により塗膜を形
成して熱処理（４５０℃〜６５０℃）をして有機ビヒク
ルを焼失させることにより電極を形成している。このよ
うして形成された電極は、ガラスフリットにより基材と
金属を結合している。一般的には、ほう珪酸鉛の入った
ガラスフリットが良好な特性を発現する為しばしば適用
されている。しかし近年環境問題で鉛の排除がさけばれ
ている。2. Description of the Related Art Conventionally, metal powder (simple or mixed or alloy of gold, silver, platinum, palladium, copper, nickel, etc.) and glass frit as electrodes of ceramic electronic parts (capacitors, thermistors, varistors, etc.) have been used as organic vehicles. An electrode is formed by forming a coating film of the uniformly dispersed product by screen printing or the like, heat-treating (450 ° C. to 650 ° C.) and burning out the organic vehicle. In the electrode thus formed, the substrate and the metal are bonded by a glass frit. In general, a glass frit containing lead borosilicate is often applied to exhibit good characteristics. In recent years, however, the elimination of lead has been avoided due to environmental issues.
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的は、従
来、適用されていなかったほう酸と酸化ビスマスから成
る鉛の入らないガラスフリットを見出し、セラミック電
子部品の電極に適用できるＰｂフリー低温焼成型導電塗
料を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to find a lead-free glass frit comprising boric acid and bismuth oxide, which has not been conventionally applied, and to provide a Pb-free low-temperature firing type which can be applied to electrodes of ceramic electronic components. An object of the present invention is to provide a conductive paint.
【０００４】[0004]
【発明が解決するための手段】本発明は、銀粉末、ガラ
スフリット、及び有機ビヒクルから成る焼成型導電塗料
であってガラスフリットがほう酸と酸化ビスマスより成
り、その配合比が重量比で８５：１５〜６０：４０で、
銀粉末：ガラスフリットの配合比が重量比で９８：２〜
９０：１０であるＰｂフリー低温焼成型導電塗料であ
る。The present invention is a fired conductive paint comprising silver powder, glass frit, and an organic vehicle, wherein the glass frit comprises boric acid and bismuth oxide, and the compounding ratio thereof is 85: 15-60: 40,
The mixing ratio of silver powder: glass frit is 98: 2 by weight.
It is a Pb-free low-temperature firing type conductive coating material having a 90:10 ratio.
【０００５】本発明においてほう酸：酸化ビスマスの配
合比でほう酸が重量比で８５％以上または６０％以下に
なると焼成後の基材との接合強度が悪くなる。また、銀
粉末：ガラスフリットの配合比が重量比で２％以下では
焼成後の塗膜の緻密性が悪く空隙が多くなり塗膜強度も
弱くなる。１０％以上添加するとこれも焼成後の塗膜の
緻密性が悪く空隙が多くなる。In the present invention, when the weight ratio of boric acid is 85% or more or 60% or less in the mixing ratio of boric acid: bismuth oxide, the bonding strength with the base material after firing is deteriorated. Further, when the mixing ratio of silver powder: glass frit is 2% or less by weight, the denseness of the fired coating film is poor, the number of voids is increased, and the coating film strength is reduced. If it is added in an amount of 10% or more, this also results in poor denseness of the coating film after firing and increases the number of voids.
【０００６】本発明で使用する銀粉末は還元粉、アトマ
イズ粉、電解粉等のいずれの製造方法で得られた銀粉末
も適用することができる。また、その形状は球状、フレ
ーク状、樹枝状等を適用することができるがフレーク状
の粉末を使用することがより好ましい。有機ビヒクルは
従来から一般的に用いられている成分のものであり、例
えばエチルセルロース樹脂やブチラール樹脂をブチルカ
ルビトールやテルピネオールで溶解したものを使用でき
る。[0006] As the silver powder used in the present invention, silver powder obtained by any production method such as reduced powder, atomized powder and electrolytic powder can be applied. The shape may be spherical, flaky, dendritic, or the like, but it is more preferable to use flaky powder. The organic vehicle is a component generally used in the past. For example, an organic vehicle obtained by dissolving an ethyl cellulose resin or a butyral resin with butyl carbitol or terpineol can be used.
【０００７】[0007]
【発明の実施の形態】BEST MODE FOR CARRYING OUT THE INVENTION
【実施例・比較例】以下、本発明の実施例と比較例を説
明する。銀粉末、ガラスフリットをそれぞれ表１に記載
の配合比で配合する。その組成物を三本ロールミルによ
り均一に混練したペーストを作製する。本実施例で使用
した有機ビヒクルはエチルセルロースをブチルカルビト
ールに溶解したものであり比較例にも使用した。同一組
成，同一重量のため表１には記載していない。作製した
ペーストを９６％アルミナ基板にスクリーン印刷により
２mm×２mmの塗膜を形成した。印刷した基板を１２０℃
で１０分間乾燥し、その後５５０℃で焼成し塗膜形成
（焼成サンプル）を作成した。焼成サンプルについて塗
膜緻密性、はんだ濡れ性、はんだ付け強度を評価し、そ
の結果を表１に示す。焼成塗膜を顕微鏡により観察して
塗膜の緻密性を見た。はんだ濡れ性の評価方法は、230
℃に保持した63Sn-37Pb組成のはんだ浴に焼成サンプル
を10秒間浸漬したもののはんだ付着面積をみた。はんだ
付け強度の評価方法は、はんだ濡れ性評価サンプルにス
ズ鍍金リード線をこてハンダでつけた試料の塗膜とリー
ド線間の剪断引っ張り強度を測定した。ハンダ濡れ性の
評価については、◎−１００％付着、○−９５％以上付
着、×−９５％未満付着とした。緻密性の評価について
は、◎−空隙率５％以下、○−空隙率１０％以下、△−
が空隙率２０％以下、×−空隙率２０％以上とした。Examples and Comparative Examples Hereinafter, Examples of the present invention and Comparative Examples will be described. Silver powder and glass frit are blended at the blending ratios shown in Table 1, respectively. A paste is prepared by uniformly kneading the composition with a three-roll mill. The organic vehicle used in this example was obtained by dissolving ethyl cellulose in butyl carbitol, and was also used in the comparative example. Not shown in Table 1 because of the same composition and weight. The prepared paste was screen-printed on a 96% alumina substrate to form a coating film of 2 mm × 2 mm. 120 ° C printed substrate
For 10 minutes, and then fired at 550 ° C. to form a coating film (fired sample). The calcined samples were evaluated for coating film density, solder wettability, and soldering strength, and the results are shown in Table 1. The fired coating film was observed under a microscope to check the denseness of the coating film. The evaluation method for solder wettability is 230
The baked sample was immersed in a solder bath having a composition of 63Sn-37Pb maintained at a temperature of 63 ° C. for 10 seconds, and the solder adhesion area was determined. The soldering strength was evaluated by measuring the shear tensile strength between a coating film and a lead wire of a sample in which a tin-plated lead wire was soldered to a solder wettability evaluation sample and soldered. Regarding the evaluation of solder wettability, ◎ -100% adhered, ○ -95% or more adhered, and × -less than 95% adhered. Regarding the evaluation of the denseness, ◎ -porosity 5% or less, ○ -porosity 10% or less, Δ-
Was 20% or less in porosity, and 20% or more in x-porosity.
【０００８】[0008]
【表１】 [Table 1]
【０００９】表１からわかるように、本発明の焼成型導
電塗料は比較例に比べ、ハンダ付強度が高く、しかもハ
ンダ濡れ性、塗膜緻密性のどちらとも安定していること
がわかる。As can be seen from Table 1, the fired conductive paint of the present invention has a higher soldering strength than the comparative example, and is stable in both solder wettability and coating film density.
【００１０】[0010]
【発明の効果】本発明は、環境問題として取り上げられ
ている鉛を使用せずに、従来適用されていなかったほう
酸と酸化ビスマスを使用することにより、低温焼成が可
能なＰｂフリーの新規電極、導体として塗膜の緻密性が
良好で信頼性の高い導電塗膜を形成することが可能にな
った。The present invention provides a novel Pb-free electrode that can be fired at a low temperature by using boric acid and bismuth oxide, which have not been applied conventionally, without using lead, which has been taken up as an environmental problem. As a conductor, it has become possible to form a highly reliable conductive coating film with good denseness of the coating film.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−39813（ＪＰ，Ａ) 特開 平４−16576（ＪＰ，Ａ) 特開 平11−329072（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01B 1/22 C09D 5/24 C09D 201/00 H01G 4/015 H01G 4/18 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-39813 (JP, A) JP-A-4-16576 (JP, A) JP-A-11-329072 (JP, A) (58) Field (Int.Cl. 7 , DB name) H01B 1/22 C09D 5/24 C09D 201/00 H01G 4/015 H01G 4/18
Claims (1)
クルから成る焼成型導電塗料であってガラスフリットが
ほう酸と酸化ビスマスより成り、その配合比が重量比で
８５：１５〜６０：４０で、銀粉末：ガラスフリットの
配合比が重量比で９８：２〜９０：１０であるＰｂフリ
ー低温焼成型導電塗料。1. A fired conductive paint comprising silver powder, glass frit, and an organic vehicle, wherein the glass frit is composed of boric acid and bismuth oxide, and the compounding ratio is 85:15 to 60:40 by weight, and A Pb-free low-temperature firing type conductive coating material in which the mixing ratio of powder: glass frit is 98: 2 to 90:10 by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34968799A JP3318299B2 (en) | 1999-12-09 | 1999-12-09 | Pb-free low-temperature firing type conductive paint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34968799A JP3318299B2 (en) | 1999-12-09 | 1999-12-09 | Pb-free low-temperature firing type conductive paint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001167632A JP2001167632A (en) | 2001-06-22 |
| JP3318299B2 true JP3318299B2 (en) | 2002-08-26 |
Family
ID=18405432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34968799A Expired - Fee Related JP3318299B2 (en) | 1999-12-09 | 1999-12-09 | Pb-free low-temperature firing type conductive paint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3318299B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4254136B2 (en) * | 2002-06-04 | 2009-04-15 | 株式会社村田製作所 | Conductive paste and ceramic electronic components |
| JP4635274B2 (en) * | 2005-03-29 | 2011-02-23 | 田中貴金属工業株式会社 | Conductive paste |
| US8383011B2 (en) * | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
-
1999
- 1999-12-09 JP JP34968799A patent/JP3318299B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001167632A (en) | 2001-06-22 |
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